TFD, Inc. Catalog by Margie Lewis

Dear Customer, Over the past 26 years, TFD has developed and perfected numerous coatings for displays, microelectronics, and photovoltaic applications. TFD, Inc. has expanded its technology & capability on a larger scale in both the U.S. & S.E. Asia (Taiwan & China). TFD has become the industry leader for producing Ultra Smooth I.T.O., I.M.I.T.O.â&#x201E;˘, Heaters, EMI Shields, Photovoltaic Coatings, and many others. Over the last 15 years, TFD has acquired several state of the art, fully automated, in-line production capabilities with advanced QC equipment, to insure a total quality solution for your products. TFD, Inc. has expanded its operations globally. We are now carrying a large collection of I.T.O. Coated glass, in stock, for quicker deliveries. Our dedication to research and innovation has positioned us as the world-wide standard by which coatings are measured. We assure you we will not relinquish this position. I would like to thank you personally for your interest in TFD and look forward to serving your R & D and production needs. Sincerely,

Saleem Shaikh President, Thin Film Devices

State of the art in-line Sputter Coater in Class 100

HIN FILM DEVICES is a world leader in high quality, volume production for: OLED / Photovoltaic

Transparent Conductors

I.M.I.T.O.™

L.T.I.T.O.™

EMI / EMP / RFI Shielding & Anti-stat

Thin Film Custom Heaters

Transparent Heaters-2

Anti-Reflection

Black Mask for Display

Photo Etch & Patterning

Hot Mirror Filters

Lamination

Metalized Substrates

Glass Fabrication

PIONEERING WORK: First To Introduce; 1986 - Ion Beam Sputter for I.T.O. for Ultra Smooth Surface

1987 - Introduced I.M.I.T.O.™ to air, epoxy & LC 1991 - Low Temp I.T.O.™ & I.M.I.T.O.™ 1997 - Single layer Black Chrome

1999 - Sputtered BBAR with Reflection 0.25%

2002 - First Plastic Resistive Touch Panel 2006 - First Single Sided P-Cap. Multi-Touch Sunlight Legible 2007 - Single Layer AR Coating ≤ 0.75%

APPLICATIONS Include: Displays, ITO and IMITO™ for STN, TFT, EL, FED, Touch Screens, Digitizers • Black Matrix for TFT, EL, FED, I.C. Masks, Reticules • Hot Mirror, Cold Mirror, BBAR, High Reflectance Dielectric Mirrors, NAG (NVIS), Color Filters, Face Plates, Short or Long Pass Filters • Hybrid Circuits, Busbars, Ruggedized Filters and Displays • Glass Cutting, Beveling and Polishing.

THIN FILM DEVICES offers: 100% inspections to Mil-45208 equivalent ISO 9001 Over three million square feet per year production capacity - USA & Taiwan Large product coating and patterning sizes up to 28” x 32” Application on TFD or Customer supplied parts Product improvement and development Competitive pricing with fast turn around 100% Satisfaction Guaranteed

SOME EXAMPLES OF MATERIALS METALS: Aluminum Gold Indium Titanium Many Others

Chrome Platinum Molybdenum Nickel

Copper Palladium Tungsten Silver

Cupil Incusil Stainless

Gold Alloys Aluminum:Silver Silver Alloys

ALLOYS: Constantan Cusil Inconal Many Others

TRANSPARENT CONDUCTORS: Indium Tin Oxide (ITO) Tin Oxide:F2 (FTO)

Indium Zinc Oxide (IZO) Zinc Oxide Doped With Aluminum (AZO)

DIELECTRICS: Silicon Dioxide Aluminum Dioxide

Silicon Nitride Spin on Glass

Niobium Oxide Low K Dielectric

SPECIAL REQUIREMENT:

IR MATERIALS: Silicon Sapphire Diamond Like Carbon (DLC)

Germanium Zinc Sulphide / Zinc Selenide

QUALITY CONTROL Every TFD product passes a critical inspection prior to shipment. We deliver many products that meet military specifications. We comply with: MIL C-45208

Quality Control Inspection

MIL C-675C

Coating of Glass Optical Elements

MIL C-48497

Durability Requirements for Coatings

MIL M-13508

Front Surface Mirror Aluminization

MIL G-45240C

Gold Coating

MIL Q-9858A

Quality Program Requirements

MIL I-45208A

Inspection System Requirements

MIL 883B

Test Methods / Procedures / Microelectronics

FACILITY CAPABILITIES (Anaheim, CA):

• 20,000 square foot manufacturing plant in Anaheim, USA, with 7,000 square foot class 100 cleanroom.

• 45,000 square foot manufacturing plant in Taiwan with 20,000 square foot class 100 cleanroom.

• 100% inspections to ISO-9000 and Mil-45208. TFD Headquarters in So. California.

EQUIPMENT:

• ULVAC - SDP300 (With Ion beam (IBS), MF & DC sputtering system up to 18" x 18" coating areas. (14 Target Materials).

• ULVAC - CSE4: Very high volume. Sputtering System equipped with MF & DC Power Supply’s. The coating surfaces up to 28" x 36". (16 Target Materials).

The SE4 Capable of 28”x 36” Size.

• Electron Beam Evaporation with Ion beam assist Capacity, 50” diameter area. Automatic optical monitoring and controlling to ± 5 µm.

• Villa Precision Programmable Glass CuttingFAST24 machine for ALL SHAPES up to 24” x 24”.

• Automated Polish / Beveling equipment. • Photo-etch line – Auto Gen 2.5. for I.T.O. / I.M.I.T.O.™ / Al / Cr / Ni / NiCr / SnO2F

The Ulvac Can Apply Seven Layers On Both Sides in One Pass.

and many other materials.

• Keyence Auto Inspection System: for dimensions as low as 12 µm.

• Nikon Inspection System: for dimensions as low as 0.5 µm.

• SEM Capability: to 500K Magnification. • Annealing Vacuum Furnace up to 450 °C.

A Sheet of Glass Enters the Ulvac.

• Air-bake Furnace up to 750 °C. 1

COATING CAPABILITY:

• Over three million square feet per year production capacity in Both USA & Taiwan.

• Over 50 material capabilities for thin film applications.

• Large patterning sizes up to 370 x 470 mm. • Product improvement and development for displays and solar applications.

Delivery End Inspection after the Sputtering Process is completed.

• Complete product manufacturing & Capabilities.

QUALITY CONTROL EQUIPMENT: 1. Shimadzu Spectrophotometer #310 (200µm – 300µm).

Glass Cleaning Station.

2. Veeco Dektak Profilometer / AFM. (M6). 3. Ellipsometer (Film Matrix F- 20). 4. Four Point Probe – FPP–20, (1 mΩ – 20 kΩ/Sq.). 5. P.E. 210 IR Spectrophotometer (2.5 – 20µm). 6. Keyence Auto Inspection System. 7. Environmental Chambers (-85°C – 200°C) Blue M. 8. Blue M - Thermal Shock, Mil-810C. 9. SEM – Magnify 1K – 500K.

Microscope Quality Control

SPECIAL REQUIREMENTS: For any custom or special requirements, a team of scientists and engineers at TFD will focus on the task and its problems. Their study often results in new product development. These are commonplace at TFD because we are equipped

Villa Programmable Glass Cutter

with the best scientists, advanced equipment and state-of-the-art DC/RF magnetron sputtering systems. In addition: SEM, electrical, optical, thickness measurements and various standard tests are incorporated in our laboratory to assist our team in product research and improvement. Glass Cutter Inspection Control

Various Products waiting for QC

Smoothest I.T.O. for Oled and Solar Applications (TFD, Inc.) Thin Film Devices founder, Saleem Shaikh, was the first to use magnetron sputter Indium Tin Oxide (I.T.O.) for display applications, in 1976, while working for Sharp Co. (Japan). The smoothest surfaces were required as the structure and geometrics got smaller & smaller on active devices, with multiple structures, such as TFT, TFEL, Photo Voltaic, Oled, MEMS, and others. (TFD, Inc.) Thin Film Devices uniquely incorporated the Ion Beam Sputter (IBS) process, in-line process for transparent conductors of I.T.O. (Indium Tin Oxide) I.Z.O. (Indium Zinc Oxide), A.Z.O. (Aluminum Zinc Oxide). For Dielectrics, such as Si02 (Silicon Dioxide), Silicon Oxynitride (Si0N), Silicon Nitride (Si3N4), Aluminum Oxide (Al203), Niobium Oxide (Nb203), Titanium Oxide (Ti02), Tantalum Oxide (Ta205), and for Metals, such as Al (Aluminum), Cr (Chromium), Mo (Molybdenum), Ni (Nickel), NiCr (Nichrome), NiCu (Constantan), Platinum (Pt), Pladium (Pd), Gold (Au), and many others. This unique technique, Ion Beam Sputter (IBS), has produced the lowest surface roughness, on all of the films, which allowed fine features, ≤ 5 µm and smoothes possible surfaces.

Thin Film Devices Inc. • 1180 N Tustin Ave, Anaheim, CA 92807 • (714) 630-7127 • FAX (714 )630-7119 • email: sales@tfdinc.com

Smoothest I.T.O. for Oled and Solar Applications

Target After Use – No Nodules

IBS - Magnetron Sputtering in combination with an ion gun provides an improved sputtering process. Only this method can satisfy quality required by today’s advanced display/solar products. The IBS energy levels of themagnetic sputtered atoms and ions are 5 - 10 times higher compared to conventional thermal evaporated films using electron beam and resistive sources. This unique technique of producing thin film produces many improvements in the films. Very Low Surface Roughness I.T.O.

ADVANTAGES: • • • • •

• •

IMPROVED, COMPACT DENSITY LOW SURFACE ROUGHNESS (SEE BELOW) SPLATTER FREE FILMS FILMS KEEP INITIAL ALLOY RATIO CORROSION REDUCED with SMALL GRAIN SIZE

SUPERIOR ADHESION & DURABILITY LOW TEMPERATURE PROCESS CAPABILITY

Thin Film Devices Inc. • 1180 N Tustin Ave, Anaheim, CA 92807 • (714) 630-7127 • FAX (714 )630-7119 • email: sales@tfdinc.com

Transparent Conductors (Thin Film Devices, Inc.) TFD is one of the leading manufacturers of high quality Transparent Conductors. Such as I.T.O. (Indium Tin Oxide), I.Z.O. (Indium Zinc Oxide), A.Z.O. (Aluminum Zinc Oxide), for the Flat Panel and Solar Industry, for both glass and plastic substrates. TFD has pioneered using these transparent conductors (TC) for many different applications which involves TFT, LCoS, Oled, MEMS, EMI Shields, Heaters, Biological Devices Organic Photovoltaic (OPV) and Touch Screens. I.T.O. (Indium Tin Oxide), I.Z.O. (Indium Zinc Oxide), A.Z.O. (Aluminum Zinc Oxide) are Ion Beam Sputtered (IBS) with Thin Film Devices (TFD, Inc.) proprietary method, uniquely developed for Inline ULVAC SPD300 & SE3 Machines with large scale volume capacity. The Ion Beam Sputter (IBS) has produced the lowest surface roughness, 7Å (RMS) for (1500Å thick) and higher work function (W.F.) for transparent conductors, I.T.O. (Indium Zinc Oxide), A.Z.O. (Aluminum Zinc Oxide), and I.Z.O. (Indium Zinc Oxide), than other methods. These qualities can not be achieved in conventional Magnetron Sputter and Ion-Assisted E-Beam processes. (Thin Film Devices, Inc.) TFD’s Transparent Conductor (T.C.), I.T.O. (Indium Zinc Oxide), A.Z.O. (Aluminum Zinc Oxide), and I.Z.O. (Indium Zinc Oxide), are highly stoichiometric, (which allows fine wet etch to 2µm), shows very low nodules (Peak to Valley Roughness), excellent surface quality, with higher work functions (W.F.), to build Semiconductor Structures with multiple layers, such as Oled, Organic Photo Voltaic (OPV), MEMS, and many other similar devices.

Thin Film Devices Inc. • 1180 N Tustin Ave, Anaheim, CA 92807 • (714) 630-7127 • FAX (714 )630-7119 • email: sales@tfdinc.com

Transparent Conductors:

SPECIFICATIONS:

I.T.O. - Indium Tin Oxide (Ratio 91-9 / 95-58 / 99-1)

Process:

Planar Ion Beam Magnetron Sputtering

I.Z.O. - Indium Zinc Oxide (Ratio 91-9)

Resistivity’s:

1.5 - 1000 Ohms/Sq. (Standard ITO)

Accuracy Of Value:

± 5% Of Specified Value (nominal)

Substrates:

Glass, Float, Borofloat, Corning, Sapphire, Quartz, Silicon

Optical Index n, k

(Visible Spectrum) See Attached Data.

Surface Roughness:

7 Å RMS (For 1500Å Film)

A.Z.O. – Commonly used for capacitive touch screens and other high resistive applications.

Work Function:

≥ 4.8 ev.

F.T.O. – Is the most stable, and oldest transparent conductor. It can only be produced by CVD process. Difficult to etch fine patterns has made its use primarily for plasma displays & low E architecture glass applications.

Uniformity:

± 5% Within 14” x 14” and 24” x 24”

Etchability:

2 µm Features

Size:

18” x 20” / 28”x 36” or Smaller

Shapes:

Flat, Curved, Domed, Cupped And Rod

A.Z.O. - Zinc Oxide with Aluminum 2% F.T.O. - Fluorine doped Tin Oxide I.T.O. - Remains to be the king among all the transparent conductors. Most commonly used in all flat panel displays, touch screens, heaters, EMIshielding, circuits, MEMS and solar applications. I.Z.O. - Is used quite often in the LCD’s in place of I.T.O., easily etchable, but not as durable as I.T.O.

TFD pioneered and invented Planar Ion Beam Sputtering (IBS) for large area coating process. This technique is different than plain magnetron sputter process.

APPLICATIONS: LCD

This process provides very low surface roughness, i.e. I.T.O. (RMS) ≤ 7Å @ 1500Å and higher work function (W.F.) ≥ 4.8 ev. This is an excellent choice to manufacturing devices such as Oled, MEM’s & Organic Solar. The IBS process provides an excellent adhesion, abrasion, higher compact density ≥ 99% and extremely stoichiometric, where E-Beam and Ion assisted E-Beam can not match the quality.

Desirable ohm/SQ Ranges

– TN/STN – AMLC

100 – 300 10 - 20

Touch Screen

Resistive Capacitive

300 – 600 1000 - 2000

Heaters

LCD Cameras

10 – 20 20 - 50

Shielding

EMP EMI RFI

≤4 ≤ 10 ≤ 50

Electro Static Discharge

K ohm – Mega ohm

RF Antennas

1000 – Kilo-ohm

Solar

≤ 20 ohm/Sq.

ENVIRONMENTAL: Meets or exceeds:

Mil C-675C

No part of coating removed by standard tape pull. (Severe)

Mil 810C M-13508B

No visible degradation after ≤ 80 eraser rubs. (Severe)

Mil C-675A Mil M13508B

Shall withstand 24 hours of 95 – 100% humidity @ 120°F.

Mil M14806A

Shall show no evidence of deterioration after exposure to ambient temperature of -65°F for 4 hours at each specified temperature.

Thin Film Devices Inc. • 1180 N Tustin Ave, Anaheim, CA 92807 • (714) 630-7127 • FAX (714 )630-7119 • email: sales@tfdinc.com

I.M.I.T.O.™ (Index Matched I.T.O.™) I.M.I.T.O.™ (Index Matched Indium Tin Oxide™) was invented by Saleem Shaikh @ Thin Film Devices (TFD, Inc.) in 1987. The main purpose of Index Matching was to reduce internal & external reflections of ITO (Indium Tin Oxide) when used in displays such as TFT-LCD, Chroma Filters, EMI Shields & Heaters, when used with (primarily) LCD and others. The I.M.I.T.O.™ (Index Matched Indium Tin Oxide™) concept was first extended to Oled, Photo Voltaic, LCoS, Capacitive Touch Panels, and many other applications. The use of the I.M.I.T.O.™ (Index Matched Indium Tin Oxide™) concept has revolutionized the improvement of Displays, and Touch Screen Enhancements for sun light view ability and superior contrast. TFD, Inc. (Thin Film Devices, Inc.) not only invented and developed I.M.I.T.O.™ (Index Matched Indium Tin Oxide™), but also incorporated it with Ion-beam Sputter (IBS) to produce much more superior and reliable coatings when compared to the Ion Assist evaporation process. I.M.I.T.O.™ (Index Matched Indium Tin Oxide™) can be patterned as small as 5µm features for up to 14" x 18" sizes.

Thin Film Devices Inc. • 1180 N Tustin Ave, Anaheim, CA 92807 • (714) 630-7127 • FAX (714 )630-7119 • email: sales@tfdinc.com

IMITO™ Description: IN 1987 TFD INVENTED AND PIONEERED THE IMITO™ multi-layer coating stack. IMITO™ (Index Matched ITO) was primarily developed to reduce internal and external reflections for LCD, TFT, micro displays, EMI, ruggedization and other applications. The internal reflections can be reduced to as low as 0.2-0.5% as seen in the accompanying curves. ITO and IMITO™ reflectivity is compared in the curves as well.

IMITO™ filter laminated to LCDs

The IMITO™ can be used with any of the ITO resistivity’s desired, from 10 to 500 ohm/sq., but some transmission & reflection performance is sacrificed for lower resistive values of ITO ≤ 10 ohm/sq. IMITO™ structure varies with the application. The ITO is made as the top coat for LCD and other display usage. For EMI and heater applications, the ITO is sandwiched between dielectrics to give maximum transmittance. This is also the layering used where epoxy, or oil is on that surface, as in ruggedization applications requiring lamination.

IMITO™ on LCD, low reflection

The IMITO™ for LC applications is etchable by standard etchants. TFD also provides etched panels where required, with the guarantee of “no residual” (bridges, leakage, etc.). The low surface roughness of IMITO™ for LC permits cell gaps of 3mm.

SPECIFICATIONS: Process Method:

Enhanced Magnetron Sputtering.

Resistivity:

2 - 600 ohm/sq. (Standard ITO).

Accuracy of value:

± 10% of specified value (nominal).

Substrates:

Glass, Silicon, Quartz, Germanium and others.

Optical Index:

Gradient (See curve).

Surface Roughness: 7 ± 2 Å (for 1500 Å film). Etch ability:

5 µm features.

Uniformity:

≤ 5% within 14“ x 14”.

Size:

18” x 16” 28” x 36” or smaller.

Shapes:

Flat curved domed cupped & rod.

IMITO™ laminated to LCD

APPLICATIONS: Displays- TFD Displays, micro-displays, reflective displays and VSI-IRshutters. EMI Windows, heaters for Ruggedization. Heater Windows for Ruggedization.

ENVIRONMENTAL: Meets or exceeds: Mil C-675A

No part of coating removed by standard tape pull. (Severe)

Mil 810C M-13508B

No visible degradation after Mil C675A 20 eraser rubs. (Severe)

Mil M-13508B

Shall withstand 24 hours of 95100% humidity @120째F.

Shall show no evidence of deterioration after exposure to Mil M-14806A ambient temperature of -65째F and 160째F for 4 hours at each specified temperature.

Thin Film Devices Inc. • 1180 N Tustin Ave, Anaheim, CA 92807 • (714) 630-7127 • FAX (714 )630-7119 • email: sales@tfdinc.com

L.T.I.T.O.™ (Thin Film Devices, Inc.) TFD utilizes, Ion-beam Sputter (IBS), where deposition is performed at temperatures as low as 30 °C - 60 °C. The Low Temperature I.T.O.™ (L.T.I.T.O.™) Sputtering process minimizes the temperature buildup on the part during deposition and yet the Low Temperature ITO™ (L.T.I.T.O.™) exhibits very good adhesion, durability and transmittance. The Low Temperature ITO™ (L.T.I.T.O.™) Process Coatings are deposited on a variety of Plastics, Acrylics, Polycarbonate, Crystals, LCD Color Filters, PET and Polymers. The resistivity’s of 10 to 500 ohms/sq. are routinely achieved. Typically, TFD recommends that all plastics be hard Si-Coated, by Spray or Dip Methods, prior to any coating, to reduce the materials internal out gassing chemical & mechanical changes. This Low Temperature I.T.O.™ (L.T.I.T.O.™) process allows I.T.O. (Indium Tin Oxide) to be deposited on Finished Products such as Touch Panels, Polarizer’s, Privacy Screens and other Finished Products for EMI Shields, Heaters, and other Display applications.

Thin Film Devices Inc. • 1180 N Tustin Ave, Anaheim, CA 92807 • (714) 630-7127 • FAX (714 )630-7119 • email: sales@tfdinc.com

LOW TEMPERATURE ITO (LTITO™) 10 – 500 OHM/SQ Resistivity’s Series LTITO™ DESCRIPTION: TFD’s unique sputtering process, IBS where deposition is performed at temperatures as low as 30 °C – 60 °C. The LTITO™ exhibits good adhesion, durability and transmittance. The LTITO™ process coatings are deposited on a variety of acrylics, crystals, LCD color filters, Polycarbonate, PET & polymers.

ITO and IMITOTM on Plastic Panels

The LTITO™ sputtering process is unusual as it minimizes the temperature buildup on the part. Resistivities of 10 to 500 ohms/sq are routinely achieved. Generally, all plastics are Si-hard coated by spray or dip methods prior to any coating. The Si-hard coat provides a higher level of adhesion and mechanical durability.

SPECIFICATIONS: Process Method: Resistivity’s: Accuracy of value: Substrates:

Low Temperature IBS Magnetron Sputtering 10 – 500 ohm/sq (LTITO™) ± 5% of specified value (nominal) Plastics, Plastic sheet, Crystals & Others

Optical Index:

See Following Pages

Surface Roughness:

< ±10Å RMS (For 1500Å Film)

Uniformity:

< 5% within 14” x 14”

Etchability:

± 10 (m features)

Size:

18” x 20” (Flat Substrate)

Shapes:

Flat, curved, domed, cupped and rod

APPLICATIONS: Desirable ohm/sq Range Displays Oled ≤20 TFD ≤20 Capacitive 300 - 600 Touch digital Screen Resistive PET Solar ≤ 20 Polymers EMP ≤4 Shielding EMI ≤ 20 RFI ≤ 500 Heater

Not Recommended

ENVIRONMENTAL: Meets or Exceeds Mil C-675C

No part of coating removed by standard tape pulls. (Severe)

Mil 810C M-13508B

No visible degradation after 3 80 eraser rubs. (Severe)

Mil C-675A Mil M-3508B

Shall withstand 24 hours of 95 – 100% humidity @ 120°F.

Mil M-4806A

Shall show no evidence of deterioration after exposure to ambient temperature of –65°F and 160°F for 4 hours at each specified temperature.

Thin Film Devices Inc. • 1180 N Tustin Ave, Anaheim, CA 92807 • (714) 630-7127 • FAX (714 )630-7119 • email: sales@tfdinc.com

Antistat/EMI//EMP/RFI Shielding I.T.O. (Indium Tin Oxide) & I.M.I.T.O.™ (Index Matched Indium Tin Oxide™) are excellent choices for EMI, RFI, and EMP Shielding, for the ever growing flat panel display integration, for TFT, Plasma and LCoS displays. Also plain I.T.O. (Indium Tin Oxide) or I.M.I.T.O.™ (Index Matched Indium Tin Oxide™) is used for heater applications for rugged environments. Typical applications are as follows: Antistatic requires 1000 – 5K ohms/sq. RFI Shielding requires 500 – 50 ohms/sq for lower frequencies (5 – 50 MHz). EMI Shielding requires 20 – 5 ohms/sq (for frequencies 250 MHz – 10 GHz. EMP Shielding requires ≤ 4 ohms/sq (for frequencies ≥ 10 GHz. THE OLD AND CONVENTIONAL NEED, FOR EMI SHIELDING, WAS TO USE WIRE MESH, BUT IT IS COSTLY, HAS POOR TRANSMISSION AND MOIRE EFFECT AND HENCE, ITO OR I.M.I.T.O.™ CAN REPLACE WIRE MESH. Heaters made with I.M.I.T.O.™ (Index Matched Indium Tin Oxide™) are essentials for Ruggedization of LCD Displays. (Thin Film Devices, Inc.) TFD manufactures these Heaters, Index Matched to both air and epoxies, LC (Liquid Crystals), and other mediums.

Thin Film Devices Inc. • 1180 N Tustin Ave, Anaheim, CA 92807 • (714) 630-7127 • FAX (714 )630-7119 • email: sales@tfdinc.com

EMI SHIELD COATING – EMP SHIELDING EMI (VISIBLE RANGE) FOR RUGGEDIZATION

DESCRIPTION:

TFD invented & pioneered the use of ITO and IMITO™ (Low Reflectance ITO) for EMI-RFI shielding & heater applications. The usage is commonly required in most consumer, military, and OEM applications. The technique is simple and economical. These coatings can be applied on both glass and plastic type substrates.

OPTIONS: Viewer

Display Side

Bus Bar

BBAR / IMITO™

IMITO™ to Air

Wraparound

BBAR / IMITO™

IMITO™ to Epoxy

Wraparound

BBAR / IMITO™

Hot Mirror, NVG

Busbar Front Side

IMITO™(EMI)

IMITO™/ (Heater)

Busbar Both Sides

Hot Mirror IMITO™

*NOTE: ITO and IMITO™ are interchangeable.

SUBSTRATES: Î Schott/ Hoya Filter Glass Î Chemically &Heat Tempered Î Touch Screen Î Matte Finished Î Eagle XG / Float Glass Î Plastic Acrylics / Polycarbonate

Ruggedization of Flat Panel Displays, or CRT Faceplates Shielding sensitive components from spurious radiation’s NIR or IR windows Shielding aircraft and avionic light systems Protecting MOS circuit components from static discharge FAB line windows

Coating

Ohms/sq

@10 MHz

*Transparency

0.11

None

0.5

None

3.5

65%

70%

VITO

83%

ITO

88%

IMITO

±89%

IMITO

±92%

EMI / RFI Shielding for visible, NIR and far IR region. High conductivity with high emissivity coating in all the regions: Vis, NIR and IR. Mesh technique is also used as a heater element.

EMI: GRID SHIELDING EMI Series – Infrared Windows, NIR and IR DESCRIPTION: TFD has also developed techniques to apply metallic grids or meshes on materials such as ZnS, ZnSe, CdS, Se, Ge, Si, Sapphire Windows and domes, as well as glass. Notice the photographs. The odd shapes are often a requirement of advanced scientific and military applications. TFD has also developed unique alloys and intermetallic layer systems. These are applied by a modified sputtering technique and demonstrate superb adhesion and high temperature stability to 350°C without any significant change of thermal coefficient of resistance (TCR ±50 PPM). The grid pattern is designed to optimize both transmission and conductivity to achieve the necessary EMI attentuation. The grid size and attenuation relationship is shown in the graph, which predicts the SE (Shielding Effectivity) versus Frequency. Fine line widths as small as 0.0001” (2.54 micron) are successfully deposited on substrate dimensions as large as 10” x 10”. Larger grids are applied on surface areas to 14” x 16”. The shielding effectiveness (SE) is primarily controlled by the aspect ratio (line width) space + line width and the conductivity of the film. The chart shows that the mesh spacing must be made quite small to be effective at higher frequencies, but maintaining a fine mesh line permits excellent viewing through the mesh to values of 92% or better.

Coating

Ohms. Sq.

Shielding @ 10MHz

Transparency

EMI SHIELD (VIâ&#x20AC;&#x2122;s)

EMI Ruggedized Displays

Aircraft Lenses with EMI Coatings

Coated using IMITO Low Reflectance

Thin Film Devices Inc. • 1180 N Tustin Ave, Anaheim, CA 92807 • (714) 630-7127 • FAX (714 )630-7119 • email: sales@tfdinc.com

TRANSPARENT HEATERS (Thin Film Devices, Inc.) TFD is the leading manufacturer of glass heaters for the flat panel display industry. Typically, heaters are I.M.I.T.O.™ to epoxy or air, for stand alone or lamination versions. The heater designed for 0.1 Watt/Sq. Inch – 5 Watt/Sq. Inch. (Thin Film Devices, Inc.) TFD has developed a unique software process to predict heat dissipation, power loading and temperature rise, in different sets of environments, for ruggedization. (Thin Film Devices, Inc.) TFD is also a leading heater manufacturer for sapphire and silicon substrates using accumulation of metal and/or oxide in a grid pattern, which can be powered up to 20 Watts/Sq. Inch, with transmission up to 95%, in the ranges of 0.8 µm – 6.5 µm. An ideal choice for NIR and IR applications.

Thin Film Devices Inc. • 1180 N Tustin Ave, Anaheim, CA 92807 • (714) 630-7127 • FAX (714 )630-7119 • email: sales@tfdinc.com

THIN FILM CUSTOM HEATERS SUBSTRATE SPECIFICATIONS: Glass:

Corning Eagle XG, Eagle 2000, Borafloat, Standard float (soda-lime)

Tempered Glass:

Chemical or Heat Tempered

Thicknesses:

0.01" (0.25 mm) to 0.5" (12.7 mm) standard. (For others, consult TFD) 70 µm & 100 µm On Special Request

PRODUCT DIMENSIONS: Sizes:

Plain Version:

All from 1/2" sq or round, to 24” x 24" (610 mm x 610 mm)

Patterned:

Sizes from 1/2" sq. to 14” x 18" (355 mm x 457 mm)

Custom:

Many variations available: Circular domes, curved plates Wide variations on voltage and power are possible (consult TFD)

Tolerances for sizing:

± 0.002" (0.05 mm)

PROCESS:

ION BEAM SPUTTERING (SUPERIOR PROCESS)

CUSTOM POWER DISSIPATION: Tested Power Rating:

0.05 to 20 watts /sq.in. (Configuration dependant)

Heating Uniformity:

± 5%

OPTICAL CHARACTERISTICS: (See Curves) Heater Types:

Plain ITO

IMITO™

Grid / Patterned

Transmissions: *

75 – 85%

85 94%

* 90 – 98%

IR 90%

Vs. Wavelength:

*****************

Resistivity, nominal (ohms/sq.) (* = ITO Thickness Dependent)

2 to 350

400 – 700 nm ***************** 2 to 350

2 to 350

1 – 10 µm 5 to 50

APPLICATIONS:

Commercial Displays, Avionics and Military Displays

COATING NON-UNIFORMITY:

± 2.5% across full sheet

BUSBARS:

1: Sputtered Cr/Ni/Au, Solder reflow, 10K PSI (pull test) 2: Flex Cable 3: Wraparound (see diagram)

Options:

SURFACE QUALITY: Defects:

< 5 micron on large substrates

Imbedded Particle

< 2 micron

Surface Roughness:

< 20 Å RMS, for each side

Inspection Quality:

1: 80/50 to 20/10 (5K Lux) 2: Thermal Imaging

DURABILITY: Abrasion:

200 strokes @ 10Kgm (Mil C-675)

Adhesion:

Snap Test (Mil M-13508)

Solubility:

> 24 hours in Sodium Chloride, Fog and Solution (Mil C-675)

Temperature:

> 12 hours @ -55 to 350°C

PACKAGING:

CLASS 100, OR AS REQUIRED

OTHER MATERIAL RESISTIVITY TABLE: Resistivity (Ohm – Cmm)

Thickness

TCR Thermal Coefficient Of Resistivity

General Nature

ppm @ 25˚C

ITO

1.5 X 10 -4

1500 Å

1500+ 200

Transparent

SiOiCr

7.2 x 10 -4

1500 Å

100+ 25

Black

Inconel

4.5 x 10 -4

1500 Å

*150+ 25

Metal (grid)

NiCr

3.5 x 10 -4

1500 Å

*300+ 50

Metal (grid)

TaN

4.5 x 10 -4

1500 Å

*100+ 50

Ceramic

4.6 x 10 -6

1500 Å

450+ 50

Others Available Upon Request

Metal (grid)

RESIST EQUATIONS: For the final manufacture of a heater, the resistance for the heater (ohms) is converted to resistivity (*ohms/sq. This value is a function of the length of the heater (L) and the width (W) as it relates to the total resistance. L is the size between bus bars.

BUS BAR COATINGS: TFD offers several solutions of low profile, solid state and silver bus bars completely compatible for all solvents and pull tests of 8K gram/sq in. A. Metalized Busbar. B. Silver Epoxy C. Copper Tape

Cr / Ni / Au Solderable

Standalone

STANDALONE HEATERS, 10 OHMS/SQ IMITOTM (W BBAR ONE SIDE) ON TEMPERED FLOAT GLASS

No.

Wavelength

Transmittance

420

92.165

450

94.246

500

94.383

550

94.295

600

94.295

650

94.028

RUGGEDIZED HEATERS, 15OHMS/SQ. IMITO™ FRONT SIDE (index matched back), LAMINATED TO LCD

No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16

Wavelength 400.00 420.00 440.00 460.00 480.00 500.00 520.00 540.00 560.00 580.00 600.00 620.00 640.00 660.00 680.00 700.00

Transmittance 92.097 95.988 97.028 97.325 97.368 97.356 97.491 97.635 97.762 97.815 98.029 98.055 98.055 97.990 97.555 96.945

CUSTOM HEATERS: TFD offers complete design, specification and solution for your unique ruggedized heater application.

Thin Film Devices Inc. • 1180 N Tustin Ave, Anaheim, CA 92807 • (714) 630-7127 • FAX (714 )630-7119 • email: sales@tfdinc.com

TRANSPARENT HEATERS-2 Transparent heaters are essential to use for challenging environments for cameras, LCD’s & electro-optical devices below -10° C. The application in Avionics, cameras, LCD’s & locomotives require heaters so they can operate in cold and severe climates. Applying a heater is the simplest solution. The transparent heater is usually made by only I.T.O. or I.M.I.T.O.™ with higher transmittance. The resistance of the heater determines the rate of heat required and power utilization. The lower the resistance, it requires higher power and higher rates of heating. TFD, Inc. has pioneered the use of I.T.O. and I.M.I.T.O. ™ with BBAR coatings for efficient and high performance heaters for avionics, locomotives, flat panel displays, ships and cameras. The heating uniformity and burned out is controlled by very low resistive bus bar material with low contact resistance. The heaters can be designed for wide resistance from 300 – 5 ohms and voltages (115, 28, 24, 12 volt). The heater with I.T.O. or I.M.I.T.O.™ has been tested up to 10 watts per square inch. Usually a much lower heat is used for LCD display applications. The bonded heaters require less power than stand alone, typically 1/3. The I.T.O. & I.M.I.T.O.™ coatings are extremely reliable and stable for continuous operations. The typical visible transparency for I.T.O. is ≥ 80% avg., and IMITO™ is ≥ 92% average. The patterned heaters are commonly used for uniquely higher or lower powers, ≥ 10 watts/sq. inch. TFD can design patterned for various shapes, & sizes while maintaining uniform heating. The patterned heaters are also very desirable for Infra-Red (IR) applications for wave lengths of 1.0 µm – 12 µm.

Basic Heater Form

Patterned Heater Allows Higher Resistance or Voltage

Thin Film Devices Inc. • 1180 N Tustin Ave, Anaheim, CA 92807 • (714) 630-7127 • FAX (714 )630-7119 • email: sales@tfdinc.com

TRANSPARENT HEATERS - 2 Transparent heaters are essential to use for challenging environments for cameras, LCD’s & electro-optical devices below -10ºC. The application in Avionics, cameras, LCD’s & locomotives require heaters so they can operate in cold and severe climates. Applying a heater is the simplest solution. The transparent heater is usually made by only I.T.O. or I.M.I.T.O.™ with higher transmittance. The resistance of the heater determines the rate of heat required and power utilization. The lower the resistance, it requires higher power and higher rates of heating. TFD, Inc. has pioneered the use of I.T.O. and I.M.I.T.O.™ with BBAR coatings for efficient and high performance heaters for avionics, locomotives, flat panel displays, ships and cameras. The heating uniformity and burn-out is controlled by very low resistive bus bar material with low contact resistance. The heaters can be designed for wide resistance from 300 – 5 ohms and voltages (115, 28, 24, 12 volt). The heater with I.T.O. or I.M.I.T.O.™ has been tested up to 10 watts per square inch. Usually a much lower heat is used for LCD display applications. The bonded heaters require less power than stand alone, typically 1/3. The I.T.O.& I.M.I.T.O.™ coatings are extremely reliable and stable for continuous operations. The typical visible transparency for I.T.O. is ≥ 80% avg., and I.M.I.T.O.™ is ≥ 92% average. The patterned heaters are commonly used for uniquely higher or lower powers, ≥10 watts/sq. inch. TFD can design patterned for various shapes, & sizes while maintaining uniform heating. The patterned heaters are also very desirable for Infra-Red (IR) applications for wave lengths of 1.0 µm – 12 µm.

Basic Heater Form

Patterned Heater Allows Higher Resistance or Voltage

CONNECTION: Bus bar to heating surface. The contact resistance from the bus bar to the heating surface, I.T.O., I.M.I.T.O.™, or NiCr must have ≤ 0.1 ohm. The other rule of thumb is to have individual bus bar resistance to be ≤ 5% of the total resistance of the heater. The bus bar materials are: A. Silver Epoxy

B. Soldered Metallization

C. Silver Frit Material

The Silver Epoxy is inexpensive and decays in 2 – 3 years. The Silver Frit Material has to be fired at ≥ 350°C which deforms glass flatness and this process contaminates the surface. The Metalized Bus bar, such as Cr/Ni/Au, is a solid state process and works extremely well with Soldered bus bar heaters. This is a highly recommended process. (See Heaters – 1 Page).

POWER CALCULATION: Below a Temperature Rise curve is provided that gives the relationship of time versus power of the heater with thickness 0.040”. There are different ways to apply heater glass with displays: A. Stand alone. B. Laminated. The standalone are typically applied in the back of the displays and have air gaps, 0.008”– 0.020”, which makes it a poor heating system. For low heat requirements it’s plenty. For fast rise temperature the heater glass should be bonded for optimum avionics applications. Mounting heater glass on the front (viewing side) of the display is not recommended as heat loss to air could be as high as 50% of the total heat. A thermistor or I.T.O./Thermal coefficient of resistance (TCR) is commonly used to control temperature. If higher temperatures are used to quickly heat the display, you must reduce that heat level once at operating temperature. Additionally, it is not recommended to operate heaters above a 20 C ambient temperature.

(0.040” glass heater curve)

TIME (min.)

SIDE NOTE: Besides adding a thermistor to monitor the temperature, I.T.O. itself has a sizable TCR and can be its own temperature sensor.

Example: For example, for dew removal we might use only ¼ W/sq. inch in a 2 x 4 inch heater pattern on glass. With the 8 square inches, a total of 2 watts is required since the chart values are Watts/sq. in. (8 x ¼ = 2). This information and the intended heater voltage allow calculation of the heater resistance. The formula follows:

E2 P

Heater Resistance (R) =

(Voltage, in Volts) (Power, in Watts)

Example 1: Bus Bars on ends

To complete the Example, we’ll use 6 Volts to power the heater. So, R becomes 18 ohms (6, squared, divided by 2).

Now the heater resistance and part sizes are all that’s required to define a heater to TFD; But there, heater resistance is converted into resistivity for production purposes. Resistivity is the surface resistance nature the manufacturer coats so the part shows the correct resistance. To determine the resistivity value, it’s calculated with the length (L) and width (W).

(Note: Length is always the distance between bus bars, even if smaller than the width).

Resistivity (

) = LxR W

L = Length (either inch or cm) R = Heater Resistance (ohms)

W= Width (either inch or cm) = Resistivity (ohms/sq.)

Process: Sputtering Heater Coating Materials: The most commonly used transparent resistive coatings are I.T.O. (Indium Tin Oxide), and tin oxide. TFD concentrates on producing superb quality I.T.O. and I.M.I.T.O.™, in a variety of forms. Opaque conductor films are Aluminum, Nichrome, Inconel, Tantalum, Nitride and cermet films. Substrate materials can be glass, quartz, ceramic, plastic, kapton, polyester and others.

Resistivity Table:

I.T.O. Sn02 NiCr TaN Inconel Si0iCr

Resistivity

Thickness

TCR/PPM

1.5 x 10 -4 3.5 x 10 -4 3.5 x 10 -4 4.5 x 10 -4 4.5 x 10 -4 7.2 x 10 -4

1500Å 1500Å 1500Å 1500Å 1500Å 1500Å

1500 ±250 1500 ±100 300 ±50 150 ±50 225 ±50 150 ±50

General Nature Transparent Transparent Opaque Opaque Opaque Opaque

Bus bar Coatings: Bus – Bar Materials as Follows:

Power Recommendation

Application

1. Silver Epoxy

≤1.5 watt/sq inch

Commercial Heaters

2. Silver Epoxy with Copper Strip

≤2.0 watt/sq inch

Commercial/Industrial

3. Sputtered Cr/Ni/Au

1 – 10 watt/sq inch

Avionics, Ruggedized

4. Silver Frit

2.5 – 5 watt/sq inch

commercial/Industrial

Anti-Reflection Coatings (Thin Film Devices, Inc.) TFD developed BBAR Coatings using IBS(Ion Beam Sputter) techniques, which allows almost defect free films (≤ 5µm), high temperature stability to 450 °C (no cracks and haze), extreme chemical inertness (can be immersed in regular acids & alkaline) and very low haze (Internal Scatter), excellent mechanical durability. All of the above characteristics can not be achieved in conventional (Ion-beam with e-beam) process. (Thin Film Devices, Inc.) TFD can design these BBAR Coatings for different wavelengths. (Thin Film Devices, Inc.) TFD BBAR are routinely used for LCoS, MEMS, DLP Touch Panels and Antireflective Filters.

Illustrates The Low Reflectance Of A White Cup From An AR Coated Panel

Thin Film Devices Inc. • 1180 N Tustin Ave, Anaheim, CA 92807 • (714) 630-7127 • FAX (714 )630-7119 • email: sales@tfdinc.com

ANTI-REFLECTION COATINGS SUBSTRATE MATERIAL: Glass:

Corning Eagle XG, Eagle 2000, Borofloat, Standard float (soda-lime)

Tempered Glass:

Chemical or Heat Tempered

Plastics: (Optional)

Acrylic, Polycarbonate, others (consult with factory on issues)

DIMENSIONS: Sizes:

14 x 18" (356mm x 457mm); 24 x 24" (610mm x 610mm); (variations considered, consult with factory)

Tolerances for sizing:

±0.08" (±2mm)

Thicknesses:

0.010" (0.25mm) to 0.50" (12.7mm)

PROCESS:

ION BEAM SPUTTERING (Proven Superior Process) Over E-Beam

OPTICAL CHARACTERISTICS (Glass): Standard BBAR Band 420 - 670nm Reflectance 0.25% avg.

UV BBAR 375 - 630nm 0.25% avg.

BBAR (C-Band) NIR 1250 - 1600nm 0.50% avg.

≥99.5% <0.1%

≥98%, coated 2 sides -

≥99.5% <0.1%

Transmission Absorption (coating) COATING UNIFORMITY:

±2.5% across full sheet

SURFACE QUALITY: Defects

<5 micron on large substrate

Imbedded Particle

<2 micron

Surface Roughness

< 20Å RMS

Inspection

5K Lux (for 20/10), 10K Lux (for 5/2)

DURABILITY: Abrasion

200 strokes @ 2.5lb (MIL C-675)

Adhesion

Snap Test (MIL M-13508)

Solubility

> 24 hours in NaCl, Fog and Solution (MIL C-675)

Temperature

> 12 hours @ -55° to 350°C

PACKAGING:

CLASS 100 Or As Customer Requirements

The TFD "SUPERIOR" PROCESS ADVANTAGE: 1) TFD offers Ion Beam Sputtering versus others E-Beam processes. 2) Extremely low surface roughness ≤ 20 Angstroms (rms) compared to E-Beam. 3) Extremely low imbedded particle defects of ≤ 5µm. 4) Excellent process to support LCoS, DPL, micro mirrors, Oled, TFT displays, heaters, EMI shields and C band IR shutters. 5) All coatings withstand up to 450 °C and severe reliability tests.

STANDARD VISIBLE SPECTRUM REFLECTIVITY (one side coated):

Wavelength 365.00 400.00 420.00 430.00 480.00 550.00 600.00 630.00 670.00 680.00 700.00

Reflectance 13.481 1.529 0.438 0.288 0.142 0.194 0.106 0.196 0.719 0.940 1.502

Wavelength 365.00 400.00 420.00 430.00 480.00 550.00 600.00 630.00 670.00 680.00 700.00

Transmittance 70.685 96.202 98.945 98.239 99.234 99.359 99.619 99.725 99.880 98.349 97.501

HIGH TRANSMITTANCE BBAR (both sides coated):

Illustrates The Low Reflectance Of A White Cup From An AR Coated Panel

Thin Film Devices Inc. • 1180 N Tustin Ave, Anaheim, CA 92807 • (714) 630-7127 • FAX (714 )630-7119 • email: sales@tfdinc.com

BLACK MASK FOR DISPLAYS

TFD offers three different types of black masks. The high contrast is an essential and very basic to the success of a display. These black & opaque coatings must be patternable or etchable, and as small as 5µm. The spaces are created for red, blue & green light to pass thru with different aspect ratios. All black masks (organic / inorganics) must have very low reflection thru the glass sides (viewer side).

Thin Film Devices Inc. • 1180 N Tustin Ave, Anaheim, CA 92807 • (714) 630-7127 • FAX (714 )630-7119 • email: sales@tfdinc.com

BLACK MASK FOR DISPLAYS TFD offers three different types of black masks. The high contrast is an essential and very basic to the success of a display. These black & opaque coatings must be patternable or etchable, and as small as 5µm. The spaces are created for red, blue & green light to pass thru with different aspect ratios. All black masks (organic / inorganics) must have very low reflection thru the glass sides (viewer side).

1. Black organic resins: (Color Filters) Very commonly used in LCD displays. These resins are similar to photoresist and are typically applied by spin on, dip or spray on methods. The patterning process is similar to photoresist. Following are the typical characteristics of the resins.

1. Substrate Dimensions

14” x 18” x 0.028” – 0.150”

2. Thickness

0.5 – 8 mm (0.020” – 0.500”)

3. Non-Uniformity

± 10% Center area ± 25% Corners

4. Temperature Stability

180° ± 10 in air ≤ 140°C in vac

5. Edge Resolution

±5µm on 14” x 14”

6. Optical Density

≥ 3.5

Applications LCD displays, Reticles Others

7. Chemical Stability

Acid – good Basic – poor

8. Abrasion

Poor

Mil-C-675

9. Adhesion

Good – Excellent

Mil-48497

2. Black Mask (Thin Film) (Cr:Cr20x or Nb:Nb20x) – For glass / Plastic This film is deposited using a unique sputtering process to create a solid state mixture in a single layer stack rather than a multi-layer coating process which has more pin holes and Etchability is poor. These films are pattern and etchable to the finest resolution.

1. Dimensions

14” x 18”

2. Coating Thickness

1500 – 5500 Å

3. Non-Uniformity

± 10%

4. Optical Density

≥ 5.0

5. Temperature Stability

450 C

6. Edge Resolution

± 3 µm

7. Chemical Stability

Acid/Base

8. Abrasion

Excellent

Mil-C-675

9. Adhesion

Excellent

Mil-48497

Applications

LCD, LCOS, MEMS, DLP FILTERS

Wavelength 425.00 450.00 475.00 500.00 525.00 550.00 575.00 600.00 625.00 650.00 675.00 700.00 725.00 750.00 770.00 800.00

Reflectance 14.15 13.78 10.48 5.69 1.63 0.27 1.94 5.44 9.54 13.39 16.83 19.62 21.68 22.96 23.91 24.89

3. Black Mask (Thin Film) (Thru Air)

TFD has pioneered in manufacturing opaque black mask (thin film) when viewing either threw the glass or plastic or viewing thru the air directly on the film.

These films are patterned and etchable. 1. Dimensions

14” x 18”

2. Coating Thickness

1500 – 5500Å

3. Non-Uniformity

± 10%

4. Optical Density

≥ 5.0

5. Temperature Stability

450 C

6. Edge Resolution

± 3 µm

7. Chemical Stability

Acid/Base

8. Abrasion

Excellent

9. Adhesion

Excellent

Applications LCD, LCOS, MEMS, DLP FILTERS

Mil-C-675 Mil-48497

Wavelength 425.00 450.00 475.00 500.00 525.00 550.00 575.00 600.00 625.00 650.00 675.00 700.00 725.00 750.00 775.00 800.00

Reflectance 1.16 1.25 1.31 1.36 1.39 1.40 1.41 1.41 1.42 1.43 1.45 1.52 1.63 1.79 1.95 2.10

Thin Film Devices Inc. • 1180 N Tustin Ave, Anaheim, CA 92807 • (714) 630-7127 • FAX (714 )630-7119 • email: sales@tfdinc.com

PHOTO ETCH & PATTERNING

Photolithography patterning is provided on almost all coating products of TFD. Metals such as Al, Al:Cu, Cr, NiCr, Ni, Au, Pd, Pt, Ag, Cu, Mo, Mo:Cr and many other alloys and oxides like I.T.O., IMITO™, & Black Cr. (Cr203). These are patterned as small as 2 micron resolution with sharp and tapered edges on up to 370 mm x 470 mm glass and other wafer substrates, 150, 200, & 300 mm. Quality is ensured for all patterns. No residual coating remains in etched areas as small as 2 microns. The Plastic substrates are also patterned but to a lesser Resolution, 10µm features. Numerous display panels and IC masks are products requiring this high-quality patterning.

Thin Film Devices Inc. • 1180 N Tustin Ave, Anaheim, CA 92807 • (714) 630-7127 • FAX (714 )630-7119 • email: sales@tfdinc.com

1. Photo Etch & Patterning:

Photolithography patterning is provided on almost all coating products of TFD. Metals such as Al, Al:Cu, Cr, NiCr, Ni, Au, Pd, Pt, Ag, Cu, Mo, Mo:Cr and many other

OLED Display with Black Chrome & AR

alloys and oxides like I.T.O., IMITO™, & Black Cr. (Cr203). These are patterned as small as 2 micron resolution with sharp and tapered edges on up to 370 mm x 470 mm glass and other wafer substrates, 150, 200, & 300 mm.

Quality is ensured for all patterns. No residual coating remains in etched areas as small as 2 microns. The

Color Filter

Plastic substrates are also patterned but to a lesser Resolution, 10µm features. Numerous display panels and IC masks are products requiring this high-quality patterning.

2. Patterned Products:

Metalized Wafer

TFD has routinely fabricated multilayered products with Thin films as below:.

PRODUCTS a. Capacitive Touch Displays

LAYERS I.T.O./I.M.I.T.O.™/Dielectric & Metal.

b. MEM – Display c.

OLED – Display

Metal/Oxide/Metal I.T.O./Metal/Dielectric

d. Solar (Organic)

I.T.O./Metal

e. Solar (SIG)

Mo/I.T.O./Dielectric

NiCr/Al:Cu & Ag:Au

Heater for (I-R region)

g. Black Mask

OLED on Plastic

Black Cr/Black Resist.

h. Other Products for Research & Development. Chip On Glass

ETCHING PROCESS:

LIFT OFF PROCESS:

Thin Film Devices Inc. • 1180 N Tustin Ave, Anaheim, CA 92807 • (714) 630-7127 • FAX (714 )630-7119 • email: sales@tfdinc.com

QUALITY CONTROL

Thin Film Devices (TFD, Inc.) has been proud to incorporate a rigorous quality inspection method and system into every product it manufactures. These methods are incorporated at minimum 25% in process & 100% at outgoing QC.

Thin Film Devices Inc. • 1180 N Tustin Ave, Anaheim, CA 92807 • (714) 630-7127 • FAX (714 )630-7119 • email: sales@tfdinc.com

1.0

VISUAL INSPECTION: Scratch/ Stain/Chip Inspection: (done by reflection & transmission techniques).

Uniformity and Mark

Scratch, Digs and Chips

Chip Inspection: (done by calibrated Eye Loupe, dimensions in mm).

2.0 INSPECTION METHODS AND QUALITY AREA:

Coated Surface Scratch/Stain

Pattern Surface Scratch/Stain

Bottom Surface Scratch/Stain

Crack/Chip

Pinhole

Fluorescent

Green Halogen

Light 2x30W

Light 100-200W

Light Intensity

1500 Lux

10000 Lux

Conditions

In a dark clean room

Inspection Method

Visual Inspection reflected light

Visual Inspection reflected + transmitted light

Contents Items

Light Source

2.1

Quality Areas After Coating: (area inspected; except for chip and crack)

3.0

SCRATCH & DIG MEASUREMENT: For the Displays, Optical Filters and Solar Cells, defects are extremely important. Early on, the military specifications required methods of inspection to quantify the defects allowed for appropriate product applications. Typically, the application defines the level of defects allowed. This document will describe the standard developed from the Military code. Industry wide, it is useful for identification of small defects located on, or in, an optical surface, and classifies as "pass/fail" purposes. The MIL specification 13830A equivalent (ISO 10110) are routinely used to check visual defects in Flat Panel Displays, Optical Filters and Solar industries, world wide.

3.1

Inspection Setup: Unless the environment for inspection is properly prepared, the inspection will not be reliable and accurate. Here is the layout specified by Mil-13830A, (ISO 10110):

Notice the need for a black background and a Non-Reflective black table top. This setup provides the contrast enhancement needed to see as small as 2µm defects. The intensity of light is also very important. The 2 fluorescent lights with 30 watts each can allow defects both scratch/digs to be seen as small as 20µm, but using 200 watt halogen can allow defects seen as small as 2µm. The light must be focused on the part in inspection, about 6 inches away. The distance, between the eye and the part in inspection, should be 14” – 18” away.

3.2

'Scratch' & 'Dig' Eye Loupes / Microscopes: For the last 50 years, loupes were the only tools to measure the defects of a scratch or dig. Now calibrated, automated microscopes are routinely used, but inspection criteria remains the same. If the eye loupes are used, which is held gently against the inspected part where the flaw was seen. Looking through the eye loupe, the inspector sees both the flaw and the eye loupe scale. The defect is matched and calculated against the defects allowed. The inspection loupes are magnified up to 10X. The microscopes can inspect up to 500X. This inspection method is slow, but very accurate and reliable for patterned glass, or when specs are very tight.

3.3

Measurement Technique: Using the Inspection Arrangement noted above, the part is held at a 14”-18” distance and rotated 90° so the flaw causes the light to reflect back to the inspector's eye. Once found, the artifact or defect is inspected with the calibrated Loupes to determine its size, record the artifact as required, and continue the inspection until completed. The inspection should only be limited to the “active area” or “clear aperture”. The chart below gives the scratch width in microns and digs in mm, per MIL-13830A. The flaws are typically 'paired' to identify the part 'flaw' level and are called „Scratch‟ and 'Dig'.

Scratch Width (μm wide) 80 60 40 20 10 5

Dig Diameter (x 0.1 mm) 50 40 20 10 5 2

Light Source 2 Fluorescent 30 Watts Each Green Light 100 – 200 Watts

3.4

Measurement Guidelines: (example) If a Scratch / Dig specification is 80/50, here are guidelines to use for proper judgment of the part: 1)

Any part with a Scratch wider than 80 µm is unacceptable. ("Fail") a. Only scratches in the clear aperture are considered.

Any Scratch found must be 80µm or smaller in width to be accepted. ("Pass") a. With scratches of 80µm, the total ACCUMULATED LENGTHS of the scratches must be ≤ ¼ of the part diameter*. The formula for the ACCUMULATED LENGTHS allowed is: ∑ L1 + L 2 + L3 + L4 ········· etc ≤ D/4 b. When the predominant number of Scratches are smaller than 80 μm (to 60 or 40), Then follow this formula about accumulated lengths: ∑ L1 + L 2 + L3 + L4 ········· etc ≤ D/2 (* = use the actual diameter or the D for a round part of the same area)

3.5

Specific Dig Criteria Related: 1) No Digs > 0.5mm are allowed. If greater than 0.5mm, the part is a "Fail". 2) If the part digs are less than 0.5mm, then the part is a "Pass" for this check.

a. If the part has Digs of 0.5mm (or less), 4 Digs are allowed. (= "Pass") b. Clear Aperture = 20 mm diameter (0.8"): 1 Dig* allowed, and the maximum sum of Dig diameters are 2 times the maximum Dig diameter. c. Clear Aperture = 40 mm diameter (1.6"): 2 Digs* allowed and the maximum sum of Dig diameters are 4 times the maximum Dig diameter. 5

d. Clear Aperture = 60 mm diameter (2.4"): 3 Digs* allowed, and the maximum sum of Dig diameters are 6 times the maximum dig diameter. (* = maximum dig size) e. Digs of a specified maximum size 10 (0.1mm), must be separated edge to edge, by at least 1 mm. f. These formulae apply to the number and size of Digs.

Permissible Number:

Sum of Dig Diameters:

n ≤ Dig diam. 20 mm

∑ D1 + D2 + D3 + . . . . . ≤ 2 diam.

(Notes: 1. The diameter of an irregularly shaped dig is 1/2 x [length + width]) 2. Ignore Digs less than 2.5 micron. 3. Clear Aperture is the portion used of the part being inspected. 3.6

Bevel Edges:

Scribe & Break

Swiped Light Bevel

“C” Shaped Pencil Edge

Medium Bevel

3.7

Chips: Unless or other wise mentioned, there should not be more than 3 chips ≥ 0.020” or 0.5mm. Larger chips are allowed to be stoned to minimize stress and cracks.

3.8

Handling of Substrates: The substrates must be handled with auto pick & place equipment or between the finger edges. The latex powder free gloves must be worn in class 100 hood with ionized atmosphere.

4.0

MECHANICAL PROPERTIES: Adhesion: To test a coating lot, a test strip, approximately 1.250” wide (30mm) is removed from one edge of one production sheet per run, and coupons = 1.0 Sq. inch is submitted to test from different areas of the coated sheet. The adhesion, abrasion and environmental, durability is treated. These coupons are representative of specific areas of the whole coated sheet. The samples of the coating shall show no evidence of deterioration from the surface of the substrate. The backside (adhesive side) of the #610 Tape and the area of the substrate that was tape tested shall be examined for evidence of coating material.

5.0

ABRASION TEST PROCEDURE: Cleaned surface to be applied with 0.250” diameter of rubber eraser tip per the following:

5.1

Light test

Cheesecloth 2.5 IG.

50 strokes

5.2

Moderate test

Rubber erasers 1.5 IG.

30 strokes

5.3

Severe test

Rubber erasers 1.5 IG.

80 strokes

Surface must be checked usually in the same light as defined per Grade 1 and 2. 5.4

Abrasion and Humidity Resistance: After test, the coating shall show no evidence of permanent deterioration when viewed from a distance of 12” (30 cm) from the test specimen under 5K, 10K Lux illumination.

6.0

CHEMICAL RESISTANCE: The coating shall show no deterioration after a puddle of each of the agents is allowed to remain on the surface for 24 hours. Chemical agents which can only be removed by acetone will not be considered for testing as this would destroy the plastic substrate.

6.1

Extended Humidity: Samples will be placed in humidity chambers and examined after 24 hours, 96 hours, and 240 hours of exposure. Acceptance of each coating batch will occur after the initial 24 hours of exposure.

6.2

Definition of Lot: One lot shall consist of the identifiable product of the same type manufactured continuously from the same materials under the same manufacturing condition.

6.3

1st Article: TFD, Inc. performs 1st article on all manufacturing steps.

6.4

Inspection by TFD, Inc.: All samples, from each lot, are inspected in a Class 1000 area after the surface cleaning.

Several other Product Qualification Tests are performed during the qualification phase of a new product. These tests are performed on an as needed basis for product quality.

Table I Properties

Requirement

Frequency

Chemical Resistance

The coating will be tested for durability against the following chemical agents: Acetic acid (50% by volume) Artificial perspiration Gasoline Ball-point pen ink Citric acid (10% by volume) Coffee Cola Ethanol Felt tip pen Grease pencil Isopropanol Lipstick Liquid detergent (0.5% by volume) (Triton X-200 and water) Methanol Pencil lead Rubber cement Sodium chloride (10%) by volume Stamping ink

These tests will be performed on a qualification basis. st (1 Article only)

7.0

Test Methods:

7.1

Cosmetic Appearance (Scratch/Digs): Visual inspection. Defects (pinholes in the coating) shall be measured visually at a distance of approximately 30 cm from the specimen under 5K Lux or 10K Lux illumination, using black background. (See section 3.0).

7.2

Reflected Color: (uniformity of coatings) The reflected color of substrates coated with any of the coatings, shall be calculated from the measured reflectance using a 1931 XY CIE Color Coordinate System with a 2째 observer and an illuminate C light source on 1st article only.

7.3

Coating durability: “The durability tests described shall be performed only after the moisture content of the coating and the base substrate system has returned to a “normal” condition (typically 24 hours after coating) for every lot.

Table II Properties Adhesion

Test Conditions Snap tape with #610 cellulose tape pressed against coated surface and remove with snap of wrist

Test Method MIL-C675

Rub Durability

Cheesecloth mandrel with a 2.5 lb. Weight

MIL-C-675

50 rubs minimum for

Rubber Eraser with a 1.5 lb. Weight 30 rubs minimum for the coating

Moderate

30 rubs minimum for the coating

Humidity resistance

8.0

80 rubs minimum for IMITO™/BBAR

Severe

24 Hours at 75°C, 95% RH for BBAR side 24 Hours at 75°C, 93% RH for IMITO™ side

MIL-810C

CERTIFICATION: Shall include the key components of the following for each shipping lot, 100% inspected. a.

Dimension – tolerance

Surface, Scratch/Digs

Bevel – Light, Medium, Heavy, Notch

Flatness/Warp (on an as needed basis)

Coatings – Both Sides

Resistance – Ohms/Sq.

Optical Transmittance

Optical Reflection

1st Article Results

Adhesion/Abrasion Testing

Others – As Required.

9.0

PACKAGING / LABEL: a.

Packaging will be performed in Class 1000 or 10,000 for paper wrapped material.

20 pc / package for square or rectangular shape or customer advised.

25 pc / package for round wafers or customer advised.

Each box or package will be plastic wrapped.

Labels to be applied inside/outside per each customer request.

Label will consist of ship date, lot number, quantity, inspector, customer PO number, and other information.

HOT MIRROR FILTERS (Thin Film Devices, Inc.) TFD now produces the HPHM (High Performance Hot Mirror) which is superior to conventional Hot Mirrors. HPHM (High Performance Hot Mirror) rejects ≥ 80% of heat wavelengths, for 1 – 3 µm range, for improved performance. (Thin Film Devices, Inc.) TFD Hot Mirror Filters are coated using our proprietary IBS (Ion Beam Sputtering) process. As a result, TFD Hot Mirror grain sizes are more compact, higher density, and show very low light scatter (Haziness), and higher temperature stability to (450 °C – 2 hrs) which can not be said for Ion-Beam &/or e-beam coated Hot Mirrors. Typical applications are filters for sun loading, microscopes, CMOS filters and similar.

Thin Film Devices Inc. • 1180 N Tustin Ave, Anaheim, CA 92807 • (714) 630-7127 • FAX (714 )630-7119 • email: sales@tfdinc.com

HOT MIRROR FILTERS / IR REJECTION MIRRORS SUBSTRATE MATERIAL: Glass:

Eagle XG, Eagle 2000, Borofloat, Standard Float (soda-lime) Matte, and others

Tempered Glass:

Chemical or Heat Tempered

PRODUCT DIMENSIONS: Sizes:

14” x 18” (356 mm x 457 mm), to 24 x 24” (610 mm x 610 mm) (variations considered, consult factory)

Tolerances of sizing:

±0.002” (±0.05 mm), or as specified

Thicknesses:

0.010” (0.25 mm), to 0.50” (12.7 mm)

PROCESS:

ION BEAM SPUTTERING (SUPERIOR PROCESS)

OPTICAL CHARACTERISTICS: HPHM *

UV-VISIBLE

STANDARD

PLASTIC (only)

• Transmission:

90% avg

70%

• Transmission @ 50%:

700nm, ±15n

650nm, ±15nm

700nm, ±15n

700nm, ±15nm

• Rejection Band:

750-25Knm

375 – 650nm

750 – 950nm

750 – 1200nm

• Reflectance:

≥95% avg

≥80%

• Absorption (coating):

<1%

10%

(0° aio)

(HPHM* = High Performance Hot Mirror)

COATING UNIFORMITY:

± 2.5% across full sheet

SURFACE QUALITY: Haze: Defects: Imbedded Particle: Surface Roughness: Inspection:

≤ 1.0% < 10 micron (on large substrate) < 5 micron < 100Å RMS 3K Lux (for 60/40); or 5K Lux (for 20/10)

DURABILITY: Abrasion: Adhesion: Solubility: Temperature:

PACKAGING:

80 STROKES @ 2.5 lb (Mil C-675) Snap test (Mil M-13508) > 24 hours in Sodium Chloride, Fog and Solution (Mil C-675) > 12 hours @ -55 to 350°C To Class 100

PLASTIC HOT MIRRORS

OXIDE / METAL / OXIDE

Measurement Properties Wavelength Range (nm): Scan Speed: Fast Sampling Interval: Auto Sampling Interval: Scan Mode:

400.00 to 1200.00 0.5 Disabled Single

Sample Preparation Properties Weight Dilation: Volume: Path Length: Additional Information: Instrument Properties Instrument Type Measuring Mode: Transmittance S. R. Width: Light Source Change Wavelength: Detector Change Wavelength: SR Exchange Detector Lock SR Program:

5.0 nm 285.0 nm 895.0 NM Normal Auto Normal

Attachment Properties Attachment:

None

UV-3101

No 1 2 3 4 5 6 7 8 9 10 11 12 13 14

Wavelength 634.00 608.00 567.00 526.00 491.00 451.00 422.00 775.00 624.00 588.00 549.00 509.00 466.00 436.00

T% 97.30 98.61 98.00 99.14 98.01 97.54 97.52 0.19 95.43 94.70 95.58 96.36 96.33 95.03

Thin Film Devices Inc. • 1180 N Tustin Ave, Anaheim, CA 92807 • (714) 630-7127 • FAX (714 )630-7119 • email: sales@tfdinc.com