PCIe—Poised to Dominate the Future of Backplanes?

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solutions engineering

VMe vpx and beyond

3U VPX: Small, Rugged and REDI With so many new architectures and form-factors there often seem to be a multitude of solutions for every application. One new formfactor may not be getting the attention it deserves because it has been in the shadow of its larger 6U sibling. It is 3U VPX. by M ichael Munroe Elma Bustronic

Mechanical Form-Factor

When the features of 3U VPX are examined, the strength of this compact architecture becomes clear. The

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September 2007

1.60 (0.063 in)

Max. Component Height Secondary Side 4.06 (0.160 in). Includes Board Thickness 14.70 (0.579 in) Max. Component Height 13.72 (0.540 in) Primary Side

7.65 (0.301 in) .00 (0.000 in) 7.25 (0.285 in)

100.00 (3.937 in)

21.65 (0.852 in)

50.45 (1.986 in)

84.70 (3.335 in) 2.50 (0.098 in) Guide Rail Clearance 2 PLS.

3

U VPX is much more than just a half-size version of 6U VPX. Unlike 3U VME’s relationship to 6U VME, 3U VPX can support the same speed and bandwidth of its larger 6U brother. Unlike the trade-off between 3U cPCI and 6U cPCI, 3U VPX doesn’t require the user to make such a dramatic decision between bus width and I/O capability. It is true that 3U VPX has a much more limited number of potential I/O channels than the larger 6U version. However, with two fabric connectors offering 32 differential bi-directional channels (64 links total), 3U VPX probably has more than enough connectivity for most applications. One popular system configuration that a number of individuals have inquired about is a 3U VPX system with four x4 transport channels for the card to card topology and the remaining 16 bi-directional channels used for rear panel I/O.

Figure 1

160.00 (6.299 in) 170.60 (6.717 in)

3U-160 x 5 HP conduction-cooled module (XPedite 8070 – Extreme Engineering Solutions, Inc.).

mechanics of the form-factor are particularly compelling when compared to other small serial fabric solutions (Figure 1). 3U VPX compares favorably to

the other smaller form-factors with regards to total available PCB area as well as total front panel space as shown in Table 1.


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