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ADC/DAC 6U VPX Module Targets Electronic Warfare Applications
Get Connected with with companies mentioned in this article. Applications like electronic warfare have a huge appetite for low latency, high ADC/DAC performance combined the highest available I/O www.cotsjournalonline.com/getconnected bandwidth. With that inwith mind, Curtiss-Wright Controls introduced the Industry’s first Xilinx Virtex\-7 OpenVPX Get Connected companies and products featuredhas in this section. the CHAMP-WB (“WideBand”), COTSwww.cotsjournalonline.com/getconnected DSP Engine designed for sense-and-response applications that require high bandwidth and minimal latency. In addition, Curtiss-Wright is also introducing its first module for the CHAMP-WB, the TADF-4300, featuring Tektronix Component Solutions’ 12.5 Gsample/s ADC and DAC technologies. Combined, these two modules form the CHAMP-WB-DRFM and provide the highest bandwidth/highest resolution platform for wideband Digital Radio Frequency Memory (DRFM) processing available in the embedded defense and aerospace market, delivering an unprecedented 12.5 Gsamples/s 8-bit ADC and 12.5 Gsample/s 10-bit DAC performance from a single 6U slot. This new rugged 6U card set is the first product resulting from Curtiss-Wright’s recently announced technology and marketing partnership with Tektronix Component Solutions, and features the jointly developed TADF-4300 module. Based on Tektronix’s silicon germanium (SiGe)-based data converters, the TADF-4300, when coupled with the CHAMP-WB’s onboard Virtex7 FPGA and high-speed wideband interfaces, enables designers to develop powerful embedded DRFM solutions with 3x the performance of existing CMOS-based offerings. The board’s modular design supports both standard Virtex7-compatible FMC (VITA 57) mezzanine cards as well as providing for higher throughput modules such as the TADF-4300. The board’s data plane connects directly to the FPGA with support for Gen2 Serial RapidIO (SRIO) data plane fabric. Alternate fabrics can also be supported with different FPGA cores. A Gen3 PCI Express (PCIe) switch connected to the board’s expansion plane enables a single host card, such as Curtiss-Wright’s VPX6-1957 or CHAMP-AV8, to control multiple CHAMP-WB cards without utilizing data-plane bandwidth. Memory support on the CHAMP-WB includes two 64-bit, 4 Gbyte DDR3L memory banks that provide up to 8 Gbytes of on-card data capture or pattern generation capability. Curtiss-Wright Controls Defense Solutions, Ashburn, VA. (703) 779-7800. [www.cwcdefense.com].
1553B PMC and PCI Interface Boards Suit Networked Systems
Front End Hot Swap Power Supplies Deliver 92% Efficiency
Sabtech Industries has introduced its Falcon family of PMC and PCI interface boards. The new interface family consists of the Falcon PMC and the Falcon PCI models that connect computers with PMC and PCI bus slots to military computers and peripherals over a serial bus as defined in MIL-STD-1553B. The PCI version also features an optional MIL-STD1397C Type A, B, C or H interface. Sabtech’s Falcon PMC 1553 provides single or dual MIL-STD-1553B channels on a single PCI Mezzanine Card (PMC). On dual-channel models, both channels can operate concurrently with full performance and programmability. Additional features include software controlled bus coupling, dual-redundant bus connections and interrupt, PIO/DMA operation. The Falcon PCI model features independent MIL-STD-1553B and NTDS Parallel Type A/B/C/H interfaces on a single board. The Falcon saves valuable slot space without sacrificing performance by allowing a single PCI card to communicate simultaneously over both Link-11 (MIL-STD-1397C) and Link16 (MIL-STD-1553B). It is supported by an extensive application programming interface (API) library and a device driver that integrates support for both the 1553 and NTDS channels.
TDK has announced the expansion of its TDK-Lambda HFE1600 range of 1.6 kW high-density, front end power supplies with the addition of a 32V model. Particularly well-suited for use in broadcast applications, the HFE1600-32 operates from a universal 85 to 265 VAC input, and the high efficiency of up to 92% minimizes heat dissipation and power consumption thus meeting Climate Savers Computing efficiency standards. In addition to the 32V model, these supplies are available with other standard output voltages including 12V, 24V and 48 VDC. The outputs are user adjustable to suit custom requirements. Each HFE1600 supply has two variable-speed cooling fans and can operate in temperatures ranging from -10° to +70°C. As with all models in the HFE1600 series, the HFE160032 AC-DC power supply can be used individually, or up to 5 units can be mounted into a dedicated 1U rack delivering up to 8 kW. To form a hot swap N+1 redundant power system, up to 10 units mounted in two racks can be configured in parallel with single wire current sharing. The HFE1600 power supplies are available now and priced from $399 each in quantities of 500 units.
Sabtech Industries, Yorba Linda, CA. (714) 692-3800. [www.sabtech.com].
TDK-Lambda Americas, San Diego, CA. (619) 575-4400. [www.lambdapower.com].
CompactPCI Serial SBC Sports Third Gen 3.3 GHz Core i7 MEN Micro offers its latest 3U CompactPCI Serial SBC, the G22. With speeds up to 3.3 GHz using Turbo Boost functionality, the new Intel Quad Core i7-based board provides exceptional processing performance in data-intensive environments. The G22 also provides high graphics performance as well as state-of-the-art I/O functionality. The board enables fast serial data transfers up to 12 Gbit/s and full mesh capabilities without additional configuration overhead. All of the eight Gigabit Ethernet interfaces specified in the CompactPCI Serial standard can be led to the backplane. The G22 comes with 4 or 8 Gbytes of soldered DDR3 DRAM, complete with ECC. All components are soldered to withstand heavy shock and vibration, and conformal coating protects the 3U SBC from dust and humidity. Watchdogs monitor the processor and board temperature. Pricing for the G22 is $3,008.
MEN Micro, Ambler, PA. (215) 542-9575. [www.menmicro.com]. 48
COTS Journal | March 2013