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Tech Recon Cooling Technologies
Liquid Flow-Through Coldplate Passes Muster Keeping electronics cool is a big challenge in the military/aerospace environment of high temperatures and volume/weight constraints. Liquid flow-through cooling promises to do the job for at least the next decade.
Michael Benjamin, Technology Team Leader, Advanced Cooling Systems Parker Hannifin Ivan Straznicky, Senior Staff Mechanical Engineer Curtiss-Wright Controls Embedded Computing
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However, substantially more effort is required to thermally design today’s products than even two to three years ago, and that effort is expected to continue rising. In addition, newer and higher-power products will challenge the ability of conduction and airbased convection to keep device temperatures below maximum limits. This is especially the case with commonly specified boundary
s thermal trends in electronics point to increasing heat densities and heat loads, the importance of cooling d grows. The difficulty of keeping devices such as processors below maximum operating temperatures is greatly exacerbated in military/aerospace applications, where high temperatures and volume and weight constraints work against cooling. nies providing solutions now With air-cooling and conduction-cooling on into products, technologies and companies. Whether your goal is to research the latest methods practical limits, liquid tion Engineer, or jump tonearing a company's technical page, the goal flowof Get Connected is to put you (LFT) is being closely examyou requirethrough for whatever type ofcooling technology, and products you as areasearching ined naturalfor. successor, particularly in apwww.cotsjournalonline.com/getconnected plications where liquid is already available.
conditions, such as the 85°C card edge temperature and the 70°C inlet air temperature. For these and future generations of products, LFT cooling is being examined as a potential successor to conduction and air cooling.
LFT Cooling Single-phase LFT cooling is a relatively straightforward cooling approach
Meeting the Cooling Challenge To date, air cooling and conduction cooling at the card level have served military/ aerospace applications well. Thanks to innovations that continue to push out cooling limits, such as embedded heat pipes and processor shunts, these approaches will continue to meet cooling needs for many products.
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Figure 1
Example LFT system. Circuit cards with LFT coldplates are housed in a chassis supplying liquid coolant via a manifold fed by a pump module. Courtesy Parker Hannifin.
August 2006 COTS Journal [ 41 ] Get Connected with companies mentioned in this article. www.cotsjournalonline.com/getconnected