3D Time-of-flight
Image Sensors Market
3D Time-of-flight Image Sensors Market Scope:
Industry Analysis, Market Size, Growth, Trends Till 2031
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3D Time-of-flight
3D Time-of-flight Image Sensors Market Scope:
Industry Analysis, Market Size, Growth, Trends Till 2031
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The global 3D Time-of-flight Image Sensors market is projected to grow at a CAGR of 20% during the forecast period. The market size is expected to reach $2.5 billion by 2025 due to increasing demand for depth sensing technology in applications such as automotive, consumer electronics, and industrial automation.
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Companies Covered (Covid 19 Impact Covered)
◍ Texas Instruments
◍ STMicroelectronics
◍ PMD Technologies
◍ Infineon
◍ PrimeSense (Apple)
◍ MESA (Heptagon)
◍ Melexis
◍ ifm Electronic
◍ Canesta (Microsoft)
◍ Espros Photonics
◍ TriDiCam
The competitive landscape of the 3D Time-of-flight Image Sensors Market includes companies like Texas Instruments, STMicroelectronics, PMD Technologies, Infineon, PrimeSense (Apple), MESA (Heptagon), Melexis, ifm Electronic, Canesta (Microsoft), Espros Photonics, and TriDiCam. These companies use 3D Time-of-flight Image Sensors in various applications such as automotive, consumer electronics, industrial automation, and robotics to drive growth in the market.
- Texas Instruments: $14.46 billion
- STMicroelectronics: $9.85 billion
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By Application
◍ Consumer Electronics
◍ Robotics and Drone
◍ Machine Vision and Industrial Automation
◍ Entertainment
◍ Automobile
◍ Others
By Product
◍ Half-QVGA ToF Image Sensor
◍ QVGA ToF Image Sensor
◍ Others
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$ X Billion USD