Solution Overview
SMART Memory for Blades
Problem Statement
Application Examples
• Networking, telecom, computing, and storage environments.
• Edge computing, IIoT (Industrial Internet of Things), and highly dense data processing systems.
• Mission-critical applications requiring high reliability, such as telecom infrastructure.
Blade servers are increasingly adopted for dense computing, networking, and storage environments where space and power constraints are critical. Traditional memory modules often limit system density and airflow by occupying excessive vertical space, thereby restricting optimal performance and cooling within blade enclosures. Embedded and industrial blade platforms (such as ATCA and storage blades) require highly reliable, high-density memory modules that support extreme operating conditions, including wide temperature ranges and protection against environmental stressors.
Solution Overview
• SMART offers Very Low Profile (VLP) and Ultra Low Profile (ULP) memory modules engineered for blade servers, enabling vertical DIMM placement to maximize space efficiency, system density, and cooling performance across DDR4 and DDR5 ECC UDIMM and RDIMM form factors.
• Additional features include support for industrial-temperature operation, anti-sulfur resistors, conformal coating, and underfill options for enhanced reliability in harsh environments, along with Zefr® high-reliability support for mission-critical applications.
Product Summary Overview
Headquarters/North America:
T: (+1) 800-956-7627 • T: (+1) 510-623-1231 F: (+1) 510-623-1434 • E: info@smartm.com
*Product images are for promotional purposes only. Labels may not be representative of the actual product. For more information, please visit: www.smartm.com
Latin America: T: (+55) 11 4417-7200 • E: sales.br@smartm.com
Asia/Pacific: T: (+65) 6678-7670 • E: sales.asia@smartm.com
EMEA: T: (+44) 0 7826-064-745 • E: sales.euro@smartm.com
Customer Service:
• E: customers@smartm.com