f. The voids are back-filled with high index material using standard techniques known in the art; for example, chemical vapor deposition can be used here. g. Resist is chemically dissolved to leave 3-D structure in the high index material. The process described above can be modified and/ or extended in a number of ways without departing from the spirit of the invention. For example, after step c, step b can be repeated so as to achieve a multilayered structure of defects; UV exposure can be applied after step b and then again after step c. Any number of techniques can be used for step f. The dissolution of resist in step g can be accomplished using a wet process by using a specific solvent, e.g., acetone, or by oxygen plasma (dry etch, ashing), or it may be burnt off in high temperature, or the removal process might be skipped altogether if the contrast between the material used in step f and the resist is sufficient for a specific application. Fast System for Color Prediction in Halftones Inventors:
Patent Number: Issue Date:
Arce, Gonzalo R.; Nino, Cesar L. 7,173,733
Docket Number: UD03-08
February 6, 2007
The invention is a system that characterizes an inkjet color printer, reducing drastically both the number of measurements and the computational complexity. This system is based on a new mathematical model developed entirely by the inventors. The need for color accuracy and the ability to predict accurately the output of a given printer are the core technology of colorproofing, a business where the main customer is basically every graphic magazine (such as American Photo, Newsweek, Time, etc.) as well as companies that produce graphic designs for advertising purposes, or companies that produce color product catalogs. The goal in colorproofing is to reproduce as closely as possible the behavior, in terms of color, of the magazine press in order to minimize the risk of a mismatch in color between the original graphic design (in the computer monitor, for example) and the final impression.
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INVENTIONS - Technologies Available for Licensing
Method for Creating High-Aspect Ratio, Flip-Chip Conductive-Polymer Bumps Using Photolithography and Polishing Inventors:
Serial Number: Filing Date:
Prather, Dennis; Lohokare, Saurabh 10/710,870
Docket Number: UD03-16
August 9, 2004
Commercially used polymer flip-chip wafer-bumping processes use stencil-printing techniques that offer a crude alignment resolution (~10 microns). The invented process uses a low-viscosity, spin-on conductive polymer bump material that offers improved bumping resolution (~2 – 3 microns) using photolithography and also eliminates the requirement for a sophisticated head system (for scraping and dispensing the polymer material) by use of a polishing technique. Method for Generating Software Pipelined Code for Loop Nests Inventors:
Serial Number: Filing Date:
Gao, Guang R.; Rong, Hongbo 10/944,986
Docket Number: UD03-36
September 20, 2004
This invention presents a new method for generating software pipelined code for loop nests. The code is characterized by the parallel execution of several iterations from the outermost loop. The iterations are partitioned into groups. Iterations within the same group are executed in parallel. For a perfect loop nest, iteration points in the iteration space are issued at a fixed rate.