T E C H N I C A L D ATA
Alloy
Temper
EN AW-6005 T6 - Solid profile AlSiMg T6 - Hollow profile EN AW-6005A T6 - Solid profile AlSiMg(A) T6 - Hollow profile EN AW-6060 T4 AlMgSi T6
Proof stress Rp0.2 MPa, min.
Tensile strength Rm MPa, min.
Elongation A % min.
t ≤ 5: 225 5<t ≤10: 215 10<t ≤25: 200
t ≤ 5: 270 5<t ≤10: 260 10<t ≤25: 250
t ≤ 25: 8
14
170
t ≤5: 215
t ≤ 5: 255
5<t ≤15: 250
t ≤ 15: 8
14
170
t ≤ 5: 225 5<t ≤10: 215 10<t ≤25: 200
t ≤ 5: 270 5<t ≤10: 260 10<t ≤25: 250
t ≤ 25: 8
14
170
t ≤5: 215
t ≤ 5: 255
t ≤ 15: 8
14
170
t ≤ 25: 16
5
190
t ≤ 25: 8
10
190
5<t ≤15: 200
5<t ≤15: 200
t ≤ 25: 60 t ≤3: 150
3<t ≤25: 140
5<t ≤15: 250
t ≤ 25: 120 t ≤ 3: 190
3<t ≤25: 170
Hardness Thermal conductivity Webster B at 20o W/m oC
t ≤25: 65
t ≤25: 130
t ≤25: 14
5
190
t ≤10: 170 10<t ≤25: 160
t ≤10: 215 10<t ≤25: 195
t ≤25: 8
12
190
T66
t ≤10: 200 10<t ≤25: 180
t ≤10: 245 10<t ≤25: 225
t ≤25: 8
13
190
T4
190
T4 EN AW-6063 T6 AlMg0.7Si
EN AW-6063A AlMg0.7SiA T6 T4 EN AW-6082 T6 - Solid profile AlSi1MgMn T6 - Hollow profile
t ≤25: 90
t ≤25: 150
t ≤25: 12
7
t ≤10: 190 10<t ≤25: 180
t ≤10: 230 10<t ≤25: 220
t ≤25: 7 10<t ≤25: 5
13
190
t ≤ 25: 110
t ≤ 25: 205
t ≤ 25: 14
11
170
t ≤5: 250 5<t ≤25: 260
t ≤5: 290 5<t ≤25: 310
t ≤5: 8 5<t ≤25: 10
15
170
t ≤5: 250 5<t ≤15: 260
t ≤5: 290 5<t ≤15: 310
t ≤15: 8 5<t ≤15: 10
15
170
t = Wall thickness Temper Designations: T4: Solution heat treated and naturally aged. T6: Solution heat treated and artificially aged. T66: Solution heat treated and artificially aged.
20