7:30 – 8:30 GROUP 9:00 – 10:00
BREAKFAST
DIGITAL
MIXED SIGNAL
POWER MANAGEMENT/ AUTOMOTIVE
PRODUCTION INTEGRATION & HW/SW INTERFACE
RF WIRELESS
ASSEMBLY TEST MIL/AERO
Letting Q Program the FLEX
How Many Bonds Can You Convert? I
Welcome to Power: High Voltage/High Current Test
Collaboration
Miscellaneous
iStudio/Di-Series
9:00 – 9:30
4/A TUTORIAL - FLEX™ Platform Calibration 101 Igor Lavrinenko, Teradyne
4/A Use Half of ADC Bits Output to Reconstruct Waveform for Dynamic Testing Adonis Chang, Teradyne
4/A How to go Beyond 30V @ 100mA with only 4/A PI Version Selector Two DC30 Channels Mike Knapp, Analolg Devices; Laurent Bonneval, Teradyne Dean Garrison, Sherry Sponheimer, Teradyne
4/A Characterization/HVM Comprehensive Test 4/A Hands-on Programming the Di-Series using Solution for 10G/3G Transceiver Utilizing the iStudio Workshop Teradyne Tiger Platform and SDM 10G Module Fayez Sedarous, Intel Corp.
9:30 – 10:00
4/B How to Capture All Fail Data from Scan Vectors Using the Memory Test Option (MTO) on the FLEX™ Johnny Steck, Texas Instruments; Dwayne Dohmann, Thuy Tran, Teradyne
4/B Improving INL DNL Repeatability Steve Matej, Jim Ptasinski, Texas Instruments; Kent Magnuson, Teradyne
4/B Pararallel Test Solution for a High Current 4/B How to Write and Use Simple DLLs to PROFET Device Using FLEX™ DC90 DEMUX Accelerate Code Execution Petar Fanic, Tzong Sheng Ng, Infineon Technologies Emanuele Vazzoler, STMicroelectronics; Alfredo Stabile, Teradyne
4/B Interpolation Cookbook: Algorithms, Performance, and Guidelines Aimen Oueslati, NXP Semiconductors; Martin Dresler, Teradyne
10:00 – 10:30 10:30 – 12:00
BREAK FLEX: Shaken not Stirred
BREAK How Many Bonds Can You Convert? II
Welcome to Power: High Voltage/High Current Test
Collaboration and Revision Control
10:30 – 11:00
5/A Fast Time Measurements in Milliseconds with HSD Channels on the FLEX/microFLEX Diego Koch, Massimo Zambusi, Teradyne
5/A Microcontroller-Based Servo Loop for ADC Linearity Testing Shu Xia, Teradyne
5/A DC90™ Voltage Compliance, Part 1: Insider Look at the DC90 Power Model Cristian Cesarini, Arthur Russell, Chi-Heng Wang, Teradyne
5/A Test Program Guidelines for Collaborative Development Jeff Cramer, Jonathan Kubala, Tom Vance, Teradyne
11:00 – 11:30
5/B A Simplified J750™ Technique to Handle EFlash Data Management Chi Wee Ang, Gang Liu, Infineon Technologies
5/B Undersampling Using Beat Frequency (Theory and Practice) Ching-Chia Tien, Teradyne
5/B TUTORIAL — DC90™ Voltage Compliance, Part 2: Are You Getting your Two Kilowatt's Worth? Cristian Cesarini, Arthur Russell, Chi-Heng Wang, Teradyne
5/B Subprogram Modularity: Improving Test Program Development Productivity and Reusability Kevin Bushe, Teradyne
11:30 – 12:00
5/C ETAccess to IG-XL™ Silicon Solution Givargis Danialy, LogicVision; Ted Kim, Iwan Oei, Guillermo Pidal, Teradyne
5/C Testing a Correlated Double Sampling ADC on the FLEX™ Lai-Choon Chan, Teradyne
12:00 – 1:00 1:00 – 2:30 1:00 – 1:30
8
BREAKFAST
LUNCH Memory Test Never Dies
5/C Smarter ASCII Export for Dumber CM Tools: Using Interpose Functions with ASCII_Utils.xla Glenn Carson, Freescale Semiconductor
Tutorials
iStudio/Di-Series
5/A TUTORIAL — Forward Error Correction in Wireless Communication Standards Steven Fields, Teradyne
5/A Hands-on Programming the Di-Series using iStudio Workshop (Continued)
5/B TUTORIAL — GSM/EDGE EVM Test Ching-Chia Tien, Teradyne
5/B Replacing M9-Series Digital Test Instruments (M9-Series DTI) with Di-Series Digital Test Instruments (Di-Series DTI) Lloyd Frick, Teradyne
LUNCH How Many Bonds Can You Convert? III
6/A Enabling Modularity and Portability to Test 6/A Clock Jitter Effect for Testing Data Multi-Configuration Memories within a Single Converters Chip TayBian Yeoh, Texas Instruments Jin-Soo Ko, Teradyne
Welcome to Power: High Voltage/High Current Test 6/A When to Use Which V/I Crossover Type on the FLEX DC90™XP Mereen Mammen, Teradyne
Tester Integration B 6/A Mixed-Signal Simulation for Test Program Development Philippe Raynaud, Mentor Graphics; Philippe Planelle, STMicroelectronics
1:30 – 2:00
6/B Trade Between Speed and Flexibility: Develop a Pattern Conversion Tool Adun Ye, Teradyne
6/B Conversion of ADC Ramp Tests from the J750™ to the UltraFLEX™ Russell Long, Freescale Semiconductor; Tim Scanlon, Teradyne
6/B Paralleling DC90XP VIs to Achieve Currents 6/B Integrating the GSI Group WaferTrim™ Beyond Merged Mode M310 with the microFLEX™ Eric Bergeron, Maurilio Fabiano, Teradyne John Grandbois, Analog Devices; Peter Turner, Teradyne
2:00 – 2:30
6/C High-Speed Memory Test and Redundancy Analysis (RA) on the UltraFLEX™ Hiroshi Kaga, NEC Electronics; Hideaki Nakajima, Teradyne
6/C Testing High-Speed Mixed-Signal Devices on the UltraFLEX™ Daniel Weinberg, Analog Devices
6/C Introduction to the DC90XP™ — A High Power Instrument Optimized for the Automotive Market Cristian Cesarini, Larry Klein, Teradyne
2:30 – 3:00
BREAK
3:00 – 7:00
BUSINESS MEETING, ENGINEERING UPDATE, POSTER/ROUNDTABLE SESSIONS, VENDOR FAIR
3:00 – 3:15
7/A SEMICONDUCTOR BUSINESS MEETING
3:15 – 4:00
7/B SEMICONDUCTOR ENGINEERING UPDATE
4:00 – 4:45
7/C SEMICONDUCTOR OPEN FORUM DISCUSSION
4:00 – 7:00
VENDOR FAIR
4:45 – 7:00
POSTER/ROUNDTABLE SESSIONS
6/C Enabling Customers to Develop Tailored Instruments for the FLEX™ Architecture through OpenFLEX™ Omar Biabani, Lee Holt, Robert Manlick, Teradyne
Tutorial 6/A TUTORIAL — DTV/HDTV testing on UltraFLEX™ Fang Xu, Teradyne
Instrument Replacement 6/A Applications for Ai- and Bi-Series Instruments in Legacy™ Tester Replacement Gary Bryant, Richard Lawrence, NAVAIR
6/B TBA
6/C A Reconfigurable, Extendable L200 AutoConverter Yonet Eracar, Teradyne
BREAK
7/A Engineering Update
ROUNDTABLE DISCUSSIONS
9