Product News Puma 91xx Series High performance darkfield inspector, for benchmark sensitivity at production throughputs
Increasingly complex technical and economic challenges continue to emerge at 65nm design rules and below. Shrinking geometries and new device materials require increased resolution and proven noise suppression capabilities in patterned wafer inspectors. The Puma™ 91xx series of darkfield UV patterned wafer inspectors provides high sensitivity at high production throughputs for all layers. Enhanced data rates and the innovative Streak™ technology deliver fast and efficient defect detection on array and logic structures. Noise suppression capability is unparalleled with grazing-angle illumination, selectable polarizations and true programmable Fourier filters. A range of pixel combinations balances the sensitivity and flexibility requirements of a broad application space – from tool monitoring to advanced etch. Built on the established and widely adopted Puma 9000 platform, the Puma 91xx series offers a 1.7x throughput increase, enabling higher sampling or improved sensitivity to control critical yield excursions. The new FAST algorithm and Brightfield Recipe Import make recipe setup quick and simple, improving productivity. Platform commonality with KLA-Tencor’s 23xx/28xx broadband brightfield and eS3x e-beam inspectors enables rapid production integration. With enhanced sensitivity and speed, plus reliable production performance, the Puma 91xx series meets the cost and performance requirements of advanced defect monitoring. Questions about how the Puma 91xx series can address a specific use case or challenge? Please contact Matthew McLaren at matthew.mclaren@kla-tencor.com
Puma 91xx Series Benefits Highest available darkfield sensitivity at production throughputs Flexibility to meet sensitivity and throughput requirements for the broadest range of applications – from tool monitoring to advanced etch Highest range of production throughputs in a single tool Improved Fourier filtering for better sensitivity at array/ periphery interfaces
Automatic defect classification with iDO™ improves binning performance and reduces time to results
Increased Sampling
Throughput
Quick and simple recipe setup with the new FAST algorithm and platform commonality
~1.7x increase in throughput
Puma 91xx Puma 9000
Extendible architecture protects capital investment
Higher Sensitivity
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Sensitivity
The Puma 91xx provides increased sampling, higher sensitivity or lower CoO. A range of inspection pixels provides the flexibility required to cost-effectively inspect the broadest range of applications.
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Puma is utilized as a cost-effective void monitor by providing high throughput, low nuisance capture of STI voids on 90nm DRAM devices.*
* Reference: U. Streller et al, Monitoring Yield-Critical Defects in DRAM Structures, Semiconductor International, July 2006.
Spring Winter 2007 Yield Management Solutions