EPSRC Centre for Innovative Manufacturing in Large-Area Electronics - Annual Report (2017)

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for a number of important industrial applications with partners such as CDT and Beko (see case studies). In the current phase of iPESS we are developing an integrated sensor system that combines the OFET sensors with a printed analogue front end for signal amplification and a suitable energy source that provides reliable power during operation. We are engaging with flexible electronics industrial partners to source flexible circuit components and are developing an integration process for a complete sensor system.

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Photographs of sensor, integrated system and packaged device for detection of polar analytes Figure a) Electrical characteristics and b) voltage gain of University of Cambridge complementary hybrid signal amplifiers. c) Delamination of amplifier foils from carrier substrate. d) Amplifier foil bonded for testing

Industry interaction In recent years more and more capable plastic electronic device components (FETs, solar cells, LEDs, sensors, etc.) have been developed that are meeting the performance requirements for a broad range of applications. However, one of the remaining grand challenges in the field is to integrate these different components into working systems that address the requirements of real-world applications. This requires careful consideration of specific process compatibility issues such as common processing temperature or solvent orthogonality as well as mechanical and electrical interface issues. In the iPESS project we are developing such a system integration approach in the context of smart sensor applications. We work in close collaboration with our industrial partners to ensure that industrial manufacturing requirements are fully addressed. We are also interested in engaging with new industrial partners from across the plastic electronics value chain, for example, to integrate higher performance components, to explore novel manufacturing technologies and integration processes or to demonstrate new applications for such integrated sensor systems.

Contact: Professor Henning Sirringhaus: hs220@cam.ac.uk Professor Mike Turner: michael.turner@manchester.ac.uk Professor Krishna Persaud: krishna.persaud@manchester.ac.uk

TECHNICAL PROGRAMME

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