High Density Interconnect PCB Market 2018 Industry Survey, Growth, Competitive Landscape and Forecasts to 2023
PREPARED BY Market Research Future (Part of Wantstats Research & Media Pvt. Ltd.)
High Density Interconnect PCB Market 2018 High Density Interconnect PCB Market 2018: Industry Survey, Growth, Competitive Landscape and Forecasts to 2023 Globally, the High-Density Interconnect (HDI) Printed Circuit Board (PCB) market is expected to have significant growth over the forecast period. The increasing need for smaller, energy-efficient, and highperformance PCBs in diverse electronic products acts as the major driving factor for the growth of HDI PCB market globally. However, the high cost associated with manufacturing and lack of expertise in manufacturing are hampering the market growth. In this study, the HDI PCB market is segmented based on number of high-density interconnection layer, industry vertical, and regions/country. By number of high-density interconnection layer, the market is segmented into 1, 2 or more, and all. On the basis of industry vertical, the market is segmented into consumer electronics, military and defense, telecom and IT, automotive, manufacturing, medical devices, and others. Finally, the regions covered in this study are North America- US, Canada, and Mexico; Europe- Germany, France, the UK, and the rest of Europe; Asia-Pacific- China, India, Japan, and the rest of Asia-Pacific; and the rest of the world, which includes Middle East and Africa and Latin America.
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High Density Interconnect PCB Market 2018
“Taste the market data and market information presented through more than 50 market data tables and figures spread in 100 numbers of pages of the project report. Avail the in-depth table of content TOC & market synopsis on “High Density Interconnect PCB Market Research Report - Global Forecast 2023 ”
Globally, the High-Density Interconnect (HDI) Printed Circuit Board (PCB) Market is expected to grow from USD 8,683.9 million in 2018 to USD 15,600.6 million by 2023, at a CAGR of 12.4% during the forecast period, 2018–2013.
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High Density Interconnect PCB Market 2018 Segmentation: The global HDI PCB Market is segmented into number of high-density interconnection layer, industry vertical, and regions/country. By number of high density interconnection layer, the market is segmented into 1, 2, and all. By industry vertical, the market is segmented into consumer electronics, military and defense, telecom and IT, automotive, manufacturing, medical devices, and others. By region, the market is segmented into North America, Europe, Asia-Pacific, and rest of the world.
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High Density Interconnect PCB Market 2018 Application & Major Players in this Research: High Density Interconnect PCB Market Prominent Players :
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Epec, LLC (US),
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TTM Technologies (US),
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PCBCART (China),
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Millennium Circuits Limited (US),
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RAYMING (China),
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Mistral Solutions Pvt. Ltd. (India),
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SIERRA CIRCUITS, INC. (US),
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High Density Interconnect PCB Market 2018 High Density Interconnect PCB Market Competitive Analysis Commenting on the report, an analyst from Market Research Future (MRFR)’s team said: The global market for global HDI PCB is estimated to grow at a significant rate during the forecast period from 2018 to 2023. The geographical analysis of the market is studied for North America, Europe, Asia-Pacific, and the rest of the world. North America is presumed to have significant growth in the HDI PCB market. The US and Canada are the leading countries in the region. The growth is attributed to increase in demand for wearable devices in the healthcare sectors and high demand in the automotive sector. Asia Pacific is also anticipated to be the fastest growing region in the HDI PCB market over the forecast period. India, Japan, South Korea, and China are the leading countries in the HCI PCB market. This is due to the presence of a large number of electronics and semiconductor manufacturers in the region and wide usage of consumer electronics products in the region.
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