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tvnetwork
Spotlight on Indian
electronics A N N U A L V I S U L U T I O N A R Y
A
2016
ELE Times to Launch
s you are aware that New Delhi Print Media is launching “Spotlight on Indian Electronics”, that gives a holistic picture of Indian Electronics in India. The book would carry the comprehensive information on policies, products, and the brands in India. It would be a primary source of information on Indian Electronics to Indians and the rest of the world. The book is an attempt to extend the help to all of them who would want to know anything about electronics industry. The year book 2016 would be launched at Elecrama 2016 in Bangalore. The Guide Book will get distributed throughout the year to Industry Professionals, Government Sectors, Trade Fairs, Embassies, Associations and consultants in India and overseas.
World's First TV Channel on Electronics Launched
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Spotlight on Indian
electronics
2016
contents
16 Cover Story
ROLE OF MEDIA IN CHANGING VALUE SYSTEM IN ELECTRONICS INDUSTRY IN INDIA
Issue Focus 10 22 26
Bulletin
Technology
Winning with the Industrial Internet of Things
T&M Times
Keysight Introduces Infiniium V-Series Oscilloscopes for Greater Insights in Validation, Debug
R&S RTE Digital Storage Oscilloscope Easy, powerful and simply more scope
36
Semi Power
Reinforced insulated DC/DC Converters Prolong The Service Life of IGBT Circuits Small and reliable ROHM Expands Its Full SiC Power Module Lineup
40
Vol : 5, Issue 01, January, 2016 Editor Devendra Kumar Publisher Shailesh Shukla Sub Editors Aakansha Mehrotra Shloka Chauhan Chief Correspondent Dr. Ajay Shukla Corporate Communication Shilpa Shukla Sales & Marketing Nempal Singh Rana Design & Print Production Jitendra Sagar Atul Kumar Tiwari Director Technical-Advisory Board K. R. Sripathy Human Resource Development Dr. Anjana Singh Legal Advisor Dharmendra Rajput Sr. Advocate High Court, Delhi Service Support Rajkumar Delhi Head Office : A-159, 3rd Floor Vikas Marg Delhi - 110092 (India) Tel : +91-11-42754100, 42750100, 64641886 E-mail : info@newdelhimedia.co.in Bangalore : E-mail : bangalore@newdelhimedia.co.in Mumbai : E-mail: mumbai@newdelhimedia.co.in Chennai : E-mail : chennai@newdelhimedia.co.in Pune : E-mail : pune@newdelhimedia.co.in Kolkata : E-mail : eletimes.cal@newdelhimedia.co.in
In Conversation
We primarily set ourselves apart through innovation and find substantially more room for developing our strengths in growing markets -Vivek Mahajan
Complexities at product designing need masterly Multiphysics Simulation from COMSOL
43
Design
Four Quick Steps to Production, Using Model-Based Design for Software-Defined Radio Developing Effective Design Strategies for Today’s Wearable Devices: POWER MANAGEMENT
50 54
A&D
Meeting the Cyber Challenges of Tomorrow
Future Technology
Flexible Electronics Paving the way for technologies of the future
54
Contributing Authors Srinivasa Rao Appalla | Rohde & Schwarz Bianca Aichinger | RECOM Power GmbH Akshat Garg | Texas Instruments Pavan Shetty | Texas Instruments
Pre Show Report
Elecrama 2016 adds interesting features to boost energy sector High-growth prospects of Indian manufacturing sector opens up valuable opportunities for automation and technology players
Printed and Published by Mr. Shailesh Shukla for and on behalf of New Delhi Print Media Pvt. Ltd. from A-159, 3rd Floor, Vikas Marg, Delhi-110092, Phone No.: 01142754100, 42750100 and printed at MP Printers, B-220, Phase-II, Noida, Gautambuddh Nagar (UP) Pin - 201305 The opinions expressed by authors to ELE Times are not necessarily those of the editor or publisher. ELE Times may not be reproduced in whole or in part without prior permission of the publisher. Copyright Š 2016 ........... All rights reserved. Reproduction in any manner is prohibited
NOTION
T
Pushing the Limits‌ Further
aking on new ways of doing things is to go with the flow and to follow the Time. New Thoughts are the principle of origin, creation and universal movement. We think that certain ways of doing things are best because they are according to Time. New thoughts that come from within the time become a timeless creation. To change the ways with time is the way of ELE Times – that creates the universal appeal cutting across the industry line and becomes the slogan instantly. The Spotlight on Indian Electronics is one such initiative from New Delhi Print Media. In this era of extraordinary change and globalization, we acknowledge that knowledge and innovations are now driving the new economies. Since the period of Aryabhata and Varahamihira India has had a scientific temper throughout these years. Such temper is a prerequisite of systemic study of the subject. The same scientific temper is tapering down to the present day in the society. We rely on an unlimited global resource, the hands on information, policies, strategic locations branding and human creativity. Growth strategies in the creative economy therefore focus on harnessing the development potential of an unlimited resource and not on optimizing limited resources (as in traditional manufacturing industries). For harnessing resources and growth one needs to have a systematic information of all the components required for uninterrupted source of information. For such a scientific society there has to be a systemic study of Electronics Industry which was hither to somewhat absent. The Spotlight on Indian Electronics is an attempt to pore-forth the stream of information that will help, guide and in a way be the torchbearer to business optimization for countless professionals and entrepreneurs. The book has a nature of an encyclopedia, carries comprehensive information on Electronic policies, products, and the brands in India. It would be a primary source of information on Indian Electronics to Indians and the rest of the world. The book is an attempt to extend the help to all of them who would want to know anything about electronics industry. The Spotlight on Indian Electronics would be launched at ELECRAMA 2016 in February in Bangalore. Industry Professionals, Government Sectors, Trade Fairs, Embassies, Associations and consultants in India and
overseas have the excess to Spotlight distribution throughout the year. We invoke the illuminated community from electronics and allied industries to take the optimum benefit of the information as policies, products and brands. Innovations in technology and digitization are increasingly impacting how we connect with the issues. The industry developments are impacting how we connect and interact with each other, where newer generations are leading the evolution. Broader innovative consequences of this evolution are just beginning to unfold in what is perhaps one of the most rapid media metamorphoses the world has experienced of late. EletimesTV has been designed to provide strategic insights to the industry that investigates the developments evolved through the current period. eletimesTV has afforded the world to connect 24/7, hence created a digital generation so fortunate to have a wealth of powerful, affordable promotional and marketing tools at everyone’s disposal. The unprecedented levels of access that eletimesTV provide allows us to connect directly with potential customers and buyers on an individual basis, at a much lower cost than would have been possible up-till now. The TV plays an essential role in how consumers discover, research, and share information about brands and products. With worldwide reach of eletimesTV, businesses cannot avoid using this platform as a catalyst to disseminate their information. Consequently the TV transforms the way we think on advertising, the retail marketing, global business, industry interactions, as an important trend to understand and adopt accordingly. We congratulate everyone of us on the onset of new year for more innovations and a rightful sharing of news and information so fast as through eletimesTV and so steady as through Spotlight. Enjoy Reading ELE Times. Devendra Kumar Editor devendra@newdelhimedia.co.in
ELE Times | 08 | January, 2016
@devendra1963
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Bulletin
The Electronics manufacturing
sector in India set to receive subsidies
The Centre has decided to give subsidies to companies involved in the electronics manufacturing sector. Guidelines are being finalised for subsidising of the production of electronic items in India, like microprocessors, semiconductors and others. Ajay Kumar, additional secretary in
Department of Electronics and Information Technology (DeitY), said at an event organised by Assocham, "We have introduced an element of production subsidy, now we are in process of finalising guidelines and since there are different kinds of projects, we are looking for specific technical inputs," He also said that the government needed support in making the guidelines- “We need support, to be able to pin-point what needs to be subsidised and how, some work is going on, the consultants are
Consumer electronics to go 3D: Dassault Systemes Dassault Systemes – the world leader in 3D design software, recently released a report that said that 3D technology is going to transform how consumer electronics are manufactured and consumed. The multinational which has presence in 140 countries announced that it will showcase its virtual universe technology at the International Consumer Electronics Show (CES) in Las Vegas, Nevada, from January 6 to 9(2016), to provide a “glimpse of how innovations will look and behave in the future.” The company will demonstrate its 3D Experience universes technology at CES to allow innovators from business, science and a host of other fields to engage in an interactive journey around the theme of ‘Dream, Create, Live.’ In the “Dream” area, visitors will experience a 3D application paired with an HTC virtual reality headset, to sketch ideas and bring them to life. Next, they will explore how companies can “Create” products through demonstrations spanning all steps of product development, from ideation to design to sales and marketing. Lastly, visitors will see how people can “Live” and consume a 3D experience, from personalizing their home, to shopping with 3D technologies or navigating cities of the future, it added. “Sophisticated data sensors and connected devices are transforming how humans interact with the world around them, and CES is the perfect forum to show businesses, consumers, executives, manufacturers, makers and tinkerers how 3D Experience universes are the backbone of this new era of highly social, mobile and connected consumer electronics,” said Olivier Ribet, Dassault Systems’ vice president of high-tech industry.
working on it, but any specific inputs from industry are more than welcome," Ajay Kumar also revealed that the government is working on fabless chip design policy. "That is work under progress, it will support the companies involved in chip design." He emphasised upon the need to manufacture low-priced laptops in India to spur computer manufacturing. "Maybe a price point of Rs. 10,000 and it cannot be a device which can be seen as a low grade version of laptop."
Govt to invest Rs 10,000 crores to Boost Electronics Manufacturing The government will announce a corpus of Rs 10,000 crores, to an Electronics Development Fund this month to provide financial assistance to domestic companies, in its bid to encourage electronics manufacturing and innovation. Launching Qualcomm’s Design in India initiative, Department of Electronics and IT (DeitY) secretary J S Deepak said the fund, housed with Canbank Venture Capital Fund, will start this month with an initial corpus of Rs 2,500 crore and the rest will be raised from various sources. “This fund is a fund of funds. This will fund venture capitalists, who in turn will fund domestic companies in the field of electronics system design and manufacturing… The Cabinet has already approved it,” he said. “It will be used to encourage innovation and support entrepreneurship. We need to change present system of electronics manufacturing. It has to be rich in domestic Intellectual Property Rights,” added Deepak. At the event, Qualcomm India vice-president Sunil Lalvani announced the launch of its ‘Design in India’ initiative to support the government’s ‘Make in India’ vision. Qualcomm has tied up with IT industry body Nasscom for its ‘Design in India’ initiative, which will largely be for hardware components rather than software, for which it is largely known. Lalvani said the company creating a product under the Design in India programme will own intellectual property rights (IPR). A Qualcomm Innovation Lab has been set up at Bangalore and 10 Indian companies have been shortlisted, these will be eligible for funding of up to Rs 6.5 lakh each to enable them to translate ideas to working prototypes. Up to three winning companies will receive up to Rs 65 lakh each as recognition and encouragement for future efforts,” he added.
ELE Times | 10 | January, 2016
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Bulletin
Top technology trends to watch out for in 2016 in the server space As the volume of data generated goes up drastically, enterprises are facing new challenges when it comes to storage and processing of this data in a secure and easily retrievable manner. The everburgeoning datacenter and storage requirements have meant that companies are increasingly expecting their existing infrastructure to scale up seamlessly, preferably without demanding too many investments in terms of cost, energy and space. Below are some trends we saw in the last one year and which we expect to continue well into 2016. • Security is the number 1 concern: Enterprises have always been concerned about security; but in the last one year, security has become even more important. Customers and employees are demanding access to information anytime, anywhere and on any device; but at the same time, the threat landscape becoming deadlier than ever. • Pressure to do more with less: One of
the big challenges for CIOs is that enterprises are demanding more from IT than ever before- both from a budget and performance point of view. Businesses expect IT to deliver the same results from smaller IT budgets. • But an even bigger challenge is the saturation of the energy envelope for their datacenters, which means they don’t have the physical space or the Power required to run and cool more servers. • Hyperconvergence: Customers today are looking for the convenience of a single management console for several infrastructure layers, be it the compute layer, hypervisor, networking, fabric or storage.Hyper convergence enables businesses to grow their infrastructure as and when it is needed, in the form of building blocks. • On public cloud, hype is greater than actual adoption: Large enterprises are still taking baby steps on the cloud. Although the peripheral data has moved out to the
Siddhesh Naik Director, Enterprise Business Group Lenovo India cloud, core applications and data are still in-house. Instead, we’ve seen greater demand for Hybrid clouds, with a single window between public and private cloud for a seamless user experience. • Analytics is starting to come of age: There has been huge demand for business analytics in India, with core decision making becoming real-time. Using real time data, manufacturing cycles are being planned on a daily basis, based on current demand. • High Performance Computing: High Performance Computing (HPC) has seen a good investment in 2015. This is expected to significantly go up in 2016 / 17. Government of India has announced their outlay of 4500 cr for the National Supercomputing Mission.
AVX Partners with Mouser Electronics to Littelfuse Invests In Silicon Empower Autonomous Vehicle Innovation Carbide Technology
AVX Corporation, a leading manufacturer of passive components and interconnect solutions, has teamed up with Mouser Electronics, celebrity engineer Grant Imahara, and several other visionaries within the global electronics industry to launch a Driver-less Cars Series for Mouser’s award-winning Empowering Innovation Together™ program, which is designed to inspire creative thinking in both professional and aspiring engineers. Dedicated to addressing various aspects of autonomous vehicle technology spanning history, ethics, discoveries, innovations, and public opinion, the Driver-less Cars Innovation Hub features articles, blogs, videos, challenges, product information, and other in-depth technical content contributed by various industry experts to provide visitors with insider insights about where technology is heading and how autonomous driving will revolutionize how we live and get around. “Moving to full-scale autonomous driving will have substantial economic, environmental, and social impacts that will drastically change the way people live and conduct their everyday lives,” said Mouser Electronics President and CEO, Glenn Smith. “This new series is a great opportunity for the engineering community to experience first-hand the technology created and still needed for driver-less cars to become a reality.”
As part of the company’s strategy to move more significantly into power semiconductors for industrial and automotive markets, Littelfuse has made an investment in Monolith Semiconductor, Inc., a start-up company developing silicon carbide technology. Silicon carbide is a rapidly emerging semiconductor material that enables power devices to operate at higher switching frequencies and temperatures versus conventional silicon. This allows inverters and other energy conversion systems to be built with significantly improved power density, energy efficiency and cost. “Investing in and partnering with Monolith’s experienced team of silicon carbide and power semiconductor experts allows us to quickly evolve our portfolio with strategically relevant and innovative technology,” said Ian Highley, Littelfuse Senior VP and GM, Semiconductor Products, and CTO. “Forming this strategic partnership with Littelfuse accelerates development and helps bring silicon carbide technology to the market,” said Sujit Banerjee, PhD, CEO of Monolith Semiconductor. “Littelfuse is an ideal partner for us. We are excited to dramatically increase our customer reach, gain access to global channels, and benefit from their sales and marketing depth and expertise.” Initially this is not a material investment for Littelfuse; however, the company has committed to add to its investment once Monolith has achieved certain milestones. This investment is not expected to have any material financial impact on Littelfuse in 2015 or 2016.
ELE Times | 12 | January, 2016
Bulletin
About 50 Percent Consumers Will Prefer Using Smartphones or Wearable Devices According to Gartner, Inc., with half of consumers in mature MARKETS are expected to be using smartphones or wearable for mobile payments by 2018. “Innovation in apps, mobile devices and mobile services are impacting traditional business models, particularly in the way people use personal technology for productivity and pleasure,” said Amanda Sabia, principal research analyst at Gartner. When it comes to mobile payments, there are three types of mobile payments or mobile wallets available now: smartphone or wearable-based payments, branded mobile wallets from banks or credit card providers, and branded mobile wallets from retailers such as Starbucks. However, mobile payments using Near FieldCOMMUNICATION (NFC) technology (Apple Pay, Samsung Pay and Android Pay) will be limited in the short to midterm due
to a lack of partnerships between retailers and financial organizations, “Instead, cloud-based solutions will have a better chance to succeed as they can reach a wider audience and can support many use cases beyond face-to-face or in-store options.”, said Annette Jump, research director at Gartner. Gartner made two further predictions for the personal technologies market: By 2018, 75 percent of TV-style content will be watched through applicationbased services in matureMARKETS “The increasing prevalence of applicationbased TV-style viewing will be disruptive to the traditional pay-TV market. services such as Netflix and Hulu Plus are putting pressure on the revenue of pay-TV operators. By 2019, less than 20 percent of users in mature markets will subscribe to mobile data-only connections
Communications service providers (CSPs) have been promoting mobile data-only connections as a complement to fixed broadband accessed through Wi-Fi, when consumers need the flexibility to use their data-centric devices on the go.
NTT Com Receives NLD License to Revenue Drop in Fabless Launch Network Services in India IC Industry Marks Continuous NTT Communications Corporation, the ICT solutions and international communications business within the NTT Group, announced recently that it has been licensed to launch domestic network services in India through NTT Communications India Network Services, a newly established Indian subsidiary. The launch will include IP-VPNand and other reliable, high-quality connectivity services, that are required by businesses in India today. Customers will be able to use multiple local carriers for carrier-redundant access, one of the many ways NTT Com aims to provide secure, costefficient networks backed by strong service-level agreements for the mission-critical systems of its enterprise customers. NTT Com will combine its new network services with managed-hosting and cloud services currently offered by Netmagic, another NTT Com subsidiary, which owns nine data centers in India. As a result, NTT Com will offer a comprehensive range of ICT services, including system integration, to support the businesses of Indian enterprises and multinational corporations. With the addition of this capability, NTT Com&Netmagic will be able to address more mature requirements of enterprises, especially with the wide spread adoption of SMAC based technologies and growth of internet centric enterprises in India. Netmagic already enjoys the trust of over 1500 enterprises, spread across industries and with this additional capability set, Netmagic will be able to add more value on ICT front.
Struggle in 2016 : TradeForce
2015 was a challenging year for the fabless IC industry, due to slowdown in the end market, and as TrendForce projects it will continue to struggle in 2016, with revenues dropping 4.1 percent. According to global market research firm TrendForce, revenue generated by fabless IC industry worldwide for the entire 2015 is estimated around US$80.52 billion, down 8.5 percent year on year which will continue in 2016, with limited end market demand. While the Internet of Things will eventually lead to a reversal of fortunes, TrendForce analysts say the trend is still nascent in development, and will have limited contribution to the industry’s revenue for 2016. Price decline in the processor chip market will continue as Chinese IC design houses like Spreadtrum escalate the competition by chipping away at prices at the low end. Smartphone vendors like Samsung, Huawei and LG, who hope to differentiate their devices from their competitors’ will develop their own processor chips. While these will not pose a threat to dedicated chipset makers in the short term because of the initial cost and technology hurdles, this trend does erode the market for ICs.
ELE Times | 14 | January, 2016
Mouser Electronics, Inc. is now stocking the bq25120 battery management IC from Texas Instruments (TI). The bq25120 is the industry’s smallest and lowest-power battery management solution in the wearables market, requiring a no-load quiescent current of just 700 nA at 1.8V when the buck converter is enabled. The solution supports batteries from 3.6V to 4.65V, and fast charge currents from 5mA to 300mA, allowing wearables and industrial Internet of Things (IoT) applications to always be on without draining the battery. TI’s bq25120 battery management IC, now available from Mouser Electronics, features a linear charger, configurable low-dropout (LDO) regulator, load switch, buck converter, pushbutton control, and battery voltage monitor in a diminutive 2.5mm2 WCSP package. The bq25120 integrates a highefficiency, low-quiescent-current buck converter with TI’s DCS-control architecture that extends light-load efficiency down to
10-µA load currents. Low quiescent current during operation and shutdown enables maximum battery life, and the device’s accurate charge termination down to 500 µA maximizes the energy delivered to the battery before completing the charging cycle, allowing batteries to draw a more robust full charge. The bq25120's I2C programming interface allows designers to set key parameters including battery charger voltage, current, termination threshold, input current limit, load switch control, flexible timer, and reset options. The device is supported by the bq25120EVM-731 evaluation module, a high-performance, easy-to-use development kit that helps engineers design flexible power management solutions based on the onboard bq25120 IC. The bq25120 IC and evaluation module are ideal for smartwatches and other wearable devices, health monitoring accessories, and rechargeable toys.
ELE Times | 15 | January, 2016
leader in transport ticketing solutions
Gemalto , the world leader in digital security, has been recognized by three market research analysts as the world’s number one supplier of contactless and mobile solutions for public transportation. ABI Research, Juniper Research and IHS have all published independent reports that rank Gemalto as the global leader in this fast-growing sector. They scored the company highly for its market position, commitment to innovation, international presence and evident success in implementing a series of pioneering NFC applications for major public transportation networks. Gemalto has been working with the Government of India in consolidating and digitising vehicle registration data in many Indian cities and handling interstate traffic, since 2003.
For more information visit www.gemalto.com
Bulletin
TI's bq25120 Battery Management Solution Gemalto awarded three times as the global Smallest on Market, Now at Mouser
Spotlight on Indian
electronics An encyclopedia on India Electronics from the House of ELE Times
Proud Promoter Of
Grand Launch at
ELE Times | 16 | January, 2016
2016
ELE Times Presents
I
n this era of extraordinary change and globalization, many acknowledge that knowledge and innovations are now driving the new economies. Organizations and even economic regions that embrace knowledge information and knowhow generate significantly higher revenue and provide greater stability into the future. It is true that we rally on an unlimited global resource, the hands on information, policies, strategic locations branding and human creativity. Growth strategies in the creative economy therefore focus on harnessing the development potential of an unlimited resource and not on optimizing limited resources (as in traditional manufacturing industries). For harnessing resources and growth one needs to have a systematic information of all
the components required for uninterrupted source of information. Keeping in mind the needs for a comprehensive knowledge and statistics at one place for electronics industry players in India and international, New Delhi Print Media is launching “Spotlight on Indian Electronics�, that gives a holistic picture of Indian Electronics in India. The book would carry the comprehensive information on Electronics policies, products, and the brands in India. It would be a primary source of information on Indian Electronics to Indians and the rest of the world. The book is an attempt to extend the help to all of them who would want to know anything about electronics industry.
Devendra Kumar | ELE Times
Cover Story
ROLE OF MEDIA IN CHANGING VALUE SYSTEM IN ELECTRONICS INDUSTRY IN INDIA ELE Times | 17 | January, 2016
Cover Story
The year book 2016 would be launched at in the month of February 2016 at ELECRAMA Exhibition in Bangalore. The Guide Book will get distributed throughout the year to Industry Professionals, Government Sectors, Trade Fairs, Embassies, Associations and consultants in India and overseas. As you know India is now the epicenter of consumer demand for high technology and electronic products. The Spotlight on Indian
demand-supply gap and venture in to take informed decision. • Is an important part of business planning. Current situation provides an ideal condition for each one of us dealing in electronics for tremendous growth. The spotlight on Indian Electronics provides an opportunity to all of us to flaunt our brands and have a bigger part of the profit pie.
“India is experiencing a real boom within the electronics industry driven by many factors including trends in technology and communication, not forgetting the ‘Make in India’ initiative. Electronic Hardware Technology Parks, Special Economic Zones and a strong drive for foreign investment, along with a culture of liberalisation and relaxed tariffs are enabling some very impressive growth figures. The Guide Book, “Spotlight on Indian Electronics”, is clearly being launched at a very important time and is poised to become the go-to guide for clear up to date information regarding the electronics industry. As a primary information source carrying pre-categorised and segmented information relating to products, policies and key brands, the Guide Book will quickly become invaluable in enabling both informed and strategic purchasing decisions.” Padmanabha Shakthivelu, Electrolube Sales Manager, India
Electronics 2016, an annual edition and a four hundred pages encyclopedia on Indian electronics industry is badly needed by the marketing and technology professionals in electronics industry. The Spotlight on Indian Electronics is a knowledge pack on Government Policies and resultant development in the country, High Priority Markets and the information on Mega Brands and their Channel Partners, that help existing and the incumbent investors take informed decision on their investment. The Spotlight, not only help grow your business but also mark the epithet of excellence in the electronics fraternity. Spotlight on Indian Electronics 2016 is the first edition of an encyclopedia on India Electronics. The encyclopedia, updated annually, deals with electronic information and all the burning issues related to it. The book has importance in the fact that electronic market is ever increasing and you need to abreast the minutest details and would like to update on micro and micro
Availability: The encyclopedia is available on the tables of the strategic planners, libraries, Embassies and Consulates in India, Chambers of commerce, Consultants, trade Associations in India, China, Taiwan, Japan, Korea, USA, European Union and Association of African countries, government and PSUs, Industry trade channel, Major trade fairs in electronics and allied industries in India, Aerospace and Defence Labs and establishments and electronic companies in general in India.
Categories: The Spotlight on Indian Electronics is a rich source of information and detailed overview of the electronics industry such as comprehensive database, government policies, size and trends in Output and the market, Import-export scenario, drivers of growth, overall market size and SWOT analysis of the ecosystem for the following high priority product markets.
“The Spotlight on Indian Electronics is a good initiative by New Delhi Print Media. The information on governmental policies, market, products and the brands in India – all at one place will be very much complementing to each other. I expect it to be a good source of information on whole ecosystem of Indian electronics. This idea and concept is appealing. It should be able to extend the help to all stakeholders and information seekers of entire electronics fraternity. I wish a great success to this endeavour,” Sumit Sharma, Marketing Manager – India, Good Will Instrument Co., Ltd. economics on Electronics. As you know the electronics market in India is one of the largest in the world and is anticipated to reach US$ 400 billion in 2022. The fact is – it is a big business for domestic and foreign players. Spotlight on Indian Electronics 2016 highlights on the following points: • Is a window to know Indian Electronic industry. • Highlights and compiles extensive information of electronics and allied industries. • Throws light enacting a brief biographical sketch of prominent persons excel in electronics business and R&D. • Is important because it allows business owners to estimate the
Economy need Statistics and Market Intelligence India is one of the fastest growing markets for electronics. The demand is projected to reach USD 400 Billion by 2020. Government of India has launched the National Policy on Electronics 2012 with the vision to make India a globally competitive destination for Electronics System Design and Manufacturing. Besides, The National Telecom Policy 2012 works in conjunction with NPE, 2012 and provides for creating a design and manufacturing ecosystem for telecom equipment.
Electronic System Design & Manufacturing
ELE Times | 18 | January, 2016
Cover Story
Over the last couple of decades India has been the epicenter of consumer demand fuelled by a phenomenal GDP growth. While demand increased across all sectors, demand for high technology products, specifically electronic products has registered significant growth and going by current estimates, the demand for electronics hardware in the country is projected to increase from USD 45 billion in 2009 to USD400 billion by 2020. The estimated production will reach USD 104 billion by the year 2020, creating a gap of USD 296 billion in demand and
electronics, apart from covering electronic hardware products relating to IT and office automation, telecom, consumer electronics, electronic components, etc., we cover a wide range of products relating to verticals like solar photovoltaic, automotive electronics, medical electronics, avionics, LED etc. To address the issue of infrastructure, a scheme for Electronics Manufacturing Cluster provides 50% of the cost of upgrading infrastructure and logistics as grant in aid from Government.
“Spotlight on Indian Electronics is an excellent attempt to bring the industry closer to investors and other institutions. It’s like a mini encyclopedia and would be a great source of information. Such efforts are very helpful for the industry to grow fast and also keep pace with competition. Comprehensive relevant information on electronics is now available in a very presentable manner,” Sunil Bhatnagar, Director- Sales & Marketing, Coslight India Telecom Pvt. Ltd.
production. This creates a unique opportunity for companies in the ESDM (Electronic System Design & Manufacturing) sector to look at India as their next destination to cater to the domestic Indian demand as well as act as an exports hub.
Why we need to abreast with Government Policies The Government has recently approved National Policy on Electronics (NPE). One of the important objectives of the NPE is to achieve a turnover of about USD 400 Billion by 2020 involving investment of about USD 100 Billion and employment to around 28 million by 2020. This interalia, includes achieving a turnover of USD 55 Billion of chip design and embedded software industry, USD 80 Billion of exports in the sector. Moreover, the policy also proposes setting up of over 200 Electronic Manufacturing Clusters. Another important objective of the policy is to significantly upscale high-end human resource creation to 2500 PhDs annually by 2020 in the sector. As part of the efforts to promote the electronics sector, India is setting up a semiconductor wafer fab in the country. India has become the hub for semiconductor design with nearly 2000 chips being designed per year and more than 20,000 engineers
Electronic Hardware Technology Parks (EHTPs) and Special Economic Zones (SEZs) The Government of India has set up Electronic Hardware Technology Parks (EHTPs), Special Economic Zones (SEZs) and a brought about a favourable climate for foreign direct investment (FDI). It has also increased liberalisation and relaxed tariffs to promote growth in the sector. In addition, the government gave its green signal to the Modified Special Incentive Package Scheme (MSIPS) under which the central government will be offering up to US$ 1.7 billion in benefits to the electronics sector in next five years. The growing customer base and the increased penetration in consumer durables segment has provided enough scope for the growth of the Indian electronics sector. Also, digitisation of cable could lead to increased broadband penetration in the country and open up new avenues for companies in the electronics industry.
Employment opportunities India has a vast pool of innovative and talented human resource. Our human resource is our strength which we offer to an investor from abroad. We produce over 200,000 engineers every year. We
“New Delhi Print Media is renowned to bring forth the excellent industry publications every time. I hope that Spotlight on Indian Electronics will be the next gem in the line. Spotlight is the need of the hour as it gives the much needed information to the professionals. I appreciate and congratulate the management for the foresight for sensing the need of the industry. The book will not only give a progressive picture of the industry, it highlights the commitment of the government in order to create a better eco system for FDIs and manufacturing,” R A Gotur, Director Operation, Hongfa India
are working in various aspects of chip design and verification. Annually India is generating nearly USD 2 Billion in revenues for the chip design services. This provides an enabling environment for the semiconductor wafer fab which will come up in India.
Financial Incentives The financial incentives are available not only for new units but also for units relocating from abroad. Besides, when we speak of
also propose to enhance the number of post graduates and PhDs in Electronics so that abundant manpower is available for Electronics industry to grow and flourish. The Indian domestic demand for electronics products is expected to reach $125 billion by 2014 from the current level of $45 billion annually. The primary demand drivers for the Indian Electronic Industry are sectors like telecom, defence, IT and e-governance, automotive, consumer
ELE Times | 20 | January, 2016
“The ‘Spotlight on Indian Electronics’ is an great Initiative NEW DELHI PRINT MEDIA. This initiative will spot the light on Policies, Programs and Incentives from the Government of India. The book gives full information to stake holders about opportunities in Indian Electronics Industry. The effort will make our beloved Prime Minister’s dream of MAKE IN INDIA go faster,” R Sivaprasad, Managing Director, Comkey.in
Cover Story
electronics, and energy. At these demand levels, until India creates its own electronics product industry, the imports of these products will create the single largest trade deficit item, which would even be larger than petroleum products. On the other hand, if this particular unique opportunity is utilized, it can create a large industry catering to domestic consumption, which will help achieve self reliance in strategic sectors like telecom and defence, while leading to large exports.
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Investments In a major boost to the 'Make in India' initiative, the Government of India has received investment proposals of over Rs 1,10,000 crore (US$ 16.56 billion) in the last 12 months from various companies including Airbus, Phillips, Thomson, Samsung, LG and Flextronics among others. India has become one of the most attractive destinations for investments in the manufacturing sector.
Road Ahead The Government of India has an ambitious plan to locally manufacture as many as 181 products. The move could help infrastructure sectors such as power, oil and gas, and automobile manufacturing that require large capital expenditure and revive the Rs 1,85,000 crore (US$ 27.85 billion) Indian capital goods business. India is an attractive hub for foreign investments in the manufacturing sector. Several mobile phone, luxury and automobile brands, among others, have set up or are looking to establish their manufacturing bases in the country. With impetus on developing industrial corridors and smart cities, the government aims to ensure holistic development of the nation. The corridors would further assist in integrating, monitoring and developing a conducive environment for the industrial development and will promote advance practices in manufacturing.
Spotlight is Knowledge and knowledge is power Knowledge is power, Information is liberating and Education is the premise of progress. Man has placed himself at the top of all living beings and natural objects of the world by means of his great knowledge. Man has conquered the space above, tamed the sea and scaled the snow-clad mountains. He has dug out the wealth that remained deposited long in the womb of the earth. Let you acquire Spotlight on Indian Electronics 2016, for knowledge is power. You will find this out for yourselves as you learn more.
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Kristeel Shinwa Industries Ltd. Krislon House, Saki Vihar Road, Sakinaka, Andheri (E), Mumbai - 400072 Tel.: 022-42256666/13/14, Fax: 022-42256690 Email: sales@kristeel.com, smt@kristeel.com Web: www.kristeel.com
Decades of Engineering Excellence ELE Times | 21 | January, 2016
Seizing the opportunity Just when you thought the digital revolution was too focused on consumers, along comes the Industrial Internet of Things (IIoT). Arguably the biggest driver of productivity and growth in the next decade, this latest wave of digital innovation will accelerate the reinvention of sectors that account for almost two-thirds of world output. Accenture estimates it could add US$14.2 trillion to the global economy by 2030, and that there will be particularly significant gains for the real gross domestic product (GDP) of mature economies. Contrary to conventional wisdom, Accenture research suggests that this next generation of digital technology will also benefit workforces of the future by augmenting skills and redefining tasks. The potential economic benefits of the IIoT may be massive, but they are by no means guaranteed. Realizing returns begs two key questions: Are companies prepared to take full advantage of this opportunity? Are governments putting the right conditions in place to facilitate progress and capture benefits? Although a few pioneers are reaping rewards from their early investments, widespread adoption is hampered by major challenges. Accenture analysis reveals that many CEOs may be overconfident about their readiness for the IIoT. It also shows that many countries lack the full spectrum of enabling conditions required to spur the application of these new technologies across their economies. As the world struggles to emerge from a phase of weak productivity growth, fragile employment and pockets of inadequate demand, the IIoT offers a chance to redefine many sectors and accelerate economic and employment growth. However, to seize these opportunities, businesses and governments must intensify their efforts and escalate investments.
The Industrial Internet of Things is a network of physical objects, systems, platforms and applications that contain embedded technology to communicate and share intelligence with each other, the external environment and with people. The adoption of the IIoT is being enabled by the improved availability and affordability of sensors, processors and other technologies that have helped facilitate capture of and access to real-time information.
Securing economic growth The raw technical conditions for the widespread adoption of the IIoT are highly favorable. The number of sensors and devices on which the IIoT depends has already reached tens of billions. There is a difference, however, between the availability of these technologies and capitalizing on their full potential by applying them effectively within organizations, through entire supply chains and across multiple industries. Consider the emergence of electric power at the turn of the last century. Electricity did not become mainstream or transformative until the United States took the lead in embedding it across the wider economy. It was one thing to light the streets; it was another to reinvent factories around powered assembly lines, retrain workers and standardize manufacturing processes. The substantial boost to productivity laid the foundations for entirely new markets. The United States’ head start in electricity gave the nation an advantage in developing and leading a range of related sectors, from the light bulb and domestic appliances, to automotive, semiconductors or software. Likewise, if the IIoT is to generate economic growth, company and country leaders will have to think unconventionally as the rules of competition, production and service delivery change. Accenture estimates that the IIoT will lift real gross domestic product (that is, adjusted for inflation) by 1.0 percent in 2030 over trend
Winning with the Industrial Internet of Things How to accelerate the journey to productivity and growth
ELE Times | 22 | January, 2016
Technology
projections for 20 major economies studied. And if those economies were to increase their IIoT investments by 50 percent and improve the underlying enabling conditions in their respective countries, this could rise from 1.0 percent to 1.5 percent in that year. Looked at collectively in 2030, Brazil, Russia, India and China (BRICs) will see corresponding increments to annual GDP of 0.2 percent on average and, with enhanced investments and measures, 0.5 percent. In particular, Accenture estimates that China looks set to see greater economic gains from the IIoT than Russia, India or Brazil. With IIoT-enhancing measures in place, China could see its cumulative GDP rise by US$1.8 trillion by 2030, raising its GDP in 2030 by 1.3 percent over trend projections. The United States’ economy will gain US$6.1 trillion in cumulative GDP by 2030. By taking additional measures, for instance, to improve the country’s broadband infrastructure, this figure could rise to US$7.1 trillion. This could mean that the United States’ annual GDP is 2.3 percent higher than trend projections in 2030. Including additional efforts and investments, Germany could lift its cumulative GDP by US$700 billion and the United Kingdom by US$531 billion within the next 15 years. This would raise German gross domestic product and United Kingdom gross domestic product by 1.7 and 1.8 percent, respectively, in 2030 over trend projections. How can this economic uplift be achieved?
Creating the outcome economy Today, the IIoT is helping to improve productivity, reduce operating costs and enhance worker safety. For example, in the petroleum industry wearable devices sense dangerous chemicals and unmanned aerial vehicles can inspect remote pipelines. However, the longer-term economic and employment potential will require companies to establish entirely new product and service hybrids that disrupt their own markets and generate fresh revenue streams. Many of these will underpin the emergence of the “outcome economy,” where organizations shift from selling products to delivering measurable outcomes. These may range from guaranteed energy savings in commercial buildings to guaranteed crop yields in a specific parcel of farmland.
How ready are companies? It is clear that many companies are not ready to take advantage of the outcome economy. When Accenture surveyed more than 1,400 C-suite decision makers—including 736 CEOs—from some of the world’s largest companies, the vast majority (84 percent) believe their organizations have the capability to create new, service-based income streams from the IIoT. But scratch beneath the surface and the gloss comes off. Seventy-three percent confess that their companies have yet to make any concrete progress. Just 7 percent have developed a comprehensive strategy with investments to match. Similarly, CEOs and executives express remarkable confidence (96 percent) that the senior leadership in their organizations grasp at least something of the nature of the IIoT. But far fewer say their leaders have completely understood it (38 percent). And even this percentage seems to reflect a degree of overconfidence. Accenture, in collaboration with the Industrial Internet Consortium (IIC) undertook a World Economic Forum Industrial Internet Impact Survey among more than 90 market
leaders, those who are actively pursuing IIoT initiatives. The vast majority (88 percent) said that they still do not fully understand the underlying business models and long-term implications of the IIoT. These conflicting opinions underscore uncertainty around the IIoT. Accenture argues that many companies do not comprehend its full potential and that most are not primed for the fundamental shifts required to deliver hybrid products and services in an outcome-focused economy. If companies are to move from recognizing the potential of the IIoT to taking action, they need to improve their understanding through early experimentation and pilots with a range of partners. Commitment to the Industrial Internet of Things: 73 percent of businesses have yet to make concrete progress. Only 7 percent have developed a comprehensive strategy.
Good news for the workforce of the future Contrary to some accounts of the growing threat from intelligent machines, the IIoT will make people’s work more engaging and productive. Eighty-seven percent of business leaders believe that the IIoT will result in the net creation of jobs. Intelligent machines will automate mundane tasks, freeing up workers to perform more creative and collaborative work with wider networks of people and machines. For example, real-time data access will enable today’s blue collar workers to jointly analyze and adjust the performance of drill equipment in a mine or design products more iteratively with the use of rapid 3D printed prototypes. The IIoT will augment work through innovations, such as wearable technology. Global positioning system (GPS) navigation is an early example. Accenture and Royal Philips have created a proof-ofconcept demonstration that uses a Google Glass head-mounted display for researching ways to improve the effectiveness and efficiency of performing surgical procedures. This solution could provide physicians with hands-free access to critical clinical information. Theoretically transferable to other industries, the
ELE Times | 24 | January, 2016
Reimagine industry models
Three accelerators to productivity and growth
The power of the IIoT comes not only from generating insightful data from physical objects, but also from sharing it between players within supply chains and cross industry consortia. According to a survey undertaken by Accenture and GE, 73 percent of companies are already investing more than 20 percent of their overall technology budget on big data analytics. That shift requires new technical and management skills. Further, it demands a cultural willingness to streamline data flow, not only within enterprises, but also between them. Companies must create new financial and governance models to share the rewards of using common data. Interoperability and security are identified as the greatest hurdles to progress by two thirds of those companies actively pursuing IIoT initiatives. Collaborators should establish their own processes and tests to improve interoperability while establishing common security frameworks. Governments need to work across borders with business and other stakeholders to agree who owns data, what can be shared and how liabilities will be handled across jurisdictions.
Given the clear impact of national enabling conditions on a country’s ability to take advantage of the IIoT, government action will be important. It will be a balancing act. To accelerate the IIoT, countries require “hard” capabilities, such as digital infrastructure, and “soft” technology skills and upskilling programs that depend on investment—in industries, data and people. Business should play its part in identifying the deficiencies in education, capital, technology or institutional frameworks, and ensure that policy action focuses on a balance of factors that can amplify existing competitive advantages. Governments can support directly by bringing together the public, private and education sectors in the promotion of pilots that fast track innovation while reducing the investment risks. For businesses, three key areas need to be addressed to accelerate the economy-wide, cross-industry application of the IIoT:
If every product is connected and enables a new service, reinventing industry practices and business models becomes paramount. As companies embark on a journey that begins with using the IIoT to improve efficiencies, and progresses to creating outcome-oriented, product service hybrids, they will need to plan each stage. How can their efforts for improving asset utilization, for example, be used as a platform for new services? Will a company gain most value by offering its own data to an ecosystem of partners, or from incorporating third-party data to enhance its own services? Should a company invest in its own platform or join existing industry platforms? How will its partnerships evolve as a consequence?
Capitalize on the value of data
Prepare for the future of work An overwhelming majority of executives (94 percent) believe that the increasing use of smart products and robotics will change the required skill and job mix in the workforce of the future. Decision making can be devolved to workers empowered by valuable data, while the design and creative process could become more iterative and experimental. Employees may have to develop working relationships with intelligent machines. And continuous learning could replace traditional training as technologies and business practices evolve quickly. Managers will have to be willing to collapse hierarchies and silos and open up to extended workforces beyond their own walls. Such an approach demands a new culture and tolerance of autonomy. Leaders must also accept the demand for individually tailored working environments and experiences by creative and dispersed workforces, while maintaining core values and a common purpose within their organizations. Companies will have to establish digital platforms to create global talent exchanges that address skills shortages. Digital tools will also accelerate skills development and support a continuous learning culture. Companies will need to reassess their organizational structures and operations. Thanks to technologies such as 3D printing and micro-assembly, in some quarters, the IIoT will reverse today’s trend of centralized manufacturing and localized services, requiring the reconfiguration of operations and talent.
ELE Times | 25 | January, 2016
Technology
application could be used to help field engineers repair equipment with which they are unfamiliar, for instance. As IIoT growth takes hold, the need for talent will intensify. What is more, entirely new categories of jobs will be created: in digital medicine and precision agriculture, for example. The demand for digital literacy will be at a premium, with new skills required in specialist roles from digital robot design and management to transport network engineering and data analytics. As digital technology blurs or removes organizational boundaries, it will create more flexible workplaces that will appeal to sought-after Millennials and other groups that will be required to deliver new customer-oriented services. The impact will be felt on the workforce at every level and will require greater delegation by leadership and more decentralized decision making by individual employees.
Keysight Introduces
Infiniium V-Series Oscilloscopes
for Greater Insights in Validation, Debug
The Infiniium V-Series oscilloscopes from Keysight Technologies provide superior measurement accuracy, enhanced analysis tools and advanced probing systems. With models that range from 8 GHz to 33 GHz, the V-Series enables circuit designers and engineers to make rapid progress from first silicon to eventual product release. When engineers are designing high-speed digital products or components, they need an oscilloscope to help them debug, validate and optimize their designs, perform pre-compliance tests, discover the root cause of failures, and maximize design margins. The Infiniium V-Series offers engineers the capability to perform these tests faster and more accurately, allowing them to get their products to market faster and with more confidence in design quality. The V-Series’ measurement accuracy leads the industry in three
areas: 1) lowest oscilloscope noise floor, 2) lowest real-time oscilloscope jitter floor, and 3) highest number of effective bits. Based on a Keysight-proprietary indium phosphide integrated circuit process, these advantages enable developers to see highly accurate depictions of their signals and achieve tighter design margins. To help designers find and debug their most challenging problems, the V-Series includes a 12.5-Gbps hardware serial trigger with a 160bit sequence (the industry’s longest). Currently, this is the only hardware serial trigger capable of finding 132-bit USB 3.1 (128b/132b) or 130-bit PCIe® Gen 3 (128b/130b) symbols. The VSeries also includes the industry’s fastest mixed signal oscilloscope with 20-GS/s digital channels, which is ideal for triggering, analyzing and debugging DDR4 and LPDDR4 buses.
Keysight Introduces
Portable Oscilloscope Families
That Set New Standards in Price, Performance and Measurement Accuracy
Keysight Technologies introduced new high-performance portable oscilloscope series deploying next-generation oscilloscope technology. The Infiniium S‐Series sets a new standard for signal integrity for bandwidths up to 8 GHz. The Infiniium S-Series has the world’s fastest 10-bit ADC. Compared with traditional scopes with 8-bit ADCs, the S-Series has four times the vertical resolution for precise viewing of signal detail. Coupled with a new low-noise front end, the S-Series delivers an ENOB (effective number of bits) for the system of more than eight, the
highest in the industry. The series includes bandwidths from 500 MHz to 8 GHz with four-channel DSO models and 16-digital-channel MSO models. Standard memory is 50 Mpts per channel or 100 Mpts per channel when interleaved, the deepest in the industry. The S-Series features the industry’s most comprehensive applicationspecific measurement software, fueled by a powerful motherboard with 8-GB RAM, ensuring the scope stays responsive in all operating modes. Fast boot-up time and increased reliability is made possible with its solid-state drive. The 15-inch (38.1-cm) multi touch capacitive display is the largest in the industry, making it easier to see results and easier to use. Keysight also provides options for integrating MATLAB capabilities directly into the oscilloscopes, further increasing their measurement and analysis power for customers. For general-purpose, high-speed differential probing with the Infiniium S-Series oscilloscopes, Keysight also introduced the new InfiniiMax III+ probing solutions, including 4-GHz, 8-GHz and 13-GHz differential active probes and new QuickTip accessories for InfiniiMax probes. The InfiniiMax III+ probes work with the full array of InfiniiMax III probe heads, including a wide range of solder-in probe heads, a browser head, ZIF (zero insertion force) tips, 2.92mm/3.5-mm/SMA heads and the new QuickTip head.
ELE Times | 26 | January, 2016
R&S RTE Digital Storage Oscilloscope Easy, powerful and simply more scope Srinivasa Rao Appalla, Manager-Product Support & Applications, Rohde & Schwarz
R&S has launched different oscilloscopes to address various market requirements.
RTE Digital Storage oscilloscopes were launched to cater the demands of embedded design development to power electronics analysis to general debugging. RTE Series digital storage oscilloscopes offer quick and reliable solutions for every day test and measurement tasks. Many analysis tools provide fast results like FFT that allows EMI debugging during development. QuickMeas function that displays several measurement results at the same time. An Intuitive and smart interface based on high resolution touch screen makes operation easy. The RTE Digital storage oscilloscope has many unique features and one among them is High Definition (HD) mode. The vertical resolution determines how precisely the signal can be measured and how accurately it can be analysed. The HD mode enhances the vertical resolution up to 16 bits against 8 bit vertical resolution of A to D converter. It means HD mode provides 256 times more vertical resolution. This improved vertical resolution enables display of small signals that are otherwise buried in noise. With the unique Digital Trigger, we can even trigger on these small signals and make precise measurements. The High Definition (HD) mode doesn’t require special hardware. It can be enabled by software key code and simple upgrade for existing units as well. Hence depending on the application, the user has flexibility to choose between high bandwidth and high resolution mode on single instrument.
We are now explain the brief technical details about the HD mode -High Definition (HD) mode enhances the vertical resolution up to 16 bit by applying digital low pass filtering to the signal in real time directly after A/D converter. Due to filtering noise is reduced and signal to noise ration increases which results in enhanced resolution. The bandwidth of the filter can be adapted to signal characteristics. Lower the bandwidth of the filter, higher the gain and resolution.
The schematic diagram showing the signal flow is shown below:
The enhanced resolution results in clean waveforms and signal details otherwise lost in noise are visible now. The low noise front end and single core A/D converter of scope with Effective number of bits (ENOB) >7, has contributed to high dynamic range and measurement accuracy. With High Definition mode the user benefits from precise analysis results due to high dynamic range and better accuracy.
Fig 2 -This picture shows Zoom in to a sine wave in normal mode. The quantisation steps are clearly visible. Signal details might be hidden in noise.
The same signal is as in Fig 2 with HD mode is activated. Due to improved resolution, the super imposition of sine
ELE Times | 27 | January, 2016
wave is clearly seen The user doesn’t need to compromise on speed or measurement capabilities with High definition mode. The reason being digital filtering in HD mode is done thru ASIC which results in high acquisition and processing rate. Analysis tools like automatic measurements, FFT, History mode can be used in High Definition mode without any compromise. The High Definition (HD) Mode is really beneficial for analyzing switched mode power supplies usually known as SMPS. In SMPS, the Switching devices on and off voltage must be measured in the same acquisition cycle. The difference in on and off voltage is of several hundred volts which requires high dynamic range. The HD mode with vertical resolution up to 16 is best suited to make these measurements. High Definition (HD) mode is also suitable for measuring modulated RF signals with small modulation index which is common in radar applications. High Definition (HD) mode ability to measure low level signal accurately is really beneficial to Bio medical measurements. In summary, RTE Digital storage Oscilloscope’s low noise performance, High waveform update rate, precise digital trigger, powerful analysis functions combined with High Definition (HD) mode results in more confidence in your measurements.
GDS-2000E Series Digital Storage oscilloscope from GW Instek GW Instek introduced the brand new GDS-2000E series to offer users a more affordable and excellent 8” TFT LCD oscilloscope. The GDS-2000E Series Digital Storage Oscilloscope offers 2 and 4channel configurations and the bandwidth selections, including 200MHz, 100MHz and 70MHz. 4 channel models of the series provide 1GSa/s max.real-time sampling rate; 2 channel models of the series provide 1GSa/s per channel real-time sampling rate. The series is equipped with waveform update rate of 120,000 wfm/s. The 8-inch 800*480 16:9 WVGA display and the minimum 1mV/div vertical range allow the GDS-2000E series to clearly display complex and random waveforms. The GDS-2000E series provides 10 Mega point record length in each channel with Waveform Search and Segmented Memory functions, which greatly enhance the value of long memory utilization of a DSO. The GDS-2000E series also provides 1M max FFT display. High resolution FFT display, high waveform update rate, Window Zoom and Peak Search allow users to obtain more accurate and efficient test and measurement results while conducting tests in the frequency domain.
Low Background Noise: For small signal measurement, oscilloscope’s background noise will affect the measurement results. The brand new GDS-2000E low noise amplifying circuit can tremendously improve overall noise interference to produce the genuine signal demonstration. As shown in the diagram below, the GDS-2000E series has merely the background noise of 400uV under 2mV/div that is superior to the same category oscilloscopes developed by competitors. Waveform Update Rate of 120,000 wfm/s and VPO Waveform Display Technology: The GDS-2000E digital oscilloscope allows users to easily and completely observe inrush signals and rare transient waveforms to increase waveform debugging efficiency by using features, including advanced VPO (Visual Persistence Oscilloscope) signal processing technology, waveform update rare as high as 120,000 wfm/s, and multi-layered afterglow display to enhance waveform display efficiency. Oscilloscope with VPO technology displays signals with three dimensional waveforms constructing by amplitude, time and signal strength to show each waveform point. 256 color gradients yield clear waveform changes. Comparing with the conventional digital storage oscilloscope, the GDS-2000E series provides more natural and more genuine signal display effect which is very close to the original analog signal.
1M FFT Display: The FFT function of the GDS-2000E Series provides the maximum 1M display for more precision frequency domain display. The function supports four window displays, including Rectangular, Hamming, Hanning, and Black-harris. Users select window display
for frequency domain analysis according to test requirements. The GDS-2000E series not only provides the FFT function but also FFTrms, vertical adjustment, and local zoom-in functions for users to adjust waveforms of frequency domain by their requirements. Via rapid waveform update rate and waveform search functions, users can precisely observe the test results of frequency domain.
Digital Filter Function: Engineers are often troubled by noise interference while measuring signals in the electric circuit tests. The GDS-2000E series features the digital filter function which can be set to high pass or low pass digital filter. Digital filter allows users to independently set filter frequency for each channel. The tracking on function rapidly sets same filter frequency for all channels.
Support I2C/SPI/UART/CAN/LIN Serial Bus Trigger and Decoding Function: The serial bus technology has been widely applied in the present embedded application design. How to rapidly and correctly trigger and analyze serial bus data has posed a difficult challenge to engineers. The GDS-2000E series provides serial bus analysis function and 10M long memory depth to trigger, decode, and analyze frequently used I2C, SPI ,UART serial bus and CAN/LIN bus, which is often used by automotive communications.
GDS-2000E Features and Functions: • • • • • • • • • • • •
200/100/70MHz Bandwidth Selection; 2 or 4 Channels 1GSa/s Real-Time Sampling Rate for Each Channel (2ch model) 1GSa/s Maximum Real-Time Sampling Rate (4ch model) Standard 10M Maximum Memory Depth and VPO Waveform Display Technology Max. Waveform Update Rate of 120,000 wfm/s 8 ” WVGA TFT LCD Display FFT with Maximum 1M points to Provide Higher Frequency Domain Resolution Measurement High and Low Pass Digital Filter Functions 29,000 Sections of Segmented Memory and Waveform Search Functions I2C/SPI/UART/CAN/LIN Serial Bus Trigger and Decoding Function Data Log Function Tracks Signal Changes Up To 100 hours Network Storage Function
Contact: Sumit Sharma, Good Will Instrument Co., Ltd., Noida, Mob No: +91-9999167300, E-mail: sumit_sharma@goodwill.com.tw, Website:www.gwinstek.com
ELE Times | 28 | January, 2016
Ava DGS&D ilable on Rate with st Contract a 3 years ndard warran ty
email: sales.rsindia@rohde-schwarz.com
Contact us: New Delhi: +91-11-42535400 | Bangalore: +91-80-41780400 | Hyderabad: +91-40-40003200 | Mumbai: +91-22-26743848
BERTWave MP2100B : Anritsu 4ch BERT, Sampling Oscilloscope in single unit
Global Data center IP traffic grows at a compound annual growth rate (CAGR) of 23 percent, resulting in increasing production of optical modules. (Production of optical modules exceeded 15 million units.) The recent rapid increases in data volumes at network equipment, servers, and storage due to increasing use of smartphones, cloud computing, FTTx rollout, video streaming, etc., seem likely to increase even further in future. To cope with demand, many appliances and facilities are using digital signals exceeding the Gbit/s band. Dealing with these high-speed signals requires paying attention not only to the digital aspects but also to analog-type behavior, and care is required in choosing tools for monitoring these signals. This document discusses the key points when handling digital signals exceeding 10 Gbit/s from the perspective of measurement tools. The BERTWave MP2100B is an all-in-one test set with built-in BERT and available sampling oscilloscope supporting evaluation of optical modules, including BER measurements, Eye Mask tests, Eye pattern analyses, etc. A BERT and sampling oscilloscope are required measuring instruments for evaluating optical modules used by optical communications systems. Previous evaluations of optical modules, such as QSFP+ and SFP+ modules, required provision of a separate BERT and sampling oscilloscope. However, the BERTWave MP2100B incorporates a BERT supporting from one up to 4 channels as well as an optional sampling oscilloscope in a single, compact, 18 cm deep cabinet, slashing equipment investment costs and saving bench-top space. In addition, the BERTWave MP2100B reduces measurement times by eliminating the need to change cable connections at simultaneous BER measurements, Eye Mask tests, and Eye pattern analyses. Additionally, adding the SFP+ plug-in port supports optical BER measurements.
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Key Features: • • • • •
• • • • • • •
Built-in 4ch BERT and sampling oscilloscope Simultaneous 4ch Bit Error Rate (BER) measurements High-quality waveform PPG (1 psrms Jitter) High-input sensitivity (10 mVp-p minimum input sensitivity) High-speed Eye Mask test and Eye pattern analysis at 150 ksample/s max. Supports differential signal BER measurement, Eye Mask test and Eye pattern analysis Up to six built-in Bessel filters for full-featured application support Compact (18 cm deep) test set for optical module evaluation Simultaneous measurement of BER, Jitter, Eye pattern and Eye Mask Supports WDP measurements Calculates optimum values for sampling simultaneously with equalizer and emphasis values to display Eye Pattern Simultaneous Eye Pattern, Eye Mask and Jitter measurements of simulated waveform
Key Application Area:
5.
6.
Evaluation of Active Optical Cables (AOCs) not only requires BER measurements and Eye Pattern analyses but also requires Jitter Analysis due to a analysis at electrical signal conversion. By using the MP2100B along with the Jitter Analysis Software MX210001A option, the Jitter of high-speed, multichannel AOCs can be measured at the same time as performing Eye Pattern and Eye Mask tests. Simultaneous Multi-channel Measurements Both-ways transmissions of multichannel AOCs using InfiniBand, etc., can be measured simultaneously. Since the MP2100B has a built-in 4ch PPG and ED, it can also measure BER simultaneously, helping cut measurement times. 40 Gbit/s QSFP+ (4 x 10 Gbit/s) Measurement: Simultaneous Measurements: Optical modules used in data centers are handling increasing data volumes, some more multichannel optical modules such as QSFP+ are being used. The MP2100B supports simultaneous BER measurements of multichannel optical modules for four channels using the builtin BERT. In addition, Eye Pattern and BER can be measured simultaneously using the built-in BERT and sampling oscilloscope. PON Device BOB (BOSA On Board) Evaluation: Clock Recovery Options: Because the MP2100B has a built-in clock recovery option supporting 8.5 GHz to 12.5 GHz and 0.1 GHz to 2.7 GHz, it can be used to confirm the optical output characteristics of transmission equipment without requiring a trigger source. High-Speed Mask Margin Measurement: Eye Pattern analysis can be performed at sampling rates up to 150 ksample/s using the Fast Sampling Mode. In addition, automated Mask Margin tests shorten measurement times and increase measurement efficiency. Direct Attach Cable (DAC) Measurement: The Eye opening of passive cables like Direct Attach Cables (DAC) used for short connections between server racks, etc., can be assured using the equalizer built into the equipment Rx section. The MX210002A can measure the S21 Gain and Phase characteristics of these devices. Moreover, since waveforms with optimized equalizer, filter, and emphasis values can be predicted from these transmission characteristics, Eye Pattern measurements and Eye Mask tests of simulated waveforms can be performed. Emphasis Effect Simulation: The same 4Tap Emphasis as the 4Tap Emphasis MP1825B can be set. The type of Eye Pattern measurement resulting from equalization and Emphasis correction of a waveform with an Eye Pattern measurement degraded by transmission path loss, or analysis using on-thespot waveform simulation to determine the required equalization or Emphasis can be fed-back into the Emphasis design.
1. Active Optical Cable (AOC) Measurement: Jitter Analysis:
ELE Times | 30 | January, 2016
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Reinforced insulated DC/DC Converters Prolong The Service Life of IGBT Circuits
Small and reliable Bianca Aichinger, Product Marketing Manager, RECOM Power GmbH
IGBTs are key components in power electronics and are mainly used where fast switching is essential, for example in inverters or motor control systems. Their drivers are powered through small, highly efficient DC/DC converters that play a crucial role for the reliability of the entire system. It is therefore very important that the correct converter model is chosen. IGBTs have become indispensible in power electronics. Due to their capability to switch high powers with minimum current, they have become the preferred solution in many types of circuits, including modern frequency converters. In times of rising electricity costs, frequency converters are among the most effective solutions for the efficient operation of production plants. The primary task of frequency converters is regulating the speed of a three-phase asynchronous motor. As the frequency of the power grid determines the motor speed, changing the frequency enables operators to change the speed of the motor.
Design of standard frequency converter: A frequency converter consists of three main components, namely the rectifier, the intermediate circuit and the inverter (see figure 1). In the power rectifier, the alternating current is converted by means of a three-phase bridge circuit into pulsed direct current. This current is smoothed in the intermediate circuit capacitor. Subsequently, the output voltage and frequency are adjusted in the inverter. The main components of the inverter are 6 IGBTs that are arranged in pairs on three branches. The IGBTs control the rectified intermediate circuit voltage output by means of pulse width modulation (PWM).
Figure 1: Diagram of frequency converter
IGBT control The IGBTs are powered and controlled by means of IGBT drivers integrated into the power circuit where they float in line with the input voltage. There is thus a need for electrical insulation. Optocouplers act as insulators for the control signal. For the supply power, the insulation is normally provided by two reinforced insulated DC/DC converters. IGBTs thus combine the characteristics of MOSFETs at the input end and bipolar transistors at the output end. They can be controlled with minimum current. When through-connected, they show minimum voltage drop along the collector-emitter path. IGBTs are thus the ideal devices for the switching of high voltages and currents with minimum power consumption. During the
ELE Times | 36 | January, 2016
Figure 2: IGBT switching; the curves to the left show the switching-on and switching-off currents and voltages. The advantage of reducing the switch-off voltage to acceptable dv/dt loads is clearly visible.
The latest products on the market are IGBT converters. These devices are perfectly adapted for combination with IGBT drivers, and feature dual asymmetric outputs of +15V and -9V for the supply of the drivers (see figure 3). As a single converter is thus sufficient, they cater for compact solutions and can help save money.
Why insulation is crucial for a long service life At first sight, given an intermediate circuit voltage of around 560V, insulation strength does not appear to be a huge problem. As a rule of thumb, one would expect that insulation by twice the intermediate circuit voltage should be more than sufficient. When taking into account the high switching frequencies of up to 16kHz and the associated steep switching edges, it becomes apparent, however, that other aspects must be considered for effective insulation. As the switching rates are normally within the Âľs range, damage to the insulation is not immediately detectable. Over time, the extra load can, however, lead to premature failure of the component. As the saying goes, little strokes fell big oaks, and this is exactly what can happen here. When choosing the type of insulation, air clearance and creepage distances around the transformer are the main issues. They are normally specified for 50Hz. At higher and irregular frequencies that are commonly found in motor control devices, the behaviour of electromagnetic components and materials is, however, very different. In addition, the steep switching edges cause parasitic capacities. It would therefore be foolish to rely on simple or functional insulation consisting of varnish around the transformer winding wires. Double or basic insulation, where the wires are separated by additional insulation barriers, offer much greater safety. In conclusion, it is therefore recommended to choose an insulation voltage that is significantly above the expected voltage peaks. Combined with basic or even reinforced insulation, the reliability of IGBT converters can be greatly improved. The fact that manufacturers do not always provide the necessary information in the data sheets of their products can make it difficult for designers to compare like with like. Sometimes, the values refer to a test voltage applied for "1 second". In other data sheets, the specifications apply to test voltages of "1 minute" or "continuous". The longer the test time, the lower the voltage value.
Advanced IGBT converters from RECOM In order to meet the demands of as many applications as possible, RECOM now offers seven new IGBT converter series. All models feature asymmetric outputs of +15V and -9V at input voltages of 5V, 12V, or 24V, respectively, and are therefore tailor-made for the operation of IGBT drivers. Special attention has been paid to the insulation rating of the new products. Ranging from 3kV (RHxx1509D) to 6.4kV (RxxP1509D), the new converters offer suitable insulation values for virtually all applications. As designers often need to consider the size of components, the new IGBT converters are available with the compact SIP7 housing (RP-xx1509D), the universal DIP14 housing (RKZ-xx1509D), or as flat DIP24 miniature (RV-xx1509D) models. These 1W and 2W modules are certified according to EN60950-1 and do not contain hazardous substances according to the RoHS2 and REACH Directives. As usual for RECOM devices, these products come with a three-year warranty.
Figure 3: In the IGBT control stage (IAS in fig. 1), the control circuit (blue) and the power circuit (red) are completely separated
ELE Times | 37 | January, 2016
Semi Power
switch-on process, it is important that the gate capacity is charged as quickly as possible. This, however, results in shortterm current peaks. The gate resistance RG ensures that the longest permissible switching time at just about acceptable di/dt is achieved. During switching off, the voltage of the gate capacity must be reduced as quickly as possible. This is done by applying a suitable control voltage VG-. With symmetric power supply and +15V, which is required for IGBTs to switch on reliably, the control voltage should thus be -15V. If the gate charge drops too quickly, the components of the device would, however, be exposed to huge voltage peaks. In order to protect the components against such peaks, the control voltage is normally reduced during switching off. Tests have shown that -9V is a good compromise, as the gate is discharged sufficiently quickly at acceptable dv/dt values. Figure 2 shows the respective current and voltage curves. Developers of IGBTs have thus to make a choice: they can opt for a compact design with a single converter and symmetric Âą15V, or choose a more costly, and less compact, solution with supply through two separate converters with +15V and -9V.
ROHM Expands
Its Full SiC Power Module Lineup New 1200V/300A model ideal for high power applications
ROHM has recently announced the development of a 1200V/300A full SiC power module designed for inverters and converters in solar power conditioners and industrial equipment. The 300A rated current makes the BSM300D12P2E001 suitable for high power applications such as large-capacity power supplies for industrial equipment. In addition, 77% lower switching loss vs. conventional IGBT modules enables highfrequency operation, contributing to smaller cooling countermeasures and peripheral components. ROHM began mass production of the world’s first full SiC power module with an integrated power semiconductor element composed entirely of silicon carbide, and its 120A and 180A/1200V products continue to see increased adoption in the industrial and power sectors. And although further increases in current are expected due to energy-saving effects, in order to take advantage of the high-speed switching capability of SiC products an entirely new package design was needed that can minimize the effects of surge voltage during switching which can becomeparticularly problematic at higher currents. In response, the BSM300D12P2E001 features an optimized the chip layout and module construction that significantly reduces internal inductance, suppressing surge voltage while enabling support for higher current operation up to 300A. And going
forward ROHM will continue to strengthen its lineups by developing products compatible with larger currents that incorporate SiC devices utilizing high voltage modules and trench structures. Key Features 1. Reduced switching loss through higher frequency operation: Replacing IGBT modules is expected to reduce switching loss by up to 77%, enabling smaller cooling systems to be used. And higher frequency switching will make it possible to decrease the size of peripheral components such as the coil and capacitors as well, improving efficiency while contributing to greater end-product miniaturization. 2. Lower inductance improves current-handling capability: Increasing the rated current for power modules involves reducing the internal inductance to counter the higher surge voltages generated during switching. The BSM300D12P2E001 features an all-SiC construction and optimized circuit layout that cuts internal inductance by half, making it possible to increase the rated current to 300A. Device Configuration • Full SiC module integrates an SiCSBDand SiC-MOSFET into a single package • Equivalent package size as standard IGBT modules • Built-in thermistor • Tjmax=175°C SiC Power Module Lineup
ELE Times | 38 | January, 2016
Akshat Garg | Analog Applications Engineer, Pavan Shetty | Field Applications Engineer (Analog) Texas Instruments Today’s enterprise and telecom hardware systems are pushing the technology in power electronics to achieve smaller size, robust design, better efficiency and thermal performance. At present, there is a need to pack more computing power on the same formfactor boards, which increases the power density needed from the power delivery modules. In short, customers’ demand of “increase the power density without increasing the size”, needs to be met.
Reducing size with new TI solutions
Applications such as server racks and network switches have multiple boards stacked inside a single chassis. Designers often have height and space constraints. Low profile inductors, transformers, bulk capacitors, etc. are in common demand. Designers need to look at ways of increasing the switching frequencies in order to reduce their size. Silicon Mosfets with improved gate charge and RdsON, as well as newer wide bandgap devices like GaN (Gallium Nitride), are major breakthroughs that help in reducing the size of power solutions. GaN switching devices enable customers to implement large step down ratios without having an intermediate bus, increasing switching frequency beyond 2MHz. Designers can directly look to convert 48V to 3.3V high power rails instead of generating a 12V intermediate bus. One of the main challenges that come up in the design of high switching frequency convertors is in the layout, where it is imperative to minimize switching loops to reduce output noise and address EMI/EMC concerns. LMG5200 Module from TI combines a GaN FET and GaN driver in a single package, reducing the stress on external layout design. LMG5200 when combined with a digital controller like UCD3138A can be used for direct point of load applications from a high voltage bus or isolated supplies with reduced transformer size. Silicon FET such as 100V CSD19536KTT offers a 2.4 mOhm (Max) Rdson which is excellent for applications that need Oring or Hotswap. Power stages such as CSD95378 combine a gate driver and MOSFET in the same package enabling tighter layout for high current point of load designs.
Integration
When we hit the limits of switching frequencies, the next thing
Figure 1: TI Silicon FET power block CSD95378
that can be turned to is INTEGRATION. Integrated MOSFET convertors also often have internal compensation or use hysteretic control topologies like adaptive constant on time that do not need external circuitry. Convertors like TPS544C20 and TPS544C25 can deliver 30A loads, replacing traditional controller + external MOSFETs to integrated FET solutions. TPS544C20 uses TI’s DCAP2 (adaptive constant on time) topology that incorporates internal ripple injection and requires fewer external components. Due to the extremely fast transient response on these control topologies, designers can afford to use fewer and smaller capacitors to satisfy load regulation needs while going for low ESR ceramic capacitor bank. Introduction of plug and play modules further shrink the solution size by integrating inductors and capacitors with the convertor. TPS82085 (SIL) for example allows for an implementation of 35mm2 which is half the size of a corresponding external inductor design. Modules like TPS8268 (SIP) even integrate the input and output capacitors, in a low profile solution.
Figure 2 : Integration levels
Size reduction can also come in the form of eliminating component footprints present for qualification purposes. Board designs usually incorporate margining circuitry to enable DVT qualifications, otherwise unused. By using convertor control topologies like a PMBus, designers can eliminate this circuitry and instead implement the margining through simple software. PMBus functionality in devices like the TPS544C2x also incorporates real-time voltage and current sensing to gauge the actual load. Devices like TPS549A20 come in a PMBus and non PMBus pin compatible version to optimize cost during mass production. A popular way to increase the power density is to use a multiphase converter where each phase can switch at a higher switching frequency, using smaller passives. Using 2 phase options like TI’s TPS62180, designers can opt for two smaller lower cost low profile inductors instead of one bulky inductor. Similarly devices like LP8758-B0 can deliver upto 16A in less than 50mm2 area, enabled by a 4 phase configuration. For higher current (200A), multiphase controllers like TPS53647 can be combined with power stages to reduce solution size and also output switching ripple.
ELE Times | 39 | January, 2016
Semi Power
Texas Instruments’ Power solutions for Enterprise and Telecom Market
We primarily set ourselves apart through innovation and find substantially more room for developing our strengths in growing markets -Vivek Mahajan
Infineon, through relentless innovations, has made the barely visible electronic components an indispensable part of our daily lives. They help to feed regenerative energy into power grids with almost zero losses, tame power-hungry computers, safeguard the data flying through cyberspace and make cars more energy-efficient. Vivek Mahajan, Division Head, Industrial power control for Asia Pacific, Infineon Technologies, in conversation with ELE Times discusses the power semiconductor and the market. Excerpts from the interview.
ELE Times: What are the current global trends in the Power Semiconductor market and how do you foresee the market to grow in the next couple of years? Vivek Mahajan: We expect that the growth in the Industrial, Consumer, Automotive and Chip Card ICs segments of the semiconductor industry will outpace the total semiconductor market in the next 4 years. Infineon, with its technology and products in the four divisions Industrial Power Control, Power Management and Multimarket, Automotive and Chip Card and Security is well positioned to profit from the developments we foresee. And our market assessment is supported by IHS and a report they issued in September last year. The industrial segment covers a wide spectrum of applications along the entire power value chain, starting with power generation including renewable energy
conversion, to transmission and a broad range of consumption. The consumption area includes various applications ranging from traction, CAV, general purpose drives, conveyors, home appliances and robotics, to data servers, power tools, lighting, consumer gadgets in the low power arena. The major trends in the industrial segment are industrial automation due to higher labour cost, and rapid urbanization demanding mass transport systems not only within cities but also for commuters. After we have seen the success of the Paris negotiations on climate fostered by the UN, the legislative push for higher mix of renewable energy sources will have to be intensified. In general we feel very comfortable that semiconductor technology that enables higher power density and with that, higher energy efficiency, will profit from these trends. Even though the semiconductor itself is
ELE Times | 40 | January, 2016
not noticed at all by the consumer, up to 90 percent of innovations in vehicles, for example, are implemented today by means of electronics. Progress in electronics in turn is based nearly entirely on the pace of innovation in semiconductors. In automotive, power and sensors are among the fastest growing product categories with Y-Y growth of 11 percent. (Source: Strategic Analytics, Apr 2015). The global trends in the automotive segment, for example ADAS, xEV, connectivity, and advanced security – are significantly increasing the semi content per vehicle. Legislations in favour of CO2 reduction will push for improvements in internal combustion engine and adoption of EV and HEV. Semiconductors and innovative manufacturing technologies are also helping to reduce system cost to enable wider adoption of advanced safety and comfort features. Contd. on Pg 42
COMSOL provides software solutions for multiphysics modeling. It is a fast growing high tech engineering software company. COMSOL Multiphysics is a finite element analysis, solver and Simulation software / FEA Software package for various physics and engineering applications, especially coupled phenomena, or multiphysics. Dr. Samarth Agarwal, Office Manager, Delhi COMSOL Multiphysics had a candid conversation with ELE Times during COMSOL conference last month at Pune, India. Excerpts from the interview.
from COMSOL
ELE Times: What is the significance of Multiphysics? How can product developers use Multiphysics? Please make us understand with an example. Samarth Agarwal: Technology today, be it the designing of a simple light bulb or an automobile, require inputs from different areas of science and engineering. The ability to handle these different physical phenomena together through computer simulations is called Multiphysics. Any product developer would need to be mindful of these different phenomena influencing the product design simultaneously. To be able to handle these complexities one would have to resort to using a Multiphysics simulator like COMSOL. Adopting an approach that is not Multiphysics in nature would never allow a product designer to reach the most optimum operating points, given that the design space is typically large. For example in the designing of a light bulb, one has to look at several aspects, like the heat transfer inside the bulb, structural strength and electrical properties of the materials all at the same time. By taking these phenomena one at a time, one cannot possibly understand the effect they have on each other and therefore it would be virtually impossible to achieve the best combination. A Multiphysics approach on the other hand would help in designing this efficiently and give the optimum solution in a given design space. ELE Times: What are the several important roles in simulation-based design? (As product development moves towards completely digitized processes, Multiphysics simulations can play several important roles in simulation-based design. What are they)? How has the emergence of a shorter time-to-market affected work practices? Samarth Agarwal: Though the importance of simulation is well understood, the move towards Multiphysics simulations is more recent. Previously several different teams working independently with different simulation tools would design different aspects of the technology. Now as these different technology aspects get intertwined, a Multiphysics approach is
essential. Uniformity across these teams also demands that as far as possible a similar software platform capable of handling a wide range of problems be used. In addition to that, all tasks down to analysing data and creating reports can be handled by COMSOL. Uniformity and standardization across teams has also reduced the time-to-market. So an organization looking at choosing a computer simulator must ensure that they adopt an approach that makes it easy to achieve their objectives of streamlining processes and keeping the time to market as short as possible. ELE Times: Can you elaborate on simulation for everyone? What ramification does the Application Builder has for semiconductor industry? Samarth Agarwal: The essential idea is to be able to use simulation capability such that one is required to look only at parameters relevant to the problem, rather than all the details of a Multiphysics simulation. The Application Builder from COMSOL is a big step in this direction. It gives the power to the user to design a custom interface keeping only relevant design parameters, and then pass them on to other users in the form of an application. This way a larger group of people will then have access to simulations in any organization. For example in the semi-conductor industry, various teams are involved in the manufacturing stage and have knowledge of the operating points of the technology. The technology design however is taken care of by a relatively smaller R&D team. Using the application builder, the R&D team can reach out to a large number of experts in the manufacturing team through custom designed applications and get feedback on their design. The manufacturing team will only have to deal with the relevant parameters and not with all the details that went into building a Multiphysics simulation model. This would ensure a smoother transition of any design from concept to manufacturing. ELE Times: What major electronics design challenges does simulation help tackle? What are the offerings from COMSOL for an electrical and
ELE Times | 41 | January, 2016
In Conversation
Dr. Samarth Agarwal Office Manager COMSOL Multiphysics
Complexities at product designing need masterly Multiphysics Simulation
In Conversation
We primarily set ourselves... Contd. from Pg 40 ELE Times: How is technology changing with this growth? Vivek Mahajan: The semiconductor industry is particularly exciting because of its rapid and significant changes. About every three to five years, a new technology generation emerges. Even the automotive industry that is characterized by longer development cycles recently had to experience how quickly new suppliers can move the market. It was as recent as in 2008 when Tesla entered serial production with the Roadster. Since that time, the company also sells electric components to established car manufacturers or home energy storage systems known as powerwall to end customers. In a rapidly changing market, it is necessary to consider whether a recipe for success might lead to a dead end over the longer term. This is especially true when you focus on technology, a key element in semiconductors. Here, it is warranted to find a compromise between continuity and change. Technology must serve a purpose which is of major relevance for our society, and move people and markets. We make life easier, safer and greener – with technology that achieves more, consumes less and is accessible to everyone. Microelectronics from Infineon is the key to a better future. We primarily
set ourselves apart through innovation and find substantially more room for developing our strengths in growing markets. ELE Times: Which are the key sectors where you are investing for solving current challenges? Vivek Mahajan: On a more general level, we see three major challenges modern societies are facing today: energy efficiency, mobility and security. Why? Electricity will remain our main source of power in thefuture. But we must use it more efficiently. Our semiconductor technologies are building more efficiency into the entire energy value chain – from generation through transmission to consumption. Everyone wants to be mobile. But the increasing urbanization and the pressing need to protect our climate call for new forms of mobility. Besides more energy-efficient cars, we also need sustainable and affordable concepts for localand long-distance travel. Our daily lives are shaped by digital services. And all modern communication media – from the Internet to electronic passports – must be safeguarded against misuse to protect personal data. These are three sectors in which we build up system understanding so that we can now provide solutions to our customers which set them apart from their competition. To give you an inside to our approach let’s
take the example of the major home appliance (MHA) market: In 2011, out of the estimated 420m units of electric motor based home appliances, only about 20 percent are based on Variable Speed Drive (VSD) technology. Growing demand for MHA will put a strain on energy supplies. The need for energy efficiency will continue to drive VSD penetration rate in MHA segment. It is in this regards that we took shares in LS Power Semitech Co., Ltd., a company established in 2009 as a joint-venture of Infineon and LS Industrial Systems in Korea. The strategic acquisition increased our global footprint in the growing market segment of Intelligent Power Modules (IPM) which enable higher energy efficiency in consumer appliances such as refrigerators, freezers, washing machines, dryers, and air conditioners. In May 2015 we announced the acquisition of the outstanding shares. The acquisition of International Rectifier can also be seen in this light. They have perfectly matched with our portfolio to address the growing demand for energy efficiency in MHA. Thanks to these acquisitions Infineon in 2014 was ranked among the top-5 players in the market for IPMs for the first time. In this year,the market for IPMs amounted to 1.26 billion US-Dollars in total.
Complexities at product designing... electronics engineers? Samarth Agarwal: Even in the electronics domain COMSOL has demonstrated that complicated problems in optoelectronics and mems can be handled using a Multiphysics approach. These problems are particularly involved because of the need to understand different sub-disciplines in the electronics domain. The capability of COMSOL in electrical and electronics engineering ranges from being able to treat low frequency or DC to high frequency problems in electromagnetism. The semiconductor capability on the other had allows analysis at the device physics level. Geometrical ray tracing can be done using the Ray optics capability. COMSOL is capable of handling problems in EMI/EMC
(Electromagnetic interferenc/Electromagnetic compatibility) which involves simulating electromagnetic energy generation and propagation. More involved topics like plasmonics where the interaction of electromagnetic fields with electrons is studied can also be attempted. The electrical capability in COMSOL can not only handle mixed simulations involving circuits and devices, but it can also interface with other circuit simulators. Finally other related phenomena like heat transfer and thermal expansion can be seamlessly integrated into the electronics capability. ELE Times: Please give a brief account of the paper presented at COMSOL Conference held at Pune. Samarth Agarwal: Participation from the
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COMSOL community has gone from strength to strength, with over a 100 presentations from both industry and academia being submitted at this year’s conference held in Pune. Electromagnetism and related topics seemed to be the most popular area of work. The top academic institutions from across the country were well represented. The industry participation was from several leading corporates and government labs. The level of work can be gauged from the fact that several of the papers presented close comparisons between simulations and experiments. These presentations are now available online.
Four Quick Steps to Production
Using Model-Based Design for Software-Defined Radio
Analog Devices / Xilinx SDR Rapid Prototyping Platform: Its Capabilities, Benefits, and Tools Introduction
With the exponential growth in the ways and means by which people need to communicate, modifying radio devices easily and cost effectively has become business critical. Based on this requirement, software-defined radio technology has been widely employed recently since it brings the flexibility, cost efficiency, and power to drive communications forward. The purpose of an SDR system is to implement as much as possible of the modulation/demodulation and data processing algorithms in software and reprogrammable logic so that the communication system can be easily reconfigured just by updating the software and the reprogrammable logic and not making any changes to the hardware platform. With the advent of system on chip (SoC) devices like the Xilinx Zynq. All Programmable SoC that combine the versatility of a CPU and the processing power of an FPGA, designers have the means to consolidate the data processing functions of an SDR system into a single device while integrating additional processing tasks. Processing intensive tasks like the data modulation/demodulation algorithms are offloaded to the programmable logic of the device while tasks like data decoding and rendering, system monitoring and diagnosis and user interface are deferred to the processing unit. At the same time, prototyping wireless systems has been a discussion topic for decades but has only in recent years evolved into a complete design flow for FPGAs—from model creation to complete implementation—due to the evolution of the modelling and simulation tools like MATLAB and Simulink from MathWorks. Prototyping wireless systems is transforming the way engineers and scientists work by moving design tasks from the lab and field to the desktop. Now the entire wireless system, such as an SDR system, can be modeled, allowing the engineer to observe the system’s behavior and to tune it before it is actually implemented in the field. This has several benefits, such as accelerating system integration and reducing the dependency on equipment availability. Moreover, once the Simulink model for the SDR system is complete, C and HDL code can be generated automatically for implementation on Zynq SoCs, saving time and avoiding the introduction of manually coded errors. The risk is further reduced by linking the system model to a rapid prototyping environment that allows the SDR system to be exercised under real-world conditions. This first part of the four part article series will discuss the Analog Devices/Xilinx SDR rapid prototyping system, its capabilities and benefits, and a brief description of the tool flow. The article showcases how Analog Devices RF IC technology and reference design hardware and software require a reduced design skill subset, thus enabling customers to mitigate risk and shorten their time to market.
By Di Pu, Andrei Cozma, and Tom Hill ELE Times | 43 | January, 2016
Design Figure 1. Xilinx Zynq SoC block diagram
Zynq for SDR Advanced SDR systems are required to execute a combination of data processing, communication, and user interface tasks that have different processing bandwidth requirements and real-time constraints. The hardware platform chosen to implement such a system must be robust and scalable at the same time allowing for future system improvements and expansion. Xilinx Zynq-7000 All Programmable SoCs fulfil these requirements by supplying a high performance processing system combined with programmable logic as shown in Figure 1. The combination of programmable logic and processing system delivers superior parallel processing power, real-time performance, fast computational speeds, and connectivity versatility. The processing system side of the Zynq SoC consists of a dual-core ARM Cortex-A9 processor combined with a NEON coprocessor and floating-point extensions to accelerate software execution. Embedded Linux or real-time operating systems can be deployed on the dual-core ARM processor to fully benefit from the system’s capabilities. The processor is self-contained and can be used without the need to configure the programmable logic, which is a critical element for software developers who will want to start developing code in parallel to hardware developers who will design the FPGA fabric. On the programmable logic side, the device has up to 444,000 logic cells and 2,200 DSP slices that supply massive processing bandwidth, allowing the Zynq device to tackle a variety of challenging signal processing applications. Five high through-put AMBA-4 AXI high speed interconnects tightly couple the programmable logic to the processing system with the equivalent of more than 3,000 pins of effective bandwidth.
AD9361 Agile Wideband RF Transceiver IC for SDR In recent years, Analog Devices has brought to market revolutionary SDR products to support increasingly evolving SDR
requirements and system architectures. Some of the most important Analog Devices products in this field are the AD9361/ AD9364 integrated RF agile transceivers. The AD9361 (2 Ă— 2) and AD9364 (1 Ă— 1) are high performance, highly integrated RF transceiver ICs intended for use in SDR architectures in applications such as wireless communications infrastructure, defense electronics systems, RF test equipment and instrumentation, and general software-defined radio plat-forms. The devices combine an RF front end with a flexible, mixed-signal baseband section and integrated frequency synthesizers, simplifying design-in by providing a configurable digital interface to a processor or FPGA. The chips operate in the 70 MHz to 6 GHz range, covering most licensed and unlicensed bands, and support channel bandwidths from less than 200 kHz to 56 MHz by changing the sample rate, digital filters, and decimation, all programmable within the AD9361 and AD9364 devices. Figure 2 shows the block diagram of a AD9361 device.
Figure 2. AD9361 block diagram.
In order to help customers shorten time to market and overall development effort, Analog Devices has gone a step further by providing SDR solutions within a complete ecosystem of seamless FPGA connectivity, enabling a rapid prototyping and development environment for complete radio system design. The ADFMCOMMSx-EBZ rapid development and prototyping boards are a family of high speed analog FMC modules, incorporating AD9361 or AD9364 agile RF transceiver ICs or a discrete signal chain that seamlessly connects to the Xilinx FPGA development platform ecosystem. These boards are fully customizable by software without any hardware changes and come with downloadable Linux drivers and bare metal software drivers, schematics, board layout, and design aid reference materials, all contained on their
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Figure 3. ADI HDL and software infrastructure.
Zynq SDR Rapid Prototyping Platform Reference Design Together with the FMCOMMSx platforms, Analog Devices provides a complete Vivado framework, with a Linux and bare metal software infrastructure that can be used both for prototyping purposes as well as a part of the final production system. Figure 3 shows the Analog Devices Zynq Infrastruc-ture to support the FMCOMMSx boards. This high level diagram shows how the ADI reference design is partitioned on a Xilinx Zynq SoC. An HDMI output is used to display the Linux interface on a monitor while a keyboard and mouse can be connected to the system on a USB 2.0 port. The ARM Cortex-A9 processing system runs Ubuntu Linux provided by Analog Devices. This includes the Linux IIO drivers needed to interface with the Analog Devices FMCOMMS hard-ware, the IIO Oscilloscope (Scope) user space application for monitoring and control, a libiio server that allows real -time data acquisition and system control over TCP together with clients running on a remote computer, and optional user applications that incorporate C code generated by the Embedded Coder for the controller’s Simulink model.
Software Infrastructure
All ADI Linux drivers are based on the Linux Industrial I/O (IIO) subsystem, which is now included in all mainline Linux kernels. The IIO Scope is an open-source Linux application developed by Analog Devices that runs on the dual ARM Cortex-A9 cores inside the Xilinx Zynq and has the ability to display real-time data acquired from any Analog Devices FMC card connected to the Xilinx Zynq platform. The data can be displayed either as a time domain, frequency domain, or constellation plot. Different popular file formats like comma separated values or .mat MATLAB data files are supported to save the captured data for further analysis. The IIO Scope provides a graphical user interface for changing or reading back the configuration of the Analog Devices FMC cards. The libiio server allows real-time data
acquisition and system control over transmission control protocol (TCP) together with clients running on a remote computer. The server runs on an embedded target under Linux and manages realtime data exchange over TCP between the target and a remote client. This library abstracts the low level details of the hardware, and provides a simple yet complete programming interface that can be used for advanced projects. Its modular architecture, well designed API, and built-in network capabilities allow the users to create applications that will run on the system not only where the IIO devices are connected, but also remotely through the network. At first targeted at Linux, it can now be used under Windows as well by using the remote back end of the library. Written in C and licensed under the LGPL, it features bindings for C#, Python, and MATLAB. A MathWorks IIO client is available as a system object to be integrated in native MATLAB and Simulink applications. It is designed to exchange data over Ethernet with an ADI hardware system connected to a FPGA/SoC platform running the ADI Linux distribution, which enables a MATLAB or Simulink model to perform the following functions: • Stream data to and from a target • Control the settings of a target • Monitor different target parameters
Figure 4. Screen capture of the beacon frame receiver example.
The IIO System Object is available in both MATLAB and Simulink, depending on whether the user calls it from a MATLAB script or incorporates it into a MATLAB System Block. The Linux software and HDL infrastructure provided by ADI for the FMCOMMS platforms is a great environment for proto-typing SDR applications together with the tools provided by MathWorks and Xilinx, and it also contains production ready components that can be integrated into the SDR system— helping to reduce the time and cost needed to move from concept to production. In order to help customers ramp up quickly and easily with the IIO System Object, we provide several MATLAB and Simulink examples based on this interface, such as a beacon frame receiver, QPSK transmitter and receiver, as well as a LTE transmitter and receiver. In these examples, FMCOM-MSx platforms are configured by IIO System Object, and are used as RF front ends, which transmit or receive the analog signals over the air. These signals are streamed to or from the target via the IIO System Object. All the other signal pro-cessing happens in MATLAB or Simulink. Figure 4 is a screen capture of the beacon frame receiver example, which shows a typical connection between the IIO System Object and the other Simulink blocks.
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Design
respective Analog Devices wiki sites. Table 1 summarizes the features of the different FMCOMMSx platforms.
Developing Effective Design Strategies for Today’s Wearable Devices
POWER MANAGEMENT
Warren Kurisu, Director of Product Management, Mentor Graphics Embedded Systems Division
Comprehensive Power Management As the next wave of wearable devices expands into a new class of revolutionary and innovative products, there will be a growing importance placed on the real-time operating system (RTOS) and corresponding middleware. Wearable System-on-Chip (SoC) processors require an operating system optimized for size and performance with power-efficient wireless connectivity options needed for machine-to-machine (M2M) communication and cloud connectivity. A full-featured RTOS which includes a variety of power management techniques is of the upmost importance. The Mentor Graphics Nucleus RTOS is one such operating system that offers a variety of power saving and power management capabilities. Two key power management capabilities supported by Nucleus are the Nucleus native power management framework and the Mentor Embedded Multicore Framework. This paper examines how a full-featured RTOS can assist developers in the areas of extending battery life, designing within multicore/multi-OS environments, and other areas relating to embedded system power management which include scalability, space partitioning, and connectivity.
Extending Battery Life
Battery life has long been an important feature for connected and wearable devices as the end-user has very little patience for
energy-hog gadgets requiring frequent recharging cycles. The current generation of wearables is placing new demands on reducing power consumption at a time when software complexity is rapidly increasing under system resource constraints of the wearable device. From a business perspective, companies face enormous pressure to reduce development costs and shorten time-to-market with their devices in this increasingly crowded and competitive space. Also, leveraging software investments and minimizing costs in follow-on product versions utilizing updated hardware technologies is key to the success of any wearables product line. Nucleus RTOS is the first real-time operating system with a built-in native power management framework designed to take advantage of the power management features now present in wearable SoCs. This framework allows developers to immediately address critical power issues without requiring developers to invest enormous amounts of time developing the power management software themselves. The Nucleus power management framework enables software developers to manage the power state for each peripheral, set of peripherals, or system, using simple high-level application programming interface (API) calls. Just as modern software architectures abstract hardware functions through device drivers, the Nucleus power
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With a power management framework, software developers can effectively write code to meet power requirements without spending precious development cycles that could result in code bloat (Figure 2) or increasing the size of the memory footprint. A word about bare metal: Bare metal is usually considered more efficient because it is so lightweight. However, the amount of code required to move devices in and out of various power states is complex and can add code bloat without an established framework. For example, taking the Wi-Fi off-line for a transition requires code to ensure the buffers are empty for each TCP/UDP socket, as well as IP management queues. And, the buffer descriptors for each protocol level down to the direct memory access (DMA) state must be verified before the Wi-Fi can be taken off-line. This code is complex and can often be difficult to test. Just as important, the Nucleus power management framework allows software developers to consider power specifications early in the software design cycle and enables them to define power states which can then be managed through the power management framework (Figure 3). Code can be written to minimize both the footprint and power consumption – and tested throughout the development process to ensure power requirements are achieved.
Designing and Working within Multicore/MultiOS Architectures
Figure 1: At the center of a power management framework is the device manager capability which coordinates the transition of all devices during a change to a low-power state.
Figure 2: Source lines of code: comparison between bare metal, standard RTOS, and Nucleus RTOS with power management features. Oftentimes, developers end up with far more code when working in a bare metal environment.
Wearable SoC architectures are evolving rapidly to integrate more application-class and microcontroller-class cores on a single piece of silicon. System architects see a tremendous opportunity to consolidate and extend functions on these heterogeneous multicore processors, but are finding that consolidation of heterogeneous operating environments on a single SoC presents some unique architectural and development challenges. With this type of dynamic, it’s also more difficult for developers to utilize the power-saving capabilities available in the underlying hardware. While symmetric multiprocessing (SMP) operating architectures allow load balancing of the application workload across homogeneous processors within the multicore infrastructure, they do not scale to heterogeneous cores. Further, while asymmetric multiprocessing (AMP) system architectures are increasingly required, there is a lack of accepted standards and software design paradigms to take full advantage of AMP architectures. Having certain mechanisms in place enables AMP applications to efficiently leverage parallelism offered by the heterogeneous processors present in a multicore configuration. Mentor’s multicore framework was designed specifically for these challenges and offers architects a light-weight methodology to quickly begin AMP architectural development.
The Mentor Embedded Multicore Framework
Figure 3: The Nucleus power management framework can be used to define and manage system power budgets, as in this medical wearable device example.
To address AMP complexities, the Mentor Embedded Multicore Framework (enabling AMP with the Nucleus RTOS, Mentor Embedded Linux, bare metal environments, and the Mentor Embedded Hypervisor) allows developers to configure and deploy multiple operating systems and applications across heterogeneous processor cores. This comprehensive framework enables developers to manage the many challenges associated with interprocess communication (IPC), resource management and sharing, booting, process control, debugging, and application optimization within a heterogeneous multicore environment by supporting native, virtualized, and trusted configurations of multiple operating
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Design
management framework (Figure 1) provides a structured mechanism for all system devices to be controlled using intuitive API calls. Any alteration of one device that impacts other devices results in a coordinated transition across all involved subsystems. The power management framework approaches the conservation of power usage from four different directions: • System states used to control peripheral power. • Dynamic Voltage Frequency Scaling (DVFS) focuses on the entire system. • Idle power management prevents expending energy without an ascertainable goal. • Hibernate/sleep modes allow the system to go off-line during long periods of inactivity.
Design
systems. Components of the multicore framework include:
Inter-Process Communication (IPC) Once the master processor OS and application stack are running, many use cases require communication with other parts of the system. The multicore framework provides a cleanroom, proprietary implementation of an open source remote processor messaging feature (referred to as rpmsg) to establish a communications channel between the master operating system and the remote operating systems. In this way, data can be passed back and forth between the two in an inter processor communication channel (Figure 4).
Processor Lifecycle Control and Management Assuming control over a remote processor, and then starting or stopping an OS and/or application stack within that remote processor, is referred to as remote processor lifecycle management. The Linux community has adopted a remote processor framework (remoteproc) for managing this scenario in an open source environment and now this technology is part of the Mentor multicore framework. Remoteproc allows a master operating system to bring up other operating systems on other processor cores in the same SoC. The remoteproc feature within Mentor’s multicore framework (Figure 5) allows remoteproc interoperability between numerous, disparate operating systems, such as Mentor Embedded Linux, Nucleus RTOS, and bare metal environments. A key benefit to remote processor lifecycle management is reduced power consumption. The remote processor stays in a low power state when not in use, which is a critical design requirement for wearables. When the use case of the wearable device requires more powerful processing tasks, remoteproc is used to bring up the remote processor, which increases the power consumption only for the duration of that activity.
Simplified Booting
Figure 4: The inter processor communication (IPC) channel allows data to passed between the master OS (core 0) and the remote OS (core 1) allowing for buffer allocation, payload prioritization, and configuration from device trees.
The transport layer that enables both remote processor lifecycle management and interprocess communication is made possible by VirtIO. VirtIO is a virtualization standard for high performance input/output device drivers widely adopted in virtualized Linux environments. This same technology has now been imported and tested and is fully operational in an RTOS environment, allowing a seamless system IPC mechanism that interoperates between proprietary and open source environments.
Booting a heterogeneous system is also not as simple as booting an OS on a unicore or homogeneous multicore processor. One needs a way to manage the booting of operating systems across the various cores, and to manage the applications that run on those processors. For example, performance requirements may dictate a certain boot order of the components. The multicore framework feature provides the capabilities to manage the booting of operating systems and applications across heterogeneous cores through the support for the remoteproc which can be used for open source, RTOS, and even bare metal implementations.
Visualization into a Multicore System In order to optimize performance and power consumption, developers can benefit by having a way in which to visualize how the heterogeneous components interact in the consolidated heterogeneous system. Because the systems are consolidated on shared hardware, chances of running into resource contention and bottlenecks are increased, which can hinder performance, and create unnecessary processing cycles and power consumption. Developers need tools that can help them identify those contentions and bottlenecks, and then quickly find solutions to the problems. Sourcery CodeBench with built-in Sourcery Analyzer has been integrated into the multicore framework. This means various runtime systems and graphics components, along with virtualized guest runtimes and corresponding applications can be visualized on a single common timeline.
Scalability
Figure 5: Remote processor lifecycle management allows the master OS (core 0) to bring up other OSes on other cores.
Small, battery-powered wearables require highly efficient methods that consume minimal resources and are amicable to minimizing power modes. Nucleus RTOS allows common applications to span not only a wide variety of peripheral combinations, but also allows applications to be transportable across different processor variations, families, and architectures. A reduced feature version of an application can share the same environment on an MCU device as a full-featured version would experience on a high-performance MPU platform.
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Although there are plenty of commercial RTOSes to choose from, many of these RTOSes do not provide a mechanism for embedded developers to design software that can take advantage of spatial (memory) partitioning. With spatial partitioning built into the operating system, Protected Protected Protected Protected the MPU can be easily configured at runtime Memory Memory Memory Memory to establish memory regions in both kernel and user space. Intuitive APIs can be used to Process Process Library Library load processes at runtime or dynamically based on the use-case during execution. Nucleus employs a light-weight approach to a process model (Figure 6).
challenges associated with wireless connectivity to support M2M communication and cloud integration can be a critical factor on whether a product makes it to market on time, or if the product launches at all. This is especially true for wearable systems with complex applications that use multiple wireless connections or multiple profiles on a single device. The networking features in Nucleus incorporate a wide range of standards-compliant networking and communication protocols designed exclusively for wearables supporting Wi-Fi, Bluetooth, USB 2.0/3.0, and lowpower options such as Bluetooth Low Energy (BLE) and 6LoWPAN over 802.15.4. Nucleus RTOS supports an array of chipsets and SoCs and its modular and highly structured organization provides for the ability to install additional software protocols as SoC requirements change.
Wireless It’s quite common for wireless connectivity technologies to change over the lifetime of a wearable device. The introduction of Bluetooth Low Energy (BLE) is just one example. It’s even possible that a new wireless technology will be introduced during the development cycle of a wearable design. Some wireless technologies and their distinct advantages and requirements are outlined in (Figure 7).
Figure 6: The Nucleus process model offers increased device reliability by providing hardware-enforced fault isolation.
The MPU in the ARM Cortex-M3/M4-based Nucleus RTOS SoCs can be used for spatial domain partition- ing without the need (or overhead) to virtualize memory. Processes can be loaded directly into Networking GUI File Peripheral Systems Bus Drives memory from ROM or Flash. And with prelinked embedding, processes can execute in Flash, which is a feature commonly required in MCUs with very limited RAM. Utilization of the MPU for process separation in Cortex-M-based SoCs, Ethernet / LCD Storage Connectivity Wireless provides embedded developers with a powerful Protected Memory feature to design embedded systems for wearables that gives the perception of a system being much larger on the outside than what Figure 6: The Nucleus process model offers increased device reliability by is actually available on the inside, since providing hardwareenforced fault isolation. applications can be dynamically loaded depending on the current demands on the wearable by the user. The ability to dynamically load processes in this manner allows the wearables designer to select hardware with minimum processing power and memory, which not only saves on cost, but also minimizes power consumption.
Figure 7: The more common wireless links used in today’s wearables. Ethernet included as a comparison.
6LoWPAN IPv6 over Low Power Wireless Personal Area Networks (or 6LoWPAN) is a networking connectivity technology connecting wearables to each other and to the cloud. 6LoWPAN’s low-power, IP-driven nodes, and large mesh network support make it an ideal connectivity technology for not only wearables, but for a variety of IoT applications. It supports Layer 2 packet forwarding over multiple radio hops and is compatible with Ethernet, Wi-Fi, 3G, and satellite.
CoAP Constrained Application Protocol (CoAP) is an application-layer protocol for simple, low-power connected devices allowing a device to communicate interactively over the Internet. CoAP is especially suited for devices such as wearables. CoAP is ideal for limited Flash or RAM requirements and supports DTLS for communications security.
Connectivity
For wearable embedded systems, eliminating the design
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Design
Space Partitioning
Vol 2 Issue 01 January 2016
Aerospace researchers are pursuing diverse means of endowing space systems with the intelligence, autonomy, and adaptability needed to overcome a range of future threats
Shailesh Shukla | ELE Times
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s the cyber threat evolves and the incidence of attacks increases, maintaining preparedness and situational awareness is vitally important. Customised malware, DDoS attacks and the vulnerabilities of mobile and enterprise networks all present real challenges. While we progress through IT and make a more digitalised army, the danger is of disruption through cyber attacks by the enemy. We need to enhance our capabilities to ensure that they are protected from such disruptive cyber attacks or cyber manipulations. Stating that the future wars might be fought in the cyberspace, Defence Minister Manohar Parrikar warned the Army against "information blackout" as he sought enhanced capabilities to ensure protection from disruptive cyber attacks or manipulations. Information corruption and information overload can be another danger to the platform which we use. India as a nation will be interacting with increasingly fraught with turbulence and will call for dominant military might. India needs to develop technology and system appropriate to
evolving military doctrine. Information Technology (IT) has an important role to play because future wars may be cyber wars. Though boots on the ground cannot be replaced but they can be equipped with equipment which will provide them with all the information to fight with a well decided and well planned way without getting interrupted. The terrorist organizations like ISIS are one of the best users of internet technology for promoting their cause. It is explicitly evident from the fact that the Lashkar-e-Toiba, Hizb-ul-Mujahideen, the Haqqanis, ISIS and al-Qaeda pose a very potent threat to India security in the cyberspace. As threats continue to mount, understanding and managing cybersecurity risks have become top of mind for leaders in business and government. Nations and organisations are responding by taking action. Increasingly, they are adopting innovative technologies like cloud-enabled cybersecurity, Big Data analytics and advanced authentication to reduce cyber-risks and improve cybersecurity programmes.
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Aerospace Threat
A C E & D E F E
Virtual machines offer some interesting capabilities. They can be started and stopped on demand, or paused and unloaded. The state of the paused machine can be saved as a snapshot that can later be reloaded and execution resumed. This capability provides a great benefit for forensic operations: if an attack is detected, a snapshot can be created and inspected before any malware has a chance to cover its tracks. Virtual machines have proved invaluable to malware research and analysis because they can be used to create a quarantined area for the study of malware execution. The malware can be observed without risk of spreading or infecting real systems. While virtualization has many benefits, it also carries some associated risk. For example, what were formerly multiple operating system instances on distinct pieces of hardware become virtual machines on a single physical machine. Thus, a single hardware failure can affect multiple virtual machines. All software has bugs, and hypervisors are no exception. If an attacker can exploit a bug in the hypervisor, he gains control of all virtual machines hosted on that server. What was formerly the compromise of a single server now extends to many. The weak link of a single virtual machine has the potential to affect many more. Aerospace has been active in the area of virtualization for many years. Initial efforts focused on defining data and system architectures to use as baselines for empirical studies. This work later led to the creation of a virtualization test bed in which to build and test secure virtualized applications. Some Aerospace research has focused on virtualization as a tool and not an end in itself. Researchers are investigating, for example, how functional components could be isolated into virtual machines so that a failure of one would not take down the entire system. In such a setup, malfunctioning components could be restarted with the goal of seamless operation.
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Growth Regions
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Global cyber security market for the defence industry is expected to grow significantly over the next decade. Huge investments in cloud network security solutions applicable for the battle field management, data protection, and wireless security solutions along with development of network security and cloud security software stands out as the key factors contributing to the growth of cyber security market for the defence sector.
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One of the major trends in the Global Aviation Cyber Security Market is the increased demand for cloud-based security solutions. Budget constraints and a lack of available resources and expertise are some of the main challenges for companies managing standalone or integrated network components. This is causing many organizations to look to cloud-based IT security solutions that are cost-effective, comply with PCI DSS regulations, and offer round-the-clock system monitoring.
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Demand for Cloud-based Security Solutions
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Encouraged by patterns carried out on a larger scale recently, researchers believe digital steganography has arrived as a legitimate method for attackers to use when it comes to obscuring communication between command and control servers. Steganography, or the art of hiding information inside media, isn’t a particularly new concept, but the researchers claim that malware programmers and operators appear taken with the technique as of late.
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Attackers Embracing Steganography to Hide Communication
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The defence industry has changed dynamically over the past decade. Threats from conventional insurgent activities are no longer the only concerns for the defence industry. Advancement in the field of information technology, upgradation of existing weapons with intelligence, surveillance, and reconnaissance systems along with increasing volume of classified data gathered systems have necessitated the usage of reliable and enhanced cyber security solutions for the defence industry. The aerospace, defense, and intelligence verticals are considered one of the most complex and integrated systems of information and communications technology (ICT) globally and are the most potential target for large-scale cyberattacks. With the continual and rapid integration of new technologies, aviation industry keeps expanding, changing, and becoming increasingly connected, however, so do our adversaries and their threats. And without the appropriate cyber security measures in place for this evolving threat, the industry may be at high risk. The computer based systems is used in almost every aspect of civil aviation operations – ranging from sophisticated air navigation systems, on-board aircraft control and communications systems, airport ground systems including flight information and security screening, to simply inventory and day-today office data management systems and have been going on for many years now. Similarly, cyber threats such as computer viruses and more malicious deliberate attacks on computer systems by hackers and other adversaries are not new occurrences. Hacked medical devices may be the biggest cyber security threat in 2016. through insulin pumps and pacemakers, hackers could hold your life ransom. Hackers have been using ransom ware - a type of malware in which attackers can steal or delete the contents of users’ computers if they don’t pay a ransom. Now, it seems, the same tactic may be used on insulin pumps and pacemakers.
E C N E F E D & E C A P S O R E A
Market Players The companies catering to the cyber security market can be broadly classified into security vendors, and defence companies. Security vendors consist of companies engaged in designing, manufacturing, and delivering information security products, services, and solutions to the defence and government organisations. Cisco Systems Inc., IBM Corporation, Intel Security Group, Dell SecureWorks Inc., Symantec Corporation, and Verizon Communications Inc., are some of the most prominent security vendors in the cyber security market. Defence companies engaged in developing cyber security solutions consists of leading players in the defence industry engaged in developing network security solutions and software to prevent cyber-attacks on military software systems. BAE Systems Plc, General Dynamics Corporation, Finmeccanica S.p.A., Lockheed Martin Corporation, Northrop Grumman Corporation, Raytheon Company, and Thales Group are some of the leading defence companies engaged in manufacturing such solutions, globally.
Cybersecurity Market in India Commercial impacts to the businesses due to Cyber-attacks are costing more than $400 billion yearly. Market research firm Gartner says global spending on IT security is set to increase 8.2 percent in 2015 to $77 billion, while India has the world’s second largest population, and a very small cybersecurity economy. But it is a nation to watch for cybersecurity market growth. According to a PwC report India’s cyber security market size in India will jump to $1 billion USD in 2015 (from an estimated $500 million USD last year) which is anticipating as 100 percent year-over-year growth. The aviation sector is currently seeing high demand for cyber security solutions to protect critical information and detect, monitor, report and counter cyber threats while maintaining the integrity of IT systems. While aviation only accounted for 2.32 percent share of the overall cyber security market in 2014, the Global Aviation Cyber Security market is witnessing significant growth and is expected to grow at a CAGR of 5.94 percent from 2014-2019.
Upcoming Trends The current cyber security market encompasses a variety of solutions ranging from network security solution to endpoint security, application security, content security, cloud security, and wireless security solutions. These solutions have the capability to perform individual tasks and can be integrated together to form a strong line of defence against sophisticated threats in a multi-layered fashion. Sophistication of cyberattacks from worms and viruses to enhanced techniques such as zero-day attack, Dynamic Trojan Horse Network (DTHN) Internet worm, and Stealth Bot led the cyber security vendors to design upgraded security software and solutions such as the Integrating Basic Unified Threat Management systems, Security of Information Management (SIM) software solutions, network flow analysis, Next-Generation Firewalls (NGFWs), Security Information and Event Management (SIEM), white listing, and DDoS mitigation techniques. Rising threat of cyber-attacks to critical infrastructures by
organised criminal groups along with technological advancement in the cyber security market remains as the key driver for the growth of cyber security solutions for the defence industry. The defence and the homeland security agencies are expected to cover around 40% share of the global cyber security market in 2015. Growth in investments on military programs and allocation of resources for research and development of cyber security solution for the battle field communication systems is expected to remain as the most upcoming trends in the cyber security market for the defence industry over the coming years. Emerging technologies have the potential to change the way information assurance and mission resilience are achieved. The Aerospace agencies have been investigating various technologies that may eventually influence the development of space and cyber systems. Some of these include virtualized computers, protected terrestrial networks, cognitive radios, and biologically inspired mechanisms. These technologies may seem unrelated, but when considered collectively, they suggest the sort of grand synthesis that space and cyber systems will need to achieve in the coming years.
Virtualization Traditionally, computer hardware runs a single operating system that runs user applications. Virtualization inserts another layer of software between the hardware and operating system, a “hypervisor.” The hypervisor implements and manages virtual machines, which allow the installation of operating systems and associated applications. The hypervisor manages and allocates the physical hardware to support concurrent operation of multiple virtual machines and therefore multiple operating systems. Each virtual machine is partitioned from the others to prevent interference. Virtualization is a powerful technology with many applications. It is a fundamental part of cloud computing, providing the flexibility to handle dynamic workloads. But as with any technology, there is a cost in terms of price, performance, and risk. These need to be considered when deciding if virtualization is the correct tool for the job.
Using Satellites to Protect Terrestrial Networks
ELE Times | 52 | January, 2016
A
The need to protect networks from advanced cyber threats has led companies worldwide to adopt multiple security solutions, which has increased the complexity of IT infrastructure. To mitigate the effects of such complex infrastructure, companies are opting for converged security solutions, which is boosting the market for solutions like unified threat management and next-generation firewalls.
National Cyber Coordination Centre
P E & D E F
While the defence industry tends to be program focused and slow moving, the cyber security market is technology driven and is growing very rapidly. With increasing dependency on internet network by the military organisations, the frequency of sophisticated and organised cyber-attacks is on the rise. Hence, the major focus of security vendors and defence organisations in the cyber security market should be to design enhanced cloud computing solutions, operating systems, and virtual machine technologies aided with highly reliable and breach free software systems with an aim to defend their cyber space against cyber-attacks from clandestine state and non-state activist groups in the near future.
C
Conclusion
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Government of India has approved setting up of the National Cyber Coordination Centre (NCCC), which will screen online threats and coordinate with the intelligence agencies to handle issues related to the national security. Elaborating on its structure, the official said that the instructions are to create a group of cyber security professionals and experts who will look after the functioning of the centre and track illegal and terror activities online. This centre will have top experts from the field and it will be run like similar organisation in other countries such as the US, the UK, France, Germany, etc. NCCC is expected to coordinate between intelligence agencies, specifically during network intrusions and cyber attacks.
S
Using Biology to Inspire Cybersecurity Strategies
Technological Convergence
O
The U.S. military’s trend toward more combat units comprised of smaller teams has generated an unprecedented increase in the number of required communication links. To meet the increased demand, the military relies on unhardened, commercial satellites. A recent study reported that 21 out of 50 ground-to-commercial-satellite interference incidents could not be accounted for. On the basis of geographic location and transmission type, the authors concluded that intentional jamming was a likely cause. In a sense, jamming represents a denial of the cyber domain and is therefore a form of cyber warfare that targets the physical layer of a communication system.
R
Cognitive Technologies
to autonomously monitor their operational environment and adapt accordingly. Aerospace has been investigating how the study of biological systems can lead to greater autonomy and adaptability in cyber systems. More specifically, researchers are examining whether the means by which a biological system recognizes and protects itself can have implications for cybersecurity.
E
In addition to research into virtualized machines, Aerospace has been exploring the dynamics and security implications of controlling large networks. The Internet, for example, is not actually a single network, but an aggregation of smaller, autonomously managed networks (known as domains) connected in such a way that a user of one domain can communicate with a user in any other domain. The key to this universal connectivity is that all of the routers—the switching devices that bridge two or more networks—must collaboratively teach each other how best to forward traffic.
E N E
ELE Times | 53 | January, 2016
C
Algorithms known as problem managers use the Wrappings descriptions to determine which resources to use, how to combine them, and how to organize the system’s computational resources in response to problems posed to it. In practice, several problem managers might operate on a problem. A primary benefit of cognitive radios is their ability
flexible electronics
Paving the way for technologies of the future
T
Shloka Chauhan | ELE Times
he market for flexible electronics is growing exponentially. According to estimates the current market is set at one billion dollars; which is going to rise to 45 billion dollars by 2016.This estimated meteoric rise in the market for flexible electronics is the due to the unprecedented, life-altering potential of these flexible electronics and the extensive research and development that is going on in this extraordinary field if innovation. Flexible electronics are electronics that are not only durable, but pliant as well, that can twist and bend and fold, like a contortionist, according to our needs and our will. In this technology, organic electronic components are mounted on pliable, conductive, plastic substrates or are printed on polyester or other materials; to make the whole thing or parts of it flexible and bendable. It allows more components to be packed or printed in a circuit than normal. Flexible electronics are paving the way for a future with flexible displays and smart textiles, a future where you could stretch your charger chord to any length and then compress it back according to your need, or where you could carry foldable flexible displays that could fold out as large as a television, or where you could have foldable and flexible photovoltaic cells and reconfigurable antennas- that would conform to the roofs and trunks of your cars to power them, or sown to your clothes or bags- to charge your phones while
you are walking on the street, and to make sure that you are online no matter what remote destination you are in. The list of potential technologies and innovative devices and equipments that flexible electronics is going to bring into our lives, is endless. Along with these innovations flexible electronics is also going to bring us cheap, scalable, wearable communication devices that will be rugged and durable, bendable and foldable. Researchers are developing the technology through which electronic components would be printed on long plastic sheets, in an assembly line, as they move through a factory. A printer would do this by applying different inks onto the film. “As the inks dried, they would turn into wires, transistors, capacitors, LEDs and all the other things needed to make displays and circuits�, as Thomas N. Jackson, the Robert E. Kirby Chair Professor of Electrical Engineering at Penn State University explains on the Penn State University website. Flexible electronics is going to change the basics of how electronics are made. Printed electronics is going to completely transform the electronics manufacturing sector by lowering production costs significantly. Conventional semiconductors require complex processes and multi-billion dollar foundries but if they were to be printed on plastics the same way ink is printed on newspapers the cost of production will go down drastically.
ELE Times | 54 | January, 2016
India‘s no.1 exhibition on LED lighting products & technologies 12 — 14 May 2016 Bombay Exhibition Centre, Mumbai www.theledexpo.com
Bookings now open! For more information, please contact: Himanshu Chitnis +91 22 6757 5980 | +91 98210 69124 himanshu.chitnis@india.messefrankfurt.com Deepika Jeet Kaur +91 11 6676 2340 | +91 97177 70404 deepika.kaur@india.messefrankfurt.com Vaibhav Bhamare +91 22 6757 5963 | +91 98211 33442 vaibhav.bhamare@india.messefrankfurt.com
Future Technology
The potential applications and future technologies Flexible electronics are going to have a wide range of applications because of its adaptability and conductivity. These preliminary R&D’s are something that is going to start a chain reaction which will see the growth of revolutionary future technologies that will have huge commercial applications. Here’s a look at some future technologies and innovations that are soon going to be realised, because of flexible electronics-
The future innovations that flexible electronics will bring will have the potential to make the lame walk and the blind to see
1:In Medicine and health Consider surgery to remove a tumor from a patient's liver. Even after following up with radiation or chemotherapy, the surgeon is never sure if the treatment was successful. But now through flexible electronics doctors could image the cancerous tissue and clearly see if there is a new malignancy, and then wirelessly release a drug directly onto the spot or heat up that tissue to kill the malignant cells. A research team at MIT ha35s developed a highly versatile matrix of stretchy hydrogel that can incorporate electronics, and has various potential uses in healthcare. They have designed hydrogel in a way for it to possess similar mechanical and physiological
use electronic implants to emit light in order to manipulate neural circuits in the brain and the spinal cord to reduce pain. Researchers at Washington University in St. Louis have been testing these implants on mice and have got excellent results in mapping sensory information in the spinal cord.
2:In prosthetics
Our smart phones and other electronic devices will now not only be durable but also bendable, foldable and potentially rollable, not to mention cheap properties as the brain, which will allow electronics to be implanted into our bodies and even our brain. An envelope of hydrogel will allow for the implants to behave like smart tissues that would relay information and perform diagnostic functions. Researchers are also in the process of developing electronic implants that will be soft and flexible and tissue-like in its structure, which would make it easier for electronic tags to be implanted. These implants can be left in the body for long periods of time. They could then be used to not only to monitor the health of patients but to take action and release medicine and drugs. Treating chronic pain is also going to get easier, thanks to flexible electronics. Researchers in the field of Optogenetics are hoping to
Research and the use of flexible electronics in the field of prostheses is going to make captain hook even more ridiculous and alien to the children of today, the days of metal-hook hands and wooden legs are long over. Robotic limbs have changed the lives of millions of amputees, they have allowed amputees to walk and carry on daily tasks. But robotic limbs don’t come close to the real things that give us the sense of touch along with the usual paraphernalia of uses and functions. Engineers at Stanford University and the Palo Alto Research Center have created a plastic skin-like material that can detect pressure and deliver a Morse code-like signal directly to a living brain cell. This skin can be added to artificial limbs that may allow a person with a prosthetic hand to actually feel a handshake. The engineers have created artificial mechanoreceptors that mimic the complex process through which our skin detects the sense of touch. To the prosthetic “skin,” the scientists combined a pressure sensor with a flexible circuit layer that produces electrical pulses. The sensors are made of flexible pyramidshaped nanotubes that funnel electric currents to the circuit layer. The circuit layer, made of plastic, is created from ink-jet printing. When pressure increases, the nanotubes compress and electricity flows through the sensors and the circuit layer. This produces electrical pulses, and the number of pulses is determined by the level of pressure—just as mechanoreceptors work in real skin. The researchers tested their design by connecting a prosthetic hand fitted with their artificial “skin” to a slice of brain from a mouse. They genetically engineered the neurons in the brain that normally react to touch, so they would also react to light. The scientists found that light stimulation to the skin produced neuronal activity. The researchers say this indicates that the manmade material would potentially be able to transmit physical sensation as well. “If the brain is following the light pulses, that
ELE Times | 56 | January, 2016
Driving manufacturing processes of the future
Platinum partners
7 – 9 April 2016 Helipad Exhibition & Convention Centre Gandhinagar (Near Ahmedabad), Gujarat, India www.spsautomation-india.com
Silver partner
Supported by
Tradeshow on Automation & Control System Integration Solutions for the following industries: • Automobile
• Food Processing
• Oil & Gas
• Textile
• Ceramics
• Energy
• Govt. Contracts
• Packaging
• Telecom
• Pharma
• Plastics
• Aviation
• Material Handling For further details, kindly contact: +91 22 6144 5913 sonam.kanal@india.messefrankfurt.com
Future Technology
mean the brain understood the information,” explains Zhenan Bao, a professor of chemical engineering at Stanford and the lead author on the paper. “The next step we want is to do such experiments in live animals, and increase the complexity to add other sensing functionalities,” says Bao. That could mean creating skin that can feel temperature or texture rather than just pressure. “But how humans will actually react and how the signal will be perceived—that requires experiments in the future.” Research in this field is going to be a boon for paraplegics.
3: Making Structures safer If you have a fear of flying then rest assured, you were born in the right century. Innovations in flexible electronics is going to make your life much safer, flexible electronics is going to facilitate the production of sensors that could be attached to the curved surfaces of airplanes which could monitor the state of the aircraft and morph to adapt to changing flight conditions. Similarly flexible, smart and super-durable sensors could be built that could be attached to the blades of colossal windmills and on bridges. These flexible sensors would monitor the vibrations of the wind-mills, bridges and dams and warn us when these structures needed maintenance.
4:Robotics Researchers have been developing very tiny flying drones that could find potential use in surveillance. These tiny drones have been modelled on miniscule insects, like the housefly. These spy drones also have the 360 degree vision of insects to help them from colliding into buildings and electric poles. Insect-like miniature robots are no longer some fantasy technology that you only find in sci-fi Hollywood movies and comic books. These drones will have miniature navigation systems that would use flexible electronics to fit the components into the confined space, and will have small and lightweight, flexible digital cameras, which will be highly sensitive to light changes as they move to alert them of any obstacles in their way. These drones will also have sensors, weighing only two milligrams which will take up only two cubic millimetres, and will be able to detect motion in conditions ranging from a poorly lit room to very bright sunlight outdoors—three times faster than fast flying insects.
5: Solar power Organic solar cells that use organic flexible electronics will provide a pathway toward low-cost, clean energy. These solar cells will be lightweight and mechanically flexible, making it possible, to integrate them into curved surfaces, and possibly making them rollable and foldable increasing access and making them easier to use. This will allow more and more people to satisfy their domestic electric power needs through this cheap, renewable and convenient source.
6: Wearable electronic devices OLED displays have already been making a buzz in the electronics arenas for a while now and they have opened the gates for flexible electronics to have large scale commercial applications. OLED’s consist of organic semiconductors approximately 100 nm thick, that emit light due to the
electroluminescence. While regular LEDs are usually fabricated on a glass substrate which makes them rigid and non-bendable, but by replacing glass with a flexible plastic such as polyethylene terephthalate (PET) among others, OLEDs become bendable and lightweight. Now, academics at the University of Manchester, have come up with communication devices such as mobile phones and healthcare monitors, made of cheap, flexible, wireless graphene that can be directly printed into clothing and even skin. This breakthrough paper, which was published in Scientific Reports, demonstrates how graphene can be crucial to wearable electronic applications because of its highly-conductive and ultra-flexible nature. This research is going to pave the way for smart, battery-free healthcare and fitness monitoring, phones, internet-ready devices and chargers to be incorporated into clothing and ‘smart skin’ applications .The researchers printed graphene to construct transmission lines and antennas and experimented with these in communication devices, such as mobile and Wifi connectivity. Using a mannequin, they attached graphene-enabled antennas on each arm. The devices were able to ‘talk’ to each other, effectively creating an on-body communications system.
Conclusion Printed flexible, organic, electronics is going to revolutionize technology and make the electronic devices that are now high end products, dirt cheap, and much more efficient and convenient. The benefits of these new electronics are going to be numerous ranging from lower cost, improved performance, flexibility, transparency, reliability, to better environmental credentials and much more. The ongoing research is going to create new and exciting applications for the technology, which all technology and electronics enthusiasts are going to eagerly wait for. In the meantime, all existing electronic and electrical products that we are now using will see a complete overhaul. Flexible electronics is only going to aid us in our quest to be constantly hooked to our electronic devices. Wearable, foldable smart phones, prosthetic limbs, wearable monitoring devices, etc are no longer something that our great grandkids will use, way off in the future. The technology is in the making and it will once again end up transforming our lives completely.
ELE Times | 58 | January, 2016
adds interesting features to boost energy sector ELECRAMA, the world electricity forum, has now turned into a movement, beyond just an exhibition. It is a premier show of Indian Electrical Sector and is the World’s largest confluence of the power transmission and distribution community. Held biennially since 1990 in India, the eleventh edition ELECRAMA-2014 hosted 970 exhibitors from India and across the world and also attracted 100,000+ footfalls into the exhibition. In the last two decades ELECRAMA as an exhibition featured the biggest names in the global electrical T&D industry, to whom it serves as the perfect launch vehicle to introduce latest products and technology. ELECRAMA showcases products and technology through the entire voltage spectrum, from 220 V to 1200 kV, conforming to global standards and specifications. A large number of business and technology partnerships are also transacted during the 5 day period giving it a must attend event status amongst global exhibitions. ELECRAMA visitors consist of a wide spectrum of industry stakeholders, offering them an international framework for display, discussions and deliberations. It brings together manufacturers and suppliers to interface with key customer segments like private and public transmission and distribution utilities, EPCs, Consultants and specifiers, members of the government and policy makers. It also brings together global thought leaders in the electrical transmission and distribution sector consisting of industry leaders, engineering professionals and technologists, professionals and academia, et al through high power panel discussions, premier conferences, technical workshops, tutorials and seminars held concurrently with the exhibition. ELECRAMA also hosts international diplomatic and trade visitor delegations from various countries and large country pavilions from leading manufacturing nations from around the world. The Government of India participation is reinforced with the presence of four senior ministers. The ministers who have lent their consent to be present during the event are Suresh Prabhu, Minister of Railways, Kalraj Mishra, Minister of MSME, Anant Geete, Minister of Heavy Industries and Public Enterprises and Piyush Goyal, Minister of Power who would also be inaugurating this grand event. ELECRAMA is a stellar platform for a world view on technology, best practices, new systems and forecasting the trends in the future of electricity, both from technology and a socio-economic point of
view. ELECRAMA will for the first time feature “WORLD UTILITY SUMMIT”, a unique global platform like no other. This ‘By Invitation Only’, event is ‘of the utilities, for the utilities and by the utilities’. CXOs of more than 50 global utilities are being invited to participate in the two day summit to interact with CXOs of Indian utilities and share their experiences and best practices. ‘Network to Networth’ is another new interesting and necessary addition to ELECRAMA 2016. N to N is planned for creating awareness about the huge investment and JV opportunities in the Indian electrical sector for both Global and domestic investors. ELECRAMA for the first time features unique experience pavilions displaying, ”Energies of Tomorrow” and “Evolution of 125 years of Electricity”, in collaboration with IEEE, a coffee table book on this subject is also under preparation. RND – Railway, Nuclear & Defense pavilion is also planned for the first time at ELECRAMA to enable interaction between Industry and these critical sectors displaying their strengths, capabilities, services and plans in this specially dedicated pavilion. Renewable Energy pavilion is another addition under planning for displaying the strengths of the Indian Industry in the renewable sector. Contemporary Events which have added strength to ELECRAMA over the years continue to feature. The third edition of Reverse buyer Seller Meet, supported by the Ministry of Commerce, Govt. of India continues to generate large scale business opportunities. 8000+ meetings with 600 overseas buyers from 42 countries are planned over two and half days of this event. ‘Engineer Infinite’ in ELECRAMA 2016 will feature 50 most innovative third year student projects in the electro mechanical segment, for encouraging young budding engineers from across the country. A subset to this activity is “Coffee with Sir”, where participating students listen and network with industry leaders over all five days. The 5 best student’s projects are awarded by an industry leader at the “Innovation Day’. International T & D conclave, another Co-located event has been planned as a half day event in its third edition. It provides a unique opportunity for Indian industry and it’s stakeholders to listen to and interact with global experts from the energy sector.
ELE Times | 59 | January, 2016
Trade Fair Report
High-growth prospects of Indian manufacturing sector opens up valuable opportunities for automation and technology players
With the new phase of Indian manufacturing slated to be technology intensive, the country’s manufacturing sector, projected to touch USD 1 trillion by 2025,opens up invaluable opportunities for automation and technology industry players. Against this optimistic background, German companies Mesago Messe Frankfurt GmbH and P. E. Schall GmbH & Co KG together with Messe Frankfurt Trade Fairs India Pvt Ltd have come together once again to organise the second edition of the SPS Automation India, Motek and Control India in Gujarat. The three trade fairs, which draw attention to high-quality manufacturing technologies for the Indian market, envisages to bring the Indian manufacturing sector a step closer to government’s ‘Make-in-India’ vision by bringing the required technology in industrial, factory and process automation as well as quality control solutions from the world’s leading technology companies. This premium business event for the manufacturing sector will take place from 7 – 9 April 2016 at the Helipad Exhibition and Convention Centre, Gandhinagar, Gujarat. India is moving from being a costconscious market to a value-based market striving for operational excellence. Seeking resource and performance enhancing solutions, manufacturers today are ready to invest in automated processes. The automation market in the country has been continually witnessing development and requirement of customised solutions by combining old technologies with new intelligent processes. In keeping with the technology needs of the Indian market, SPS Automation India 2016 will be dedicated to industrial automation and applied solutions whereas Motek India will cover automation in
production and assembly line. Control India, on the other hand, will cover solutions in inspection and quality assurance. Together, the three shows will feature all aspects of manufacturing technologies to attain greater productivity, efficiency, quality and safety – the key to global competitiveness.
Co-joint fairs re-locate to Helipad Convention and Exhibition Centre
The fairs which made their debut in Gujarat early this year had strong support from industry associations as well as Gujarat government and saw 2,858 decision makers and business visitors networking and matching their business requirements with leading industry brands on over 3,500 sqm of exhibition space. Going by the successful response, the organisers have decided to double up the exhibition space and participation level for the second edition as well as bring in wider participation in the Motek and Control segment. As part of strategic planning for the 2016 edition, the shows have also been relocated to the state-of-the art Helipad Convention and Exhibition Centre in Gandhinagar, Gujarat which offers convenience and ultra-modern facilities with better connectivity. The fairground is also ideal for live demonstration of heavy machinery and equipment. Referred as one of ‘Asia’s biggest investment infrastructure opportunity centre’, Gujarat has been a frontrunner in industrial development of petrochemicals, automobiles, pharmaceuticals, gems and jewellery, textiles, education, hospitality and urban infrastructure sectors making it an ideal location to create a business arena for manufacturing sector players and technology solution providers.
Visit: www.spsautomation-india.com; www.control-india.com; www.motekindia.com
ELE Times | 60 | January, 2016
Deployments with ARM mbed and Maxim Microcontrollers Maxim Integrated’s low power MAX32600MBED brings integrated security and precision analog to the IoT.
With the addition of MAX32600MBED to the ARM mbed IoT Device Platform program, mbed engineers and IoT developers can quickly develop embedded Systems based on the MAX32600 microcontroller (MCU) from Maxim Integrated Products. To make it easier and faster to design Internet of Things (IoT) applications with differentiated silicon, Maxim has developed software libraries and development hardware for its MCUs to be prototyped Through mbed. MAX32600MBED includes a MAX32600 ARM Cortex‐M3 based microcontroller, Prototyping area with adjacent access to precision analog front end (AFE) connections, I/O access through Arduino-compatible connectors, additional I/O access through 100mil x 100milheaders, USB interface, and other general purpose I/O devices. Key Advantages: • Fast time to market: Ease of design with access to software, tools, infrastructure, and support community • Integrated security: On-board trust protection unit • Low power: 175µA/MHZ with full SRAM retention in 1.5µA standby mode “Maxim has been making microcontrollers for a long time for
Microchip Launches PIC32 MPLAB
specific markets; now with our mbed supported platform, we’re opening up our technology so any developer and any application can make use of our security, analog, and low power technology,” said Kris Ardis, Executive Director for Micros & Security, Maxim Integrated. “We will continue to support the mbed ecosystem on upcoming Maxim microcontrollers, enabling any designer to build secure, power-conscious Internet of Things applications.” “Trusted products are required for enterprises looking to take advantage of IoT deployment for efficiencies,” said Zach Shelby, Vice President of Marketing, IoT Business, ARM. “Maxim’s offering brings secure, low power, mixed-signal microcontrollers to ease the development path to IoT products, and this will be welcomed by the growing mbed community.” Availability and Pricing: The MAX32600MBED development platform is available for $49 at Maxim’s website. • Details for MAX32600MBED: http://bit.ly/MAX32600MBED • MAX32600MBED hi-res image: http://bit.ly/MAX32600MBED_image • Start designing now: http://bit.ly/MAX32600MBED_ARM_mbed
Contact: Joy Zhao, +86 10 52264215, email: Joy.Zhao@maximintegrated.com
New Power MOSFETs from STMicro
Harmony Ecosystem Development Program Enable Smaller, Greener Microchip Technology Inc., has announced its MPLAB® Harmony Ecosystem Program for the developers of embedded middleware and operating systems who are seeking to unlock the business potential of Microchip’s 32-bit PIC32 MCU customer base. MPLAB Harmony is the industry’s most comprehensive 32-bit microcontroller firmware development framework, which integrates licensing, resale and support of Microchip and third-party middleware, drivers, libraries and real-time operating systems. This new Ecosystem Program builds on that framework by offering an open and structured method to become certified as “Harmony Compatible”, using the embedded-control industry’s only set of test harnesses, checklists and reference validation points. Microchip’s MPLAB Harmony framework for its PIC32 MCUs can reduce the development time of a typical project by a minimum of 20-35 percent, by providing a single integrated, abstracted and flexible source of tested, debugged and interoperable code. Additionally, MPLAB Harmony provides a modular architecture that enables the efficient integration of multiple drivers, middleware and libraries, while offering an RTOS-independent environment. Not only does this preverification and integration speed development, it also increases reuse. On the hardware side, the MPLAB Harmony framework makes it even easier to port code, thereby simplifying migration among all of Microchip’s 32-bit PIC32 microcontrollers, enabling a highly profitable, multi-tiered end equipment offering with minimal code redevelopment.
Automotive Power Supplies STMicroelectronics has introduced a new family of high-voltage Nchannel Power MOSFETs for automotive applications. These AEC-Q101-qualified devices are built using ST’s state-of-the-art MDmesh™ DM2 super-junction technology with fast-recovery diode. The devices feature a breakdown voltage over the 400V-650V range and are housed in D2PAK, TO-220, and TO-247 packages. ST’s new Power MOSFETs offer the best performance in both Trr / Qrr and softness factor in the automotive market, while they are also among the best in turn-off energy (Eoff) at high currents, improving efficiency of automotive power supplies. In addition, excellent fast body-diode performance reduces EMI issues, allowing the use of smaller passivefiltering components. In this way, MDmesh™ DM2 technology enables greener power design by reducing wasted energy, maximizing the efficiency, and minimizing the form factor of the end products. Key technical features of ST’s new automotive Power MOSFETs include: • Fast-recovery body diode • Extremely low gate charge and input capacitance of 44nC and 1850pF, respectively, for a 500Vdevice in D2PAK • Low on-resistance • Best Reverse Recovery Time (Trr): 120ns @ 28A for a 600Vdevice in TO-247 and 135ns @ 48A for a 650Vdevice in TO-247 • Gate to Source zener-protected
ELE Times | 61 | January, 2016
Products
Enable Rapid Prototyping for Commercial IoT
Products
Mouser Kicks Off 2016 IoT Design Contest with Murata and Broadcom Mouser Electronics Inc., announced the launch of the 2016 IoT Design Contest, sponsored by Mouser, Murata, and Broadcom. The contest challenges engineers, students, and hobbyists to unleash their creativity by designing projects that use Murata and Broadcom components. “India is host to one of the fastest-growing electronics design and manufacturing sectors, and IoT is a booming trend,” says Mark Burr-Lonnon, Senior VP, EMEA & APAC Business, Mouser Electronics. “Mouser proudly sponsors this design contest, which is all about thinking differently to create innovative designs. We can’t wait to see the next generation of ideas that Indian designers bring forward.” Mouser Electronics, the industry leader in new product introductions (NPIs), is sponsoring the IoT Design Contest to motivate and support engineering innovations for Internet of Things (IoT) applications. Designers of the top 100 projects will gain access to free-of-cost Murata and Broadcom components from Mouser, including: • Murata PKGS shock sensors • Murata Board Mount Barometric Pressure Sensors • Murata Type YD-Certified Wi-Fi module • Murata UMAC Series small energy device • Broadcom WICED™ Sense Bluetooth® Smart sensor development kit • Broadcom BCM92073X_LE_KIT WICED SMART™ development kit • Broadcom WICED SMART Bluetooth System-on-Chip (SoC) Those designers will then be eligible for other prizes throughout the contest, including three grand prizes. For more information
Emerson Launches New Transformer free UPS Maximizing Energy Savings Emerson Network Power, the world’s leading provider of critical infrastructure for information and communication technology systems, announced the availability of their new Liebert® uninterrupted power supply (UPS) system. The company has further bolstered its product portfolio by introducing the new Liebert® GXT MT+ 10/20 kVA 3×1 UPS system in India. Targeted at IT Resellers and VAR’s(Value Added Resellers) in India, the new product is a transformerfree UPS offering a compact, efficient and reliable solution to protect modern electronic gadgets. The availability of the true double conversion online backup power feature on this new UPS system makes it a reliable and yet uninterruptible power supply source for optimal running of small data centers, data networks, voice networks and process automation equipment, even in harsh power environments. With a capacity of 20 kVA and battery backup, it has provisions for extra battery cabinets which can be added for an extended run time in case of power supply failure. Another key highlight of the Liebert UPS is, whatsoever the quality of the power coming in, the good output ensures that the equipment remains protected at all times, making it a good option for businesses when looking out for secure power management apparatus. With an output power factor of 0.9, this is a best in class UPS system, that assures maximum reliability, highest efficiency and energy savings making it best suited for mission critical applications as it offers full protection from damaging power problems which includes outages, spikes, surges, noise, and voltage fluctuations.
visit: http://www.mouser.in/india-iot-design-contest/.
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ELE Times | 62 | January, 2016
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Digital innovation for a clean future – emissions monitoring in vehicles India, 21thDecember 2015 -HARTING IIC MICA from HARTING is a modular platform comprising openhardware and software components whichcan be adapted quickly and cost-effectively to many industrial areas of application. The Swiss automotive manufacturer Rinspeed is now also deploying HARTING IIC MICA. Rinspeed’s “Etos”concept car is fitted with HARTING IIC MICAfor independent emissions and status monitoring. This digital innovation therefore aimsto ensure a clean future. The intelligent mini-industrial-computer MICA manufactured by the industrial connectivity specialist HARTING illustrates how drive and engine data can be continually recorded and transmitted and then
evaluated and processed by an independent, neutral body (Dekra),as agreed beforehand by the customer and contracting partner. It also allows statements on the credibility of mileage status to be made. “MICA can be quickly and easily integrated into a wide range of vehicles. Its installation in the Etos is an excellent example of this,”remarked Dr. Jan Regtmeier, Director of Product Management at HARTING IT Software Development. The MICA will embark on a roadshow over the coming weeks and will be on display at the CES in Las Vegas (5 to8 January 2016), the Hannover Messe Preview (27 January 2016), the Geneva Motor Show (3 to13March 2016) and the Hannover Messe (25to 29 April 2016).
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239, Lajpat Rai Market, Delhi-110006 Telephone : 011-23867631, 23860623 M: 9873847233, E-Mail : seleshgupta@yahoo.co.in ELE Times | 63 | January, 2016
Products
Rinspeed's Etos concept car deploys HARTING MICA
Products
3D Image Sensor Chips REAL3 of Infineon Bring Virtual Reality to the Smartphone In the future, mobile devices will be able to quickly and realistically detect their surroundings in three dimensions. When they do, it will be thanks to the 3D image sensor chips from Infineon Technologies AG and pmdtechnologies. REAL3™ will enable extremely realistic virtual and augmented reality game experiences that involve the interaction of the gamer’s own hands and his living environment within the game, via headmounted devices.
Infineon and pmd will be showcasing the latest 3D image sensor chip of the REAL3 family at the Consumer Electronics Show (CES) 2016 in Las Vegas. The optical pixel sensitivity of the new 3D image sensor chips are now double that of the previous version, thus the camera’s system power consumption is almost halved. Google’s “Project Tango” using Infineon's IRS1645C 3D image sensor chip Infineon and pmdtechnologies are joint partners in Google’s “Project Tango”. With “Tango”, cell phones and tablets are equipped with a special optical sensor system for 3D perception, which includes a 3D camera with Infineon’s IRS1645C 3D image sensor chip. Applications are augmented reality, indoor navigation and three-dimensional measurement. The 3D image sensor chips
operate with infrared light and use the time-of-flight (ToF) measuring principle: For each of its pixels, the 3D image sensor chip measures the time the infrared light takes to travel from the camera to the object and back again. At the same time, each of the pixels also detects the brightness value of the objects. The IRS1125C will be available in volume as of first quarter of 2016. The start of production for the smaller IRS1645C and IRS1615C is planned for the second quarter of 2016. All three types are exclusively delivered as a bare die to allow maximum design flexibility while minimizing system costs.
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e-mail: jit_maruti@yahoo.co.in, maruti_elec53@rediffmail.com
ELE Times | 64 | January, 2016
Featuring green lighting technology 5 – 7 October 2016 Pragati Maidan, New Delhi, India For bookings please contact: Rasheed Anwaar +91 99901 01000 | rasheed.anwaar@india.messefrankfurt.com Himanshu Joshi +91 85869 26107 | himanshu.joshi@india.messefrankfurt.com
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Who will prevent downtime and equipment failure?
You and NI will. With an integrated platform that combines flexible, rugged hardware with intuitive software, NI helps organizations improve operational efficiency by providing systems that monitor and analyze rotating equipment. With advanced I/O, complex signal processing, and data analytics and visualization capabilities, NI puts you on the cutting edge of the Industrial Internet of Things and connects equipment, people, and technology like never before. See how at ni.com/mcm. NI Systems (India) Private Limited Phone: 1800 103 9449 (Toll Free) | Email: ni.india@ni.com Š2016 National Instruments. All rights reserved. LabVIEW, National Instruments, NI, and ni.com are trademarks of National Instruments. Other product and company names listed are trademarks or trade names of their respective companies. 22316