Evatec LAYERS 4 2018-19 - Advanced Packaging

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Advanced Packaging

Andreas Erhart Senior Product Marketing Manager Andreas trained as an industrial engineer before completing his executive MBA in the UK in 2005. He has more than 20 years of experience in international sales, marketing and business development in electronics and semiconductors including 10 years based in China & Taiwan. His focus at Evatec is on applications like UBM/RDL, Fan Out and other composite substrates including FO Panel Level Packaging.

Roland Rettenmeier Senior Product Marketing Manager Roland is a mechanical engineer and completed his executive MBA studies in Austria in 2005. He has been working in the electronics and semiconductor environment and driving international business development since 2001. He joined Evatec in 2017 and is concentrating on business development for emerging applications like EMI Shielding, IC-Substrate manufacturing and FO Panel Level Packaging.

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