Thin Packaged IC’s enabling a new evolution in electronics. Semiconductor-on-Polymer™ (SoP) technology is set to rise to prominence for thin Flexible Hybrid Electronics (FHE) by 2020 as consumers seek revolutionary experiences. Booth 516 Henkel Corporation 14000 Jamboree Rd. Irvine, CA 91626 Phone: +1-949-344-6688 Fax: +1-714-368-2265 www.henkel-adhesives.com/us/en/ Contact: Eva Laus Email: electronics@henkel.com Henkel is the premier materials supplier for the electronics assembly and semiconductor packaging industries. Our advanced formulations include a range of products that facilitate electrical interconnect, provide structural integrity, offer critical protection, and transfer heat for reliable performance. We’re proud to create products that improve today’s electronic technologies and enable tomorrow’s advances. Booth 100 Heraeus Electronics 24 Union Hill Rd Conshohocken, PA 19428 Phone: +1-610-825-6050 www.heraeus-electronics.com Contact: James Wertin Email: james.wertin@heraeus.com Heraeus Electronics provides an innovative product portfolio and trusted expertise in engineering. With applications centers all over the world Heraeus aims to provide next generation solutions for the electronic industry focusing on reliability, thermal management, and cost control while operating at peak performance. Heraeus serves several markets including semiconductor, automotive, power electronics, LED and consumer electronics with advanced products like solder paste, sinter paste, thick film inks, metal substrates and direct copper bonded substrates. Our knowledge in electronic packaging will shorten your development cycles, lower development costs, and bring next generation products to market faster. Booth 212 Hitachi Chemical Co., Ltd. 1-9-2, Marunouchi, Chiyoda-ku, Tokyo 100-6606 Japan Phone: +81-3-5533-7000 Fax: +81-3-5533-7077 www.hitachi-chem.co.jp Contact: Tsuyoshi Ogawa Email: ts-ogawa@hitachi-chem.co.jp Hitachi Chemical is a leading company in providing various materials used in advanced semiconductor assembly packages, such as FO-WLP/PLP, 2.5 & 3D packages, SiP etc. In addition to those materials, Hitachi Chemical provides “Open Laboratory” located in Japan where any customers can utilize advanced fabrication and analytical equipment to achieve
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an accelerated development for complex and advanced structures. The Open Laboratory will relocate to more convenient location, closer to Tokyo, in Q4 2018. Our sales offices are located around the world, with technical engineers stationed to support customers in case of need. Please contact us if you are interested in “Open Laboratory” and materials such as die bonding films, molding related materials (EMC of solid, fine granular, liquid and film, and release film), underfill (CUF and NCF), temporary adhesives, photo-sensitive dielectric, dry film resist, solder resist, organic laminates (including low Dk/Df dielectric) and much more. Booth 121 i3 Electronics 100 Eldredge St. Binghamton, NY 13901 Phone: +1-607-238-7077 www.i3electronics.com i3 Electronics, Inc., with headquarters in Binghamton, NY, is a vertically integrated provider of high performance electronic solutions consisting of design and fabrication of printed circuit boards and advanced semiconductor packaging, full turnkey services for printed circuit board assembly and integrated circuits assembly and test, systems integration, cable and harness manufacturing, heterogeneous MCM, die extraction and reassembly and world class reliability and failure analysis laboratories. i3 unites advanced technology and technical know-how with a robust manufacturing environment to meet the current and emerging needs of the most demanding markets, including defense and aerospace, communications and computing, advanced test equipment, and medical. Booth 210 IBM Canada Ltd. 23 Airport Blvd Bromont, Quebec, Canada J2L 1A3 Phone: +1-450-534-6496 Cell: +1-450-531-2474 www.ibm.com/assembly Contact: Luc Comtois Email: assembly@ca.ibm.com At IBM Assembly and Test facility in Bromont, we have asserted our proposition in several key areas providing solutions for high current and high thermal dissipation applications in computing electronics market and developing specialized areas with attractive know- how in RF, Antennas, SiP and advanced opto electronic packaging for communication and wireless markets. Beyond our technical orientation, our experienced engineering team takes pride in using its design, assembly and test expertise to provide tailor-made solutions for our client’s needs and bring forth designs, prototypes and fast manufacturing ramp ups that are key to our client’s success. Several fruitful collaborations have been enacted in the past months and we already have received feedback that it provides high value to the customers that have chosen us as their development and manufacturing OSAT solution. Clients also
see value in our supply chain management proposition. Clearly beyond the customersupplier relationship, we value true partnerships for mutual growth. We have an exciting 2019 roadmap, some of the highlights include deploying high density interconnect laminates, pursuing integration and optimization of SiP packages and also deploying technical milestones to prepare for dense optical integration which is highly anticipated by several key players of the communications market in the years ahead. Booth 527 Integrated Service Technology (iST) 2381 Zanker Road Suite 120 San Jose, CA 95131 Phone: +1-408-627-5749 www.istgroup.com Contact: Edward Lee Email: USSales@istgroup.com Founded in 1994 in Taiwan, iST began its business from IC circuit debugging and modification and gradually expanded its scope of operations, including Failure Analysis, Reliability Verification, Material Analysis, Automotive Electronic Verification Platforms and Signal Integrity Testing Services. iST has offered full-scope verification and analysis services to the IC engineering industry, its customers cover the whole spectrum of the electronics industry from IC design to end products. In response to iST’s mission of providing integrated solutions to customers, iST not only focuses on its core laboratory services but also enters the mass production services Booth 511 Interconnect Systems, Inc. 741 Flynn Rd. Camarillo, CA 93012 Phone: +1-805-482-2870 Fax: +1-805-482-8470 www.isipkg.com Contact: Tom Casey Email: info@isipkg.com Interconnect Systems International, LLC (“ISI”), specializes in high-density module packaging, advanced interconnect and real time signal processing hardware. ISI offers design, qualification, and testing, coupled with fully integrated in-house manufacturing. ISI’s system design capabilities include hardware, firmware and software and high-density PCB design. ISI’s additional capabilities include custom manufacturing process development, fine pitch SMT, flip chip, wire bond assembly, IC packaging, custom molding, over molding, and automated optical inspection.