Program Sessions: Wednesday, June 1, 1:30 p.m. - 5:10 p.m. Session 10: Novel Interconnect Materials
Session 11: Optical Interconnects & 3D Photonics
Session 12: Electromigration, Warpage, and Material Characterization
Committee: Materials & Processing
Committee: Optoelectronics
Committee: Thermal/Mechanical Simulation & Characterization
Room: Mont-Royal 1
Room: Mont-Royal 2
Room: Yaletown 4
Session Co-Chairs: Ivan Shubin – Oracle Dong Wook Kim – Qualcomm Technologies, Inc.
Session Co-Chairs: Hiren Thacker – Oracle Stephane Bernabe – CEA LETI
Session Co-Chairs: Pradeep Lall – Auburn University Gamal Refai-Ahmed – PreQual Technologies Corp.
1. 1:30 PM - Novel Low Cost Bumping Process with Non-strip Type Photosensitive Resin and Injection Molded Solder (IMS) for Fine Pitch Flip Chip Joining
1. 1:30 PM - Scalable Optical Coupling Between Silicon Photonics Waveguides and Polymer Waveguides Antonio La Porta, Roger Dangel, Daniel Jubin, Norbert Meier, Daniel Chelladurai, Folkert Horst, and Bert Jan Offrein – IBM Corporation
1. 1:30 PM - The Nonlinearity of Stress Evolution in Polymer-Metal Composite Thin Films During Thermal Treatment Heng Li, Le Luo, and Gaowei Xu – Chinese Academy of Sciences
2. 1:55 PM - Design and Fabrication of Silver Solid Solution Layer on Silicon and Its SolidState Bonding Applications Yi-Ling Chen, Yongjun Huo, and Chin C. Lee – University of California, Irvine
2. 1:55 PM - Multi-layer Electro-Optical Circuit Board Fabrication on Large Panel Henning Schröder and Christopher Frey – Fraunhofer IZM; Marcel Neitz, Christian Herbst, and Klaus-Dieter Lang – Technical University of Berlin; Simon Whalley – ILFA Industrieelektronik und Leiterplattenfertigung GmbH
2. 1:55 PM - Substrate Trace Modeling for Package Warpage Simulation Mingji Wang and Brendan Wells – Amkor Technology, Inc.
3. 2:20 PM - Die Attach Material Having Nano-Level Sn-Cu Diffusion Control for Power Semiconductor Devices Hiroaki Ikeda, Shigenobu Sekine, Ryuji Kimura, Koichi Shimokawa, Keiji Okada, Hiroaki Shindo, Tatsuya Ooi, and Rei Tamaki – Napra Co., Ltd.; Makoto Nagata – Kobe University
3. 2:20 PM - Low-Loss Characteristics of a Multimode Polymer Optical Waveguide on an Electrical Hybrid LSI Package Substrate at 1.3 um Wavelength Takeru Amano, Akihiro Noriki, and Yoichi Sakakibara – AIST; Shigenari Ukita, Yoshiyuki Egashira, Mikiko Sasaki, and Kazuhiko Kurata – PETRA
3. 2:20 PM - Wafer Warpage Characterization of Multi-Layer Structure Composed of Diverse Passivation Layers and Re-Distribution Layers for Cost-Effective 2.5D IC Packaging Alternatives Cheng-Hsiang Liu, Chen-Hong Chiu, Hsiao-Chun Huang, Lu-Yi Chen, Chang-Lun Lu, and Shih-Ching Chen – Siliconware Precision Industries Co., Ltd.
Toyohiro Aoki, Takashi Hisada, Eiji Nakamura, Hiroyuki Mori, Yasumitsu Orii, and Yasuharu Yamada – IBM Corporation; Seiichirou Takahashi, Jun Mukawa, Chihiro Kobata, Kenzou Ohkita, and Kouichi Hasegawa – JSR Corporation
Refreshment Break: 2:45 p.m. - 3:30 p.m. Exhibit Hall – Belmont 1 & 5 4. 3:30 PM - Exploring Bismuth as a New Pb-Free Alternative for High Temperature Electronics Junghyun Cho, Sandeep Mallampati, and Russell Tobias – Binghamton University; Harry Schoeller – Universal Instruments Corporation; Liang Yin and David Shaddock – GE Global Research
4. 3:30 PM - 3D Silicon Photonics Packaging Based on TSV Interposer for High Density On-Board Optics Module Yan Yang and Rusli – Nanyang Technological University; Mingbin Yu, Qing Fang, Junfeng Song, Xiaoguang Tu, and Guo-Qiang Lo – IME, A*STAR
4. 3:30 PM - Measurement of the Comprehensive Viscoelastic Properties of an Advanced EMC Using a FBG Sensor Yong Sun, Hyun-Seop Lee, and Bongtae Han – University of Maryland, College Park
5. 3:55 PM - Porous Cu3Sn Formation in Cu-Sn IMC-Based Micro-Joints Yaodong Wang, David T. Chu, and King-Ning Tu – University of California, Los Angeles
5. 3:55 PM - Graded-Index Multimode Polymer Optical Waveguide Enabling Low Loss and High Density 3D On-Board Integration Akira Yamauchi, Kyuta Suzuki, Yoshie Morimoto, Hikaru Masuda, and Takaaki Ishigure – Keio University
5. 3:55 PM - Electromigration Induced Stress in Lead-Free Solder Joints Jiamin Ni and Antoinette Maniatty – Rensselaer Polytechnic Institute; Yong Liu, Jifa Hao, and Matt Ring – Fairchild Semiconductor Corporation
6. 4:20 PM - Solder Process for Fluxfree Solder Paste Applications Alexander Hanss and Gordon Elger – Technische Hochschule Ingolstadt; Matthias Hutter – Fraunhofer IZM; Jörg Trodler – Heraeus Deutschland GmbH & Co. KG
6. 4:20 PM - Design and Demonstration of Micro-Mirror and Lens for Low-loss and Low-Cost Single-Mode Fiber Coupling in 3D Glass Photonic Interposers Bruce Chou, William Vis, Fuhan Liu, Venkatesh Sundaram, and Rao Tummala – Georgia Institute of Technology; Ryuta Furuya – Ushio, Inc.
6. 4:20 PM - Peridynamic Direct Concentration Approach by Using ANSYS Sungwon Han, Y. Hwang, and H. Seol – Samsung Electronics Company, Ltd.; C. Diyaroglu, S. Oterkus, and E. Oterkus – University of Strathclyde, Glasgow; Erdogan Madenci – University of Arizona
7. 4:45 PM - Improved Joint Strength with Sintering Bonding Using Microscale Cu Particles by an Oxidation-Reduction Process Xiangdong Liu and Hiroshi Nishikawa – Osaka University
7. 4:45 PM - Wet Etched Silicon Interposer for the 2.5D Stacking of CMOS and Optoelectronic Dies Chenhui Li, Barry Smalbrugge, Tjibbe de Vries, Teng Li, Patty Stabile, and Oded Raz – Eindhoven University of Technology
7. 4:45 PM - Electromigration Induced Voiding and Resistance Change in ThreeDimensional Copper Through Silicon Vias Marco Rovitto and Hajdin Ceric – Technische Universität Wien
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