Knowing the Step-Wise Approach in PCB Production

Knowing the Step-Wise Approach in PCB Production After focusing on and passing through the steps of film generation, raw material selection, whole drilling and electro-less copper plating, the method of PCB production goes into the application of image and photo-resist features. This is done to transpose the PCB design from the original electronic data (CAD) to the physical circuit board.

The trained mechanics begin with the application of photosensitive and delicate photo-resist to this panel. It covers the entire board periphery. After this, they place the copper layer/film image on the board, which is a high intensity light source of UV as it gets exposed in the uncovered section of the photo-resist.

Post this, the manufacturers chemically develop the main board and remove all unexposed and latent photo-resist from this panel. It creates traces and pads. The pattern plate is the next step in the PCB production phase.

This PCB production step entails an electrochemical process that creates copper thickness inside the holes along with the PCB surface. After the copper thickness gets piled up on the holes and onto the circuitry, they plate it and put an additional layer of molded tin on the exposed surface.

The tin protects the plated copper while etching process of PCB production USA goes on. You can later remove it. The next step is stripping and etching, which takes place in a series of processes. The first deals with the chemical removal or stripping of the photo-resist part from the panel.

After this, the newly exposed and segmented copper is etched or chemically removed from the panel. The applied tin in the earlier process shields the desired and significant copper circuitry from getting etched. For any PCB supplier, this is the point that defines fundamental circuitry in the ambit of PCB. After all is being taken care of, the protective tin layer is chemically removed from the place. It exposes the copper circuitry.