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LINEA II – Inline Wet Process Equipment for Cleaning, Texturing and PSG Removal | 用于清洁、制绒和清洗去磷硅玻璃的在线式湿法设备
Main Characteristics
主要特点
Effective, Economical, Flexible
有效、经济、灵活
→→ Platform for all inline processes →→ From R&D tool to the fully integrated 10-lane facility →→ Uniform media flow on wafer surface →→ Consistant flow conditions from lane to lane →→ Economical because of small bath volumes and high wafer throughput →→ Fast media exchange on wafer surface →→ Fast discharging of process reaction products →→ Low exhaust volumes through intelligent airflow next to each wafer lane →→ Future-proof and flexible with modular process units →→ Easy integration of new or additional process options
→→ 所有在线式加工的平台 →→ 从研发工具到完全一体化的10通道设施 →→ 硅晶片表面上统一的介质流动 →→ 通道之间的流动条件稳定 →→ 由于腐蚀液用量小和高硅晶片产量高而实现经 济节约 →→ 在硅晶片表面上实现快速介质交换 →→ 过程反应产品的快速排出 →→ 通过每条硅晶片通道旁的智能气流而降低排 气量 →→ 适应于未来发展的灵活的模块化加工单元 →→ 方便集成新加的工艺选项
Controlled, Precise, Intelligent →→ Fully automated tool with integrated process control →→ Compact process chambers with innovative media and process management →→ Simple and robust „spider-chain“ wafer transport system without mechanical contacts on top side →→ Shadow-free contact of the wafer surfaces with the process media →→ Wafer tracking and wafer thickness measurement
Safe, Clean, User-Friendly →→ Safe for persons, environment, and in the process →→ Cleanroom compatible design according to ISO and SEMI standards →→ Friction-free, gentle wafer transport through the process media →→ Excellent accessibility of the process chamber from all sides through the separation of process and installation modules
控制、精确、智能 →→ 采用集成工艺控制的全自动工具 →→ 紧凑的加工室运用了创新介质和工艺管理 →→ 简单而牢固的“蜘蛛链条”硅晶片传输系统， 正面无机械接触 →→ 硅晶片表面与加工介质的无暗影接触 →→ 硅晶片的跟踪和硅晶片厚度测量
安全、洁净、用户友好 →→ 在加工过程中，对操作员与环境都很安全 →→ 按照ISO和SEMI标准进行能兼容净化室的设计 →→ 通过加工介质进行无摩擦的温和硅晶片运输 →→ 通过将加工及安装模块分离，可方便地从各个 侧面进入加工室