MEGA SCIENCE 2.0 Electrical & Electronics Sector
Table 3.3 First term roadmap action plan for infrastructure development Goals Substrate manufacturing facility
Action plans •
To develop substrate manufacturing facility for: o Sapphire substrate
Target At least one substrate manufacturing facility completed in 2016
o Silicon substrate Epitaxial growth facility
o Gallium Nitride substrate
•
To create epitaxial growing facility for heteroepitaxial (Sapphire and Silicon) and homoepitaxial (GaN)
One epitaxial facility by the year 2016
•
To convert existing CMOS foundry/clean room to include LED fabrication capability. One of the MIMOS facilities can be modified to add LED manufacturing.
Compound semiconductor foundry
•
To create compound semiconductor fabrication facility that capable to fabricate LED and MMIC.
One compound semiconductor foundry by 2016
Improving existing LED packaging and luminaire manufacturing plant
•
Introducing new innovation for existing facility targeting at cost reduction of LED manufacturing
30% cost reduction in LED packaging and luminaire manufacturing
GLC for sales and distribution company as the market for compound semiconductor industry
•
Setting up a company for sales and distribution to complete the eco-system of the compound industry (target product: smartphone)
GLC based local brand company for smartphone business
MIMOS as one of the LED fabrication facilities in Malaysia
3.3.2 MEDIUM-TERM ACTION PLAN (2020-2030) The medium term action plan is to further develop and expand the compound semiconductor industry in the country to embrace new technology. Application of new innovative technology is important, especially in producing low cost products. This is to ensure the sustainability and relevancy of the industry and to maintain its competitiveness. Table 3.4 shows some of the action plans for the medium term.
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