MEGA SCIENCE 2.0 Electrical & Electronics Sector
The typical cost breakdown for an LED package is shown in Figure 3.7. The data represents high vol. manufacturing of 1 mm2 dye on 100 mm diameter sapphire substrates and packaging of the dye to produce high power warm white phosphor-converted LED lighting sources. The Figure indicates that that a significant proportion of the cost contributes by the dye-level packaging stage. Nevertheless, this result is not surprising as the final product is a packaged dye, and there are many thousands of such dyes on each wafer (around 5,000 1 mm2 dye on a 100 mm diameter substrate). Therefore, costs associated with dye-level activities will tend to dominate and manufacturers will need to address dye-level packaging processes or perform more of the packaging activities at a wafer level in order to realise the required cost reductions. Figure 3.8 demonstrates how the LED package cost elements predicted to change over time, falling to about 17% of 2013 values by 2020.
Figure 3.8 Cost reduction projection of LED manufacturing Source: USA Department of Energy, SSL R&D-manufacturing roadmap
3.3.1.1 RESEARCH AND DEVELOPMENT In the short term, Malaysia will establish a local compound industry through substrate manufacturing, LED dye manufacturing (epitaxial growth, LED device fabrication, LED packaging), luminaire manufacturing, and MMIC design and fabrication. Table 3.1 shows all the activities for the first term plan, with regards to R&D progress. Figure 3.7 Cost breakdown for an LED manufacturing Source: USA Department of Energy, SSL R&D-manufacturing roadmap
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