What’s New in Electronics Mar/Apr 2025

March/April 2025 Vol.44 No.5 PP100007394

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COVER STORY

CONTENTS 4

5G connectivity — ever-increasing possibilities

12

Improving the way flash memory is made

14

Researchers leverage AI for wireless chip design

24

Researchers create quantum ‘Schrödinger’s cat’ in silicon chip

26 27

SMCBA Conference returns with exciting line-up Australia’s largest electronics expo returns to Melbourne

34

Optical memory unit boosts processing speed

43

Quantum teleportation performed over busy internet cables

46

Sodium-ion study says tech needs breakthroughs to compete

48

Spinning, twisted light could power next-generation electronics

50

Magnetic sensor technique helps identify original batteries

March/April PP10000739 2025 Vol.44 No.5 4

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CONNECTIVITY — EVER-INCREASING POSSIBILITIES Initially, efforts aimed at implementing the 5G network were met with a dose of resistance and doubt from society. However, with time, more and more users have started taking advantage of this new technology.

I

t supports rapid mobile data transmissions and connections spanning a huge number of various devices, including environmental sensors or units detecting specific events or objects. This, in turn, facilitates forecasting, monitoring, remote control and other operations that were previously inaccessible or even impossible due to the technological limitations of wireless networks.

Initially, the implementation of the 5G transmission technology was based on the formerly used 4G LTE technology, and it involved deploying software updates in base stations. However, this solution made it rather hard to make use of the full potential of 5G, and its main effect was on marketing and advertising the new network. That being said, it must also be admitted that it did offer some advantages over LTE. Firstly, the transmission speed was increased, and secondly, the network capacity was enhanced without any physical infrastructure expansion.

Instead, now that the ‘old’ infrastructure has been in place for some time, higher carrier frequencies (“C” band) are used to allow transmission speeds reaching several gigabits per second.

The 5G network is even capable of operating one million devices within a 1 km2 area.

This capability has an enormous impact on

the development of IoT, smart city, modern agriculture, Industry 4.0 and other applications, such as illumination and water supply management systems, road traffic intensity analysis software, and programs running car parks or supervising autonomous vehicle operation.

Moreover, thanks to the impressive network capacity, devices not only transmit data to the system that supervises their operation or creates forecasts, but also communicate with one another. Even today, solutions implemented in some autonomous vehicles make it possible to share data on accidents, traffic jams and detours. There are also solutions that are able to control traffic lights depending on actual traffic, thus eliminating congestion.

5G technology — basic overview

The main spectrum of radio frequencies operated in 5G networks ranges from 3.3–4.9 GHz. Lower frequency bands (<1 GHz) are reserved for devices providing larger area coverage and designed to penetrate rooms.

Millimetre waves (frequency range: from 24–28 GHz and 39 GHz) are used in local hot-spots and applications providing outdoor and indoor connectivity. The 5G network radio frequency interface has been developed in a manner ensuring maximum flexibility, as it

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makes it possible to combine waves from various frequency ranges.

Other important features of the new interface include MIMO technology and antenna array deployment. The antennas (also referred to as Massive MIMO) are installed in base stations to facilitate not only the correct forming of the frequency characteristics, but also of the radiation characteristics, to ensure the area has coverage and direct radio frequency beams away from the user’s head (in mobile devices). As such, the MIMO antennas made it possible for the LTE and 5G technologies to ‘coexist’ within the same area during the initial stages of the implementation process.

The 5G radio network includes the ORAN (Open Radio Access Network) interface operating between the RF path and cloud edge devices. It facilitates flexible service deployment and provides access to cloud resources and services. The processing operations required for correct radio frequency path functioning are performed by cloud edge devices, ensuring that the network capacity is quickly adapted to actual requirements.

The LTE networks support the following modulation schemes: QPSK, 16QAM, 64QAM and 256QAM. All the above-mentioned modulation types are also used by the 5G network radio frequency interface. Moreover,

TELECOMMUNICATIONS

ensures the 10 Gb/s transmission rates for high-throughput applications, such as video streaming or VR/AR gaming.

Massive machine-type communications (mMTC): This service is designed to connect a massive number of devices. It is expected to be used mainly in applications related to smart city solutions and other IoT applications.

Ultra-reliable low latency communications (URLLC): URLLC is a perfect solution for critical applications which require network reliability, minimum latency (below 1 ms), and short response times. Such applications include autonomous vehicles or remote control systems for industrial machinery.

Enhanced mobile broadband (eMBB)

iStock.com/Jian Fan

the 3GPP specification also includes the n/2BPSK scheme to facilitate further reduction of the peak-to-medium power ratio at low transmission speeds, which is important in the context of selected services.

This feature is particularly useful while collecting data obtained from IoT sensors.

The power ratio reduction in wireless paths provides energy savings to ensure longer operation of battery-operated equipment.

A lower peak power rating may enhance network performance and mitigate the risk of interferences, which translates into higher connection quality and reliability. This is particularly important in areas characterised by high density of devices. Additionally, the peak power reduction ensures more efficient use of the available frequency resources (decreased harmonic levels), which in turn translates into higher network capacity, ie, the ability to simultaneously operate a larger number of connected devices.

The spectrum of the new 5G network applications is even more extensive, so the list of modulation schemes is likely to be extended as well. For example, the 1024QAM modulation scheme may become part of the radio frequency interface specification, as the fixed connection designed to transmit data from the main network to sub-networks already uses a

higher modulation scheme than 256QAM. The radio frequency interface specifications may also include modulation schemes dependent on the terminal equipment.

For the operation of diverse services within a broad frequency range, the scalable OFDM technology is required. It involves multiplexing in the frequency domain, ie, a simultaneous transmission of multiple data streams using orthogonal carrier frequencies. Wider carrier spacing may be available for small-area, highcarrier-frequency services, where latency is a key factor. If individual carrier frequencies are lower, the spacing among them can be decreased, which is particularly useful for large-area services, narrow-band equipment and multimedia services, eg, eMBMS. It may also be possible to simultaneously support multiple services with different requirements using the same carriers by multiplexing two different channel splits.

5G — main assumptions

The 5G network architecture has been designed with a view to operating the following three key service areas: Enhanced mobile broadband (eMBB) connectivity: This service area extends and enhances the services currently used in mobile data transmission applications. It

Initially, during the process of the 5G implementation, emphasis was put mainly on multiplying the data transmission speeds to enhance the mobile broadband application capabilities.

The 5G technology makes it possible to obtain very high transmission rates, due to the fact that broadband transmissions supported by the MIMO technology are implemented. The typical maximum bandwidth for the carrier frequency below 1 GHz is 20 MHz, which translates into 200 Mb/s TDD (time-division duplex) speeds at 2×2 MIMO. The 100 MHz TDD band and 4×4 MIMO application provide transmission rates even up to 2 Gb/s. Also, 24–28 GHz frequency range millimetre waves make it possible to obtain 10–20 Gb/s at the 1 GHz bandwidth and 2×2 as well as 4×4 MIMO. Thanks to the implementation of the 5G technology in existing LTE networks, much larger network capacities and higher data transmission speeds were obtained, mainly as a result of using antenna matrices and the MIMO technology. In real-life networks, an LTE cell with 20 MHz bandwidth ensures throughput amounting to 40 Mb/s, at medium-level traffic intensity. A 5G network cell with 100 MHz bandwidth makes it possible to connect 20 times more users, as a 5 times broader frequency band is used. So far, the 5G technology has ensured the highest capacity increase in the history of mobile telephony networks.

mMTC = millions of connected devices

Massive machine-type communications facilitates transmission of massive numbers of small-sized data packages (eg, sensor data) to/from a large number of devices. mMTC streamlines using applications collecting IoT sensor data to enhance the quality of users’ > life or services they provide.

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TELECOMMUNICATIONS

In terms of device density, mMTC supports up to 1 million devices per 1 km2, which is over 10 times more than in the case of the LTE technology. As such, 5G provides an infrastructure that is necessary to operate enormous sensor systems connected via the network of mobile telephony base stations.

The mMTC service area is designed to support mass IoT implementations handling a massive number of low-power-consumption devices for regular transmissions of small amounts of data. One of the main requirements for such devices is a long life while supplied by batteries, reaching even up to 10 years.

IoT sensors typically transmit small-sized data packages over the distance of up to 10 km.

This makes them ideal for such applications as agriculture, where hundreds of sensors can transmit data on weather conditions, soil moisture levels and the status of devices located across vast cultivated areas. Such data can, for example, be used to optimise the irrigation frequency and areas. In this kind of applications, sensors cannot use millimetre waves which have a very short range and are strongly attenuated by outdoor obstacles.

To that end, the key feature of the 5G network is needed, thanks to which each of the three service areas may exist as an individual network operating within the same physical infrastructure. Network slicing, also referred to as the software-defined network (SDN), is a system of distributing the throughput among different areas to correctly adapt various service functions. This means that each application can simultaneously access selected resources, but higher-priority applications are the first ones to do that.

Each network slice can be set up individually for safety, quality of service (QoS), and network sharing. For example, mMTC provides low-throughput, long-range and extensive-coverage connectivity, while URLLC (described below) ensures high reliability, but, in comparison with mMTC, does not ensure such a large area coverage.

The mMTC 5G connectivity enhances wireless network performance in a large spectrum of applications. Smart cities use a large number of sensors to monitor the consumption of utilities such as water, gas and electricity, and to streamline waste management. Within smart city systems, sensors can be strategically deployed throughout the city to collect data which is then sent back to the central server and analysed for relevant information.

Different sensors report various datasets which can be combined to specify areas for improvement. For example, collating and

WITH THE DEPLOYMENT OF 5G, THE COMPLEXITY OF NETWORKS HAS INCREASED, THANKS TO WHICH NEW TECHNOLOGIES CAN BE INTRODUCED TO SATISFY A WIDE RANGE OF BOTH HOUSEHOLD AND BUSINESS REQUIREMENTS.

analysing data obtained from thousands of traffic cameras, radar traffic counters and air quality sensors may help combat road congestion and improve air quality for the benefit of the smart city dwellers.

URLLC = enhanced reliability of communications

The URLLC service is designed for applications requiring high network reliability and very short latency times, ie, below 1 ms.

Examples of such applications include vehicle or drone operation. This brings a whole range of benefits — from time saving to improved road safety. However, it still requires vehicles to be connected to one another and to the infrastructure such as traffic lights, emergency and road maintenance services.

In such a scenario, data would have to be shared in real time with minimum delays, as the required safety level can be ensured only by extremely reliable and secure connections.

Applications related to Industry 4.0 also impose similar requirements. This is due to the fact that operators, machinery and industrial robots must often cooperate in real time.

Moreover, they might need instant access to information provided by sensors deployed all over the plant. In such applications, shortlatency systems facilitate safe and efficient operation for optimised production.

Other applications requiring reliable connectivity include remote healthcare and augmented reality operations, such as remote surgeries, smart electricity distribution and cloud-based gaming and entertainment services.

Network slicing makes it possible to ensure separate operation of each of the three areas included in the 5G ecosystem. To this end, each segment operates as an individual network governed by specified requirements for sharing, safety and service quality. Therefore, mMTC, which typically requires a low safety level and low throughput, is separated from the URLLC address, which in turn provides high safety and reliability levels. However, each of these sections exists within the same physical network infrastructure.

URLLC is characterised by perfect reliability and short latency times. This is defined by

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the requirement demanding that not more than 0.001% of 20-byte packages can be delivered with a delay exceeding 1 ms. The 5G network architecture is designed with a view to eliminating delivery failures and errors by implementing such technologies as beamforming, network slicing and package retransmission protocols.

In the 4G LTE system, before exchanging any kind of data, a user’s device and base station exchange a series of signalling requests (handshaking). Before the data is sent, the base station must grant access, which results in prolonging the latency time up to 11 ms. The URLLC 5G system has free access to the up-link connection, so that base stations can reserve throughput to transmit the connection in this direction. The user’s device does not have to wait for scheduling and access requests, which significantly reduces latency along the route. As for the down-link data, resources can be allocated from other network slices, which is referred to as pre-emption.

Future of 5G network

With the deployment of 5G, the complexity of networks has increased, thanks to which new technologies can be introduced to satisfy a wide range of both household and business requirements. This, in turn, results in diversification in the telecommunications industry and abundance of possibilities resulting from ever-increasing global 5G accessibility. In particular, URLLC will ensure connectivity for critical applications, which has been talked about for years, but implemented only recently.

Electronic equipment designers and software engineers will face even greater challenges connected with developing highperformance devices. For some applications, software developers may require new protocols, coding methods and sharing techniques to ensure maximum security and reliability.

Updates for the existing equipment will also be required to ensure that it meets the 5G frequency band specifications, or constantly evolving requirements for battery operation speed and lifetime.

Text prepared by Transfer Multisort Elektronik Sp. z o.o.

NOVEL BIOSENSOR INCREASES ELEMENT EXTRACTION EFFICIENCY QUT synthetic biologists have developed a prototype for an innovative biosensor that can detect rare earth elements and be modified for a range of other applications.

Lanthanides (Lns) are elements used in electronics, electric motors and batteries. The problem is that we can’t extract enough of them to meet the growing demand and current extraction methods are expensive and environmentally damaging.

Professor Kirill Alexandrov and colleagues, from the QUT Centre of Agriculture and Bioeconomy and the ARC Centre of Excellence in Synthetic Biology, engineered proteins to create molecular nanomachines that generate easily detectable signals when they selectively bind to Lns. Along with Professor Alexandrov, the international research team involved QUT researchers Dr Zhong Guo, Patricia Walden and Dr Zhenling Cui, in collaboration with researchers from CSIRO Advanced Engineering Biology Future Science Platform and Clarkson University (USA).

Publishing their findings in Angewandte Chemie International, the team describe engineering a hybrid protein, or “chimera,” by combining a lanthanide-binding protein, LanM, with an antibiotic degrading enzyme called beta-lactamase.

Image credit: QUT.

Conceptual artwork of a biosensor.

This hybrid acts like a “switch” that becomes active only when lanthanides are present. It can be used to detect and quantify Lns in liquids, producing a visible colour change or an electrical signal.

Impressively, bacteria modified with these chimeras were able to survive in the presence of antibiotics that otherwise would kill them — but only when lanthanides were present. This highlights how precisely the proteins respond to these rare metals.

“This work opens up exciting possibilities for using biology to detect and recover rare earth metals,” Professor Alexandrov said.

“The prototype can also be modified for various biotechnological applications, including construction of living organisms capable of detecting and extracting valuable metals.”

The research team now plan to work on increasing the specificity of the molecular switch to better differentiate between closely related rare earth elements. It also explores the possibility of developing switches for other critical elements. The team is in active discussions with potential industry partners who are interested in this technology.

“We also want to explore using the tool to engineer microbes that can directly extract rare earth minerals from ocean water,” Alexandrov said.

“This is probably one of the best performing switches made and has given us a lot of insight into the mechanics of protein switches.”

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HARNESSING ELECTROMAGNETIC WAVES TO IMPROVE WIRELESS COMMUNICATION A team of researchers from the University of Ottawa has developed innovative methods to enhance frequency conversion of terahertz (THz) waves in graphene-based structures, unlocking new potential for faster, more efficient technologies in wireless communication and signal processing.

THz waves, located in the far-infrared region of the electromagnetic spectrum, can be used to perform non-invasive imaging through opaque materials for security and quality control applications. Additionally, these waves hold great promise for wireless communication. Advances in THz nonlinear optics, which can be used to change the frequency of electromagnetic waves, are essential for the development of high-speed wireless communication and signal processing systems for 6G technologies and beyond.

THz technologies are rapidly evolving as they are poised to play a critical role in health, communication, security and quality control. Jean-Michel Ménard, Associate Professor of Physics from the Faculty of Science and a team of researchers have paved the way for developing devices capable of up-converting electromagnetic signals to higher oscillation frequencies, effectively bridging the gap between GHz electronics and THz photonics.

These findings — published in Light: Science & Applications — demonstrate innovative strategies for enhancing THz nonlinearities in graphene-based devices. “The research marks a significant step forward in improving the efficiency of THz frequency converters, a critical aspect for multi-spectral THz applications and especially the future of communication systems, like 6G,” said Ménard, who collaborated on the project with fellow uOttawa researchers Ali Maleki and Robert W. Boyd.

This new research showcases methods to leverage the unique optical properties of graphene, an emerging quantum material made of a single layer of carbon atoms. This 2D material can be seamlessly integrated into devices, enabling new applications for signal processing and communication.

Previous works combining THz light and graphene primarily focused on fundamental light–matter interactions, often examining the effect of a single parameter in the experiment. The resulting nonlinear effects were extremely weak. To overcome this limitation, Ménard and his colleagues have combined multiple innovative approaches to enhance nonlinear effects and fully leverage graphene’s unique properties.

“Our experimental platform and novel device architectures offer the possibility to explore a vast range of materials beyond graphene and potentially identify new nonlinear optical mechanisms,” added Maleki, a PhD student in the Ultrafast THz group at uOttawa, who collected and analysed results for the study.

“Such research and development are crucial for refining THz frequency conversion techniques and eventually integrating this technology into practical applications, particularly to enable efficient, chip-integrated nonlinear THz signal converters that will drive future communication systems.”

NANO-SPRING COATING TECHNOLOGY BOOSTS EV BATTERY STABILITY A team of researchers from the Pohang University of Science and Technology (POSTECH) has developed technology that could increase the lifespan and energy density of electric vehicle (EV) batteries. The research findings were published in the journal ACS Nano.

An electric vehicle battery must maintain its performance while being charged and discharged. However, the charging and discharging process causes the battery’s positive active materials to expand and contract repeatedly, causing microscopic cracks within. As time goes by, the battery performance decreases. To prevent this, researchers are increasing the strength of the cathode active materials by adding reinforcement dopant, but this is not a fundamental solution.

The key to this research is the ‘nano-spring coating’ technology that can design elastic structures. The researchers implemented a multiwalled carbon nanotube (MWCNT) on the surface of the battery electrode materials. This absorbed strain energy generated from the charging and discharging process prevented cracks and minimised thickness changes in the electrode to improve stability. The researchers effectively suppressed cracks within the battery while improving its lifespan and performance.

This technology enabled researchers to minimise resistance caused by volume changes of the material with only a small amount of conductive material. The research findings also showed an improvement in lifespan by maintaining 78% of the initial battery capacity after 1000 charge and discharge cycles or above.

The technology can be combined with existing battery manufacturing processes, allowing easy mass production and commercialisation. This development could also help to overcome current limitations in battery technology, paving the way for more efficient and durable EV batteries.

Professor Kyu-Young Park from POSTECH said, “With a different approach from existing ones, this research effectively controlled changes that could occur to a battery during the charging and discharging process. This technology can be widely used not only in the secondary battery industry but also in various industries where material durability is important.”

HOW HALIDE PEROVSKITES COULD TRANSFORM LIGHT-POWERED ENERGY TECH University of Missouri scientists are unlocking the secrets of halide perovskites — a material that’s poised to reshape our future by bringing us closer to a new age of energy-efficient optoelectronics.

Suchi Guha and Gavin King, two physics professors in Mizzou’s College of Arts and Science, are studying the material at the nanoscale: a place where objects are invisible to the naked eye. At this level, the extraordinary properties of halide perovskites come to life, thanks to the material’s unique structure of ultra-thin crystals — making it astonishingly efficient at converting sunlight into energy.

Think solar panels that are not only more affordable, but also far more effective at powering homes. Or LED lights that burn brighter and last longer while consuming less energy.

“Halide perovskites are being hailed as the semiconductors of the 21st century,” said Guha, who specialises in solid-state physics.

“Over the past six years, my lab has concentrated on optimising these materials as a sustainable source for the next generation of optoelectronic devices.”

To create the material, the scientists used a method called chemical vapour deposition. It was developed and optimised by Randy Burns, one of Guha’s former graduate students, in collaboration with Chris Arendse from the University of the Western Cape in South Africa. And because it’s scalable, it can easily be used to mass produce solar cells.

Guha’s team explored the fundamental optical properties of halide perovskites using ultrafast laser spectroscopy. To optimise the material for various electronic applications, the team turned to King.

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King, who primarily works with organic materials, used a method called ice lithography, known for its ability to fabricate materials at the nanometre scale. Ice lithography requires cooling the material to cryogenic temperatures — typically below -150°C (-238°F). This ultra-cool method allowed the team to create distinct properties for the material using an electron beam.

He equates the method to using a “nanometre-scale chisel.”

“By creating intricate patterns on these thin films, we can produce devices with distinct properties and functionalities,” said King. “These patterns are the equivalent to developing the base or foundational layer in optical electronics.”

Finding success through collaboration

While Guha and King work in different areas of physics, they said this collaboration has benefited both them and their students.

“I find it exciting because, on my own, there are only so many things I can do, both experimentally and theoretically,” Guha said. “But when you collaborate, you get the full picture and the chance to learn new things. For example, Gavin’s lab works with biological materials, and by combining that with our work in solid-state physics, we’re discovering new applications that we hadn’t considered before.”

King agrees. “Everyone brings a unique perspective, which is what makes it work,” said King. “If we were all trained the same way, we’d all think the same, and that wouldn’t allow us to accomplish as much as we can here together.”

Their work is an example of the innovative energy research at Mizzou that’s powering the new Center for Energy Innovation.

IMPROVING THE WAY FLASH MEMORY IS MADE

The right recipe creates the narrow, deep holes needed for dense data storage twice as fast. To store ever more data in electronic devices of the same size, the manufacturing processes for these devices need to be studied in greater detail. By investigating new approaches to making digital memory at the atomic scale, researchers engaged in a public-private partnership are aiming to address the endless demand for denser data storage.

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ne such effort has focused on developing the ideal manufacturing process for a type of digital memory known as 3D NAND flash memory, which stacks data vertically to increase storage density. The narrow, deep holes required for this type of memory can be etched twice as fast with the right plasma and other key ingredients, according to a new study published in the Journal of Vacuum Science & Technology A. The study involved simulations and experiments conducted by scientists at Lam Research, the University of Colorado Boulder and the U.S. Department of Energy’s Princeton Plasma Physics Laboratory (PPPL).

NAND flash memory is a type of non-volatile data storage, meaning that it retains data even if the power to the device is off. “Most people are familiar with NAND flash memory because it’s the kind that is in the memory cards for digital cameras and thumb drives.

It is also used in computers and mobile phones. Making this type of memory denser still — so that more data can be packed into the same footprint — will be increasingly important as our data storage needs grow due to the use of artificial intelligence,” said Igor Kaganovich, a principal research physicist at PPPL.

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Stacking memory cells to save space

Digital memory saves information in units called cells. Data is saved as the cell’s state, where each cell is either on or off. With traditional NAND flash memory, the cells are arranged in a single layer. In 3D NAND flash memory, many memory cells are stacked on top of each other to fit more data in a smaller footprint. It’s akin to replacing a bungalow with a 10-storey apartment to house more people.

A critical step in creating these stacks involves carving holes into alternating layers of silicon oxide and silicon nitride. The holes can be etched by exposing the layered material to chemicals in the form of plasma (partly ionised gases). Atoms in the plasma interact with atoms in the layered material, carving out the holes.

Researchers want to refine how they make these holes so each one is deep, narrow and vertical, with smooth sides. Getting the recipe just right has been tough, so scientists have continued to test new ingredients and temperatures.

Using plasma to create deep, narrow channels

“These processes use plasma as a source of high-energy ions,” said Yuri Barsukov, a former PPPL researcher now working at Lam Re-

MICROELECTRONICS

Alternating layers of silicon dioxide and silicon nitride (left) are etched to create a deep, vertical hole (right).

Kyle Palmer/PPPL Communications Department. iStock.com/lyash01

search. Using the charged particles found in plasma is the easiest way to create the very small but deep, circular holes needed for microelectronics, he said. However, the process, known as reactive ion etching, isn’t fully understood and could be improved. One recent development involves keeping the wafer — the sheet of semiconductor material to be processed — at a low temperature. This emerging approach is called cryo etching.

Traditionally, cryo etching uses separate hydrogen and fluorine gases to make the holes. The researchers compared results from this process to a more advanced cryo-etching process that uses hydrogen fluoride gas to create the plasma.

“Cryo etch with the hydrogen fluoride plasma showed a significant increase in the etching rate compared to previous cryo-etch processes, where you are using separate fluorine and hydrogen sources,” said Thorsten Lill of Lam Research. Headquartered in Fremont, California, Lam Research supplies wafer fabrication equipment and services to chipmakers.

Doubling etch rates

When silicon nitride and silicon oxide were tested separately, the etch rate increased for the nitride and the oxide layer using the hydrogen

fluoride plasma instead of the separate hydrogen and fluorine gases.

While the effect for silicon nitride was more pronounced than for silicon oxide, etching both materials simultaneously yielded the most significant increase. In fact, the etching rate for the alternating silicon oxide and silicon nitride layers more than doubled, increasing from 310 nanometres per minute to 640 nanometres per minute. (A human hair is roughly 90,000 nanometres in width.)

“The quality of the etch seems to have improved as well, and that’s significant,” Lill said.

The researchers also studied the impact of phosphorus trifluoride, an essential ingredient when etching silicon dioxide at any significant degree. While it has been used before, the researchers wanted to better understand and quantify its impact. They found that adding phosphorus trifluoride quadrupled the etch rate for silicon dioxide, though it only marginally increased the silicon nitride etch rate.

Another chemical compound the researchers studied was ammonium fluorosilicate, which forms during the etching process when the silicon nitride reacts with the hydrogen fluoride. The research showed that ammonium fluorosilicate can slow down etching, but water can offset this effect. According to Barsukov’s simulations, water weakened the ammonium fluorosilicate bonds. “The salt can decompose at a lower temperature when water is present, which can accelerate etching,” Barsukov said.

Laying a foundation for future research

Kaganovich said the research is also important because it shows how scientists in industry, academia and national laboratories can work together to answer important questions in the microelectronics field.

It also brings together information gathered from experimentalists and theorists. “We are building bridges to the greater community,” he said. “This is an essential step in gaining a better understanding of semiconductor manufacturing processes for everyone.”

Lill said he appreciates working with PPPL on semiconductor manufacturing research because PPPL research offers a range of capabilities in plasma simulation for microelectronics.

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RESEARCHERS LEVERAGE

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Specialised microchips that manage signals at the cutting edge of wireless technology are astounding works of miniaturisation and engineering. They’re also difficult and expensive to design.

Princeton University.

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ow, researchers at Princeton Engineering and the Indian Institute of Technology have harnessed artificial intelligence to take a key step towards slashing the time and cost of designing new wireless chips and discovering new functionalities to meet expanding demands for better wireless speed and performance. In an article published in Nature Communications, the researchers describe their methodology, in which an AI creates complicated electromagnetic structures and associated circuits in microchips based on the design parameters. What used to take weeks of highly skilled work can now be accomplished in hours.

What is more, the AI behind the new system has produced strange new designs featuring unusual patterns of circuitry. Kaushik Sengupta, the lead researcher, said the designs were unintuitive and unlikely to be developed by a human mind. But they frequently offer marked improvements over even the best standard chips.

“We are coming up with structures that are complex and look random shaped and when connected with circuits, they create previously unachievable performance. Humans cannot really understand them, but they can work better,” said Sengupta, a professor of electrical and computer engineering.

These circuits can be engineered towards more energy efficient operation or to make them operable across an enormous frequency range that is not currently possible. Furthermore, the method synthesises inherently complex structures in minutes, while conventional algorithms may take weeks. In some cases, the new methodology can create structures that are impossible to synthesise with current techniques.

Uday Khankhoje, a co-author and associate professor of electrical engineering at IIT Madras, said the new technique not only delivers

iStock.com/Pgiam

AI FOR WIRELESS CHIP DESIGN

An enlarged image of the chip’s circuitry in Sengupta’s lab at Princeton.

efficiency but promises to unlock new approaches to design challenges that have been beyond the capability of engineers.

“This work presents a compelling vision of the future,” he said. “AI powers not just the acceleration of time-consuming electromagnetic simulations, but also enables exploration into a hitherto unexplored design space and delivers stunning high-performance devices that run counter to the usual rules of thumb and human intuition.”

Wireless chips are a combination of standard electronic circuits like those in computer chips and electromagnetic structures including antennas, resonators, signal splitters, combiners and others. These combinations of elements are put together in every circuit block, carefully handcrafted and co-designed to operate optimally. This method is

CIRCUIT DESIGN

Emir Ali Karahan, Princeton University.

The AI design features unusual, and efficient, circuitry patterns.

then scaled to other circuits, sub-systems and systems, making the design process extremely complex and time consuming, particularly for modern, high-performance chips behind applications like wireless communication, autonomous driving, radar and gesture recognition.

“Classical designs carefully put these circuits and electromagnetic elements together, piece by piece, so that the signal flows in the way we want it to flow in the chip. By changing those structures, we incorporate new properties,” Sengupta said. “Before, we had a finite way of doing this, but now the options are much larger.”

It can be hard to comprehend the vastness of a wireless chip’s design space. The circuitry in an advanced chip is so small, and

the geometry so detailed, that the number of possible configurations for a chip exceeds the number of atoms in the universe, Sengupta said. There is no way for a person to understand that level of complexity, so human designers don’t try. They build chips from the bottom up, adding components as needed and adjusting the design as they build.

The AI approaches the challenge from a different perspective, Sengupta said. It views the chip as a single artefact. This can lead to strange but effective arrangements. He said humans play a critical role in the AI system, in part because that AI can make faulty arrangements as well as efficient ones. It is possible for AI to hallucinate elements that don’t work, at least for now. This requires some level of human oversight.

“There are pitfalls that still require human designers to correct,” Sengupta said. “The point is not to replace human designers with tools. The point is to enhance productivity with new tools. The human mind is best utilised to create or invent new things, and the more mundane, utilitarian work can be offloaded to these tools.”

The researchers have used AI to discover and design complex electromagnetic structures that are co-designed with circuits to create broadband amplifiers. Sengupta said future research will involve linking multiple structures and designing entire wireless chips with the AI system.

“Now that this has shown promise, there is a larger effort to think about more complicated systems and designs,” he said. “This is just the tip of the iceberg in terms of what the future holds for the field.”

This issue is sponsored by —Electronex — www.electronex.com.au 15

SPONSORED CONTENT

THREE YAMAHA YSM20R MOUNTERS INSTALLED AT GPC ELECTRONICS MAXIMISING CAPABILITY AND SCALABILITY

GPC Electronics Pty Ltd is a well-established contract electronics manufacturer based in Jamisontown, NSW, with offices in New Zealand and China. Founded in 1985 by Christopher Janssen, the company ensures high standards across its production processes, from supply chain management to PCB design and expert manufacturing.

H

awker Richardson has been working with GPC Electronics for decades, and with the recent addition of three Yamaha YSM20R mounters, has completed the facility’s fourth production line. Plant Manager Rodney Gibson shares further insights in the full case study.

Rodney — you are the Plant Manager of GPC Electronics.

Can you tell us about the company?

It is important that GPC has the capability to manage all types of customers. We can help start-ups with their products, develop the processes, and then lock them in. Design for Manufacture and design for test is one part of that. When we do a build for the first time, we can see what processes went right and where there are opportunities for improvement. This allows the process and the design to be fine-tuned for volume production.

GPC is a contract electronics manufacturer. We make products for other companies; we don’t have any product of our own.

We have accreditation to many standards, including Quality – ISO 9001, Medical – ISO 13485, Aerospace and Defence – ISO 9100, and Environmental Systems – ISO 14001. We also have DISP approval and recent accreditation to ISO 27001 – Information Security Management Systems. We have fully implemented SAP as our ERP system across the whole group and utilise an MES system, which allows a great level of traceability for every product.

You have lots of different brands of equipment at your facility. How well do the Yamaha mounters integrate with those other brands of equipment?

GPC provides a range of services, including Design for Manufacture and Electronics Manufacturing. Customers come from a range of sectors, including defence, commercial, space, medical, and aerospace. How important is it for GPC to cater for a range of needs, including specialisations such as ruggedised electronics?

GPC now has four lines, and each line has impressive capability with three mounters. How important is it for GPC to offer capability AND scalability?

GPC offers services to many different market segments in the industry, and each one is unique. We may be building prototypes for new start-ups, and we also build products for larger organisations, such as multinationals, where we build thousands of products.

16 This issue is sponsored by — Electronex — www.electronex.com.au

Yamaha surface mount machines fi t in line with many other brands of equipment and different processes. From surface mount stencil printers, solder paste inspection machines, board handling equipment, reflow ovens and automatic optical inspection stations. We run the whole cell as one unit, and the Yamahas fit in seamlessly.

Capability and scalability are very important. In today’s world, components are getting smaller, and designs are becoming more complex.

We selected the Yamaha YSM20Rs due to the throughput and accuracy of the machines and local support for such critical equipment.

We have now put YSM20Rs into all our facilities. This allows us to quickly transfer product between organisations. We can

tables out, scan new tables to the machines and then we were right to run. We saw huge benefits in that, in the order of 80% reduction in changeovers.

With offices/facilities in Sydney, Christchurch in New Zealand, and Shenzhen in China, how important is it for GPC to draw business from the Australasian market and overseas?

Some businesses like to have manufacturing close to where they are located. They can look at the progress of new products, or there may be special security requirements and, therefore, products must be made in a certain location. GPC can support all these options for customers.

GPC can offer manufacturing from a low labour cost market such as China. The advantage with GPC is that we manage all processes locally for the customer. The customer doesn’t have to deal with China directly. They deal with GPC, and we organise the purchasing, planning, and all aspects of the builds.

We have an International Procurement Office in China and do a lot of our purchasing for the group from there. We can also perform quality audits on products before they ship. Noncompliant product is detected before it is shipped to GPC, improving quality and eliminating delays.

Hawker Richardson has been an SMT equipment supplier to GPC for over a decade. How important is it that your suppliers understand your business and your requirements?

start a product in Australia or New Zealand and then transfer the product to China. The Yamahas have been integral in making that transfer process very easy.

Having four identical lines in Australia gives us great capacity and flexibility. We can run any product on any line, there are no planning considerations. Our four lines have three modules in each line, which offers a huge feeder account. We build some products which have over 6,000 parts on a board. We can set up those products to run both sides in the one set-up, so lots of flexibility and capacity.

You have made some significant investments over the years that enable GPC to offer impressive capabilities for Electronics Manufacture. How important is it for you to measure each part of the production process to ensure maximum efficiency and productivity?

We verify the performance of major equipment after we have purchased it. When running a surface mount line, we can see the actual machine output and compare that to what is in our ERP system to see whether we are on track with effi ciency.

We also have automatic optical inspection stations at the end of each line, which look at the quality of the product going through. This information feeds back into a real-time SPC chart so we can verify the quality of the product.

We also ensure that the equipment is utilised correctly. With the surface mount equipment, we went through a quick changeover process, looking to optimise all steps in the process.

One of the outcomes was to invest in more surface mount tables, feeders and software. We could do complete offline setups while machines were running other product. When the changeover occurred, it was quite easy just to move the old

Our suppliers must have a very good knowledge of GPC equipment and processes. If we have breakdowns, they need to make sure we are up and running as soon as possible.

In terms of equipment spares, Hawker Richardson identifies which ones are critical and stores them locally so that if something were to happen, we can be up and running very quickly.

Knowing what we currently do means that they provide good solutions for new equipment straight away rather than going through a process where there’s lots of discussion working out what is best for GPC.

Could you share your overall experience with Hawker Richardson’s service and support?

The overall experience with Hawker Richardson is very positive.

We have been working together for a long time, and they have very good knowledge of their product. If something happens to their equipment, we know that they will sort it out quickly.

Hawker Richardson is also willing to help in difficult situations.

With the recent purchase of surface mount equipment, we were going to have a long delay due to transport issues at the wharf.

Hawker Richardson reduced the delay. We moved the equipment off the boat earlier and transported it across land to get it onsite earlier. The machines were up and running quickly.

Would you recommend Hawker Richardson to anyone else based on your experience?

They are easy to deal with, reliable and always on time. Our experiences have been very good over many years. So, very happy to recommend Hawker Richardson.

Hawker Richardson www.hawkerrichardson.com.au This issue is sponsored by —Electronex — www.electronex.com.au 17

PIEZO ELECTRIC SWITCH Control Devices has launched a reinforced PBAK

MINIATURE DC MOTORS

series (19 mm diameter) of piezo electric switches.

FAULHABER has ex-

The anti-vandal switches are designed with a

panded its DC motor

stainless steel (316L) body and polycarbonate

line-up with the 1218

illumination ring to extend protection. They are

SXR and 1228 SXR;

sealed to IP69K and can withstand impacts of

t h e s e h i g h - p e r f o r-

up to IK06 (equivalent to one joule), with a long

mance miniature mo-

life expectancy of up to 50 million cycles.

tors feature optimised

The switches also feature bright RGB illumina-

rotor balancing for

tion feedback for increased visibility in all types of

smooth operation and extended lifespan, making them suitable for

conditions. The switches are suitable for various

precision-driven industries.

outdoor applications such as bike sharing stations,

The SXR series stands out with its innovative hexagonal coil

emergency call boxes or parking meters, as well

technology, offering a high copper fill factor and straight wiring for

as applications that require impact resistance.

enhanced efficiency. A new magnet grade boosts magnetic induc-

Control Devices Australia www.controldevices.com.au

tion and temperature stability, providing consistent performance in challenging environments.

With flexible voltage options (3–18 V), multiple bearing configurations and customisation possibilities (including vacuum and high-temperature adaptations), these motors cater to diverse needs. They are RoHS compliant and easily integrate with FAULHABER’s planetary gearheads, like the 14GPT, for compact, high-power solutions.

Targeting industries such as prosthetics, surgical tools, metrology, semiconductor processing and automation, the SXR family is designed to deliver exceptional power-to-volume ratio and precision. The SXR motors are also suitable for medical devices and high-tech automation.

ERNTEC Pty Ltd www.erntec.net

AI ACCELERATION MODULES Advantech has launched the EAI-1200 and EAI-3300 AI acceleration modules, powered by Hailo-8 AI processors. Delivering up to 52 TOPS with over 12 times the power efficiency of comparable AI modules and GPUs, the modules come in standard M.2 and PCIe form factors. They can be integrated with x86 and ARM-based platforms, thereby enabling quick AI upgrades for existing systems. By offloading inference tasks to the Hailo-8 NPU while managing application processing on the CPU, the modules also enhance resource efficiency. A user-friendly software suite — including Edge AI SDK, Dataflow Compiler and TAPPAS — streamlines AI deployment and development.

The EAI-1200 M.2 AI module, powered by a single Hailo-8 VPU, delivers up to 26 TOPS while consuming just 5 W. Designed for integration, it operates in temperatures from -40 to 65°C with an optional heatsink. Suitable for applications like baggage screening, workforce safety and autonomous mobile robots (AMR), it pairs with Advantech systems such as ARK-1221L, AIR-150 and AFE-R770.

Featuring dual Hailo-8 VPUs, the EAI-3300 PCIe AI card provides 52 TOPS of AI processing at just 15 W. Its low-profile design and efficient cooling enable operation from -40 to 70°C. Compatible with AIR-510, AIMB-279 and ARK-3534D, it is designed for medical imaging, traffic monitoring and defect inspection.

Advantech Australia Pty Ltd www.advantech.net.au

18 This issue is sponsored by — Electronex — www.electronex.com.au

ALUMINIUM ENCLOSURE Hammond has introduced the IP68 1550ZF range, flanged versions of all 18 sizes in the established 1550Z rugged thick wall heavy-duty diecast enclosure family. The full-size flange is spot-welded to the base to provide a strong and smooth mounting plate for use when the units are secured to a surface.

The 18 sizes range from 50 x 45 x 30 mm to 223 x 147 x 83 mm, with

FANLESS INDUSTRIAL COMPUTER

the lids’ thickness ranging from 5–33 mm in depth depending on the size. The tongue

The Tensor i22 Fanless Industrial Com-

and groove design and a pre-formed one-piece silicone rubber gasket gives the IP68

puter is a rugged, high-performance

environmental protection so the enclosures are suitable for installation in environments

system designed for industrial and

where dust and water will be present.

edge computing applications.

They are UL and cUL Listed and have been independently tested to IP66, IP67 and

Built with reliability in mind, it features

IP68; they are also rated to NEMA Type 4, 4X, 12 and 13. All sizes except the smallest

a fanless design for silent operation and

have an impact rating of IK08, defined in IEC 62262 as the equivalent to the impact of

resistance to dust and debris, making

a 1.7 kg mass dropped from 300 mm above the impacted surface.

it suitable for harsh environments.

They are available in a natural finish or with a tough polyester black powder finish to

Equipped with Intel 12th Gen Alder

both the outside and inside of the enclosure.

Lake processors, the computer can

Hammond Electronics Pty Ltd www.hammfg.com

provide robust computing power and energy efficiency for demanding tasks such as industrial automation, machine vision and IoT edge deployments.

15.6″ FANLESS PANEL PC ICP Electronics Australia has introduced iEi’s PPC2-CW156A-ADLP 15.6″ fanless panel PC. The fanless industrial panel PC is designed for demanding environments and powered by Intel Alder Lake-P and Raptor Lake-P processors. It offers good performance and versatility, supporting 12th and 13th Gen Intel Core i7/i5/i3 mobile processors, with 8 GB of DDR4 SO-DIMM memory (expandable to 64 GB).

The 15.6″ full HD display features a 10-point capacitive touchscreen with anti-glare and anti-UV coating, enabling clear visibility even in challenging light conditions.

The device also supports 4K UHD output via HDMI, making it suitable for highresolution visual applications.

For connectivity, the panel PC is equipped with dual 2.5 GbE LAN ports, four USB 3.2 Gen1 ports, and multiple M.2 expansion slots, allowing for extensive peripheral integration. Remote management is enabled with optional IPMI 2.0 support, facilitating system monitoring and maintenance from afar.

Built with a durable aluminium and SECC enclosure, the panel PC is IP65-compliant, ensuring protection against dust and water. Additionally, its fanless design allows for operation in harsh environments, withstanding temperatures ranging from -20 to 60°C, making it suitable for industrial applications.

ICP Electronics Australia www.icp-australia.com.au

20 This issue is sponsored by — Electronex — www.electronex.com.au

The compact system supports dual 2.5GbE L AN ports for high-speed network connectivity, multiple USB and serial ports for peripheral integration, and optional expansion slots for custom configurations. It also offers wide operating temperature ranges and is tested for shock and vibration resistance to enable good performance in challenging conditions.

It supports advanced storage solutions, including NVMe SSDs, providing rapid data access and secure storage for critical applications. With its compact form factor and versatile mounting options, it integrates seamlessly into industrial set-ups, vehicles or control cabinets.

Metromatics provides local sales, service and support for the Tensor i22 to help Australian users with expert assistance and ongoing support for their industrial computing needs.

Metromatics Pty Ltd www.metromatics.com.au

How AI is remodelling the IoT

iStock.com/Userba011d64_201

B

ack in 1956, Allen Newell, Cliff Shaw and Herbert Simon put together a computer program called The Logic Theorist. Funded by the RAND Corporation, the program intended to mimic the problem-solving skills of a human and is considered by many to be the first example of artificial intelligence (AI).

Fast forward to today, and the poster child for AI is the large language model (LLM). LLMs are computational

algorithms that achieve general-purpose language generation and other natural language processing tasks by learning statistical relationships from text documents during an intensive training process. OpenAI’s ChatGPT is perhaps the best-known example.

Useful though they are, for the IoT it is not the potential of LLMs that’s driving things forward. Where things get exciting is when huge volumes of data collected by automated systems are used to train machine learning (ML) algorithms that are later deployed to make IoT devices make better and smarter decisions. ML is an application of AI that involves training algorithms on large datasets, enabling computers to make predictions or decisions based on patterns and insights derived from the data, without being explicitly programmed to perform specific tasks. This process enhances the capabilities and intelligence of machines over time as they process more data.

The IoT can be described as a global interconnected network with the capacity to collect a virtually limitless volume of data. That data can be fed to computers in the cloud and used to fuel ML algorithms that enhance the intelligence of the billions of connected devices making up the network. Even the most modest IoT device can become continually smarter, offering huge potential for the future of industry, commerce, education, medicine and more.

22 This issue is sponsored by — Electronex — www.electronex.com.au

ML in action Despite a range of tough engineering challenges, developers are already introducing IoT products with ML into the commercial sector. One example is Norwegian company Sensorita. The firm has launched a smart waste management solution based on Nordic’s nRF9160 SiP cellular IoT product. Sensorita’s device uses radar technology based on research from the Norwegian University of Life Sciences to assess the fill levels and contents of large waste receptacles.

Waste management companies face problems such as customers moving waste disposal containers and disposing of different waste than agreed, not knowing how full the container is, what’s in it or when it should be picked up. This creates problems for logistics and production planning, and increased CO2 emissions from unnecessary pick-ups.

Sensorita has addressed the problem with a rugged sensor incorporating radar and GPS. The sensor takes radar images of the inside of the container multiple times per hour, and these are then sent to the Sensorita cloud platform for analysis. Using ML algorithms trained on millions of radar images, the sensor can estimate how full the receptacle is, and the main material type it contains.

The nRF9160 SiP uses cellular network location data and GNSS trilateration to record the precise location of each container and transmits the sensor data to the Sensorita cloud platform through its LTE-M/NB-IoT modem. Sensorita also uses ML to optimise the route taken by trucks as they travel around cities emptying the waste containers; the results are fuel savings, reduced man-hours and lower carbon emissions.

More efficient fridges, predictive maintenance and waste bin optimisation are important, but they are niche. When ML is widely deployed on the network the results will be dramatic. One example is the impact of the technology on health care. Wireless SoCs like Nordic’s nRF54H20 will support wearables with a wide array of sensors such as heart rate, heart rate variability (HRV), temperature, respiration rate, blood oxygen, stress, fatigue and other physiological signs. Such wearables won’t be just for fitness fanatics, but worn by seniors, adults and children alike.

Armed with ML and cellular IoT connectivity, the wearable becomes a device that can continuously monitor multiple vital signs simultaneously. And if some or all show signs of change, the wearable’s ML model could determine if the trend is trivial or a serious medical emergency. An example might be a sudden change in blood oxygen level, heart rate, blood pressure and respiration rate that indicate an imminent cardiac problem.

If things are serious, the wearable could notify first responders while also providing them with vital data ahead of arrival.

Such a device could protect stretched healthcare budgets by cutting down on hospital visits while optimising the care of people who really need it. That would save hundreds of billions of dollars across the world.

The ability to perform ML on low-power, embedded devices that can run on batteries will transform the IoT. It will make the network even more intelligent, capable and flexible. And it will enable new types of products and applications that were previously impossible. It makes for an exciting future and one which is much closer than you might think.

Nordic Semiconductor

www.nordicsemi.com

This issue is sponsored by —Electronex — www.electronex.com.au 23

RESEARCHERS CREATE

iStock.com/Tanased Hemathulin

QUANTUM ‘SCHRÖDINGER’S CAT’ IN SILICON CHIP

A team led by UNSW quantum engineers has created a ‘Schrödinger’s cat’ — a famous quantum thought experiment — inside a silicon chip.

U

NSW engineers have demonstrated a well-known quantum thought experiment in the real world. Their findings deliver a new and more robust way to perform quantum computations — and they have important implications for error correction, one of the biggest obstacles standing between them and a working quantum computer.

Quantum mechanics has puzzled scientists and philosophers for more than a century.

One of the most famous quantum thought experiments is that of the “Schrödinger’s cat” — a cat whose life or death depends on the decay of a radioactive atom.

According to quantum mechanics, unless the atom is directly observed, it must be considered to be in a superposition — that

is, being in multiple states at the same time — of decayed and not decayed. This leads to the troubling conclusion that the cat is in a superposition of dead and alive.

“No one has ever seen an actual cat in a state of being both dead and alive at the same time, but people use the Schrödinger’s cat metaphor to describe a superposition of quantum states that differ by a large amount,” said UNSW Professor Andrea Morello, leader of the team that conducted the research, published recently in the journal Nature Physics.

Atomic cat

For this research paper, Professor Morello’s team used an atom of antimony, which is much more complex than standard ‘qubits’, or quantum building blocks.

24 This issue is sponsored by — Electronex — www.electronex.com.au

“In our work, the ‘cat’ is an atom of antimony,” said Xi Yu, lead author of the paper.

“Antimony is a heavy atom, which possesses a large nuclear spin, meaning a large magnetic dipole. The spin of antimony can take eight different directions, instead of just two. This may not seem much, but in fact it completely changes the behaviour of the system. A superposition of the antimony spin pointing in opposite directions is not just a superposition of ‘up’ and ‘down’, because there are multiple quantum states separating the two branches of the superposition.”

This has profound consequences for scientists working on building a quantum computer using the nuclear spin of an atom as the basic building block.

“Normally, people use a quantum bit, or ‘qubit’ — an object described by only two quantum states — as the basic unit of quantum information,” said co-author Benjamin Wilhelm.

QUANTUM COMPUTING

“If the qubit is a spin, we can call ‘spin down’ the ‘0’ state, and ‘spin up’ the ‘1’ state. But if the direction of the spin suddenly changes, we have immediately a logical error: 0 turns to 1 or vice versa, in just one go. This is why quantum information is so fragile.”

But in the antimony atom that has eight different spin directions, if the ‘0’ is encoded as a ‘dead cat’, and the ‘1’ as an ‘alive cat’, a single error is not enough to scramble the quantum code.

“As the proverb goes, a cat has nine lives. One little scratch is not enough to kill it. Our metaphorical ‘cat’ has seven lives: it would take seven consecutive errors to turn the ‘0’ into a ‘1’! This is the sense in which the superposition of antimony spin states in opposite directions is ‘macroscopic’ — because it’s happening on a larger scale, and realises a Schrödinger cat,” said Yu.

Scalable technology

The antimony cat is embedded inside a silicon quantum chip, similar to the ones we have in our computers and mobile phones, but adapted to give access to the

quantum state of a single atom. The chip was fabricated by UNSW’s Dr Danielle Holmes, while the atom of antimony was inserted in the chip by colleagues at the University of Melbourne.

“By hosting the atomic ‘Schrödinger cat’ inside a silicon chip, we gain an exquisite control over its quantum state — or, if you wish, over its life and death,” said Holmes.

“Moreover, hosting the ‘cat’ in silicon means that, in the long term, this technology can be scaled up using similar methods as those we already adopt to build the computer chips we have today.”

The significance of this breakthrough is that it opens the door to a new way to perform quantum computations. The information is still encoded in binary code, ‘0’ or ‘1’, but there is more ‘room for error’ between the logical codes.

“A single, or even a few errors, do not immediately scramble the information,” said Morello.

“If an error occurs, we detect it straight away, and we can correct it before further errors accumulate. To continue the

‘Schrödinger cat’ metaphor, it’s as if we saw our cat coming home with a big scratch on his face. He’s far from dead, but we know that he got into a fight; we can go and find who caused the fight, before it happens again and our cat gets further injuries.”

The demonstration of quantum error detection and correction — a ‘Holy Grail’ in quantum computing — is the next milestone that the team will address.

The work was the result of a vast international collaboration. Several authors from UNSW Sydney, plus colleagues at the University of Melbourne, fabricated and operated the quantum devices. Theory collaborators in the USA, at Sandia National Laboratories and NASA Ames, and Canada, at the University of Calgary, provided precious ideas on how to create the cat, and how to assess its complicated quantum state.

“This work is a wonderful example of open-borders collaboration between worldleading teams with complementary expertise,” said Morello.

This is a modified version of a news item published by UNSW Sydney.

This issue is sponsored by —Electronex — www.electronex.com.au 25

SMCBA CONFERENCE returns with exciting line-up Australia’s most anticipated electronics design and manufacturing conference is back from 6–8 May! Australia’s most anticipated electronics design and manufacturing conference is back! This exclusive three-day event brings together industry professionals, engineers, innovators and manufacturers to explore the latest advancements, trends and challenges in the ever-evolving electronics landscape. Whether you’re an industry veteran or an emerging entrepreneur, the SMCBA conference is designed to equip you with valuable insights into quality and competitive design and manufacture of electronics.

Nadia Court

Ben Kitcher

Jasbir Bath

Chris Turner

Chuck Corley

Dave Hillman

Tuesday: The Future of Advanced Manufacturing

Following insightful opening addresses from Nadia Court, CEO – Semiconductor Support Service Bureau and Ben Kitcher, Executive Director – Advanced Manufacturing Readiness Facility on Australian advanced manufacturing, Jasbir Bath of Bath Consultancy LLC will share an in-depth review of the most recent INEMI Board Assembly Chapter Roadmap. He will detail some challenges the electronics assembly industry will face in the next 10 years and discuss potential solutions to those challenges, including component developments such as larger BGAs and CPU sockets; press-fit technology; SMT printing; reflow and rework/repair of electronic assemblies and the developments needed for the assembly materials used.

Wednesday: Feeding the Hungry Lion

Designs for high power consumption devices require careful consideration of thermal management, power integrity and signal integrity. Chuck Corley, of Speeding Edge, will provide a course focused on the practical knowledge and design techniques needed for a power delivery system that supports the demands of modern power-hungry ICs; covering types of power system components and their extremely undesirable system side effects if incorrectly selected. Strategies will be laid out for designing power delivery systems that yield reliable system designs.

Currently a Principal DFT Consultant for Red back Test Services, Chris Turner is widely recognised for his expertise in developing and deploying test solutions and methodologies.

He is a skilled guide for electrical designers in DFT, creation of robust test requirements, developing and designing PCBA test hardware to measurably lower overall costs while ensuring high-quality medical, automotive, military and aerospace products.

Turner’s presentation examines how top-performing companies in

26 This issue is sponsored by — Electronex — www.electronex.com.au

the PCBA industry use risk-driven development strategies to boost efficiency. It also showcases real-world examples and practical techniques that have proven successful in industry.

Thursday: Invisible Terminations

Bottom Termination Components presents a unique set of challenges in modern electronics manufacturing. Dave Hillman, of Hillman Electronic Assembly Solutions LLC, will provide a workshop focused on the evolution and introduction of BTC and LGA components into the electronics industry. The component package design attributes and manufacturing aspects, from land patterns, solder paste and stencilling through to cleaning, will all be discussed. Solder joint reliability, for both Sn/Pb and Pb-free soldering processes, is covered in terms of thermal cycling, vibration and drop shock under IPC Class 2/3 High Performance product testing. The impact of voids in terms of solder joint integrity and thermal attributes will be specifically covered in depth.

The SMCBA conference is the ultimate destination for professionals looking to stay ahead in the fast-paced world of electronics design and manufacture. So, Secure Your Spot Today! Don’t miss out on this unparalleled opportunity to connect with local and global electronics experts. Register now and be part of the future of electronics!

Registrations from only $585* *SMCBA Member discounted price excluding GST

To see the full program and register, visit: smcba.asn.au/conference.

AUSTRALIA’S LARGEST

ELECTRONICS EXPO RETURNS TO MELBOURNE Electronex — The Electronics Design and Assembly Expo & Conference — will be held in the Melbourne Convention and Exhibition Centre from 7–8 May 2025.

E

lectronex is Australia’s major exhibition for companies using electronics in design, assembly, manufacture and service in Australia.

Electronex will be co-located with Australian Manufacturing Week, with trade visitors able to attend both events on the Wednesday and Thursday. Noel Gray, Managing Director of Electronex and Organiser AEE, said, “Following the success of the co-location in 2023 we are delighted to again be holding Electronex alongside Australia’s premier manufacturing event. Hundreds of exhibitors will be meeting face to face with thousands of trade visitors, creating the largest event for the manufacturing sector in Australia. Electronex focuses on the hi-tech end of manufacturing and visitors will be able to see the entire spectrum of the latest products, technology and turnkey solutions for the electronics and manufacturing industries at the one venue.”

Electronex features a wide of range of electronic components, surface mount and inspection equipment, test and measurement and other ancillary products and services.

Companies can also discuss their specific requirements with contract manufacturers that can design and produce turnkey solutions

for their products. Many companies will be launching and demonstrating new products and technology at the event and over 100 local and international companies will be represented at this year’s Expo, making it the largest ever held. The show attracts designers, engineers, managers and other decision-makers who are involved in designing or manufacturing products that utilise electronics and is the only specialised event for the electronics industry in Australia. With many Australian manufacturers now focusing on niche products and hi-tech applications, the event provides an important focal point for the industry in Australia.

Regulatory Approval to Sell Your Products in AU & Globally, Microchip’s AI-Centric 64-Bit Processors, Smart AI In Conformal Coating and Dispensing, Software-defined Test: A More Efficient Way to Automate and Validate, High Mix SMT Manufacturing, Leveraging Strategic Partnerships to Transform Traditional Products into Smart Innovations, Advancing Edge Computing with AMD, Technology & Process Capabilities for SMT PCB Assembly in Australia, and Building a Product Test System the Right Way. Visit the show website for times and session details.

Competitions will also be held on the show floor where visitors can test their skills against their peers. Could you be Australia’s champion wire harness assembler or hand soldering expert? The SMCBA, with the support of IPC International, will once again be conducting the Australian Round of the IPC Hand Soldering Competition (HSC) and — excitingly — the Australian Round of the inaugural IPC/WHMA Wire Harness Competition (WHC)!

The WHC will be a timed event where entrants assemble a multi-wire harness with various connectors and termination types! The winner will have the opportunity to compete in the international finals at the iEMi Expo, Bengaluru India, January 2026!

Free Expo registration: www.electronex.com.au Australasian Exhibitions and Events Pty Ltd www.electronex.com.au

Free seminars and competitions

A series of free seminars will also be held on the show floor with visitors able to attend on the day with no pre-booking required.

These sessions will provide an overview of some of the hot topics and key issues for the industry. Topics include: Reliability in Programmable Power Supplies, Affordable Yet Versatile Multifunction 12 in 1 Test & Measurement Devices, Successful Product Development, Handling Complexity in PCB Manufacturing and Assembly, Compliance and

This issue is sponsored by —Electronex — www.electronex.com.au 27

7–8 MAY 2025 STAND

C16

STAND

D17

MIXED-SIGNAL OSCILLOSCOPE The Analog Discovery Pro (ADP2230) is a mixed-signal oscilloscope (MSO) designed for professional engineers.

It features analog inputs, analog output and digital I/O, with deep memory buffers all operating at up to 125 MS/s.

Users can both receive and generate digital signals to test and analyse data from various devices while powering those systems with its robust power supply. The featurepacked design allows the oscilloscope to perform the functions of several test and measurement devices and can replace a range of traditional instruments.

With the free WaveForms software, users can view and capture complex data, perform spectral and network analysis, and quickly retrieve large amounts of data. WaveForms leverages the product’s deep buffer memory, allowing hundreds of millions of samples to be stored and streamed back to the host computer.

The software’s friendly user interface also has the feel of traditional benchtop oscilloscopes.

Digilent Inc www.digilent.com

VECTOR NETWORK ANALYSER Rohde & Schwarz has launched the R&S ZNB3000 vector network analyser, designed to provide precision, versatility and speed for RF testing.

Featuring fast measurement speeds and scalable upgrades, the analysers are designed to tackle a range of demanding applications. The vector network analyser is engineered to maximise throughput with fast measurement cycles, thereby reducing testing costs and facilitating faster time to market.

The analyser supports flexible upgrades for fast scaleup requirements. It features high dynamic range, low trace noise and high output power. The product is designed to support next-generation technologies, such as 6G.

Rohde & Schwarz (Australia) Pty Ltd www.rohde-schwarz.com.au

STAND

A6

THERMAL CIRCUIT BREAKERS The Multicomp Pro thermal circuit breakers provide an efficient way to facilitate repeatable circuit protection. They are designed as a replacement for standard blown fuses.

The breakers assist with systems that may be exposed frequently to over currents, or where replacing fuses may not be feasible. The manual reset version leaves the circuit

EMC • EMR • RADIO • SAFETY • ENV Accredited testing and global product approvals since 1992

in the open position until a safety diagnosis of the circuit fault is complete.

The thermal circuit breakers are also non-cycling, thereby allowing users to reset the breaker and close the circuit.

The circuit breakers are suitable for a range of applications, including automation and process control (such as transformers and motors), electronics, and safety and system monitoring.

EMC Technologies Pty Ltd

Melbourne: +61 3 9365 1000 Sydney: +61 2 9624 2777 Bayswater: +61 3 9761 5888 Auckland (NZ): +64 9 360 0862

www.emctech.com.au 28 This issue is sponsored by — Electronex — www.electronex.com.au

element14 au.element14.com

7–8 MAY 2025

ENCLOSURES FOR MOUNTING ARM SYSTEMS OKW Gehäusesysteme offers a range of advanced enclosures for mounting arm and suspension systems. These systems enable flexible positioning of medical devices and monitors, making them vital in operating theatres and intensive care units.

The Carrytec enclosure features a functional handle and large surfaces suitable for user interfaces (small = 8.4″, medium = 10.4″, large = 13.4″). It enables users to align and position displays and operating surfaces, with clean cable routing.

The slightly smaller Interface-terminal is a multifunctional electronics enclosure with numerous design options, a range of accessories and optional IP54 protection.

For added robustness, the Smart-terminal aluminium profile enclosure, with its recessed control panel for installing and protecting displays, membrane keypads and control elements, is also a suitable choice to support medical devices.

The choice of appropriate enclosure depends on the specific application requirements and spatial conditions.

ROLEC OKW Australia New Zealand P/L www.okw.com.au

This issue is sponsored by —Electronex — www.electronex.com.au 29

7–8 MAY 2025

STAND

A30

SMART FACTORY SOFTWARE Yamaha’s YsUP software for SMT machinery offers a range of benefits for PCB manufacturers of all sizes. Designed to meet the demands of Industry 4.0, Yamaha’s software suite enables OEMs, CEMs and small operators to overcome the challenges of disconnected machinery and multi-vendor environments.

YsUP’s full factory suite of products, P, S and T tools are designed to work together as part of an integrated ecosystem to enhance various aspects of the SMT assembly process. P Tools programs and schedules tasks including data conversion and visual editing. S Tools centres on production assistance and material management, including component setup verification. T Tools focuses on traceability, production history management and quality analysis support.

With one smart, interconnected ecosystem, the software bridges the gap in non-machine-to-machine (M2M) environments, providing manufacturers with a united M2M communication portal for traceability, control and optimisation across many brands and suppliers. The YsUP Dashboard incorporates real-time monitoring, automatic analytics, customisable thresholds and production analytics plus component pickup analysis. Yamaha’s intelligent factory software provides manufacturers with tools for automation and connectivity to achieve smarter, more efficient PCB assembly.

Hawker Richardson will be exhibiting Yamaha’s YsUP software for SMT machinery at Electronex 2025, on stand A30.

Hawker Richardson www.hawkerrichardson.com.au

STAND

D17

TEST AND MEASUREMENT DEVICE INDUSTRIAL-GRADE MODULE The Glyn FN920C04 5G RedCap industrial-grade module enables 5G mid-speed connectivity by leveraging the latest 3GPP Release 17 RedCap technology. It is designed to enhance performance and efficiency compared to LTE while offering users a seamless transition to a 5G future. The industrial-grade, rugged module is designed for global deployment, featuring enhanced uplink performance, power-saving capabilities and LTE Cat 4 fallback for optimal coverage.

RedCap technology fills the gap between high-speed mobile broadband devices and ultralow-bandwidth IoT applications. The module offers worldwide coverage and flexible form factors, making it suitable for industrial automation, smart wearables and video surveillance applications.

The module can be integrated with Telit Cinterion connectivity and services, including NExT data plans, connectivity activation, AppZone and OneEdge. As 5G adoption accelerates, the module provides a future-ready connectivity solution for businesses transitioning from legacy networks.

Attendees of Electronex 2025 can request to qualify for a global 5G data card sample. Glyn’s robust cellular 5G data card portfolio enables commercial deployments for original equipment manufacturers (OEMs), system integrators and service providers. These data cards support 4G/5G multimode operation, enabling new product concepts to be tested and deployed quickly wherever LTE is available, even as 5G rollouts continue.

The module’s industrial-grade M.2 form factor enables migration from 3G and 4G solutions to 5G, making it suitable for enterprise routers and gateways, high-speed fixed wireless access modems, private LTE and 5G networks, video broadcasting and security applications.

The modules, leveraging Snapdragon X35 and X72 5G Modem-RF Systems, also offer an evolution path from LTE Cat 1 and Cat 4. The modules cater to mid-speed applications such as rugged telematics, industrial routers and connected health care.

Glyn Ltd www.glyn.com.au 30 This issue is sponsored by — Electronex — www.electronex.com.au

The Analog Discovery 3 is a portable, pocket-sized, mobile USB-powered test and measurement device, featuring a digital oscilloscope, logic analyser, waveform generator, pattern generator and much more.

Using Digilent’s free WaveForms software, the 12-in-one device can be used in the lab, in the field or even at home. It is lightweight and small enough to fit in a pocket or backpack, making it a suitable companion for any engineer.

The product features a large buffer size, allowing more data to be sent through the waveform generator and received through the mixed-signal (analog and digital) oscilloscope. It also has an increased sampling rate of up to 125 MS/s on all channels and a potent power supply (up to 800 mA). The larger buffers allow users to capture longer records at high resolution and enable more complex AWG signals.

Digilent Inc www.digilent.com

SPONSORED CONTENT

SMART AND SAFE CONTROL SOLUTIONS FOR MOBILE MACHINERY iStock.com/AUKID

In the rapidly evolving landscape of mobile machinery, the demand for ef ficient, safe, and adaptable control systems is paramount. HYDAC’s MATCH software platform emerges as a comprehensive solution, addressing these needs with precision and reliability.

Simulation Environment ( TSE), and Machine Service Tool (MST). These tools work seamlessly together, supporting development according to the V-model.

This integrated approach enhances efficiency and traceability across all stages of development.

What is MATCH?

4. Hardware Independence and Robustness

MATCH is a TÜV-certified sof tware suite designed for the development and maintenance of control software in mobile machinery. It offers optimally coordinated solutions throughout the machine’s entire life cycle, ensuring both innovation and safety are at the forefront.

Key Features and Benefits 1. Rapid Development and Redesign With MATCH, engineers can swiftly design new applications for complex vehicle or machine controls. It also facilitates quick redesigns of existing machines, components, and functions, leading to time savings of up to 50%.

2. Functional Safety Standards Safety is integral to MATCH. The suit of tools is designed for functional safety from the outset, with all tools, libraries, and components being TÜV-certified. This ensures that control systems are future-proof and compliant with stringent safety standards.

3. Comprehensive Toolchain MATCH’s toolchain comprises the Project Definition Tool (PDT), Test and

The plat form o f fers hardware independent programming, MATCH abstracts programming away from the hardware layer, allowing for flexibility in hardware selection. Its robust middleware and extensively tested and safety certified library function blocks ensure reliability and ease of portability to other hardware systems.

5. Multi-Controller Capability MATCH supports application development at the machine level, enabling the seamless integration of multiple control units and displays. This multi-controller approach ensures cohesive functionality and communication across the entire system.

Applications Across the Machine’s Life Cycle MATCH is designed to support various stages of a machine’s life cycle: • System Definition & Embedded Software Engineering: From requirements management to software design and programming, MATCH

provides a structured approach to developing control systems.

• Software Test & Machine Validation: MATCH facilitates testing through all steps of the V-model, including module and integration tests, system tests, and vehicle validation. Integrated modules support a plug-and-play test environment.

• Production & End-of-Line Support: The platform streamlines end-of-line commissioning, software downloads, machine configuration, and final validation, ensuring a smooth transition from production to deployment.

• Service Organisation & Field Service Engineering: MATCH provides comprehensive tools for service and maintenance, including user-related access rights, and machine-specific diagnostic pages.

Conclusion HYDAC’s MATCH software platform stands as a pivotal advancement in mobile machinery automation. By integrating safety, efficiency, and flexibility, it empowers engineers and developers to meet the evolving demands of the industry, ensuring that machinery is both innovative and reliable throughout its life cycle.

To learn more about MATCH software, click here.

HYDAC International

This issue is sponsored by —Electronex — www.electronex.com.au 31

7–8 MAY 2025 STAND

C2

MODULE The ME910G1-NTN module from Glyn integrates

STAND

B28

non-terrestrial networks (NTN) with traditional cellular communication. Designed to enhance application robustness, the module supports 2G, LTE-M, NB-IoT and satellite connectivity, facilitating

STENCIL ENGINEERING TOOL

continuous operation in remote and rural locations.

On-track Technology has incorporated the Siemens Process Preparation

Built on the Qualcomm 9205S LTE modem, the

Stencil Engineering Tool into its suite of products. This addition complements

module is optimised for IoT applications, including

the company’s range of Siemens Process Preparation SMT Preparation and

industrial sensors, agricultural equipment, utility

Programming Engineering tools.

meters and transportation solutions.

Siemens Process Preparation remains a core component of On-track Technol-

With compliance to 3GPP Release 17, the

ogy’s capability in processing PCBA datasets from clients. It has facilitated a

product enables uninterrupted connectivity by

standardised workflow, enabling the merging and normalisation of PCBA data

leveraging satellite communication as an additional

for SMT line programming. Custom API integrations have also been implemented

network path. This advancement improves perfor-

to link On-track Technology’s internally developed ERP/MRP/MES systems. This

mance in areas with limited terrestrial coverage,

integration streamlines BOM data sharing, enhances automation and accom-

such as oil fields, rural highways and offshore

modates last-minute customer changes, which are reflected in the Siemens

installations. Through collaboration with industry

Process Preparation database.

leaders, the module supports S and L band satel-

The Siemens Process Preparation Stencil Engineering Tool is designed to

lite connections, thereby enabling global reach.

optimise the critical task of stencil creation, providing first-time-right stencils

Developers benefit from its pin-to-pin compat-

and accurate paste quantity estimates per PCBA; it should thus reduce costs

ibility within the xE910 product family, making it

associated with stencil re-spins and SMT line downtime. It also improves the

a cost-effective solution for upgrading existing

quality of SMT NPI ramp-ups and facilitates the integration of lessons learned

designs. The product also provides businesses with

into future stencil designs.

an innovative and resilient communication platform.

On-Track Technology www.on-track.com.au

Attendees of Electronex 2025 can request to qualify for a global 5G data card sample. Glyn’s cellular 5G data card portfolio enables commercial deployments for original equipment manufacturers (OEMs), system integrators and service provid-

STAND

C23

ers. These data cards support 4G/5G multimode operation, enabling new product concepts to be tested and deployed quickly wherever LTE is

UV HYBRID EPOXY

available, even as 5G rollouts continue.

The Epoxy Technology Hybrid 353ND

The module’s industrial-grade M.2 form factor

is an advanced UV- and heat-curable

allows for seamless migration from 3G and 4G

hybrid epoxy that is designed to deliver

solutions to 5G, making it suitable for enterprise

good adhesion and mechanical perfor-

routers and gateways, high-speed fixed wireless

mance. Suitable for bonding, sealing

access modems, private LTE and 5G networks,

and coating applications in electronic

video broadcasting and security applications.

assembly, the hybrid epoxy offers flexibility and strength.

Glyn Ltd www.glyn.com.au

for semiconductor and fibre-optic applications. It is designed to have similar

A single component, the high-temperature hybrid epoxy is also suitable cured performance to EPO-TEK 353ND, modified to allow for initial UV tacking.

The epoxy features a Dual Cure System with UV and secondary heat cure mechanism for fast processing and enhanced performance. The epoxy bonds to a variety of substrates, including metals, ceramics and plastics. Its low outgassing and high purity make it suitable for optical and medical applications.

Other applications for the epoxy include semiconductor packaging and die attach, fibre bonding and component alignment, piezo electric bonding, LiDAR and IR sensors, and optical and medical device assembly.

Onboard Solutions www.onboardsolutions.com.au 32 This issue is sponsored by — Electronex — www.electronex.com.au

STAND

7–8 MAY 2025

B19

MICROPROCESSOR UNITS The 64-bit PIC64 series of MPUs from Microchip Technology offers a range of robust solutions for various markets, from commercial to space applications.

The PIC64-GX MPUs feature a 64-bit RISC-V quad-core processor with asymmetric multiprocessing (AMP), capable of running Linux, real-time OS and bare-metal in a single processor cluster. This makes it suitable for mid-range intelligent edge computing needs.

The series of microprocessing units also features an Athena F5200 TeraFire Crypto Processor; Cryptography Research Incorporated (CRI)-patented differential power analysis (DPA) protection; integrated dual physically unclonable function (PUF), 56 kilobytes of non-volatile memory; built-in tamper detectors; and digest integrity check for sNVM and eNVM. The microprocessor units are designed to serve industrial, automotive, communications, IoT, aerospace and defence segments, making them versatile for various high-demand applications.

The series also supports a range of operating systems, build systems and drivers/middleware. It is also backed by both open-source and commercial tools.

Microchip Technology Hong Kong Limited www.microchip.com

STAND

A12

SOLID-STATE DRIVE The Exascend AS500 BGA solid-state drive (SSD) is designed to power the future of automotive innovation, delivering high-speed and compact storage for connected vehicles, ADAS, infotainment systems and autonomous driving applications. With a PCIe 3.0 NVMe 1.3 interface, the product facilitates fast data transfer, minimal latency and enhanced responsiveness, making it suitable for real-time, mission-critical automotive workloads.

Built with automotive-grade 3D TLC NAND, the SSD features wide temperature tolerance (-40 to 105°C) and rugged durability to withstand a range of environmental conditions. Advanced error correction, power loss protection and intelligent thermal management enable data integrity under continuous operation.

With its ultra-compact BGA form factor, the SSD can be integrated into space-constrained automotive designs while supporting storage capacities up to 1 TB. Whether for high-definition navigation, real-time sensor fusion or AI-powered vehicle systems, the product enables fast performance and the endurance needed for next-generation automotive applications.

Control Synergy www.controlsynergy.com.au

This issue is sponsored by —Electronex — www.electronex.com.au 33

OPTICAL MEMORY UNIT BOOSTS PROCESSING SPEED

Researchers have developed a new type of optical memory called a programmable photonic latch that is fast and scalable. This fundamental memory unit enables temporary data storage in optical processing systems, offering a high-speed solution for volatile memory using silicon photonics.

T

he new integrated photonic latch is modelled after a set-reset latch, a basic memory device used in electronic devices to store a single bit by switching between set (1) and reset (0) states based on inputs.

“While optical communications and computing have seen significant progress over the past decades, data storage has been predominantly implemented using electronic memory,” said the study’s author Farshid Ashtiani from Nokia Bell Labs. “Having a fast optical memory that can be used with optical processing systems, as well as other optical systems used in communications or sensing, would make them more efficient in terms of energy and throughput.”

In the Optica Publishing Group journal Optics Express, the researchers describe a proof-of-concept experiment in which they demonstrated the photonic latch using a programmable silicon photonic platform. Features such as optical set and reset, complementary outputs, scalability and compatibility with wavelength division multiplexing (WDM) make this approach promising for faster and more efficient optical processing systems.

“Large language models like ChatGPT rely on massive amounts of simple mathematical operations, such as multiplication and addition, performed iteratively to learn and generate answers,” Ashtiani said. “Our

This new type of optical memor y unit, called a programmable photonic latch, is fast and scalable.

It could offer a high-speed silicon photonics solution for volatile memory.

Farshid Ashtiani, Nokia Bell Labs.

memory technology could store and retrieve data for such systems at high speeds, enabling much faster operations. While a commercial optical computer is still a distant goal, our high-speed optical memory technology is a step toward this future.”

Advancing integrated optical memory

Optical technologies have been instrumental in advancing communication systems, from long-haul data transmission and data centre connectivity to emerging technologies like optical interconnects and computing. However, data storage remains predominantly electronic due to its scalability, compactness and costeffectiveness. This presents challenges for optical processing systems because transferring optical data to electronic memory — and

34 This issue is sponsored by — Electronex — www.electronex.com.au

back — increases energy consumption and introduces latency.

Although there has been extensive research in the area of optical memory, most implementations rely on bulky, costly and energyintensive setups or specialised materials that are not typically offered in commercially available silicon photonic processes, leading to higher costs and lower yields.

To overcome these challenges, the researchers created an integrated programmable photonic latch based on optical universal logic gates using silicon photonic micro-ring modulators. These devices can be implemented in commercially available silicon photonic chip fabrication processes.

They combined two optical universal logic gates to create an optical latch that can hold optical data.

DATA STORAGE

iStock.com/RBFried

Creating memory that is scalable and fast

Ashtiani says that one key advantage of the new system is its scalability. “Because each memory unit has an independent input light source, it is possible to have several memory units working independently without affecting each other through optical power loss propagation,” he said. “The memory units can also be co-designed with the existing silicon photonic systems and be built reliably and with very high yields.”

Another advantage is the photonic memory unit’s wavelength selectivity, which allows it to work seamlessly with WDM. This is because the unit’s microring modulators are designed to operate at specific wavelengths, enabling multi-bit data storage within a single memory unit.

Additionally, it enables fast memory response time, measured in tens of picoseconds, outpacing the clock speeds of advanced digital systems and supporting high-speed optical data storage.

To demonstrate this approach to optical memory before making dedicated chips, the researchers used a programmable photonic platform to implement the universal logic gates and the optical latch through experiments and realistic simulations.

The researchers tested the gates under different input scenarios. Even in the presence of random variations, the gates reliably generated the desired outputs. Similarly, the latch also performed all functions — set, reset and hold— accurately in the presence of input power variations.

Next, the researchers would like to pursue several research directions to make the new memory units more practical. This includes scaling the technology to a larger number of memory units and fabricating dedicated photonic memory chips. This, combined with the WDM compatibility, would enable higher on-chip photonic memory density. They would also like to develop a way to use a single manufacturing process to integrate both the photonic memory circuit and the electronics needed to control it.

Certificate no.

TC-DNVGL-SE-0439-04314-0

This issue is sponsored by —Electronex — www.electronex.com.au 35

7–8 MAY 2025 STAND

A26

ALUMINIUM ENCLOSURES

NVMe SOLIDSTATE DRIVE The Exascend PE4 Se-

METCASE has released the TECHNOMET-CONTROL

ries is a PCIe Gen4

aluminium enclosures for electronic control systems,

NVMe SSD designed

panel PCs and HMI electronics. They are designed

to meet the storage

for mounting on standard VESA brackets/arms, walls,

requirements of data

machines and round poles.

centres, enterprise serv-

The enclosures are suitable for indoor applications such

ers and cloud comput-

as industrial machine control, factory processing, security

ing. Engineered for ef-

systems, test and measurement, point-of-sale, IIoT and

ficiency and scalability, the series provides low-latency, high-bandwidth

detection equipment. They are compatible with Siemens

performance, enabling data processing in virtualisation, artificial intel-

TP displays (sizes KTP400 to TP1200) but can also house

ligence (AI) and high-performance computing (HPC) environments.

touchscreens and displays by other manufacturers, including Beckhoff and B&R.

Built with enterprise-grade 3D TLC NAND and optimised for continuous 24/7 operation, the series delivers enhanced endurance and thermal efficiency. Exascend’s power loss protection (PLP), advanced error correction and firmware optimisations facilitate data integrity and system stability, even under demanding workloads.

The series supports U.2, E1.S and M.2 form factors with a capacity of up to 15.36 TB, offering flexible deployment options for modern server architectures. Featuring a PCIe 4.0 NVMe 1.4 interface, it accelerates data-intensive applications, making it suitable for next-generation data centres and enterprise storage solutions.

Control Synergy www.controlsynergy.com.au The enclosures feature diecast front and rear bezels that fit flush with the main case body. Snap-on trims hide all the assembly screws. The enclosures are easy to customise in any size, with plenty of space for connectors.

STAND

A1

The front panel is recessed in the bezel to protect displays and membrane keypads. At the rear, VESA MIS-D 100 mounting points are provided for fitting an off-the-shelf VESA control arm or wall bracket. The base panel on

DIGITAL OSCILLOSCOPES Rigol Technologies, represented in Australia by Emona Instruments,

the underside is removable with space for cable entry.

will launch a new series of digital oscilloscopes at Electronex 2025.

Inside, the assembly extrusions have M3 holes and

The Rigol MHO/DHO5000 series of 8-channel, high-resolution digital

guide rails to hold internal plates, while the rear panel

oscilloscopes meets a range of design, debugging and test demands.

has M3 PCB pillars. All the case panels are fitted with

Based on Rigol’s Centaurus technical platform, the oscilloscopes

M4 threaded pillars for earth connections. Some studs

offer up to eight channels, 1 GHz bandwidth, 1,000,000 wfms/s wave-

can also be used with retaining straps to secure the

form capture rate (in fast recording mode), 500 Mpts memory depth,

front and rear panels during maintenance.

12-bit resolution, an enhanced noise floor, and vertical measurement

The enclosures are available as standard in four sizes

accuracy to meet the test requirements for higher accuracy. The series

from 230 x 180 mm to 420 x 300 mm, with a slim profile

supports AFG, digital signal analysis, Bode plot and other functions.

that is 95 mm deep. The standard colour is traffic grey A

The oscilloscopes can also

(RAL 7042) or combination traffic grey A/traffic white (RAL

be powered by a battery

7042/9016). Custom colours are also available on request.

pack, offering convenient

Accessories include front panels, internal mounting

operation and control, ap-

plates, wall mounting kits and a pole mounting bracket

plicable for various com-

(for poles 50 mm in diameter or larger). METCASE can

plex test scenarios.

also supply the enclosures fully customised. Services

Emona Instruments Pty Ltd www.emona.com.au

include bespoke sizes, CNC machining, custom front panels, fixings and inserts, photo-quality digital printing and painting/finishing.

ROLEC OKW Australia New Zealand P/L www.metcase.com.au 36 This issue is sponsored by — Electronex — www.electronex.com.au

7–8 MAY 2025

STAND

A6

STAND

C23

MICRO DISPENSING SYSTEM The BDTronic Mini Dis is a micro dispensing device designed for high-precision fluid applications. Engineered to meet the demands of modern manufacturing, it offers control down to the nanolitre range for dispensing adhesives, sealants and conductive materials, making it suitable for microelectronics and medical applications.

The micro dispensing system’s modular and flexible design make it adaptable to various production environments. The system’s contactless jet dispensing enables rapid application without substrate contact. The system is also compatible with automated production lines.

Onboard Solutions www.onboardsolutions.com.au

PHOTOVOLTAIC/SOLAR CONNECTOR The Multicomp Pro MP013877 photovoltaic/solar connector is designed for use in solar power systems. The connector enables secure and efficient connections between solar panels and other components within the PV system.

Both male and female couples are included in one pack.

The couplers provide a stable connection to facilitate the operation of solar power systems. The connectors are built to withstand harsh environmental conditions, making them suitable for outdoor applications. They feature high voltage and current ratings and meet compliance and flammability standards, for safe operation within PV systems.

element14 au.element14.com

This issue is sponsored by —Electronex — www.electronex.com.au 37

PICK AND PLACE MACHINE The NXTR A model, part of the FUJI Smart Factory Platform, is a pick and place machine that is designed to enhance productivity, maintain high-quality standards and reduce the need for manual intervention, thereby streamlining the production process.

The pick and place machine is an automated part supply and exchange system. This system is enabled by the Smart Loader, which automates part supply and changeover for the next production according to the production schedule. In a line equipped for automatic part supply, the Smart Loader automatically supplies machines with cassette-type feeders from a buffer station within the line. This allows for the necessary parts to be set in the buffer station in advance, thereby enhancing the efficiency of the production process. This system eliminates short stops due to part supply errors, but also mitigates issues caused by delays and mistakes during supply work.

Another key feature of the pick and place machine is its ability to handle a range of panel sizes. The model supports panels up to 750 x 610 mm on single-lane conveyors and up to 370 x 280 mm on dual-lane conveyors. This expanded conveyable panel size allows the NXTR A model to support a greater variety of production, from large panel production to the efficient production of double-sided, small to medium-sized panels.

The pick and place machine’s automated part supply and exchange system, automatic feeders and ability to handle a range of panel sizes make it a versatile and efficient solution for any production line. With its focus on maintaining high-quality placements and reducing manual intervention, the NXTR A model is suitable for a range of smart factories.

Kobot Systems smt.fuji.co.jp/en

AI ACCELERATION MODULES SOLID-BOX ADVANCED ENCLOSURES In the realm of medical technology, suspension systems offer a multitude of applications, enabling flexible positioning of medical devices and monitors.

These systems are necessary for patient monitoring, tracking vital functions such as heart rate, blood pressure and oxygen saturation.

Additionally, they are indispensable in operating theatres and intensive care units, where the ability to adjust equipment flexibly is needed for high-precision work. Even the less critical applications, such as patient information displays, should not be overlooked.

OKW Gehäusesysteme offers a variety of suitable models in its product range.

The CARRYTEC enclosure, for instance, features a functional handle and large surfaces suitable for user interfaces (S: 8.4″/21 cm; M: 10.4″/26 cm; L: 13.4″/34 cm), making it suitable for aligning and positioning displays and operating surfaces, as well as enabling clean cable routing.

The smaller INTERFACE-TERMINAL is a multifunctional electronics enclosure with numerous design options, a range of accessories and optional IP54 protection.

The SMART-TERMINAL aluminium profile enclosure, with its recessed control panel for installing and protecting displays, membrane keypads and control elements, is also a suitable choice for added robustness.

The selection of the appropriate enclosure depends on the specific application requirements and spatial conditions.

ROLEC OKW Australia New Zealand P/L www.okw.com.au

38 This issue is sponsored by — Electronex — www.electronex.com.au

Advantech has introduced the EAI-1200 and EAI-3300 AI acceleration modules, powered by Hailo-8 AI processors.

Delivering up to 52 TOPS with 12x the power efficiency of traditional AI modules, these M.2 and PCIe solutions enable AI upgrades for x86 and ARM platforms. Developers can run inference on the Hailo-8 NPU while offloading application processing to the CPU, thereby optimising system performance.

Paired with user-friendly software toolkits — including the Edge AI SDK, Dataflow Compiler and TAPPAS — these modules streamline edge AI development for vision applications.

The EAI-1200 features a single Hailo-8 VPU, delivering up to 26 TOPS while consuming just 5 W. Its compact M.2 form factor enables easy integration, with an optional heatsink supporting operation from -40 to 65°C. Designed for security and automation, it also enhances AI applications such as baggage screening, workforce safety and autonomous mobile robots (AMR). The module is also compatible with Advantech systems including ARK-1221L, AIR-150 and AFE-R770.

Equipped with dual Hailo-8 VPUs, the EAI-3300 delivers 52 TOPS at up to 15 W. Its low-profile PCIe design enables easy deployment across various chassis, with an optimised cooling system for operation between -40 and 70°C. Supporting medical imaging, traffic monitoring and defect inspection, it integrates with AIR-510, AIMB-279 and ARK-3534D.

Advantech Australia Pty Ltd www.advantech.net.au

Electric dump valves help oil and gas company reduce emissions

E

merson has partnered with Laramie Energy to help the Colorado-based oil and gas producer comply with state and federal emissions regulations. Using ASCOTM zero-emissions electric dump valves, an all-electric solution for separators, scrubbers, and compression units, Emerson helped Laramie Energy achieve compliance

by eliminating both vented and fugitive emissions from the liquid dump stage of their separation process.

Conventional dump valves are often piloted by well gas, which can leak into the atmosphere as vented and fugitive emissions. Some states, including Colorado, have emissions regulations that include fines for non-compliance, and the Environmental Protection Agency (EPA) has established a waste emissions charge for methane emissions that exceed specified thresholds.

If fugitive emissions are detected, the EPA requires oil and gas producers to report their greenhouse gas data and conduct tests, surveys and repairs. Companies that fall out of regulation must pay expensive fines and waste subsequent downtime to re-establish compliance.

In comparison, ASCO zero-emission electric dump valves use ultralow-power electric actuation, which removes the need to vent well gas in upstream applications. Unlike traditional dump valves, they are fugitive-emissions-free by design because they have no valve packing.

With precise control, ASCO electric dump valves actuate in 50 to 75 milliseconds compared to conventional valves that take several seconds, thus virtually eliminating any chance of gas blowby.

This helped Laramie Energy better maintain the static pressure of their vessels which ultimately led to an increase in natural gas production. The valves also use 1.2 W of energy compared to a conventional electric retrofit kit that uses 96 W, reducing valve power usage by 98.75%.

“Though initially designed for legacy well sites, these fully electric dump valves can help oil and gas companies achieve compliance and avoid red tape on both newly drilled production sites and existing production sites to meet new standards,” said Michael Land, sales development manager with Emerson’s discrete automation business. “Our solution provides a maintenance-free alternative to meet compliance when compared to other solutions like instrument air, nitrogen and electric retrofit kits.”

Laramie Energy focuses on developing unconventional oil and gas reserves within the Rocky Mountains, operating roughly 1500 wells. The company installed ASCO electric dump valves in newly drilled wells while updating its legacy wells with the solution. Beyond facilitating compliance, the valves have provided additional benefits, including less maintenance and greater well efficiency.

Emerson

www.emerson.com/au/automation

1552 hand-held plastic enclosures Learn more: hammondmfg.com/1552 ausales@hammfg.com • 08 8240 2244 This issue is sponsored by —Electronex — www.electronex.com.au 39

SURFACE-MOUNTER HARDWARE Yamaha Robotics SMT Section has launched the 1-Stop Smart Solution, designed to enhance the performance of its highspeed pick and place machines.

These innovations target industries with stringent quality demands such as automotive, aerospace and medicine.

The key hardware-based enhancements for Yamaha Mounters include nozzle-tip force measurement to enable the early detection of issues like blockages. This allows for timely nozzle maintenance, for enhanced end-of-line production yield. The system also tracks changes in force and measures component-placement force to within 0.1N resolution.

LCR verification measures the inductance, capacitance or resistance value of components in SMD-chip packages to verify the correct part type and tolerance before placement. This helps users detect issues like feeder errors, reel errors or defective components before placement to maximise first-pass yield and avoid rework. The LCR unit can be fitted to Yamaha YRM mounters and legacy YSM machines without special modifications.

A large board option enables YRM mounters to handle boards up to 1.5 m long and 510 mm wide, suitable for assemblies like extralarge LED-lighting boards. This option increases the maximum board size by more than 30% compared to standard YRM mounters and accepts boards up to 10 mm thick and weighing up to 10 kg. It allows manufacturers to work with assemblies designed for high thermal capacity, such as heavy-gauge copper or aluminium-insulated metal substrates (IMS).

These options can be implemented individually or together to boost surface-mount production performance and extend the advantages of the 1-Stop Smart Solution, which comprises Yamaha’s YRP printers, YRM-D dispensers, YRM mounters and YRi-V inspection systems. The 1-Stop Smart Solution allows users to configure a complete SMT assembly line from Yamaha, unified with a common software platform and smart tools that facilitate flexibility, quality and productivity.

Hawker Richardson is the exclusive supplier of Yamaha SMT line products in Australasia, providing regional access to Yamaha’s advanced PCB assembly solutions.

Hawker Richardson www.hawkerrichardson.com.au

COMPUTER-ON-MODULES congatec has launched the COM Express Compact Computer-on-Modules with AMD Ryzen Embedded 8000 Series processors. The modules are based on the computing cores of the Ryzen processors featuring up to eight ‘Zen 4’ cores, innovative XDNA NPU and Radeon RDNA 3 graphics.

This makes the conga-TCR8 Type 6 modules suitable for high-volume applications requiring a combination of advanced AI, graphics and computing power. OEMs in medical imaging, test & measurement, AI-supported POS/POI systems and professional gaming can also leverage these long-term available COM Express Compact modules to accelerate innovation. With a broad, scalable TDP range of 15–54 W, these modules are also suitable for upgrading existing designs.

The conga-TCR8 computer-on-modules support up to 128 GB DDR5-5600 memory with error correction code (ECC) for data-intensive and data-critical applications. With the integrated AMD XDNA NPU (16 TOPS) and AMD Radeon RDNA 3 graphics, the modules deliver a combined computing power of up to 39 TOPS. They also support immersive graphics output on up to four displays with resolutions as high as 8K. For fast peripheral connectivity, they offer six PCIe Gen 4 (8 lanes) with PEG x8 Gen 4, three DisplayPort (DP) interfaces, one eDP or LVDS, four USB 3.2 Gen 2 ports, and four USB 2.0 ports.

The modules are also available as application-ready aReady.COMs, with custom pre-installed and validated operating systems like ctrlX OS, Ubuntu and/or RT Linux, optional system consolidation via aReady.VT, and IoT connectivity via aReady.IOT. On request, the modules can be pre-installed with the customer’s application, allowing for simple plug-and-play integration into the finished system.

Congatec Australia Pty Ltd www.congatec.com 40 This issue is sponsored by — Electronex — www.electronex.com.au

FREQUENCY CONVERTER The Rohde & Schwarz FC330ST frequency converter is designed for up- and downconversion of intermediate frequency (IF) signals to and from the RF frequency range from 220–330 GHz. A high-performance mixer with low conversion loss enables precise measurements, while the integrated IF amplifier enhances sensitivity and signal performance. The frequency converter supports a wide IF range up to 35 GHz, enabling the transmission and reception of ultra-wideband signals. The optional FC330-Z50 external amplifier features a low noise figure and can be used to boost transmitter output power or as a low-noise amplifier to improve the receiver sensitivity.

To complete the solution, a range of accessories is available, including a variety of bandpass filters, tuneable attenuators and horn antennas.

The frequency converter utilises a WR3.4 waveguide RF connector that meets the WR3 EIA standard to provide frequency coverage. To support flexible operation and minimise unwanted signals, a set of five external bandpass filters is available, each with a 30 GHz passband. These filters enable the selective elimination of sideband and local oscillator signals, thereby enhancing signal quality across the entire frequency range.

The IF frequency range of the FC330 from 1–35 GHz enables the transmission of wideband signals and provides a range of options to select the optimal IF/LO combination. Each frequency converter is characterised in the factory and supplied with measurement and alignment data on a USB flash drive. This flexibility in customisation enables control of the system to achieve a specific RF frequency, making it a suitable solution for various applications.

The frequency converter also incorporates an integrated IF amplifier, which serves to enhance sensitivity in receive mode and optimises the mixer input levels in transmit mode. By amplifying the downconverted IF signal directly after the mixer, the amplifier also improves overall system performance. In transmit mode, the amplifier optimises the mixer input level, resulting in improved signal quality.

The R&S FC330-Z50 external amplifier operates within the frequency range of 220–330 GHz. It can be supplied with power directly from the R&S FC330 and provides a typical gain of 15 dB, delivering signals with up to +8 dBm output power (measured at saturation). Due to its low noise figure, the amplifier is suitable for transmit (TX) as well as receive (RX) direction.

Rohde & Schwarz (Australia) Pty Ltd www.rohde-schwarz.com.au

This issue is sponsored by —Electronex — www.electronex.com.au 41

STAINLESS STEEL PUSH-BUTTONS RAFI’s RAFIX 30 FS+ series of control devices includes

POWER MANAGEMENT IC Nordic Semiconductor has launched the nPM2100 Power Management IC (PMIC), designed to prolong the operating time per battery for primary (non-rechargeable) battery applications by managing energy resources using an ultra-efficient boost regulator and a range of energy-saving features. The PMIC has a range of applications, including wireless mice and keyboards, consumer asset tracking, remote controls and body-worn medical devices.

The PMIC’s boost regulator and energy-saving features — including primary-cell fuel gauging — address power management inefficiencies while also using all of the battery’s stored energy before the cell is thrown away.

The power management IC manages the power supply for low-power systems-on-chip (SoCs) or microcontroller units (MCUs) such as Nordic’s nRF52, nRF53 and nRF54 series of advanced wireless multiprotocol products. The PMIC is optimised for maximum efficiency and compact size and is configurable through an I2C-compatible Two Wire Interface (TWI). This interface enables access to configure a range of advanced functions, including ship mode and battery fuel gauging. The PMIC also features two GPIOs that can be repurposed to direct control lines to time-critical control functions as an alternative to serial communication.

The PMIC targets primary battery applications. Examples of supported batteries are one or two AA/AAA/LRxx batteries (in series), or one 3 V LiMnO2 cell. Single- or dual-cell silver oxide and zinc-air coin-cell batteries are also supported, plus any other primary battery that operates within the nPM2100’s input voltage range.

illuminated push-buttons in a modern stainless steel design with ring and spot illumination. With an installation height of 3.45 mm, the flat actuators have a stainless steel front ring and a push-button surface with a metal V2A inlay and translucent illuminated dot. An SMT LED is integrated as the light source for the push-buttons, which are available as standard in five illuminated colours: white, red, yellow, green and blue.

The actuators offer IP65 protection on the front and, like all control and signalling devices in the series, are dimensioned for standard installation openings of 30.3 mm. They can be used in temperature ranges from -25 to +70°C and are designed to have a service life of one million actuation cycles. Due its clear tactile feedback, the push-button series is also suitable for glove operation.

The push-buttons can be combined with PCB switching elements for PCB applications as well as with QC switching elements for classic wiring. In the PCB version, the push-buttons achieve an installation depth of 15.7 mm.

The QC switching elements are connected individually via 2.8 x 0.8 mm flat plugs with an installation depth of 31.9 mm. Both switching element variants are available in versions with gold contacts for a maximum of 35 V and 100 mA or with silver contacts for up to 250 V and 4 A. Short-stroke adapters enable the use of MICON 5 short-stroke push-buttons as switching elements.

Switches Plus Components Pty Ltd www.switchesplus.com.au

The nPM2100 features a boost regulator with an output range of 1.8–3.3 V, powered from an input range of 0.7–3.4 V. The regulator can deliver up to 150 mA maximum current. The regulator also powers a Load Switch/ LDO supplying up to 50 mA across an output range of 0.8–3.0 V. The regulator also features a quiescent current (IQ) of 150 nA.

Nordic Semiconductor www.nordicsemi.com

BENCHTOP IONISER The EXAIR Varistat Benchtop Ionizer is a fan-driven static eliminator engineered to neutralise static charges on surfaces in a range of industrial environments. This ioniser is designed to provide a consistent stream of ionised airflow, eliminating static and particulates without the need for compressed air. The Varistat is now available in 230 V to meet the needs of industrial locations. Easily mounted on benchtops or machines, this static eliminator is manually adjustable and suitable for processes needing comprehensive coverage.

The 230 V model offers adjustable features, allowing for versatility. Features like selectable voltage 115 VAC/230 VAC, variable fan speed and adjustable polarity make the Varistat a comprehensive solution for eliminating static in a variety of processes and facilities. Once plugged in, the ioniser provides rapid static decay capable of reducing 1000–100 V in 0.8 seconds. This product features two replaceable ion emitter points and two 30 PPI foam filters to enhance performance over extended periods, as well as LED lights to signify proper function.

Available from Compressed Air Australia, the Varistat is part of an extensive line of static eliminating products that are UL listed and CE compliant. Products like the Intellistat Ion Air Gun, the Gen4 Super Ion Air Knife and the Gen4 Ionising Bar exhibit the range of static solutions offered and the ability to combat static in a variety of manufacturing processes.

Compressed Air Australia Pty Ltd www.caasafety.com.au 42 This issue is sponsored by — Electronex — www.electronex.com.au

PHOTONS

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QUANTUM TELEPORTATION PERFORMED OVER BUSY INTERNET CABLES Amanda Morris, Northwestern University

Northwestern University engineers are the first to successfully demonstrate quantum teleportation over a fibre-optic cable already carrying internet traffic.

T

he discovery, published in the journal Optica, introduces the new possibility of combining quantum communication with existing internet cables — greatly simplifying the infrastructure required for advanced sensing technologies or quantum computing applications.

“This is incredibly exciting because nobody thought it was possible,” said Northwestern’s Prem Kumar, who led the study. “Our work shows a path towards next-generation quantum and classical networks sharing a unified fibre-optic infrastructure. Basically, it opens the door to pushing quantum communications to the next level.”

An expert in quantum communication, Kumar is a professor of electrical and computer engineering at Northwestern’s McCormick School

of Engineering, where he directs the Center for Photonic Communication and Computing.

How it works

Only limited by the speed of light, quantum teleportation enables a new, ultra-fast, secure way to share information between distant network users, wherein direct transmission is not necessary. The process works by harnessing quantum entanglement, a technique in which two particles are linked, regardless of the distance between them. Instead of particles physically traveling to deliver information, entangled particles exchange information over great distances — without physically carrying it.

“In optical communications, all signals are converted to light,” Kumar explained.

“While conventional signals for classical communications typically comprise millions of particles of light, quantum information uses single photons.”

“By performing a destructive measurement on two photons — one carrying a quantum state and one entangled with another photon — the quantum state is transferred onto the remaining photon, which can be very far away,” said Jordan Thomas, a PhD candidate in Kumar’s laboratory and the paper’s first author. “The photon itself does not have to be sent over long distances, but its state still ends up encoded onto the distant photon. Teleportation allows the exchange of information over great distances without requiring the information itself to travel that distance.”

This issue is sponsored by —Electronex — www.electronex.com.au 43

PHOTONS

ONLY LIMITED BY THE SPEED OF LIGHT, QUANTUM TELEPORTATION ENABLES A

The key: finding the right route to avoid traffic

NEW, ULTRA-FAST, SECURE WAY TO SHARE INFORMATION BETWEEN DISTANT NETWORK USERS, WHEREIN DIRECT TRANSMISSION IS NOT NECESSARY.

Before Kumar’s new study, many researchers were uncertain if quantum teleportation was possible in cables carrying classical communications. The entangled photons would drown among the millions of other light particles. It would be like a flimsy bicycle trying to navigate through a crowded tunnel of speeding heavy-duty trucks.

Kumar and his team, however, found a way to help the delicate photons steer clear of the busy traffic. After conducting in-depth studies of how light scatters within fibreoptic cables, the researchers found a less crowded wavelength of light to place their photons. Then, they added special filters to reduce noise from regular internet traffic.

“We carefully studied how light is scattered and placed our photons at a judicial point where that scattering mechanism is minimised,” Kumar said. “We found we could perform quantum communication without interference from the classical channels that are simultaneously present.”

To test the new method, Kumar and his team set up a 30-kilometre-long fibre-optic cable with a photon at either end. Then, they simultaneously sent quantum information and high-speed internet traffic through it. Finally, they measured the quality of the quantum information at the receiving end while executing the teleportation protocol by making quantum measurements at the mid-point. The researchers found the quantum information was successfully transmitted — even with busy internet traffic whizzing by.

“Although many groups have investigated the coexistence of quantum and classical communications in fibre, this work is the first to show quantum teleportation in this new scenario,” Thomas said. “This ability to send information without direct transmission opens the door for even more advanced quantum applications being performed without dedicated fibre.”

Future possibilities

Next, Kumar plans to extend the experiments over longer distances. He also plans to use two pairs of entangled photons — rather than one pair — to demonstrate entanglement swapping, another important milestone leading to distributed quantum applications. Finally, his team is exploring the possibility of carrying out experiments over real-world inground optical cables rather than on spools in the lab. But, even with more work to do, Kumar is optimistic.

“Quantum teleportation has the ability to provide quantum connectivity securely between geographically distant nodes,” Kumar said. “But many people have long assumed that nobody would build specialised infrastructure to send particles of light. If we choose the wavelengths properly, we won’t have to build new infrastructure. Classical communications and quantum communications can coexist.”

COMPUTER-ON-MODULES congatec has updated its conga-SA8 SMARC modules; the low-power computer-on-modules (COMs) are now available with the latest Intel Core 3 processor generation. This new CPU technology delivers a performance boost, making the energy-efficient, credit-card-sized SMARC modules suitable for edge applications and low-power system consolidation.

With the new conga-SA8, all edge computing applications operating within the extended temperature range of 0 to +60°C can achieve higher performance and improved energy efficiency. These modules support clock frequencies of up to 3.9 GHz and feature a configurable TDP of 9 or 15 W. The integrated Intel Graphics further supports INT8 inference with up to 32 execution units (EUs). Users benefit from accelerated AI-supported workloads which, in combination with system consolidation, contribute to increases in the efficiency and productivity of their applications.

The modules are suitable for low-power applications such as point-of-sales, industrial PCs, AI-accelerated edge systems, automated guided vehicles (AGVs) and semi-autonomous vehicles in logistics. The conga-SA8 modules also feature many connection options and high energy efficiency, making them suitable for use in handheld medical devices and in medical diagnostics such as blood analysers.

The conga-SA8 SMARC modules are available in five different processor variants with up to 16 GB LPDDR5-4800 memory with in-band ECC for high data security. In terms of operating systems, congatec supports Windows 11 IoT Enterprise, Windows 10 IoT Enterprise 2021 LTSC and LTS Linux.

Congatec Australia Pty Ltd www.congatec.com

44 This issue is sponsored by — Electronex — www.electronex.com.au

SPONSORED CONTENT

Over six decades ago, a high school teacher’s passion for electronics education laid the foundation for what would become Mouser Electronics — a global leader in electronic component distribution. Today, Mouser stands as a trusted partner for engineers, designers, innovators, educators, and buyers worldwide, offering cutting-edge components and resources to fuel the next generation of engineering solutions and future product development.

Supporting Australia’s Design Engineers with the Newest Technologies Mouser Electronics is an authorised distributor for over 1,200 leading manufacturers, offering more than 6.8 million products in stock. With a commitment to rapid product launches, Mouser introduces nearly 70,000 new components annually, ensuring that design engineers in Australia and beyond have access to 100% genuine, certified components for their latest innovations.

Mouser has built trust through consistent support and understanding of design engineers and buyers’ needs. Daphne Tien, Vice President of Marketing & Business Development for Mouser APAC, notes, “Our core value proposition has been the rapid introduction of new products and technologies, regardless of market challenges. We maintain a robust inventory of over a million different components, including a vast selection of semiconductors, connectors, sensors, passives, and more to support customers worldwide.”

With no minimum order quantity, engineers can purchase just a single part for prototyping and testing instead of having to commit to large product quantities, ensuring flexibility throughout the design process. With an extensive range of every type of component necessary to build a finished working prototype, Mouser simplifies sourcing by offering one-stop shopping. This eliminates the need for multiple suppliers. Comprehensive datasheets, application notes, and reference designs are also available to streamline workfl ows, enabling informed decisionmaking at every stage of development.

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MOUSER ELECTRONICS: POWERING INNOVATION FOR AUSTRALIAN ENGINEERS

Fast, Reliable, and Efficient Supply Chain Solutions

Driving Future Innovation in Australia

Navigating supply chain complexities is a significant challenge for engineers and procurement professionals. Mouser’s stateof-the-art global distribution centre operates with cutting-edge automation, capable of processing up to 14 orders per minute , with same-day shipping on most in-stock items. Real-time stock updates help mitigate the risk of delays and production halts due to component shortages, ensuring a steady supply for critical projects.

Mouser’s localised support enhances the customer experience by offering dedicated assistance with ordering issues, component selection, and technical inquiries. To better serve Australian customers, Mouser has opened a customer service centre in Melbourne, providing region-specific support.

Overall, by streamlining the procurement process and offering local support, Mouser helps accelerate project timelines and reduce the complexity associated with managing numerous vendor relationships.

As Australia continues to expand its footprint in high-tech industries such as renewable energy, and smart infrastructure, Mouser remains committed to equipping engineers with the latest resources to drive innovation. Additionally, Mouser’s website features a powerful suite of digital tools, including advanced search capabilities, an ECAD design library, and real-time inventory tracking, making it easier than ever to source and integrate the right components into designs.

Beyond distribution, Mouser also supports engineering education, providing students and academic institutions with resources that bridge the gap between theoretical learning and practical application. Through access to technical content, online tools, and the newest components, Mouser helps nurture the next generation of engineers with the knowledge needed to drive Australia’s technological progress.

Ensuring Quality and Design Continuity

Mouser remains dedicated to supporting its customers with the highest quality products and services. With a forwardlooking approach and a commitment to embracing new technologies, Mouser is poised to continue its leadership in the electronics industry for many years to come.

As the company looks to the future, it remains excited about the endless possibilities and new opportunities ahead.

For engineers working on high-performance applications, quality and reliability are essential. Mouser sources exclusively from the original manufacturers, implementing rigorous anti-counterfeit measures, full product traceability, and quality controls to safeguard component integrity.

To support long-term design planning, Mouser provides lifecycle management insights, including Not Recommended for New Design (NRND) labels and End-of-Life (EOL) tracking. These proactive measures help engineers and procurement teams make informed decisions and avoid supply chain disruptions.

Looking Ahead

Mouser Electronics au.mouser.com

This issue is sponsored by —Electronex — www.electronex.com.au 45

SODIUM-ION STUDY SAYS

TECH NEEDS BREAKTHROUGHS TO COMPETE A thorough analysis of market and supply chain outcomes for sodium-ion batteries and their lithium-ion competitors is the first by STEER, a new Stanford and SLAC energy technology analysis program.

L

egions of battery engineers and their supporters have sought for years to build batteries cheaper than the dominant lithium-ion technology, hoping to capture some of lithium-ion’s $50 billion-a-year and growing market. The latest darling contender among researchers, startups, and venture capitalists — sodium-ion batteries — has received much attention after COVID-induced mineral supply chain challenges sent lithium prices on a wild ride.

Still, achieving a low-cost contender may be several years away for sodium-ion batteries and will require technological advances and favourable market conditions, according to a new study in Nature Energy.

Sodium-ion batteries are often assumed to have lower costs and more resilient supply chains compared to lithium-ion batteries.

46 This issue is sponsored by — Electronex — www.electronex.com.au

Despite much potential, sodium-ion batteries still face an uphill struggle. The amount of energy they hold per pound tends to be lower than lithium-ion batteries. So, possible lower materials prices aside, the cost per unit of energy stored remains higher for sodium-ion batteries. This likely would limit widespread commercial adoption — unless research breakthroughs can be made first.

The most fertile areas for advancement are highlighted in the study, the first by a new partnership between the Stanford Doerr School of Sustainability’s Precourt Institute for Energy and the SLAC-Stanford Battery Center. The new program, STEER, assesses the technological and economic potential of emerging energy technologies and advises “what to build, where to innovate, and how to invest” for the energy transition. The new

ALTERNATIVE ENERGY

given that the price of lithium-ion continues to fall,” said Yao, a doctoral candidate who returned to academia after eight years of being the founder and chief technology officer of a lithium-ion battery start-up now producing its batteries on a large, commercial scale.

Yao’s PhD co-advisors are the new study’s senior authors and the co-directors of STEER: Sally Benson, the Precourt Family Professor in the Department of Energy Science and Engineering in the Doerr School of Sustainability; and William Chueh, an associate professor of materials science and engineering in the School of Engineering, of photon science at SLAC, and of energy science and engineering in the Doerr School.

Cube3D

study evaluated more than 6000 scenarios to test the robustness of their roadmaps for sodium-ion batteries’ competitive potential.

“The price of lithium-ion batteries rose for the first time in 2022, which set off alarms for potentially needing an alternative.

Sodium-ion is perhaps the most compelling near-term challenger to lithium-ion, and many battery companies announced plans of major build-out of sodium-ion manufacturing, promising pathways to lower prices than the incumbent,” said Adrian Yao, the study’s lead author and the founder and team lead of STEER, which began in October 2023 with the support of three offices within the US Department of Energy.

“We recognised that if, when, and how sodium-ion batteries might undercut lithiumion on price was largely speculative, especially

Do’s and don’ts for sodium-ion

For the batteries to compete on price, specifically against a low-cost variant of the lithiumion battery known as lithium-iron-phosphate, the study highlights several key routes for sodium-ion battery developers. Most important is to increase energy densities without the use of critical minerals. Specifically, developers should target lithium-iron-phosphate energy densities while moving away from nickel.

Currently, most leading sodium-ion designs rely on the relatively expensive metal.

“Our primary objective, though, was not predicting specific years for when we expect price parity, but in surfacing the impacts of various market scenarios on the viability of competing technologies,” said Chueh.

“As technologists and investors, we cannot assume that economies of scale will always send prices plummeting once a device reaches commercial production. Yes, there will be a learning curve, but here we quantify this curve and show that it isn’t enough on its own,” said Chueh, who is also the director of the Precourt Institute for Energy. “Engineering advances will likely do much more to cut sodium-ion battery costs than simply scaling production.”

“This sodium-ion study was the perfect undertaking to launch STEER as a new way to guide research and investment toward the technology roadmaps most worthy of pursuit and, perhaps more important, away from ones unlikely to be successful,” said Benson.

Such advances and new battery chemistries generally are worth pursuing, the researchers said. The Department of Energy’s 2022 energy storage supply chain analysis notes that diversifying technologies for grid energy storage systems could increase the resiliency of the overall supply chain.

Continuing to rely so heavily on lithium-ion batteries as more energy storage is needed for the global transition to sustainable energy will pose security, economic, and geopolitical risks. For example, the study simulates how the competitiveness of sodium-ion would be accelerated if supply shocks were to occur to graphite — a critical material used in lithium-ion batteries where China controls more than 90% of the global supply. In fact, on 3 December 2024, China began to significantly restrict exports of graphite to the United States while also banning exports of three other critical minerals.

The study also identifies market forces and supply chain conditions that could hurt sodium-ion’s competition with lithium-ion.

For example, if lithium prices continue where they are today near historic lows, sodium-ion has a narrower set of technology routes to become price advantageous in the next decade.

“One key thing we learned from industry practitioners is that while battery cell prices are important, technologies only succeed at the systems level — say, an electric vehicle or a grid-scale battery energy storage system.

That’s why we’re now expanding our scope to provide more holistic perspectives, including understanding the cost of safety and other systems considerations,” said Yao.

Up next

STEER has begun to apply its approach to other technology areas. Its researchers are examining the supply chain of the previously mentioned and often overlooked critical mineral: graphite. Industry executives and Department of Energy leaders advised on the right questions to ask and answer at a roundtable in Washington, DC, in September. The workshop included more than 40 industry organisations, stitching together the value chain from mining companies to car makers, as well as every graphite manufacturer with funding under the Bipartisan Infrastructure Law. “STEER is able to identify paths with the highest chances of contributing to the energy transition and those likely to lead nowhere thanks to our collaborators in industry, government, and other research institutions,” said Benson. “Our team combines commercial deployment experience, technology roadmapping, and systems thinking.”

The STEER team also plans to analyse technology roadmaps in long-duration energy storage and other energy transition areas such as hydrogen and industrial decarbonisation.

This issue is sponsored by —Electronex — www.electronex.com.au 47

SPINTRONICS

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SPINNING, TWISTED LIGHT COULD POWER NEXT-GENERATION ELECTRONICS Researchers have advanced a decades-old challenge in the field of organic semiconductors, opening new possibilities for the future of electronics.

T

he researchers, led by the University of Cambridge and the Eindhoven University of Technology, have created an organic semiconductor that forces electrons to move in a spiral pattern, which could improve the efficiency of OLED displays in television and smartphone screens, or power next-generation computing technologies such as spintronics and quantum computing.

The semiconductor they developed emits circularly polarised light — meaning the light carries information about the ‘handedness’ of electrons. The internal structure of most inorganic semiconductors, like silicon, is symmetrical, meaning electrons move through them without any preferred direction.

However, in nature, molecules often have a chiral (left- or right-handed) structure: like human hands, chiral molecules are mirror images of one another. Chirality plays an important role in biological processes like DNA formation, but it is a difficult phenomenon to harness and control in electronics.

But by using molecular design tricks inspired by nature, the researchers created a chiral semiconductor by nudging stacks of semiconducting molecules to form ordered right-handed or left-handed spiral columns.

Their results are reported in the journal Science.

One promising application for chiral semiconductors is in display technology. Current displays often waste a significant amount of energy due to the way screens filter light.

The chiral semiconductor developed by the researchers naturally emits light in a way that

could reduce these losses, making screens brighter and more energy-efficient.

“When I started working with organic semiconductors, many people doubted their potential, but now they dominate display technology,” said Professor Sir Richard Friend from Cambridge’s Cavendish Laboratory, who co-led the research. “Unlike rigid inorganic semiconductors, molecular materials offer incredible flexibility — allowing us to design entirely new structures, like chiral LEDs. It’s like working with a Lego set with every kind of shape you can imagine, rather than just rectangular bricks.”

The semiconductor is based on a material called triazatruxene (TAT) that self-assembles into a helical stack, allowing electrons to spiral along its structure, like the thread of a screw.

“When excited by blue or ultraviolet light, self-assembled TAT emits bright green light with strong circular polarisation — an effect that has been difficult to achieve in semiconductors until now,” said co-first author Marco Preuss, from the Eindhoven University of Technology. “The structure of TAT allows electrons to move efficiently while affecting how light is emitted.”

By modifying OLED fabrication techniques, the researchers successfully incorporated TAT into working circularly polarised OLEDs (CP-OLEDs). These devices showed recordbreaking efficiency, brightness and polarisation levels, making them the best of their kind.

“We’ve essentially reworked the standard recipe for making OLEDs like we have in our smartphones, allowing us to trap a chiral structure within a stable, non-crystallising

48 This issue is sponsored by — Electronex — www.electronex.com.au

Confocal microscopy image of a chiral semiconductor.

matrix,” said co-first author Rituparno Chowdhury, from Cambridge’s Cavendish Laboratory. “This provides a practical way to create circularly polarised LEDs, something that has long eluded the field.”

The work is part of a decades-long collaboration between Friend’s research group and the group of Professor Bert Meijer from the Eindhoven University of Technology. “This is a real breakthrough in making a chiral semiconductor,” Meijer said. “By carefully designing the molecular structure, we’ve coupled the chirality of the structure to the motion of the electrons and that’s never been done at this level before.”

The chiral semiconductors represent a step forward in the world of organic semiconductors, which now support an industry worth over $60 billion (about £45 billion). Beyond displays, this development also has implications for quantum computing and spintronics — a field of research that uses the spin, or inherent angular momentum, of electrons to store and process information, potentially leading to faster and more secure computing systems.

This is a modified version of a news item published by the University of Cambridge under CC BY-NC-SA 4.0. This version is similarly licensed under CC BY-NC-SA 4.0.

CARRIER CARDS Metromatics has launched the APX4020 Series PCIe Carrier Cards, an innovative solution for industrial and embedded systems requiring versatile and high-performance I/O integration. Designed and manufactured by Acromag, this product is supported locally in Australia and New Zealand by Metromatics.

The carrier cards enable the integration of AcroPack and mini PCIe (mPCIe) mezzanine modules into PC/104 computing systems. These carrier cards offer a compact, rugged design suitable for demanding applications in defence, aerospace and industrial environments, where size, weight and power (SWaP) optimisation is critical.

The carrier cards feature dual module slots; this support for AcroPack and mPCIe modules enables users to mix or match a variety of I/O functions, including analog, digital, serial communication, avionics and FPGA computing.

The carrier cards are also fully compatible with PCIe/104 and PCI/104-Express formats, offering plug-and-play configuration and robust interrupt support. The cards are built for harsh environments, with extended temperature range, conductioncooling options and fused power lines for enhanced performance.

The carrier cards feature dual 50-pin connectors on the front panel to simplify field I/O signal routing, thereby eliminating loose internal wiring. The carrier cards also provide comprehensive support for Linux, Windows and VxWorks operating systems for seamless integration into existing systems.

The APX4020 Series is designed for a range of applications, including data acquisition and control, test and measurement, simulation and communication systems.

The carrier cards are designed to deliver versatility, enabling industries to maximise performance while minimising system complexity and costs. Their rugged design and advanced computing capabilities make them a suitable choice for leading industrial and embedded system integrators.

Metromatics Pty Ltd www.metromatics.com.au

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SENSORS

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HELPS IDENTIFY ORIGINAL BATTERIES Researchers at the University of Tsukuba have developed a non-destructive method to identify the authenticity of individual batteries by attaching a magnetic sensor to the battery casing and measuring the magnetic field generated by the associated battery.

L

ithium-ion batteries are used in smartphones, PCs and electric vehicles, making them an essential part of day-to-day life. However, fires and other incidents can occur in relation to the use of compatible batteries as an alternative to original equipment manufacturer (OEM) batteries. With the widespread use of lithium-ion batteries, their shapes have become standardised and as a result, distinguishing OEM batteries from the nonoriginal ones based on their appearance has become challenging. While marks, certification displays, QR codes and IC chips are used to identify OEM products, they can be copied.

Therefore, developing identification methods based on electrical characteristics and internal structures is essential.

Researchers from the University of Tsukuba had previously developed a method for detecting fuel cell failures using magnetic sensors; they applied this method and developed a system for identifying lithium-ion batteries based on the differences in the current path caused by the internal structure of these batteries. This method involves attaching a magnetic sensor to the exterior of a lithium-ion battery and measuring the magnetic field generated by the current during charging and discharging. This method can identify single cells and multiple batteries connected in series.

The researchers will now establish a system for identifying the battery within an actual battery module. They also aim to develop a system that can identify batteries even in cases of deterioration and identical structures.

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52 This issue is sponsored by — Electronex — www.electronex.com.au