Delayering Copper Devices with ULTRAPOL Advance

ULTRAPOL advance FLAT POLISHING MACHINE

Delayering of Copper IC devices

ULTRAPOL advance FLAT POLISHING MACHINE

Delayering of Copper IC devices

ULTRAPOL advance Flat Polishing Machine

Front Panel Access to All Parameters

ULTRAPOL advance Fine Pressure Control

Coarse Pressure Control

System offers ULTRA TEC’s signature ‘Quick Release’ Sample holder Cam-lock design and precise two circle angular adjustment. Precise Pressure Control is shown

ULTRAPOL advance

Fast Amplitude Setting (Think ASAP-1 Analog system!)

ULTRAPOL advance

Faucet (plumbed in)

Recirculating Pump

Fluid can run to drain or be recirculated, dependent on the process. The drip tray is removable for fast, effective clean-up.

ULTRAPOL advance

A Choice of Polishing Pads and Films are available, in stock, to achieve Best Known Techniques for all sample types

ULTRAPOL advance Angular Alignment with ULTRACOLLIMATOR

ULTRAPOL advance

ULTRAPOL advance Angular Alignment

ULTRAPOL advance

Optically-enhanced Single Die ‘Stub’ holders (JEOL shown above) allow for convenient, rapid transfer to a wide range of SEM’s, FIB’s

ULTRAPOL advance PROCESS CONDITIONS

Sample Type: Cu Technology Bare Die Stage Oscillation: 1 Head Rotation Speed: 1 Sample Load: 100g Lap Rotation Speed: 50 rpm Polishing Pad Type: Fiberpad (black) Abrasive Media: Blue Colloidal Silica

ULTRAPOL advance

Mag= 500x Customer images taken by JEOL tungsten SEM (JEOL 6610LV). The images were taken on a single die sample and show Cu metal structure after delayering

ULTRAPOL advance

Mag= 2000x Customer images taken by JEOL tungsten SEM (JEOL 6610LV). The images were taken on a single die sample and show Cu metal structure after delayering

ULTRAPOL advance

Mag= ~4000x Further Close-up of Customer images showing Cu metal structure after delayering on ULTRAPOL Advance

ULTRAPOL advance

Each Advance System is shipped with a case containing weights, holders and useful accessories

ULTRAPOL advance

For less demanding, or lower specification requirements, ULTRAPOL Advance is also available without the ULTRACOLLIMATOR. Supplied mechanical gauges are used to calibrate the system.

ULTRAPOL advance

ULTRA TEC offers the widest range of sample holders for precision polishing

ULTRAPOL advance

The Hot Plate Transfer Fixture provides a safe & convenient way to work with heated sample holders

Also Available for the Sample Preparation Lab Toolkit…

ULTRAPOL Advance

ASAP-1® IPS

ICis Materials Inspection System

ICis Materials Inspection System

ICis offers 3 imaging modes – NIR (for backside prep), Visible (for planar polish / x-sections) and UV (for maximum surface definition).

Full range of specialist objective lenses available.

ICis Materials Inspection System Illumination Sources

ICis Materials Inspection System

ICis Materials Inspection System Backside (NIR) Imaging

Si Thickness Here

ULTRASPEC-III

Integrated algorithms enables stage motion positioning and direct readout of remaining Silicon Thickness. Windows 7 Version now shipping.

ICis Software is powered by FA Instruments

SUMMARY ULTRAPOL Advance enables‌

Improved Parallel Polish / De-process Live ULTRACOLLIMATOR Mode Fast, convenient and /accurate angular adjustment TO THE DIE Floating Head Control for unsurpassed polishing quality The Widest Range of Sample Holders

SUMMARY ULTRA TEC provides‌ Global Sales & Product Support In-stock Consumable products Application Knowledge Base In-house Design, Manufacture & Test On-site Installation & Training Applications Lab for Product & process development Market-leading customer portfolio We look forward to working with you!

ULTRAPOL forms part of ULTRA TEC’s

More Information at:

www.ultratecusa.com

ULTRAPOL advance FLAT POLISHING MACHINE