TTI / Connector Product Overview

CONNECTOR PRODUCT OVERVIEW FOR ADVANCED INTERCONNECTS

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TABLE OF CONTENTS Connector Overview..........................................................................................................................6 Wire-To-Board.................................................................................................................................. 10 Wire-To-Board Microminiature....................................................................................................................................10 Wire-To-Board Signal..................................................................................................................................................12 Wire-To-Board Power..................................................................................................................................................14 Wire-To-Board Ribbon Cable / Wire Trap....................................................................................................................15 Wire-To-Board Storage...............................................................................................................................................15 Wire-to-Wire................................................................................................................................... 16 Wire-to-Wire Power....................................................................................................................................................16 Wire-to-Wire Signal....................................................................................................................................................17 Board-to-Board............................................................................................................................... 18 Board-to-Board High Speed.......................................................................................................................................18 Board-to-Board Microminiature.................................................................................................................................19 Board-to-Board Power...............................................................................................................................................20 Board-to-Board Signal...............................................................................................................................................21 Board-to-Board Storage.............................................................................................................................................22 Power up to 5A................................................................................................................................ 22 Power up to 20A.............................................................................................................................. 23 Power up to 21A+........................................................................................................................... 24 I/O Connectors................................................................................................................................ 26 I/O Connectors Consumer/PC....................................................................................................................................26 I/O Connectors Networking/Telecommunications......................................................................................................27 I/O Connectors Mobile Products................................................................................................................................28 I/O Connectors Industrial Products............................................................................................................................29 Backplane....................................................................................................................................... 30 Backplane Connectors High Speed...........................................................................................................................30 Backplane Connectors Cable Assemblies.................................................................................................................31 FFC/FPC.......................................................................................................................................... 32 Modular Jacks.................................................................................................................................. 36 Solderless Terminals........................................................................................................................ 37 Terminal Blocks............................................................................................................................... 38 RF Products.................................................................................................................................... 39 Sealed Connectors.......................................................................................................................... 40 Memory Module Sockets.................................................................................................................. 42 Memory Card Sockets...................................................................................................................... 43 Standard Antennas.......................................................................................................................... 44 Solid State Lighting......................................................................................................................... 45 Switch Products.............................................................................................................................. 46 Custom Solutions / Application Tooling............................................................................................. 47

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MOLEX SOLUTIONS ALWAYS AHEAD OF THE CURVE

Molex is a leading global supplier of innovative interconnect solutions.

To meet the needs of customers all over the world, we have developed one of the industry’s largest product portfolios, including over 100,000 connectors, interface solutions, application tooling and more.

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Connector Product Overview for advanced interconnects

Molex innovative portfolio is always growing. Every year, we design and manufacture solutions that set new standards and drive innovation in a wide array of markets – from telecom and computer networking, to transportation and consumer goods, to medical and lighting. We’re committed to looking ahead and anticipating the needs of our customers.

Innovation through intensive research With our state-of-the-art product design centers, Molex has made a serious commitment to research and development. All of our products are designed to meet the demands of next-generation applications and are based on a deep understanding of industry trends.

At Molex, we use the latest systems and technology, including advanced Computer Aided Engineering software and predictive engineering tools. It’s all part of our focus on delivering tomorrow’s technologies, today.

A strong commitment to sustainability We believe the global environment is an important issue for everyone. That’s why we not only adhere to all environmental regulations, but also insist on ecofriendly and safety-focused business practices.

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Connector Overview Wire-to-Board Connectors

SL™ (Stackable Linear) Modular Connectors

Micro-Fit 3.0™ Power Products

KK® Power and Signal Connectors

Mini-Fit® Power Products

MLX™ Power Connectors

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Connector Overview Mini-Fit Sr.™ Power Products

SlimStack™Products

Mezzanine Products

Power Products

EXTreme Power™ Products

Consumer I/O Products

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Connector Overview Backplane Board-to-Board Products

Backplane Wire-to-Board Products

Orthogonal Backplane Products

FFC/FPC Products

Modular Jacks and Plugs

RF Products

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Connector Overview Memory Card Products

DDR3 and DDR4 DIMM Sockets

High-Speed I/O Connectors

iPass+™ HD Interconnects

QSFP+ Interconnect Solutions

zQSFP+™ Interconnect Solutions

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Wire-To-Board Microminiature

Product Name

Description Flexible, high-performance microminiature IDT coaxial connectors feature a double-clamp wire grounding method that provides both electrical and mechanical grounding. This method offers a more reliable termination than hand-soldering and up to 60% less transmission (dB) loss at frequencies between 1-3MHz.

Pitch

Current Rating

Circuits Size

0.40mm

N/A

30-50

• Consumer

1.00mm

1.0A

2-15 20-50

• Consumer

1.20mm

1.5A

2-6

• Transportation • Consumer • Mobile Devices

1.25mm

1.0A

2-30 12-14 15-20

• Transportation • Consumer • Medical • Mobile Devices

1.25mm

1.0A

2-15

• Transportation • Consumer • Industrial Automation • Medical

1.25mm

1.0A

2-40

• Transportation • Consumer • Data/Communications

1.25mm

1.0A

1.50mm

2.0A

2.00mm

3.0A

1.25mm

1.0A

Applications

Micro IDT Coaxial Connectors Pico-Clasp™ is a compact wire-to-board system, offered in both single and dual-row versions. Friction and (inner and outer) positive locks are offered for various application needs. Other features include mating guides, solder tabs and footprint compatibility with some competitive versions.

Pico-Clasp™ Pico-EZmate™ connectors are compact and low-profile; ideal for miniature, tight packaging, wire-to-board applications. Locking features and vertical mating between the receptacle housing and header enables secure and easy placement in tight spaces.

Pico-EZmate™

PanelMate™

PicoBlade™

Mini Mi II™

CLIK-Mate™

Duo-Clasp™

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PanelMate™ offers the lowest profile of any fullyshrouded wire-to-board system from Molex. The series features an SMT header with robust solder tabs and solder-conducing SMT fillet tail design for secure PCB retention. The housing includes a friction lock for secure mating and housing lance for safe and secure terminal retention.

PicoBlade™ is offered in wire-to-board and wire-towire options, single row, with both SMT and throughhole headers. The system saves about 45% of PCB space versus typical 2.00mm wire-to-board systems whilst providing the same amperes of current. (Semi-) automatic and manual tooling is available to support crimp harness assembly.

Mini Mi II™ is a compact multi-harness system available in both wire-to-board and wire-to-wire options. Custom lengths and wire configurations, single/ dual row and SMT/ through-hole styles available. Other features include APQP certified, internal positive lock for secure retention, and IDT housings for cost effective termination.

CLIK-Mate™ wire-to-board connectors are designed for applications that require higher pin-count connectors to carry more signal lines in less space. A tuning-fork terminal design provides low insertion force and a secure mating contact. Reinforced metal solder tabs ensure a secure PCB retention and solder joint strain relief. Note: * single row †dual row.

Duo-Clasp™ dual-row, SMT connectors offer secure positive lock-system for superior mating retention and gold plating for increased durability. The dual-lock design prevents the housing from being dislodged from the PCB connector in case the wires are pulled, thus ensuring high signal contact. Suitable for high volume pick-and-place production.

2-15 2-15* 16-34†

• Consumer

4-15

20-40

• Consumer

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Wire-To-Board Microminiature

Product Name

Pico-Spox™

Pico-Lock™

Flexi-Mate™

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Description The Pico-Spox™ system includes crimp terminal, receptacle housings and PCB headers. The box style terminal makes contact with the header pin via two inward-facing dimples ensuring high reliability. Vertical and right-angle headers offer design flexibility. Friction lock and polarising features provide secure retention and proper mating.

The Pico-Lock™ 1.50mm pitch wire-to-board system offers a mated height of just 2.00mm combined with a current carrying capacity of 3.0A per contact. Secure mating is achieved by side positive locks and top friction locks. Increased board retention is helped by way of wide robust fitting nails. Headers and housings are polarised to prevent mis-mating.

The Flexi-Mate™ connector system provides a full range of co-planar wire-to-board, board-to-board and terminator options for the lighting industry. Key features include a dual-contact terminal design for secure electrical contact and space-saving positive side locks. Guide features help facilitate mating and protect terminals.

Pitch

Current Rating

Circuits Size

Applications

1.50mm

3.0A

2-15

• Consumer • Data/Communications • Medical

1.50mm

3.0A

4, 6, 7, 8 and 10

3.70mm

2.0A

2

• Automotive • Consumer • Solid State Lighting • Industrial • Telecoms

• Consumer

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Wire-To-Board Signal

Product Name

Description The Milli-Grid™ family saves up to 40% in PCB real estate over traditional 2.54mm pitch connectors.

Suitable for wire-to-board, board-to-board and IDT cable-to board connections. Features include early entry (long wipe) terminals, center polarisation key and locking ramps, SMT and through-hole headers.

Pitch

Current Rating

Circuits Size

2.00mm

2.0A

4 -50

• Automotive • Consumer • Networking • Telecommunications

• Automotive • Consumer • Industrial • Medical • Smart Phones and Mobile Devices

Applications

Milli-Grid™

iGrid™

DuraClik™

iGrid™ wire-to-board dual-row system comes with an anti-tangle internal positive lock providing space savings and secure mating retention, in a compact and robust design to withstand rugged handling and high vibration. Includes crimp terminals, receptacle housings and fully shrouded PCB headers in straight and rightangle configurations.

DuraClik™ connectors meet various space constraints and harness installation needs due to the right-angle and vertical configuration options. Features include wide solder tabs, positive inner-lock and an audible mating sound, footprint compatibility, dust and damage reppelent contact design and an open area for pick-andplace.

MicroClasp™ wire-to-board system includes a unique inner positive lock that provides latch protection, secure retention and an audible mating “click”. The terminal design offers low insertion and withdrawal forces. Single and dual-row crimp receptacles and PCB headers are available in SMT and through-hole configurations.

2.00mm

2.0A

10-40

2.00mm

3.0A

2-12

• Automotive • Commercial Vehicle • Industrial Automation

2.00mm

3.0A

2-40

• Consumer • Industrial • Medical

2.00mm

2.0A

2-15

• Consumer • Data/Communications

2.00mm

3.0A

4-15

• Consumer • Data/Communications

2.00mm

2.0A

2-20

• Automotive • Consumer

2.00mm

2.0A

2-15

• Automotive • Consumer

Micro-Clasp™

MicroBlade™

Micro-Lock™

Sherlock™

Micro-Latch™

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MicroBlade™ system offers a reliable box-type terminal that provides secure electrical contact, optional IDT receptacle and fully shrouded headers in straight, rightangle and bottom-entry versions. Features include a low-profile mated height for space savings, user-friendly friction lock with housing windows and polarisation options to prevent mis-mating.

Micro-Lock™ connectors feature a wide mating latch with two-point positive lock for secure mating retention.

The system provides the optimal combination of pin protection, low profile and low-insertion force enabling easy mating and unmating. ‘Crash Free’ mating design protects housing terminals and header pins from damage.

The Sherlock™ family consists of vertical and rightangle headers, crimp housings and reliable box-style terminals. Key features include a positive locking latch that withstands high vibration and permits unmating only when activated, a low mated profile for space saving, and polarised sidewalls that prevent mismating and provide mating guidance.

Micro-Latch™ connectors ensure durable mating and protection of the electrical circuits due to a friction-lock mechanism where the noses on the latching receptacle housing slide into the header wall openings. Throughhole versions are available for both right-angle and surface-mount compatible vertical headers. Polarising features help prevent mis-mating.

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Wire-To-Board

Wire-to-Board Signal Connectors Product Name

Product Name

Product Image

Mini-Lock™ Mini-Lock

Description Versatile wire-to-board and wire-to-wire system Description including terminals, crimp housings and fully-shrouded straight and right-angle headers available in tray and radial tape packaging. Features include a four-point contact wire-to-board design for electrical reliability, system guide walls and Versatile and wire-to-wire pull tabsterminals, for easy mating/unmating, anti-fishhooking including crimp housings and fully contact for safe harness assembly.

shrouded straight and right-angle headers available in tray and radial tape packaging. Features include: four-point contact design for electrical reliability; SPOXwalls BMI™and (Blind-Mate Interface) connectors offer guide pull tabs for easy mating/unmating; low-profile, dual-row, and wire-to-board anti-fishhooking contactwire-to-wire for safe harness assembly.

Pitch

Pitch 2.50mm

2.50mm

Current Rating Current Rating 3.0A

3.0A

Circuits Size Circuits Size 2-15

2-15

Applications

Applications • Consumer • Industrial

Consumer Industrial

solutions. Self-aligning features and mated stack

distance of only 11.00mm allow for secure use in both Duplicate Product Image

SPOX BMI™ Spox BMI

Product Image

SPOX™

horizontal and vertical directions. Multiple pin counts permit design flexibility and provide solutions for both power and signal applications.

The SPOX™ family features Mini-SPOX™, including crimp and IDT housings, wire-to-wire and wire-to-board options, and Macro-SPOX™, including unshrouded and Duplicate partially shrouded headers, along with board-to-board options. The “spring box“-shaped terminals provide multiple points of contact assuring excellent signal integrity.

2.54mm

10.0mm (0.393”)

2.505.08mm

10.0mm (0.393”)

3.0A

30.0A (Power Blade)

3.0-7.0A

30.0A (Power Blade)

6-16

• Networking • Telecommunications

2

2-16

1

• Transportation • Consumer • Data/Communications • Industrial Automation

Spox The 3rd generation C-Grid III™ system offers unique design features including 3 different plating options - a

Duplicate termination technique supporting discrete wire and Product Image

ribbon cable connectors, inter-mateability with Molex‘s QF-50 product line and full compatibility with DIN41651, 2.54mm 10.0mm HE-13/14 standard connector systems.

(0.393”)

C-Grid III™ C-Grid III

3.0A 30.0A (Power Blade)

2-130

1

• Transportation • Consumer

SL™ (Stackable Linear) is a modular, single-row, wire-

Duplicate to-wire and wire-to-board system including press-fit Product Image

SL Modular SL SL™ Connectors Product Image

XYZ product name ® product name KK

Product Image

XYZ product name product name

Product Image

XYZ product name product name

Note: do not change font size in this template ttieurope.com/molex

(compliant-pin), through-hole and SMT PCB termination.

Latching vertical/right-angle headers; discret wire, FFC and IDT crimp housings are available. SL™ intermates with CGrid® and KK® product families in same pitch to provide design flexibility and configuration options.

10.0mm 2.54mm (0.393”)

30.0A 3.0A (Power Blade)

Minctor endisqu aesequos sandanim and lat ant qui vel A versatile single-row wire-to-board board-to-board crimp contact system.

Vertical and right-angle PCB magnam qulaccus, solorep, blablablubbblubb, headers withrem, or without polarisation locks. tatemolorum Aceaque, veni, vidi,and vici,friction endisqu Right-angle top- andlatbottom-entry PCB connectors aesequos sandanim ant qui vel magnam mate with standard headers to facilitate board-to-board qulaccus, lat ant qui vel magnam Aceaque, veni, vidi, configurations. vici, endisqu aesequos sandanim lat ant qui vel magnam qulaccus,

10.0mm 2.50mm/ (0.393”)

30.0A (Power 4.0A Blade)

Minctor endisqu aesequos sandanim lat ant qui vel magnam qulaccus, solorep, blablablubbblubb, tatemolorum rem, Aceaque, veni, vidi, vici, endisqu aesequos sandanim lat ant qui vel magnam qulaccus, lat ant qui vel magnam Aceaque, veni, vidi, vici, endisqu aesequos sandanim lat ant qui vel magnam qulaccus,

10.0mm (0.393”)

30.0A (Power Blade)

3

Minctor endisqu aesequos sandanim lat ant qui vel magnam qulaccus, solorep, blablablubbblubb, tatemolorum rem, Aceaque, veni, vidi, vici, endisqu aesequos sandanim lat ant qui vel magnam qulaccus, lat ant qui vel magnam Aceaque, veni, vidi, vici, endisqu aesequos sandanim lat ant qui vel magnam qulaccus,

10.0mm (0.393”)

30.0A (Power Blade)

3

2.54mm

2-25 3

3

2-28

• Transportation • Consumer • Data/Communications • Industrial Automation • Medical • Networking

• Transportation • Consumer • Data/Communications • Industrial Automation • Medical • Networking

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Wire-To-Board Power

Product Name

Mini-Fit Sr.™

RAST Connectors

KK® 396

Standard .093’’

Mini-Fit® Products

Description Mini-Fit Sr.™ power connectors offer a compact wireto-wire and wire-to-board high-current system capable of handling up to 50.0A per contact. This single- and dual-row system is UL, CSA and TUV approved. Features include integrally molded TPA’s on single-row products, positive locking and polarised housings across all circuit sizes.

Molex offers the full range of RAST IDT connectors and headers. RAST 5 for indirect mating in either 10.0A or 16.0A versions. RAST 2.5 for direct and indirect mating and RAST Power in both 6.0A and 10.0A versions for direct or indirect mating. Multiple polarisation and coding options are available as standard and all products are Glow Wire compliant.

Able to handle up to 13.0A per contact when using the MarKK terminal the KK® 396 wire-to-board and board-to-board system is ideal for use in many varied applications. RPC (reflow process compatible) headers are also available in vertical and right-angle friction-lock variations. UL 94V-0 and Glow wire compliant versions are also available.

Industry standard .093” pin-and-socket power connectors are suitable for wire-to-wire and wire-toboard configurations. Terminals can be used in both plug or receptacle housings allowing for design flexibility.

PCB headers are also available. Features include panel mount and free hanging housings with positive locks and fully isolated contacts.

The Mini-Fit® family is designed for higher-current / higher-density applications which require design flexibility for wire-to-wire, wire-to-board and board-toboard configurations. Features include fully isolated terminals, positive locking, low-engagement forces and polarised housings and receptacles. Glow wire compliant and Halogen free versions are available.

The MLX™ series is interchangeable, intermateable and intermountable with industry standard products. This allows greater flexibility in mating with existing wire harnesses, connectors or PCB headers. The housings are designed for both male and female terminals.

Housings are fully polarised and offer positive locking.

Circuits Size

Applications

50.0A

2 – 14

• Commercial Vehicles • Consumer • Industrial Automation • Medical • Networking

2.50mm 5.00mm

4.0A 16.0A

1 - 20

• Home Appliance • Consumer • Automotive

3.96mm

Up to 13.0A

2-24

• Automotive • Consumer • Industrial • Medical

5.03mm

17.0A

1-15

• Consumer • Data/Communications • Networking

Pitch

10.00mm

Current Rating

4.20mm

13.0A

2 - 24

• Consumer • Data/Communications • Industrial Automation • Networking • Medical • Automotive • Commercial Vehicle • Military/Aerospace • Telecommunications • Alternative Energy Source

6.35mm

13.5A

1-15

• Commercial Vehicle • Consumer • Industrial Automation Networking

MLX™

Micro-Fit™ Products

Mega-Fit

14

The Micro-Fit™ family is a wire-to-wire, wire-to-board and board-to-bord connector system in single- and dualrow configurations. Features include blind mate (BMI), compliant pin (CPI) and reduced mating force (RMF) options. PCB-mount headers are available in straight and right angle, SMT and through-hole types, halogen-free and glow-wire compliant materials.

Mega-Fit Power Connectors deliver cutting-edge current density at 23.0A per circuit; terminals provide six independent contact points for long-term reliability in virtually every industry and application. Available in a wire-to-board configuration with vertical and rightangled headers along with UL94V-0 and glow-wire compliant housings.

3.00mm

5.70mm

5.0A

23.0A

2-24

2-12

• Alternative Energy Source • Consumer • Data/Communications • Medical • Military/Aerospace • Telecommunications

• Consumer • Home Appliance • Commercial Vehicle • Industrial • Telecom

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Wire-To-Board Ribbon Cable / Wire Trap Product Name

Picoflex®

Lite-Trap™

Description The 8 versatile series of Picoflex® receptacles and headers, including the reverse-footprint SMT headers in standard and latched versions, enable maximum design flexibility. Picoflex offers excellent polarisation to both the PCB and between the female connector and header.

Plating options include tin and palladium nickel with gold flash.

Lite-Trap™ is a low profile (4.20mm) SMT wire-to-board connector ideal for the lighting industry. A stripped wire is inserted into the connector and pushes open a gate-style terminal that “traps” the wire. To unmate, a button-style lever on the housing top is pushed down to allow the wire to be removed. The connector also features a compact industry standard PCB layout pattern.

Pitch

Current Rating

Circuits Size

Applications

• Alternative Energy Source • Automotive • Consumer • Data/Communications • Industrial Automation • Medical

1.27mm

1.2A

4-26

4.0mm

9.0A

1 and 2

• Solid State Lighting • Consumer • Industrial

Wire-To-Board Storage Product Name

iPass™

Serial ATA

Micro SATA

Serial Attached SCSI – SFF 8482

Description The iPass™ Interconnect System offers both connectors and cable assemblies that enable flexible speed compatibility for applications ranging from 1.5 Gbps up through 10.0 Gbps. Cable assemblies provide 100 Ohm differential impedance with tight skew control and low crosstalk, available in multiple standard / custom cable lengths.

Molex leads the way with an ever growing family of SATA interconnect solutions including latching cable receptacles in both straight- and right-angle versions for Parallel ATA to Serial ATA conversion, locking PCB plugs that are backwards-compatible in right-angle and vertical options, and combo external SATA and USB receptacles for effective storage.

Low-Insertion-Force Micro SATA Revision 3.0 Specification-compliant interconnects deliver highspeed data at 6 Gbps with uncompromised quality for 1.80” Solid State Drives, mobile computing and consumer applications. Features include FMLB, guide post and pockets, friction locks, solder tabs and high temperature thermoplastic housings.

Also known as SAS Backplane Connector, this connector has the same form factor as Serial ATA with the addition of a “bump” to key it specifically for SAS. Features include point-to-point topology, disk/ backplane interoperability with Serial ATA, hot plug, blind-mate connections, 3.0 Gbps transfer rate, compact cabling and multiple receptacle options.

Serial Attach SCSI uses a point-to-point architecture which works in conjunction with PCI Express and other high-speed architectures on the market such as Serial ATA. Molex offers a broad range of connectors ranging from SAS Multi-Lane cable assemblies to SAS vertical and right angle Internal Multi-Lane connectors.

Current Rating

Circuits Size

Applications

0.75mm 0.80mm 1.27mm

N/A

Multiple

• Data/Communications • Networking • Telecommunications

Multiple

N/A

Multiple

• Consumer • Networking • Storage

1.5A AC or DC

14, 16

• Consumer • Data/Communications

0.80mm, 1.27mm

N/A

Multiple

• Data/Communications • Networking • Telecommunications

Multiple

N/A

Multiple

• Consumer • Networking

Pitch

1.27mm 1.32mm 5.08mm

Serial Attached SCSI – SFF 8484 ttieurope.com/molex

15

Wire-To-Wire Power

Product Name

MX150L™

Versablade™

Description Offered in wire-to-wire, wire-to-panel and wire-toboard configurations, the IP67-rated MX150L™ system provides design flexibility for low level signal to high power applications. Key features include pre-assembled connector housings, integral TPA and two-way mat seal on mating connector, sealed panel-mount plugs and proven blade-type terminals.

The Versablade™ wire-to-wire connector system consists of wide flat blade tab terminals (1.78mm), multi-configured modular housings and terminal position assurance inserts for modularity and design flexibility in various applications. Other features include positive lock and TPA secondary lock, single-row system and spring style mounting ears.

The MLX™ series is interchangeable, intermateable and intermountable with industry standard products. This allows greater flexibility in mating with existing wire harnesses, connectors or PCB headers. The housings are designed for both male and female terminals.

Housings are fully polarised and offer positive locking.

Pitch

Current Rating

Circuits Size

Applications

5.84mm, 7.62mm

Up to 18.0A and 40.0A

2-16

• Commercial Vehicle • Consumer • Industrial Automation

Various

4.0A -15.0A

1-9

• Consumer • Industrial Automation

1 - 15

• Commercial Vehicle • Consumer • Industrial Automation Networking

6.35mm

13.5A

MLX™

Mini-Fit Products ®

Standard .093’’

4.20mm

13.0A

2 - 24

• Consumer • Data/Communications • Industrial Automation • Networking • Medical • Automotive • Commercial Vehicle • Military/Aerospace • Telecommunications • Alternative Energy Source

5.03mm

17.0A

1-15

• Consumer • Data/Communications • Networking

The Industry standard 0.62“ pin-and-socket wire-to-wire connector system provides a robust economical solution to applications needing a current handling capability of up to 5.0A. Housings will accept both male and female terminals and are polarised to eliminate mismating.

3.68mm

5.0A

1-36

• Consumer • Data/Communications • Networking

Smallest pitch wire-to-wire connector system for 100 to 300 V signal and power applications when using 2.60mm diameter wire. The system features a positive lock design for secure mating, fully shrouded contacts and an optional TPA retainer.

3.30mm

4.0A

2-6

• Consumer • Industrial Automation

6.35mm

10.0A

2-24

• Consumer • Industrial Automation

The Mini-Fit® family is designed for higher-current / higher-density applications which require design flexibility for wire-to-wire, wire-to-board and board-toboard configurations. Features include fully isolated terminals, positive locking, low-engagement forces and polarised housings and receptacles. Glow wire compliant and Halogen free versions are available.

Industry standard .093” pin-and-socket power connectors are suitable for wire-to-wire and wire-toboard configurations. Terminals can be used in both plug or receptacle housings allowing for design flexibility.

PCB headers are also available. Features include panel mount and free hanging housings with positive locks and fully isolated contacts.

Standard .062’’

Inertia Lock 3.30mm Beau™ plug and socket blade-type connectors provide superior durability over hollow-pin connectors, allowing repetitive mating without any damage. Thermoplastic backshells provide greater dielectric strength and safety, uniform float contacts enable maximum surface engagement, low contact resistance and easier mating.

Beau™ Power Connectors 16

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Wire-To-Wire Power

Product Name

Micro-Fit™ Products

Description The Micro-Fit™ family is a wire-to-wire, wire-to-board and board-to-bord connector system in single- and dualrow configurations. Features include blind mate (BMI), compliant pin (CPI) and reduced mating force (RMF) options. PCB-mount headers are available in straight and right angle, SMT and through-hole types, Halogen Free and Glow Wire compliant materials.

Pitch

3.00mm

Current Rating

5.0A

Circuits Size

2-24

Applications • Alternative Energy Source • Consumer • Data/Communications • Medical • Military/Aerospace • Telecommunications

Wire-To-Wire Signal

Product Name

SPOX™

SPOX BMI™

Mizu-P25™

SL™ Modular Connectors

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Description The SPOX™ family features Mini-SPOX™, including crimp and IDT housings, wire-to-wire and wire-to-board options and Macro-SPOX™, including unshrouded and partially shrouded headers, along with board-to-board options. The “spring box“-shaped terminals provide multiple points of contact assuring excellent signal integrity.

SPOX BMI™ (Blind-Mate Interface) connectors offer low-profile, dual-row, wire-to-wire and wire-to-board solutions. Self-aligning features and mated stack distance of only 11.00mm allow for secure use in both horizontal and vertical directions. Multiple pin counts permit design flexibility and provide solutions for both power and signal applications.

Mizu-P25™ wire-to-wire connector system is IP67 certified. The family includes systems rated up to 125 V and 250 V. Due to their small dimensions both systems are ideal for wire-to-wire applications in confined spaces. Other features include positive locking, polarisation and special terminal designs for high vibration applications.

SL™ (Stackable Linear) is a modular, single-row, wireto-wire and wire-to-board system including press-fit (compliant-pin), through-hole and SMT PCB termination.

Latching vertical/right-angle headers; discret wire, FFC and IDT crimp housings are available. SL™ intermates with CGrid® and KK® product families in same pitch to provide design flexibility and configuration options.

Pitch

Current Rating

Circuits Size

Applications

2.505.08mm

3.0-7.0A

2-16

• Transportation • Consumer • Data/Communications • Industrial Automation

2.54mm

3.0A

6-16

• Networking • Telecommunications

2.50mm

3.0/4.0A

2-4

• Transportation • Consumer • Industrial Automation

2-25

• Transportation • Consumer • Data/Communications • Industrial Automation • Medical • Networking

2.54mm

3.0A

17

Board-To-Board High Speed

Product Name

Impact™

GbX I-Trac™

Description The Impact™ backplane connector system for conventional, coplanar and mezzanine configurations provides data rates up to 25 Gbps and superior signal density up to 80 differential pairs per inch. Achieve low cross-talk and high signal bandwidth while minimising channel-performance variation across every differential pair within the system.

GBX I-Trac™ system, available in standard backplane, orthogonal midplane, high-current power modules, inverted and coplanar configurations provides design flexibility and enables future system performance upgrades without requiring platform re-design. Capable of supporting next-generation applications with data rates of 12.5 Gbps or higher.

Speed

Density

Orientation

Applications

25 Gbps

80 diff pair / sq inch

Conven Coplanar Mezz

• Data Communications • Telecommunications • Military/Aerospace

12.5 Gpbs

69 diff pair / sq inch

Conven Coplanar Inverted Orthog

• Networking • Telecommunications

The Z-PACK TinMan’s press-fit, flexible, mono-block based system can be stacked end-to-end to meet customer pin-count requirements. The system delivers integrated shielding, differential-pair density, 85 Ohm 66 diff impedance and lower crosstalk and insertion loss versus 12.5 Gbps pair / sq inch 100 Ohm backplane systems.

Z-PACK TinMan*

Conven Mezz

• Data Communications • Medical • Networking • Telecommunications

Conven Coplanar Orthog

• Data Communications • Medical • Networking • Telecommunications

Conven Coplanar

• Data Communications • Industrial Automation • Medical • Military/Aerospace • Networking • Telecommunications

170 ckt.

• Medical • Instrumentation • Telecommunications

*Z-PACK and Z-PACK TinMan are trademarks of Tyco Electronics

GbX® backplane connectors deliver high-density and high-speeds up to 10 Gbps and are custom-configurable.

Bifurcated contact beams in daughtercard receptacles ensure greater reliability with 2 points of contact to each header pin.

10 Gbps

GbX® is a registered trademark of Amphenol Corporation

69 diff pair / sq inch

†

GbX

®†

Very High Density Metric connectors achieve highspeed signal integrity via interstitial signal and ground shields between columns. Standard VHDM®* connectors support data rates of 3.125 Gbps with less than 5% crosstalk; H-series supports up to 6.25 Gbps. *VHDM is a registered trademark of Amphenol Corporation

Up to 100 diff 6.25 Gbps pair / sq inch

VHDM® MicroTCA delivers a low-cost, flexible and scaleable solution with 10.0 Gbps data rate for a wide variety of low to mid-range telecom applications. This press-fit, vertical, edge-card connector provides 170 contacts on 0.75mm pitch and enables AdvancedMC (AMC) cards to be plugged directly to a backplane.

10Gbps

1.5A

MicroTCA

18

ttieurope.com/molex

Board-To-Board Microminiature

Product Name

SlimStack™

Description Molex’s SlimStack™ family of board-to-board connectors offers stacking heights from 0.70mm to 20.00mm. All versions are gold-plated for high reliability over multiple mating cycles. Other features include a durable bladeon-beam contact, SMT tails that create strong solder fillets, and a friction locking feature for added mating retention.

Standardised PCI mezzanine card connectors have a fully shrouded leaf-style design which minimizes the chance of damaging plug contacts. Receptacle contacts feature a low mating force that reduces PCB stress.

Gold over Nickel contact plating enhances long-term reliability. LCP housings enable SMT reflow processing.

Pitch

Current Rating

Circuits Size

0.40/0.50 0.635/ 1.00mm

0.4/0.5A

6-140

1.00mm

1.0A

64-256

0.7mm 4.5mm

1.5-7.0A

2-10

3.70mm

2.0A

2

0.75mm

1.5A

170

Applications

• Transportation • Consumer

• Consumer • Networking • Telecommunications

PMC

Compression Connectors

Flexi-Mate™

Molex’s compression connectors offer design flexibility, reduced component counts and a high degree of manufacturability. The range includes parts with a height above the board of 0.60mm and contact pitches as small as 0.70mm. The high temperature materials used in the manufacturing process enable the parts to be IR reflow soldered.

The Flexi-Mate™ connector system provides a full range of co-planar wire-to-board, board-to-board and terminator options for the lighting industry. Key features include a dual-contact terminal design for secure electrical contact and space-saving positive side locks. Guide features help facilitate mating and protect terminals.

MicroTCA delivers a low-cost, flexible and scaleable solution with 10.0 Gbps data rate for a wide variety of low to mid-range telecom applications. This press-fit, vertical, edge-card connector provides 170 contacts on 0.75mm pitch and enables AdvancedMC (AMC) cards to be plugged directly to a backplane.

• Transportation • Consumer • Mobile Devices

• Consumer

• Medical • Instrumentation • Telecommunications

MicroTCA

ttieurope.com/molex

19

Board-To-Board Power

Product Name

EXTreme PowerMass™

EXTreme Ten60Power™

EXTreme ZPower™

Description EXTreme PowerMass™ is a high-current, boardto-board, modular connector system, providing customer-specific interconnect solutions for AC and DC power requirements. The system offers a density of up to 350.0A per inch while providing minimum heat generation due to extremely low plane-to-plane resistance.

EXTreme Ten60Power™ is easily configured to meet special design requirements with no tooling costs! The system is a modular high-current power and signal connector system in a coplanar and right-angle boardto-board orientation. The low profile (10.0mm height) helps to enhance the system airflow within the power system.

EXTreme ZPower™ is a high-current, rigid, board-toboard and wire-to-board mezzanine style interconnect designed to transfer power loads from one PCB to another. The connector is press-fit into the PC base board. The PC top board is then screwed down on top of the EXTreme ZPower connector, forming a high-pressure interface.

EXTreme PowerEdge™ is a one-piece vertical card edge style connector, used with either gold finger pc boards, or as a bus bar interconnect for power supply and power distribution applications. Connectors are available in power only, signal only and power/signal combinations and can be configured for AC and DC power systems.

Pitch

Current Rating

Circuits Size

Various

150.0A, 80.0A, 40.0A

Multiple power and signal

Various

60.0A

Multiple

• Industrial Automation • Networking • Telecommunications

10.30mm

30.0A

1

• Industrial Automation • Power Supplies • Telecommunications

Various

40.0A

Multiple

• Networking • Telecommunications

Various

40.0A 3.0A

Multiple

• Consumer • Data Communications • Industrial Automation • Networking • Telecommunications

Various

35.0A 3.0A

Multiple

• Data Communications • Industrial Automation • Networking • Telecommunications

Various

30.0A 1.0A

Multiple

• Data Communications • Industrial Automation • Networking • Telecommunications

2 - 24

• Consumer • Data/Communications • Industrial Automation • Networking • Medical • Automotive • Commercial Vehicle • Military/Aerospace • Telecommunications • Alternative Energy Source

Applications

• Networking • Telecommunications

EXTreme PowerEdge™ EXTreme PowerDock™ interconnects include guide pins for blind mating, mounting ears option for mechanical attachment to the PCB, power blades and signal pins in multiple lengths and press-fit tails. This family can be used as a drop-in replacement in many existing applications due to its custom configurable nature.

EXTreme PowerDock™

EXTreme LPHPower™

The EXTreme LPHPower™ connector is a mixed, highcurrent power and signal connector system with power blades parallel to the PC board. Its extremely lowprofile height of only 7.50mm allows greater system airflow while taking up 53% less space than traditional connectors with the same current rating. Right-angle, coplanar or vertical configurations are available.

EXTreme PowerPlus™ series conforms to the Server System Infrastructure (SSI) open specification. Features include recessed signal-pins and sequential mating (LMFB) that allows the hot-swapping of power supply units on the male side, guide pockets (headers) or guide posts (receptacles) and fully shrouded headers.

EXTreme PowerPlus™

Mini-Fit® Products

20

The Mini-Fit® family is designed for higher-current / higher-density applications which require design flexibility for wire-to-wire, wire-to-board and board-toboard configurations. Features include fully isolated terminals, positive locking, low-engagement forces and polarised housings and receptacles. Glow wire compliant and Halogen free versions are available.

4.20mm

13.0A

ttieurope.com/molex

Board-To-Board Power

Product Name

KK® 396

Description Able to handle up to 13.0A per contact when using the MarKK™ terminal the KK® 396 wire-to-board and board-to-board system is ideal for use in many varied applications. RPC (reflow process compatible) headers are also available in vertical and right-angle friction-lock variations. UL 94V-0 and Glow Wire compliant versions are also availble.

Pitch

Current Rating

Circuits Size

3.96mm

Up to 13.0A

2-24

Applications

• Automotive • Consumer • Industrial • Medical

Board-To-Board Signal Product Name

Description The Milli-Grid™ family, saves up to 40% in PCB real estate over traditional 2.54mm pitch connectors.

Suitable for wire-to-board, board-to-board and IDT cable-to board connections. Features include early entry (long wipe) terminals, center polarisation key and locking ramps, SMT and through-hole headers.

Pitch

Current Rating

Circuits Size

2.00mm

2.0A

4 -50

• Automotive • Consumer • Networking • Telecommunications

• Transportation • Consumer • Data/Communications • Industrial Automation • Medical • Networking

Applications

Milli-Grid™ A versatile single-row wire-to-board and board-to-board crimp contact system. Vertical and right-angle PCB headers with or without polarisation and friction locks.

Right-angle top- and bottom-entry PCB connectors mate with standard headers to facilitate board-to-board configurations.

2.54mm

5.0A

2-36

2.54mm

3.0A

2-130

• Transportation • Consumer

2-25

• Transportation • Consumer • Data/Communications • Industrial Automation • Medical • Networking

KK® 254 The 3rd generation C-Grid III™ system offers unique design features including 3 different plating options, a termination technique supporting discrete wire and ribbon cable connectors, inter-mateability with Molex‘s QF-50 product line and full compatibility with DIN41651, HE-13/14 standard connector systems.

C-Grid III™

SL™ Modular Connectors

ttieurope.com/molex

SL™ (Stackable Linear) is a modular, single-row, wireto-wire and wire-to-board system including press-fit (compliant-pin), through-hole and SMT PCB termination.

Latching vertical/right-angle headers; discret wire, FFC and IDT crimp housings are available. SL™ intermates with CGrid® and KK® product families in same pitch to provide design flexibility and configuration options.

2.54mm

3.0A

21

Board-To-Board Storage

Product Name

Serial ATA

Micro SATA

EBBI™ 50D

Description Molex leads the way with an ever growing family of SATA interconnect solutions including latching cable receptacles in both straight- and right-angle versions for Parallel ATA to Serial ATA conversion, locking PCB plugs that are backwards-compatible in right-angle and vertical options, and combo external SATA and USB receptacles for effective storage.

Low-Insertion-Force Micro SATA Revision 3.0 Specification-compliant interconnects deliver highspeed data at 6 Gbps with uncompromised quality for 1.80” Solid State Drives, mobile computing and consumer applications. Features include FMLB, guide post and pockets, friction locks, solder tabs and high temperature thermoplastic housings.

Molex‘s versatile low-cost EBBI™ 50D series are unshielded, high density, leaf-style connectors available in vertical, right-angle, blind-mating and SMT configurations. Housings are UL 94V-0 approved, the IDT receptacles mate to standard .062 inch pc card edge and terminals are plated with 30µ“ minimum gold in the mating area.

Pitch

Current Rating

Circuits Size

Multiple

N/A

Multiple

1.5A AC or DC

14, 16

1.0A

30 - 130

1.27mm 1.32mm 5.08mm

1.27mm

Applications

• Consumer • Networking • Storage

• Consumer • Data/Communications

• Data communication • Telecommunication

Power Connectors Current up to 5A

Product Name

Micro-Fit™ 3.0

Description The Micro-Fit™ family is a wire-to-wire, wire-to-board and board-to-bord connector system in single and dual row configurations. Features include blind mate (BMI), compliant pin (CPI) and reduced mating force (RMF) options. PCB mount headers available in straight and right angle, SMT and T/H types. Halogen-free and glowwire compliant materials.

A versatile single-row wire-to-board and board-to-board crimp contact system. Vertical and right-angle PCB headers with or without polarisation and friction locks.

Right-angle top- and bottom-entry PCB connectors mate with standard headers to facilitate board-to-board configurations.

Pitch

3.00mm

Current Rating

5.0A

Circuits Size

Applications

2-24

• Alternative Energy Source • Consumer • Data/Communications • Medical • Military/Aerospace • Telecommunications

2.54mm

5.0A

2-36

• Transportation • Consumer • Data/Communications • Industrial Automation • Medical • Networking

3.68mm

5.0A

1-36

• Consumer • Data/Communications • Networking

KK 245® The Industry standard 0.62“ pin-and-socket wire-to-wire connector system provides a robust economical solution to applications needing a current handling capability of up to 5.0A. Housings will accept both male and female terminals and are polarised to eliminate mismating.

Standard .062’’

22

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Power Connectors Current up to 20A

Product Name

Mini-Fit® Products

Description The Mini-Fit® family is designed for higher-current / higher-density applications which require design flexibility for wire-to-wire, wire-to-board and board-toboard configurations. Features include fully isolated terminals, positive locking, low-engagement forces and polarised housings and receptacles. Glow Wire compliant and Halogen free versions are available.

The MLX™ series is interchangeable, intermateable and intermountable with industry standard products. This allows greater flexibility in mating with existing wire harnesses, connectors or PCB headers. The housings are designed for both male and female terminals.

Housings are fully polarised and offer positive locking.

Pitch

Current Rating

Circuits Size

Applications

4.20mm

13.0A

2 - 24

• Consumer • Data/Communications • Industrial Automation • Networking • Medical • Automotive • Commercial Vehicle • Military/Aerospace • Telecommunications • Alternative Energy Source

6.35mm

13.5A

1 - 15

• Commercial Vehicle • Consumer • Industrial Automation Networking

5.03mm

17.0A

1-15

• Consumer • Data/Communications • Networking

5.00mm

10.0A, 16.0A

1-8

• Consumer

MLX™

Standard .093’’

RAST 5

Sabre™

KK™ 396

ttieurope.com/molex

Industry standard .093” pin-and-socket power connectors are suitable for wire-to-wire and wire-toboard configurations. Terminals can be used in both plug or receptacle housings allowing for design flexibility.

PCB headers are also available. Features include panel mount and free hanging housings with positive locks and fully isolated contacts.

RAST 5 IDT and crimp connectors are extremely reliable power connectors meeting all industry standards and testing requirements. Features include Glow Wire compliant, low-insertion force, colour-coded polarisation, multiple keying and latching configurations, vertical and right-angle headers are also available in tin and silver plating.

Sabre™ is a high-current wire-to-wire and wire-toboard connector family with a built-in TPA feature that prevents terminal backout. Crimp terminals are available to suit a wide range of wire guages and insulation thicknesses and terminals are fully isolated.

The system is UL recognised, CSA approved, TUV licensed.

Able to handle up to 13.0A per contact when using the MarKK™ terminal the KK® 396 wire-to-board and board-to-board system is ideal for use in many varied applications. RPC (reflow process compatible) headers are also available in vertical and right-angle friction-lock variations. UL 94V-0 and Glow Wire compliant versions are also available.

7.50mm

18.0A

2-8

• Alternative Energy Source • Consumer • Industrial Automation • Medical • Military/Aerospace • Networking • Telecommunications

3.96mm

Up to 13.0A

2-24

• Automotive • Consumer • Industrial • Medical

23

Power Connectors Current up to 21A+

Product Name

EXTreme PowerMass™

EXTreme Ten60Power™

EXTreme ZPower™

Description EXTreme PowerMass™ is a high-current, boardto-board, modular connector system, providing customer-specific interconnect solutions for AC and DC power requirements. The system offers a density of up to 350.0A per inch while providing minimum heat generation due to extremely low plane-to-plane resistance.

EXTreme Ten60Power™ is easily configured to meet special design requirements with no tooling costs! The system is a modular high-current power and signal connector system in a coplanar and right-angle boardto-board orientation. The low profile (10.0mm height) helps to enhance the system airflow within the power system.

EXTreme ZPower™ is a high-current, rigid, board-toboard and wire-to-board mezzanine style interconnect designed to transfer power loads from one PCB to another. The connector is press-fit into the PC base board. The PC top board is then screwed down on top of the EXTreme ZPower connector, forming a high-pressure interface.

EXTreme PowerEdge™ is a one-piece vertical card edge style connector, used with either gold finger pc boards, or as a bus bar interconnect for power supply and power distribution applications. Connectors are available in power only, signal only and power/signal combinations and can be, configured for AC and DC power systems.

Pitch

Current Rating

Circuits Size

Various

150.0A, 80.0A, 40.0A

Multiple power and signal

Various

60.0A

Multiple

• Industrial Automation • Networking • Telecommunications

10.30mm

30.0A

1

• Industrial Automation • Power Supplies • Telecommunications

Various

40.0A

Multiple

• Networking • Telecommunications

Various

40.0A 3.0A

Multiple

• Consumer • Data Communications • Industrial Automation • Networking • Telecommunications

Various

35.0A 3.0A

Multiple

• Data Communications • Industrial Automation • Networking • Telecommunications

Various

30.0A 1.0A

Multiple

• Data Communications • Industrial Automation • Networking • Telecommunications

11.00mm

80.0A

2 and 3

• Automotive • Consumer • Telecom • Datacom

Applications

• Networking • Telecommunications

EXTreme PowerEdge™ EXTreme PowerDock™ interconnects include guide pins for blind mating, mounting ears option for mechanical attachment to the PCB, power blades and signal pins in multiple lengths and press-fit tails. This family can be used as a drop-in replacement in many existing applications due to its custom configurable nature.

EXTreme PowerDock™

EXTreme LPHPower™

The EXTreme LPHPower™ connector is a mixed, highcurrent power and signal connector system with power blades parallel to the PC board. Its extremely lowprofile height of only 7.50mm allows greater system airflow while taking up 53% less space than traditional connectors with the same current rating. Right-angle, coplanar or vertical configurations are available.

EXTreme PowerPlus™ series conforms to the Server System Infrastructure (SSI) open specification. Features include recessed signal-pins and sequential mating (LMFB) that allows the hot-swapping of power supply units on the male side, guide pockets (headers) or guide posts (receptacles) and fully shrouded headers.

EXTreme PowerPlus™

EXtreme Guardian™

24

Exceed high-current and reliability requirements in topend server and high-power applications with Molex’s compact, EXTreme Guardian™ Power Connector System, providing EMI/RFI shielding, overmolding and discretewire options for design flexibility. This wire-to-board system also features ‘first mate, last break’ contact arrangements.

ttieurope.com/molex

Power Connectors Current up to 21A+

Product Name

Mini-Fit Sr.™

Mega-Fit

Sabre™

ttieurope.com/molex

Description Mini-Fit Sr.™ power connectors offer a compact wireto-wire and wire-to-board high-current system capable of handling up to 50.0A per contact. This single- and dual-row system is UL, CSA and TUV approved. Features include integrally molded TPA’s on single-row products, positive locking and polarised housings across all circuit sizes.

Mega-Fit Power Connectors deliver cutting-edge current density at 23.0A per circuit; terminals provide six independent contact points for long-term reliability in virtually every industry and application. Available in a wire-to-board configuration with vertical and rightangled headers along with UL94V-0 and Glow Wire compliant housings.

Sabre™ is a high-current wire-to-wire and wire-toboard connector family with a built-in TPA feature that prevents terminal backout. Crimp terminals are available to suit a wide range of wire gauges and insulation thicknesses and terminals are fully isolated.

The system is UL recognised, CSA approved, TUV licensed.

Pitch

10.00mm

5.70mm

7.50mm

Current Rating

50.0A

23.0A

18.0A

Circuits Size

Applications

2-14

• Commercial Vehicles • Consumer • Industrial Automation • Medical • Networking

2-12

• Consumer • Home Appliance • Commercial Vehicle • Industrial • Telecom

2-8

• Alternative Energy Source • Consumer • Industrial Automation • Medical • Military/Aerospace • Networking • Telecommunications

25

I/O Connectors Consumer / PC

Product Name

Description Industry standard USB connectors and cable assemblies provide connection for power and data exchange without the need for a host PC across a variety of industries. Available in standard, mini and micro versions.

Pitch

Current Rating

Circuits Size

2.00mm 2.50mm

1.5A

5

0.50mm

0.5A

20

• Consumer • Data/Communications

0.40mm 0.50mm

0.8A

19

• Consumer

0.40mm

0.8A

19

• Automotive • Consumer • Smart phones and Mobile Devices

0.80mm 2.00mm

1.5A

4, 6, 9

N/A

3.0A

29

Applications

• Consumer • Medical • Smart Phones and Mobile Devices

USB Products The DisplayPort solution consists of SMT external receptacles with a polarised D-shape mating interface and PCB retention features. Receptacles are mountable on the device side and the overmolded plug connects to the display device. The cable assemblies come in both latching and non-latching versions.

DisplayPort*

*DisplayPort is a trademark of Video Electronics Standards Association (VESA)

High Definition Multimedia Interface (HDMI*) Connectors come in a compact, user-friendly fully shielded design.

A single cable bandwidth of 5 Gbps carries both uncompressed audio and video. Other features include backward compatible HDMI to DVI cables, mounting flanges and triad signal layout.

HDMI*

*HDMI, the HDMI Logo, and High Definition Multimedia Interface are trademarks or registered trademarks of HDMI Licensing LLC in the US and other countries.

A 19-pin interconnect in a stainless steel shell, half the size of the current Mini connector, offering all the advantages of the HDMI 1.4 specification. Available in full SMT, through-hole shell tabs and hybrid SMT and through-hole shell tab versions; receptacles offer friction lock and terminal hold-down features. Cable assemblies available.

Micro HDMI*

*HDMI, the HDMI Logo, and High Definition Multimedia Interface are trademarks or registered trademarks of HDMI Licensing LLC in the US and other countries

IEEE 1394 (also named “Firewire” by Apple, and “i.Link”

by Sony) is a standard I/O interface, carrying video and audio with assured quality, based on its high bandwidth capabilities. This simple to use, peer-to-peer connection system is keyed, electrically tested and fully integrated to detect new nodes plugged in without powering down.

• Automotive • Consumer • Data/Communications • Medical

IEEE 1394

MicroCross DVI

26

The Molex MicroCross DVI system provides a highbandwidth video interface for host and display devices. The rugged LFH (Low Force Helix) contact design provides two points of contact for optimal signal integrity and reduces insertion force to ensure high reliability. A full range of connectors, cables and adaptors is available.

• Consumer

ttieurope.com/molex

I/O Connectors Networking / Telecomm Product Name

iPass™

IPass+™ HD

IPass+™ High Speed Channel (HSC)

QSFP+

Description The iPass™ Interconnect System offers both connectors and cable assemblies that enable flexible speed compatibility for applications ranging from 1.5 Gbps up through 10 Gbps. Cable assemblies provide 100 Ohm differential impedance with tight skew control and low crosstalk, available in multiple standard / custom cable lengths.

iPass+™ HD, also named mini-SAS, improves system airflow and signal integrity by eliminating midplane connections. This low-profile system, meets SAS-3 nextgeneration speed and density requirements, with signals enabling active copper and optical cable modules. iPass+ HD connectors mate to all current miniSAS HD cable assemblies.

The newest addition to the iPass+™ family enables pluggable copper/optical options, thereby increasing the flexibility of system-level hardware for end users. Offered as one-piece press-fit connector and cage assembly in both single and stacked dual-port configurations. Adopted by Infiniband* CXP 12x QDR and IEEE 802.3ba.

Current Rating

Circuits Size

Applications

0.75mm 0.80mm 1.27mm

N/A

Multiple

• Data/Communications • Networking • Telecommunications

0.75mm

N/A

36, 62, 72, 144

• Data/Communications • Networking • Telecommunications

0.80mm

N/A

84, 168

• Networking • Telecommunications

0.80mm

N/A

N/A

• Automotive • Networking • Telecommunications

1.27mm (Matrix 50), 1.90mm (Matrix 75)

1.0A

60-200 (Matrix 50); 96-130 (Matrix 75)

1.27mm

1.5A

• Consumer 18, 28, 38, • Data/Communications 48, 72 • Industrial Automation • Medical

N/A

68, 136

• Data/Communications • Industrial Automation • Medical • Networking • Telecommunications

Various

• Consumer • Data/Communications • Industrial Automation • Medical • Networking

Pitch

*Trademark of the InfiniBand Trade Association

The Quad Small Form-factor Pluggable Plus (QSFP+) Interconnect system is designed for high density applications. The QSFP+ connector, cage and cable assemblies (copper and optical) and loopbacks are part of a highly-integrated system that combines effective use of space, power and port density for high-density applications.

The patented Low Force Helix (LFH) male pin interfaces with a split-beam receptacle contact giving a low insertion force with 2-point contact reliability. The system will accept various wire sizes and is available in vertical and right-angle header versions. Optional hardware for docking applications is also available.

• Data/Communications • Medical • Networking • Telecommunications

LFH

TDP® (Triad™ Differential Pair)

Ultra+™ VHDCI

Modular Plugs Jacks

ttieurope.com/molex

TDP® connectors provide a shielded, dual-row, cableto-board interface offering mid-range speed (up to 5Gbps) and 100 Ohm controlled impedance. Fully shielded vertical (through-hole) and right-angle (SMT) receptacles plus fully shielded plugs and cable kits are available. Overmolded cable assemblies complete the range.

The Ultra+™ Very High Density Cable Interconnect system features “blade on beam” style contact, reduced size (27% smaller than SCSI-3), increased robustness, improved electrical performance and higher density. Superior leaf/ribbon style contact, meets EIA, ANSI/SFF-8441and SPI-4 specifications to ensure intermatability with conforming products.

Molex offers jacks in a variety of styles and configurations, including right-angle, top- and bottomentry, through-hole and SMT, shielded and un-shielded using gold or high durability palladium-nickel plating.

Modular jacks with integrated magnetics with or without LED’s that support Power-over-Ethernet (PoE) are also available.

0.80mm

Various

Various

27

I/O Connectors Mobile Products

Product Name

Description Molex has developed seven series of Micro-USB Type ‘B’ and Type ‘AB’ receptacles in a selection of top-, bottomand mid-mount versions, and a new series of USB ‘A’ to Micro-USB ‘B’ cable assemblies. These connectors include a lead-in feature in the connector housing for blind-mating of the receptacle to the plug.

Pitch

Current Rating

Circuits Size

0.65mm

1.0 (Signal), 1.8 (Power)

5

• Consumer • Smart Phones and Mobile Devices

0.80mm

1.0A

5

• Consumer • Smart Phones and Mobile Devices

0.60mm

0.5A

20

• Consumer • Data/Communications

0.40mm

0.8A

19

• Automotive • Consumer • Smart phones and Mobile Devices

16

• Aerospace and Defence • Automotive • Consumer • Data/ Communications • Medical • Smart Phones and Mobile Devices

Applications

Micro USB Key features of the USB OTG are compact and lightweight design (about 1/8th the size of standard USB-B connectors), fully shielded, fully compliant with USB 2.0 specifications, detent lock and keying feature, 5-pin design and high durability of 5,000 mating cycles, UL certified. Cable assemblies available.

USB OTG (On-The-Go) Mini DisplayPort* is 50% of the size of standard DisplayPort connectors, delivering pure digital connections quickly and seamlessly to external displays and offering plug-and-play performance while supporting VGA, DVI and dual-link DVI connections.

Mini DisplayPort*

*DisplayPort is a trademark of Video Electronics Standards Association (VESA)

A 19-pin interconnect in a stainless steel shell, half the size of the current Mini connector, offering all the advantages of the HDMI 1.4 specification. Available in full SMT, through-hole shell tabs and hybrid SMT and through-hole shell tab versions; receptacles offer friction lock and terminal hold-down features. Cable assemblies available.

Micro HDMI*

*HDMI, the HDMI Logo, and High Definition Multimedia Interface are trademarks or registered trademarks of HDMI Licensing LLC in the US and other countries

The HandyLink™ USB 2.0 compatible family includes a right-angle SMT receptacle, a wire and PCB version of the plug, perpendicular and parallel mounted cradle connectors for docking applications and a wide array of cable assemblies. HandyLink wire-to-board solutions and board-to-board docking solutions are RoHS compliant.

HandyLink™

28

0.80mm

1.5 – 3.0A

ttieurope.com/molex

I/O Connectors Industrial Products

Product Name

Description Molex’s CRC™ rectangular I/O connector system provides a compact solution for small industrial robots and factory automation equipment. The system includes panel-mount and wire-to-wire versions, and takes up only about 1/15th the space of industry-standard heavyduty connectors.

Current Rating

Circuits Size

Applications

Various

7.0, 15.0A

12, 20, 30, 50 (signal); 4, 15 (power)

• Aerospace and Defence • Automotive • Data/Communications • Industrial Automation • Medical • Telecommunications

N/A

6.0, 10.0, 12.0A

3.00mm

7.0A

Pitch

Circular Robotic Connector - CRC™ Molex’s line of HMC™ Heavy Duty Rectangular Connectors offer a unique new design and user-friendly features compared to traditional-style heavy duty connectors for robotic and other industrial applications.

Multi-module types allow gender interchanging of housings, as well as hybrid configurations using different terminal inserts.

12, 36, 40, • Industrial Automation 48, 52, 72

Heavy Duty Rectangular Connector HMC™ Connectors

Mini-HMC™

Commercial Micro-D

ttieurope.com/molex

The compact sized Mini-HMC™ family incorporates the same unique features of Molex’s standard HMC™ connectors such as a one-touch lock and interchangeable housings with the same solderless crimp terminals as Molex’s CRC™ connectors. Other features include a braided wire clamp for additional ESD shielding and a hard-shell hood.

High-density Commercial Micro-D shielded microminiature connectors provide 4 times the density of standard D-sub connectors. Commercial versions available in right-angle (single row and stacked) and vertical configurations, cable assemblies in single- and double-ended Commercial Micro-D to standard D-Sub connectors.

1.27mm

1.0A

10, 40

• Data/Communications • Industrial Automation • Medical

Various

• Aerospace and Defence • Commercial Vehicle • Data/Communications • Industrial General • Medical

29

Backplane Connectors High Speed Product Name

Impact™

GBX I-Trac™

Description The Impact™ backplane connector system for conventional, coplanar and mezzanine configurations provides data rates up to 25 Gbps and superior signal density up to 80 differential pairs per inch. Achieve low cross-talk and high signal bandwidth while minimising channel-performance variation across every differential pair within the system.

GBX I-Trac™ system, available in standard backplane, Orthogonal midplane, high-current power modules, Inverted and Coplanar configurations provides design flexibility and enables future system performance upgrades without requiring platform re-design. Capable of supporting next-generation applications with data rates of 12.5 Gbps or higher.

Speed

Density

Orientation

Applications

25 Gbps

80 diff pair / sq inch

Conven Coplanar Mezz

• Data Communications • Telecommunications • Military/Aerospace

12.5 Gpbs

69 diff pair / sq inch

Conven Coplanar Inverted Orthog

• Networking • Telecommunications

The Z-PACK TinMan’s press-fit, flexible, mono-block based system can be stacked end-to-end to meet customer pin-count requirements. The system delivers integrated shielding, differential-pair density, 85 Ohm 66 diff impedance and lower crosstalk and insertion loss versus 12.5 Gbps pair / sq inch 100 Ohm backplane systems.

Z-PACK TinMan*

Conven Mezz

• Data Communications • Medical • Networking • Telecommunications

Conven Coplanar Orthog

• Data Communications • Medical • Networking • Telecommunications

Conven Coplanar

• Data Communications • Industrial Automation • Medical • Military/Aerospace • Networking • Telecommunications

*Z-PACK and Z-PACK TinMan are trademarks of Tyco Electronics

GbX® backplane connectors deliver high-density and high-speeds up to 10 Gbps and are custom-configurable.

Bifurcated contact beams in daughtercard receptacles ensure greater reliability with 2 points of contact to 10 Gbps each header pin.

GbX® is a registered trademark of Amphenol Corporation

69 diff pair / sq inch

†

GbX

®†

Very High Density Metric connectors achieve highspeed signal integrity via interstitial signal and ground shields between columns. Standard VHDM®* connectors support data rates of 3.125 Gbps with less than 5% crosstalk; H-series supports up to 6.25 Gbps. *VHDM is a registered trademark of Amphenol Corporation

Up to 100 diff 6.25 Gbps pair / sq inch

VHDM®*

HDM®*

The High Density Metric (HDM®*) connector system suits applications that require high interconnect density and high-speed signal integrity. Daughter card modules are combined on a metal stiffner enabling very high circuit count assemblies to be handled as one connector.

Power, guidance and coding function modules are also available.

N/A

30 Contacts/ Right Angle • Networking CM Vertical

*HDM is a registered trademark of Amphenol Corporation

MicroTCA™ delivers a low-cost, flexible and scaleable solution with 10.0 Gbps data rate for a wide variety of low to mid-range telecom applications. This press-fit, vertical, edge-card connector provides 170 contacts on 0.75mm pitch and enables AdvancedMC (AMC) cards to be plugged directly to a backplane.

10Gbps

N/A

Card Edge

• Medical • Instrumentation • Telecommunications

MicroTCA™

30

ttieurope.com/molex

Backplane Connectors Cable Assemblies Product Name

GbX® Cable Assemblies

Description GbX® cable assemblies offer improved capabilities to current backplane cable products, with impedance matching, low pair-to-pair crosstalk, within-pair and pairto-pair skew control and a variety of raw-cable designs to meet customer-specific loss budgets. Suitable for existing / new generations of XAUI and InfiniBand*based systems.

Hard Metric Cable Assemblies

Impact™ Cable Assemblies

Circuits Size

6 Gbps

55 diff pair/inch

Contact Molex

• Networking

3-5 Gbps

100 real signals/inch

Contact Molex

• Data/Communications • Industrial Automation • Networking • Telecommunications

1.5 Gbps

Contact Molex

Contact Molex

• Data/Communications • Industrial Automation • Networking • Telecommunications

2.5 Gbps

100 real signals/inch

Contact Molex

• Data/Communications • Networking • Telecommunications

25 Gbps

80 diff pair/inch

Contact Molex

• Data/Communications • Telecommunications

800 MHz

Contact Molex

Contact Molex

• Data/Communications • Industrial Automation • Networking • Telecommunications

Applications

*VHDM-HSD is a trademark of Amphenol Corporation

Offering high-speed differential pair or single mode solutions for applications include backplaneto-backplane and cabinet-to-cabinet I/O signal transmission. Molex’s advanced manufacturing capabilities include computer-controlled laser wire preparation, thermo-resistance welding, ultra sonic welding, and insert molding.

The Very High Density Metric (VHDM*) system comprises arrays of individual wafers that incorporate the signal pins as well as strip-line shielding. The shielding allows 100% of the signal pins to be used for signal transmission. Accommodates micro coaxial, micro twisted pair and micro twin axial cable constructions.

VHDM* Cable Assemblies

Density

*InfiniBand is a trademark of the InfiniBand Trade Association

VHDM-HSD™* connectors comprise arrays of individual wafers that incorporate the signal pins as well as the strip-line shielding. The shielding allows 100% of the signal pins to be used for signal transmission. Designs can accommodate multi-wafer and custom backshell solutions. In house test equipment is also available.

VHDM-HSD™ Cable Assemblies*

Speed

*VHDM is a trademark of Amphenol Corporation

Impact™ cable assemblies use a low-impedance, localised ground-return path in an optimised differentialpair array. Shielded and isolated, the pairs are tightly coupled to, and surrounded by, ground structures, leading to reduced cross-talk and increased overall bandwidth performance, with minimal performance variance across the system.

Engineered to match application requirements for controlled impedance and propagation rates, Milli-Z™ cables help minimise crosstalk. Cables are compatible with single, four, five and six row carrier systems for industry standard backplane headers. They also mate with single and dual row printed circuit board headers.

Milli-Z™ Cables

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31

FFC/FPC Connectors Core Micro Products

Product Name

FFC/FPC Connectors

Description Ideal for tight-packaging applications, Molex’s line of FFC/FPC connectors come in various pitch options ranging from 0.20mm pitch up to 1.00mm and include features to meet a wide variety of space and usage needs for applications in all markets.

Molex’s FFC/FPC connectors are available with push and flip-style actuators, which are pre-assembled covers that secure the connection between the FFC/FPC and the connector terminals. Molex is continually developing lower-profile and higher-density versions to meet the downsizing needs of electronic equipment makers.

Pitch (mm)

Series

0.20

503419

0.25

Au

Au

0.9

Au

Au

1.0

Au

Au

1.65

-xx68

-xx60

-xx68

-xx60

-xx20

-xx91

-xx21

-xx92

503566

-xx08

-xx00

502598

-xx11

-xx91

503425

-xx11

-xx91

1.2

501912

-xx10

-xx90

1.8

502078

51281 54548 54550

0.9 Au

Au

-xx09

-xx01

Au

Au

-xx08

-xx02

Au

Au

-xx09

-xx00

Au

Au

-xx30

-xx92

SnBi

SnBi

-xx40

-xx94

Au

Au

-xx19

-xx33

SnBi

SnBi

-xx29

-xx71

Au

Au

-xx22

-xx33

SnAgBi

SnAgBi

-xx29

-xx71

Au

Au

0.95 1.15

0.8 1.0 1.2 1.2 1.2

-xx19

-xx11

Au

Au

-xx22

-xx33

SnAgBi

SnAgBi

-xx29

-xx71

Au

Au

-xx22

-xx33

SnAgBi

SnAgBi

-xx29

-xx71

Au

Au

-xx22

-xx33

SnAgBi

SnAgBi

-xx59

-xx97

Au

Au

-xx22

-xx33

SnAgBi

SnAgBi

-xx39

-xx71

Au

Au

-xx22

-xx33

SnAgBi

SnAgBi

-xx29

-xx31

Au

Au

-xx22

-xx33

SnAgBi

SnAgBi

-xx68

-xx62

Au

Au

502790

-xx11

-xx91

Au

Au

2.5

502611

-xx29

-xx21

Au

Au

3.9

-xx21

-xx80

-xx51

-xx81

SnBi

SnBi

-xx11

-xx90

-xx31

-xx91

Au

Au

-xx41

-xx92

503366 52435 52437 52745 52746 54104 54132

501864

32

H (mm)

-0xx0

503480

0.50 RA0.50 RA0.50 RA

Tail Plating

-xx10

501461

Through-hole versions are available in vertical and right-angle configurations, ZIF and non ZIF versions and various pitch options ranging from 1.00mm to 2.54mm.

Circuit sizes range from 1 to 50.

Contact Plating

-0xx8

502250

Other features include Molex’s unique BackFlip™ actuator design, which provides easy cable insertion and extraction even in tight packaging applications, top, bottom and dual contact versions are available.

T&R (Tray)

-xx18

503320

0.30

Conn

2.0 2.0 2.0 2.0 2.0 2.0 2.0

4.85

ttieurope.com/molex

FFC/FPC Connectors Core Micro Products

Depth (mm)

FPC T (mm)

Cable Type

Contact Pos.

Actuator type

Voltage (V)

Current (A)

Temp. (min.)

Temp. (max.)

2.85

0.2

FPC

Bottom

Front flip

50

0.2

-40°C

+85°C

2.75

0.2

FPC

Bottom

Front flip

50

0.2

-20°C

+85°C

2.98

0.2

FPC

Bottom

Front flip

50

0.3

-40°C

+85°C

4.19

0.2

FPC

Dual

Back flip

50

0.2

-25°C

+85°C

2.85

0,2

FPC

Bottom

Front flip

50

0.2

-40°C

+85°C

3.8

0.2

FPC

Dual

Back flip

50

0.2

-40°C

+85°C

4.6

0.2

FPC

Dual

Back flip

50

0.2

-40°C

+85°C

3.85

0.2

FPC

Bottom

Front flip

50

0.2

-20°C

+85°C

3.2

0.12

FPC

Bottom

Back flip

50

0.3

-40°C

+85°C

4.0

0.3

FFC/FPC

Dual

Back Flip

50

0.5

-40°C

+85°C

4.05

0.3

FFC/FPC

Dual

Non ZIF

50

0.5

-20°C

+85°C

3.85

0.3

FFC/FPC

Bottom

Pull up

50

0.5

-20°C

+85°C

3.85

0.3

FFC/FPC

Top

Push pull

50

0.5

-20°C

+85°C

5.6

0.3

FFC/FPC

Bottom

Front flip

50

0.5

-20°C

+85°C

5.2

0.3

FFC/FPC

Top

Push pull

50

0.5

-40°C

+85°C

5.2

0.3

FFC/FPC

Bottom

Pull up

50

0.5

-40°C

+85°C

5.0

0.3

FFC/FPC

Top

Push pull

50

0.5

-20°C

+85°C

5.0

0.3

FFC/FPC

Bottom

Pull up

50

0.5

-20°C

+85°C

5.6

0.3

FFC/FPC

Top

Push pull

50

0.5

-20°C

+85°C

5.6

0.3

FFC/FPC

Bottom

Push pull

50

0.5

-20°C

+85°C

5.3

0.3

FPC

Bottom

Front flip

50

0.5

-20°C

+85°C

7.9

0.3

FPC

Bottom

Front Flip

100

0.3

-10°C

+100°C

Note FPC with tabs Low-Halogen Longer actuator FPC with notches Low-Halogen FPC with tabs FPC with notches FPC with notches increased act lock F, 8ckt only

FPC with tabs

FPC with tabs, 2 contacts FPC with tabs Jacket:501783, Cover:501784

8.0

0.3

FFC/FPC

Bottom

Jacket

50

0.3

-40°C

+85°C Shield FFC Sealing treat

ttieurope.com/molex

33

FFC/FPC Connectors Core Micro Products

Pitch (mm)

Series

Conn

T&R (Tray)

Contact Plating

Tail Plating

H (mm)

Depth (mm)

FPC T (mm)

0.20

503419

-0xx8

-0xx0

Au

Au

0.9

2.85

0.2

-xx18

-xx10

-xx68

-xx60

Au

Au

1.0

2.75

0.2

Au

Au

1.65

2.98

0.2

0.9

4.19

0.2

0.95

2.85

0.2

1.15

3.8

0.2

0.25

502078 503320

-xx68

-xx60

-xx20

-xx91

-xx21

-xx92

503566

-xx08

-xx00

502598

-xx11

-xx91

503425

-xx11

-xx91

1.2

4.6

0.2

501912

-xx10

-xx90

1.8

3.85

0.2

0.8

3.2

0.12

1.0

4.0

0.3

1.2

4.05

0.3

1.2

3.85

0.3

1.2

3.85

0.3

2.0

5.6

0.3

2.0

5.2

0.3

2.0

5.2

0.3

2.0

5.0

0.3

2.0

5.0

0.3

2.0

5.6

0.3

2.0

5.6

0.3

502250 0.30

501461 503480 51281 54548 54550 503366 52435

0.50 RA0.50 RA0.50 RA

52437 52745 52746

Au

-xx09

-xx01

Au

Au

-xx08

-xx02

Au

Au

-xx09

-xx00

Au

Au

-xx30

-xx92

SnBi

SnBi

-xx40

-xx94

Au

Au

-xx19

-xx33

SnBi

SnBi

-xx29

-xx71

Au

Au

-xx22

-xx33

SnAgBi

SnAgBi

-xx29

-xx71

Au

Au

-xx19

-xx11

Au

Au

-xx22

-xx33

SnAgBi

SnAgBi

-xx29

-xx71

Au

Au

-xx22

-xx33

SnAgBi

SnAgBi

-xx29

-xx71

Au

Au

-xx22

-xx33

SnAgBi

SnAgBi

-xx59

-xx97

Au

Au

-xx22

-xx33

SnAgBi

SnAgBi

-xx39

-xx71

Au

Au

-xx22

-xx33

SnAgBi

SnAgBi

-xx29

-xx31

Au

Au

-xx22

-xx33

SnAgBi

SnAgBi

-xx68

-xx62

Au

Au

502790

-xx11

-xx91

Au

Au

2.5

5.3

0.3

502611

-xx29

-xx21

Au

Au

3.9

7.9

0.3

SnBi

SnBi 4.85

8.0

0.3

Au

Au

54104 54132

501864

34

Au

-xx21

-xx80

-xx51

-xx81

-xx11

-xx90

-xx31

-xx91

-xx41

-xx92

ttieurope.com/molex

FFC/FPC Connectors Core Micro Products

Cable Type

Contact Pos.

Actuator type

Voltage (V)

Current (A)

Temp. (min.)

Temp. (max.)

FPC

Bottom

Front flip

50

0.2

-40°C

+85°C

FPC

Bottom

Front flip

50

0.2

-20°C

+85°C

FPC

Bottom

Front flip

50

0.3

-40°C

+85°C

FPC

Dual

Back flip

50

0.2

-25°C

+85°C

FPC

Bottom

Front flip

50

0.2

-40°C

+85°C

FPC

Dual

Back flip

50

0.2

-40°C

+85°C

FPC

Dual

Back flip

50

0.2

-40°C

+85°C

FPC

Bottom

Front flip

50

0.2

-20°C

+85°C

FPC

Bottom

Back flip

50

0.3

-40°C

+85°C

FFC/FPC

Dual

Back Flip

50

0.5

-40°C

+85°C

FFC/FPC

Dual

Non ZIF

50

0.5

-20°C

+85°C

FFC/FPC

Bottom

Pull up

50

0.5

-20°C

+85°C

FFC/FPC

Top

Push pull

50

0.5

-20°C

+85°C

FFC/FPC

Bottom

Front flip

50

0.5

-20°C

+85°C

FFC/FPC

Top

Push pull

50

0.5

-40°C

+85°C

FFC/FPC

Bottom

Pull up

50

0.5

-40°C

+85°C

FFC/FPC

Top

Push pull

50

0.5

-20°C

+85°C

FFC/FPC

Bottom

Pull up

50

0.5

-20°C

+85°C

FFC/FPC

Top

Push pull

50

0.5

-20°C

+85°C

FFC/FPC

Bottom

Push pull

50

0.5

-20°C

+85°C

FPC

Bottom

Front flip

50

0.5

-20°C

+85°C

FPC

Bottom

Front Flip

100

0.3

-10°C

+100°C

Note FPC with tabs Low-Halogen Longer actuator FPC with notches Low-Halogen FPC with tabs FPC with notches FPC with notches increased act lock F, 8ckt only

FPC with tabs

FPC with tabs, 2 contacts FPC with tabs Jacket:501783, Cover:501784

FFC/FPC

Bottom

Jacket

50

0.3

-40°C

+85°C Shield FFC Sealing treat

ttieurope.com/molex

35

Modular Jacks

Style

Right Angle

Vertical

Right Angle with Magnetics

PoE / PoE+ Magnetic Jacks

PoE PD Magnetic Jacks

36

Description Available with and without shielding in through-hole or SMT mounting. Optional integrated LED‘s or light pipes also available. Mounting options include inboard or outboard fitting nails. Inverted types and types with RJ11 keep out features also available. Standard and low profile versions and gold and palladium nickel / gold flash plating is offered.

Available with and without shielding in through-hole or SMT mounting with flush or flanged panel options. Low profile (12.70mm height) versions and types with SMT solder tabs for increased board retention.

A single port bottom entry type is also availabe for space constrained applications. Gold or palladium nickel / gold flash plating is offered.

Magnetic modular jacks, available in single- and multi-port versions, simplify customer board layouts by reducing the number of components required. All parts are IEEE 802.3 compilant and hence Ethernet 10/100/1000 compatible. Available with or without integrated LED’s and also availabe in low-profile 13.45mm heights.

Molex offers a range of Integrated Jacks or ICMs that provide a cost-effective, plug-and-play solution for customers implementing PoE and PoE Plus (PoE+).

Available in single port (1-by-1), 8-port (2-by-4), and 12-port (2-by-6) configurations and with LED options, the ICMs provide PoE+ Power Source Equipment (PSE) capability.

PDJack™ with integrated ‘Power Device’ controller circuitry plus Ethernet connectivity simplifies PoE Plus implementation for any network device. The PDJack supplies 54 V of power up to 25.5 watts. Two pins output power and standard signal pins provide Ethernet connectivity. Additional pins allow power-up of external DC to DC converter.

Number of Ports

Catagory

Circuits / Contacts

3, 5, 5e, 6

4/2, 4/4, 6/2, 6/4, 6/6, 8/2, 8/4, 8/6, 8/8, 8/10

1

3, 5

4/2, 4/4, 6/2, 6/4, 6/6, 8/2, 8/4, 8/6, 8/8, 8/10

• Telecom • Networking • Medical • Consumer • Data/Computing

1, 8, 12

Gigabit Magnetics

8/8

• Telecom • Networking • Medical • Consumer • Data/Computing

1, 8, 12

PSE PoE+

8/8

• Telecom • Networking • Medical • Consumer • Data/Computing

1

PD – PoE+

8/8

• Telecom • Networking • Medical • Consumer • Data/Computing

1, 2, 3, 4, 5, 6, 8, 12, 16

Applications

• Telecom • Networking • Medical • Consumer • Data/Computing

ttieurope.com/molex

Solderless Terminals

Product Name

Description • An all-weather solderless terminal • Provides waterproof crimp connections • NiAc™ heat-shrinkable insulation

Perma-Seal™ • Solutions for splicing and tapping of magnet and aluminum wire • Terminates magnet wire without removing insulation • Open barrel permits easy access

MagKrimp™ • Wire AWG: 10 - 22 • Available in non-insulated, PVC insulated and nylon insulated wires • Provides a reliable, vibration-proof connection

Wire Pins • Wire AWG: 8 AWG - 250 MCM • Available with or without tin plating • For heavy-duty 600V applications

Battery Cable Lugs • Wire AWG: 22 AWG - 600 MCM • Seamless crimp barrel • Heavy-duty terminals with tin plating

VersaKrimp™ • High-quality, seamless-barrel metric ring terminals • Insulated Avikrimp™ and un-insulated VersaKrimp™ seamless barrel types • Suitable for terminations using metric studs up to 10mm in diameter and wire size up to 6mm²

Metric Ring Terminals • Designed for high-temperature applications from +343 to +649°C • Nickle-plated copper • Butt seamed and barrel styles

High Temperature Terminals and Splices

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37

Terminal Blocks

Product Name

Positive Locking System

Beau™ EuroMate™ Pluggable

Description • Current rating: 10.0A • Wire Gauge: 12 to 30 AWG • Voltage rating: 300V • Circuits: 2 to 24 • Pitch: 4.00 to 5.00mm • Operating temperature: -40 to +115°C • UL File No.: E48521

• Current rating: 12.0 to 15.0A • Wire Gauge: 12 to 22 AWG • Voltage rating: 300V • Circuits: 3 to 24 • Pitch: 3.81 to 5.08mm • Operating temperature: -40 to +120°C • UL File No.: E48521

• Current rating: 20.0 to 115.0A • Wire Gauge: 11 to 30 AWG • Voltage rating: 300V or 600V • Circuits: 2 to 16 • Pitch: 5.08 to 15.00mm • Operating temperature: -40 to +130°C • UL File No.: E48521

Beau™ Eurostyle™ High-Power Fixed Mount

• Current rating: 85.0A • Wire Gauge: 3 to 14 AWG • Voltage rating: 600V • Circuits: 2 to 12 • Pitch: 12.00mm • Operating temperature: -40 to +130°C • UL File No.: E48521

EuroMax™ Pluggable High-Power

• Current rating: 20.0 to 63.0A • Wire Gauge: 6 to 22 AWG • Voltage rating: 300V or 600V • Circuits: 2 to 12 • Pitch: 8.00 to 15.00mm • Operating temperature: -40 to +105°C • UL File No.: E48521

Eurostyle™ Two-Screw Terminal Strips

Eurostyle™ PCB Pluggable

• Current rating: 8.0 to 30.0A • Wire Gauge: 12 to 30 AWG • Voltage rating: 300V • Circuits: 2 to 48 • Pitch: 3.50 to 9.53mm • Operating temperature: -40 to +115°C • UL File No.: E48521

• Current rating: 10.0 to 65.0A • Wire Gauge: 8 to 30 AWG • Voltage rating: 300V or 600V • Circuits: 2 to 32 • Pitch: 6.37 to 17.48mm • UL File No.: E48521

Beau™ Barrier Strips

38

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RF Microminiature & Subminiature Products

RF Miniature, Medium and Large Products

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39

Sealed Connectors

Product Name

Mini-Fit® H2O

Description The Mini-Fit® H2O mid-range power connector is designed for use in weatherproof applications that require a sealed system. The Mini-Fit H2O connector system is IP67-rated, which ensures connector integrity when submersed in up to one meter of water. The MiniFit H2O connector has a small overall profile and can handle up to 9.0A per circuit.

The pre-assembled, fully-submersible MX150™ family is available with housing matte seals or cable seals. It offers a reduced package size and is ideal for SAE- and ISO-style wire in single- and dual-row configurations supporting both signal and power applications up to 22.0A. Features include integral TPA and optional CPA.

Pitch

Current Rating

Circuits Size

Applications

• Alternative Energy Source • Commercial Vehicle • Consumer • Industrial Automation • Medical

4.20mm

9.0A

2

3.50mm

22.0A

2- 20

• Automotive • Commercial Vehicle

5.84mm, 7.62mm

Up to 18.0A and 40.0A

2-16

• Commercial Vehicle • Consumer • Industrial Automation

2.54mm

25.0A Max

56, 66, 73, 80,

N/A

N/A

4 - 64

• Industrial Automation • Military/Aerospace • Networking • Telecommunications

N/A

N/A

N/A

• Data/Communications • Industrial Automation • Networking • Telecommunications

N/A

N/A

N/A

• Industrial Automation • Medical

N/A

13.0A Max

14, 31

MX150™

MX150L™

MX123™

MXL38999™

Offered in wire-to-wire, wire-to-panel and wire-toboard configurations, the IP67-rated MX150L™ system provides design flexibility for low level signal to high power applications. Key features include pre-assembled connector housings, integral TPA and two-way mat seal on mating connector, sealed panel-mount plugs and proven blade-type terminals.

The MX123™ is a fully sealed, high-performance connection system designed for transportation powertrain applications in the most challenging under-hood environments. Features include integral TPA and CPA, lever ‘mate assist’ receptacles and ‘anti-scoop’ housings to prevent terminal damage. Headers and dress covers complete the range.

High-density all optical MXL38999™ provides MILDTL-38999 solutions for APC, UPC single mode and PC multi-mode applications. The connectors include precision-machined and plated all-metallic inserts with zero plastic distortion. Available in all standard shell materials and plating options. Designed with Molex’s LumaCore™ optical terminus technology.

The Sealed SFP (Small Form-factor Pluggable) assembly is an optical and electrical-integrated connection system, designed to maximize valuable real estate on the PCB while providing an environmentally rugged interface rated to IP67. Compatible with ODVA optical and copper assemblies.

• Automotive • Commercial Vehicle

Sealed SFP

Industrial USB

XRC™

40

Molex’s IP67 and NEMA 6P rated Industrial type A and type B Universal Serial Bus (USB) connectors are ideal for industrial and harsh commercial applications. The rugged plug and receptacle designs feature bayonetstyle latches, encapsulated PCB receptacles and fully shielded cable assemblies to help keep out dust, debris and water.

The IP67 rated Extra Rugged Circular (XRC™) system includes plastic plugs and receptacles and new lowinsertion-force stamped terminals. Features include tactile and audible mating feedback, visual markings on outer shell, seal retainer collar, imprinted wire seals and bayonet-latch design in shell sizes 18 (14 contact) and 24 (31 contact) types.

• Automotive • Commercial Vehicle

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Sealed Connectors

Product Name

SRC

Mizu-P25™

CMC

CMX

Perma-Seal™

Description Molex’s SRC (Sealed Rectangular Connectors), with single-handed blind-mate functionality offer a hybrid, high power-and-signal, high circuit-count interface for harsh applications in commercial vehicles. The SRC system uses proven MX150™ terminals with current ratings up to 18.0A and MX150L™ terminals with current ratings up to 40.0A.

Mizu-P25™ wire-to-wire connector system is IP67 certified. The family includes systems rated up to 125 V and 250 V. Due to their small dimensions both systems are ideal for wire-to-wire applications in confined spaces. Other features include positive locking, polarisation and special terminal designs for high vibration applications.

The Molex family of CMC Hybrid Connectors provides a sealed, high-density, modular and cost-effective connection system for heavy-duty, powertrain and bodyelectronics applications in the transportation industry.

Traditionally a wire-to-board system, Molex has recently introduced a 32-circuit wire-to-wire version and new 28-circuit R/A headers.

Robust, high-density CMX connectors provide IP6K9K interfacial-seal protection in a compact, cost-effective lean design for electronic control units and other wireto-board transportation applications. Features include a robust TPA™ design, different color codings and polarisation, lever-actuated movable seal protector and sealing dummy cavity plugs.

MIL-T-7928 approved Perma-Seal™ terminals and splices give long-lasting, moisture-proof connections that withstand corrosive compounds and heat. The NiAc™ insulation material (shrinks up to 40% faster than comparable nylon/ polyolefin products) and special hot-melt adhesive used in the inner wall of the sleeve provide a tough and durable seal.

The MXP120™ Sealed Connector System is a highperformance 1.20mm terminal in-line connection system for automotive and commercial vehicles. Female receptacles feature an integral locking-latch with bridge protection and independent secondary locking while the male connectors feature primary lock reinforcement.

Pitch

Current Rating

Circuits Size

4.20mm

40.0A max

38, 66, 84

• Commercial Vehicle • Industrial

2.50mm

3.0/4.0A

2-4

• Automotive • Commercial Vehicle • Consumer • Industrial

Various

2.5 - 26.0A (Power Blade)

22 - 154

• Automotive • Commercial Vehicle • Industrial

2.50mm 3.70mm

7.50A max

55, 65

• Automotive • Commercial Vehicle

N/A

N/A

N/A

• Industrial Automation • Military/Aerospace • Networking • Telecommunications

4.00mm

13.0A

2, 6

• Automotive • Commercial Vehicle • Consumer

Applications

MXP120™

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41

Memory Module Sockets

Product Name

DDR3 DIMM

Description Molex offers DDR3 DIMM sockets in low-profile and verylow-profile SMT and press-fit aerodynamic versions with 2.40mm seating plane, that maximise air flow around memory modules during operation, and ultra-low-profile DDR3 DIMM sockets with 1.10mm seating plane for optimum design flexibility. Accepts JEDEC specifications, ATCA recognised.

DDR2 increases the data bandwidth over DDR by doubling the data fetch rate at the same bus frequency.

It is able to deliver data throughput beyond 3.2 Gbps.

Features include high-temperature thermoplastic housing, dual ejector latches, added contact wipe and beveled metal pins.

Angle

Current Rating

Circuits Size

Applications

Vertical 25°

1.0A

240

• Data/Communications • Industrial • Medical • Networking • Telecommunications

Vertical 25° 22.5°

1.0A

200, 244

• Consumer • Data/Communications • Networking • Telecommunications

1.0A

200, 244

• Consumer • Networking • Telecommunications

Vertical 28.5°

0.5A

240

• Data/Communications • Networking

Vertical Right Angle 25°

1.0A

168

• Consumer • Data/Communications • Networking • Telecommunications

Vertical

0.75A (Per pin)

288

• Telecom • Datacom

DDR2 DIMM

MiniDIMM

The MiniDIMM saves PCB real estate over full size DIMMs whilst ensuring the same reliable features.

Features include card guide style latch, direct module Vertical insertion into connector, integral vibration damping, SMT fitting nails at both ends, and standard and reverse Right Angle 22.5° configurations in vertical, angled and right-angled versions.

FB DIMM combines the high-speed internal architecture of DDR2 with a bi-directional point-to-point serial memory interface which links each FB DIMM module together in a chain. The system is available in various color options and accepts JEDEC defined modules to ensure 100% industry compatibility.

Fully Buffered DIMM Molex’s DIMM modules feature high-temperature thermoplastic housing to withstand lead-free solder processing, dual ejector latches to ensure easy module insertion/removal with minimal micro-motion, added contact wipe for oxidation wipe-off and forklocks for secure PCB retention.

DIMM Meeting JEDEC specifications, Molex’s DDR4 high-speed sockets offer greater PCB real-estate and cost savings with excellent assembly-processing compatibility. The sockets feature high dimensional stability and excellent compatibility in lead-free and halogen-free technologies.

DDR4

42

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Memory Card Sockets

Product Name

Description Available in various profiles, Molex’s push-push, hinged and push-pull microSD* connectors reduce card sticking and memory card fly-out. Features include ultra small size, detect terminal with wiping function, metal shielding, gold-plated beveled contacts, solder nails and detect switch.

microSD*

SD

microSD*/ SIM Combo

Pitch

1.09mm 1.10mm 1.27mm

Current Rating

0.5A

Circuits Size

Applications

8/9

• Automotive • Consumer • Data/Communications • Industrial • Medical

9

• Automotive • Consumer • Data/Communications • Industrial • Medical

16 / 18

• Automotive • Consumer • Data/Communications • Industrial • Medical

6/8

• Automotive • Consumer • Data/Communications • Industrial • Medical

6, 8

• Automotive • Consumer • Data/Communications • Industrial • Medical

6

• Automotive • Consumer • Data/Communications • Industrial • Medical

*microSD is a trademark of the SD Card Association

Molex‘s compact size, user-friendly SD memory card connectors provide space savings and features like push-push eject for smooth card extraction and with the newest design allowing the card to extend to 6.00mm outside the shell in the locked position. The family includes card polarisation features and gold-plated beveled contacts.

This combo connector enables the user to combine two connector form factors into one, thus saving space.

Push-push reverse-mount microSD* with detect switch combined with push-pull normal-mount SIM provide design flexibility with left-entry and right-entry versions.

Reliable coplanarity of 0.1mm max after reflow ensures assembly process efficiency.

2.50mm

1.09mm 1.27mm

0.5A

0.5A

*microSD is a trademark of the SD Card Association

Molex’s low-profile micro-SIM card sockets come in hinged, push-pull and push-push styles offering optimum space and cost-savings. Features include small footprint and low-profile height, terminal-beam design with gradual lead-in, anti-shorting feature, card polarisation and multiple soldering hold-down points.

1.35mm 1.40mm 2.54mm

Molex‘s SIM card connectors are made of hightemperature thermoplastic material and feature a range of standard options plus the ability to custom design parts in specific applications. The new block-type design integrates the SIM card into the mobile application via the connector.

1.09mm 1.27mm 2.54mm

0.5A

micro-SIM

0.5A

SIM Molex offers ChipSIM connectors in standard and custom designs for both the connector and cardholder.

Optionally, the connector comes with an active- or passive-latch mechanism, location tabs and various button designs and colors; the cardholder fascia is modifiable for shorter customer assembly process.

ChipSIM

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2.54mm

0.5A

43

Standard Antennas

Product Name

Description • Ground-plane independent design • Poly-fl exible, double-sided adhesive tape on antenna • Robust coaxial cable to fl exi-antenna with Pull Force of over 18.0N • Choice of several miniature coaxial cable length options

2.4/5 GHz Wifi Standalone Antenna • Smallest on-ground plastic antenna in the market measuring only 3.00 by 3.00 by 4.00mm • No removal of ground layers from beneath the antenna needed • Fully SMD-compatible • Application of Laser Direct Structuring (LDS) chip antenna technology in manufacturing

2.4GHz Surface Mount Device (SMD) On Ground Antenna • Built on proprietary MobliquA™ technology enable signifi cant antenna volume reduction • Balanced design minimises ground-plane effects • Minimum total radiation effi ciency of 50% and 67% (respectively) for the 868 and 915 MHz bands • Poly-fl exible, double-sided adhesive tape for easy peel-and-stick mounting

868/915MHz ISM Standalone Antenna • Total average effi ciency of 80% at the low band (GSM850, GSM900) and 70% at the high band (GSM1800, GSM1900 and LTE band-7) • Balanced design minimises ground-plane effects • Poly-fl exible double-sided adhesive tape for easy peel-and-stick mounting • Robust coaxial cable to fl exi-antenna with a pull-force of over 18N

Cellular 6 Band Standalone Antenna • Simple 50 Ohm passive antenna interface provides complete CMMB band coverage • Internal antenna design enhances mobile device appearance • Product is RoHS compliant and halogen-free for environmental sustainability • Specially-designed housing slots reduce antenna radiation loss

Mobile TV Standard Antenna

44

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Solid State Lighting

Product Name

LED Array Holders

Description • Molex LED Array Holders available for Bridgelux*, Citizen†, Cree‡, Nichia and Sharp** • Certified and tested to UL 496 OLFB2 lampholder specification • Simplifies the COB (chip on board) LED installation process, reducing quality concerns associated with other installation methods such as hand solder • Compression contacts to power array provide a reliable electrical connection • Double-ended wire-trap terminal to attach power source, allows for wiring single or serial LED sequences to ensure ease of assembly and design flexibility • New elegant design features provide a clean and finished look to COB LED array installation • Molex LED holder designs address every aspect of COB LED installation: thermal management, reliable electrical connection and optical requirement • New designs available for Cree XLamp‡ series CXA1507, CXA1512, CXA2520, CXA2530 • Mechanical attachment for directional optics (Optional CXA25) • Pre-load feature allows for attachment of COB LED to holder prior to attaching to heat sink, simplifying installation • Elegant design with flat landing surface for secondary optics and beveled area to allow for an uninterrupted beam pattern from lightsource • High temperature thermal plastic housing to resist high heat environments

Cree ‡ LED Array Holders • Designed to accommodate Nichia L series COB LED arrays • Clearance provided around LED to easily incorporate secondary optics • Concealed wire trap cap protects electrical contacts and provides additional voltage isolation when incorporating metal reflectors • High temperature thermal plastic housing to resist high heat environments

Nichia LED Array Holders

Pico-EZmate™ Harness

• Solderless connection design minimises handling of arrays during installation, greatly reducing the possibility of damage • Eliminates specialised operator training and solder-joint inspection • Vertical snap-to-mate connection enables a fast, easy and reliable connection to the LED array holder • Low-profile 1.40mm connector height provides a slim design for space-limited applications and minimises risk of affecting light output • Positive-lock latching feature provides an audible click to confirm connection • Available in 3 wire gauges and several length options for design flexibility (Bridgelux Vero* example shown in photo)

* Bridgelux and Vero are trademarks or registered trademarks of Bridgelux, Inc. † Citizen is a registered trademark of Citizen Electronics Co., Ltd. ‡ Cree and XLamp are registered trademarks of Cree, Inc. ** Sharp is a registered trademark of Sharp Electronics Corporation.

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45

Switch Products

Switch Technology

Capacitive Sensing

Description • Elegant design - Unique backlighting solution with seamless overlays allow for easy cleaning - Unlimited cosmetic options including colors, textures and backlighting • Robust and durable - No moving parts to wear out; can sense through the protection of glass or thick plastic overlays - Resistant to harsh chemical exposure, the effects of EMI and contaminants on overlays - Can be sealed and protected from environmental effects • Design flexibility - Circuit can be constructed using polyester, polyimide or PCB and can be mounted to curved surfaces - Shape and size of buttons can be tailored to customer specifications • Extremely reliable contact system withstands even the most rugged commercial environment • Dome designs are produced with auto-placement in mind to ensure product reliability • Lightweight and low profile; easy to integrate into smaller and thinner packages

Metal Dome Arrays • Extremely resistant to shock and vibration; excellent for commercial applications • Durable to meet the needs of rugged and high-usage applications • Can be shielded to offer protection against static discharge and EMI/RFI

Membrane Switches Non-Tactile • Extremely reliable contact system that withstands even the most rugged commercial environment • Dome designs are produced with auto-placement in mind to ensure product reliability • Can be shielded to offer protection against static discharge and EMI/RFI

Membrane Switches Tactile • Allows addition of simple electronic components onto the flexible switch substrate, which often eliminates the need for an additional LED or display board mounted below the switch substrate • Washable and well-suited for medical, industrial and commercial applications • Can be shielded to offer protection against static discharge and EMI/RFI

Bonded Membrane Switch Assemblies • Combines both the switch contact system and custom electronics into one complete package, eliminating the need for an additional LED indicator board • Keypad can be designed using various interface systems, such as 3-dimensional (rubber keypad) buttons or flat panels • PCB substrate offers additional rigidity in front panel applications, which may eliminate the need for a metal backer

Hybrid Switch Assemblies • Combines both the switch contact system and custom electronics into once complete package, eliminating the need for an additional motherboard or display board • Keypad can be designed using various interface systems, such as 3-dimensional (rubber keypad) buttons or flat panels • Can be shielded to offer protection against static discharge and EMI/RFI

Control Panel Assemblies • Insert molded contact system can be combined with molded assembly packages, which is well-suited for end products such as cellular telephone volume controls and special, sealed product applications • Front panel may be backlit by electroluminescent panels • Washable and well-suited for medical, industrial and commercial applications

Insert Molded Switch Assemblies 46

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Switch Products

Switch Technology

Description • Alternative to PCBs or polyimide, which reduces the cost and allows printed flexible tail integration as part of the switch substrate • Eliminates the need for an additional interconnect method • Easy to integrate into low-profile applications so products can be designed into tightly controlled areas • Designers may add optional cosmetic enhancements such as rubber keypads or graphic overlays

Flexible Circuits

Custom Solutions When it comes to investing in research and development, Molex is an industry leader. We know that by leveraging our internal product technology, we can drive a continuous supply of innovation directly to you. If you are faced with a specific challenge that cannot be solved through our existing portfolio of connectors and integrated products, please contact Molex.

Application Tooling Molex offers a wide variety of production equipment designed and tested to ensure a high quality electrical connection. From fully automatic equipment that provides production flexibility and works in most industry standard wire processors to semiautomatic equipment and hand tools for prototyping, Molex offers the solution for all your application needs.

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47

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