Techspan - Dyna Purge Grade D2 vs competitive commercial purging compounds

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New Dyna-Purge速 D2 vs. other commercial purging compounds Performance test results comparing commercial purging compounds: New Dyna-Purge速 D2 (Mechanical/Non-Abrasive)

Mechanical (Abrasive) Purging Compound Chemical Purging Compound

Conducted by The Institute of Polymer Science and Polymer Engineering at The University of Akron in Akron, Ohio. Commissioned by Shuman Plastics, Inc., Dyna-Purge速 Division, Depew, New York


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Techspan - Dyna Purge Grade D2 vs competitive commercial purging compounds by Tim Fastnedge - Issuu