COTS Journal, June 2026

June 2026, Volume 28 - Number 6 cotsjournalonline.com

The Journal of Military Electronics & Computing

Aerospace-Grade Thin Film Substrates: The Foundation of Electronics Reliability Why the Other AI—Access Intelligence—is a Critical Security Layer for Defense Contractors

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COTS (kots), n. 1. Commercial off-the-shelf. Terminology popularized in 1994 within U.S. DoD by SECDEF Wm. Perry’s “Perry Memo” that changed military industry purchasing and design guidelines, making Mil-Specs acceptable only by waiver. COTS is generally defined for technology, goods and services as: a) using commercial business practices and specifications, b) not developed under government funding, c) offered for sale to the general market, d) still must meet the program ORD. 2. Commercial business practices include the accepted practice of customer-paid minor modification to standard COTS products to meet the customer’s unique requirements —Ant. When applied to the procurement of electronics for the U.S. Military, COTS is a procurement philosophy and does not imply commercial. Office environment or any other durability grade. E.g., rad-hard components designed and offered for sale to the general market are COTS if they were developed by the company and not under government funding.

SPECIAL FEATURE 16

Aerospace-Grade Thin Film Substrates: The Foundation of Electronics Reliability

By Jeff Elliott, Contributing Technical Writer

DEPARTMENTS 6

Publisher’s Note

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The Inside Track

SYSTEM DEVELOPMENT 20

Why the Other AI—Access Intelligence—is a Critical Security Layer for Defense Contractors

By Scott Meyer, CEO of Sign In App.

COT’S PICKS 24

Editor’s Choice for June Cover Image: Dark Doorway An explosive ordnance disposal technician assigned to Explosive Ordnance Disposal Mobile Unit 1 clears a doorway during training in California, June 15, 2026.

Credit: Navy Petty Officer 2nd Class August Clawsonead

COTS Journal | June 2026

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A48_COTS.qxp_A19.qxd 12/10/25 1:43 PM Page 1

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COTS Journal

Jeff Elliott, Scott Meyer

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PUBLISHER’S NOTE

By John Reardon, Publisher & CEO of COTS Journal

BEYOND THE HEADLINES: INNOVATIONS TO WATCH

As publisher of COTS Journal, I've often received media briefings that, while interesting, fall just outside our normal editorial scope. Here are a few that stood out to me.

Perfect Point EDM Perfect Point EDM is ushering in a maintenance breakthrough for the aerospace industry. For decades, techni-

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COTS Journal | June 2026

cians relied on twist drills to remove titanium rivets—a slow, risky process prone to airframe damage. The E-Drill system redefines this by cleverly deploying directed energy through handheld electro-discharge machining (EDM). Instead of physical force, it uses precise electrical spark erosion to dissolve fastener heads in seconds, avoiding metal shavings and

heat. The aviation world must take note: this contactless, high-tech method protects critical structures and slashes removal times by up to 20x.

Defense Unicorns In cybersecurity, Defense Unicorns enables the secure operation of commercial-off-the-shelf software in air-gapped systems. Their big innovation is Zarf, an open-source tool that packages applications and dependencies into one, internet-free payload. This speeds up military deployment in areas without network coverage. The company’s progress shows its approach works. It reached unicorn status after a $136 million Series B round led by Bain Capital and won a role in the Missile Defense Agency's $151 billion SHIELD contract.

University of Toronto In the realm of materials science, researchers from the University of Toronto and Caltech have used machine learning to engineer an ultra-strong carbon nanolattice that matches the strength of carbon steel while remaining as light as Styrofoam. By utilizing a multi-objective Bayesian optimization algorithm, the AI designed novel, smooth lattice structures that optimize stress distribution and eliminate stress-fracturing intersections. Fabricated via nano-3D printing, the material achieves a specific strength five times that of titanium, offering significant weight-saving and efficiency advantages for the aerospace and automotive industries.

Cubic Next, Cubic's Nuvotronics division is revolutionizing millimeter-wave architectures by delivering unmatched SWaP-C optimization for highly constrained defense platforms. High-frequency routing traditionally forces engineers to sacrifice valuable payload space to mitigate insertion loss and isolation penalties. Nuvotronics shatters this bottleneck with its proprietary PolyStrata microfabrication technology, enabling broadband performance from DC to over 100 GHz. Their micro-multiplexers and integrated switches use an air-dielectric, all-copper transmission line to deliver waveguide-like performance in a miniature surface-mount package. Standard switched filter banks and diplexers clear congested airwaves from 17.7-40 GHz, while custom configurations scale from 2 GHz to 60 GHz. By tightly integrating switches and filters, they eliminate parasitic losses seen in discrete layouts, providing a repeatable solution for electronic warfare, radar, and satellite communications.

I hope you found these innovations as intriguing as I did in my recent briefings, and just maybe one of them will help solve a problem you face.

Enjoy your Fourth of July!

COTS Journal | June 2026

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Inside Track Aitech Awarded $63M Contract for Avionics Computing Solutions to Power India's Light Combat Helicopter Program.

Hindustan Aeronautics Limited Selected Aitech for Trusted Avionics Computing Technology and Long‑Term Program Support Aitech announced a $63 million production contract with Hindustan Aeronautics Limited (HAL), India, to supply mission‑critical avionics computing solutions for India's Light Combat Helicopter (LCH) program. The follow-on contract supports avionics systems for 156 helicopters. It ensures long‑term production and sustainment of the Display Mission Computer (DMC) and related flight systems over the next five to six years.

It marks the continuation of a relationship that began in 2011 when HAL initiated development of a next‑generation avionics architecture, a high‑performance, rugged computing solution capable of supporting demanding real‑time avionics applications, advanced graphics, deterministic communications, and long operational lifetimes. Selected early in the program, Aitech designed and customized a CompactPCI‑based single-board computer and graphics solution specifically tailored for rotary‑wing display and mission processing. Rather than offering a drop‑in com-

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mercial product, Aitech worked closely with HAL engineers to modify and qualify a COTS-derived architecture, integrating dedicated PMC modules and avionics‑specific interfaces to meet the helicopter’s requirements.

As HAL developed its mission and flight software, Aitech provided hands‑on technical support, on‑site collaboration, and sustained manufacturing for flight testing and certification activities. The strength of the renewed contract lies not only in trusted technology, but in a partnership built over time.

HAL’s LCH avionics suite, including the Display Mission Computer and Automatic Flight Control Computer, represents one of India’s most advanced helicopter electronics programs to date. The systems rely on dual‑redundant SBC architectures, real‑time processing, and robust data handling to support mission visualization, flight control, and situational awareness in demanding operational environments.

HAL’s decision to work with Aitech centered around the following key factors: Proven Avionics Computing Expertise: The DMC architecture is built around high‑reliability computing, advanced graphics processing, and deterministic connectivity, including Ethernet, all core strengths within Aitech’s avionics portfolio.

Long‑Term Sustainment Commitment: Unlike many suppliers, Aitech demonstrated the ability to maintain the same quali-

COTS Journal | June 2026

fied board designs well beyond typical life cycles, avoiding disruptive mid-program technology migrations.

Incumbent Knowledge and Design Investment: The avionics computing boards are deeply “designed‑in” to the helicopter.

Replacing them would require a full redesign and requalification cycle measured in years.

Continuous Technical Support: From early characterization through certification and clearance, Aitech engineers worked directly with HAL on integration, performance, and qualification.

For over four decades, Aitech has engineered solutions and systems that solve complex problems for military applications across sea, land, air, and space domains.

This latest contract underscores Aitech’s ongoing support to meet HAL’s need for a long‑term avionics computing partner, delivering not only performance, but also continuity, a critical requirement for complex aerospace platforms.

“HAL selected Aitech because we provided innovative solutions from the beginning of the project and remained involved every step of the way to the present day," said Gil Botton, vice president and head of business development, Aitech SEA and EMEA. "We played a key role in HAL's first success by bringing technical knowledge, computing expertise, and manufacturing discipline to support the avionics systems for decades, not just years."

The

Inside Track Parsons and DroneShield Highlight Open-Architecture Approach to Countering Evolving Drone Threats DroneShield recently highlighted its participation in a recent C-UAS demonstration with Parsons Corporation, showcasing how interoperable technologies can help organizations detect, track, and respond to evolving drone threats.

The demonstration brought together advanced sensing, command-and-control, and counter-drone technologies within a common operational environment, highlighting how organizations can leverage bestof-breed capabilities to improve situational awareness and accelerate decision-making during complex security operations.

As part of the demonstration, DroneShield provided drone detection, electronic warfare, and mitigation capabilities within Parsons' DroneArmor™ command-and-control environment. The event highlighted how open architectures enable technologies from multiple providers to work together, giving operators greater flexibility to build solutions tailored to mission requirements.

Parsons is a leading disruptive technology provider in the national security and global infrastructure markets, with capabilities across cyber and electronic warfare, space and missile defense, transportation, water and environment, urban develop-

Vino Waves and ATEK MIDAS Announce ATEK America LLC ATEK MIDAS, a novel designer and supplier of high-performance mixed-signal silicon ASICs & RFICs and advanced GaAs & GaN MMICs and Vino Waves, is pleased to announce the formation of ATEK America LLC, a U.S.-based company dedicated to delivering enhanced sales, marketing, product development, and operational support for ATEK MIDAS customers across the Americas.

Built with a strong focus on customer service and responsiveness, ATEK America enhances ATEK MIDAS's ability to support

ment, and critical infrastructure protection.

The demonstration underscored the value of industry collaboration in addressing increasingly sophisticated airspace security challenges. The demonstration underscored the value of industry collaboration in addressing increasingly sophisticated airspace security challenges.

"Drone threats continue to evolve, and organizations need technologies that work together seamlessly," said Nate Webb, Director of Strategic Projects at DroneShield. "This demonstration highlighted the value of interoperability and open

architectures, allowing customers to combine bestof-breed capabilities into effective counter-drone solutions that can adapt as mission requirements change."

DroneShield's solutions are designed to integrate with a broad range of command-and-control systems, sensors, and mitigation technologies. This approach enables customers to build layered counter-drone ecosystems that meet operational requirements while maintaining flexibility as technologies and threats continue to evolve.

engineers, partners, and suppliers by enabling faster engagement, closer collaboration, and expanded local resources.

Vino Waves principals Norm Hildreth and Vinny Cannistraro now serve as Managing Partners of ATEK America, bringing deep industry expertise and a continued commitment to helping customers succeed. This transition has been carefully structured to be seamless, ensuring uninterrupted relationships and an even higher level of support for existing customers, manufacturer representatives, and suppliers.

Through its exclusive partnership with ATEK MIDAS, ATEK America is uniquely

positioned to provide hands-on support, technical guidance, and responsive service—helping customers move faster from concept to deployment.

COTS Journal | June 2026

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The

Inside Track Allen-Vanguard secures over $3 million worth of new contracts in Africa Allen-Vanguard, a global leader in Cyber Electromagnetic Activities (CEMA), has secured over $3 million in new contracts for its vehicle-based Electronic Countermeasure (ECM) system (3XXX) and its highly adaptable man-portable ECM system (SCORPION 2) to enhance the force protection and C-IED capabilities of two African nations.

Allen-Vanguard is an expert in delivering integrated, platform-agnostic RF electronic warfare, counter-RCIED, and counter-UAS solutions. It has over 25 years of operational experience in the design, development, and deployment of integrated, platform-agnostic systems tailored to counter evolving threats in high-risk environments. Its capabilities enable the detection, disruption, and protection of personnel across complex battlespaces, supporting defense, security, and public safety organizations worldwide. Allen-Vanguard combines proven technology with comprehensive training, threat-informed updates,

Microchip’s Nantes Facility in France Achieves QML Class Y Certification, Expanding High‑Reliability Capabilities Microchip Technology announces that its Nantes facility in France has expanded its Qualified Manufacturers List (QML) MIL‑PRF‑38535 certification scope to include QML Class Y, reinforcing the Compa-

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and through-life support to ensure sustained effectiveness and mission readiness in highrisk operational scenarios.

Due to the sensitivity and security risks associated with the customer's theatre of operations, it is not possible to disclose the purchasing nations or specify the deployment plans for this new capability. However, these initial orders represent a major force-protection capability uplift for the end user. It will deliver enhanced individual, vehicle, and vulnerable point protection to security forces operating in high-risk Radio Controlled Improvised Explosive Device (RC-IED) environments and, in addition, help mitigate the increasing threat posed by the use of Uncrewed Air Systems (UAS), such as drones, to conduct aggressive ISTAR activity or deliver lethal effects.

The contracts come with a full support package, including training for users, technicians, and mission-fill development. This support includes deploying Field Service Representatives to develop indigenous ECM capability and providing reachback to the Threat Management Team. This team of RF experts optimizes algorithms tailored to the

end user's needs to combat evolving threats in their region of operations. This comprehensive wraparound support maximizes the protection offered by ECM systems, both through physical capabilities and through the essential changes to tactics, techniques, and procedures necessary to keep operators safe.

Stuart Wilson, Director Business Development & Marketing at Allen-Vanguard, said: "We have a long history of providing force protection capability to African nations and associated peace-keeping forces, and we are extremely pleased to secure these new contracts to maintain and enhance this important relationship with the region.

Unfortunately, the significant threat to security forces in Africa from UXOs, IEDs, RC-IEDs, and other RF hazards remains high. It has only been exacerbated by the growing threat from UAS. Our systems are not only market-leading in terms of their technology and capability, but our support packages also ensure purchasing nations improve their wider ECM capability and remain updated with the latest algorithms and software to maintain their protection. For this reason, we are trusted and operationally proven with NATO countries and peace-keeping forces globally."

ny's commitment to delivering high‑reliability semiconductor solutions for aerospace and defense applications. The Nantes site expanded its certification scope from QML Classes V and Q to now include Class Y. Microchip's Nantes site has maintained QML certification to Classes Q and V since 1999, supporting the most demanding space and defense mission requirements. The addition of Class Y certification advances the facility's capabilities by enabling additional pack-

aging technologies, including non‑hermetic solutions, thereby enabling higher levels of integration and supporting the more advanced semiconductor architectures required by next‑generation military and space programs.

“We’re honored to be a leading supplier of semiconductors to the aerospace and defense industry and continue to deliver the quality and reliability our customers depend on for critical missions,” said Patrick Johnson, senior corporate vice president of Microchip’s Aerospace and Defense Group.

COTS Journal | June 2026

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Inside Track “Microchip’s products are in most military applications, and in space, we are virtually in everything that leaves Earth.”

With Class Y certification, the Nantes facility strengthens Microchip’s European manufacturing footprint for high‑reliability devices. The site also holds ESCC QML and AS9100:2018 certifications, positioning it among Microchip’s most highly qualified manufacturing locations for aerospace and defense solutions.

The Company's Nantes facility is equipped to support the qualification and testing of its PIC64 High-Performance Spaceflight Computing (PIC64‑HPSC), a series of radiation-hardened and radiation-tolerant 64-bit microprocessors (MPUs) for space exploration applications. This capability enhances Microchip's ability to meet evolving customer requirements for electrical testing, qualification, and long‑term mission assurance in harsh operating environments.

Microchip has worldwide qualification sites in the United States and Europe, each certi-

SPARC AI Expands Overwatch Targeting Capability with Image Recognition and Successful 43km Target Acquisition Test SPARC AI Inc., a defense technology company building Overwatch, the GPS-denied navigation and target-acquisition software platform for drones and autonomous systems, today announced the successful completion of a 43km long-range target-acquisition test conducted over open water in Port Phillip Bay, Victoria,

fied to specific military standards and classes aligned with their product focus. In the U.S., the Company's site in San Jose, Calif., is qualified to MIL-PRF-38535 Classes Q, V, and Y, for advanced digital and space applications, while its site in Garden Grove, Calif., supports Class Q for analog and mixed-signal devices.

The Company's Lawrence, Mass., facility pro-

vides capabilities under MIL-PRF-19500 and MIL-PRF-38534, Classes H and K, for discrete and hybrid microelectronics. In Europe, in addition to the Nantes site, Microchip's facility in Ennis, Ireland, is certified to MIL-PRF-19500 for its discrete manufacturing.

Australia. The target recording was done at a drone height of 115m above ground level.

The 43km span is comparable to, and in some measurements exceeds, the Strait of Hormuz's narrowest width, one of the world's most strategically significant maritime chokepoints. The comparison illustrates the scale of contested, GPS-denied maritime environments in which the capability is designed to operate.

SPARC AI is also pleased to announce it has integrated image recognition into the SPARC AI drone controller application, adding further capability to its targeting solution. Overwatch brings together targets recorded by multiple

drones from different manufacturers and locations onto a single operating map, where operators can classify and track targets, collaborate, and plan missions in a single shared picture.

With image recognition now overlaid onto that picture, operators gain richer intelligence and can respond more rapidly across teams.

Capabilities of this kind have historically been locked inside expensive, proprietary drone platforms. By delivering them as software across any manufacturer's hardware, the Company believes Overwatch meaningfully expands its addressable market and positions the platform as a premium software layer rather than a single-aircraft feature.

Looking ahead, the next phase of Overwatch's development will introduce the ability to deploy multiple drones directly from the platform. The Company is developing teaming and swarm capabilities that it believes will be unique to Overwatch, enabling the simultaneous deployment and coordination of drones from different manufacturers, operating from different locations, in a GPS-denied environment.

SPARC AI intends to make these capabilities available to its partners in Dubai, Ukraine, and the United States with the next software update.

COTS Journal | June 2026

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Inside Track FLEETWERX Launches FLEET-X to Test How the Military Can Make, Move, and Use Critical Parts in the Field FLEETWERX, alongside the Naval Postgraduate School's Consortium for Advanced Manufacturing Research and Education (NPS CAMRE) and industry partners, will run FLEET-X, a live industry-focused operational check at Camp Roberts during the Joint Interagency Field Experimentation (JIFX) 26-3 to demonstrate how critical parts can be identified, manufactured, and delivered in real time.

The effort is part of preparation for RIMPAC 2026. Still, FLEET-X is designed to put greater focus on the companies, systems, and operational workflows that may help military units reduce downtime when critical equipment fails.

JIFX is the Naval Postgraduate School's field experimentation program, where military teams, engineers, and private companies test new technologies in realistic conditions to determine what works before they are used at scale.

During FLEET-X, teams will run the process from need to delivery. A part requirement is identified, digital files and system information are prepared, software tools help assign the request to the right manufacturing capability, partners produce the component using advanced manufacturing, and the finished part is delivered using unmanned systems across the test range.

The exercise is designed to test the connective tissue between capabilities that are often treated separately: manufacturing, AI-enabled decision support, data capture, tasking, delivery, and operational feedback.

"This is about production flexibility, speed, and effective system management," said Ethan Brown, FLEETWERX Program Manager. "When parts fail, they can take larger systems out of service. FLEET-X is

Unseenlabs’ BRO-22 to Become the First Foreign Private Satellite Launched Aboard Japan’s H3 Launch Vehicle Unseenlabs announces the upcoming launch of BRO-22, the first satellite from a foreign private company to fly aboard Japan’s H3 Launch Vehicle (H3 rocket). Scheduled

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designed to show how industry partners, software tools, and unmanned systems can help reduce part production lead times and move useful capability closer to the point of need."

FLEETWERX is coordinating the effort across military, academic, and industry partners, helping ensure the full process operates as a single system rather than a series of disconnected demonstrations.

The exercise will also test how unmanned systems can support delivery, especially in situations where traditional logistics may be slow, limited, or unavailable. Teams will plan and execute delivery missions, tracking how quickly parts can move from production to the point of need.

"Making a part is only part of the challenge," said Chris Curran, CAMRE Program Manager.

"FLEET-X gives us a practical way to understand how advanced manufacturing, AI-enabled workflow tools, and autonomous delivery systems perform together in field conditions, and what needs to improve before those capabilities are used at larger exercises and in real operations. Using these tools, we can produce quality parts that solve warfighter requirements rapidly until the traditional supply system can be utilized."

The effort also reflects a broader operational problem facing deployed units: keeping ships, aircraft, and other systems in fighting trim

during long missions when traditional supply lines may be stretched, delayed, or contested.

The work has clear relevance for extended deployments, Indo-Pacific logistics challenges, and recent operational lessons from efforts such as Operation Epic Fury, where faster repair and sustainment at the edge can matter as much as initial deployment speed.

One anticipated example is Re:3D’s work to print drone components for an operational unit, a practical use case that connects distributed manufacturing to current mission needs in environments such as CENTCOM. Other partners will help test how requests are captured, assigned, produced, and delivered so the military can better understand what is ready now and what still needs refinement.

The goal is to identify what works, what needs improvement, and what must be ready before larger exercises like RIMPAC. The effort will also help industry partners better understand how their technologies fit into real-world military workflows and timelines.

for June 10, between 09:53 and 11:52 a.m.

Japan Standard Time, the launch will take place from the Yoshinobu Launch Complex at Japan Aerospace Exploration Agency (JAXA)’s Tanegashima Space Center. Space BD will integrate the satellite. BRO-22 will strengthen Unseenlabs’ space-based RF detection constellation dedicated to maritime surveillance.

Building on the collaborative achieve-

ments of Unseenlabs and Space BD, including the April 2026 Memorandum of Understanding, this launch will further strengthen the partnership between the two companies.

Furthermore, marking the first of many to come, Unseenlabs anticipates that its constellation will also be carried by the H3 rocket in the future.

“This collaboration with Space BD and JAXA is important for Unseenlabs,” said Clément Galic,

COTS Journal | June 2026

The

Inside Track CEO and Co-Founder of Unseenlabs. “Japan is a strategic partner for France, and also for Unseenlabs. We are pleased to launch BRO-22 aboard Japan’s H3 rocket and to work with Space BD and JAXA on this mission. This launch is another step in the development of our constellation and supports our goal of providing reliable RF data for maritime surveillance worldwide.”

As Unseenlabs is already established in the Asia-Pacific region, with an office and

team in Singapore, this collaboration with Space BD and JAXA reflects Unseenlabs' commitment to the region and the Company's understanding of maritime surveillance challenges.

BRO-22 is a Gen 1 satellite in the Unseenlabs constellation. Like the rest of the constellation, it is based on the Company's exclusive monosatellite technology, meaning it is designed to operate independently from

the other satellites.

BRO-22 will be dedicated to maritime surveillance using radio frequency (RF) detection. It will detect RF signals emitted by vessels at sea, further enhancing Unseenlabs’ ability to detect, geolocate, and characterize ships, including those not visible through traditional monitoring systems such as AIS. RF data collected by Unseenlabs' satellites helps detect and monitor maritime activity, including undeclared, suspicious, and illegal operations such as: • IUU fishing, • Ocean dumping, • Operations near critical infrastructure.

Over the coming months, Unseenlabs will launch its first Gen 2 satellites, further enhancing RF signal detection capabilities and expanding the Company's RF applications across sea, land, and space.

The

Inside Track Look Up Selects Skynopy To Power Automated Collision Avoidance For Its Atlas² Space Safety Program Look Up, the French space surveillance and safety company, has selected Skynopy, a NewSpace company specializing in satellite ground-station services, to provide the ground-segment interface for its ATLAS² project. The partnership marks a significant step towards the world's first fully automated, end-to-end collision avoidance service for satellites in Low Earth Orbit. Under this contract, Skynopy will design, develop, and demonstrate the integration of its virtualized ground station network with Look Up's ATLAS² automated space safety platform, enabling real-time command-and-control of satellites in response to collision threats detected by Look Up's proprietary radar network.

Addressing the urgent challenge of orbital safety With over 15,000 active satellites in orbit today and hundreds of thousands of debris fragments circling the Earth at high speed, the risk of catastrophic collisions is growing at an unprecedented rate. Today, most space surveillance capabilities in Low Earth Orbit, where 90% of space traffic occurs, are provided by the United States. Look Up is developing a sovereign European alternative.

Look Up's ATLAS² program, co-funded by the European Innovation Council (EIC) Accelerator Challenge, brings together the Company's two core proprietary technologies to deliver the first comprehensive, fully integrated space safety

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service. SORASYS, Look Up's global network of seven high-precision radars deployed across EU sovereign territories, can detect debris as small as a few centimeters. Combined with SYNAPSE, Look Up's multi-source digital data-fusion and analytics platform, ATLAS² enables precise conjunction assessments, maneuver recommendations, and real-time threat detection at a scale and sovereignty level previously unavailable in Europe.

To transform detection into action, ATLAS² requires seamless, automated integration with a ground station provider capable of commanding satellites in near-real time. Skynopy has therefore been selected as one of our strategic partners.

A two-phase program to demonstrate end-toend reactivity The contract between Look Up and Skynopy is structured in two sequential phases designed to progressively de-risk the integration and validate the full chain, from collision detection to satellite maneuver.

In Phase 1, Skynopy will deliver the architecture and CONOPS (Concept of Operations) defining how its ground station network interfaces with ATLAS², as well as a high-fidelity RF signal simulator. The simulator will emulate in-orbit contacts between satellites and ground stations, model on-board radio behavior, and provide a test environment representative of real-life collision avoidance scenarios. This phase is planned to be completed in mid-2026.

Phase 2, subject to a gate review following Phase 1, will validate the integrated system through real-life in-orbit testing with an operational satellite, culminating in a full end-to-end demonstration of an automated collision avoidance maneuver: from Look Up's SORASYS ra-

SORASYS-1, the first space surveillance radar. Credit; Look Up

dar network, detecting a collision threat to Skynopy transmitting the telecommand activating the satellite's propulsion system.

Bringing together space surveillance and ground segment expertise This partnership combines Look Up's unique expertise in space domain awareness with Skynopy's next-generation, fully software-defined ground station infrastructure. Skynopy's network, now spanning 17 operational sites deployed in just 18 months, brings the speed, flexibility, and automation required by an operational space safety service.

Antonin Hirsch, CTO and co-founder of Skynopy, explains, "This collaboration with Look Up is a first of its kind: for the first time, a collision avoidance detection system will be directly and automatically connected to a ground station network capable of commanding a real satellite. Our goal is to demonstrate that end-to-end reactivity, from threat detection to maneuver execution, is not only possible but deployable at scale. This is a critical building block for the future of sustainable space operations."

Michel Friedling, CEO and co-founder of Look Up, adds, "With ATLAS², we aim to connect detection directly to action in orbit. Skynopy stood out for its speed of execution, technical depth, and ability to interface with complex systems, making its ground segment a key enabler in transforming our detection capabilities into an operational collision avoidance service. Together, we are building the infrastructure to make space safer for every operator."

A milestone for European space safety sovereignty The ATLAS² program reflects a broader European ambition to develop sovereign, end-to-end space safety capabilities. Look Up was founded in 2022 by General (Ret.) Michel Friedling, France's first Space Commander, and Juan-Carlos Dolado Perez, former Head of Space Surveillance at CNES, are two of Europe's foremost experts in space security. The Company has since raised over €64 million, including a €50 million Series A in 2025 backed by partners and investors including ETF Partners, Kfund, EIC Fund, MIG Capital, Karista, Expansion Ventures, CNES (Center National d'Études Spatiales), EU SST, Bpifrance, etc.

Skynopy's participation in this program further strengthens the European NewSpace ecosystem. It demonstrates the growing role of software-defined, agile ground segment solutions in supporting critical national and international space infrastructure.

The

Inside Track Echodyne and Moog Successfully Demonstrate Reconfigurable Integrated-weapon Platform (RIwP®) at U.S. Army Exercise Echodyne and Moog Inc. announce the results of testing of their defensive systems to counter small offensive UAS ("sUAS") weapons.

Capabilities Tested • Live detection, lock on with precision tracking, and successful engagement of Group 1-3 UAS threats in less than 3 seconds.

• Combined AI targeting, wireless fire control, and radar integration across mission equipment capabilities for defense against small UAS weapons.

• AI targeting for passive detection, autonomous targeting, track re-acquisition, and multi-object targeting.

One of today's critical Defense challenges is detecting, tracking, and mitigating small unmanned offensive platforms in all domains.

The speed and lethality of sUAS make them a constant and serious threat on the battlefield, requiring rapid system response to protect the warfighter.

The Operation Condor Rebirth demonstration exercise was conducted at Fort Hood, Texas in late March and the team included Moog (RIwP and AI targeting), Echodyne (EchoShield radar), and Picogrid (Legion data platform for connected mission systems). The goal was to deliver rapid integration of new systems into a secure Army network and validate against simulated threats in live-fire scenarios.

Moog’s modular weapons platform includes an edge computer, Echodyne’s EchoShield radar for precision tracking, and cables to enable integration with any existing U.S. Army turreted weapon station. The AI targeting system is an enhanced counter-UAS (C-UAS) detection and tracking capability designed for turreted weapons. Fusing precision airspace data with AI capabilities for rapid computation of firing solutions has been shown to immediately upgrade these existing kinetic weapon stations into effective C-UAS systems. The team demonstrated

detecting, locking on with solid precision tracking, and successfully engaging Group 1-3 UAS threats in less than 3 seconds.

EchoShield is the market-leading medium-range radar that consistently and reliably generates precise location data for all drone types and configurations. As a commercial-offthe-shelf (COTS) radar system, EchoShield’s industry-standard interfaces and rich data options create a baseline data set that accurately slews optical sensors, cues effector options, and accelerates reaction time. Boasting advanced classification capabilities powered by machine learning, EchoShield tracks all movement and pinpoints system and operator attention where and when it matters.

“Echodyne is proud to continue supporting Moog’s advanced C-UAS and Air Defense capabilities as a trusted partner and collaborator,” said Eben Frankenberg, Echodyne CEO. "By combining high-quality radar sensors and rapid integration of data, it is possible to deliver impressive C-UAS capabilities from existing battlefield systems, affordably and more quickly than using purpose-built systems."

AimLock and FN America Collaborate on Dune Solution to Update RWS for Counter-Small UAS AimLock announced it is collaborating with FN America, LLC, on the Dune solution to combat small unmanned aircraft systems (UAS). The Dune features AimLock’s autonomy suite for networked, layered counter-UAS (cUAS) integrated into FN America’s FN DEFNDER® MEDIUM remote weapons station (RWS).

The Dune solution will be mounted on a BC Customs SXVXL-6X6 ground vehicle to demonstrate its capabilities. The SXV 6x6 is a purpose-built, rugged UTV (Utility Terrain Vehicle) capable of carrying up to 4,500 pounds, with 46 square feet of deck space and the ability to be transported internally via CH-47 with roll-on/roll-off ease. Powered by a durable Cummins R2.8 turbo diesel and heavy-duty drivetrain components, it delivers high performance, including sub-12 second 0–60 mph, while excelling in rapid deployment, infiltration, and extraction operations without requiring additional shoring.

As small, hard-to-combat UAS continue to complicate battlefield operations, solutions like the Dune are critical for updating existing RWS and enabling faster, more precise shots even in the most complex engagement scenarios. Within the Dune solution, AimLock’s systems, powered by the Company's Keystone Core Targeting Module (CTM), will support FN America's FN DEFNDER® MEDIUM RWS in delivering precision auto-targeting across key mission sets in cUAS, Force Protection, Direct Action, Integrated Defense, Strike Anti-Armor, and Support by Fire.

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SPECIAL FEATURE

AEROSPACE-GRADE THIN FILM SUBSTRATES: THE FOUNDATION OF ELECTRONICS RELIABILITY

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COTS Journal | June 2026

By Jeff Elliott, Jeff Elliott is a Torrance, Calif.-based technical writer. He has researched and written about industrial technologies and issues for the past 20 years.

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n military and aerospace systems, thin-film patterned substrates serve as the foundation for some of the most critical electronic assemblies, including RF, microwave, millimeter-wave, and high-speed digital circuits.

These substrates are typically made by depositing extremely thin layers of conductive and dielectric materials on bases made from materials such as alumina, aluminum nitride, quartz, or certain high-performance titanates with dielectric constants up to 4000.

The goal: to create precise, stable electrical pathways that improve electrical performance and increase reliability even under extreme conditions such as rapid temperature fluctuations, high vibration, exposure to radiation, and long mission lifetimes where maintenance is impossible. An additional benefit is that thin-film circuits are often smaller and lighter than those of other technologies, which can be important for airborne and spaceborne systems.

This level of precision is essential for electronics embedded in low-earth orbit (LEO) satellites, drones, spaceborne communications, radar payloads, navigation systems, and signal-processing electronics, where even slight impedance or phase shifts can degrade link quality, reduce antenna beam accuracy, or impair payload measurements.

Thin Film Substrates Compared to thick-film or regular printed circuit boards, thin-film technology allows for extremely fine detail, often with lines and spaces just a few microns wide, helping ensure electrical performance is consistent from one part to the next.

With accurate conductor line widths and spacing, designers can control the characteristic impedance of transmis-

sion lines, RF trace coupling, and even thermal loads within RF circuits.

At high frequencies, even a small change in the width of a circuit trace can affect impedance or detune a filter, so this level of control is critical. It also allows more circuitry to fit into a smaller space while keeping unwanted electrical effects to a minimum.

dielectric constant, measuring conductor thickness with micron precision, and stress testing for vibration, shock, and thermal cycling.

High-purity gold, platinum, or other noble metals are often used for conductors to ensure low resistive loss, corrosion resistance, and consistent performance over decades. The dielectric layers are also applied with precise thickness control to achieve exact impedance targets and reduce parasitics, which is critical for multi-gigahertz wireless operation.

Space-qualified thin-film substrates are manufactured to far tighter tolerances and undergo extensive screening/ testing before integration. This includes thermal cycling, random vibration, and shock testing to ensure performance.

“Functionally, thin film substrates provide the stable, high-precision electrical platform on which critical aerospace and military electronics are built. They allow complex circuits to be integrated in ways that minimize signal loss, maintain phase coherence, and reduce noise—attributes that directly impact range, clarity, and security of communications, as well as the resolution and accuracy of sensing systems,” says Scott Horton of Johanson Technology. For more than 60 Years, Johanson Technology of Camarillo, Calif., has designed and manufactured passive components and substrates, including thin-film circuits, multi-layer ceramic capacitors, EMI filters, and other critical components for high-reliability applications.

Military and Aerospace-Grade Versions Compared to commercial RF substrates, those for military and aerospace are manufactured to tighter dimensional tolerances and undergo more extensive screening. This includes controlling the

Across all these military and aerospace applications, thin-film patterned substrates are designed. They can be screened to the highest-level reliability standards, such as MIL-PRF-38534 for hybrid microcircuits and MIL-STD-883 for environmental and mechanical stress testing.

“This combination of precision, thermal performance, and rugged construction makes them one of the few substrate technologies capable of meeting the performance and reliability expectations of modern defense and space electronics,” says Horton.

Substrate Selection Horton adds that selecting the correct substrate is key because it influences the mechanical and electrical functions of a design.

Johanson Technology offers several dielectric k values and different metallization schemes to meet customer needs.

The substrates can be metallized or nonmetallized. Metallized substrates can be patterned to customer specifications by

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chemical etching, abrasive etching, and patterned plating.

Single- or double-sided metallization is available, and each side can have unique design requirements and metallization for specific uses.

Adhesion layers such as titanium-tungsten or chromium help the metal adhere firmly to the ceramic, while gold, copper, or nickel provide good conductivity, solderability, and compatibility with wire bonding. The thickness of the gold layer is controlled to ensure wire bonds remain strong over time.

Attention should also be given to the coefficient of thermal expansion (CTE) and thermal conductivity parameters of the circuits involved. Spaceborne applications can experience large temperature swings from external sources (e.g., solar radiation), while higher-power systems can create higher operating temperatures. These higher temperatures must be mitigated during the design process.

Aluminum nitride, specifically, conducts heat extremely well, spreading it away from hot components and helping them last longer, while alumina offers strong mechanical stability and high-voltage tolerance. Special "filled vias" inside the substrate reduce thermal resistance and electrical inductance, helping with heat transfer and maintaining clean signal paths.

“In applications where heat conduction is critical, such as in the vacuum of space, designers must consider thermal conductivity of available substrates or use filled-vias as an alternative thermal path within a design,” says Horton.

Johanson Technology also has ad-

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vanced experience in incorporating vias into substrate designs with demanding requirements. Vias can be offered as either filled, through-hole, or plated-through. The process involves lasering through a substrate from the top to the bottom layer, then sputtering or plating over the substrate through the opening. Both options are effective for routing electrical signals from one side to the other.

“Plated-through vias are often recommended for low-power applications, while filled vias are ideal for high-power applications because they help transfer heat away from the substrate. Filled-vias also offer the lowest RF inductance,” says Horton.

Military and Aerospace Applications Across the defense and aerospace sectors, numerous applications stand to benefit from the exceptional reliability offered by thin-film substrate technologies.

In LEO satellites, thin-film substrates often form the foundation for transceiver modules, frequency converters, phased-array control circuits, and sensor readout electronics.

In LEO, substrates undergo repeated thermal cycling every 90 minutes as the spacecraft moves in and out of sunlight, experiences exposure to vacuum, and is bombarded by radiation. These factors can cause dimensional changes, shifts in dielectric properties, or microcracking in poorly matched materials.

Reliability is therefore critical because satellites cannot be repaired once in orbit, and any electrical drift can have serious consequences.

COTS Journal | June 2026

For drones, the ability to integrate

precision RF and high-speed digital components in a small footprint directly translates into more capable payloads without increasing size or mass, an essential factor in maximizing endurance and maneuverability.

In surveillance drones, thin-film substrates are used in microwave circuits for synthetic aperture radar or high-resolution imaging payloads. In strike drones, they might be part of encrypted communication modules or electronic countermeasure systems. Even in smaller tactical drones, they may be embedded in compact GPS receivers or advanced telemetry systems to ensure reliable navigation and data links.

Thin Film Substrates in Radar Systems: Military ground-based radar, shipborne radar, and airborne radar all rely on consistent RF performance, since small electrical variations can cause significant degradation in system performance.

In phased-array radar (T/R) modules, thin-film substrates enable long-range detection, high resolution, and resistance to jamming.

In active electronically scanned arrays (AESA), each transmit/receive module must handle high-frequency RF signals with precise phase and amplitude control. The fine-line tolerances of thinfilm patterned substrates ensure that microstrip or coplanar lines have predictable impedance and minimal loss, so beam steering and radar resolution remain consistent across hundreds or thousands of modules.

In satellite and space communications payloads, thin-film patterned substrates are critical because they combine

high-frequency capability with survivability in vacuum and radiation environments.

Aluminum nitride-based thin-film boards, for example, can efficiently dissipate heat from high-power amplifiers while maintaining structural stability through the extreme thermal cycles of orbit, ranging from −150 °C in shadow to +150 °C in sunlight.

Space-qualified versions of these substrates must comply with NASA's EEE-INST-002 or the European ECSSQ-ST-60 guidelines, which cover material selection, metallization thickness, adhesion strength, and environmental testing.

Avionics and flight control electronics also make heavy use of thin-film patterned substrates. Precision navigation systems, sensor processing units, and communications modules often operate in environments with constant vibration, rapid altitude changes, and wide temperature swings. The controlled thermal expansion of ceramics such as alumina and aluminum nitride reduces mechanical stress on the circuitry, helping prevent cracking or delamination over time. This is especially important for components mounted near engines or in other high-heat zones.

and amplitude accuracy, and resisting environmental drift, they ensure that a jammer can place energy exactly where it’s needed in the spectrum while keeping friendly systems free from self-interference. This combination of precision and durability is what enables EW platforms to operate effectively in the crowded, contested electromagnetic battlespace.

in mission-critical operations.

Functionally, thin-film substrates in radios and SATCOM systems enable compact, lightweight, and precisely tuned RF modules that maintain link quality, frequency stability, and filtering performance even under extreme environmental conditions.

In LEO satellites, drones, radar systems, and advanced communications equipment, these substrates provide the precision and long-term stability essential for RF, microwave, and highspeed digital circuits to perform reliably throughout the entire mission life.

By minimizing insertion loss, preserving phase accuracy, and allowing for complex multi-function integration in a small footprint, they ensure that communication links—whether between aircraft, ground forces, ships, or satellites—remain clear, secure, and reliable

For more information, contact Johanson Technology at (805) 389-1166, visit the website at https://www.johansontechnology.com/ppr/military-aerospace/, or e-mail kvilla@johansontechnology.com.

The company is located at 4001 Calle Tecate, Camarillo, CA 93012.

Because they support extremely fine conductor geometries with tight tolerances, thin-film substrates enable the high levels of miniaturization required for antenna feed networks, RF amplifiers, radar front ends, GPS modules, high-frequency filters, and phased-array control electronics.

The compact, high-frequency RF circuits used in radar seekers, infrared seekers, or GPS receivers benefit from the low loss and tight impedance control of thin-film technology, which ensures targeting accuracy even after prolonged storage and during the extreme acceleration of launch.

Thin film substrates also play a critical role in electronic warfare (EW) and jamming systems. A substrate that shifts in impedance or resonant frequency due to thermal expansion, mechanical stress, or moisture ingress could instantly reduce jamming effectiveness or allow an enemy radar to regain a track.

By minimizing loss, preserving phase

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SYSTEM DEVELOPMENT

Why the Other AI—Access Intelligence—is a Critical Security Layer for Defense Contractors 20

COTS Journal | June 2026

By Scott Meyer, was named CEO of Sign In App (https://signinapp.com/) in January 2026 after close to two years as the company’s COO. He has more than 25 years of experience in cloud-, AI-, and SaaS-based technology, including president and board roles at Xenial, Stratix Corporation, and Nextep Systems.

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visitor arrives at the defense contractor’s fa- expected, the person got the opposite, leaving them cility for a meeting and, after an ID check embittered toward the company. by front-desk security staff, is turned away under For defense contractors, scenarios like this are a company policy that prohibits entry based on the a reminder that intelligently managing access to visitor’s country of origin. physical spaces and digital infrastructure is a comThe would-be visitor is adamant: Their reason for plex, high-stakes undertaking, and that the visitor being there and credentials to enter the facility are experience must be both secure and welcoming. valid. The truth is, they’re a dual citizen, not a foreign national. They have the right credentials and a Do These Risks Ring True? good business reason to visit.

As broad an array of visitors as might enter a deThe problem, it turns out, is with the process it- fense contractor’s facilities on a given day, they all want one thing: access to physical facilities, IT inself, not with the security staff or the visitor. frastructure, intellectual property, or employees.

Had the process been supported by an intelligent Each party seeking access presents a unique risk prescreening system, it would have recognized this that your organization must manage based on their person as a dual citizen rather than a foreign nation- profile and the reason for their request. al. That system could have cross-checked with legal Because they handle highly sensitive information and compliance teams for second-level approvals, and intellectual property, and often have governthen alerted front desk personnel in advance to expect the person and clear them for entry, even sup- ment agencies as customers, defense contractors plying specific documentation to justify granting face a unique set of security and compliance risks. access. The outcome would have been much differ- Besides cyber threats targeting their IT infrastrucent. Instead of a productive visit that began with an ture and physical threats to their buildings and ocentry process that made the visitor feel welcome and cupants, they also have to account for hybrid threats

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that move between the physical and cyber domains.

A bad actor could gain unauthorized access to an organization’s network via the HVAC system in one of its buildings, then find a way to compromise the building's physical security and the safety of the people inside it.

Risk lurks in other places that an organization might overlook. Relying on siloed systems and teams, along with manual processes, creates vulnerabilities. An organization’s building security team might not think to alert their counterparts on the cybersecurity team when a visitor badge has been used to gain unauthorized entry into a facility’s server room, or similarly, the cybersecurity team might not alert building security staff of a cyber breach that could result in physical security systems being compromised. Without a single system to connect the teams, sharing critical information like this in a timely way to thwart threats is a roll of the dice when it could and should be a matter of course. Suspicious activity in one domain should automatically trigger alerts in the other domain.

tal infrastructure, and employees, why, and for how long. Here, "access" refers to physical and digital entry to an organization's spaces and assets. A high level of access intelligence enables an organization to fulfill its duty to protect its most valuable assets from bad actors while also providing rich, personalized experiences to visitors. Richer experiences and heightened security should never be mutually exclusive.

Access intelligence depends on a single, foundational element: a converged security and compliance environment that encompasses intelligent access controls, policies, procedures, risk workflows, and reporting. That environment replaces manual visitor logs, spreadsheets, and disparate security and compliance practices, protocols, and processes.

From this centralized environment, an organization can intelligently manage the mounting standards, requirements, and expectations they face regarding data privacy, physical access, cybersecurity, and GRC (governance, risk, and compliance) in general.

If any of these issues ring true for your organizaAccess intelligence flows from this single environtion, it’s probably time it took measures to increase ment or layer, manifesting in multiple ways across a its access intelligence—the “other AI.” defense contractor’s organization: • Prescreening. Advanced screening tools can scan government IDs and cross-reference them Access intelligence essentially entails having re- against internal databases, external denied-party al-time insights into exactly who is on-site, seeking lists, and watchlists, flagging potential issues long access to, or engaged with physical facilities, digi- before a scheduled visit.

Access Intelligence: What It Is and Why It Matters

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COTS Journal | June 2026

• Policies that scale and flex to specific locations, zones, and individual risk profiles. From that single environment, an organization can implement and enforce standardized compliance practices and processes across locations. They can also tailor policies to the specific needs of a location, such as additional protections or segregation for national security-sensitive intellectual property.

cess control, and the visitor journey, and extends to the recording, management, and reporting of data associated with each visitor and visit. All the information to support an audit resides in one place.

• GRC readiness. Organizations gain a single source of trusted information to confirm compliance with safety, legal, and industry regulations such as FedRAMP, CMMC, ITAR, SAM, FAR, DFARS, and TAA. Compliance becomes a continuous lifecycle that begins before a visitor’s arrival with prescreening and approvals, continues through check-in, ac-

ing cup of coffee or tea.

• Smooth emergency response and evacuation.

With access to live visitor lists, emergency notifications and communications, and real-time headcounts during an incident, a defense contractor • Eliminating loopholes and gaps. By connecting can execute emergency procedures rapidly and efthe physical and cyber domains into a single envi- ficiently. ronment, security and compliance teams gain a 360° • Visitors feel expected, not inspected. The more view of the digital and physical identities of people an organization knows about an incoming visitor, entering their buildings and/or accessing their dig- the better equipped they are to curate personalized ital infrastructure. journeys for them, from reserved parking to a waitIn a business where defense contractors are constantly evaluated on their security, compliance, and visitor experience, access intelligence is the difference between turning away a legitimate visitor and welcoming them with confidence.

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June 2026

COT’S PICKS Accelerating Technology: New GaN Chip for the Department of War Delivers on Performance in Record Time Northrop Grumman's leadership in the Microelectronics Commons program led to the production of a breakthrough GaN chip that sets the pace for defense and commercial markets.

Microscope photo of Northrop Grumman’s high-frequency GaN microwave chip. (Photo Credit: Northrop Grumman) Northrop Grumman has built a new Gallium Nitride (GaN) chip that sets a new performance standard for military and commercial applications. The chip fully leverages the W-band spectrum, a range of very high-frequency radio waves that enable microchips to send and receive more

Samtec Cable-to-Cable Interconnects Support High-Density AI Architectures Samtec, Inc., announces the release of the ARJ6 cable-to-cable high-density panel-mount cable assembly. Supporting PCI® 6.0/CXL® 3.2 and 100 GbE in AI architectures and FPGA prototyping, the ARJ6 cable assembly is part of Samtec’s popular AcceleRate® HP family with 112 Gbps PAM4 performance per channel.

Cable-to-Cable Samtec's ARJ6 cable assembly mounts into a panel bracket (ARJ6-PB). When paired with Samtec’s ARP6 Series, the ARJ6 cable assembly enables cable-to-cable connection at the front panel, mid-plane, or backplane, which eliminates the need to route signals through a PCB. The ARJ6to-ARP6 cable-to-cable connection also uses direct-attach technology, eliminating the transition PCB in the cable assembly housing and replacing it with high-densi-

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detailed information. Developed and market-ready in under six months, this breakthrough enables military radar systems to send secure data wirelessly and quickly via satellites, while also supporting the next generation of 5G/6G connectivity.

ty contacts that solder directly to the cable.

Removing unnecessary PCBs at both the panel and within the connector assembly itself streamlines the signal path and improves impedance control, overall signal integrity, and density.

Extreme Density and Performance In addition to eliminating unnecessary PCB transitions, the ARJ6 AcceleRate HP cable system balances density and performance with designated signal mapping and staggered row-to-row spacing, which reduces crosstalk. High-density differential pair configurations are available with 25 or 37 positions per row on 4 or 6 rows.

COTS Journal | June 2026

The chip acts like a tiny, superefficient “brain” that strengthens wireless signals— making them clearer and faster—providing the military with secure communications and letting everyday devices enjoy quicker, more reliable connections. Its compact and low-cost design replaces bulky, power-hungry gear and helps keep the country ahead in next-generation wireless technology.

Manufactured at Northrop Grumman’s semiconductor facility in California, this chip was developed quickly through a project with the Microelectronics Commons California DREAMS hub, where Northrop Grumman is a leading partner. This program is funded by the Office of the Under Secretary of War for Research and Engineering (OUSW(R&E)) as part of a unique industry-government-academia partnership designed to keep the nation at the forefront of microchip innovation and deliver breakthrough technology to the field faster.

ARJ6 uses Samtec’s 34 AWG, 92 Ohm Eye Speed® Thinax™ cable, which has approximately a 40% smaller cross-sectional area than an equivalent micro twinax cable. This makes it easier to route through a system while also maximizing air flow and reducing weight. Eye Speed cable is designed to manage intrapair skew by eliminating physical mismatches within a differential pair and controlling skew to very low, predictable levels, especially at 112 Gbps PAM4 speeds and beyond. Advanced co-extrusion techniques create best-in-class symmetry between conductors and shielding, resulting in a maximum skew of 3.5 ps/meter.

June 2026

COT’S PICKS AAEON Outlines Plans for Four Intel Core Series 3-Powered Platforms Following the release of the Intel Core Series 3 processors (formerly Wildcat Lake), AAEON has announced four upcoming platforms set to feature them.

Following the unveiling of the new Intel Core processors (Series 3) (formerly Wildcat Lake) in April, AAEON's UP brand (stock code: 6579) has announced its development timeline for four new platforms that will feature the processor line, with both developer boards and edge systems included.

Expected to enter mass production in late Q3 2026, the developer boards included in AAEON's roadmap are the UP WCL and UP Nexus WCL. The first of these is a credit card-sized board consistent with the original UP board's form factor, while the UP Nexus WCL represents a branding shift for the UP Squared Pro

form factor, measuring 101.6mm × 101.6mm.

Both boards will also offer fully embedded edge system versions, the UP WCL Edge and the UP Nexus WCL Edge, designed to appeal to customers requiring plug-and-play systems.

All four platforms will be available with the option of Intel Core 7 processor 350 and Intel Core 5 processor 320 CPUs from the Wildcat Lake family, while the UP WCL will also provide SKUs with the Intel Core 3 processor 304. Delivering up to 40 TOPS of AI performance via integrated GPU and NPU, but with a CPU prioritizing low-power E-cores, the Intel Core series' first integrated heterogeneous compute architecture sees AAEON position its upcoming products as suitable for building advanced applications across market segments, but with the benefit of a lower power footprint than platforms tailored to high-performance computing needs.

Both the UP WCL and the UP Nexus WCL offer notable improvements over previous generations. For the UP WCL, a substantial boost in available system memory from the previous-

Dreams Can Come True Your Favorite NI/Ettus SDRs Are Now MIL Rugged

Pixus can make your ruggedization aspirations come to life. This includes outdoor IP67 styles that are fanless, full MIL rugged, or versions with superior forced air cooling. Whether it’s an NI/ Ettus SDR or your customized SFF solution, Pixus has a solution for you.

X440 \ X420 \ X410 \ X310 \ N310 \ E320 \ B210 \ Custom • IP67 outdoor • MIL rugged • Semi-rugged superior air cooled • Rackmount, pole-mount, base-mount, or other • Extended temperatures pixustechnologies.com

ly capped 8GB is available, with standard UP WCL SKUs equipped with 24GB of onboard LPDDR5. Meanwhile, the UP Nexus WCL, which previously supported only up to 16GB of LPDDR5 in its UP Squared Pro line, now offers up to 48GB. The standard 64GB of eMMC storage typically listed on UP product specification sheets has also been upgraded, with both the UP WCL and UP Nexus WCL now coming with 256GB of UFS3.1.

Among the preliminary specifications for the UP WCL are a 10-pin wafer for I2C, PWM, and SPI, 8-bit GPIO, 2.5GbE LAN, and three USB 3.2 Gen 2 ports. Meanwhile, the UP Nexus WCL retains the conventional 40-pin GPIO offered by traditional UP boards, while adding two 10-pin headers for RS-232/422/485, two 2.5GbE LAN ports, and both dual USB Type-A (USB 3.2 Gen 2) and dual USB Type-C (USB 3.2 Gen 2x2) ports.

Regarding OS compatibility, all four offerings support both Windows 11 LTSC and Linux Ubuntu 24.04 LTS.

New Series of Horizontal Loading MIL Rugged Rackmount Enclosures By Pixus Pixus Technologies, a provider of embedded computing and chassis solutions, has announced a new MIL rugged 19" rackmount enclosure in a horizontal-loading configuration. The enclosures feature a front-to-rear airflow path.

The new Series of MIL rugged 19" rackmount enclosures come in multiple sizes and configuration options. This includes sizes in 2U, 4U, 5U, 6U, and various depths. The enclosures support Rear Transition Modules (RTMs) and offer deeper sizes for mounting other devices. The designs are typically for 3U, 6U, or a hybrid mix of Eurocard-sized modules.

Pixus offers these enclosure systems in OpenVPX / SOSA(R) aligned, VME, and customizable form factors. The chassis is designed to MIL–STD-810 for shock/vibration/environmental conditions and MIL-STD-461 for EMI, and related specifications. Various power and I/O options are available. Side-to-side cooling is also optional.

COTS Journal | June 2026

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June 2026

COT’S PICKS Molex Expands Award-Winning AirBorn SInergy Modular HighSpeed Hybrid Connectors with New High-Power Modules for All-in-One Connectivity Molex announces a significant expansion of its award-winning AirBorn SInergy Modular High-Speed Hybrid Connectors. The introduction of new heavy-duty, high-power contacts supports up to 25.0A of power delivery within a standard module bay, representing a 12.5x increase in power capacity to handle increased electrical loads while preserving critical space in compact system designs optimized for harsh environments where failure is not an option.

“The rapid evolution of next-generation aerospace and defense systems requires an exponential leap in power delivery,” said Billy Rhea, group product director, Aerospace and Defense Solutions, Molex.

“This latest extension of the proven AirBorn SInergy platform offers our customers accelerated design capabilities by enabling them to mix-and-match high-power, highspeed data and RF contacts for an all-in-one connectivity solution.”

Unmatched Configuration Flexibility and Versatility With the new AirBorn SInergy power modules, design engineers can more easily address the massive scaling needed to support power-hungry applications, including aircraft launch systems, advanced radar, avionics, satellites, and

New SOSA-Aligned 3U VPX SBC Features Intel Tiger Lake-H Xeon-W CPU & 100-Gigabit Ethernet.

Acromag’s newest VPX processor board follows the SOSA I/O-intensive profile to provide high-performance computing and a broad range of I/O interfaces for rugged embedded systems.

The new VPX7600 3U OpenVPX SBC is powered by Intel's 11th Generation Tiger Lake-H Xeon W-11000E processor and aligns with the SOSA I/O-intensive profile.

An XMC mezzanine site and a wide variety of

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combat vehicles. Combined with high-density signal contacts supporting up to 25 Gbps and RF contacts supporting up to 40 GHz, the AirBorn SInergy Modular High-Speed Hybrid Connectors are ideally suited for space-constrained, geometrically challenging designs.

Up to five interchangeable connector bays can be configured with different contact types, in any combination of signal, power, and RF modules to support specific application requirements.

Unlike other hybrid offerings with fixed layouts, SInergy provides true position-by-position configuration flexibility, enabling engineers to place the exact contact type precisely where it is needed. The platform's small form factor—one-bay connectors are roughly the size of a US quarter—and versatile mounting options optimize mechanical alignment and mating security.

Streamlined Integration and Supply Chain Efficiency Historically, design engineers tackling dense, challenging Printed Circuit Board (PCB) geometries had to source, layout, and qualify three or four disparate connectors from different vendors. In contrast, the AirBorn SInergy Modular High-Speed Hybrid Connectors replace single-function connectors with an integrated, customizable platform that reduces the bill of materials (BOM), supply chain complexity, and arduous qualification processes, accelerating time to market.

Building on a legacy of innovation established by the AirBorn M Series MIL-DTL-83513 Micro-D Connectors and AirBorn N Series MILDTL-32139 Nano-D Connectors, the SInergy

I/O peripherals offer great flexibility. Intel’s E810 Ethernet controller supports 100GbE on the data plane and 10GbE on the control plane.

An NVMe SSD provides up to 1TB of M.2 data storage. Backplane I/O includes 2.5 GbE, DisplayPort, USB 3.2, SATA III, RS232/RS422, and GPIO. Conduction-cooled and air-cooled with front I/O versions are available.

"This processor board packs a high-performance workstation-class CPU, 100GbE, and other high-speed I/O interfaces on a 3U VPX card to support defense, aerospace, and scientific applications," suggests Robert Greenfield, Acromag’s Director of Business Development.

COTS Journal | June 2026

portfolio is designed to withstand extreme temperature, vibration, shock, and moisture. The modules meet the MIL-DTL-83513 specifications for rugged, reliable performance. Additionally, the new power contacts have been engineered to the MIL-DTL-39029 contact crimp standard to support up to 25.0A, simplifying design and power delivery. Engineered for elevated thermal proficiency, the new SInergy 25.0A power module is rated at a strict 30°C temperature rise (T-Rise) baseline over ambient. Backed by de-rating test data, this performance supports highly specialized space applications where heat dissipation is severely constrained.

Addressing ever-increasing power needs was ranked first by more than half (52%) of the engineers surveyed for Molex's report on The State of Design Engineering in Aerospace and Defense. Additionally, the top four technology innovations prioritized by survey participants are power distribution and onboard power management, along with high-speed data transfer, electronic Defense, and advanced sensing and sensory processing.

The development of the high-power extension to the SInergy portfolio reflects a focused voiceof-the-customer approach, which involved collaborating with customers to determine exact specifications and preferences for modular solutions capable of supporting signal, power, or RF. The newly expanded AirBorn SInergy Modular High-Speed Hybrid Connectors represent the latest culmination of our partnership with global OEMs, prime contractors, and Tier 1/subsystem suppliers in the aerospace and defense industry.

June 2026

COT’S PICKS Power Integrations Unveils Space-Saving, Ultra-Slim Auxiliary PSU Reference Designs for NVIDIA Kyber 800 VDC AI Data Center Compact, low-profile designs use highly integrated, 1700 V-rated PowiGaN™ single-HEMT ICs to save space, simplify designs, improve reliability, and reduce the BOM count, achieving 88 percent efficiency.

Power Integrations introduced two new ultra-slim, compact auxiliary power supply reference designs for 800 VDC AI data centers. The single-output, 15 W design is only 30 mm by 30 mm with a 7 mm profile, while the isolated,

six-rail, 35 W design is only 80 mm by 60 mm with an 8 mm profile. Optimized specifically for the NVIDIA Kyber liquid-cooled blade-rack architecture, these ultra-compact solutions free up approximately 30 percent of space on densely packed main power distribution boards (PDBs), with an estimated 30 percent reduction in the BOM count—streamlining design and improving overall reliability. These designs are highly efficient with at least 88 percent efficiency across line and load.

“As the only company offering single-HEMT 1700 V GaN devices, Power Integrations can design these bestin-class, highly efficient flyback converters with a low BOM count while maintaining wide safety margins on an 800 V bus,” said Jason Yan, Senior Training Manager at Power Integrations. “The only alternative solutions are discrete, costly silicon carbide (SiC) devices,

which require 30 percent more components and space to operate."

The newly published design example reports describe 35 W and 15 W flyback auxiliary power supplies for high-voltage AI data center applications. These compact power supply units (PSUs) power internal components such as MCUs, gate drivers, and op-amps, which deliver critical "control and housekeeping" functions to ensure reliability, efficiency, and system safety.

Both designs are based on Power Integrations’ InnoMux™-2 ICs, featuring 1700 V PowiGaN gallium nitride (GaN) technology. The 1700 V-rated InnoMux-2 IC easily supports a 1000 VDC nominal input voltage in a flyback configuration and delivers a flat efficiency of 90 percent in discontinuous conduction mode (DCM) while maximizing power delivery.

DITHD Introduces MGP173LC Series: Rugged Mobile KVM Console Built for Demanding Environments Display Integration Technologies (DITHD) today announced the launch of the MGP173LC Series Rugged Mobile KVM Console, a new all-aluminum, high-brightness solution designed for mission-critical mobile and deployable applications.

Engineered as a brand-new mobile configuration leveraging decades of DITHD's proven KVM expertise, the MGP173LC delivers exceptional performance in harsh conditions. Originally developed for onboard military aircraft use, this versatile console is ideal for defense, aerospace, industrial, field operations, and other demanding environments where reliability, visibility, and durability are non-negotiable.

"The MGP173LC represents a significant evolution in our rugged console lineup," said Alton Baker, Product Marketing Manager at DITHD. "We took lessons from decades of building integration solutions and created a truly mobile, high-bright (1200 NITS) system that performs brilliantly in daylight and extreme conditions while offering flexible configuration options for our customers."

COTS Journal | June 2026

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June 2026

COT’S PICKS Socapex MIL-DTL-38999 Connectors for Battlefield Communications Inelco Hunter is pleased to confirm the availability of the Amphenol Socapex MILDTL-38999 Series. The range includes circular connectors and cordsets, fiber-optic connectors, PCB connectors, and Ethernet and USB solutions. MIL-DTL-38999 Series connectors are high-reliability circular connectors designed for harsh military applications, and are also suitable for demanding aerospace and industrial systems. They feature a 360° self-locking coupling, superior EMI shielding, and high corrosion resistance, and operate efficiently between -65°C and +200°C. The connectors have high-speed signal and power contacts for use in electronic systems and ground vehicles for battlefield communications, with high bandwidth and fast data transfer, capable of supporting multi-gigabit data rates. The range of connectors is extensive, supporting a

Defense Unicorns Launches UDS Fleet to Put Mission Operators in Command at the Tactical Edge

Defense Unicorns, the leader in airgap-native software delivery for national security missions, today announced the launch of UDS Fleet, a purpose-built product within the Unified Defense Stack (UDS) platform designed to solve one of Defense's most persistent challenges: deploying and managing software at scale across distributed systems operating on the front lines.

UDS Fleet is built for mission operators managing dispersed fleets of tactical systems in complex, contested environments. By replacing fragmented, manual processes with centralized fleet management, operators gain the clarity and control needed to maintain operational readiness at speed and

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multitude of specific military applications. As military equipment becomes more compact and lightweight, interconnect solutions must meet these requirements while still providing reliable performance in challenging environments – therefore, MIL-DTL-38999 connectors' rugged, compact design is ideally suited. Advanced encryption and security are also supported - vital in today's warfare systems.

MIL-DTL-38999 Series connectors are available in a wide range of shell materials and finishes, with 48-, 500-, 1000-, and 2000-hour salt-spray plating options. The shell materials include aluminum, stainless steel, and composite materials. The connectors feature high-density contact arrangements within a miniature circular shell, providing high coupling durability.

The high-density contact arrangement provides 100% scoop-proof pins to prevent damage and is designed to withstand extreme shock, exposure, and vibration.

The MIL connectors combine high reliability, moisture and corrosion resistance, and IP67 environmental protection, with some models offering IP68 protection. The connectors operate over an extreme temperature range of -65°C to +200°C and feature excellent EMI/RFI shielding (65dB min at 10 GHz) and high vibration/shock resistance. The self-locking connector system features a triple-start threaded coupling, and the copper alloy crimp socket contacts are gold-plated to ensure high reliability.

scale.

"The way defense software gets deployed and managed hasn't kept pace with the speed of modern missions. UDS Fleet changes that are at the edge. We're giving mission operators a clear, practical path to manage secure software across distributed systems, whether they're in a data center or operating in the most contested environments on the planet. This is about giving the people who defend this nation the tools they need to move fast and win," said Dr. Rob Slaughter, CEO, Defense Unicorns.

UDS Fleet is part of the broader Unified Defense Stack platform, which also includes UDS Enterprise — designed for platform engineers and cybersecurity teams managing cloud and on-premises data center environments. The two products are designed to work together, with UDS Fleet extending secure software delivery out to the edge as an organization's operational footprint grows. The new product centralizes and simplifies fleet-wide software management through two powerful capabilities: UDS Fleet Connect — A simple, intuitive interface that allows mission operators to connect to and manage software on individual systems. Available as an Android application and a browser-based desktop app, with iOS support planned for a future release.

UDS Fleet Command — A unified view for fleet-

wide observability and management, giving operators unified visibility and control across all systems in their environment.

"UDS Fleet reflects our commitment to delivering software that is secure by design, operationally resilient, and built for the realities of modern defense missions. We're replacing complexity with clarity, from the data center to the tactical edge," added Slaughter.

Defense Unicorns' customers include the US military's most critical branches, the Air Force, Navy, Army, and Space Force, with software deployed across more than 80 mission systems and organizations. The company holds a $300 million DOD-wide contract for software and GenAI solutions in classified and air-gapped environments, as well as a $15 million Space Force contract to modernize launch-range systems. Defense Unicorns also works alongside major defense primes and system integrators, including BAE Systems and SAIC, and is accessible to federal agencies, including DHS and CISA, through streamlined procurement vehicles.

"UDS Fleet was born out of a real mission need that was discovered through a value alignment with open source software. Here at Defense Unicorns, we are enabling soldiers, sailors, and pilots to deploy real mission software on complex distributed systems," said Eddie Zaneski, Field Chief Technology Officer at Defense Unicorns.

COTS Journal | June 2026

June 2026

COT’S PICKS Cambridge Pixel Is Announcing Its Innovative Vsd-C2 Display Software Cambridge Pixel's VSD-C2 application bridges the gap between commercial-offthe-shelf (COTS) and bespoke command & control (C2) display software and is targeted at sensor and effector developers as well as systems integrators covering security, surveillance, military C2, and counter-UAS systems.

VSD-C2 offers broad support for sensors, effectors, standards, and protocols. It integrates readily with existing system components, making it easier to adapt systems as threats and operational requirements evolve. The software provides a flexible operator interface, with highly configurable

screen layouts and workflows to support different missions, roles, and deployment environments.

VSD-C2 can be used by sensor and effector developers who need a proven display application to bundle with their products, or by system integrators looking for an operator display that works effectively across multiple components within a wider system.

Martin Hoather, managing director, Cambridge Pixel, said: “VSD-C2 addresses the critical challenge faced by many security and defense integrators today— how to deliver a highly customized command and control display solution that is both cost-effective and timely. We look forward to showcasing our capabilities at this international event.”

Cambridge Pixel’s field-proven technology is trusted by the US Navy, the British

Royal Navy, Saab, Lockheed Martin, L3 Harris, BAE Systems, QinetiQ, OSI Maritime, and many other companies operating across the defense, security, maritime, air traffic control, and unmanned surface vehicles (USV) markets.

Martin Hoather, managing director, Cambridge Pixel.

Capture and Identify RF Threats in Secure Environments MS2710xA and MS2720xA Series Remote Spectrum Monitors Frequency Range: 9 kHz to 9/14/20/26.5/32/43.5/54 GHz Designed for integration into spectrum monitoring and threat detection systems, perfect for SIGINT, TSCM, interference hunting, and drone detection applications.

Tested. Trusted. Supported.

IQ Signal Master™ MX280005A Capture and analyze IQ data with this comprehensive suite of post processing tools

Vision™ MX280001A

View spectrum traces from multiple monitors on a single PC using the Vision high-speed port scanner

www.anritsu.com

June 2026

COT’S PICKS Altera Introduces Next-Generation Agilex 9 Direct RF-Series SoC FPGA to Power the Future of High-Performance RF Systems Altera Corporation, the industry’s largest pure-play FPGA solutions provider, announced engineering sample availability of its next-generation wideband Agilex® 9 Direct RF-Series SoC FPGAs. Designed to meet the growing demands for performance, integration, and adaptability in aerospace, defense, and advanced communications systems, the latest addition to Altera’s Direct RF portfolio delivers a 40% increase in compute capability per square millimeter and 45% greater logic and DSP density compared to the previous generation.

As next-generation RF systems grow more complex, engineers face increasing pressure to process wider bandwidths, respond in real time, and deliver greater capabilities within tight size, weight, power, ad latency constraints. Altera’s

Qorvo® Advances X-Band Radar Performance with a More Efficient and Sensitive Compact Front-End Module Qorvo, a leading global provider of connectivity and power solutions, introduced an X-band radar front-end solution that enables defense system de-

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Agilex® 9 Direct RF-Series SoC FPGAs address these challenges by enabling developers to process and analyze RF signals closer to the edge while adapting to evolving mission requirements.

Agilex 9 Direct RF-Series SoC FPGAs deliver a tightly integrated architecture that combines high-speed data converters, programmable logic, and processing elements into a single package.

This enables developers building next-generation wideband RF systems to reduce complexity, manage power, and meet real-time performance demands where latency and responsiveness are critical. “Across aerospace, defense, and advanced communications, our customers are being asked to handle more data and operate within tighter constraints,” said John Sotir, General Manager of Altera's Aerospace, Defense, and Government business unit.

"With Our latest Agilex 9 Direct RF device, we’re helping them meet those challenges by bringing together high-performance compute, memory, and RF capabilities into a single, highly integrated platform.”

Building on Altera’s proven Direct RF portfo-

lio, the new Agilex® 9 device delivers 45% Greater logic and DSP density compared to the previous generation, along with support for next-generation DDR5 and LPDDR5 memory technologies.

With integrated RF, compute, and memory resources, the programmable solution eliminates the need for multi-chip designs while enabling more advanced beamforming for radar and data cube processing. The highly integrated RF platform supports high-bandwidth signal capture and generation, allowing customers to scale performance while maintaining the flexibility to evolve their designs over time. Ian Dunn, CTO at Spectrum Control, stated, "As RF systems become more complex and bandwidth demands continue to grow, integration and performance at the system level are critical. Altera’s newest Agilex 9 Direct RF-Series SoC FPGA enables us to simplify system architectures while delivering the high-performance signal processing our customers require. The combination of integrated RF, compute, and memory helps us accelerate development and bring more capable solutions to market faster.”

signers to achieve higher performance without increasing size, weight, or prime power. Designed for modern phased-array and multifunction sensors, the solution combines transmit power, efficiency, and receive sensitivity in a single compact module, addressing key challenges in next-generation radar design.

The Qorvo QPF5012 is a fully integrated X-band transmit/receive front-end module operating from 8.5 to 10.5 GHz, delivering 10W of transmit power. With 42 percent power-added efficiency and 2.1 dB noise figure in a 7 x 5 mm package, the QPF5012 enables designers to extend radar range, reduce thermal load, and improve detection sensitivity without increasing system complexity.

"Radar designers have historically been forced to trade off output power, prime power, or sensitivity," said Doug Bostrom, general manager of Qorvo's Defense and Aerospace business. "With the QPF5012, Qorvo brings all three together in a compact integrated frontend module, helping customers simplify design, reduce thermal

constraints, and improve real-world radar performance."

QPF5012 is specifically designed for X-band phased-array radar applications where size, weight, and power (SWaP), and thermal performance are critical. Its high level of integration reduces component count and simplifies system design while maintaining constant efficiency and RF output power across changing antenna loads. This enables AESA systems to deliver more consistent RF performance across varying scan angles. Qorvo enables this integration through vertically integrated RF design expertise, advanced multi-technology packaging, and trusted manufacturing capabilities.

COTS Journal | June 2026

Key Features of QPF5012: • 10W saturated transmit power across 8.5 to 10.5 GHz • 42% power-added efficiency to reduce prime power consumption and thermal load • 2.1 dB noise figure to improve receive sensitivity and detection accuracy • Integrated T/R functionality in a compact 7 x 5 mm module to reduce SWaP and design complexity By delivering power, efficiency, and sensitivity together in a single integrated module, Qorvo enables defense radar designers to overcome traditional design constraints and achieve higher system-level performance in a compact front-end architecture.

COTS

ADVERTISERS

Company

Page #

Website

Annapolis Micro Systems. . . . . .

4

. . . . . . . . . . . . .www.annapmicro.com

Anritsu. . . . . . . . . . . . . . . . . . . . . .

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. . . . . . . . . . . . . . . . . www.anritsu.com

Behlman Electronics. . . . . . . . . . IFC/BC . . . . . . . . . . . . . . . www.behlman.com

IBC

. . . . . . . .www.dolphinics.com/COTS

Highland Technology. . . . . . . . . .

13

. . . . . . www.highlandtechnology.com

nVent. . . . . . . . . . . . . . . . . . . . . . .

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. . . . . . . . . . . . . . . . . . .www.nvent.com

ODU. . . . . . . . . . . . . . . . . . . . . . . .

5

. . . . . . . . . . www.odu-aerospace.com

PICO Electronics, Inc. . . . . . . . .

4

. . . . . . . . . .www.picoelectronics.com

Pixus. . . . . . . . . . . . . . . . . . . . . . .

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. . . . . . . .www.pixustechnologies.com

Tekdense. . . . . . . . . . . . . . . . . . . .

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. . . . . . . . . . . . . . . . www.tekdense.com

Index

Dolphin. . . . . . . . . . . . . . . . . . . . .

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BEHLMAN LEADS THE PACK AGAIN! FIRST PROVEN VPX POWER SUPPLIES DEVELOPED IN ALIGNMENT WITH THE SOSA™ TECHNICAL STANDARD

Behlman introduces the first test-proven VPX power supplies developed in alignment with the SOSA Technical Standard. Like all Behlman VPXtra® power supplies, these 3U and 6U COTS DC-to-DC high-power dual output units feature Xtra-reliable design and Xtra-rugged construction to stand up to the rigors of all mission-critical airborne, shipboard, ground and mobile applications.

VPXtra® 1000CD5-IQI

VPXtra® 800D-IQI

> 6U power module developed in alignment with the SOSA Technical Standard > Delivers 1050W DC power via two outputs > VITA 46.11 IPMC for integration with system management

> 3U power module developed in alignment with the SOSA Technical Standard > Delivers 800W DC power via two outputs > VITA 46.11 IPMC for integration with system management

The Power Solutions Provider SOSA™ and logo design and The Open Group Certification Mark™ are trademarks of The Open Group in the United States and other countries.

: 631-435-0410

: sales@behlman.com

: www.behlman.com