Chemical Mechanical Polishing CMP Consumables Market
Chemical Mechanical Polishing CMP Consumables
Market Scope: Industry Analysis, Market Size,
Growth, Trends Till 2031
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Chemical Mechanical Polishing CMP Consumables
Market Size and Growth
The Chemical Mechanical Polishing (CMP) consumables market is experiencing growth driven by advancements in semiconductor manufacturing. The market size is estimated to reach approximately $2.5 billion by 2025, reflecting a compound annual growth rate (CAGR) of around 6%. Increased demand for efficient polishing techniques underscores the significance of this segment.
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Companies Covered
(Covid 19 Impact Covered)
◍ Cabot
◍ Anji Technology
◍ Dow Chemical
◍ Fujimi
◍ Hubei Dinglong Holdings
◍ DuPont
◍ Rodel
◍ ACE
◍ Versum
◍ Hitachi
◍ AGC
◍ Saint-Gobain
◍ Fujifilm
◍ FUJIBO
◍ Ferro (UWiZ Technology)
◍ TWI Incorporated
◍ JSR Corporation
The Chemical Mechanical Polishing (CMP) consumables market features companies like 3M, DuPont, and Fujimi, which supply slurries and pads for semiconductor fabrication. These firms innovate and enhance product efficiency, driving market growth. Select companies report substantial revenue: DuPont ($18.5 billion), 3M ($35 billion), and Fujimi ($600 million).
◍ WEC Group
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Market Segmentation
By Application
200mm Wafer
300mm Wafer
Others
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By Product
Polishing Liquid
Polishing Pad
Other
Chemical Mechanical Polishing (CMP)
Market Growth
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$ 3.80 Billion
