VITA Technologies Winter 2015 with Buyer’s Guide

p. 6 Editor’s Foreword Flying high in 2015

p. 10 Main Feature Business barometer: 2016Â trend predictions

WINTER 2015 | VOLUME 33 | NUMBER 4

@VitaTechnology

On the cover The Winter 2016 Buyer’s Guide issue of VITA Technologies highlights a 2016 forecast for the critical embedded systems market and features some of the industry’s top products, including those pictured on the cover: Mercury Systems LDS3506 3U OpenVPX Xeon/FPGA processor module, Meritec HERCULES HS-D High-Speed D-Sub Connector, Curtiss-Wright Defense Solutions 3U and 6U OpenVPX DSP engine module, and Annapolis Micro Systems WILDSTAR UltraK for OpenVPX 3U.

Business barometer: 2016 trend predictions »» p. 10

By Jerry Gipper, Editorial Director

DEPARTMENTS

6 Editor’s Foreword

Jerry Gipper

Flying high in 2015

8 VITA Standards Update

Jerry Gipper

VITA Standards Organization activity updates

22 Primetime Choices VNX: Extending VPX into small form factor systems »» p. 12

By Bill Ripley and Wayne McGee, Creative Electronic Systems

24 VITA Technologies Buyer's Guide Radar

Avionics

1. Publication Title

Commercial

Rugged

Communications

Surveillance

Imaging

Test & Measurement

Industrial

UAV

Statement of Ownership, Management, and Circulation (All Periodicals Publications Except Requester Publications)

VITA Technologies 4. Issue Frequency

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0

8

8

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4

3. Filing Date

1

3

5

5. Number of Issues Published Annually

Quarterly

4

7October 2015 $65.00

7. Complete Mailing Address of Known Office of Publication (Not printer) (Street, city, county, state, and ZIP+4 ®)

16626 E Avenue of the Fountains, Ste 201, Fountain Hills, AZ 85268

Telephone (Include area code)

480-967-5581

16626 E Avenue of the Fountains, Ste 201, Fountain Hills, AZ 85268 9. Full Names and Complete Mailing Addresses of Publisher, Editor, and Managing Editor (Do not leave blank) Publisher (Name and complete mailing address)

Patrick Hopper - 30233 Jefferson Ave, St. Clair Shores, MI 48082-1787 Editor (Name and complete mailing address)

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Full Name Complete Mailing Address

Benchmarking SBC functional density »» p. 16

By Jerry Gipper, Editorial Director

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Rosemary Kristoff

16626 E Avenue of the Fountains, Ste 201, Fountain Hills, AZ 85268

Rosemary Kristoff

16626 E Avenue of the Fountains, Ste 201, Fountain Hills, AZ 85268

Patrick Hopper

30233 Jefferson Ave, St. Clair Shores, MI 48082-1787

b. Paid Circulation (By Mail and Outside the Mail)

(2)

Mailed In-County Paid Subscriptions Stated on PS Form 3541 (Include paid distribution above nominal rate, advertiser’s proof copies, and exchange copies)

(3)

Paid Distribution Outside the Mails Including Sales Through Dealers and Carriers, Street Vendors, Counter Sales, and Other Paid Distribution Outside USPS®

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Free or Nominal Rate Distribution Outside the Mail (Carriers or other means)

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f. Total Distribution (Sum of 15c and 15e)

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Contact Person

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Wayne Kristoff

13. Publication Title

6. Annual Subscription Price

Fall 2015

16. Electronic Copy Circulation

Average No. Copies Each Issue During Preceding 12 Months

Average No. Copies No. Copies of Single Each Issue During Issue Published Preceding 12 Months Nearest to Filing Date a. Paid Electronic Copies

8500

0 0

c. Total Print Distribution (Line 15f) + Paid Electronic Copies (Line 16a)

0

0

d. Percent Paid (Both Print & Electronic Copies) (16b divided by 16c Í 100)

0

b. Total Paid Print Copies (Line 15c) + Paid Electronic Copies (Line 16a)

8497

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1263

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9823

No. Copies of Single Issue Published Nearest to Filing Date

0 0

9823

0

I certify that 50% of all my distributed copies (electronic and print) are paid above a nominal price.

17. Publication of Statement of Ownership If the publication is a general publication, publication of this statement is required. Will be printed

Publication not required.

Winter 2015 in the ________________________ issue of this publication.

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Owner/President

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09/30/2015

I certify that all information furnished on this form is true and complete. I understand that anyone who furnishes false or misleading information on this form or who omits material or information requested on the form may be subject to criminal sanctions (including fines and imprisonment) and/or civil sanctions (including civil penalties).

100%

97%

* If you are claiming electronic copies, go to line 16 on page 3. If you are not claiming electronic copies, skip to line 17 on page 3.

Complete Mailing Address

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All registered brands and trademarks within VITA Technologies magazine are the property of their respective owners. ™VPX and its logo is a registered product/trademark of VITA. © 2015 OpenSystems Media © 2015 VITA Technologies enviroink.indd 1

4 | VITA Technologies Buyer’s Guide Winter 2015

10/1/08 10:44:38 AM

www.vita-technologies.com

Advertiser Index

EDITORIAL DIRECTOR Jerry Gipper jgipper@opensystemsmedia.com

MANAGING EDITOR Jennifer Hesse jhesse@opensystemsmedia.com

GROUP EDITORIAL DIRECTOR John McHale jmchale@opensystemsmedia.com

E-CAST MANAGER Joy Gilmore jgilmore@opensystemsmedia.com

CREATIVE DIRECTOR Steph Sweet ssweet@opensystemsmedia.com

SENIOR WEB DEVELOPER Konrad Witte kwitte@opensystemsmedia.com

CONTRIBUTING DESIGNER Joann Toth jtoth@opensystemsmedia.com

SALES SALES MANAGER Tom Varcie tvarcie@opensystemsmedia.com (586) 415-6500

STRATEGIC ACCOUNT MANAGER Rebecca Barker rbarker@opensystemsmedia.com (281) 724-8021

STRATEGIC ACCOUNT MANAGER Eric Henry ehenry@opensystemsmedia.com (541) 760-5361

STRATEGIC ACCOUNT MANAGER Twyla Sulesky tsulesky@opensystemsmedia.com (408) 779-0005

STRATEGIC ACCOUNT MANAGER Kathleen Wackowski kwackowski@opensystemsmedia.com (978) 888-7367

SOUTHWEST REGIONAL SALES MANAGER Barbara Quinlan bquinlan@opensystemsmedia.com (480) 236-8818

17

Alphi Technology Corporation – Mission-critical I/O solutions

3

Annapolis Micro Systems, Inc. – WILDSTAR OpenVPX Ecosystem

2

Behlman Electronics – Higher 6U power

7

Creative Electronic Systems – COTS and safety certifiable

11

Elma Electronic – Reduce, save, improve

18

Embedded World – Embedded World Exhibition & Conference

15

Highland Technology, Inc. – Continuing our long term commitment to VME

13

Interface Concept – Build your own VPX system

2

Orbit Electronics Group and Orbit Power Group – Higher 6U power; higher 6U health monitoring performance

32

Pentek, Inc. – Got tough software radio design challenges

21

Vector Electronics & Technology, Inc. – VME/VXS/cPCI chassis, backplanes, & accessories

9

VEROTEC Electronics Packaging – Verotec integrated packaging

SOUTHERN CALIFORNIA REGIONAL SALES MANAGER Denis Seger dseger@opensystemsmedia.com (760) 518-5222 NORTHERN CALIFORNIA REGIONAL SALES MANAGER Sydele Starr sstarr@opensystemsmedia.com (978) 888-7367

ASIA-PACIFIC SALES ACCOUNT MANAGER Elvi Lee elvi@aceforum.com.tw EUROPE SALES ACCOUNT MANAGER James Rhoades-Brown james.rhoadesbrown@husonmedia.com

WWW.OPENSYSTEMSMEDIA.COM

PUBLISHER Patrick Hopper phopper@opensystemsmedia.com

PRESIDENT Rosemary Kristoff rkristoff@opensystemsmedia.com

EXECUTIVE VICE PRESIDENT John McHale jmchale@opensystemsmedia.com

EXECUTIVE VICE PRESIDENT Rich Nass rnass@opensystemsmedia.com

CHIEF TECHNICAL OFFICER Wayne Kristoff ASSISTANT MANAGING EDITOR Lisa Daigle ldaigle@opensystemsmedia.com SENIOR EDITOR Sally Cole scole@opensystemsmedia.com

ASSOCIATE EDITOR Mariana Iriarte miriarte@opensystemsmedia.com

PICMG EDITORIAL DIRECTOR Joe Pavlat jpavlat@opensystemsmedia.com EMBEDDED COMPUTING BRAND DIRECTOR Rich Nass rnass@opensystemsmedia.com

December 15 11:00 a.m. EST ecast.opensystemsmedia.com

MANAGING EDITOR Monique DeVoe mdevoe@opensystemsmedia.com ASSISTANT MANAGING EDITOR Brandon Lewis blewis@opensystemsmedia.com TECHNICAL CONTRIBUTOR Rory Dear rdear@opensystemsmedia.com CREATIVE SERVICES DIRECTOR David Diomede ddiomede@opensystemsmedia.com

CREATIVE PROJECTS Chris Rassiccia crassiccia@opensystemsmedia.com

FINANCIAL ASSISTANT Emily Verhoeks everhoeks@opensystemsmedia.com

Radar for the car – Active safety evolves

EMBEDDED COMPUTING EDITORIAL DIRECTOR Curt Schwaderer cschwaderer@opensystemsmedia.com

ECAST

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REPRINTS

WRIGHT’S MEDIA REPRINT COORDINATOR Wyndell Hamilton whamilton@wrightsmedia.com (281) 419-5725

www.vita-technologies.com

EVENTS Embedded Tech Trends January 18-19 Houston, Texas www.embeddedtechtrends.com

Embedded World February 23-25 Nuremberg, Germany www.embedded-world.de

VITA Technologies Buyer’s Guide Winter 2015 |

5

Editor’s Foreword

By Jerry Gipper, Editorial Director @VitaTechnology

jgipper@opensystemsmedia.com

Flying high in 2015 2015 was a whirlwind of travel for me, both personal and business, so much so that the newly unified American Airlines and I are best friends – platinum friends!

I have updated my “Business barometer” feature that goes into more detail on my predictions for technology related to our coverage.

My duties as executive director at VITA kept me especially busy. VITA picked up 17 new members as of November 1, with one of them being CERDEC as a sponsor member. As usual we did lose five or six members to mergers or change of business direction. Work on VPX, SpaceVPX, and FMC was the incentive for the majority of the new members to join VITA. Some of the new members are located around the globe, especially China and recently, South Africa, further reinforcing the global impact of VITA technology. We welcome them all.

The bimonthly VITA Standards Organ­ i­z ation (VSO) meetings were well attended all year. The VSO branched out to new locations this year to get closer to the members and users of VITA technology. More than 20 working groups are busy creating specifications that will become the standards for critical and intelligent embedded systems of the future. Following two of the VSO meetings, we held a VITA Technology workshop for the public. The focus of the workshop was primarily on VPX and FMC, but we also covered the VITA roadmap as part of the introduction. We extend a big thanks to Greg Rocco from MIT Lincoln Labs for his outstanding presentation and discussion on VPX. Look for future workshops in your area in 2016.

The VITA goals for 2016 will aim to expand our marketing activities and continue the fine tradition of the develop­-

ment of standards essential to the critical and intelligent embedded systems industry. Refinements to VPX continue as input from users with deployed systems come back to the suppliers. The FMC community is anxious to roll out FMC Plus in early 2016. With three small form factors due to end their trial use status, we expect efforts to move to the next phase.

VNX has already started the ball rolling.

Now it is more important than ever to become involved with setting the next generation of standards for critical embedded systems technologies. If you want to make a lasting impact on the technology key to the critical embedded computing industry, then find a way to participate in a technology standards working group. You will be surprised at how rewarding the work can be.

Embedded Tech Trends 2016, the business and technology forum for the em­bedded open architecture computer industry, is scheduled for January 18-19 in Houston. The theme for 2016 is “Houston – We have a Problem!” The focus and emphasis will be on highperformance computing problems and technology for the critical and intelligent embedded computing industry.

Visit the Embedded Tech Trends website (www.embeddedtechtrends.com) to learn more and see material from previous years, including videos of last year’s presentations.

The VITA Technologies Hall of Fame is entering its third year. It is now time to submit nominations for the class of 2016. This past summer we inducted

6 | VITA Technologies Buyer’s Guide Winter 2015

Kim Clohessy, Eike Waltz, Tom Hall, PCI Mezzanine Cards (PMCs), VME64, and 2eSST into the hall of fame.

We have developed a simple nomination and selection process that is loosely based on the NFL Hall of Fame process.

Any “fan” can nominate any qualified individual, team of individuals, company, product, or technology to the VITA Technologies Hall of Fame via the nomination form at the Hall of Fame website (http://opensystemsmedia.com/hallof-fame/vita-technologies). The only restriction is that the nominee (person or technology) must have had a significant impact on the critical and intelligent embedded computing industry.

Our 2016 editorial calendar for VITA Technologies has been published (http://opensystemsmedia.com/mediakits). Take a look at the key topics we plan to cover in 2016: FMC Plus hits high speed, Modular Open Radio Frequency Architecture (MORA) boot camp, OpenVPX – framework of systems, applications uncovered, and much more. Next year also marks the 35th anniversary of the introduction of VMEbus, so join us in celebrating this huge milestone.

As the shift to digital media continues, VITA Technologies will change to two print editions in 2016 with E-letters every other month. We will sift through the technology news, finding information that we think is important to you as you continue to build products that are based on VITA technologies. If you have specific topics you would like to read about, please contact me to discuss. I also extend an invitation for everyone to join in the conversation at the VITA Technologies LinkedIn group (www.linkedin.com/groups/2565867).

I look forward to a great 2016. www.vita-technologies.com

COTS and

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C

r XM esso c o r ble p rtifia e C y afet 7-S 5 5 8 CMFC

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VITA Standards Update

By Jerry Gipper jgipper@opensystemsmedia.com

VITA Standards Organization activity updates The September VITA Standards Organization (VSO) meeting was held in Portsmouth, New Hampshire. This update is based on the results of that meeting. Mercury Systems hosted a fabulous evening boat tour of the harbor. Fall was in the air, and the leaves were starting to turn into their wonderful autumn colors.

Contact VITA if you are interested in participating in any of these working groups. Visit the VITA website (www.vita.com) for details on upcoming VSO meetings.

ANSI accreditation Accredited as an American National Standards Institute (ANSI) developer and a submitter of Industry Trade Agreements to the IEC, the VSO provides its members with the ability to develop and promote open technology standards. The VSO meets every two months to address embedded bus and board industry standards issues.

VSO study and working group activities Standards within the VSO may be initiated through the formation of a study group and developed by a working group.

A study group requires the sponsorship of one VITA member, and a working group requires sponsorship of at least three VITA members.

Work in progress Several working groups have current project work underway; the following roundup summarizes those projects.

VITA 17.1: Front Panel Data Port (FPDP) Objective: This standard defines a multi-drop synchronous parallel non-addressable bus connection between multiple boards in a single chassis. Extension specifications define protocols for specific use cases.

Status: ANSI/VITA 17.1 has been approved by ANSI for reaccreditation and has been published by VITA. The VITA 17.3 working group, formed to incorporate the Interlaken protocol for packet transfers scaling from 10 Gbps to 100 Gbps, reviewed the first draft at this meeting.

ANSI/VITA 42.0: XMC Switched Mezzanine Card Base Specification Objective: This standard defines a PMC form factor with open standard switch fabric interconnects.

Status: The draft specification has been approved to move to the ANSI balloting phase, the invitation to ballot has been extended, and balloting scheduled in November.

8 | VITA Technologies Buyer’s Guide Winter 2015

ANSI/VITA 47: Environments, Design and Construction, Safety, and Quality for Plug-in Units Objective: Supplying vendors’ certification of COTS plug-in units to this standard will facilitate the cost-effective integration of these items in larger systems.

Status: ANSI/VITA 47-2005 (R2007) has been opened up for revision to improve interoperability, create less reliance on individual supplier ruggedization guidelines, and make sure environments are concurrent with new VPX updates. The working group is actively scheduling meetings and working on revisions.

Participation is encouraged.

VITA 48.4: VPX REDI: Mechanical Specification Using Liquid Flow Through (LFT) Applied to VPX Objective: This standard will establish the mechanical design requirements for an LFT cooled electronic VPX module.

Status: The working group is developing a vibration test plan, as well as designing a simplified prototype vibration test module and backplane fixture to further validate the concept of removing the two outer guide pins. A first draft version of the standard is out for review to establish the content structure with details filling in as the design solidifies. The goal is to have testing complete and a draft standard ready for review by the end of the year.

ANSI/VITA 49.x: VITA Radio Transport (VRT) Objective: The VRT standard defines a transport layer protocol designed to promote interoperability between radio frequency receivers and signal processing equipment in a wide range of applications. The VRT protocol provides a variety of formatting options allowing the transport layer to be optimized for each application. The ANSI/VITA 49.1 VITA Radio Link Layer (VRL) standard specifies an optional encapsulation protocol for VITA 49.0 (VRT) packets.

Status: ANSI/VITA 49.0-2015, ANSI/VITA 49.1-2015, and ANSI/ VITA 49A-2015 have been accredited by ANSI. Specifications are available for download by VITA members and are posted at the VITA Store for purchase by the general public. www.vita-technologies.com

VITA 57.4: FMC Objective: The goal of this project is to develop a next-­ generation specification calling for a new set of connectors to support higher-speed serial interfaces.

Status: The working group is reviewing pinout proposals and plans to finalize a specification for working group ballot by the end of this year.

ANSI/VITA 65: OpenVPX Architectural Framework for VPX Objective: The OpenVPX architectural framework specification is a living document that is continuously being updated with new profile information and corrections.

Status: The working group is reviewing clocking, keying, and nomenclature proposals for the next release.

VITA 66: Optical Interconnect on VPX – Half Width MT Objective: The VITA 66 base standard defines physical features of a stand-alone compliant blind mate optical interconnect for use in VPX systems. This standard defines a half width MT style contact variant.

Status: VITA 66.4 has completed the ANSI public review ballot.

The working group is reviewing comments.

VITA 67.3: VPX: Coaxial Interconnect, 6U, Four Position SMPM Configuration Objective: This specification details the configuration and interconnect within the structure of VITA 67.0, enabling a 6U VPX interface containing multi-position blind mate analog connectors with up to four SMPM contacts.

Status: The working group has posted a draft specification.

VITA 68: VPX: Compliance Channel Objective: This standard defines a VPX compliance channel including common backplane performance criteria required to support multiple fabric types across a range of defined baud rates. This allows backplane developers to design a backplane that supports required Bit Error Rates (BER) for multiple fabric types. This also allows module developers to design plug-in modules that are interoperable with other modules when used with a compliant backplane.

Status: The working group has approved moving the specification to “VITA Draft Standard for Trial Use” status. Specifications are available for download by VITA members and are posted at the VITA Store for purchase by the general public.

VITA 76: Ruggedized 10 Gbaud Bulkhead Connector for Cu and AOC Cables Objective: Describe the copper interface of a new generation of ruggedized circular connectors with a MIL-DTL-38999L series III shell.

Status: The working group approved taking this specification to ANSI accredited status. Interested parties are invited to join the working group.

VITA 78.1: SpaceVPX Lite Systems Objective: This document leverages the work done on ANSI/ VITA 78 to create a specification with an emphasis on 3U module implementations. The most significant change from SpaceVPX is to shift the distribution of utility signals from the SpaceUM to the System Controller to allow a radial distribution of supply power to up to eight payload modules.

Status: The working group has developed a draft document of the specification.

Copies of all specifications reaching ANSI recognition are available from the VITA website. For a more complete list of VITA specs and their status, go to www.vita.com/ Specifications.

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VITA 74: VNX Objective: VNX describes a rugged small form factor subsystem intended to be rugged for deployed environments.

Status: The working group is reconvening to complete the work necessary to take this specification to ANSI accredited status. Interested parties are invited to join the working group. www.vita-technologies.com

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Ph: 603.821.9921 • sales@verotec.us • www.verotec.us VITA Technologies Buyer’s Guide Winter 2015 |

9

MAIN FEATURE

Business barometer: 2016 trend predictions

By Jerry Gipper

It’s that time of year again to stick out my neck and make predictions for 2016. The pace of embedded technology for critical embedded systems moves quite slowly, often taking years to advance very far. For this reason it takes a special breed of company to be patient and stay the course. Because the trends I discuss span over many years, providing an update might seem a bit repetitive, but some things have changed and new developments have emerged. I will try to point out some of those that I have observed this past year and forecast how these will play out in the industry in the year ahead.

Military programs are stable Last year I stated that programs are stabilizing. Today I think they are about as stable as they are going to get, given current economic and political conditions. However, as I write this, the Obama administration announced that a small number of U.S. special operations forces will be sent into Syria. The global economy is still very unstable and the political environment even more unstable. Unrest in the Middle East will not calm down in the foreseeable future, if ever. Defense programs will continue to spend heavily on autonomous weapon systems.

reelection process, so spending is unlikely to change. Several defense department initiatives, such as the U.S. Army’s Modular Open RF Architecture (MORA) initiative, have an open architecture slant that zero in on VPX as a preferred platform architecture.

Small form factor fever The small form factor (SFF) fever has subsided somewhat as real products are starting to be deployed. VNX (VITA 74), which is in “trial use” status, is moving ahead to full ANSI accreditation. An active working group has kicked off activities that will complete the process and throw in a few enhancements along the way. The other options, VITA 73 and VITA 75, have been quiet.

The real focus in 2015 was on 3U VPX, where we saw many new products and design wins. While 3U VPX is on the large end of the SFF size spectrum, the functionality and performance that can be achieved in this size is making it a great fit for larger platforms. The 3U trend will continue upward in 2016.

Optical interconnect products to emerge The unmanned aerial vehicle (UAV) market has expanded to the point where the Association for Unmanned Vehicle Systems International (AUVSI) renamed its premier conference for UAV and robotics technology industry to XPONENTIAL, marking the expansion into the commercial side of the market. Politicians will be focused on the

This glacier moved a bit with more new products introduced in 2015 based on VITA 66 specifications. Developments on backplanes went nowhere. Check out the “Copper versus optical: The battle begins” feature in the Fall issue of VITA Technologies for more information on the optical backplane front.

Proposals for smaller mezzanines for blade boards to appear in a working group The FMC working group was on the fence about its next generation as we closed out last year. Since then, the working group opted for backward compatibility and, with

10 | VITA Technologies Buyer’s Guide Winter 2015

www.vita-technologies.com

ADMIT THEM QUICKLY,

as the primary storage for critical systems. But what if a new memory technology was to come along that replaced flash and DRAM, was 1,000x faster, used much less power, was 1,000x more durable than flash, and had 10x the density of conventional memory? Intel and Micron announced in July their new 3D XPoint memory technology that is just such a product. This could be a huge game changer for the embedded markets, especially since it is projected to be priced at a cost between DRAM and flash. This could completely change the memory model used in embedded products.

AND GET ON WITH

Innovation is key

IMPROVING YOUR OTHER

To quote Steve Jobs, “Sometimes when you innovate, you make mistakes. It is best to admit them quickly, and get on with improving your other innovations.” And “Innovation distinguishes between a leader and a follower.”

"SOMETIMES WHEN YOU INNOVATE, YOU MAKE MISTAKES. IT IS BEST TO

INNOVATIONS." – Steve Jobs

As always, I suggest that innovation is key to survival.

the help of connector supplier Samtec, was able to put together a great solution that maintains compatibility. Now called FMC Plus, the working group is close to wrapping up the work on the specification.

Digital meets RF This year we heard from the U.S. Army’s Communications-Electronics Research, Development, and Engin­eer­ing Center (CERDEC) about its MORA initiative.

Since then, the applied research center has become a sponsor member of VITA to drive embedded industry support for the MORA architecture. The initiative is expected to drive the network-based connectivity of sensors and peripherals on ground vehicles and help speed the deployment of new command, control, communication, computers, intelligence, surveillance, reconnaissance/electronic warfare (C4ISR/EW) capabilities. Pair this with Mercury Systems’ OpenRFM specification, and you can see how the combination of digital and RF is going to be a hotbed.

Reduce, Save, Improve.

Elma’s Rugged Platforms Do All That - And More.

No one in embedded computing offers as many rugged products and services as Elma. Our packaging, thermal and I/O interface expertise, plus years of expert embedded subsystem designs gives our customers a serious advantage.

Tick or tock?

Intel announced the 6th Gen update to its desktop and mobile processor lines, but the embedded roadmap for these parts are not expected to be released until early 2016. The first quarter should be full of board-level product announcements using these new parts.

Consider us an extension of your team -- we fill in where you need us most, and we’re there every step of the way.

Find out why Elma is truly Your Solution Partner.

Game-changing performance to memory and storage solutions In 2014 I talked about solid-state drives (SSDs) overtaking hard disk drives (HDDs) www.vita-technologies.com

OSM JulyStorageSFF2015 Ad.indd 1

10:42:13 AM | 11 VITA Technologies Buyer’s Guide 3/25/2015 Winter 2015

SPECIAL FEATURE

VNX: Extending VPX into small form factor systems

By Bill Ripley and Wayne McGee

The VNX VITA 74 specification is substantially derived from the VPX and OpenVPX standards and adapts the technology to a smaller form factor. System designers looking to utilize the specification can gain from examining the evolution of VNX as well as observing the various size, weight, and power (SWaP) comparisons between VPX and VNX.

Evolution VNX, also known as VITA 74, is defined in a specification managed by the VITA Standards Organization. VNX is now in its third and final year of “trial use” status and is on its way to becoming a fully ANSI accredited document.

The goal for the VNX specification is to take the concepts that have made VPX successful and apply them to a similarly architected small form factor platform, as well as to use other successful standards for connectors, connectivity, and form factors to specifically reduce development risk and time to market. The following discussion will compare and contrast VNX and VPX with respect to size, weight, power, and cost, also known as SWaP-C.

Size To date, the VITA 74 specification has seen no issues that would cause changes to be made to the baseline document.

The biggest reason for this smooth sailing is that VNX is derived from other mature specifications. VPX (VITA 46) is the electrical parent of VNX. VITA 57, the FMC specification, provides the proven connector for the modules. Additionally, the 19 mm VNX module size and electronic design was chosen to optionally accommodate a PICMG COM Express Mini (Type 10) card.

To gain an idea of the size reduction for VNX in relation to VPX, Figure 1 shows the volume of various VNX and VPX modules. In the graph, the volume of a 19 mm module is normalized to represent 1.0 and contrasted against the other VNX and VPX module volumes. A 6U 1" pitch VPX card is nearly 8x larger than a 19 mm VNX module. The 3U VPX family is roughly 58 percent smaller than its 6U cousin, while the 19 mm VNX module is about 70 percent smaller than the 3U 1" pitch VPX module.

Weight System size and weight are dependent on a number of factors, including number of slots, power supplies, and applied cooling techniques. With wedge locks and conductive plates, 6U VPX conduction-cooled SBCs can weigh in at approximately 4 pounds, excluding the one or two XMC modules, which can be provisioned. A typical 7-slot 6U VPX 1 ATR mission computer can easily weigh in at 40-50 pounds. The same

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“IN SMALLER AIRFRAMES AND VEHICLES WHERE SIZE AND WEIGHT ARE IMPORTANT DECISION FACTORS, THE VNX SIZE AND UNDERLYING VPX TECHNOLOGY MAKE IT AN ATTRACTIVE SOLUTION FOR A GROWING NUMBER OF APPLICATIONS.”

Relative Size of VNX vs.

Conduction-Cooled VPX

7.9 6.3

VPX 3.4

VNX

0.7

2.7

1

12.5 mm 19 mm 3U .8"

›

3U 1"

6U .8"

6U 1"

Figure 1 | Relative volumes of common conduction-cooled modules

class of ruggedization for a 3U VPX SBC will weigh between 1.5 and 2 pounds. A conduction-cooled 5-slot 3U VPX ½ ATR Short system with payload modules will weigh between 18 and 25 pounds.

By contrast, a 19 mm VNX SBC weighs about 8 ounces, and a fully loaded VNX system with four 19 mm slots and one 12.5 mm slot comes in at less than 7 pounds. In smaller airframes and vehicles where size and weight are important decision factors, the VNX size and underlying VPX technology make it an attractive solution for a growing number of applications.

Power As with size and weight, power is highly dependent upon the number and types of cards in the system. For the purpose of this article, examples of SBCs, FPGAs, and graphics card power envelopes will be discussed.

The small form factor of VNX modules drives the standard to employ systemon-chip (SoC) processors whenever www.vita-technologies.com

practical, as the SoC device will typically be using less power than its multi-chip cousins. The 6U VPX maximum power per slot is rated at 115 W using a 5 V supply, and 348 W using a 12 V supply.

The 3U VPX maximum power per slot is rated at 115 W using a 5 V supply, and 276 W using a 12 V supply. While this is useful for certain compute-intensive applications, a 5-slot ATR chassis with a nearly 2 kW dissipation is beyond many platform power budgets and from a cooling perspective, is difficult to keep within the operating temperature range. Very few functions aboard an airframe or land vehicle require this kind of compute power.

The 12.5 mm VNX module is conservatively rated at 10 W, and the 19 mm module is currently rated for 20 W. In practice with improved mechanical design, proper operation has been verified at 15 W and 30 W, respectively, with no issues over the full extended temperature range. This results in a 5-slot VNX system, with four 19 mm slots and one 12.5 mm slot, potentially dissipating 135 W, not including power supply losses. In many cases, reduced weight and power dissipation may permit longer missions.

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Cost Connectors and metalwork in the form of wedge locks, front panels, and custom heat frames and REDI-covers are a substantial cost driver in both 3U and 6U VPX modules. The VNX module defined in the base specification eliminates a substantial portion of the metalwork and does not use wedge locks.

The 12.5 mm module uses a single 200-pin connector, while the 19 mm module uses a single 400-pin connector.

Driving VNX module cost down, the

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VITA Technologies Buyer’s Guide Winter 2015 |

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SPECIAL FEATURE connectors are significantly less expensive than the MultiGig RT-2 connectors used with VPX, and there is a single connector, not multiple supplier-specific connectors. At the system level, since small form factor applications typically require less power, the resulting cost for power supplies is lower as well.

Signaling As VNX is a direct derivative of VPX, the signaling on the VPX backplane looks and feels like a VNX backplane. In VNX there are planes for utility, management and control, data, expansion, and a user space, with similar numbers of signals as 3U VPX (see Figure 2).

Optimized for SWaP While a few applications require massive compute capabilities, many system functions on air and ground vehicles do not require the large amounts of compute power and performance that a full-up VPX solution is capable of providing. In these applications, VNX allows the system architect the ability to

›

Figure 2 | VNX signal map

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14 | VITA Technologies Buyer’s Guide Winter 2015

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Commercially, today’s system providers can now offer lower competitive pricing for applications where there is not enough budget to afford the advanced capabilities provided by yesterday’s systems. Today’s requirements can often be met by deploying systems that utilize and apply modern VNX technology for applications that would have been neglected due to the customer’s small wallet.

›

Bill Ripley is the director of business development for Creative Electronic Systems North America. Bill has served in various consulting, business development, product management, sales and marketing roles in the embedded computing marketplace for more than 15 years with Creative Electronic Systems, Themis, GE Intelligent Platforms, and SBS Technologies.

He holds a BSEE from the University of Texas at Arlington.

Figure 3 | Creative Electronic Systems ROCK-2 3U VPX and ROCK-3 VNX mission computers

Wayne McGee is the VP of sales and general manager for Creative Electronic Systems North America. Wayne has served in various senior management positions in his career and has more than 30 years of experience in the VME, CompactPCI, AdvancedTCA, VPX, and VNX markets. Wayne is also the chairperson for the VNX VITA 74 Marketing Alliance. He holds a BSEE from the University of South Carolina.

seamlessly provide well-understood VPX technology that has been compressed to a fraction of the space, stripped of Highland excess weight, and Technology implemented using VITA Summer enough processing powerIssue to getinsert the job 04/01/15 done. Using VNX, it is much easier to find a location in a cramped vehicle to NOTE: KEYLINE DOES for NOT PRINT put a system that has been optimized SWaP. Figure 3 shows a 3U VPX system TRIM as shown alongside its VNX equivalent.

›

Creative Electronic Systems bill.ripley@ces-noam.com wayne.mcgee@ces-noam.com www.ces-swap.com

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VITA Technologies Buyer’s Guide Winter 2015 |

15

TECHNOLOGY FEATURE

Benchmarking SBC functional density

By Jerry Gipper Many companies tout the functional density of their single board computer (SBC) products, often stating that they have the highest functional density within a class of product. But what does this mean? How do you measure functional density? While performance can be measured with industry-accepted benchmarks, similar benchmarks for functional density do not exist.

SBC functional density is a topic that has long intrigued me since my days as SBC product manager at the Motorola Computer Group. Our SBCs were recognized as achieving some of the highest functional density in the industry. It is widely accepted that increased functional density reduces system board count, shrinks system size or physical volume, and simplifies assembly and cabling, leading to reduced overall system cost and improved reliability. The reasoning is straightforward; if you can reduce the component count by putting more functionality on fewer boards, the other metrics improve.

“Increasing functional density is extremely important, and drives many of the innovations we bring to market,” said Richard Kirk, director of Core Computing at GE Intelligent Platforms. “Not only are our customers looking to do more with less – more performance and more functionality in smaller spaces – but, as a manufacturer, it enables us to develop a single design that addresses the broadest possible range of applications and markets.”

board,” Kirk said. As size, weight, and power (SWaP) considerations are foremost in the thoughts of most target customers, increased functional density is playing a key role in enabling systems to be developed with compelling SWaP characteristics.

Functional density influences Several inflection points have led to breakthroughs in functional density. Microprocessors and memory follow a nice Moore’s Law curve. I/O and blade interconnections have benefited from great improvements in serial fabric connectivity. ASICs drove significant advances as discrete logic and key functionality could be put into a space-saving ASIC. Eventually processors with integrated serial fabrics and local buses picked up this functionality. FPGAs have changed the model, making it possible to add impressive performance and I/O capability.

Within the scope of VPX, an SBC is commonly defined as a complete functional computer, built on a single printed circuit board. Functionality includes a single or multiple microprocessors, memory, I/O subsystems, blade interconnection, and any mezzanines within a single-slot envelope. All they lack is a power source. For most VPX suppliers, it means putting as many features and functions as possible on the board. Welldesigned SBCs have the flexibility to be customized to meet customers’ specific requirements.

Microprocessors Distinguishing an SBC by processor has been a challenge for SBC designers over the years. Everyone uses the same processors from the same suppliers, primarily Intel and NXP (Freescale). For a time in the 1990s and 2000s, you could include secondary caches and select from a variety of I/O chipsets. But today, Intel processors have become dominant, and the Intel roadmap determines functionality and performance. Added to this are the increasing amounts of I/O, Ethernet, and serial fabrics that are being incorporated into the processor, such as PCI Express (PCIe), Ethernet, or Serial RapidIO. Kirk points out that the movement toward PCIe Gen3 and 10/40 GbE fabrics to feed multicore processors is an enabling factor.

“Increased functional density is a key contributor to what we see as the rapid growth in the popularity of the 3U format – especially in VPX – as functionality that once required the extended board real estate of 6U can now be included on a 3U

In a world driven by industry standards – whether those are VPX or PCIe or Intel processors – it’s a common misconception that all boards that use them must be broadly similar, Kirk said. “Nothing could be further from the case,” he said. “It’s a

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little like giving Michelangelo and Salvador Dali the same blank canvas, and expecting both to produce the same picture.”

Inflection point: The multicore processor is the greatest innovation that has affected functional density related to processors.

Previously, to increase functional density, SBC suppliers would put two or maybe four processors on the SBC, but power and space made this extremely difficult and impractical. Multicore made this easier while at the same time enabling everyone to do the same thing. The playing field remained level, but functional density took a big jump. The improvements will continue for some time as geometries shrink and the number of cores on a die increases.

Memory subsystems Memory subsystems are one way that suppliers can still differentiate. Capacities are roughly the same, yet creative designs have different ways of making the memory modular and increasing the amount of memory on an SBC. In years past, SBC designers used custom mezzanines that filled the rest of the slot or even went into a second or third slot. Memory technology changed so fast that designers were continually redesigning memory subsystems to use the most current and cost-effective memories. Many efforts were made to use single in-line memory module (SIMM), dual in-line memory module (DIMM), and similar packages to take advantage of consumer prices, but the durability of these modules made them an unpopular choice for many.

SBC designers have always struggled with memory life cycles and capacity. Modular memory makes it easier to evolve an SBC product line and maintain the long life cycle required for embedded applications.

During a recent visit to Mercury Systems, Darryl McKenney, VP of Global Engineering Services, took me on a tour of the company’s development labs. He pointed out some interesting packaging that the company is using for memory to achieve even greater densities than is possible with DIMMs and mezzanines, yet able to address the needs of rugged operating environments. Newer Mercury Systems’ designs use a slotted circuit board with no memory connector; instead, the board is the connector. This results in a much denser and rugged design that still maintains a suitable level of replaceable modularity.

Allied to direct memory attach technology are Mercury’s BGA approaches that enable the most contemporary and powerful Intel Xeon server-class devices to be taken from their native benign LGA data-room environments and deployed in harsh military applications.

“Collectively, efficient cooling and rugged high-density packaging of Xeon devices with vast memory arrays and FPGA lowlatency offload engines enables the highest functional density to be deployed right to the tactical edge,” McKenney said.

Inflection point: A major inflection point has not occurred in this sector for many years. Memory follows a classic Moore’s www.vita-technologies.com

VITA Technologies Buyer’s Guide Winter 2015 |

17

TECHNOLOGY FEATURE Law curve for performance and capacity. However, a new memory product is showing the potential to replace flash and DRAM, offering 1,000x faster speed and 1,000x greater durability, using much less power, and providing 10x the density of conventional memory. The new 3D XPoint technology developed by Intel and Micron could dramatically advance the state of memory in the embedded market, especially since it is expected to be priced at a cost between DRAM and flash.

I/O subsystems There are various kinds of I/O, and the mix changes relatively quickly. Connectors for I/O probably have the biggest influence because many types of I/O use large connectors. I/O subsystems offer the greatest potential for establishing a differentiated product to add value and gain a competitive advantage.

Specialized, customized, and secure I/O are but some of the many areas where suppliers can shine.

Functional density is important to establishing as many options as possible. Several suppliers bypass the connector issue by extending the physical connectors out through the VPX backplane or through serial or flex cables on the front, placing the burden of the physical connectors on the enclosure or other blades in the backplane.

Inflection point: The move to high-speed serial connections, primarily USB and Ethernet, has had the biggest impact. Gone

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are the large parallel printer port connectors and serial ports using DB-15 or DB-25 connectors. USB and Ethernet both have much smaller connectors and are continuing rapid advancements in performance, with smaller connectors making it possible to add even more functionality. They can also handle so many different I/O requirements that many specialized I/O devices now utilize Ethernet or USB. New types of I/O are continually being added, making the challenge of measuring the I/O subsystem aspect of functional density even more difficult.

Blade interconnection The change to serial switched fabrics has made it easier to add board-to-board interconnection capability to an SBC. They require fewer pins per lane as compared to a parallel bus and are easier to expand or multiplex through switches.

In its early days VMEbus required a complete chipset and up to 35 percent of a 6U board to implement. I/O capability out of the backplane connectors was severely limited, leaving the front panel as the only option. ASIC and FPGA technology reduced the space requirements, but the performance was still confined. Today, serial switched fabrics are built into the processor or processor chip set so no additional board space is needed for a basic implementation. PCIe, Serial RapidIO, and various speeds of Ethernet are commonly available with more and faster channels being added every few generations of processors.

05.10.15 11:16

www.vita-technologies.com

Inflection point: Serial switched fabrics have seen a lot of innovation through the past 15 years. Hardy Ethernet has been enhanced at the performance level to keep up with other options. PCIe is widely used and has continued to improve.

Serial RapidIO fills the gap, serving target applications well.

Mezzanine modules As board form factors continue to shrink and connectivity between modules becomes solely dependent on serial switched fabrics, the need for mezzanines to add functionality will diminish or even disappear within the next 10 years.

PCI mezzanine card (PMC) has been a workhorse for several years. Switched mezzanine card (XMC) leverages serial switched fabrics that enable XMC to keep up in bandwidth.

FPGA mezzanine card (FMC) illustrates how the role of a mezzanine might be shifting. FMCs are used to provide the physical I/O interface to an FPGA controller that is on the carrier board.

Mezzanines provide a way to add unique or custom I/O and allow board designers to fill the slot space in an attempt to get more board real estate to optimize functional density.

FPGAs FPGAs provide additional processing power and custom I/O in a very small package, as well as the ability to perform runtime configurations, thus changing the whole functional density model. FPGAs will continue to play an increasingly important role, perhaps even reaching the point where most of the SBC features will be provided through FPGA IP. Boards of the future will consist of basically the microprocessor, its support chipset (if needed), the memory subsystem, and an FPGA for the remaining functionality.

Inflection point: The impact of FPGAs has been more gradual over the years. As they have become denser, faster, and lower in cost, their usage has increased. Add to that the significant improvements in development tools, and you start to see why they are so popular.

The cooling challenge The most common challenge facing SBC designers is board thermal management. Performance leads to more power being required; functional density makes the cooling challenge even greater. Many creative cooling strategies have emerged, accelerated the past few years by the increasing use of powerhungry processors and chipsets.

“The thermal density of the CPU is a constant challenge, as we want to support a large feature set and, of course, have to target conduction-cooled applications that require up to +85 °C at the card edge,” Kirk said. “Here, we have some innovative cooling strategies and technologies that enable us to surmount these challenges.”

Mercury Systems has an agnostic approach to board layouts that makes the cooling challenge easier to address. McKenney said he was overwhelmed with all the board layouts when one day he was inspired to charge his design teams to come up with a better way. He showed me how Mercury Systems uses a www.vita-technologies.com

›

Figure 1 | Mercury Systems’ cooling technologies and stand-up memory modules

common layout for all cooling methods from air convection to liquid cooling, saving a great deal of effort. Because space must be reserved for various cooling techniques, keeping a high level of functional density is even more difficult. McKenney thinks it is a wise trade-off, but it demands that designers be even more creative in other aspects of board design.

As an example, Mercury Systems’ Xeon server-class server blades are available as air-cooled modules for lab development. The same solution can be packaged as Air Flow-By (AFB) or Liquid Flow-By (LFB) modules for deployment in rugged open system architecture subsystems (see Figure 1).

“Both cooling technologies reliably remove the elevated thermal energy such powerful devices release, with the former (AFB) being an efficient low-SWaP air management approach to cooling and the latter (LFB) a redundant air/liquid approach for high-altitude applications,” McKenney said.

GE Intelligent Platforms believes the trick is to constantly evaluate available technologies and drive features in an onboard FPGA – for example, an FPGA with an ARM core that can take on I/O and board management needs. Similarly, generalpurpose graphics processing unit (GPGPU) technology allows GE Intelligent Platforms to provide more floating-point performance per slot by leveraging the GPGPU’s inherent parallelism. Another way to gain “virtual” functional density is by supporting hypervisors to allow multiple functions to be performed on the same processor, with the ability to ring-fence them for performance and security reasons.

Beginnings of a benchmark model Measuring or benchmarking SBC functional density has evaded me since those days as product manager. One day, years ago, a longtime compatriot and VITA Technologies Hall of Famer Shlomo Pri-tal came to my office and said “Gipper – we have to come up with a way to measure the functional density of our products.” Together, we worked on a method to benchmark our products but never completed the task. It has haunted me ever since, so now I’m making another attempt.

VITA Technologies Buyer’s Guide Winter 2015 |

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TECHNOLOGY FEATURE

SBC Functional Density Processor 10 8 6 4

I/O

Memory

2 -

Mezzanine

Interconnect 2015

›

2010

2005

›

Figure 2 | 6U VPX functional density – linear scale

Figure 3 | 6U VPX functional density – Log10 scale

Devices

Measurement

Notes

Microprocessors

Cores x clock speed

Does not take into account specialized processors or processes in FPGA.

Memory

Capacity x bus clock speed

Data path width not accounted for. Does not consider other types of memory: flash, SRAM, etc.

Interconnect

Data lanes x bus clock speed

Only uses PCIe in the model. Should consider other protocols.

Mezzanines

Slots x data lanes x bus clock speed

Only modeled PMC and XMC. FMC should be considered.

I/O subsystems

Number of ports x transfer speed

Due to the large variety of options this is a very rough estimate. Does not consider graphics I/O.

›

Table 1 | Functional density metrics

When asked what others do to measure functional density, I did not get a clear and precise answer. Everyone is driven by the same effort to deliver more capability and functionality to their customers without compromising the ability to upgrade simply and cost-effectively to newer generations of SBC. I did hear that there are some “broad brush” measurements that can be applied, usually performance related, such as GFLOPS per slot, a metric that correlates processing performance with the space/volume of the system. System products are frequently measured for their aggregate interconnect bandwidth, but that doesn’t help measuring density as I was hoping to accomplish.

Developing a good benchmark for comparing functional density has been very elusive. While several basic measurements can be calculated, there are numerous difficult-to-measure features. With the introduction of FPGA functionality, it becomes even more complicated. Nonetheless, I made an attempt to create a model that lets me compare products to each other and to the past, maybe helping us project what we can expect in the future.

Table 1 highlights the first attempt at a simple model and the metrics used in the calculations. The model is flexible enough to quickly add more measures to the scores. The model is based on a 6U form factor, but the actual form factor is irrelevant unless comparing between form factors where you would have to apply an adjustment for the volume of space.

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From the calculator, it is possible to chart the data to obtain a graphical representation of functional density. I choose to use a Spider chart in lieu of a single score. A single score does not capture the impact of each of the major SBC subsystems.

The Spider chart creates a dedicated axis for each subsystem.

I generate a single score for each subsystem and then normalized it to 10 to fit within a single chart. Chart A (Figure 2) uses linear calculations. Chart B (Figure 3) shows the same results, but with a logarithmic Base 10 scale that better illustrates the enormous gains in functional density over the years. The biggest relative gains have been in I/O and interconnect functional density, driven by advances in serial fabrics.

Continued advancement Functional density is only going to improve because that is what electronics do. What is really going to be interesting to watch is the impact of FPGAs. There will be a day in the not-too-distant future where many of today’s types of SBCs will be replaced by an FPGA SBC where everything is IP in the FPGA. The only component coming off the board will be high-density connectors to branch out to the I/O and interconnects.

I hope my attempts at developing a functional density calculator have piqued your interest. Please feel free to contact me if you wish to learn more of the methods to my madness or to brainstorm ideas of your own. www.vita-technologies.com

PRIMETIME CHOICES

H.264 XMC video encoder card offers high-quality video at low bit rate Challenging surveillance/C4ISR applications depend heavily on video. The Tech Source Condor VC100xX H.264 XMC high-quality video capture and compression card consumes just 7 W of power yet still delivers high-profile H.264 stream quality video at a low bit rate to support rugged rear I/O surveillance applications using the VPX platform.

The Condor VC100xX is a rugged and fully conduction-cooled XMC form factor module featuring an H.264 video encoder with baseline, main, and high-profile support up to Level 4.1.

It supports up to four composite video inputs (NTSC/PAL/SECAM) or up to two SDI inputs (HD-SDI/SD-SDI), all of which are selectable through the provided API. The module also has two stereo or four mono audio inputs. Exceptionally high-quality video data is captured and stored in files and made available to applications for processing, analysis, or display on a local graphics card. The Condor VC100xX also supports video stream transfer via UDP or TCP/IP using RTP and RTSP protocols for remote display of captured data with low latency.

Tech Source • www.techsource.com • www.vita-technologies.com/p373116

Secure SATA SSD encrypts data for industrial and defense applications With the emergence of cyber security concerns, companies are rising to meet this challenge by providing innovative solutions that fulfill security demands for embedded applications in industrial and defense markets. Microsemi Corporation has introduced an ANSI/VITA 42.3-2014 compliant PCI Express interface XMC form factor SATA solidstate drive (SSD) for industrial and defense applications where ultimate security for data at rest is required. As part of Microsemi’s TRRUST-Stor self-encrypting drive technology offerings, the XMC offers powerful key management methods. In the most advanced method, no encryption key is stored in the SSD, leaving data forensically unrecoverable.

The MXMCM256/512 TRRUST Stor 256 GB and 512 GB XMC SSDs plug directly into the host card, eliminating the need for an external enclosure. The SSDs feature hardware-based AES256 encryption and have a layered security protocol allowing a hardware or software command to erase the encryption key in less than 30 milliseconds, as well as erase full flash storage media in less than 10 seconds with no trace of recoverable data.

Microsemi Corporation • www.microsemi.com • www.vita-technologies.com/p373117

I/O mezzanine module features in-mission dynamic FPGA reconfiguration Reconfiguring an FPGA’s logic during a mission without affecting the entirety of the system has traditionally been a difficult task that greatly affects the continued operation of an application. The hardware and firmware architecture of the Mercury Systems Ensemble IOM-300 series of fiber-optic I/O modules makes this reconfiguration possible, working with and insulating the underlying system software from any disruption. These modules offer unprecedented amounts of I/O processing power and configuration versatility – all within a low size, weight, and power (SWaP) open systems architecture XMC package that is both rugged and secure.

The Ensemble IOM-300 series feature two FPGAs for streaming sFPDP, Ethernet, and other wideband protocols. The primary Altera Stratix V FPGA, a highly customizable processing resource for low-latency signal processing, hosts Mercury’s next-generation Protocol Offload Engine Technology (POET), while the configuration FPGA enables in-mission, real-time FPGA image refreshes. Each of the module’s 12 channels can be programmed for data distribution, with or without user customization, via the primary FPGA device.

Mercury Systems, Inc. • www.mrcy.com • www.vita-technologies.com/p373119

22 | VITA Technologies Buyer’s Guide Winter 2015

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Rugged

HERCULES® HS-D High-Speed D-Sub Connector Meritec’s Hercules HS-D High-Speed D-Sub embedded in the rugged-rectangular MILDTL-24308 shell provides both durable and high-bandwidth-interconnect scheme suitable for Military, Aerospace and ruggedized commercial high-bandwidth applications not previously accommodated by industry-standard connectors. Your link to The Xtreme High-Speed Xperts.

ñ Rugged lightweight MIL-DTL-24308 Shells ñ Available as Plug-Cable Assemblies and Panel-Mount, Board-Mount Receptacles with SMT tails

ñ Available in Shell Sizes DE, DA, DB, DC and DD ñ Available in positions 19, 31, 51, 75, and 108 ñ Supports date rates in excess of 10 Gb/s and differential-pair signaling ñ ñ ñ ñ ñ

with low-skew pairs and shielding for EMI/RFI protection Available in IP-67 Rating Matched impedance design of 100 Ohm Cable types available in 26, 28, 30 AWG Jacket types available: LSZH, PVC, FEP and Halar Expando Custom-length-cable assemblies available

Sponsored by Mercury Systems

28

ADLINK Technology

28

Dawn VME Products

28

Dawn VME Products

29

www.meritec.com vita.opensystemsmedia.com/p373130

Mercury Systems

29

Commercial

Meritec

29

North Atlantic Industries

29

Meritec

TE Connectivity

29

TE Connectivity

30

Themis Computer

30

Surveillance Meritec

31

Test and Measurement 30

30

Meritec

31

UAV Sponsored by Annapolis Micro Systems, Inc.

31

Meritec

31

24 | VITA Technologies Buyer’s Guide Winter 2015

Meritec’s Hercules HS-D High-Speed D-Sub embedded in the rugged-rectangular MILDTL-24308 shell provides both durable and high-bandwidth-interconnect scheme suitable for Military, Aerospace and ruggedized commercial high-bandwidth applications not previously accommodated by industry-standard connectors. Your link to The Xtreme High-Speed Xperts.

ñ Rugged lightweight MIL-DTL-24308 Shells ñ Available as Plug-Cable Assemblies and Panel-Mount, Board-Mount Receptacles with SMT tails

Sponsored by AZ-COM Highland Technology

HERCULES® HS-D High-Speed D-Sub Connector

ñ Available in Shell Sizes DE, DA, DB, DC and DD ñ Available in positions 19, 31, 51, 75, and 108 ñ Supports date rates in excess of 10 Gb/s and differential-pair signaling ñ ñ ñ ñ ñ

with low-skew pairs and shielding for EMI/RFI protection Available in IP-67 Rating Matched impedance design of 100 Ohm Cable types available in 26, 28, 30 AWG Jacket types available: LSZH, PVC, FEP and Halar Expando Custom-length-cable assemblies available

www.meritec.com vita.opensystemsmedia.com/p373130

www.vita-technologies.com

Communications Communications

Meritec HERCULES® HS-D High-Speed D-Sub Connector Meritec’s Hercules HS-D High-Speed D-Sub embedded in the rugged-rectangular MILDTL-24308 shell provides both durable and high-bandwidth-interconnect scheme suitable for Military, Aerospace and ruggedized commercial high-bandwidth applications not previously accommodated by industry-standard connectors. Your link to The Xtreme High-Speed Xperts.

Sponsored By:

StratumSystems SS-XPM-01 GPS Time and Frequency Reference

ñ Rugged lightweight MIL-DTL-24308 Shells ñ Available as Plug-Cable Assemblies and Panel-Mount, Board-Mount Receptacles with SMT tails

ñ Available in Shell Sizes DE, DA, DB, DC and DD ñ Available in positions 19, 31, 51, 75, and 108 ñ Supports date rates in excess of 10 Gb/s and differential-pair signaling ñ ñ ñ ñ ñ

with low-skew pairs and shielding for EMI/RFI protection Available in IP-67 Rating Matched impedance design of 100 Ohm Cable types available in 26, 28, 30 AWG Jacket types available: LSZH, PVC, FEP and Halar Expando Custom-length-cable assemblies available

www.meritec.com vita.opensystemsmedia.com/p373130

Communications

V Rose Microsystems, Inc. VRM-uTCA-Grande

The VRM-uTCA-Grande is our newest member of the V Rose family of MicroTCA chassis that offers the performance benefit of MicroTCA in a space saving 1U height. With six AdvancedMC slots and a 400W internal power supply, the Grande offers the flexibility to configure the system for a wide range of applications such as enterprise, telecom, wireless, and more. The Grande comes equipped with six high-performance fans that offer cooling straight through the unit. Each slot features a unique card guide design that eases the insertion and removal of AMC cards as well as a replaceable backplane that makes servicing the system a breeze.

Phone: 518-762-1288 Email: sales@vrmcs.com www.vrosemicrosystems.com vita.opensystemsmedia.com/p373177

Imaging

Meritec HERCULES® HS-D High-Speed D-Sub Connector Meritec’s Hercules HS-D High-Speed D-Sub embedded in the rugged-rectangular MILDTL-24308 shell provides both durable and high-bandwidth-interconnect scheme suitable for Military, Aerospace and ruggedized commercial high-bandwidth applications not previously accommodated by industry-standard connectors. Your link to The Xtreme High-Speed Xperts.

ñ Rugged lightweight MIL-DTL-24308 Shells ñ Available as Plug-Cable Assemblies and Panel-Mount, Board-Mount Receptacles with SMT tails

ñ Available in Shell Sizes DE, DA, DB, DC and DD ñ Available in positions 19, 31, 51, 75, and 108 ñ Supports date rates in excess of 10 Gb/s and differential-pair signaling ñ ñ ñ ñ ñ

with low-skew pairs and shielding for EMI/RFI protection Available in IP-67 Rating Matched impedance design of 100 Ohm Cable types available in 26, 28, 30 AWG Jacket types available: LSZH, PVC, FEP and Halar Expando Custom-length-cable assemblies available

www.meritec.com vita.opensystemsmedia.com/p373130

www.vita-technologies.com

The SS-XPM-01 is a slave mezzanine XMC card that provides x1 lane PCI-Express interface with the host system. The card offers on-board oscillator options including OCXO and CSAC, which are synchronized to selectable references including GNSS receivers, IEEE-1588v2 PTP or IRIG time code and pulse (PPS) inputs. This card can also be used as an IEEE-1588v2 master clock when the high sensitivity 50 channel GPS receiver is used to synchronize the local oscillator. Other GNSS receiver options are available. Power for an active external GPS antenna is provided through the antenna connection.

Timing functions are derived from the on-board clock and include programmable periodic pulse rate output, programmable start/stop output and a time stamping input. The SS-XPM-01 also offers a programmable sine wave frequency reference up to 1000MHz. The SS-XPM-01 software includes Linux Drivers and APIs, which come with a powerful set of library functions. Please ask about other driver requirements.

An SS-PCE-01 half height PCIe version is in development. Stay tuned for more announcements.

Stratum Systems is a design and manufacturing company offering a range of advanced timing and synchronization products, test systems and FPGA IP cores for embedded applications. Stratum Systems also has design competency in sensor and software defined radio systems. Please contact us with your custom design requirements. www.stratum-systems.com vita.opensystemsmedia.com/p372805

VITA Technologies Buyer’s Guide Winter 2015 |

25

Industrial

Industrial

Acromag, Inc XVME-6510

Artesyn Embedded Technologies

Acromag’s new XVME-6510 is a 6U VME Intel® Quad Core i7 air cooled processor board with up to 16GB DDR3L ECC Ram. This rugged SBC was designed for 7 to 10 years of life expectancy with a FPGA based VME to PCIe bridge. Advanced features include a programmable CPU power for heat sensitive applications, BIOS selectable bite swapping and ruggedized SODIMM removable memory. The XVME-6510 offers expansion capabilities through two PMC/XMC sites on the board. Add an expansion I/O carrier or rear transition module to further customize your application.

The Artesyn MVME81xx series of high performance 6U VME/VXS SBCs feature Freescale QorIQ processors. MVME8100 and MVME8105 feature the P5020 processor and up to 4 or 8GB DDR3-1333MHz ECC memory; the MVME8110 features the P5010 processor and 4GB DDR3-1200MHz ECC memory. All modules feature 512K NVRAM, 8GB eMMC NAND Flash, multiple USB, Serial and Ethernet ports.

The MVME8100 also provides PCIe or SRIO connectivity through VXS interface as well as commercial and rugged variants for extreme environments with extended shock, vibration, temperatures and conduction cooling. All models are ideal for a range of high end industrial control applications such as SPE, photolithography and C41SR, including radar/sonar.

MVME81xx Series

bit.ly/1GYIpRL vita.opensystemsmedia.com/p373125

www.artesyn.com/computing/products/category/vmebus vita.opensystemsmedia.com/p373126

Industrial

Industrial

ADLINK Technology

Meritec

XMC-G745 Module with NVIDIA GeForce GT 745M GPU

HERCULES® HS-D High-Speed D-Sub Connector

The ADLINK XMC-G745M is a rugged XMC module equipped with the CUDA-enabled 384-core NVIDIA GeForce GT 745M GPU, utilizing the NVIDIA Kepler architecture and yielding unprecedented levels of graphics processing performance for defense and aerospace applications. ADLINK recognizes the trend towards implementing General Purpose computing on Graphics-Processing Units (GPGPU) for increased processing performance through parallel computing, with the XMC-G745M being targeted at a variety of high-performance computing applications – such as radar, sonar, and UAV – that can take advantage of this technology. The NVIDIA GeForce GT 745M features 2048MB of GDDR5 memory, ensuring high-capacity and high-bandwidth access to data during ‘massively parallel’ GPGPU algorithm processing.

Meritec’s Hercules HS-D High-Speed D-Sub embedded in the rugged-rectangular MILDTL-24308 shell provides both durable and high-bandwidth-interconnect scheme suitable for Military, Aerospace and ruggedized commercial high-bandwidth applications not previously accommodated by industry-standard connectors. Your link to The Xtreme High-Speed Xperts.

www.adlinktech.com/ vita.opensystemsmedia.com/p373127

www.meritec.com vita.opensystemsmedia.com/p373130

Industrial

Radar

Artesyn Embedded Technologies

Annapolis Micro Systems, Inc.

MVME250x Series The Artesyn MVME250x series provides a perfect migration path for older generation MVME boards. MVME2500 includes up to 2GB DDR3 memory and 512KB non-volatile MRAM. MVME2502 has 8GB soldered eMMC solid state memory for additional rugged, non-volatile storage. Connectivity includes Gigabit Ethernet, USB 2, serial ports, SATA port and either one (MVME2500) or two (MVME2502) PMC/XMC sites. A hard drive mounting kit is available for Serial ATA or solid state hard drives. Extended temperature, rugged variants and conformal coating are available. The MVME250x series is ideal for automation, medical, and military applications such as railway control, semiconductor processing, test and measurement, image processing, and radar/sonar. bit.ly/1P635tK vita.opensystemsmedia.com/p372927

26 | VITA Technologies Buyer’s Guide Winter 2015

ñ Rugged lightweight MIL-DTL-24308 Shells ñ Available as Plug-Cable Assemblies and Panel-Mount, Board-Mount Receptacles with SMT tails

ñ Available in Shell Sizes DE, DA, DB, DC and DD ñ Available in positions 19, 31, 51, 75, and 108 ñ Supports date rates in excess of 10 Gb/s and differential-pair signaling ñ ñ ñ ñ ñ

with low-skew pairs and shielding for EMI/RFI protection Available in IP-67 Rating Matched impedance design of 100 Ohm Cable types available in 26, 28, 30 AWG Jacket types available: LSZH, PVC, FEP and Halar Expando Custom-length-cable assemblies available

WILDSTAR A10 3PE for OpenVPX 6U WILDSTAR A10 3PE for OpenVPX 6U boards include three Altera Arria10 GX900, GX1150, GT1150 FPGAs with High Speed Serial connections performing up to 15 Gbps. There is also an on-board dual ARM Cortex-A9 Processor running up to 925 MHz, which can be used for local application requirements without using PCIe bandwidth.

Each card has two WILD FMC+ (WFMC+) next generation IO sites based on FMC/FMC+ specification. While accepting standard FMC and FMC+ cards it also allows larger form factor Annapolis WFMC+ cards for higher IO density. WFMC+ supports 32 HSS and 100 LVDS IO for higher density ADC and DAC solutions as well as stacking two IO cards per site. www.annapmicro.com/products/wildstar-a10-3pe-openvpx-6u/ vita.opensystemsmedia.com/p373164

www.vita-technologies.com

Radar Radar

Curtiss-Wright Defense Solutions

Sponsored By:

CHAMP-XD

The 3U CHAMP-XD1 and 6U CHAMP-XD2 modules enable designers of High Performance Embedded Computing (HPEC) systems to take full advantage of the unmatched performance of the leading-edge Intel® Xeon® Processor D-1500 Product Family architecture, bringing its unprecedented multi-core compute power to bear on advanced applications. The CHAMP-XDx module family is designed for the most demanding deployed HPEC systems to support applications such as next-generation Radar, EW and C4ISR applications, and SAR, cognitive EW and airborne cloud computing.

OpenVPX systems, chassis platforms, and backplanes

bit.ly/1MShyt7 vita.opensystemsmedia.com/p373131

Radar

Meritec

It’s Time to Get Back to the “Open” in OpenVPX

HERCULES HS-D High-Speed D-Sub Connector ®

Meritec’s Hercules HS-D High-Speed D-Sub embedded in the rugged-rectangular MILDTL-24308 shell provides both durable and high-bandwidth-interconnect scheme suitable for Military, Aerospace and ruggedized commercial high-bandwidth applications not previously accommodated by industry-standard connectors. Your link to The Xtreme High-Speed Xperts.

ñ Rugged lightweight MIL-DTL-24308 Shells ñ Available as Plug-Cable Assemblies and Panel-Mount, Board-Mount Receptacles with SMT tails

ñ Available in Shell Sizes DE, DA, DB, DC and DD ñ Available in positions 19, 31, 51, 75, and 108 ñ Supports date rates in excess of 10 Gb/s and differential-pair signaling ñ ñ ñ ñ ñ

with low-skew pairs and shielding for EMI/RFI protection Available in IP-67 Rating Matched impedance design of 100 Ohm Cable types available in 26, 28, 30 AWG Jacket types available: LSZH, PVC, FEP and Halar Expando Custom-length-cable assemblies available

www.meritec.com vita.opensystemsmedia.com/p373130

Radar

Pentek RTS 2715 10 Gigabit Ethernet Rackmount Recorder

The Talon® RTS 2715 is a complete turn-key recording system for storing one or two ten-gigabit Ethernet (10GbE) streams. It is ideal for capturing any type of streaming sources including live transfers from sensors or data from other computers and supports both TCP and UDP protocols. Using highly optimized disk storage technology, the system achieves aggregate recording rates up to 1.6 GB/ sec. Two rear panel SFP+ LC connectors for 850 nm multimode or single-mode fibre cables, or CX4 connectors for copper twinax cables accommodate all popular 10GbE interfaces. Optional GPS time and position stamping accurately identifies each record in the file header. www.pentek.com/go/vita2715 vita.opensystemsmedia.com/p373166

www.vita-technologies.com

Whether its RADAR signal processing, electronic warfare, signal intelligence, or other Mil/Aero platforms, versatility is critical for today’s OpenVPX systems. Due partly to early VPX interoperability concerns, many prime contractors have opted to get fully integrated systems designed by one vendor. Plus, there has been an emphasis on low SWaP SFF purpose-built systems that are at best “COTS-ish”. But choosing these routes diminishes the benefits of open-standards based COTS platforms. This includes more vendor/board options, less risk, faster development, less customization, long-term stability, hardware re-use, and more. By controlling each piece of the whole integrated system, many vendors are able to charge unusually high margins. VPX doesn’t have to break the bank. There is a better way.

Leveraging components, boards, and backplanes from key partners worldwide and internal development, Pixus utilizes our expertise to provide the best and most cost-effective solution for our customers.

Pixus has a full line of OpenVPX chassis platforms. Utilizing the Rittal™ brand of over 100K components, we provide virtually limitless rackmount configurations. We also offer conduction-cooled ATRs and a wide range of 3U and 6U backplanes, power boards, and more. The company has also announced enclosures with cavities in the rear of the chassis with mounting provisions for RF or other specialty devices. This includes versions in MicroTCA. By leveraging the best-of-the-best in embedded computing COTS products, Pixus’ team of experts can find the highest performance, most reliable, and cost-effective solution for your application.

Contact Pixus today to see how we can provide superior service and tailored solutions for you!

Pixus Technologies www.pixustechnologies.com CAN: 519-885-5775 West USA: 916-297-0020 East USA: 631-360-1257

www.pixustechnologies.com vita.opensystemsmedia.com/p373176

VITA Technologies Buyer’s Guide Winter 2015 |

27

Rugged Radar

Sponsored By:

Pentek Model 78761 4-Channel 200 MHz A/D with DDC, Virtex-7 FPGA - PCIe Board

LDS3506 3U OpenVPX Xeon and FPGA processor module

ñ ñ ñ ñ ñ ñ ñ ñ ñ ñ ñ ñ ñ

Complete radar and software radio interface solution Supports Xilinx Virtex-7 VXT FPGAs GateXpress supports dynamic FPGA reconfiguration across PCIe Four 200 MHz 16-bit A/Ds Four multiband DDCs (digital downconverters) Multiboard programmable beamformer 4 GB of DDR3 SDRAM Sample clock synchronization to an external system reference LVPECL clock/sync bus for multimodule synchronization PCI Express (Gen. 1, 2 & 3) interface up to x8 Optional LVDS connections to the Virtex-7 FPGA for custom I/O Supports GateXpress® FPGA-PCIe Configuration Manager Synchronize up to eight modules with Model 7893 System Synchronization and Distribution Amplifier - PCIe

www.pentek.com/go/vitabg78761 vita.opensystemsmedia.com/p373167

Mercury’s Ensemble LDS3506 are powerful Intel Xeon D series powered OpenVPX™ compute modules with unique FPGA support from a Xilinx’s Ultrascale™ device. This dense union of best available commercial-item server-class processing and low-latency FPGA resources produces a highly versatile, affordable and interoperable building block for embedded, high-performance computing applications with additional low-latency, refresh and mission capabilities. ®

®

®

3U Ensemble LDS3506 modules leverage Mercury’s fourth generation of rugged, highly SWaP and thermally efficient packaging technology to securely deliver the Intel Xeon processor for reliable deployment in scalable subsystems right to the tactical edge. The unique compute combination delivers a potent solution for multidimensional SWaP-constrained applications, particularly those that are sensitive to performance and latency, including electronic warfare (EW), electro-optical/ infrared (EO/IR), image intelligence (IMINT) and other mission or sensor processing applications.

Rugged

ADLINK Technology VPX3G10 Rugged 3U VPX GPGPU Blade

The ADLINK VPX3G10 is a 3U VPX General Purpose computing on Graphics Processing Unit (GPGPU) blade in single-slot (0.8") form factor featuring the CUDA-enabled 384-core NVIDIA GeForce GT 745M GPU and utilizing the NVIDIA Kepler architecture for high resolution and high performance graphics capabilities targeted at defense and aerospace applications, including radar, sonar, and UAV. The VPX3G10 features 2GB of GDDR5 memory, providing high-bandwidth access to data during "massively parallel" GPGPU algorithm processing. The VPX3G10 is rugged, conduction-cooled with conformal coating, making it ideal for mission critical applications such as military and aerospace platforms. www.adlinktech.com/ vita.opensystemsmedia.com/p373128

Rugged

The LDS3506 provides x4 Gen3 PCIe® connectivity across the data plane via Xilinx’s FPGA device, with multiple DMA-enabled non-transparent bridge (NTB) interfaces, giving users the versatility needed to construct powerful processing subsystems quickly. The module’s latest Xilinx FPGA hosts Mercury’s Protocol Offload Engine Technology (POET™) to give each module the ability to refresh its mission capability, provide information assurance abilities, or even refresh or upgrade its switch fabric itself without affecting any hardware.

Ensemble LDS3506 modules are an open systems architecture approach that are designed and made in America. LDS3506 modules support open data movement middleware, including Open MPI and Open MPI/OFED, VITA 46.11 system management, and standard optimized math libraries. www.mrcy.com vita.opensystemsmedia.com/p372704

28 | VITA Technologies Buyer’s Guide Winter 2015

Dawn VME Products Fabric Mapping Modules Dawn OpenVPX backplane Fabric Mapping Modules simplify topology customization Dawn VME Products FABRIC MAPPING MODULES automate optimization of OpenVPX backplane topologies. Newly patented FMM microoverlays quickly customize off-the-shelf OpenVPX backplanes to mission requirements. Fabric Mapping Modules allow designers to work with flexible configurations of high speed links. Off-theshelf backplanes can be quickly customized to mission requirements without the time and expense required for new backplane designs, a critical advantage when schedules are compressed by late system changes. Dawn engineers have successfully used Fabric Mapping Modules to solve many OpenVPX application problems in the design phase. Fabric Mapping Modules provide a natural migratory development environment for moving from the lab to the field with high speed OpenVPX backplanes. www.dawnvme.com/shop/accessories-vpx-accessories/fabric-mapping-modules vita.opensystemsmedia.com/p373171

www.vita-technologies.com

Rugged

Rugged

Dawn VME Products

Meritec

PSC-6236

HERCULES® HS-D High-Speed D-Sub Connector

Universal AC Input VITA 62 3U Power Supply Dawn VME Products PSC-6236 universal AC input VITA 62 compliant 3U power supply for air or conduction cooled OpenVPX systems. True 6 channel supply with up to 400 watts output. Mission critical wide temperature range at high power. Input 85 VAC to 264 VAC, 47 Hz to 400 Hz. Can be special ordered to support high current single channel applications. Embedded RuSH™ technology actively monitors voltage, current and temperature, and provides protective control. Ruggedized – VITA 47 compliant. Rugged, Reliable and Ready.

Meritec’s Hercules HS-D High-Speed D-Sub embedded in the rugged-rectangular MILDTL-24308 shell provides both durable and high-bandwidth-interconnect scheme suitable for Military, Aerospace and ruggedized commercial high-bandwidth applications not previously accommodated by industry-standard connectors. Your link to The Xtreme High-Speed Xperts.

ñ Rugged lightweight MIL-DTL-24308 Shells ñ Available as Plug-Cable Assemblies and Panel-Mount, Board-Mount Receptacles with SMT tails

ñ Available in Shell Sizes DE, DA, DB, DC and DD ñ Available in positions 19, 31, 51, 75, and 108 ñ Supports date rates in excess of 10 Gb/s and differential-pair signaling ñ ñ ñ ñ ñ

with low-skew pairs and shielding for EMI/RFI protection Available in IP-67 Rating Matched impedance design of 100 Ohm Cable types available in 26, 28, 30 AWG Jacket types available: LSZH, PVC, FEP and Halar Expando Custom-length-cable assemblies available

www.dawnvme.com/product-category/power-supplies vita.opensystemsmedia.com/p371658

www.meritec.com vita.opensystemsmedia.com/p373130

Rugged

Rugged

Dawn VME Products

North Atlantic Industries

PSC-6265

3U VPX DC/DC Power Supply (with +270Vdc input) - VPX57-31

VITA 62 compliant 6U power supply for conduction cooled systems.

Industry’s first DC/DC converter that accepts +270Vdc input

Dawn’s VITA 62 compliant 6U PSC-6265 can operate continuously in diverse environments over a wide range of temperatures at high power levels. The standard model is conduction to wedge lock cooled with an operating temperature range of -40C to +85C and a nonoperating range of -55C to +105C. The PSC-6265 operates continuously at a power level of 580 watts. For systems that require higher power levels, up to three supplies may be operated in parallel. Fault monitoring and control circuits protect the system from over-voltage, over-current, and over-temperature conditions.

The VPX57-31 power supply plugs directly into a standard 3U VPX chassis with a VITA 62 1.0” power supply slot. It is conduction cooled and accepts a +270 Vdc input voltage and provides six outputs up to 400 Watts. The VPX57-31 includes features such as Built-in-Test (BIT); user programmability; I²C communication; remote error sensing; current share and protection against transients, over-voltage, over-current, and short-circuits. This offthe-shelf solution for VITA 46.0 and VITA 65 systems is compatible with VPX specifications; supports all VITA standard I/O, signals, and features; and conforms to the VITA 62 mechanical and electrical requirements for modular power supplies.

www.dawnvme.com/product-category/power-supplies vita.opensystemsmedia.com/p372930

www.naii.com vita.opensystemsmedia.com/p373132

Rugged

Rugged

Mercury Systems

TE Connectivity

LDS3506 3U OpenVPX Xeon and FPGA processor module

MULTIGIG RT 2-R

Mercury’s Ensemble® LDS3506 are powerful Intel® Xeon® D series powered OpenVPX™ compute modules with unique FPGA support from a Xilinx’s Ultrascale™ device; providing x4 Gen3 PCIe® connectivity across the data plane with multiple DMA-enabled non-transparent bridge (NTB) interfaces. The module’s latest Xilinx FPGA hosts Mercury’s Protocol Offload Engine Technology (POET™) to give each module the ability to refresh its mission capability, provide information assurance abilities, or even refresh or upgrade its switch fabric itself without affecting any hardware. Designed and made in America. www.mrcy.com vita.opensystemsmedia.com/p372704

www.vita-technologies.com

Turn & Burn with TE’s New MULTIGIG RT 2-R Connector Quad-Redundant Contact System

TE Connectivity’s MULTIGIG RT 2-R connector quad-redundant contact system offers rugged survivability with high level shock and vibration beyond VITA 47. The new MULTIGIG RT 2-R connector is a lightweight, high-speed connector system with a “pinless” interface tested to 10,000 mating/unmating cycles and backward compatibility to VITA 46 connector systems. te.com/highspeed vita.opensystemsmedia.com/p372476

VITA Technologies Buyer’s Guide Winter 2015 |

29

T&M Sponsored By:

Rugged

TE Connectivity CeeLok FAS-X Connector

New CeeLok FAS-X Connectors

VPX 3U Monitoring Extender

TE Connectivity’s new CeeLok FAS-X connectors combine rugged reliability with signal integrity to support current high-speed protocols and new, faster protocols on the horizon. The new connector features fast field termination and repair; and meets military and aerospace markets’ 10 GB/s requirements and other high-speed protocols. te.com/highspeed vita.opensystemsmedia.com/p373129

Rugged

Themis Computer NANOSWITCH™ RUGGED 16 PORT GIGABIT ETHERNET SWITCH WITH EMBEDDED x86 PC

The VPX 3U Monitoring Extender from AZ-COM is designed to aid in development and testing of 3U VPX bus cards.

It has the following features: •

Monitoring and injection of all Utility Connector (P0) signals

•

Current sensing for all voltages

•

Ability to connect external source for all voltages

•

Chassis style mounting for precision injection and removal of the DUT

•

Standard VPX and Viper connector options for DUT and/or chassis

•

Conduction Cooled mounting for DUT and/or Extender itself

•

Keysight scope sockets for precision monitoring of Vs1, Vs2 and Vs3 voltages

•

A breadboard area space for customer modifications

For more information about this extender and other VPX products visit www.az-com.com or call 1-877-692-9266. www.az-com.com/vpx.html#E vita.opensystemsmedia.com/p373124

30 | VITA Technologies Buyer’s Guide Winter 2015

The Themis NanoSWITCH™ is a SWAP-C optimized rugged multi-layer gigabit Ethernet switch with an embedded x86 PC. The NanoSWITCH brings enterprise level layer 2/3 switching into demanding environments. Typical applications include: vehicle network switching, distributed architecture vehicle controller, VICTORY compliant switch, router, timing, and control, WAN – LAN interconnectivity and firewall, and shared processing and peripheral communications. NanoSWITCH provides 16x or 10x external Gigabit Ethernet ports that operate at rates of 10, 100, and 1000 Mbps, and includes a full management suite and CLI for controlling switch and routing operations. The NanoSWITCH supports sophisticated IPv4 and IPv6 routing, including tunneling and IP Multicast, VLANs, and IETF, IEEE, and DSL Forum standards.

Themis Computer 47200 Bayside Parkway, Fremont, CA 94538 www.themis.com/nanoswitch vita.opensystemsmedia.com/p369989

T&M

Highland Technology Model V410 16-channel VME RTD/resistance input module

The V410 is a 6U VME module that provides sixteen independent analog inputs that may be used to read RTDs, thermistors, and other similar resistive sensors from tens of ohms up to 3MΩ. It can also read cryogenic diodes. Users may set input range and adjust other settings at VMEbus speed, and depending on the range selected the microprocessor will do the necessary calculations and report voltage, resistance, or temperature. Temperature conversion is available for 100Ω and 1000Ω, series 385 and 392, platinum RTDs. www.highlandtechnology.com/DSS/V410DS.shtml vita.opensystemsmedia.com/p373178

www.vita-technologies.com

UAV T&M

Meritec

Sponsored By:

HERCULES® HS-D High-Speed D-Sub Connector Meritec’s Hercules HS-D High-Speed D-Sub embedded in the rugged-rectangular MILDTL-24308 shell provides both durable and high-bandwidth-interconnect scheme suitable for Military, Aerospace and ruggedized commercial high-bandwidth applications not previously accommodated by industry-standard connectors. Your link to The Xtreme High-Speed Xperts.

ñ Rugged lightweight MIL-DTL-24308 Shells ñ Available as Plug-Cable Assemblies and Panel-Mount, Board-Mount Receptacles with SMT tails

ñ Available in Shell Sizes DE, DA, DB, DC and DD ñ Available in positions 19, 31, 51, 75, and 108 ñ Supports date rates in excess of 10 Gb/s and differential-pair signaling ñ ñ ñ ñ ñ

WILDSTAR UltraK for OpenVPX 3U

with low-skew pairs and shielding for EMI/RFI protection Available in IP-67 Rating Matched impedance design of 100 Ohm Cable types available in 26, 28, 30 AWG Jacket types available: LSZH, PVC, FEP and Halar Expando Custom-length-cable assemblies available

www.meritec.com vita.opensystemsmedia.com/p373130

Surveillance

Meritec HERCULES® HS-D High-Speed D-Sub Connector Meritec’s Hercules HS-D High-Speed D-Sub embedded in the rugged-rectangular MILDTL-24308 shell provides both durable and high-bandwidth-interconnect scheme suitable for Military, Aerospace and ruggedized commercial high-bandwidth applications not previously accommodated by industry-standard connectors. Your link to The Xtreme High-Speed Xperts.

ñ Rugged lightweight MIL-DTL-24308 Shells ñ Available as Plug-Cable Assemblies and Panel-Mount, Board-Mount ñ ñ ñ ñ ñ ñ ñ ñ

Receptacles with SMT tails Available in Shell Sizes DE, DA, DB, DC and DD Available in positions 19, 31, 51, 75, and 108 Supports date rates in excess of 10 Gb/s and differential-pair signaling with low-skew pairs and shielding for EMI/RFI protection Available in IP-67 Rating Matched impedance design of 100 Ohm Cable types available in 26, 28, 30 AWG Jacket types available: LSZH, PVC, FEP and Halar Expando Custom-length-cable assemblies available

www.meritec.com vita.opensystemsmedia.com/p373130

UAV

Meritec HERCULES® HS-D High-Speed D-Sub Connector Meritec’s Hercules HS-D High-Speed D-Sub embedded in the rugged-rectangular MILDTL-24308 shell provides both durable and high-bandwidth-interconnect scheme suitable for Military, Aerospace and ruggedized commercial high-bandwidth applications not previously accommodated by industry-standard connectors. Your link to The Xtreme High-Speed Xperts.

ñ Rugged lightweight MIL-DTL-24308 Shells ñ Available as Plug-Cable Assemblies and Panel-Mount, Board-Mount Receptacles with SMT tails

ñ Available in Shell Sizes DE, DA, DB, DC and DD ñ Available in positions 19, 31, 51, 75, and 108 ñ Supports date rates in excess of 10 Gb/s and differential-pair signaling ñ ñ ñ ñ ñ

with low-skew pairs and shielding for EMI/RFI protection Available in IP-67 Rating Matched impedance design of 100 Ohm Cable types available in 26, 28, 30 AWG Jacket types available: LSZH, PVC, FEP and Halar Expando Custom-length-cable assemblies available

www.meritec.com vita.opensystemsmedia.com/p373130

www.vita-technologies.com

WILDSTAR UltraK for OpenVPX 3U boards include one Xilinx® Kintex® Ultrascale™ FPGA with 64 High Speed Serial connections performing up to 13.1 Gbps. There is one 72-bit QDR-IV SRAM interface clocked up to 800 MHz. If IO is required, Annapolis offers extraordinary density, bandwidth and analog conversion choices. Each card has one WILD FMC+ (WFMC+) next generation IO site based on FMC/FMC+ specification. While accepting standard FMC and FMC+ cards (complies to FMC/FMC+ specification) it also allows larger form factor Annapolis WFMC+ cards for higher IO density. WFMC+ supports 32 HSS and 100 LVDS IO for higher density ADC and DAC solutions as well as stacking two IO cards per site.

There is also an on-board dual ARM CPU running up to 766 MHz, which can be used for local application requirements. It is accessible over backplane PCIe or Ethernet and provides dedicated AXI interfaces to all FPGAs. It is also used query board health like FPGA temperature and power. It is connected to the OpenVPX control plane via 1GbE. In addition, there are nine backplane HSS connections. With included High Speed Serial (HSS) FPGA cores (including 40GBASE-KR), there is up 20 GB/s of bandwidth on the VPX expansion plane, which can go directly to other VPX cards, a switch or RTM, depending on backplane topology. There is an on-board PCI Express Gen3 switch that provides connectivity between the FPGA, backplane data plane connections and Zynq CPU. WILDSTAR UltraK FPGA boards are hot swappable allowing for more system reliability.

www.annapmicro.com/products/wildstar-ultrak-3u-openvpx/ vita.opensystemsmedia.com/p373165

VITA Technologies Buyer’s Guide Winter 2015 |

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Got Tough Software Radio Design Challenges?

Unleash The New Virtex-7 Onyx Boards!

Pentek’s Onyx® Virtex-7 FPGA boards deliver unprecedented levels of performance in wideband communications, SIGINT, radar and beamforming. These high-speed, multichannel modules include: • A/D sampling rates from 10 MHz to 3.6 GHz • D/A sampling rates up to 1.25 GHz • Multi-bandwidth DUCs & DDCs • Gen3 PCIe with peak speeds to 8 GB/sec • 4 GB SDRAM for capture & delay • Intelligent chaining DMA engines • Multichannel, multiboard synchronization ® • ReadyFlow Board Support Libraries ® • GateFlow FPGA Design Kit & Installed IP ® • GateXpress FPGA - PCIe configuration manager • OpenVPX, AMC, XMC, PCIe, cPCI, rugged, conduction cooled • Pre-configured development system for PCIe • Complete documentation & lifetime support

With more than twice the resources of previous Virtex generations plus advanced power reduction techniques, the Virtex-7 family delivers the industry’s most advanced FPGA technology.

Call 201-818-5900 or go to www.pentek.com/go/vitaonyx for your FREE online Putting FPGAs to Work in Software Radio Handbook and Onyx product catalog.

Pentek, Inc., One Park Way, Upper Saddle River, NJ 07458 • Phone: 201.818.5900 • Fax: 201.818.5904 • e-mail:info@pentek.com • www.pentek.com Worldwide Distribution & Support, Copyright © 2013 Pentek, Inc. Pentek, Onyx, ReadyFlow, GateFlow & GateXpress are trademarks of Pentek, Inc. Other trademarks are properties of their respective owners.