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Winter 2019 PC/104 and Small Form Factors Application Guide

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Note: All PC/104-Plus boards are available in a PCl-104 form factor. The ISA connector is not installed for the PCl-104 board. Use the prefix PCl104- instead of PC104P to order a board without the ISA connector. PC/104+ boards can also be ordered with non-stackable PCI connectors by adding -NS to the end of the part number.

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Tower in a teacup: How the small-form-factor transition is reshaping embedded and military computing

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PC/104

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By Stephen St. Amant, PC/104 Consortium President

PC/104: Who and why?

Admission: PC/104 is not a flashy name.

There, I said it. The name itself lacks a bit of marketing magic.

But PC/104 is less about its name and more about what it delivers: a capable, reliable solution. We also know that embedded engineers aren’t swayed by catchy ads or sales gimmicks. They’re interested in data, numbers, and what’s been proven. They’re interested in what has a track record.

Embedded engineers are interested in, “I’m going to build this and it’s going to work.”

single-board computer manufacturers and also with companies that create peripheral modules for video, CAN bus, MIL-1553, GPS, and serial.

It’s for engineers building special-purpose systems using commercially available, offthe-shelf products. It’s for system integrators

Flashy or not, the PC/104 specifications have been a stalwart player in the embedded space for nearly 30 years, and the trend continues. We see PC/104 systems in early-stage developing programs, in long-term deployments, and at every stage between.

Who’s it for? What’s it for?

Whether you’re designing a product, organizing an event, creating a specification, or writing a column, “Who’s it for?” and “What’s it for?” are invaluable questions. They serve as guideposts for every decision.

Let’s start with the question of purpose: What’s PC/104 for? It’s for rugged, reliable performance in space-constrained applications. It’s for edge computing at the sweet spot between the source and the cloud. It’s for projects that might need quick uptime along with production capabilities for five years, ten years, or more. It’s for leveraging design expertise from multiple manufacturers who offer a rich ecosystem of embedded solutions.

And who’s it for? It’s for engineers building special-purpose systems using commercially available, off-the-shelf products.

It’s for system integrators who are creating flexible modular solutions. It’s for those who want to achieve a powerful balance of size, weight, power, and cost. It’s for engineers who need to tell their manager, “We solved our problem with a trusted, proven architecture.” (See also, “Great news, Boss: We made a sound design choice, and it’s a good use of your money.”)

Who else uses it?

We often talk about the end users of PC/104. However, there’s another angle into this: that of the manufacturers.

For manufacturers, PC/104 is an attractive platform. It’s a known architecture with an open specification. Spinning products onto PC/104 gives manufacturers the ability to add their products to a thriving embedded marketplace. We see this happening with www.smallformfactors.com

who are creating flexible modular solutions.

It’s for those who want to achieve a powerful balance of size, weight, power, and cost.

What’s next for PC/104 Members of the PC/104 Consortium are in the initial stages of developing a new stackable specification. While the existing PC/104 specifications serve many embedded-computing needs, our sights are set on what will be required in the future.

Since 1992, we’ve chosen the careful, conservative approach to developing our specs. How will this affect legacy users? What is the migration path going forward? What tests are necessary to ensure signal integrity and physical durability? Which choices will best serve the market? What’s a short-term trend, and what’s going to have staying power?

Our process continues. While we seek to innovate and adapt to the changing needs in the market, we’re also committed to making wise, forward-looking technical choices. We’ve long been known for the reliability and technical soundness of our adopted specifications. As we move forward, we intend to maintain that reputation in service to our membership and in service to embedded designers across the globe.

Where to see PC/104 in the wild Aside from our website, which hosts product data sheets for many of our members, you’ll find us exhibiting at embedded world in Nuremberg in February, at the OpenSystems Media pavilion (Hall 5/341). During the show, we’ll host a panel discussion with leaders from our member companies. Last year’s discussion was a great success, so be sure to look for us in 2020!

For more information on PC/104, check out www.pc104.org or drop us a line at info@pc104.org.

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APPLICATION TRENDS APPLICATION TRENDS

Tower in a teacup: How the small-form-factor transition is reshaping embedded and military computing

By Roy Keeler

The adage that “bigger is better” pervades many areas, but in computing, greater size is almost always a liability.

Large configurations demand power and create heat, consuming precious space and potentially crowding out other vital systems. Even in a 60-ton armored tank, size, weight, and power (SWaP) remain at a premium. Such environments demand the sort of small-form-factor (SFF) solutions that have dominated embedded computing initiatives for decades.

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Computing manufacturers and standards groups have done remarkable work in bringing conventionally sized systems down to diminutive proportions. Ever-shrinking circuit sizes enable one processor to contain the functionality of what previously required several discrete chips while delivering faster performance and consuming less total energy. Similarly, interconnects between components and devices continue to become denser and more efficient.

Consider the now-ubiquitous Serial ATA hard drive interface compared to its Parallel ATA predecessor: The former is a fraction of the latter’s physical size, yet offers roughly six times greater peak bandwidth (6 Gb/sec versus 133 MB/sec, or 1.06 Gb/sec).

Similarly, the range of PCI Express connections available to system components enables ever-shrinking form-factor possibilities while making leaps in performance bandwidth.

When paired with ruggedized enclosures, SFF designs can yield remarkable results.

ADLINK’s HPERC line of rugged systems have a truly compact footprint. Consider the passively conduction-cooled HPERC-KBL-MC, which measures just 223.7 (L) x 177.8 (W) x 98.7 (H) mm (8.8 by 7 by 3.9 inches), including the VITA-75.22 form factor mounting brackets, which are literally the size of a loaf of bread. Yet system features include options for a quad-core Intel Xeon processor, quad Gigabit Ethernet, and GPGPU support via PCI Express x16 Gen 3 bus. HPERC systems are built with MIL-DTL-38999 high-speed connectors and designed to meet MIL-STD-810, enabling them to withstand battle-level shock, vibration, immersion, and temperature conditions.

PC/104 and Small Form Factors Application Guide

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SFF on the move Modern SFF designs can support defense forces and their data systems while on the move anywhere in the world, with or without network connectivity. The powerful server that used to fill the back of a Humvee can now be easily carried in the crook of an arm. Broadly speaking, SFF benefits fall into a few key categories: ❚ Small size for more powerful edge networks: Palm-sized motherboards paired with dense memory and storage components enable robust systems even smaller than the HPERC family. This means that space is no longer a restricting factor for powerful data collection and analytics capabilities at the network edge and beyond – free from the latencies and potentially troublesome access of cloud-based solutions. Intelligent, data-driven decisions can be made in the field, even in isolation, without the burden of large, heavy computing equipment. ❚ Scalability: SFF systems can often be networked, allowing for the melding of multiple systems into a more powerful whole. This melding can be done either externally, as through high-speed network links, or internally, as when stacking multiple PC/104 motherboards through shared buses. ❚ Cost-effectiveness: Small size and scalability contribute to making SFF an impressively cost-effective approach to computing needs. Unlike legacy solutions that might involve buying a single, large solution able to accommodate forecasted future needs, users need only buy as much computing power as is necessary to meet current needs. This means being able to have a much smaller solution footprint that can be added to if and when required. www.smallformfactors.com

❚ Portability: From “shoebox” form factors to NVIDIA’s MXM interconnect for laptop GPUs, companies that cater to PC enthusiasts and gamers have spent over two decades devising ways to make top-end compute and graphics performance increasingly mobile. ADLINK is now building that accumulated experience and innovation into industrial and military-grade components and systems, enabling yesterday’s tower server or workstation to become today’s ultralight laptop or embedded SFF solution. ❚ Compatibility: With government buying mandates based around commercial off-the-shelf (COTS) hardware and software, selecting providers with deep support for and experience with industry standards and open architectures is critical.

Such support is essential for solution flexibility, issue remediation, and cost containment. While some proprietary designs do exist in the SFF space, ADLINK remains committed to basing SFF solutions on industry standards from PC/104 to COM Express to Mini-ITX, always seeking ways to add value without sacrificing quality or compatibility.

Whether the modern SFF market evolved to meet increasingly demanding SWaP requirements from the military or those SWaP demands were a response to stateof-the art developments in the SFF world, the end result remains: Organizations can now address the needs of increasingly mobile, connected, and analysis-driven workforces with unprecedented solution flexibility and performance.

Let’s step back a decade: The CompactPCI form factor continues to thrive in embedded and industrial settings. Featuring similar dimensions and 3U/6U implementations, CompactPCI blades generally emphasize lower-power processors for more economical, light-bandwidth

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APPLICATION TRENDS applications. ADLINK’s cPCI-6636 family features 7th-generation Intel Xeon or Core i7 processor options, dual-channel DDR4, multiple Gigabit Ethernet configurations, and remote management via ADLINK’s SEMA management services.

Single-board computers As its name suggests, a single-board computer (SBC) integrates every component necessary for operation as a functional computing system. SBCs feature communication ports, such as for integrating storage or networking, and are often deployed singly in kiosks or embedded applications; they may also be deployed in multiples connected through various means, such as plugged into a backplane or stacked through onboard buses (for example, PC/104).

Among the many SBC form factors, VPX has aged particularly well since its 2004 arrival. VPX was engineered specifically for defense applications and adheres to either 3U or 6U Eurocard configurations and communicate via switched fabric interconnects. For example, ADLINK’s VPX3010 is a rugged 3U blade (measuring only 100 by 160 mm) featuring an Intel Xeon Processor D-1500 (up to 12 cores), up to 16 GB of surface-mounted ECC DDR4 memory, an onboard 32 GB SLC SSD, PCI Express Gen3 expansion, and two 10G-KR Ethernet ports. With conformal coating for environmental protection and both conduction and air-cooled options, the VPX3010 can form the processing backbone of a rugged, extensible server solution in a wide range of military environments.

ADLINK’s PCI/104-Express Rev. 3.0 specification CMx-SLx SBC is the latest descendent in a form-factor line dating back to 1992’s PC/104 design. The CMx-SLx measures 117.4 by 96 mm (4.62 x 3.78 inches), enabling it to fit and function in the most restrictive environments. The CMx-SLx is stackable with any industry standard PCI/104Express, PCI-104, and PCIe/104 SBCs, making it a powerful way to upgrade legacy deployments. ADLINK outfits the CMx-SLx with a choice of three 6th-generation Intel Core i3 or Intel Xeon E3 processors, 8 GB or 16 GB of DDR4-ECC memory, 8 GB to 64 GB of surface-mounted SLC or MLC SSD storage, Gigabit Ethernet, a range of additional I/O ports, Intel HD audio, and Intel generation 9 LP Graphics, capable of running three independent, simultaneous displays.

ADLINK validates the CMx-SLx for standard and extreme rugged (-40 °C to +85° C) operating temperatures, relative humidity of up to 95%, and shock/vibration tolerance that adheres to multiple IEC and military standards. The CMx-SLx is built to excel in difficult, rigorous field environments and tackle tasks ranging from multiple-source, high-definition stream collection to network edge data analysis, potentially from a system no larger than a hardback novel.

COM and COM Express Whereas SBCs typically integrate all necessary computing components onto a standalone mainboard, a computer-on-module (COM) is a smaller board with only the core system components integrated into it. The COM is designed to plug into a larger carrier board custom-designed with the specific I/O and peripherals required for the user’s application. COM architecture allows system integrators to simultaneously develop software solutions using a reference carrier board while the hardware team designs the custom carrier board, significantly reducing time to market. An additional advantage is that the core system of a solution can be easily upgraded by swapping in a newer or higher-performance COM as needed.

While “COM” refers to a component type, the COM Express series of standards defines various module interfaces aimed at different applications. For many years, ADLINK has been instrumental in helping guide the evolution of COM Express standards, including chairing the subcommittee that defined the Express COM.0 Revision 3.0 specification update. Part of this work includes deciding which feature characteristics each COM Express type will offer, such as number of PCI Express lanes, SATA ports, video output formats, and USB ports.

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COM Express Type 6, for instance, emphasizes speed and multiple display outputs, making it an excellent fit for test and measurement equipment, medical imaging, and gaming solutions when built using the “basic” size standard (95 x 125 mm, or 3.7 x 4.9 inches). Alternatively, a Type 6 implementation might adopt the “compact” size standard (95 x 95 mm, or 3.7 x 3.7 inches) and target lower-power applications (5 W to 20 W) in the automation, transportation, and robotics fields.

COM Express Type 7, in contrast, are “headless,” meaning they omit graphics output capabilities. This approach is common in server systems, but, adapted into a “basic” size, Type 7 can become a powerful foundation for edge node solutions.

To illustrate, the ADLINK Express-BD7 is a basic size COM Express Type 7 module that mounts to the ExpressBASE7 ATX carrier board. The Express-BD7 features a range of processors, including the 16-core Intel Xeon processor D1577, up to 32 GB of DDR4 ECC SODIMM memory, and two Intel 10G Ethernet controllers. Because of the solution’s modular nature, an organization can build its system using the Express-BD7 today, then upgrade to a higher-performance module in several years’ time with little or no modifications required to the existing solution.

When combined with highly ruggedized enclosures, COMs can achieve incredible application results. Consider the military deployment of ADLINK’s Express-BD7 COM Express Type 7 module at the heart of a Command and Control, Intelligence, Surveillance, and Reconnaissance (C2ISR) system. In real-world testing, a military client procured a compact, modular C2ISR solution based on the Express BD7, which measures only 125 by 95 mm, and tested it against a traditional, fullsize server. For even comparison, the client ordered its ADLINK Express BD-7 variant outfitted with a 16-thread Intel Xeon Processor D-1539. The tiny system also allows for up to 32 GB of ECC DDR4 SDRAM, two 10G Ethernet ports, PCIe Gen2 or Gen3 connectivity, 6 Gb/sec SATA, USB 3.0, and a total thermal envelope of just 65 W. The client’s testing confirmed that ADLINK’s Express BD-7 exceeded its requirements on performance, power consumption, size, and a host of MIL-STD ruggedness criteria. www.smallformfactors.com

These criteria are the foundation for reliable, secure, and highly mobile C2ISR systems, exactly the sort of rugged Internet of Things (IoT) solutions answering the communication and analysis needs of modern defense, intelligence, security, and commercial missions.

Mini-ITX embedded boards The Mini-ITX motherboard form factor arrived in 2001 as a smaller alternative to the ATX and micro-ATX mainstream PC form factors of the time. Measuring 17 by 17 cm (6.7 by 6.7 inches), Mini-ITX appeared at a time when it was becoming clear that most PC users would not upgrade their systems far beyond their factory configurations, so only a minimal number of component and I/O expansion features were necessary. Mini-ITX struck a compromise between full desktopclass expandability and compatibility with leading-edge processor, memory, and storage components. While originally aimed at enthusiast niches, a wide variety of case manufacturers supported both Mini-ITX and the various ATX form factors in their offerings, making Mini-ITX very affordable to adopt.

A product such as ADLINK’s MI-220 proves adept at embedded applications that emphasize high performance within power and budget constraints.

The MI-220 features processor options ranging from the Intel Celeron B810 to the Intel Core i7-2710QE. Two DIMM sockets accommodate up to 8 GB of dual-channel DDR3. Other board features include three SATA ports, one PCIe x16 slot, one PCI slot, one PCIe Mini Card slot, and rear panel ports spanning, DVI, VGA, HDMI, USB, audio, and dual Ethernet. With the advantages of Mini-ITX, implementers can leverage the affordable expandability of a board like the MI220 that allows customization for low-power and low-noise solutions across military applications as well as medical, automation, transportation, and similar verticals.

The above SFFs, along with many others, can serve a broad variety of applications anywhere in the world – and even beyond it, as embedded SFF solutions have provided navigation and control for many spacecraft, including the U.S.’s now-retired space shuttle fleet. www.smallformfactors.com

Examples of SFFs in embedded computing solutions ADLINK’s HPERC systems are another example to showcase how SFFs can deliver rugged yet versatile solutions for military needs. Packaged in a VITA 75 rugged small form factor, the HPERC series offers a footprint of only 223.7 mm by 177.8 mm (8.8 by 7.0 inches), small enough to mount under a vehicle seat or carry in a backpack.

The system accommodates external storage and peripherals via MIL-DTL-38999 connectors while maintaining an IP67-rated sealed enclosure. Equipped with Intel Xeon or Core i7 multicore processor, up to 16 GB of ECC RAM, quad Gigabit Ethernet, and NVIDIA graphics for GPGPU processing, the HPERC relies solely on passive conduction to cold plate or air-convection cooling.

The heavily ruggedized nature of ADLINK’s design lets the system function in virtually any environment, from arctic to tropical, while withstanding levels of shock and vibration expected in military engagement-type scenarios. In one application, a defense system provider integrated an ADLINK HPERC system into its medium

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APPLICATION TRENDS altitude reconnaissance surveillance system, a military plane designed to perform a range of airborne intelligence gathering for informing field personnel actions. The craft employs a formidable range of sensors, including thermal imaging; up to four HD video cameras; multiple radio frequencies; and a VORTEX downlink.

Feeds from all these sensors flow into the rugged HPERC system. This makes the mission-­ critical computing system fast enough to handle image and signal processing across all input streams in real-time and beam them to waiting teams for immediate action.

Fanless embedded computers Rackmount systems are commonplace in data centers and even small-business “data closets” due to their performance capabilities, reliability, and easy servicing. However, many applications with these requirements do not have the necessary space for such systems. Fanless embedded computers such as ADLINK’s Matrix line can help. Matrix embedded computers provide the PCI and PCI Express expansion capabilities necessary to accommodate specific function peripherals, such as video encoding cards for surveillance capture. They also incorporate a backplane architecture for easier and more cost-effective upgrading of key components. Rugged construction suits such high-vibration settings as transportation or factory floors, while fanless operation ­provides long-term reliability.

ADLINK’s current flagship MXC-6400 series of the Matrix line integrates a quad-core Intel Core i7-6820EQ, which boasts a maximum turbo frequency of 3.5 GHz, while supporting silent, fanless operation. Industrial-friendly features include two frontmounted, hot-swappable SATA 3 Gb/sec ports, a remote on/off power switch connected to the front panel, three Gigabit Ethernet ports, and ADLINK’s SEMA management services, which allow for remote admin monitoring of system conditions.

Extended operating temperature support is from -40 °C to +85 °C (-40 °F to +185 °F), and operating vibration tolerance stands at 5 Grms (5 to 500 Hz, three axes) when used with CFast or SSD storage media. Brimming with front-panel I/O ports and convenient access to PCI/PCIe card expansion, the MXC-6400 exemplifies the level of performance, durability, and upgradability that embedded computers can bring to tough environments with very little space to spare. (Figure 1.)

As another example of ADLINK fanless systems in the field, consider the ADLINK SETO-1000. A military in a country in the Asia region deployed SETO-1000 systems – with 1U, conduction-cooled server running dual Intel Xeon Processor E5 chips, dual 10 G Ethernet, and dual Gigabit Ethernet – into remote areas areas lacking 4G connectivity. These regions tended to be environmentally harsh, with wild swings in humidity and temperature. Even though owners operated the servers from high atop long extension poles (for optimal wireless broadcast and reception), customized Figure 1 The MXC-6400 series in the Matrix line integrates a quad-core Intel Core i7-6820EQ, which boasts a maximum turbo frequency of 3.5 GHz, while supporting silent, fanless operation.

Photo courtesy ADLINK.

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Winter 2019 PC/104 and Small Form Factors Application Guide

design focused on internal cooling, IP65 ruggedness, and exceptional stability enabled these SETO-1000 to run up to six virtual machines around the clock, processing incoming video streams from area Wi-Fi cameras and uploading to a data center.

Moreover, by using its application platform software, remote management capabilities, and system-management APIs, ADLINK was able to help the buyer go from order to successful deployment in a fraction of the time that would have been required by alternative solutions.

Trends in small form factors Even though small-form-factor systems have been a force in computing for over 30 years, there seems to be no sign of slowing in the SFF market. If anything, the range of opportunities for SFF in government, military, and vertical markets is expanding faster than ever.

Topping today’s embedded computing headlines, edge and fog computing have become key SFF deployment areas and a core requirement in most broad IoT strategies for data-driven organizations. Fog and edge computing are relatively new terms, and some people are unaware of their differences or how they are distinguished from cloud computing.

Essentially, edge applications gather data at the source from environmental sensors, video cameras, and the like and preprocess them. Edge systems feed collected data up to fog systems, which sit between the edge and the cloud, and can then aggregate, analyze, and filter data, along with other functions. Fog can then send data upstream into the cloud for further refinement, big data analysis, and storage.

This chain of data collection and processing is bidirectional. Edge applications can pass data to fog nodes as well as receive information back from them, and the same is true between fog nodes and the cloud. Generally speaking, the closer one gets to the network edge, the smaller systems become. In a military setting, soldiers in the field each might have a dozen data sources streaming off their armor, all of which might be gathered by one squad member toting www.smallformfactors.com

Essentially, edge applications gather data at the source from environmental sensors, video cameras, and the like and preprocess them. Edge systems feed collected data up to fog systems, which sit between the edge and the cloud, and can then aggregate, analyze, and filter data, along with other functions.

Fog can then send data upstream into the cloud for further refinement, big data analysis, and storage. a battery-powered gateway system – could be something like an ADLINK HPERC V – or a larger fanless embedded computer mounted in a Humvee. Several such gateways, in turn, might feed data back to a server running at the company/battery/troop headquarters.

Not that long ago, minimal computing power was needed for video capture. A digital video recorder could capture a TV or surveillance camera stream with fairly modest processing resources. The game changes when that one video stream grows into high-def or 4K resolution and then multiplies across multiple cameras, then multiplies again with feeds coming from multiple people – all accompanied by other data sources, such as LiDAR cameras, laser sighting, long-range microphones, GPS, and more. Depending on the circumstances, there may be a need for this data to be processed, analyzed, and visualized in the field, especially if cloud latency and/or connectivity results in too much delay. Even relaying to fog nodes may be infeasible. SFF systems can provide the intelligence needed at the edge without significant increase to SWaP parameters.

Some of the above data-transmission and latency concerns may be impacted by another impending trend: 5G wireless connectivity. The cellular communication successor to 4G LTE, final 5G specifications are expected in April 2019 (Release-15) followed by April 2020 (Release-16). These 2020 specifications will likely yield approximate data rates of 1 Gb/sec for hotspots and 100 Mb/s for client nodes. These are generally faster than 4G performance, but excitement over 5G is less about speed and more about markedly lower latency, higher network bandwidth, and higher signal reliability. This last point in particular will dovetail with SFF systems in “noisy” RF environments, such as factory automation. Similarly, higher bandwidth will be needed to maintain consistent performance in dense IoT applications, where hundreds or thousands of devices might be vying for connection. This will also enable the ability to pull much more data from edge devices.

The rise of in-vehicle computing will clearly benefit from the advantages of SFF.

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APPLICATION TRENDS Of course, cars have relied on microprocessors for decades, but between integrated communication systems, in-car entertainment, in-car sensor analysis (think of the visual recognition needed for backup guidance), real-time navigation, and soon intercar communication for collision avoidance, the need for more powerful processing and graphics in vehicles demands high-performance embedded systems. Other transportation fields including freight, rail, nautical, and military are also seeing an increase in SFF adoption.

Data centers have their own challenges, and organizations constantly search for ways to reduce space and energy demands. Data center downsizing continues to affect organizations of all sizes, but it intersects with SFF trends when a data closet can be reduced to a small box with a handle, such as a fanless embedded computer.

Such measures allow data-driven organizations to become increasingly mobile. Mobile workforce benefits are well documented, but when IT infrastructure can be similarly mobilized, including through enablement of mobile virtual servers, then an entirely new set of cost savings and IT flexibility emerges.

Going forward Between 2018 and 2025, analysts expect the number of IoT devices, already numbering above 7 million, to more than triple. Many, perhaps most of these, will carry multiple types of sensors, resulting in a global sea of data. Increasingly, small-formfactor computing will be critical to separating signal from noise and turning the world’s chaotic ocean of information into actionable data. In today’s world, signal analysis is ubiquitous and can be found in applications ranging from noise-canceling headphones to AI-enhanced health monitoring to drone fleets taking automatic control of defensive maneuvers. In each case, increasing functionality requires more intelligence as close to the device as possible. SFF computing provides this proximity or even integration when possible.

Manufacturers and solution integrators like ADLINK continue to innovate year after year in the SFF arena – reducing footprints, improving performance/energy ratios, increasing durability, and containing costs. ADLINK’s commitment to the small form factor market is to bring industrial-class computing into more environments and with broader, deeper benefits than ever before.

Roy Keeler is senior product and business development manager, aerospace and defense, for ADLINK Technology.

He has spent 30 years in the embedded computing, DSP, SDR, and IoT spaces in the mil/aero arena. Roy served in the United States Marine Corps before attending George Mason University, where he earned a BS in computer science and electrical engineering.

ADLINK Technology www.adlinktech.com

OpenSystems Media works with industry leaders to develop and publish content that educates our readers.

Strategies for Deploying Xilinx’s Zynq UltraScale+ RFSoC

By Robert Sgandurra, Pentek RFSoC was launched in 2017 by Xilinx; it called the new technology “Disruptive Integration and Architectural Breakthrough for 5G Wireless with RF-Class Analog Technology.”

The RFSoC added RF-class analog/digital and digital/analog data converters to Xilinx’s high-performance FPGA family and changed the way engineers could design and package small high-channel-count systems.

Link: https://bit.ly/2EnGH1d

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PC/104 and Small Form Factors Application Guide

Check out our white papers at http://mil-embedded.com/ white-papers www.smallformfactors.com

SFF MARKET UPDATE BLOG

What is an industrial small-form-factor computer?

By George T. Hilliard

The title of this piece, “what is an industrial small-form-factor computer” should be followed by “and why you should care.” You should care because an industrial small-form-factor computer may be the key component that drives your entire operation, as the latest models pack more of a punch than ever before.

The obvious advantages of these platforms are that they can fit into tighter spaces, plus they consume less power than their larger brethren. Before we get too deep into the advantages and the tradeoffs associated with small-formfactor (SFF) industrial computers, let’s define what such a product is.

The term “SFF computer” isn’t an official designation, but rather describes a range of products originally compared against desktop PCs or larger industrial systems, such as a VME chassis. Form factors that can be lumped into the SFF category could include Micro-ATX, Mini-ITX, Nano-ITX, Pico-ITX, and FEMTO-ITX. It would also cover EBX, EPIC, PC-104, 3.5-inch, and other form factors. Such smaller boards are increasingly becoming the place for automation and transportation applications.

The advantage of SFF is that you can get a board that fits your specific application, rather than be saddled with something that requires shoehorning into a given area. In fact, there are many examples of where you can take a pair of SFF boards – possibly one general-purpose and one very specialized – and mount them in a chassis that’s more amenable to the available area. Just be careful not to confuse these boards with their consumer brethren; those commercial models don’t have the chops to play in an industrial environment.

features, often nearly as many as the larger boards. These features include the latest microprocessors, adequate storage, and most of the common I/O that you would expect and need for your application.

Another important aspect of SFF boards is that they can be packaged and mounted in more creative ways than larger boards. Moreover, they may not require much in the way of cooling; in fact, fanless SFF boards/systems are quite common.

The “industrial” moniker must also be considered because such a designation certainly differentiates those boards termed industrial from something that would be used in a less robust environment. For example, a common characteristic of an industrial embedded application usually requires reliable operation at temperatures ranging from -40 °C to +85 °C, or satisfying the IEC 68-2-27 specification for shock and vibration resistance.

That latter criterion is critical for industrial applications, as durability is the name of the game here. For example, many board suppliers make the extra effort to solder components directly onto the board, instead of placing them in sockets. Other situations may require access to airflow or call for mounting a box in a particular configuration.

In addition, some applications require various levels of redundancy, such as storage and/or power supplies.

Figure 1 The WINSYSTEMS SYS-405Q fits into that SFF category, but still packs a wallop in terms of features, starting with a quad-core CPU. Yet it still operates without the need for a fan.

One system that fits these industrial requirements and is also considered “small form factor” is the WINSYSTEMS SYS-405Q. (Figure 1.) It’s a rugged, industrial system that can handle extended temperatures without the need for a fan or heat pipe.

The platform, protected by a rugged enclosure, is based on Intel’s quad-core Atom E3845 processor. It includes dual Ethernet, dual MiniPCIe, USB 3.0, serial ports with RS-232/422/485, and two independent displays via DisplayPort, and/or analog VGA. The bottom line is, don’t let the size of a small-form-factor computer fool you. For industrial applications, the electronics available today remove any danger of compromise on functionality when you need to move to a smaller, more rugged package.

George Hilliard is Sales and Marketing Manager for WinSystems.

Small in size, big on specs Don’t let the small size of an SFF board fool you. They can (and do) pack lots of www.smallformfactors.com

WinSystems www.winsystems.com PC/104 and Small Form Factors Application Guide

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COMs and PC/104 CONSORTIUM SOMs

History of the PC/104 Consortium The PC/104 Consortium was established in February 1992 by 12 companies with a common vision of adapting desktop computer technology for embedded applications. This consortium has had a tremendous, positive effect on the embedded computer marketplace. The initial release of the PC/104 specification in March of 1992 was an open design offering the power and flexibility of an IBM compatible personal computer in a size ideally suited for embedding. Simple and elegant in design, while small but rugged in performance, PC/104 technology bridged the successes of the past with the promises of future innovations.

The ISA bus of the original IBM PC – as established by the IEEE P996 specification – is still fully supported today by PC/104 technology over two decades after it was created.

When demand for a faster, higher-bandwidth bus emerged, the PC/104 Consortium once again followed the desktop PC by adding a PCI bus to the ISA bus. Following on, PC/104-Plus was introduced in February of 1997. By keeping the ISA bus and adding the PCI bus, this specification became an addition to the technology rather than a replacement of any existing technology.

When desktop PCs stopped using the ISA bus, the PC/104 Consortium was ready with PCI-104 technology. The concept of PCI with no ISA was introduced in the original PC/104-Plus specification and was subsequently formally recognized with its own specification in November 2003. Once again, the PC/104 Consortium followed the desktop PC while keeping the legacy specifications intact.

This growth pattern underscores the PC/104 Consortium’s desire to support the legacy technology while developing new solutions for the future. Longevity is a requirement for embedded systems and remains one of the hallmarks of PC/104 technology. This aspect is proven time and again by the number of PC/104, PC/104-Plus, and PCI-104 products on the market today, as well as by the number of PC/104 sites on other form-factor boards.

To learn more about PC/104 Consortium organization and membership, please visit www.pc104.org or email the organization at info@pc104.org.

PC/104 Consortium Founding Members

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Ampro

DMS Systems

Real Time Devices

Automation Instruments

Enclosure Technologies

Reflection Technology

BG Technologies

IOTech Inc.

Voice Connection

Diamond Systems

Quantum Software Systems

Xecom

Winter 2019 PC/104 and Small Form Factors Application Guide www.smallformfactors.com

Types of PC/104 Specifications ❚ PC/104: Like the original PC bus itself, PC/104 is thus the

❚ EPIC: The EPIC specification defines a physical platform

expression of an existing de facto standard, rather than

for midsized embedded single-board computer (SBC) with

being the invention and design of a committee. In 1992,

multiple I/O expansion options. Its size is midway between

the IEEE began a project to standardize a reduced form-

the industry standard PC/104 stackable format and EBX

factor implementation of the IEEE P996 (draft) specification

SBC format. This size board will support larger processors

for the PC and PC/AT buses, for embedded applications.

requiring large heat sinks. The added space also allows for

The PC/104 specification has been adopted as the “base

combining features on an SBC which would normally be

document” for this new IEEE draft standard, called the

found on multiple PC/104 modules.

P996.1 Standard for Compact Embedded-PC Modules. ❚ EPIC Express: Its size is midway between the ❚ The key differences between PC/104 and the regular

industry-standard PC/104 stackable format and the EBX

PC bus (IEEE P996) are compact form factor, with size

SBC format. This board emphasizes I/O connector area.

reduced to 3.6 by 3.8 inches; unique self-stacking bus,

The added space also allows for combining features

which eliminates the cost and bulk of backplanes and card

on an SBC which would normally be found on multiple

cages; pin-and-socket connectors, in which rugged and

PC/104 modules.

reliable 64- and 40-contact male/female headers replace the standard PC’s edge card connectors; and relaxed bus

❚ EBX: The EBX form factor, combining a

drive (6 mA), which lowers power consumption to one or

standard footprint with open interfaces, is small

two watts per module and minimizes component count.

enough for deeply embedded applications, yet large enough to contain the functions of a full embedded

❚ PC/104-Plus: This specification establishes a standard for

computer system: CPU, memory, mass storage

the use of a high-speed PCI bus in embedded applications.

interfaces, display controller, serial/parallel ports, and

Incorporating the PCI bus within the industry-proven

other system functions.

PC/104 form factor brings many advantages, including fast data transfer over a PCI bus, low cost due to PC/104’s

❚ EBX Express: Allows easy and modular addition of

unique self-stacking bus, and high reliability due to

functions not contained in standard product offerings.

PC/104’s inherent ruggedness.

This EBX system expansion is based on popular existing industry standards — PC/104, PCI, PC/104-Plus,

❚ PCI-104: To accommodate the gradual replacement of ISA

PCI-104, and PCMCIA.

bus devices with PCI devices, the PCI-104 was approved by the PC/104 Consortium. PCI-104 is a PCI-only architecture

❚ “Adopt-a-spec”: Any group or individual(s) having

that accommodates the advances of PCI devices in a small,

a specification for an embedded technology that

rugged form factor.

implements and/or supports PC/104 technology may present the specification to the Consortium for

❚ PCI/104-Express: Incorporating the PCI Express bus

consideration as a standard.

within the industry-proven PC/104 architecture brings many advantages for embedded applications, including

Please see website (http://pc104.org/hardware-

fast data transfer, low cost due to PC/104’s unique self-

specifications/adopt-a-spec) for additional information.

stacking bus, high reliability due to PC/104’s inherent ruggedness, and long term sustainability. www.smallformfactors.com

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PC/104 CONSORTIUM

PC/104 Consortium Members at Embedded World February 25-26, 2020

| Nuremberg, Germany

| www.embedded-world.de/en

PC/104 CONSORTIUM MEMBER

BOOTH NUMBER

AAEON Technology Inc.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Hall 1/1-350 ADL Embedded Solutions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Hall 1/1-554 ADLINK Technology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Hall 1/1-540 Axiomtek. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Hall 1/1-456 bplus GmBH . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Hall 4/4-303 Connect Tech. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Hall 1/1-430 Diamond Systems. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Hall 2/2-350 ept Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Hall 3/3-311 Fastwel Corp. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Hall1/1-406 iBASE. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Hall 2/2-140 OpenSystems Media. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Hall 5/5-341 PEAK System Technik. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Hall 1/1-483 Samtec. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Hall 4A/4A-259 Sealevel Systems. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Hall 3/3-201 Versa Logic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Hall 3/3-257 WinSystems. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Hall 3/3-244 Listings as of 12/10/19; subject to change

PC/104 Consortium 2019 Member Directory AAEON Technology Inc. www.aaeon.com

ept Inc. www.ept.de

Red Wave Labs Ltd. www.redwavelabs.com

ADL Embedded Solutions www.adl-usa.com

EVOC Intelligent Technology www.evoc.com

RTD Embedded Technologies www.rtd.com

ADLINK Technology www.adlinktech.com

Fastwel Corp. www.fastwel.com

Samtec www.samtec.com

Advanced Micro Peripherals www.ampltd.com

General Standards Corp. www.generalstandards.com

SBS Science & Technology www.sbs.cn

Alpha Project Co. www.apnet.co.jp

Hivertec www.hivertec.com

Sealevel Systems www.sealevel.com

Apex Embedded Systems apexembeddedsystems.com

iBASE www.ibase.com/tw

Sundance Multiprocessor Technology www.sundance.com

bplus GmBH www.b-plus.com/en.home.html

MicroMax Computer Intelligence www.micromax.com

Tri M Technologies www.tri-m.com

Connect Tech www.connecttech.com

MPL AG www.mpl.ch

Umezawa Musen Denki http://www.umezawa.co.jp

Diamond Systems www.diamondsystems.com

PEAK System Technik www.peak-system.com

Unicorp www.unicorpinc.com

Douglas Electronics www.douglas.com

PC/104 and Small Form Factors www.smallformfactors.mil-embedded.com

Versa Logic www.versalogic.com

Dynamic Engineering www.dyneng.com/pc104.html

RAF Electronic Hardware www.rafdwe.com

WinSystems www.winsystems.com

Listings as of 12/10/19; subject to change

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Winter 2019 PC/104 and Small Form Factors Application Guide

www.smallformfactors.com

Communications

Alphi Technology Corporation

PEAK-System Technik GmbH PCAN-PC/104

PCIe-Mini-CAN-FD

The PCAN-PC/104 card enables the connection of one or two CAN networks to a PC/104 system. Multiple PCAN-PC/104 cards can easily be operated using interrupt sharing. The CAN bus is connected using a 9-pin D-Sub plug on the slot bracket supplied.

The PCIe-Mini-CAN-FD is a PCI Express Mini board with an integrated CAN FD transceiver delivering data rates up to 8Mbps.

It provides an interface between the CAN bus and the system processor, supporting both classical CAN and CAN FD. The board provides CAN FD transceiver differential transmit receive capability from the bus. It also supports local wake up (LWU) and bus wake up (WUP). The PCIe-Mini-CAN-FD has many protection features, including failsafe mode, internal dominant state timeout, wide bus operating range and a timeout watchdog.

Size: 30mm x 50.95mm, Operating temperatures: 0C to +70C (commercial); -40C to +85C (industrial).

The card is available as a single or dual-channel version. The opto-decoupled versions guarantee galvanic isolation of up to 500 Volts between the PC and the CAN sides.

The PCAN-PC/104 is supplied with the CAN monitor PCANView for Windows® and the programming interface PCANBasic. Device drivers are available for Windows® and Linux.

www.alphitech.com/doc/PCIe-Mini-CAN-FD.pdf

www.peak-system.com/quick/PC104-1

Communications

Communications

PEAK-System Technik GmbH

PEAK-System Technik GmbH

PCAN-PC/104-Plus

PCAN-PC/104-Plus Quad

The PCAN-PC/104-Plus card enables the connection of one or two CAN busses to a PC/104-Plus system. Up to four cards can be operated, with each piggy-backing off the next.

The CAN bus is connected using a 9-pin D-sub plug on the slot bracket supplied.

The card is available as a single or dual-channel version. The opto-decoupled versions guarantee galvanic isolation of up to 500 Volts between the PC and the CAN sides.

The PCAN-PC/104-Plus is supplied with the CAN monitor PCAN-View for Windows® and the programming interface PCAN-Basic. Device drivers are available for Windows® and Linux.

The PCAN-PC/104-Plus Quad card enables the connection of four CAN networks to a PC/104-Plus system. Up to four cards can be operated, with each piggy-backing off the next. The CAN bus is connected using a 9-pin D-Sub plug on the slot brackets supplied. There is galvanic isolation of up to 500 Volts between the computer and CAN sides.

The PCAN-PC/104-Plus Quad is supplied with the CAN monitor PCAN-View for Windows® and the programming interface PCAN-Basic. Device drivers are available for Windows® and Linux.

www.peak-system.com/quick/PC104-2

www.peak-system.com/quick/PC104-3

OpenSystems Media webcast IoT Platforms Evolution Panel Discussion Sponsored by Advantech, Kontron, and OnLogic Early-adopter IoT environments have given IoT platform vendors a glimpse into new and innovative use cases, identification of key performance indicators, and refactoring and refining IoT platforms to support them.

Join us as leaders in IoT platforms discuss what they’ve learned and the key features and capabilities needed for successful IoT deployments.

Speakers: Charlie Wu, Product Manager, Advantech; Johnny Chen, Solutions Architect, OnLogic https://bit.ly/2Nlfej6 www.smallformfactors.com

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PC/104 and Small Form Factors Application Guide

Communications

PC/104 and Small Form Factors Application Guide

Communications

IoT

PEAK-System Technik GmbH

RTD Embedded Technologies, Inc.

PCAN-PCI/104-Express

The PCAN-PCI/104-Express card enables the connection of one, two, or four CAN busses to a PCI/104-Express system. Up to four cards can be stacked together. The CAN bus is connected using a 9-pin D-Sub plug on the slot brackets supplied. There is galvanic isolation of up to 500 Volts between the computer and CAN sides. There are versions with one, two and four channels.

The card is supplied with the CAN monitor PCAN-View for Windows® and the programming interface PCAN-Basic. Device drivers are available for Windows® and Linux.

Intel Atom E3800-Based SBC The CML24BT is an advanced PC/104 single board computer and controller with a PCI/104-Express stackable bus structure. This Intel Atom E3800-based CPU is exceptionally suited for intelligent systems requiring low power consumption in harsh thermal conditions. The CML24BTseries CPUs are available in passively-cooled quad-core, dualcore, and single-core configurations. Surface-mount Type 2 PCI Express connectors enable users to stack multiple peripheral modules above and below the CPU. All models include 4GB surface-mount single-channel DDR3 SDRAM and a 32GB industrial grade surface-mount SATA flash drive. -40 to +85°C standard operating temperature. Trusted Platform Module (TPM) onboard for secure storage of cryptographic keys.

www.peak-system.com/quick/PC104-4

www.rtd.com/atom

Communications

IoT

PEAK-System Technik GmbH

Technologic Systems

PCAN-PCI/104-Express FD

TS-4900 Computer on Module

The PCAN-PCI/104-Express FD allows the connection of PCI/104-Express systems to CAN and CAN FD busses. The PCI/104-Express specification establishes PCI Express for the PC/104 form factor wherewith up to four cards can be stacked. Based on this, standardized modular embedded systems such as industrial PCs can be realized. There is a galvanic isolation between the computer and the CAN side up to 500 Volts. The card is available as a single, dual, or four-channel version.

The TS-4900 is a high-performance Computer on Module based on the NXP i.MX6 CPU which implements the ARM® Cortex™-A9 architecture clocked at 1 GHz (Single or Quad-Core) and paired with 1GB or 2GB of DDR3 RAM. Industry-standard interfaces and connections such as Gigabit Ethernet, WiFi and Bluetooth, USB, SATA II, PCI Express, and more make the TS-4900 an excellent fit for nearly any embedded systems application, especially those needing wireless connections like Industrial Internet of Things gateway.

A wide variety of software platforms are available, including Linux, Ubuntu Core, Android, Windows Embedded Compact 2013, and QNX for flexibility in matching your embedded system requirements.

The card is supplied with the CAN monitor PCAN-View for Windows® and the programming interface PCAN-Basic. Device drivers are available for Windows® and Linux. www.peak-system.com/quick/PC104-5

www.embeddedarm.com

OpenSystems Media webcast The Evolution of Higher Speed and Density in Rugged Electronic Packaging Sponsored by TE Connectivity Copper and optical interconnect technologies play a significant role in next-generation rugged embedded computing’s drive toward higher speeds and smaller form factors.

Our panel of experts will discuss the levels of packaging – from chips to external cabling, evolving copper interconnect, and where optics technology can address emerging needs.

Speakers: Mark C. Benton, Michael Walmsley, Matthew R. McAlonis – TE Connectivity https://bit.ly/33lyv9y 18 ❙

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PC/104 and Small Form Factors Application Guide

THE AUTHORITY on MINIATURE BUILDING BLOCKS

www.smallformfactors.com

Military & Aerospace

Technologic Systems

RTD Embedded Technologies, Inc.

TS-7800-V2 Industrial Single Board Computer

Powered by the Marvell Armada 385 Dual Core 1.3 GHz ARM CPU, the TS-7800-V2 industrial Single Board Computer stands out from the crowd with its highperformance components, connectivity options, and an unbelievable feature set packaged into a small footprint in both size and power.

A productive out-of-the-box experience includes pre-installed Linux OS, development tools, and utilities for controlling PC104 peripheral boards, DIO, CAN bus, a variety of serial interfaces and bringing in data from the analog ports. The guaranteed 10+ year lifecycle ensures a long-term deployment in the field.

TS-7800-V2 can operate at a temperature range of -40 to 85°C.

Managed Scalable GigE Switches The LAN35MH08HR is an 8-port 10/100/1000 scalable Managed Ethernet switch. This switch module has a total of 10 ports: 8 ports are provided to I/O connectors, one port is available to the host CPU through a x1 PCI Express GigE controller, and one port is used as a stacking switch expansion port allowing full compatibility with RTD’s managed and unmanaged StackNET® Ethernet switch family. This also allows the CPU to use the switch without external cables. The onboard CEServices Carrier Ethernet switching software provides a rich Layer 2 switching solution with Layer 3-aware packet processing. Operational from -40 to +85°C.

www.embeddedarm.com/products/TS-7800-V2

www.rtdstacknet.com

Military & Aerospace

Transportation

Advanced Micro Peripherals

MicroMax Computer Intelligence

DXStream-HDMI – Ultra Low Latency H.264 Streaming Client

M-Max 851 DT Rugged 19/2" Conduction-Cooled System

The DXStream-HDMI is an intelligent, stand-alone, ultra-low latency H.264 streaming client that receives, decodes, and displays H.264 encoded video streams. The DXStream-HDMI supports the industry-standard RTP/RTSP protocols for streaming data via the integrated 100/ 1000MBit Ethernet connection. This SWaP-optimized solution is ideal for rapid deployment in demanding applications in Military, Communications, Transportation, Mining and Energy industries. It is cost-effective, requires less development time and is the preferred streaming decoder solution for MIL customers.

DXStream-HDMI Features: Real-time H.264 decode at up to 1080p60, Ultra Low Latency with latency below 60ms. HDMI/ DVI output, Single, rugged, real-time video streaming client. Web interface for configuration, Standard PC/104 mechanical form factor, Operating temp –40°C to +85°C.

The M-Max 851 DT is a high-performance compact rugged computer based on Dual Core i7 CPU. The fully-ruggedized 19/2"-type fanless aluminum chassis uses natural convection and conduction cooling in accordance with MIL-STD-810 standards. The versatile mechanical design of the enclosure allows combining several systems into one assembly either side by side or by stacking, as well as mounting on a flat surface or into a 19" rack. COTS technology components allow configuring the system to comply with a wide variety of airborne, marine and ground vehicle applications.

The M-Max 851 DT is based on our M-Max HR 1U Systems Family.

https://www.amp-usa.com/products/stand-alone-h264-dxstream-hdmi/

bit.ly/m-max-851-dt

Military & Aerospace

RTD Embedded Technologies, Inc. HiDANplus® HDP1011 RTD’s HDP1011 embedded computer system provides an IP67 and IP69 robust Commercial-Offthe-Shelf (COTS) solution enabling rapid uptime for missioncritical applications. The system includes a high-reliability Intel Core i7-based single board computer with surface-mount DDR3 SDRAM, a robust synchronous power supply, and room for an additional peripheral module without increasing the enclosure size. Additional configuration options include a removable SATA drawer. The milled aluminum enclosure with advanced heat sinking delivers passively-cooled performance from -40 to +85°C. Integrated tongue-and-groove architecture with EMI gaskets create a watertight solution with excellent environmental isolation. www.rtdstacknet.com/hdp1011 www.smallformfactors.com

THE SPRING 2020 PC/104 AND SMALL FORM FACTORS RESOURCE GUIDE COVERS MARKET SEGMENTS INCLUDING EMBEDDED COMPUTERS, COMS AND SOMS, BOARDS/SBCS, HARDWARE/ PERIPHERALS, AND SWITCHES.

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TECHNOLOGY UPDATES | NEW PRODUCTS

PC/104 and Small Form Factors Application Guide

Winter 2019

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PC/104 and Small Form Factors Application Guide

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