PICMG Systems & Technology Spring 2015 Resource Guide

Standards Update

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Advancing Networks

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CompactPCI Serial ascends to Revision 2, AdvancedTCA primed for Ethernet and IPv6 enhancement Proprietary implementations of open source in DSN @PICMG_Tech

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| Spring 2015 | PICMG Systems & Technology Resource Guide www.picmg-systems.com

SPRING 2015 | VOLUME 19 NUMBER 1 Standards-based technology platforms for open innovation

picmg-systems.com

@PICMG_Tech

On the cover As the IEEE looks to advance Ethernet speeds from 40G to 400G for backplane-based systems such as AdvancedTCA, the PICMG Systems & Technology 2015 Resource Guide tracks the evolution of networking technologies in articles that range from 40 GbE MicroTCA and AMCs to 100G backplane design. The Resource Guide also includes myriad products for the designer of next-generation network infrastructure solutions, with products such as the Annapolis Micro Systems WILDSTAR 6/AMC featured beginning on page 19.

Identifying challenges in 100G backplane design

By Sergej Dizel, Pentair Technical Products GmbH

Technology Focus

Standards Update | Joe Pavlat 5

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CompactPCI Serial ascends to Revision 2, AdvancedTCA primed for Ethernet and IPv6 enhancement

Advancing Networks | Brandon Lewis 6

Proprietary implementations of open source in SDN

Technology Focus 8

Upgrading MicroTCA.0 and AMC.2 to 40 GbE speed levels

By Justin Moll,VadaTech, Inc.

Application Feature

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Identifying challenges in 100G backplane design

By Sergej Dizel, Pentair Technical Products GmbH

Application Feature 11

Upgrading MicroTCA.0 and AMC.2 to 40 GbE speed levels

By Justin Moll,VadaTech, Inc.

Industry Outlook 14

Ethernet – 40G to 400G

Interview with John D’Ambrosia, Chairman, Ethernet Alliance; Chair, IEEE P802.3bs 400 GbE Task Force; and Chief Ethernet Evangelist, Dell

PICMG Resource Guide 19

Resource Guide Profiles AdvancedMC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 AdvancedTCA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Ethernet – 40G to 400G

Interview with John D’Ambrosia

Industry Outlook

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® 2015 OpenSystems Media ®C ompactPCI, PICMG, PICMG, ATCA, AdvancedTCA, MicroTCA, AdvancedMC, GEN4, and their logos are registered trademarks of PICMG. TM x TCA is a trademark of PICMG. © 2015 PICMG Systems & Technology All registered brands and trademarks in AdvancedTCA & CompactPCI Systems are property of their respective owners.

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COM Express . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 CompactPCI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 DSP-FPGA Boards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 Front Panel Hardware . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 Mezzanines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 MicroTCA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39

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| Spring 2015 | PICMG Systems & Technology Resource Guide www.picmg-systems.com

Standards Update

CompactPCI Serial ascends to Revision 2, AdvancedTCA primed for Ethernet and IPv6 enhancements

By Joe Pavlat Open standards for embedded computing offer the customer a wide range of products, vendor independence, and a fairly predictable upgrade path to incorporate new semiconductor, storage, and software technologies. The standards themselves are generally developed and maintained by open organizations or consortia that work to be inclusive and not beholden to one or a few companies. There are many successful open standards organizations in operation, and the IEEE, PICMG, and VITA are among the best known.

One of PICMG’s early successful standards is CompactPCI, which incorporates the wealth of PCI silicon developed for the desktop PC world into a modular and rugged standard for embedded computing. First released in 1995, it continues to be the solution of choice for a very wide range of applications, including the Mars rover, Curiosity (I just never get tired of saying that).

Over the last ten years or so, the parallel PCI bus has given way to a serial version, PCI Express. Serial buses are faster and the chips cheaper, because they trade pin count (which is expensive) for a larger number of transistors (which are essentially free). Other buses, including USB and Serial ATA (SATA) have followed suit. The granddaddy of all serial communications interfaces, Ethernet, is still with us and just keeps getting faster.

CompactPCI Serial – Revision 2 A few years ago, PICMG released a new version of CompactPCI known as CompactPCI Serial. It provides a tenfold or so increase in performance, more interconnectivity using fewer pins, and cost-effective features such as the inclusion of multi-channel Ethernet without the need for a switch. It is already popular in Europe where it was developed, and its popularity is now moving around the globe. The vendor base continues www.picmg-systems.com

jpavlat@opensystemsmedia.com to grow, and now includes MEN Mikro Elektronik GmbH, Elma Electronic, Kontron, EKF Elektronik GmbH, ADLINK Technology, Hartmann Electronic, Schroff GmbH, Teledyne Lecroy, ADDI-DATA, and others.

A new revision of the standard in now being released, Revision 2. It adds incremental features and capabilities, which is typical of revisions to well-established standards. CompactPCI Serial Revision 2 now supports placement of the system slot on either the left or right side of the backplane. More importantly, Revision 2 supports additional rear I/O on the P6 connector and increased capability on rear transition modules (RTMs).

Graphics, USB, SATA, and other system slot connections can now be routed out the rear, important for conduction cooling applications where the front module is fully encased. PCI Express can also be routed out the rear, making it possible to easily interconnect multiple homogeneous or heterogeneous PCI Express systems.

AdvancedTCA 100G Ethernet Driven by the need for higher bandwidth in mobility, video, and security, this effort will provide capacity improvement to the AdvancedTCA (ATCA) specification by incorporating 100 Gb backplane Ethernet while maintaining backward compatibility.

Formally designated PICMG 3.1 R3.0, the 100G ATCA standard will update the PICMG 3.1 specification to incorporate 100GBASE-KR4 (NRZ) Ethernet signaling. This effort began in early 2015, and work is expected to be completed by the end of the year. It is being headed by Doug Sandy, CTO of PICMG and Artesyn Embedded Technologies, who also lead the successful 40G ATCA effort a couple years back.

IPv6 for AdvancedTCA Hardware platform management (HPM) has been an integral part of ATCA since

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Figure 1 | CompactPCI Serial supports both 3U and 6U configurations.

Shown here is an example 9-slot, 3U CompactPCI Serial system (Figure courtesy MEN Mikro Elektronik GmbH).

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Figure 2 | Depicted here is an example CompactPCI Serial backplane with the P6 connector configured for multiple rear Ethernet connections (Figure courtesy of MEN Mikro Elektronik GmbH).

the beginning, and it was originally specified to use 32-bit IP addresses according to the IPv4 protocol.

However, IPv4 supports 4 billion distinct IP addresses, and in the emerging world of Internet of Everything and billions of interconnected devices, this is not enough. IPv6 uses 128-bit addresses, so more than 3.4 x 1038 devices can be directly addressed. This new feature will be released as an Engineering Change Notice to the current revision of ATCA, Revision 3.0, helping get this much needed capability to the market quickly.

The IPv6 feature is completely optional and does not affect backwards compatibility in any way, so all existing ATCAcompliant systems will remain so.

40G for MicroTCA and AMC The 40G MicroTCA and AMC effort is well underway. The next issue will explore this in more detail.

PICMG Systems & Technology Resource Guide | Spring 2015 |

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Advancing Networks

Proprietary implementations of open source in SDN blewis@opensystemsmedia.com Earlier this year I had the opportunity to speak with Jeff Reed, VP of the Enterprise Infrastructure and Solutions Group at Cisco on the company’s software-defined networking (SDN) strategy and trends in SDN in general[1]. I went in armed with some questions about OpenFlow, expected to hear about the company’s involvement in the OpenDaylight initiative, and was primarily interested in the company’s take on how SDN architectures are impacting vendors of hardware platforms such as AdvancedTCA (ATCA). But when I asked about Cisco’s SDN strategy, Reed was quick to point me to their Application Centric Infrastructure (ACI); when I said OpenFlow he responded with OpFlex. Do you see where I’m going with this?

Proprietary implementations of open source In early 2013, Cisco teamed with IBM on the beginnings of OpenDaylight, an open-source project aimed at accelerating the development of SDN and network functions virtualization (NFV). Of course, the term “open source” is used loosely at best these days, and although OpenDaylight is now managed

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By Brandon Lewis by the Linux Foundation and had more than 250 contributors in 2014, the vast majority of the now more than 1 million lines of code are courtesy networking giants such as Juniper, Brocade, Microsoft, Intel, and, of course, Cisco[2]. So while OpenDaylight flies under the flag of open source, is it really?

Let me direct your attention back to OpFlex. OpFlex is a Cisco-envisioned protocol that orchestrates policy between the controller and network switch in ACI implementations (as mentioned, ACI is Cisco’s answer to SDN). Ironically, OpFlex is basically the equivalent of what the OpenFlow controller does for SDNs in OpenDaylight configurations, only faster and with more fine-grained control. Currently OpFlex is an open protocol, and Cisco has committed to licensing it under Apache 2.0 in addition to proposing it as a standard to the IETF[3].

While an open-source variant of OpFlex would make the protocol widely accessible to the vendor community at large, it’s also undoubtedly an endorsement of Cisco’s ACI. In addition to an application policy infrastructure controller (APIC), the ACI model relies on hardware such as Cisco’s Nexus 9000 and Nexus 9300 switches. Meanwhile, Reed also pointed out during our conversation that Cisco has been working on a line of network ASICs over the past couple years that include a flexible parser and flexible data pipeline so that the ICs “can support protocols that didn’t even exist when we shipped it.”

“That’s such a terrific toolset to have with SDN and ACI because if a customer deploys one of those boxes and a great new protocol comes along a year from now, they can support it without having to go buy a new piece of hardware,” Reed said. “So there’s a lot of opportunity for ACI to continue to drive the relevance of capabilities on the network infrastructure itself. Almost every new product or development activity we’re working on ties into ACI and how we enable it via the controllers. That’s part and parcel to how you’ll see Cisco build its products over the next few years.”

In all, these ASICs will provide a migration path from SDN/ OpenFlow to Cisco’s ACI/OpFlex architecture, or other future SDN infrastructure combinations. If you’re interested in keeping abreast of the evolution of SDN, I’d suggest you pay attention to contributions in open-source projects such as OpenDaylight; if for no other reason than to make sure there are no surprises.

References: 1. “Software-defined networking – A view from the top.” http:// opsy.st/CiscoSDN 2. “A survey of open networking standards, part 1: OpenDaylight.” http://opsy.st/QualiSystemsOpenDaylight 3. “OpFlex: Another example of Cisco being Cisco.” http://opsy.st/CiscoBeingCisco.

| Spring 2015 | PICMG Systems & Technology Resource Guide www.picmg-systems.com

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Technology Focus

Identifying challenges in 100G backplane design

By Sergej Dizel, Pentair Technical Products GmbH

Since the introduction of AdvancedTCA (ATCA) in 2002, the race for more data transfer speed on the backplane has been on. The telecom and datacom markets have a hunger for processing power that is never satisfied. Today’s processor technologies such as multicore, GPGPUs, and powerful co-processors can satisfy the demands of full HD video on demand, increasing the number of data-hungry services available for smartphones and other applications. In addition to providing the processing power for these applications, infrastructure must be able to support the huge amount of data traffic they generate.

From packet switching backplanes with 1 Gbps of data transfer in the beginning of the millennium, today’s ATCA backplanes support 40 Gbps data transfer. This is achieved by four ports, each with two differential pairs transferring 10 Gbps each, which together are capable of transferring 40 Gbps. Even this is not sufficient to feed today’s most demanding processor blades.

Today, dual-dual star backplanes are often used where two switches work in parallel to increase the data traffic between transmitter and receiver to 80 Gbps, though this is certainly not the end point of demand for data speed.

The IEEE specification for 100 Gigabit Ethernet (GbE) over copper was released at the end of 2014, and a PICMG working group is defining 100G Ethernet for ATCA based on the IEEE spec.

100 Gbps data rates create many new challenges for backplane design. Figure 1A and 1B show the thresholds for insertion and return loss of the IEEE802.3ap specification (which defined 40G Ethernet), and the new standard IEEE802.3bj that defines 100G. At 100G, the IEEE defined two coding methods, 100GBASE-KR4 and 100GBASE-KP4. As shown in the figures, the thresholds for both new methods of 100G are defined for much higher frequencies. For the backplane this means that all components, such as

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connectors, the bare board, and the copper trace structures have to be de­signed for those higher frequencies.

The current ZD+ connector as defined in the ATCA specification is not rated for those high frequencies. At the moment, no such ATCA connector is defined or freely available on the market, although connector vendors are working on a solution. The main challenge for the new ATCA connector is to achieve a much more homogeneous impedance

transition between board and backplane. One way of possibly achieving this is to decrease the size of the through holes in the backplane. This method creates another advantage for backplane routing as the smaller hole sizes create a larger routing channel in between the connector pins. This leads to a more homogeneous impedance of the traces and a lower cross talk. The down side of smaller hole sizes is that the press-fit connector pins must be smaller and less robust and may have lower cohesion.

| Spring 2015 | PICMG Systems & Technology Resource Guide www.picmg-systems.com

Figure 1A

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Figure 1B

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Figures 1A and 1B | These graphs compare the thresholds for insertion loss (1A) and return loss (1B) at 40G and both methods of 100G.

Figure 2 shows the simulation of insertion loss (Sdd21) of a 30 mm-long differential pair in an ATCA backplane without the connectors assembled. The difference between the current configuration with a 0.6 mm through hole and a reduced through hole size of 0.36 mm is obvious. A reduction of the distance of the press-fit pins within the differential pair from 1.5 mm to 1 mm is able to further reduce the losses of the transmission line.

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The near future will show what the new ATCA connector design for 100G will be, including the footprint for mounting to the backplane. At the same time the PICMG 100G ATCA working group is striving to define the new connector in a way that allows several connector manufacturers to create the 100G ATCA backplane and board connector.

Tackling cross talk The next important part of the backplane that must be addressed in 100G ATCA designs is the trace structures, especially their dimensioning with regards to losses and cross talk. Not every differential pair has similar properties. For example, when comparing two differential stripline pairs each with a 100 Ohm impedance but different trace widths (and thus a different layer stackup), they will have different behavior with www.picmg-systems.com

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PICMG Systems & Technology Resource Guide | Spring 2015 |

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Technology Focus

0 GHz 0 dB

10 GHz

5 GHz

15 GHz

20 GHz

25 GHz

-2 dB -4 dB -6 dB -8 dB -10 dB -12 dB

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Insertion loss with 6mm vias, 30mm trace length

Figure 2 | Comparison of insertion loss of a 30 mm differential pair with 6 mm and 3.6 mm vias.

regards to transmission line losses and cross talk (emission and immission). At 40G backplane data transfer this issue is solved, but there are new challenges with 100G that became visible when conducting the first simulations for 100G data transfer, as the impedance discontinuities between the connector and the differential pair need to be evaluated very carefully. This part of the transmission line already plays a significant role in a 40G backplane, but at 100G it will be much more critical. The impedance discontinuities between the connector and the backplane have a significant influence on the properties of the whole transmission channel (losses and cross talk). If the discontinuities are too large, the signal fed into the transmission line is more sensitive to cross talk from adjacent differential signal traces. When the losses and/or influence from cross talk are to great, the receiver cannot correctly read the signal; with that, the bit error rate gets increased.

To achieve the desired trace structure in a bare board, new requirements for the quality of the bare board are needed (Figure 3). Bare board material, prepreg and core types, backdrilling, drilling offset, etching, and many other factors will play an enormous role in 100G backplane design.

Spec’ing and certifying ATCA at 100G In addition to correctly defining those parameters, the quality and the tolerances of the bare board manufacturing process is essential to guarantee reproducible 100G data transfer results. Even the smallest process deviation during manufacturing will influence the signal properties, and, in the worst case, not

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Insertion loss with 3,6mm vias, 30mm trace length

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Figure 3 | An example of vias and traces in a backplane.

allow a 100G data transfer. This means it is essential to very carefully choose a PCB manufacturing partner who understands these needs and has their processes carefully controlled. A close partnership is needed to qualify those suppliers and qualify the production technology and processes.

As the PICMG 100G ATCA specification is not yet complete, only prework on qualifying a 100G ATCA backplane design can be done at the moment. Verification of a 100G backplane is not possible until the PICMG specification is defined because the parameter limits for the backplane have not been selected yet.

The IEEE802.3bj 100G specification defines the parameter for the whole Ethernet channel, which is located between both transceiver chips. The transmission line of an ATCA backplane is just a part of the whole transmission channel; as ATCA boards are located before and after the backplane within the transmission channel. For that reason the IEEE802.3bj parameter can’t be used one-to-one for backplane validation.

The IEEE802.3bj parameter limits must be separated between these three parts of the channel for both ATCA boards and the backplane. The PICMG 100G working group is currently addressing these issues, and companies like Pentair are playing an active role defining this new important standard.

Sergej Dizel is an electrical and backplane design engineer at Pentair Technical Products GmbH. Pentair Technical Products GmbH www.pentairprotect.com AskSchroff@pentair.com 1.800.525.468

| Spring 2015 | PICMG Systems & Technology Resource Guide www.picmg-systems.com

Application Focus

Upgrading MicroTCA.0 and AMC.2 to 40 GbE speed levels

By Justin Moll,VadaTech, Inc. The Higher Speed Ethernet Fabrics for MicroTCA.0 and AMC.2 committee is working to bring 40 GbE to these specifications. The specification currently runs at up to 10 GbE levels per 10GBASE-KX and 10GBASE-KR. There are several pieces involved in this effort, and careful attention has been made to its effect on related specifications.

The largest aspect of the 40G over MicroTCA (mTCA) activity is ensuring the architecture will perform well at these speeds. In doing so, the committee will provide an eye mask and design parameters for third-party users to adhere to when they develop their own boards. The goal is to provide enough guidelines and rules so that the mTCA vendor’s 40G products are fully interoperable at 40 GbE speeds, and thirdparty developments will also have enough guidance from the specification to work effectively at the increased rates.

40G over MicroTCA will be leveraging practices used in the sister specification for PICMG 3.1 (40GbE over AdvancedTCA). Listed below are a few of the guidelines: ›› Ecosystem Interoperability – Components will be tested from active mTCA developers to ensure the various connectors, backplanes, AMCs, and MicroTCA Carrier Hubs (MCHs) work together ›› Confidence Level – Establish that any party testing to the guidelines provided has a reasonably high level of confidence that their solution will perform to the metrics ›› Independent Development – Allow that backplanes, modules, and AMCs can be developed separately ›› Minimize Cost Impact – Design options will be kept open to allow cost optimization innovation by vendors/suppliers www.picmg-systems.com

›› Simplicity – Keep the testing as simple as possible and limit the amount of expensive test equipment required One of the key steps the committee took was to leverage core parts of the ecosystem to create a model for the full interconnect path. Using multiple vendors’ AMCs, MCHs, and backplanes/chassis, the Higher Speed Ethernet Fabrics for MicroTCA.0 and AMC.2 working group looked at several parameters for 10GBASE-KR compliance testing. This included the differential insertion loss, skew, differential return loss, crosstalk ratio to insertion loss, and jitter tolerance.

Overall, the results were very good and provided a solid baseline for 40G signal integrity efforts.

PICMG Systems & Technology Resource Guide | Spring 2015 |

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Application Feature As visible in Figure 1, all of the results for the insertion loss of a short channel path fell well above the fail line. As the S-parameters were based in FR4 PCB material, there is confidence that plenty of margin exists for higher speeds; in the worst case, materials with a low dielectric constant could be used.

As shown in Figure 2, the differential return loss passes as well, but comes a bit close in the low frequencies. It is not expected for there to be a problem at 40G levels, but all of the areas will have to be watched closely. Again, as base FR4 materials were the basis of analysis, there is room for recommending other materials in the specification if needed.

The 40 GbE over mTCA efforts are continuing. Once simulation models are fully instituted, characterization of 40 GbE modules and backplanes with specially made paddle/test cards will begin. This will provide confirmation of the parameters we set

“THE 40G OVER mTCA GROUP HAS PROVIDED RECOMMENDED RESOLUTIONS FOR THE OPEN CRS IN MICROTCA.0 ...” during the simulation studies. The goal is to have all simulations complete in Q1 of 2015, with characterization commencing in Q2 or Q3.

Other activities Another part of the Higher Speed Ether­net over MicroTCA.0 and AMC.2 specification the committee is addressing are Correction Requests (CRs). These most often occur when a related specification addresses an issue and a request is made to have the adjustments incorporated in all corresponding specifications.

When changes are made special care is given to not materially harm or affect the compatibility and function of related specs, but sometimes small adjustments and clarifications are required for consistency and accuracy.

MicroTCA and its related specifications have been very active in recent years, including the ratification of MicroTCA.2 and several notes/changes to MicroTCA.1.

The task of aligning all of these specs can be time-consuming, but it is important to ensuring an effective family of specifications. Furthermore, there has been a wealth of activity in MicroTCA.4 led by the high-energy physics (HEP) community, and the original authors’ allowance for the use of rear transition modules (RTMs) in the MicroTCA.0 has become a key attribute of MicroTCA.4. Addressing CRs in this instance made life easier when trying to keep the specifications aligned and up to date.

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The 40G over MTCA group has provided recommended resolutions for the open CRs in MicroTCA.0, and they will be submitted to PICMG membership for a vote.

Join the committees MicroTCA is gaining traction in physics, mil/aero, and many other applications.

Texas Instruments has based some of

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| Spring 2015 | PICMG Systems & Technology Resource Guide www.picmg-systems.com

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Graphic Boards Figure 2 | Differential return loss testing of 10GBASE-KR4 Ethernet in 40G MicroTCA.0 and AMC.2 systems was also successful, however the smaller margin for error may at some point necessitate a base material other than FR4.

their new evaluation modules on the AMC form factor, and it is also common to find a new specialty AMC board vendor crop up in unexpected places. If you are an active user or developer of AMC/MicroTCA systems and are interested in joining the group, contact Justin.moll@vadatech.com or info@picmg.org for details.

• One AMD RadeonTM E8860 • One KintexTM-7 325T FPGA • Support for DP, HDMI, VGA, Stanag3350, Arinc8181...

• One PMC/XMC site

Justin Moll is Director of Marketing for VadaTech, Inc. Justin is active in the embedded industry and is currently the Chair of the 40 GbE over MicroTCA committee within PICMG. VadaTech, Inc. www.vadatech.com justin.moll@vadatech.com www.picmg-systems.com

www.interfaceconcept.com +33 (0)2 98 57 30 30 PICMG Systems & Technology Resource Guide | Spring 2015 |

13

Industry Outlook

Ethernet – 40G to 400G Interview with John D’Ambrosia, Chairman, Ethernet Alliance; Chair, IEEE P802.3bs 400 GbE Task Force; and Chief Ethernet Evangelist, Dell

With Ethernet speeds advancing past 40G to 100G and higher, designers of systems such as AdvancedTCA (ATCA) meticulously follow activities in the IEEE 802.3 Ethernet subcommittee for any indicators on the future of backplane-based systems. In this interview with John D’Ambrosia, IEEE P802.3bs Chair, Chairman of the Ethernet Alliance, and Dell’s Chief Ethernet Evangelist, he discusses the development and deployment of the recently released 100GBASE-KR4 and -KP4 specifications, as well as the beginnings of IEEE work on 400G Ethernet and beyond.

Give a little background on the 100GBASE-KR4 spec, it’s development, and finalization.

D’AMBROSIA: The 100GBASE-KR4 spec was developed as part of what was referred to as the IEEE 802.3 100 GbE Backplane and Copper Cable project.

That project was being considered as the development of 40 GbE and 100 GbE was coming to a close. In that case, the 40 GbE and 100 GbE project hadn’t developed any new electrical signaling on a per lane basis, meaning that all of the electrical interfaces developed as part of that project were based on 10 GbE signaling.

100 GbE optics actually was developed with a 4-lambda approach based on 25 GbE per lambda. When you look at the optical specs you see 100GBASE-LR4 and 100GBASE-ER4; that was really the initial 100 GbE project. So right off the bat there was this understanding that we were going to go to 25 GbE technology just because we had looked at it from an optics perspective, which really became a systems perspective.

As I said, the electrical interfaces that were developed for the 100 GbE project, which did not include a backplane solution by the way, were based on 10 lanes of 10 GbE. As an old backplane designer I can tell you that there’s no way in hell I want to have to deal with 10 lanes of

14

10 GbE across the backplane. So as the group was winding down on 100G development, which was really an optics focus, we realized that we needed to start introducing the next members of the 100G family. And following those discussions we had around developing the optics, we started looking at developing 4 x 25 Gbps Ethernet. That’s why it was called “Backplane and Copper Cable.”

As that project emerged, it became 100GBASE-KR4 (which is a backplane solution based on NRZ signaling), there’s 100GBASE-KP4 (which is based on PAM4 signaling), and then there’s 100GBASE-CR4 (which is across a twinaxial cable for 5 m based on four differential pairs of 25 Gbps Ethernet in each direction). The actual project started with a call for interest (CFI) that happened in November of 2010, and that spec was ratified in the middle of last year. That’s been finalized, so that spec is out there now.

What were some of the challenges with 100G spec development, and how do the KR4 and KP4 specs differ?

D’AMBROSIA: In hindsight, some of the FEC encoding became more involved, and the bigger point in terms of AdvancedTCA (ATCA) is you had new channel specs. This is where -KR4 and -KP4 came from.

As a kind of rule of thumb, you’re probably looking at a 25 dB to 35 dB solution at the Nyquist rate. So, if I’m running at 10 Gbps, Nyquist is roughly half of that – 5 Gbps – for NRZ signaling. That’s kind of constant, so when we jumped to 25 Gbps the channel was in the 25 dB to 35 dB range, but now at 12.5 Gbps. So as you move to higher speeds, the channel itself becomes an issue. That’s always one of the challenges you’ll face, and you can see the same kind of thing with the 10 GbE and 40 GbE specs.

NRZ signaling stands for non-return-to-zero, and it’s a form of pulse-amplitude modulation (PAM). So it’s your classic zeros and ones. In the case of PAM4, the way that I like to describe it is if you sit in a room and you ask people to raise their hands, those are ones; if they don’t put their hands up, those are zeros. So it’s usually very easy to tell the difference between zeros and ones. Normally it doesn’t really matter how quickly they put their hands up, but as you start moving faster and faster, you start to run into some issues. One of those is the challenges of the channel, and one of those challenges is cost.

| Spring 2015 | PICMG Systems & Technology Resource Guide www.picmg-systems.com

If you were to look at PAM4, going back on my analogy, there would be more places for people to raise their hands.

So zero would be their hands down, the next level might be at their waist, the next level would be at their head, and the last level would be above their head. Pulse amplitude modulation at four levels, or PAM4. Inherently, that reduces your signal-to-noise ratio right off the bat.

that rule of thumb about 25 dB to 35 dB at Nyquist, but in the case of PAM4 it’s not really 25 dB to 35 dB at 12.5 Gbps, it’s really 25 dB to 35 dB 6.25 Gbps to 7 Gbps because of some overspeed. That becomes a way to deal with channels that may involve lower cost materials. That’s really the benefit here – being able to send more information over a lower cost channel is essentially the benefit of PAM4 over NRZ.

In the case of NRZ, you send a symbol that represents a 0 or a 1. In the case of PAM4, you send a symbol (the baud rate), but in this case it is enabled by two bits. So when you’re at level 0 it represents something, when you’re at level 1 it represents two 2 bits, when you’re at level 2 it represents two bits, when you’re at the highest level it represents two bits – also, depending on the different transitions, you get into representing what those two bits are.

So you’re sending more information in a single symbol than you do with NRZ, so your baud rate is half now. I gave you

OUT THERE THAT SUPPORTS NRZ SIGNALING. IT GOES

“YOU SEE MORE PRODUCTS BEING INTRODUCED SUPPORTING 100GBASE-KR4 THAN 100GBASE-KP4 TODAY. YOU HAVE TO REALIZE THAT THERE’S AN ECOSYSTEM FROM THE TEST EQUIPMENT TO JUST THE BASIC ENGINEERING UNDERSTANDING.”

What kind of adoption are you seeing for each specification, and what type of interoperability challenges, if any, do the two types of signaling pose for backplane designers?

D’AMBROSIA: One of the things that we are seeing is a lot more work being devoted to 100GBASE-KR4, the NRZ specification. You see more products being introduced supporting 100GBASE-KR4 than 100GBASE-KP4 today. You have to realize that there’s an ecosystem out there that supports NRZ signaling. It goes from the test equipment to just the basic engineering understanding.

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15

Industry Outlook But the debate between NRZ and PAM4 has been going on for a long time, and there are more and more people interested in PAM4. Going back 13 years, I helped form a group called the High Speed Backplane Initiative, and we were looking at using PAM4 for backplanes back then. At that time there were a few parties interested in it, but ultimately the industry decided to not specify PAM4 and specify NRZ for 10 GbE signaling.

When it came time to do 4 x 25 GbE signaling, more companies stepped up saying that they think we should do PAM4. Now as we look to going to 400 GbE and trying to go faster, more and more people are looking at using PAM4 signaling to support 50 Gbps electrical, especially over the longer channels just because of the inherent channel challenges.

50 GbE PAM4. There are some people who are pointing to that saying it’s a good thing because we could support backwards compatibility, and as we look at having to go backwards it would be to our benefit to consider doing 50 GbE PAM4 because of the popularity of 25 GbE NRZ, as opposed to having to go to newer processes to support 50 GbE NRZ. Those arguments are already happening now as we look at supporting 50 Gbps electrical signaling as part of the 400 GbE project.

The IEEE hasn’t announced any intentions of taking copper backplanes further than 100 GbE. From your perspective, what are the most viable options moving forward?

D’AMBROSIA: We’re developing 400G now. The 802.3bs Ethernet Task Force has decided that it will develop electrical interfaces for chip-to-chip (by chip-to-chip I mean on a card, not across cards) and chip-to-module. We will develop 25 GbE and 50 GbE electrical interfaces – 25 GbE will leverage NRZ signaling, 50 Gbps is still a topic of debate over whether it will be NRZ or whether it will be PAM4.

The interesting thing here is that, when I said from a backplane designer’s perspective that doing 10 x 10 GbE interfaces across a backplane didn’t sound appealing, for 400G it would be 16 x 25 GbE and 8 x 50 GbE. Even at 50 GbE that sounds really ugly to me, but it is pretty much recognized that 50 Gbps signaling is going to be the next development point.

It’s an interesting question as we go forward because a lot of the 25 GbE NRZ that has been developed and is now out in the market provides similar circuitry to what would be needed to support

The introduction of 50 Gbps though, if you look at what’s going on inside the IEEE right now, could raise some interesting questions. When you look at what’s happening with how we’re developing 25 Gbps signaling technology as part of 4 x 25 GbE for 100G, and then you look at 40G, which is leveraging 4 x 10 GbE today, what you see

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| Spring 2015 | PICMG Systems & Technology Resource Guide www.picmg-systems.com

›

Figure 1 | The 2015 Ethernet Roadmap outlines the ongoing development of Ethernet through 2020, and and includes projections for electrical/ optical speeds possibly as high as 10 Tbps.

LCR Embedded System’s complete line of integrated rugged industrial and military systems, from off-the-shelf to fully customized, are ideal for all aspects of mission-critical computing. To learn more about what we can do for you and your application, contact us today.

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PICMG Systems & Technology Resource Guide | Spring 2015 |

17

Industry Outlook is that you can’t get the same port density into an ASIC at 40G as you can at 25G because the basic building blocks don’t line up. In the case of 25 GbE, they do – 25 GbE I/O on the chip to 25 GbE I/O on the boxes. So you can get to the maximum density this way and the maximum throughput on the chips, which helps to optimize your switches, which helps to optimize and reduce cabling costs, power costs, and so on. So there is this inherent niceness to 1x or 4x architectures.

Now we’re getting to the question, and this is still a question, “Will we see 50 GbE and 200 GbE emerge as speeds for backplanes?”

There’s been a lot of discussion and debate, and the logic of this is very relevant. But we’re still in the early stages of developing 50 GbE electrical signaling. I can tell you as Task Force Chair that this comes up and I have to keep people within the scope of our project par. It’s not a foregone conclusion yet by any means in IEEE 802 because

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“... WILL WE SEE 50 GBE AND 200 GBE EMERGE? ...

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there haven’t been any votes yet taken on any of these discussions. These are really industry debates around 50 GbE and 200 GbE. So, will we see 50 GbE and 200 GbE emerge? That is the question. I don’t have the answer for you today, but I get the logic. The role of the IEEE 802 specs is to produce high-quality, market-relevant standards. The IEEE 802 does not decree, “Thou shalt develop.” That’s not the way the process works. By marketrelevant standards, what we’re saying is that the market decides what it wants to develop a standard for next. So the market market comes forward and says, “We want to do this.”

Editor’s Note: The Ethernet Alliance recently announced its 2015 Ethernet Roadmap at the Optical Fiber Communication Conference and Exposition (OFC 2015) in Los Angeles. The Roadmap outlines the ongoing development of Ethernet through 2020, and includes projections for electrical/optical speeds possibly as high as 10 Tbps.

A portion of the roadmap is located on page 17, with the entire Roadmap available for download at in its entirety at http://bit.ly/EthernetRoadmap-EA. Ethernet Alliance www.ethernetalliance.org admin@ethernetalliance.org IEEE P802.3bs 400 Gb/s Ethernet Task Force www.ieee802.org/3/bs jdambrosia@ieee.org

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Dell Networking Solutions www.dell.com/networking

| Spring 2015 | PICMG Systems & Technology Resource Guide www.picmg-systems.com

AM C1x/msd The AM C1x/msd is a high performance Single Module, Full-size or Mid-size, AdvancedMC™ processor module supporting a 4th generation Intel® Core™ processor (2-core or 4-core) with up to 16 Gbytes of DDR3L-1600 ECC DRAM. The AM C1x/msd is designed in compliance to AMC.0, AMC.4 Type 5 and Type 10 (single or dual x4 Serial RapidIO®), AMC.2 Type E2 (2 x Gigabit Ethernet) and AMC.3 Type S2 (2 x SATA ports).

The module also features USB 2.0, RS232, SATA, a x2 PCIe Gen 2 port and introduces two 10 Gigabit Ethernet interfaces on the front panel.

Supporting full hot swap and IPMI capabilities with a range of industry standard operating systems, the AM C1x/msd is designed for use in AdvancedTCA® or MicroTCA™ applications in the telecommunications, scientific, and industrial markets. Application examples include high performance embedded clusters and wireless test controllers.

FEATURES ĄĄ Full-size or Mid-size, AdvancedMC™ processor module ĄĄ 4th generation Intel® Core™ processor ĄĄ Up to 16 Gbytes of DDR3L-1600 DRAM with ECC ĄĄ Up to two x4 Serial RapidIO fabric ports ĄĄ AMC.2 Type E2 (2 x Gigabit Ethernet ports) ĄĄ 2 x 10GBase-T interfaces via front panel ĄĄ Up to 3 x external USB 2.0 ports ĄĄ Support for onboard SATA Flash Disk Module ĄĄ Up to 4 x Serial ATA interfaces on rear I/O picmg.opensystemsmedia.com/p372303  sales@cct.co.uk  +44 (0)1206 752626 or +1 781-933-5900

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ATCA-7480 The Artesyn ATCA-7480 blade uses two Intel® Xeon® E5-2600 v3 family processors (up to 28 cores per blade), optimized data paths and Artesyn’s QuadStar™ interface to deliver the highest performance processing. Optional hardware accelerators can improve the performance of security applications.

Scalable memory capacity (up to 512GB) enables faster database access, accelerated pattern matching and helps optimize routing decisions in virtualized network environments. Sixteen memory sockets means cost sensitive applications can still achieve their required capacities using cheaper modules.

Artesyn's enabling software for SDN/NFV supports Intel DPDKaccelerated OpenVSwitch, OpenFlow and OpenStack plug-ins, and Wind River's Titanium Server.

FEATURES ĄĄ Two Intel® Xeon® processors, E5-2600 v3 family ĄĄ Scalable performance range with up to 14 cores per processor ĄĄ Up to 512GB main memory, DDR4, configurable for highest capacity

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PICMG Systems & Technology Resource Guide | Spring 2015 |

19

PICMG Systems & Technology Resource Guide

AdvancedMC

PICMG Systems & Technology Resource Guide

AdvancedTCA

Netarium ATCA Series Advantech’s ATCA solutions are more than just hardware designs as we go much further than an ordinary ODM. We ensure that our systems not only have outstanding stability secured by a world-class design quality assurance process, but are enhanced by building in features which improve availability, serviceability and usability. Features which have a moderate impact on cost as they have been carefully designed by Advantech’s in-house engineering teams and are kept consistent across the product line.

Blades The cornerstones of our ATCA product line are the blades designed in our own labs and manufactured on our own production lines. We manage the entire lifecycle and control all our costs to give customers the best service at the right price. Our x86, NPU, DSP and switch blades are designed in unison with the leading silicon suppliers to give you early access to the very latest technology to accelerate your next generation product design and give you firstmover advantage.

Systems Advantech’s Netarium™ series of ATCA systems are specifically targeted to help network equipment providers reach superior levels of performance over traditional rackmount servers or appliances and extend their product range at the high end. The series represents a new generation of systems which offer superior performance, scalability and flexibility with the latest 40/100GbE switches and application blades. We optimize the systems to achieve the highest possible density at the rack level, with a maximum number of payload blades, network ports and switching capacity. eATCA – For More High-End Real-Estate The new Extended ATCA (eATCA) system architecture from Advantech responds to next generation networking needs for more high performance I/O connectivity and increased flexibility to add application-specific optimization hardware in high-end systems. eATCA is a system architecture based on ATCA that delivers increased I/O and packet processing performance for networking platforms facilitating borderless enterprise, secure datacenter, and cloud computing applications. eATCA systems integrate standard ATCA blades with extended Rear Transition Modules (eRTMs), providing almost four times more real estate for PCIe-based I/O connectivity and enabling new capacity for acceleration and offload. eATCA & ATCA Platform Management ... Appliance Style The SMM-5060, at the core of our ATCA platform management approach makes ATCA look like a big appliance and is able to support a consistent management view across our customers’ full product line. This means OEMs utilizing appliances for their entry and mid-range networking gear will find it surprisingly easy to add an ATCA based system as an extension of their product line at the high end.

Advantech’s SMM-5060 ATCA Shelf Manager features an Intel® Atom™ processor C2000 which brings added value system control and service processing to ATCA and eATCA systems, and can be used as a centralized service access point or blade boot server. The SoC’s features enable encryption and decryption of external management traffic in business and mission critical systems. The SMM-5060 has been designed to maximize management flexibility in multi-blade systems.

FEATURES ĄĄ Netarium-14 • 14-Slot, 14U fully integrated AdvancedTCA system • 12 Dual Intel® Xeon® blades + 2 hub blades (dual star) or 10 Dual Intel® Xeon® blades + 4 hub blades (dual-dual star) • 40GbE/100GbE Switches • AC or DC power; 300W+ per slot • Advanced Shelf Management with Intel® Atom™ C2000 • OVS with DPDK offload; QuickAssist ready ĄĄ MIC-5342 Telecom Blade • Two Intel® Xeon® E5-2600 v3 Processors and Intel® DH8955 • Up to 256GB ECC Memory • Up to 4x 40GBaseKR4 on FI (dual-dual star); 2x 1000BASE-T ports on BI ĄĄ MIC-5345 Server Blade • Optimized for virtualized environments • Two Intel® Xeon® E5-2600 v3 Processors with Intel® C610 • Up to 256GB ECC memory • Up to 2x 40GBaseKR4 ports on FI ( dual star); 2x 1000BASE-T ports on BI • Single CPU version adds two 2.5" SSDs and two MO-297 SSDs (or two 2.5" SSDs and two CFast Cards) ĄĄ DSP-8901 DSP Blade • 20 Texas Instruments C6678 DSPs • 512MB/1GB DDR3 memory per DSP • BCM56321 10GbE switch for both FI and BI • Freescale QorIQ™ P2020 for Local Management Processor (LMP) • IDT Tsi577 Serial RapidIO switches ĄĄ ATCA-7310 Network Processor Blade • Dual Cavium Octeon II CN6880 1.0 GHz • Up to 64GB DDR3 1066 MHz DIMMs; 32GB per NPU • 40 GbE (KR4) & 4x 10 GbE (KR) FI with Dual Star support • 8x 10GbE SFP+ and 4x 1GbE SFP to Rear I/O ĄĄ ATCA-9223 100GbE Hub Blade • 100GbE switch blade provides switching between two 100GbE uplinks, up to eighteen 10GbE uplinks and twelve 40GbE node slots • Fabric interface bandwidth up to 960Gpbs • Broadcom BCM56150 base fabric switch with 70Gbps switching capacity • Intel® Atom Processor C2000 for flexible control plane processing • Two Virtex 7-690 • FPGAs connect 2x 100G and 8x 10G for inline processing • Switch management picmg.opensystemsmedia.com/p372659

Advantech Co Ltd

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| Spring 2015 | PICMG Systems & Technology Resource Guide www.picmg-systems.com

ATCA-8330 <<Title>>

Combining a powerful Intel® Xeon® processor with up to 40 Octasic <<Description>> OCT2224M multi-core DSPs, the Artesyn ATCA-8330 blade is the industry’s highest density media processing blade. This enables network equipment providers to implement complete solutions such as session border controllers, VoLTE, video optimization or video conferencing with less blades and therefore less cost.

An innovative modular design, using DSPs mounted on DIMM-type modules, allows the blade to scale four DSPs at a time up to 40 DSPs, to meet application requirements. The blade can be configured as either a ‘gateway-on-a-blade’ or as a resource blade in a larger system.

The Artesyn ATCA-8330 includes award-winning software that makes it easier for developers to create and use arrays of media processing resources in highly complex voice- and video-enabled applications.

FEATURES ĄFEATURES Ą High performance Intel

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included ĄĄ interface <<Feature 5>>

ĄĄ Hardware <<Featureand 6>>software platform to support VoLTE and Media Resource

Function

ĄĄ Designed for NEBS Level 3 and ETSI telecom standards compliance <<magazine_url>>/<<product_id_number>> picmg.opensystemsmedia.co/p372661

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Implementation of the Intel® Accelerated DPDK ensures performance is optimized for the hardware and virtualized environment. Open ATCA hardware architecture ensures a multi-vendor payload ecosystem combined with the scalability and maintainability of a bladed architecture.

Load-balanced switching provides additional efficiencies to virtual application deployment. Artesyn's Centellis VP is based on open hardware and software architectures and is carrier-grade and NEBS certifiable.

FEATURES <<Feature 1>> ĄĄ Application virtualization software framework based on industry ĄĄ standard <<FeatureSDN 2>>& NFV software stacks

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PICMG Systems & Technology Resource Guide | Spring 2015 |

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PICMG Systems & Technology Resource Guide

<<Category>> AdvancedTCA

PICMG Systems & Technology Resource Guide

AdvancedTCA

ATCA System Software Artesyn’s range of add-on software can save time-to-market and enable you to focus your resources on value added development for competitive advantage: System Services Framework (SSF) provides ATCA system management and a framework for out-of-the-box system management functions and can yield up to 40% reduction in time-to-market for network elements.

FEATURES

ViewCheck™ is online in-service and out-of-service diagnostics & fault detection software.

ĄĄ High bandwidth traffic flow separator and load balancer ĄĄ Balance traffic to multiple AdvancedTCA® blades for packet

FlowPilot™ provides high bandwidth traffic flow separation and load balancing to enhance packet flow efficiency without a separate appliance.

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ĄĄ Maintain flow context and packet sequence

SRstackware™ supports a wide range of Layer 2 and Layer 3 standards and protocols, simplifying integration with customer applications.

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Genesis700 AC/DC 7 Slots 40G/100G ATCA The Genesis 40G ATCA series is a high-powered, yet cost-effective ATCA chassis. With side-to-side cooling of up to 550W per slot, using only 6 fans to cool up to 7 blades, Genesis redefines power and cost efficiency.

Its unique field-replaceable fan-tray configurations, offers the ability to seamlessly scale from 450W/slot to a high-power configuration of up to 550W/slot, allowing customers to future-proof their investments.

FEATURES ĄĄ High-Power – cooling power of up to 550 watts per slot. ĄĄ Field scalability – unique field-replaceable fan-tray configurations,

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• Form factor – 5U; 7 slots; 19"

in the field, providing outstanding flexibility and time-to-market.

• Slot configurations – 7 payload blades (no switches); 2 switches + 6 payload blades (Intera™); 2 switches + 5 payload blades

ĄĄ Outstanding resiliency – unique external fan tray controllers

eliminate fan tray failures.

ĄĄ Power-efficient – 7 slots are cooled by only 6 fans while reaching up

• Power & cooling – 450W/slot (standard); 550W/slot (high-power)

to 550W per slot.

• Field-replaceable AC/DC

ĄĄ Intera™ integrated switch slot – frees up to two additional payload

slots, for significantly greater processing power.

picmg.opensystemsmedia.com/p372662

Asis Ltd.

www.asis-pro.com

22

sales@asis-pro.com  408-215-1510 

| Spring 2015 | PICMG Systems & Technology Resource Guide www.picmg-systems.com

CO14-G4 The new flagship 14-slot chassis is Comtel’s “4th Generation” and the latest in high performance platforms for ATCA! Appropriately named, CO14-G4, this Chassis is a 14U height 14 slot AdvancedTCA® chassis supports full mesh, dual star and dual-dual star topologies backplanes it is DC powered and has front-to-back cooling!

About COMTEL Electronics Comtel has acquired a leadership position in the business of electrical interconnection components and systems. The activities of the company include high-speed electrical simulation, design, prototypes and mass production for Backplanes and system solutions.

Since 1993, Comtel Electronics GmbH has been offering Backplanes and integrated systems based on a wide range of VME, VME64x, VXI, VXS, VPX, Gigabit VME64x, PXI, CompactPCI, AdvancedTCA, uTCA and custom proprietary solutions.

Comtel has expertise in a wide range of engineering disciplines including concept design, board assembly and testing, mechanical design and production, wiring and functional test, system engineering and software design.

Comtel products are implemented in solutions for telecommunications, test and measurement, instrumentation, medical, military and other applications.

Comtel is a privately owned company with its headquarters in Munich, Germany. The Comtel Group incorporates production facilities in Germany, Israel and China. Furthermore the enterprise offers sales support worldwide.

Comtel is an active member of PICMG consortium, contributing in development of advanced telecommunication standards as AdvancedTCA and MicroTCA.

FEATURES ĄĄ

515W per slot engineered Cooling

ĄĄ

Options for 675W per slot Cooling

ĄĄ

Ultra high performance Air-/-Plane™ backplane supporting 40 Gbps and now 100 Gbps!

ĄĄ

Dual Star, Dual-Dual Star, Full Mesh topologies

ĄĄ

19", 14U Rackmount chassis

ĄĄ

Accommodates 14, ATCA boards and RTMs

ĄĄ

Redundant Pigeon Point Based Shelf Manager

ĄĄ

ĄĄ

ĄĄ

4 redundant Power Entry Modules (A1+ A2 and B1 + B2) to accommodate up to 800W per slot Pull cooling with 4 hot-swappable redundant fan trays with excellent airflow distribution The new cooling system pumps 1250cfm of air through the chassis

ĄĄ

High Reliability Bussed or Radial IPMB

ĄĄ

EMI containment for front and rear card cage

ĄĄ

Compliancy: • RoHS • Designed to meet NEBS • UL/cUL/CE pending picmg.opensystemsmedia.com/p372546

COMTEL Electronics

www.comtel-online.com www.picmg-systems.com

 nasales@comtel-online.com  +1-619-573-9770

PICMG Systems & Technology Resource Guide | Spring 2015 |

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PICMG Systems & Technology Resource Guide

AdvancedTCA

PICMG Systems & Technology Resource Guide

AdvancedTCA

ATCA® Shelves and Backplanes Pixus Technologies’ ATCA® shelves and backplanes support a wide range of applications in telecom, LTE, enterprise, military/aerospace, and HPC environments. All shelves are designed to meet NEBS. AdvancedTCA® shelves from Pixus are equipped with the hot-swap highperformance RiCool III fans. These fans offer added output coupled with a reduced noise level. Pixus 40GBASE-40KR4 backplanes are monolithic with a high level of signal integrity in dual star, full mesh, or replicated mesh.

Pixus provides 3U, 5U, 6U, 8U, and 13U ATCA shelves with AC and DC power options. Full redundancy is provided with dual shelf managers, dual or quad cooling units, dual Hubs, and dual power modules.

ATCA systems from Pixus leverage over 20 years of superior cooling, backplane, and packaging innovation with proven Pixus and Rittal technologies.

ATCA Shelves and backplanes can be modified to meet customer requirements without NRE.

FEATURES PXS1340 13U ATCA Shelf ĄĄ 40GBASE-KR4 Dual-Star or Full-Mesh 14-Slot Backplane ĄĄ Front-to-Rear airflow supporting over 270W/Slot cooling performance (@ 55°C) ĄĄ Full redundancy with dual ShMCs, quad CUs, dual Hubs and dual PEMs ĄĄ 15,000+ installed base worldwide PXS0640 SlotSaver 6U ATCA Shelf ĄĄ 40GBASE-KR4 Dual-Star, Full-Mesh or Replicated Mesh 6-Slot Backplane ĄĄ Integration of Hubs with ShMCs adds 2 node slots ĄĄ AC and DC power options PXS0309 3U ATCA Hybrid Chassis with 8 AMCs ĄĄ 19" rack mount 3U ATCA Hybrid AMC Chassis ĄĄ 1 ATCA slot and 8 mid-size AMC slots picmg.opensystemsmedia.com/p372668

Enclosures Cases Subracks Backplanes Chassis Integrated Systems Components

 sales@pixustechnologies.com  519-885-5775

Pixus Technologies

www.pixustechnologies.com

AdvancedTCA

Express Programs: When product is needed fast Need systems, subracks, cases or front panels quickly for prototyping or small projects? Express service provides rapid delivery turnarounds for solutions engineered to meet your design requirements – in a matter of days.

Systems Express • ATCA, MicroTCA, CompactPCI, and CompactPCI Serial models available • Shipped in as few as 15 days

FEATURES

Subrack & Cases Express • EuropacPRO subrack kits, parts and accessories • RatiopacPRO case kits, parts and accessories • Delivered in as few as 15 days

ĄĄ Conform to PICMG specifications ĄĄ ATCA, uTCA, CompactPCI standards ĄĄ Standard and customized solutions available

Front Panel Express • 5 to 50 front panels • Custom cut-outs, handles and silk screen • Delivered in as few as 5 days

ĄĄ Local and global design and product support ĄĄ Drawings and models available ĄĄ Part and quantity restrictions may apply picmg.opensystemsmedia.com/p367481

PentairProtect.com 24

AskSchroff@pentair.com  1-800-525-4682 

| Spring 2015 | PICMG Systems & Technology Resource Guide www.picmg-systems.com

450/40 and 300/40 Series ATCA Systems 450/40 and 300/40 ATCA chassis are designed to support the next generation of ATCA board requirements, minimizing the time to market for critical, high-availability applications where high performance is crucial.

With superior physical construction, optimal cooling, reliable power supplies, efficient data distribution and secure system management, Pentair’s Schroff ATCA solutions are your choice for a dependable solution.

The 450/40 series ATCA systems offer generous head room for power and cooling capabilities. Both product families feature Pentair’s leading edge 40 Gbps backplane design, shelf management and proven hardware quality.

Deploying these chassis – ensure your integrated solutions will continue to perform at the highest level as network requirements grow and higher performing ATCA boards become available.

FEATURES ĄĄ 2, 6 and 14 slot backplanes ĄĄ 40 Gbps (10GBASE-KR) transmission rate ĄĄ Up to 450 watts/slot cooling ĄĄ AC & DC power entry modules ĄĄ Various cooling configurations available ĄĄ Designed to meet NEBS, PICMG 3.0 ĄĄ Proven performance, test reports available picmg.opensystemsmedia.com/p370348

 AskSchroff@pentair.com  1-800-525-4682

PentairProtect.com

COM Express

COM Express Vision PC Active Silicon’s COM Express embedded vision solutions are driven by a customer request for a long product life embedded PC. Active Silicon can help specify, design and manufacture an embedded system that will remain fit, form and function identical for many years. We can integrate any type of video acquisition along with all the standard interfaces such as USB3, HDMI, GigE, eSATA etc. plus expansion options using PCI Express.

The COM Express architecture is ideally suited to rugged applications and is designed with reliability and long product life in mind. The mezzanine standard allows a wide variety of third party processor modules to be fitted to the custom carrier card and the processor module can be replaced, while keeping key functionality identical. Supported operating systems include Windows Embedded, Linux, and also QNX. Areas where COM Express products are widely used include markets with regulatory control and the requirement for high reliability as is the case for complex medical machines for X-ray, CT, and cancer treatment or machine vision in industries like pharmaceutical packaging, quality control and food processing. Custom embedded systems are also commonly found in extremely rugged military applications including UAV and in traffic markets such as speed cameras and vehicle identification.

FEATURES ĄĄ COM Express Mezzanine standard ĄĄ Custom carrier card to suit the application ĄĄ Camera Link, CoaXPress and 3G-SDI ĄĄ USB3, HDMI, GigE, eSATA ĄĄ PCIe expansion capability ĄĄ Stable product supply ĄĄ Rugged and highly reliable ĄĄ Extended temperature environment supported ĄĄ Ideal for long life products picmg.opensystemsmedia.com/p372656

Active Silicon

www.activesilicon.com www.picmg-systems.com



info@activesilicon.com

 +44 (0) 1753 650 600 twitter.com/activesilicon

 https://uk.linkedin.com/company/active-silicon 

PICMG Systems & Technology Resource Guide | Spring 2015 |

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PICMG Systems & Technology Resource Guide

AdvancedTCA

PICMG Systems & Technology Resource Guide

Com Express

cExpress-BL COM Express® Type 6 Compact Module The ADLINK cExpress-BL computer-on-module with built-in SEMA Cloud functionality is ready-made for Internet of Things (IoT) applications. The cExpress-BL features a 5th Generation Intel® Core™ i7/i5/i3 processor and is suitable for fanless, edge device solutions that demand intense graphics performance and multi-tasking capabilities in a spaceconstrained environment, such as digital signage for medical, transport and retail, or machine vision applications in factory automation.

FEATURES ĄĄ 5th generation Intel® Core™ i7/i5/i3 and Celeron™ processor

System-on-Chip

ĄĄ Up to 16 GB dual channel DDR3L at 1600/1333 MHz

ADLINK's cExpress-BL is also equipped with our Smart Embedded Management Agent (SEMA) to allow access to detailed system activities at the device level, including temperature, voltage and power consumption. Information can be analyzed using our SEMA Cloud portal, which also provides users the ability to set alerts and connect and configure one-to-many remote devices.

ĄĄ Two DDI channels, one LVDS supporting 3 independent displays ĄĄ Dual channel 18/24-bit LVDS (or optional eDP) ĄĄ Four PCIe x1 or 1 PCIe x4, Gigabit Ethernet ĄĄ Four SATA 6 Gb/s, two USB 3.0, six USB 2.0 ĄĄ Supports Smart Embedded Management Agent (SEMA) functions ĄĄ Extreme Rugged™ operating temperature: -40 °C to +85 °C (optional) picmg.opensystemsmedia.com/p372657  angela.torres@adlinktech.com  408-360-0200

ADLINK

www.adlinktech.com/PD/web/PD_detail.php?cKind=&pid=1495

COM Express

LSF-02 The LSF-02 is a rugged environmentally sealed tactical computing and communications platform, ideal for vehicle and man-pack applications.

The LSF-02 was designed to be easily customizable. The COM-Express based architecture provides flexibility to meet different performance and power envelopes. Support for 2 Mini-PCIe slots provides options for Mil-Std-1553, ARINC 429/575/717, CAN bus, WiFi or Cellular modems.

The platform also has room for 2 additional add in cards. Two optional Mil-Std 2590 batteries allows the platform to be unmounted and be used in man-pack applications.

FEATURES ĄĄ Customizable Payload

2 mini-PCIe expansion slots, Space for 2 additional add-in cards 6.9" x 6.9" 7" x 6.83"

ĄĄ Power

• Computing: 4th Generation Intel Core i7-4700E 2.4GHz, QM87 Express Chipset, 2 x 8GB DDR3L-1600 SO-DIMM dual channel

9-36VDC Input, Optional dual Mil-2590 Batteries

ĄĄ Physical

4.6"(H) x 9.5" (W) x 12.25" (L) Weight: <20 lbs Watertight to IP67 Operational: -40C to 70C Shock: 30g/11ms per Mil-810F Method 516.5

• Storage: Removable 2.5" SSD, Optional mSATA • I/O: 2 GbE, 4 USB 2.0, VGA Display port, RS-232 or RS-422/485 (no handshaking signal)

picmg.opensystemsmedia.com/p372665

LCR Embedded Systems

www.lcrembeddedsystems.com

26

Sales@lcrembedded.com  1-800-747-5972 

| Spring 2015 | PICMG Systems & Technology Resource Guide www.picmg-systems.com

CompactPCI Solutions Since its inception back in the mid 1990's CompactPCI has worked its way into some of the most mission critical applications on this planet. It can be found at the nerve-centre of the world's most hi-tech trains, at the core of the telecommunication network, switching calls and providing critical signalling information in essential core network elements.

In both its commercial and ruggedized form, CompactPCI controls industrial and chemical plants, while in the military arena it is employed for battle coordination managing vital communications and command functionality. Many top tier equipment providers have been deploying Advantech CompactPCI platforms within systems like these; systems upon which the world’s networking infrastructure still relies, and upon which chemical plants and power stations depend for the safe and secure continuation of their processes.

Advantech has been a key player in CompactPCI development for well over a decade now, assisting rugged and industrial OEMs as well as telecom equipment manufacturers to design and integrate CompactPCI in their business and mission critical systems. We understand the impact which the discontinuation of a component can have on a customer’s product portfolio and we have solid lifecycle management processes in place to handle it. We’ve also learnt how to step in when a key supplier announces the end of a product line and a second source blade is urgently needed which meets the same form, fit and function.

Customized COTS – Just What You Need When You Have a Unique Problem to Solve Customization at Advantech doesn’t just stop at branding. We realise that no two suppliers’ seemingly identical CompactPCI blades are exactly the same and that features may differ in various ways like a missing I/O port or connector or often custom IPMI features which aren’t implemented. That’s where our Customized COTS (C2OTS) program comes into play. Because we design our standard products with later customization in mind our processes are tailored to support the customized COTS business model. We offer significant flexibility over a “standard-product-only” roadmap by supporting changes ranging from branding, cost optimization, mechanical and schematic changes as well as the integration of a customer’s proprietary IP. We believe that this modus operandi is critical to the long term success of CompactPCI and have adapted our development and manufacturing strategies to encourage customization innovation, delivering complex CompactPCI products uniquely tailored to meet customer’s needs without sacrificing the economy of scale offered by standard off the shelf products.

Your OEM Blade There’s almost always a special feature that your customer needs you to integrate to meet a specific requirement. Its been that way since CompactPCI started and spans back even further to the early days of VMEbus. Mezzanine card technology has evolved in various form factors and with different interconnects help address the problems caused by over-customization. But when the rubber meets the road and you can’t find that feature on COTS products, you need a partner who is ready to go the extra mile and is geared to helping you re-engineer a product to meet your needs. Advantech’s CompactPCI customization team is here to identify and scope your special requests.

Below are some of the latest products from Advantech’s CompactPCI portfolio: 3U CompactPCI and PlusIO Products ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ

MIC-3022/3023 – • 4U/3U CompactPCI® Enclosures for 3U Blades MIC-3328 – • 3U CompactPCI PlusIO Intel® Core™ i7 Processor Blade MIC-3325/3326 – • Intel® Atom™ N455/D525 Low Power Processor Blade MIC-3954 – • 3U CompactPCI PlusIO Serial Peripheral Carrier MIC-3955 – • 4-port RS-232/422/485 Communication Card MIC-3756/3758 – • 64-ch/128-ch Digital I/O Cards

6U CompactPCI Products ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ

MIC-3042/3043 – • 4U CompactPCI® Enclosures for 6U Blades MIC-3398 – • 6U SBC with Intel® Atom™ E3845/Celeron® J1900 MIC-3397 – • 6U SBC with Intel® Xeon® E3/Pentium® Processor MIC-3396 – • 6U SBC with 4th generation Intel® Core™ processor MIC-3395 MIL – • Intel® Core™ i7 Rugged Processor Blade with ECC CPCI-8220 – • Freescale QorIQ P2040 Dual PMC Processor Board picmg.opensystemsmedia.com/p372658

Advantech Co Ltd

www.advantech.com/compactpci www.picmg-systems.com



ncg@advantech.com

 twitter.com/AdvantechNCG PICMG Systems & Technology Resource Guide | Spring 2015 |

27

PICMG Systems & Technology Resource Guide

CompactPCI

PICMG Systems & Technology Resource Guide

CompactPCI

CompactPCI Serial Shelf Boards and Systems Founded in 1972, EKF Elektronik has a long history in the embedded computing business. With a background of more than 30 years in modular eurocard system design, EKF is a leading vendor of CompactPCI technology, and offers continued lifecycle support for a wide range of ”classic“ CompactPCI products, in addition to the latest CPU boards, peripheral cards, and systems defined under the PICMG CompactPCI Plus I/O and CompactPCI Serial standards. EKF offers boards and systems for standard and extended temperature ranges, as well as sealing and coating on request. PMC and XMC mezzanine modules expand the product portfolio. The EKF lifetime policy guarantees long-term avail- ability for all EKF products, while a three-year standard warranty protects your investment.

EKF offers a wide range of the latest CompactPI Serial shelf boards and systems, as well as custom solution services. picmg.opensystemsmedia.com/p372676

 sales@ekf.de  0049-2381-6890-0

EKF Elektronik www.ekf.com

CompactPCI

Intermas – InterRail Intermas develops electronic enclosure systems: Cabinets, housings, subracks, and an extensive range of accessories for the 19" rack systems used in the fields of PCI, VME/VME64x, cPCI, IEEE, and communication applications with state-of-the-art EMI- and RFI-shielded protection.

Intermas has an extensive product range of more than 10,000 separate components and more than 30 years’ experience.

FEATURES ĄĄ InterRail® products meet tough physical demands and vibration

proofs used for railway engineering, traffic engineering, and power station engineering.

ĄĄ 19" subracks and housings with flexible internal layout.

Go to

ĄĄ EMI- and RFI-shielded protection using stable stainless steel

contact springs ensuring permanent and reliable bonding.

www.Intermas-US.com

ĄĄ Connectors and wiring accessories.

for our new catalog.

ĄĄ Customization available. picmg.opensystemsmedia.com/p372664

Intermas US LLC

www.Intermas-US.com

28

intermas@intermas-us.com  800-811-0236 

| Spring 2015 | PICMG Systems & Technology Resource Guide www.picmg-systems.com

G101, 3U flexible multiport Gigabit Ethernet switch MEN Micro Inc. recently released the new G101, a managed 3U flexible multiport Gigabit Ethernet switch, with a 29 GBit/s switch matrix, implemented as a CompactPCI Serial board.

Specifically designed for rugged mobile communication in harsh environments, the new Ethernet switch conforms to the EN 50155 railway standard. The high bandwidth of the 29 GBit Switch matrix, robust design and wide operating temperature of -40°C to +85°C make MEN Micro’s new G101 ideally suited for railway applications.

FEATURES

The G101 features a total of up to 25 Gigabit Ethernet ports. They can all be connected to the rear or three can be used on the front, either as three robust M12 connectors or as two RJ45 connectors with a 2.5 Gb SFP interface. This interface can be used as a high speed uplink via fiber technology.

ĄĄ Managed 3U rugged Gigabit Ethernet switch ĄĄ CompactPCI Serial design ĄĄ 29 Gbit/s carrier grade switch matrix ĄĄ Up to 25 Gigabit Ethernet ports; all on rear I/O or 3 on front and

22 on rear

The 29 GBit switch matrix incorporates different software protocols to ensure high speed and high efficiency and the large software pool enables various protocols like security, synchronous Ethernet and stability as well as for temperature needs. The G101 supports IEEE1588v2 on ports 1 to 12 and EEE (Energy Efficient Ethernet) as a standard on all ports.

ĄĄ Wide -40°C to +85°C operating temperature ĄĄ EN 50155 compliant; rugged construction for reliable operation

in harsh environments

picmg.opensystemsmedia.com/p372666

MEN Micro Inc.

www.menmicro.com



Stephen.Cunha@menmicro.com

facebook.com/MENMicro

 www.linkedin.com/company/men-micro-inc-  twitter.com/MENMicro CompactPCI

NIU1A – Embedded I/O System – Nano Interface Unit I/O Interface with optional ARM1 Processor Configure to Customize

FEATURES

The NIU1A is a small, rugged, low-power system. It consists of an integrated power supply, one function slot that can be configured with a field-proven NAI intelligent I/O and communications function module and an optional ARM Cortex-A9 processor. Ideally suited for rugged Mil-Aero applications, the NIU1A delivers off-the-shelf solutions that accelerate deployment of SWaP-optimized systems in air, land and sea applications.

Supports 1 Intelligent I/O function module 2x 10/100/1000 Base-T Ethernet 1.5"H x 1.7"D x 6.8"L @ 16 oz. (454 g) with 3 mounting options 128 MB DDR3 SDRAM Optional ARM Cortex™-A9 Dual Core 800MHz Processor 4 GB SATA II NAND Flash (up to 32 GB option) < 15 W power dissipation Wind River® Linux, VxWorks®, Altera Linux OS Support 1x RS232 Continuous Background BIT Operating temp: -40°C to +71°C conduction cooled Made in the USA Certified Small Business ĄĄ 28 VDC input ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ

Architected for Versatility NAI’s Custom-On-Standard Architecture™ (COSA™) offers a choice of over 40 intelligent I/O and communications options. Pre-existing, fully-tested functions can be selected to quickly and easily meet system requirements.

Individually dedicated I/O and communications processors allow mission computers to manage, monitor and control via single or dual Ethernet.

All products are designed to operate under extreme temperature, shock, vibration and EMI environments. EMI filters and gaskets meet or exceed MIL-STD-461F and MIL-STD-810G requirements.

picmg.opensystemsmedia.com/p372667

North Atlantic Industries, Inc. www.naii.com

www.picmg-systems.com

www.naii.com  631-567-1100 

PICMG Systems & Technology Resource Guide | Spring 2015 |

29

PICMG Systems & Technology Resource Guide

CompactPCI

PICMG Systems & Technology Resource Guide

CompactPCI

cPCI, PXI, VME, Custom Packaging Solutions VME and VME64x, CompactPCI, or PXI chassis are available in many configurations from 1U to 12U, 2 to 21 slots, with many power options up to 1,200 watts. Dual hot-swap is available in AC or DC versions. We have in-house design, manufacturing capabilities, and in-process controls. All Vector chassis and backplanes are manufactured in the USA and are available with custom modifications and the shortest lead times in the industry.

Series 2370 chassis offer the lowest profile per slot. Cards are inserted horizontally from the front, and 80mm rear I/O backplane slot configuration is also available. Chassis are available from 1U, 2 slots up to 7U, 12 slots for VME, CompactPCI, or PXI. All chassis are IEEE 1101.10/11 compliant with hot-swap, plug-in AC or DC power options.

Our Series 400 enclosures feature side-filtered air intake and rear exhaust for up to 21 vertical cards. Options include hot-swap, plug-in AC or DC power, and system voltage/temperature monitor.

Embedded power supplies are available up to 1,200 watts.

Series 790 is MIL-STD-461D/E compliant and certified, economical, and lighter weight than most enclosures available today. It is available in 3U, 4U, and 5U models up to 7 horizontal slots.

All Vector chassis are available for custom modification in the shortest time frame. Many factory paint colors are available and can be specified with Federal Standard or RAL numbers.

For more detailed product information,

FEATURES ĄĄ

Made in the USA

ĄĄ

Most rack accessories ship from stock

ĄĄ

Modified ‘standards’ and customization are our specialty

ĄĄ

Card sizes from 3U x 160mm to 9U x 400mm

ĄĄ

System monitoring option (CMM)

ĄĄ

AC or DC power input

ĄĄ

Power options up to 1,200 watts

please visit www.vectorelect.com or call 1-800-423-5659 and discuss your application with a Vector representative.

picmg.opensystemsmedia.com/p371649

Vector Electronics & Technology, Inc. www.vectorelect.com

30

 inquire@vectorelect.com  800-423-5659

| Spring 2015 | PICMG Systems & Technology Resource Guide www.picmg-systems.com

cPCI-VPX-VME Packaging Solutions Pixus Technologies provides Eurocard packaging solutions for CompactPCI, VPX, and VME architectures. Pixus supports a wide range of telecom, industrial, military, aerospace, scientific, medical, and transportation applications.

Pixus CompactPCI, VPX, and VME packaging solutions include subracks, enclosures, backplanes, chassis, and integrated system platforms. In addition, Pixus provides components and accessories such as fans, power supplies, card guides, guide rails, front panels, filler panels, and handles.

MicroTCA systems from Pixus leverage over 20 years of superior cooling, backplane, and packaging innovation with proven Pixus and Rittal technologies. MicroTCA chassis and systems can be modified to meet customer requirements without NRE.

FEATURES CompactPCI ĄĄ 1U – 13U rackmount and desktop units supporting 2 to 21 slot cPCI backplanes ĄĄ Conform to CompactPCI PICMG 2.0 specification VPX & OpenVPX ĄĄ 1U – 9U rackmount and desktop units supporting 2 to 21 slot VPX and OpenVPX backplanes ĄĄ Complies with VITA 46, VITA 48, VITA 65 VITA 1, VITA 1.1, IEC 60 297-3 and IEEE 1101.1/1101.10/1101.11 VME & VME64x ĄĄ 1U – 9U rackmount and desktop units supporting 2 to 21 slot VME and VME64x backplanes ĄĄ Complies with VITA 1, VITA 1.1, IEC 60 297-3 and IEEE 1101.1/1101.10/1101.11 picmg.opensystemsmedia.com/p372669

Enclosures Cases Subracks Backplanes Chassis Integrated Systems Components

 sales@pixustechnologies.com  519-885-5775

Pixus Technologies

www.pixustechnologies.com

Front Panel Hardware

Faceplate Hardware Southco AdvancedTCA access and alignment hardware provides the total solution of all faceplate hardware needed for complete PICMG 3.0 compliance.

These ergonomic Southco handles secure AdvancedTCA faceplates. The handles also ensure proper interface with microswitches to signal a graceful power-down sequence during hot-swap operation. All Southco AdvancedTCA compliant hardware can be tailored to user-specified configurations.

Optional custom-color powder-coated handles are available to enhance aesthetics or color-code components.

All of these Southco solutions provide finishes that are RoHS-compliant and other attributes gained from years of Southco access hardware experience – such as robust diecast construction, ergonomic molded handle grips, and precision machining to ensure precise fit.

FEATURES ĄĄ Push-to-close handles actuate microswitches, while spring-loaded

secondary catches lock boards in position

ĄĄ Narrow handle design takes minimal space, yet provides ample

ergonomic grip for easy board removal

ĄĄ Handles fit faceplates from 0.8 mm to 2.5 mm thick and

accommodate lever-, plunger-, or custom-microswitches

ĄĄ Captive screws are available in multiple styles for easy manual

tightening, including color-coated knobs ĄĄ Alignment/grounding pins in multiple lengths feature smooth bullet nose design for easy alignment/insertion ĄĄ Alignment and keying modules in multiple pin/receptacle configurations are economical and extremely durable picmg.opensystemsmedia.com/p372533

Southco

www.southco.com/ATCAresource www.picmg-systems.com

info@southco.com  610-459-4000 

PICMG Systems & Technology Resource Guide | Spring 2015 |

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PICMG Systems & Technology Resource Guide

CompactPCI

PICMG Systems & Technology Resource Guide

DSP-FPGA Boards

Wild40 Seven Slot OpenVPX 3U Chassis The Wild40 Seven Slot OpenVPX 3U Chassis is an OpenVPX-compatible chassis capable of accepting up to six 3U tall by 160mm OpenVPX Payload Front Plug-in Modules (FPMs) and one 3U tall by 160mm OpenVPX Switch FPM and up to seven 3U tall by 80mm Rear ''''Transition Modules (RTMs). Plug-in Module slot spacing is 1″.

This chassis is equipped with a very high performance backplane which is capable of Serial I/O signaling at rates up to 10Gbps on the Data and Expansion Planes. The Data Plane of the backplane is connected to adjacent slots with one Fat Pipe connection. The Expansion Plane is a 3 slot star with two Fat Pipes connecting slots.

The Wild40 Seven Slot OpenVPX 3U Chassis includes a Chassis Monitoring system which displays DC voltages, slot temperatures and fan Revolutions Per Minute (RPMs) on the front panel of the chassis and can be used to set fan speed. The Chassis Monitor can be accessed and controlled remotely via the Serial or Ethernet interfaces.

FEATURES ĄĄ

6U High with Front Mounted OpenVPX Card Cage

ĄĄ

7 Slot OpenVPX 40Gb+ Mesh Backplane with RTM Support

ĄĄ

1534 Watt Power Supply

ĄĄ

ĄĄ

The card cage is recessed from the front of the chassis so that cabling can be used between Plug-in Modules and be contained within the frame of the chassis.

ĄĄ

Radial clocking for AUXCLK and REFCLK with chassis input SMAs Payload Profile: SLT3-PAY-2F1F2U-14.2.1 and SLT3-PAY-2F4F2U-14.2.11 Switch Profile: SLT3-SWH-2F24U-14.4.3 or SLT3-SWH-2F4T16U-14.4.11

Annapolis is famous for the high quality of our products and for our unparalleled dedication to ensuring that the customer’s applications succeed.

We offer training and exceptional special application development support, as well as more conventional support.

picmg.opensystemsmedia.com/p372672

Annapolis Micro Systems, Inc. www.annapmicro.com

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 wfinfo@annapmicro.com  410-841-2514

| Spring 2015 | PICMG Systems & Technology Resource Guide www.picmg-systems.com

Wild40 12-Slot OpenVPX 6U Chassis 11U Rack mountable, 12-slot OpenVPX chassis with OpenVPX switched topology backplane capable of 10Gbps+ signalling compromising of 2 switch and 10 payload 1" slots. Option of additional secondary 4-slot OpenVPX power-only (Shown) or 5-slot VME/VXS backplane.

The Wild40 12-Slot OpenVPX 6U Chassis is an OpenVPX-compatible (VITA 65) chassis capable of accepting up to ten 6U tall by 160mm OpenVPX Payload Front Plug-in Modules (FPMs) and two 6U tall by 160mm OpenVPX Switch FPMs and up to twelve 6U tall by 80mm Rear Transition Modules (RTMs) in its Primary Backplane. Plug-in Module slot spacing is 1″ VITA 48.1.

The Wild40 12-Slot OpenVPX 6U Chassis’ Primary Backplane is a very high performance backplane which is capable of Serial I/O signaling at rates up to 10Gbps on the Data Plane and up to 8Gbps on the Expansion Plane. The Data Plane of the backplane is arranged in a dual-star configuration with two Fat Pipe connections from each Switch Slot to each Payload Slot. The Expansion Plane is a chain connecting adjacent Payload Slots.

In addition to the Primary Backplane there is also an option for a Secondary 4-Slot VPX Power-Only or 5-slot VME/VXS Backplane. The 4-slot VPX backplane supports four OpenVPX VITA65 slots with a 1″ VITA 48.1 slot spacing. These slots are not connected to each other on the Data or Expansion Planes, instead all of their connections go straight through the backplane to the RTM backplane connectors.

These slots are ideally suited for Clock Distribution boards, Tuners or other non-IO intensive FPMs. The chassis includes a Chassis Monitoring system which displays DC voltages, slot temperatures and fan Revolutions Per Minute (RPMs) on the front panel of the chassis and can be used to set fan speed.

The Chassis Monitor can be accessed and controlled remotely via the Serial or Ethernet interfaces.

The card cage is recessed from the front of the chassis so that cabling can be used between Plug-in Modules and be contained within the frame of the chassis.

FEATURES ĄĄ ĄĄ

ĄĄ

10U High with Front Mounted OpenVPX Card Cage Primary 12 Slot OpenVPX High Speed Switched Backplane with RTM Support Optional Secondary 5 Slot VME/VXS or 4 slot VPX Backplane for Power Only Payload Cards

ĄĄ

Up to 3200 Watt Power Supply

ĄĄ

Backplane Profile: BKP6-CEN12-11.2.X

ĄĄ

Payload Profile: SLT6-PAY-4F1Q2U2T-10.2.1

ĄĄ

Switch Profile: SLT6-SWH-16U20F-10.4.2

Annapolis is famous for the high quality of our products and for our unparalleled dedication to ensuring that the customer’s applications succeed.

We offer training and exceptional special application development support, as well as more conventional support. picmg.opensystemsmedia.com/p372673

Annapolis Micro Systems, Inc. www.annapmicro.com www.picmg-systems.com

 wfinfo@annapmicro.com  410-841-2514

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WILD Data Storage Solution When Storage capability is needed, Annapolis offers the highest density OpenVPX storage solutions on the market with up to 9.3 TB of capacity in a single 1" slot with up to 4.5 GB/s of write bandwidth. It also features a removable hot swappable canister with a connector rated for 10,000+ mating cycles. The WILD Data Storage Solution comes with standard images to support XAUI, 40GbE and AnnapMicro Protocol (Annapolis low FPGA utilization, full flow control protocol ideal for inter-FPGA communication).

The WILD Data Storage Solution is comprised of two pieces fitting in a single 1" OpenVPX slot, the “storage canister” which holds up to 12 1.8" SATA disks, and the “Storage Carrier” that plugs into the VPX backplane and holds the disk canister.

The Storage Carrier/Canister is specifically designed to support 10,000+ insertion cycles of the disk canister for frequent drive removal. Both the canister and the entire assembly (Storage Canister + Storage Carrier) are also hot swappable for minimum system down time and highest reliability. This OpenVPX compliant payload card supports 40Gb serial I/O on the VPX Data Plane on P1 to support four channels of 40GbE (proper backplane required for faster rates).

To ensure safe and reliable processing, WILD Data Storage Solution boards come equipped with a proactive thermal management system.

Sensors across the board monitor power and temperature, with automatic shutdown capability to prevent excessive heat buildup. WILD Data Storage Solution boards are built with a rugged, durable design.

Sensors can be accessed with a chassis manager (ChMC).

New heatsinks have been tested with great success on WILD Data Storage Solution boards. These larger heatsinks also act as stiffeners for the boards, making them sturdier.

FEATURES ĄĄ General Features

• 9.3 TB of Storage Per Each 6U VITA 65 Compliant OpenVPX Slot • Up to 4.5 GB/s Write and Up to 5 GB/s Read Bandwidth (write bandwidth determined by system environmentals) • Scalable Depth and Bandwidth • Hot Swappable Drive Canister with 10,000 Insertion Cycles & Hot Swappable Carrier (exclusive to WILDSTAR OpenVPX EcoSystem)

ĄĄ Backplane I/O

• Up to 40Gb Ethernet on each of Four Fat Pipes on P1, for a total of 20GB/s on P1 • 1 Additional Fat Pipe on P4 providing QSFP+ connection via RTM • 1Gb Ethernet Connection on P4

ĄĄ System Management

• Client/Server Interface for WILDSTAR FPGA Boards and Linux and Windows-based CPU systems • Extensive System and Drive Diagnostic Monitoring and Configuration over 1 Gb Ethernet via P1 and P4 Ethernet • Standard Intelligent Platform Management Interface (IPMI) to Monitor Current, Voltage and Temperature • Front Panel Status LEDs for all 12 SSDs and all Backplane Control and Data Plane Connections

ĄĄ Physical Features

• 6U OpenVPX (VITA 65) Compliant, 1" VITA 48.1 spacing • Supports OpenVPX Payload Profile: MOD6-PAY-4F1Q2U2T-12.2.1-n • Integrated Heat Sink • Air Cooled with Product Path to Conduction Cooling picmg.opensystemsmedia.com/p372456

Annapolis Micro Systems, Inc. www.annapmicro.com

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 wfinfo@annapmicro.com  410-841-2514

| Spring 2015 | PICMG Systems & Technology Resource Guide www.picmg-systems.com

WILD OpenVPX 40 Gb Ethernet and FDR Infiniband Switch The WILD OpenVPX 14Gbit Switch Card supports 1GbE, XAUI, 10GbE, 40GbE, 56GbE, and SDR/DDR/QDR/FDR Infiniband. It has dual 1/10GbE SFP+ front panel control plane uplinks and eight front panel data plane QSFPs. It supports up to 20 1GbE backplane control plane connections and 20 XAUI/40GbE/Infiniband data plane connections.

The WILD OpenVPX 14Gbit Switch Card is extremely versatile since it is capable of switching both Infiniband (SDR, DDR, QDR, FDR) and Ethernet (1Gb, 10Gb, 40Gb, 56Gb) traffic with up to 4 Tb/s of nonblocking switching capacity. The WILD OpenVPX 40 Gb Ethernet and FDR Infiniband Switch also supports chassis management and can act as a Chassis Manager (ChMC). The 1Gb Ethernet control plane supports up to 20 backplane ports and two front panel SFP+ which can run at 1GbE or 10GbE. The data and control planes are located on different virtual networks to ensure best performance on each.

Basic configuration is streamlined where all required features are selected by DIP switches. A front panel USB serial port allows configuration of management Ethernet interfaces if needed (DHCP is the default configuration). Software updates, if needed, are completed via a simple web interface which can also be disabled via USB serial console. Front panel status LEDs show the status of every switch port (link/activity) as well as overall status and health of the WILD OpenVPX 40 Gb Ethernet and FDR Infiniband Switch.

The front panel RJ45 10/100/1000 BASE-T Ethernet port is used for switch management and is connected directly to the on-board PowerPC. There is also an optional “in band” Ethernet connection from the PowerPC to the control plane. Note that not all switch configurations support the “in-band” management connection.

FEATURES ĄĄ MultiProtocol Switch

• 1/10/40/56 Gb Ethernet and SDR/DDR/QDR/FDR Infiniband • Up to Four Tb/s Non-Blocking Switching Capacity with up to Eight Switch Partitions

ĄĄ Backplane & Front panel I/O

• Backplane Ports: Twenty High Speed Four Lane Data Plane Connections, Sixteen 1Gb Ethernet Lanes • Front Panel Ports: Eight QSFP+, Two SFP+, RJ45 Management Port, USB UART, Status LEDs • Each Backplane and Front Panel Port can be Configured for either Infiniband or Ethernet • Infiniband and IP Routing • Ethernet Gateways

ĄĄ System Management

• System Management using Intelligent Platform Management Interface (IPMI) • Diagnostic monitoring and configuration • Current, Voltage and Temperature Monitoring Sensors • Hot Swappable (exclusive to WILDSTAR OpenVPX EcoSystem)

ĄĄ Mechanical and Environmental

• 6U OpenVPX (VITA 65) Compliant, 1" VITA 48.1 spacing • Supports OpenVPX Slot Profile: SLT6-SWH-16U20F-10.4.2-n • Integrated Heat Sink and Board Stiffener

picmg.opensystemsmedia.com/p372674

Annapolis Micro Systems, Inc. www.annapmicro.com www.picmg-systems.com

 wfinfo@annapmicro.com  410-841-2514

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DSP-FPGA Boards

WILDSTAR 7 for OpenVPX 3U The WILDSTAR 7 for OpenVPX 3U contains one VX690T or VX980T Virtex 7 FPGA per board with up to 2 GB of DDR3 DRAM for 12.8 GB/s of DRAM bandwidth and up to 32 MB of QDRII+ SRAM for 8 GB/s of SRAM bandwidth. It has up to 1 million logic cells and 1.6 million multiplier bits per board.

These FPGA boards include a Xilinx Virtex 7 FPGA with 64 High Speed Serial connections performing up to 13.1 Gbps. There is two 36-bit QDRII+ SRAM interfaces clocked up to 500 MHz and two 32-bit DDR3 DRAM ports clocked at up to 800 MHz. With included High Speed Serial (HSS) FPGA cores (including 40GBASE-KR), there is up 10 GB/s of bandwidth on the VPX data plane which can go directly to other VPX cards or to a switch, depending on backplane topology. In addition, there is up to 20 GB/s of bandwidth on the VPX Expansion Place. When using 40GBASE-KR, there is the added reliability of Forward Error Correction (FEC) to achieve a much lower Bit Error Rate (BER).

If IO is required, Annapolis offers extraordinary density, bandwidth and analog conversion choices. Each 3U card has 1 mezzanine IO sites which can support up to 2 WILDSTAR Mezzanine cards as well as a QSFP+ option (on WS7 and WS A5 board) that allows for 3 QSFP+ transceivers per slot. These options can be mix and matched to meet customer needs. Some configurations utilize a second slot (for example the QSFP+ option and WILDSTAR Mezzanine card used in a single IO Site).

WILDSTAR A5 and V7 FPGA boards are hot swappable allowing for more system reliability. This feature is unique to Annapolis and was developed because our experience with OpenVPX systems has shown it invaluable so a whole chassis does not need to be shutdown to remove a single board.

Annapolis OpenVPX FPGA cards include an on-board dual core 1.2 GHz PowerPC with direct FPGA 4x PCIe connection which can be used by customers for application requirements. It is also used query board health like FPGA temperature and power. It is connected to the OpenVPX control plane via 1GbE. There are also plenty of user backplane signals available on the Annapolis 6U Rear Transition Module (RTM) such as LVDS, FPGA HSS, IRIG, Ethernet and clocking. RTM HSS is also capable of 10Gbps signalling and supports multiple channels of 40GbE.

FEATURES ĄĄ General Features • One Xilinx Virtex 7 VX690T or VX980T FPGA • Up to 2 GB of DDR3 DRAM for 12.8 GB/s of DRAM bandwidth • Up to 32 MB of QDRII+ SRAM for 8 GB/s of SRAM bandwidth ĄĄ Backplane I/O • 24x High Speed Serial IO lanes to VPX Backplane (P1/P2) for 30 GB/s of Full Duplex Bandwidth • Two PCIe Gen3 8x Connections to VPX Backplane (P1) • Eight LVDS lines to P2 • Backplane Protocol Agnostic connections support 10/40Gb Ethernet, SDR/DDR/QDR Infiniband, AnnapMicro protocol and user designed protocols • External clock and IRIG-B Support via Backplane • Radial Backplane Clock Support for OpenVPX backplane signals AUXCLK and REFCLK ĄĄ Front Panel I/O • Accepts Standard Annapolis WILDSTAR Mezzanine Cards, including a wide variety of WILDSTAR ADC and DAC Mezzanine Cards • Three optional built-in Front Panel QSFP+ Transceivers running at up to 52.4 Gbps each for 39 GB/s of Full Duplex Bandwidth • Simultaneous QSFP and Mezzanine Card use • QSFP+ Protocol Agnostic connections support 10/40Gb Ethernet, SDR/DDR/QDR Infiniband, AnnapMicro protocol and userdesigned protocols ĄĄ Dual Core Processor APM86290 • Host Software: Linux API and Device Drivers • Each core runs up to 1.2 GHz • 2 GB of DDR3 DRAM • 4 GB SATA SSD and 16MB NOR Boot Flash • 4x PCIe Gen2 connection to Virtex 7 FPGA ĄĄ Application Development • Full CoreFire Next™ Board Support Package for Fast and Easy Application Development • 10/40Gb Ethernet and AnnapMicro Protocol Cores Included • Open VHDL Model including Source Code for Hardware Interfaces • Open VHDL IP Package for Communication Interfaces • Chipscope Access through RTM ĄĄ System Management • System Management using Intelligent Platform Management Interface (IPMI) • Diagnostic monitoring and configuration • Current, Voltage and Temperature Monitoring Sensors • Hot Swappable (exclusive to WILDSTAR OpenVPX EcoSystem) ĄĄ Mechanical and Environmental • 3U OpenVPX (VITA 65) Compliant, 1" VITA 48.1 spacing • Supports OpenVPX payload profile: MOD3-PAY-2F4F2U-16.2.10-n • Integrated Heat Sink and Board Stiffener • Available in Extended Temperature Grades • Air Cooled with Conduction Cooled path • RTM available for additional I/O picmg.opensystemsmedia.com/p372457

Annapolis Micro Systems, Inc. www.annapmicro.com

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 wfinfo@annapmicro.com  410-841-2514

| Spring 2015 | PICMG Systems & Technology Resource Guide www.picmg-systems.com

WILDSTAR G2 Dual 1.5 GSps 12-Bit ADC & DAC Mezzanine Card This ultra low latency Dual 1.5GSps ADC/DAC card is specifically designed for DRFM applications with 24ns latency from SMA to SMA. The WILDSTAR G2 Dual 1.5 GSps 12-Bit ADC & DAC Mezzanine Card was designed from the ground up for latency sensitive DRFM applications. The Board Support Interface, which is available in VHDL or CoreFire Application Design Suite, was also designed from the beginning to be suited for DRFM applications. This interface provides a Digital Bypass Mode to achieve the lowest possible latency and a Fabric Space Mode to allow the user to do additional processing and manipulation of the ADC data before returning it out the DAC. The Fabric Space Mode adds only 14ns of latency. The Board Support Interface also includes a built-in Bypass Delay which can be controlled to be from 0 to 62 ADC sample clock periods. This allows the user to “walk” the latency out from the minimum Digital Bypass Mode latency to slightly beyond the Fabric Space Latency, providing for a smooth latency transition between the two modes.

The CoreFire Next Design Suite, Annapolis’ FPGA Design Tool, allows the user to design a 24ns latency DRFM-optimized application in minutes.

The WILDSTAR G2 Dual 1.5 GSps 12-Bit ADC & DAC Mezzanine Card is shipped with a custom heatsink which enables proper cooling of the ADC. An on-board temperature monitor is also supplied which allows for real-time monitoring of the ADC’s internal die temperature.

The WILDSTAR G2 Dual 1.5 GSps 12-Bit ADC & DAC Mezzanine Card provides high fidelity and high speed analog-to-digital conversion along with a rugged design. This card is compatible with with WILDSTAR 7 and WILDSTAR A5 mainboards.

FEATURES ĄĄ General Features

• Dual Channel ADCs and DACs running at up to 1500MSps each at 12-bits • Ultra Low latency from ADC SMA input to DAC SMA output • Digital Bypass Mode (SMA-to-SMA): < 24ns • Fabric Space Mode (SMA-to-SMA): < 39ns • Digital Bypass Mode has built-in run-time adjustable delay providing additional delay from 0ns up to 62 Sclk periods • Capability to have four ADC channels and four DAC channels in one 6U OpenVPX slot when plugged into WILDSTAR OpenVPX FPGA cards • Support for WILDSTAR 7 (Xilinx Virtex™-7) and WILDSTAR A5 (Altera Stratix® V) PCIe and OpenVPX mainboards • Firmware and Software Board Support Interface provided in CoreFire Next and VHDL source

ĄĄ ADC and DAC and Performance

• Sample Rate: 300 – 1500MHz • ADC and DAC Resolution: 12 bits

ĄĄ SMA I/O

• • • • •

Two Analog Inputs Two Analog Outputs One High Precision Trigger Input One External Clock Input Mechanical and Environmental

ĄĄ Mechanical and Environmental

• Integrated Heatsink and EMI/Crosstalk Shields • Commercial and Industrial Temperatures Available

ĄĄ Clock Synchronization

• Software-selectable external clock input or onboard clock • All ADCs on a mezzanine card are synchronized to the same sample • All ADCs across multiple mezzanine cards can be synchronized to the same sample using • WILDSTAR Clock Distribution Boards • Provides capability to configure 40+ ADC and DAC channels in one COTS Annapolis 19" OpenVPX Chassis

picmg.opensystemsmedia.com/p372675

Annapolis Micro Systems, Inc. www.annapmicro.com www.picmg-systems.com

 wfinfo@annapmicro.com  410-841-2514

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Mezzanines

PCIe-Mini-1553-2 The MIL-STD-1553 (1553) PCIe-Mini expansion module is a 2 Channel dual redundant 1553 controller module, where each controller can support BC or Multi-RT with Concurrent bus monitor. The controller can support the MIL-STD-1553 A/B and the MIL-STD-1760 traffic.

This module can operate in a Mini PCI Express slot.

Utilizing the DDC Total-AceXtreme® Engine, this 1553 card is able to perform:

FEATURES

1553 Bus Monitor (MT) • IRIG-106 Chapter 10 Compatibility • Filter Based on RT Address, T/R bit, Sub-Address • Advanced Bit Level Error Detection to Isolate Bus Failures

ĄĄ 1x Mini PCI Express Gen 1.0

1553 Remote Terminal (RT) • Emulate up to 32 RT Addresses Simultaneously • Multiple Buffering Techniques • Programmable Command Illegalization • Programmable Busy by Sub-address

ĄĄ BC or Multi-RT with Concurrent Bus Monitor

1553 Bus Controller (BC) • Streaming and Minor/Major Frame Scheduling of Messages • High and Low Priority Asynchronous Message Insertion • Modify Messages or Data while BC is running

ĄĄ Optional 8 I/O Lines

ĄĄ Dual Independent Dual Redundant MIL-STD-1553 Channel ĄĄ Two independent DDC Total-AceXtreme® Engine ĄĄ Programmable Bus Controller, Remote Terminal or Bus Monitor ĄĄ Supports MIL-STD-1553 A/B and MIL-STD-1760 ĄĄ IRIG-106 Chapter 10 MT Support ĄĄ Optional Digital Irig Input ĄĄ Support for Linux®, Windows®, VxWorks ®drivers picmg.opensystemsmedia.com/p372660

ALPHI Technology Corporation www.Alphitech.com

 Support@Alphitech.com  480-838-2428

Mezzanines

XMC Removable CFast Module The XMC Removable CFast Module is a mezzanine storage module with a dual-channel PCI Express to SATA 3 controller that is rated for a temperature range of -40C to +85C. Provides boot drive and/or disk storage for VPX, VME, cPCI, and ATCA SBCs with XMC slot.

CFast is same form factor as Compact Flash but with SATA interface thus providing faster throughput. The CFast connectors are rated for 10,000 mating cycles to support frequent insertions/removals.

FEATURES ĄĄ Adds removable SSD to your ATCA, cPCI SBC ĄĄ Boot or Storage ĄĄ XMC PCIe Gen2 x1 interface per VITA 42.3 ĄĄ Air or conduction cooled ĄĄ Uses COTS CFast drives ĄĄ CFast secured by rugged retainer clip ĄĄ 10,000 mating cycles ĄĄ CFast capacities currently up to 120GB ĄĄ 1.8" SATA version available (up to 800GB) ĄĄ PMC versions also available ĄĄ Drivers for Windows, Linux and VxWorks picmg.opensystemsmedia.com/p372671

Red Rock Technologies www.redrocktech.com

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

info@redrocktech.com

| Spring 2015 | PICMG Systems & Technology Resource Guide www.picmg-systems.com

Low Cost mTCA Asis has managed to break the mTCA chassis cost barriers without compromising on the standard’s advanced features and performance.

ASIS mTCA chassis’ unique architecture enables the use of “off-the-shelf“ server PSUs and simplified fan tray modules, while still maintaining distributed power and smart fans, as required by the mTCA standard.

• Form factor – 2U; 19"

FEATURES ĄĄ Low cost – supports the use of “off-the-shelf” server PSUs and

simplified fan tray modules.

ĄĄ Fully redundant – redundant FAN Trays and power supplies. ĄĄ High-Power Cooling – cooling power of up to 80 watts per

AMC/MCH.

• 10G/40G Backplane

ĄĄ AC Power Supply – Dual Redundant 1kW hot swappable PSU units.

• 12 mid- or compact AMCs (80W each)

ĄĄ High-speed Backplane – 10/40 GbE fat pipe; 1GbE for

Management, IPMI for FRU’s.

• 2 MCH

ĄĄ AC/DC configurations – AC 110-230 VDC.

• 300mm depth

ĄĄ Compliance – EIA Compliant; RoHS Compliant; PICMG MicroTCA.0

R1.0

• Fully redundant chassis (fan trays and power supplies)

ĄĄ Option for lower cost – Non-Redundant system. picmg.opensystemsmedia.com/p372663  sales@asis-pro.com  408-215-1510

Asis Ltd.

www.asis-pro.com

MicroTCA

MicroTCA® Systems Pixus Technologies’ MicroTCA® chassis and systems are based on the PICMG® MicroTCA.0 R1.0 specification. The 1U and 3U platforms support up to 8 AMC modules to provide a superior level of flexibility and compute density.

With support for AC and DC input power, the 19" rackmount systems support a range of applications at the edge of the network in telecom, industrial, and military environments. Applications include network appliances, deep packet inspection, surveillance, protocol conversion, and SIGINT. MicroTCA systems from Pixus leverage over 20 years of superior cooling, backplane, and packaging innovation with proven Pixus and Rittal technologies. MicroTCA chassis and systems can be modified to meet customer requirements without NRE.

FEATURES PXS1PXS0108 1U MicroTCA® Chassis ĄĄ Low cost MicroTCA platform ĄĄ Active backplane removes the need for expensive Power Entry Modules (PEMs) ĄĄ Side-to-side push-pull cooling removes the need for expensive Cooling Units (CMs) ĄĄ Supports up to 6 mid-height AMCs ĄĄ Supports 2 MCHs PXS0309 3U ATCA® Hybrid Chassis with 8 AMCs ĄĄ 19" rack mount 3U ATCA Hybrid AMC Chassis ĄĄ 1 ATCA slot and 8 mid-size AMC slots ĄĄ 40GbE or 10GbE fabric across the backplane picmg.opensystemsmedia.com/p372670

Enclosures Cases Subracks Backplanes Chassis Integrated Systems Components

Pixus Technologies

www.pixustechnologies.com www.picmg-systems.com

sales@pixustechnologies.com  519-885-5775 

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MicroTCA