PICMG Systems & Technology with Buyer’s Guide Winter 2016

TRIBUTES TO JOE PAVLAT

John McHale Brandon Lewis @PICMG_Tech

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PICMG Systems & Technology Buyer’s Guide | Winter 2016 |

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WINTER 2016 | VOLUME 20 NUMBER 2 Standards-based technology platforms for open innovation

picmg-systems.com

@PICMG_Tech

On the cover The PICMG Systems & Technology Buyer’s Guide highlights some of the technologies designers can expect on the market in 2017 and beyond.

Also in this issue: Tributes to the late Joe Pavlat, president and chairman of PICMG and Editorial Director of PICMG Systems & Technology magazine.

PICMG COM Express Type 7 includes 10 GbE

By Jeff Munch, ADLINK

Technology Focus

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Tribute | John McHale 6

Remembering Joe Pavlat

Tribute | Brandon Lewis 7

On the loss of Joe Pavlat, a friend and mentor

Technology Focus 8

Unmanned aircraft leverage COM Express

By John McHale, Editorial Director

Application Feature

11

PICMG COM Express Type 7 includes 10 GbE

By Jeff Munch, ADLINK

Enhance cooling on COM Express Type 7 server-on-module

By Franz Fischer, congatec

12

Application Feature 12

Unmanned aircraft leverage COM Express

By John McHale, Editorial Director

PICMG Consortium Info 16

Background, membership, and open standards information

PICMG Consortium Info

16

Learn about PICMG Consortium, its standards, and Executive Members

Buyer’s Guide 23

Mil & Aerospace Transportation & Energy

® 2016 OpenSystems Media ®C ompactPCI, PICMG, PICMG, ATCA, AdvancedTCA, MicroTCA, AdvancedMC, GEN4, and their logos are registered trademarks of PICMG. TM x TCA is a trademark of PICMG. © 2016 PICMG Systems & Technology All registered brands and trademarks in AdvancedTCA & CompactPCI Systems are property of their respective owners.

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| Winter 2016 | PICMG Systems & Technology Buyer’s Guide

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Check out our white papers. http://whitepapers.opensystemsmedia.com/

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TRIBUTE

JOE PAVLAT

Remembering Joe Pavlat

By John McHale, Editorial Director

Summer ended with sad news for our OpenSystems Media family when we learned that our friend and coworker, Joe Pavlat, Editorial Director of “PICMG Systems & Technology” magazine, passed away suddenly at his home in Grass Valley, California.

He was only 63 years old.

Joe joined our family back in 1996 when we partnered with him and the PCI Industrial Computer Manufacturers Group (PICMG) to form “CompactPCI Systems” magazine.

The publication reigned as the top magazine in OpenSystems Media’s stable for more than a dozen years, even after it evolved to include “AdvancedTCA” in its title as “CompactPCI and AdvancedTCA Systems.” Its success was attributable to Joe’s passion for the technology, which he codeveloped, as well as his leadership as president and chairman of PICMG since its inception 22 years ago.

As my colleague, Pat Hopper, Publisher at OpenSystems Media, said to me when we heard of Joe’s passing, “No one did more for ‘CompactPCI and AdvancedTCA’ than Joe.” On the occasion of PICMG’s 20th anniversary, Joe renamed the magazine “PICMG Systems & Technology,” as the organization’s membership had become more global and its standards were embraced by multiple industries worldwide, including telecommunications, industrial, the Internet of Things (IoT), automotive, aerospace, and defense.

“I was lucky to have known him,” said Rosemary Kristoff, President of OpenSystems Media. “Just having him around made you feel better, with his candor and his unique ability to keep things in perspective. Joe was a genuine, frank, and loyal friend.”

He had an easy way with conversation, as his interests ranged from embedded computing to hiking to physics to flying.

A native of Wisconsin, he originally pursued a physics degree at the University of Wisconsin at Madison before turning toward computers and instrumentation.

He actively kept up with physics over the years, even participating in experiments in Antarctica and on top of the Haleakala volcano in Hawaii.

From a military electronics perspective, Joe had been a leading advocate for the ­adoption of open standards and open architectures in military systems since we met two decades ago.

Joe also loved to fly and even volunteered his time to fly for the Monterey Sheriff’s Aero Squadron. For years he said he wanted to take me flying, saying there was never a more careful pilot than he. Joe only flew on perfect days because, as he told me: “I hate turbulence.” The same could be said for how he approached his work with OSM. We never saw him encounter a bump he couldn’t smooth out.

Ironically, PICMG was founded shortly after the famous commercial off-the-shelf (COTS) memo was issued by then-U.S. Secretary of Defense William Perry; the memo ordered military programs to leverage COTS wherever and whenever possible. Twenty years later, COTS solutions based on PICMG standards such as CompactPCI and COM Express are quite commonly deployed in defense applications from radar to satellite communications. Joe had a right to be proud of that achievement.

The “PICMG Systems & Technology” magazine, in all its iterations, was always a reflection of Joe. His was the face of PICMG, CompactPCI, and AdvancedTCA. I cannot think of those without thinking of Joe.

Always press-savvy and friendly, Joe had a way of making complicated engineering subjects easy to understand and easy to write about for young trade press reporters.

He taught and informed, but never tried to spin me.

I also cannot imagine having a PICMG staff meeting and knowing he won’t be there to share his advice, tell a story, or reminisce about old friends. I wished I’d flown with him and I wish he were still here, so I could tell him that. We miss you already, Joe, and always will.

Such growth was a tribute to Joe’s leadership and enthusiasm for the open standards developed under the PICMG umbrella as well as his knowledge of embedded computing developed over a 36-year career that included leadership roles at Prolog, Motorola, and Parker Hannifin.

When I joined OpenSystems Media five years ago, Joe was one of the first to welcome me and say how excited he was for us to be working together. A gentleman with a kind manner, he was always quick with a compliment when he saw an article he liked and sincere when he asked after his colleagues. Those traits combined with his knowledge, expertise, and reputation made him popular with his coworkers and a valuable member of our team.

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Predeceased by his parents and brother, Joe is survived by his wife. www.picmg-systems.com

TRIBUTE

On the loss of Joe Pavlat, a friend and mentor

By Brandon Lewis, Technology Editor My first day of work in the embedded computing space came the day after the Super Bowl in 2011. I had about as much knowledge of the high-tech industry as your casual commuter who catches a news snippet on one of the big five tech companies while buying their morning coffee, and frankly didn’t think I’d need to know much more. I figured I’d have the job at a company called OpenSystems Media for six to 12 months – just long enough to get hired on as a high school educator somewhere. Anywhere. Embedded computing was Greek, I was an American twentysomething, and the guts of industrial controllers and network infrastructure were only relevant to me insofar as I’d never had to acknowledge their existence.

JOE PAVLAT

blewis@opensystemsmedia.com

But a boss Joe wasn’t, at least not in the sense that typically carries a negative connotation. With almost 40 years of industry experience that consisted of business and technology development, Joe could have been too arrogant or too busy to deal with my naïveté as both a young technology editor and young professional. He never was.

Instead, Joe took his time with me. Where I was ignorant of history, Joe would walk me through “how we got to now” stories about the rise and fall of the Motorola Computer Group, where he had served as Director of Advanced Development; where I was unsure during my early days covering embedded technology, Joe urged me to keep writing; where I didn’t understand changes happening in the industry, at our company, or even in my personal life, Joe assured me it was all part of the plan.

“WITH ALMOST 40 YEARS OF INDUSTRY EXPERIENCE THAT CONSISTED OF BUSINESS AND TECHNOLOGY DEVELOPMENT, JOE COULD HAVE BEEN TOO ARROGANT OR TOO BUSY TO DEAL WITH MY NAÏVETÉ AS BOTH A YOUNG TECHNOLOGY EDITOR AND YOUNG PROFESSIONAL. HE NEVER WAS.”

These assurances would often take place on Thursday or Friday afternoons, starting as quick phone calls about the newly ratified PICMG spec or the latest analyst numbers and evolving into parables about growing up with his older brother in Wisconsin or the rock scene in the 1960s and 1970s. These conversations occurred once or twice a month until I moved on from “PICMG Systems & Technology” at the end of last year, at which point we still spoke regularly. Through it all, I don’t believe a disingenuous word ever passed between Joe’s lips or by Joe’s pen, and no matter my question or thought, he always responded with the utmost sincerity. For that I often found myself harkening back later to little lessons and nuggets of wisdom from Joe. I still do today.

A couple months later I was assigned to a publication called “AdvancedTCA and CompactPCI Systems” (now “PICMG Systems & Technology”), a book that focused on standards-based compute platforms for the above-mentioned applications. With that assignment I was also introduced to Joe Pavlat, president of the PCI Industrial Computer Manufacturers Group (PICMG) that governed the specifications covered in the magazine, as well as the publication’s editorial director.

I had a new boss. www.picmg-systems.com

At the beginning of September I learned that Joe had unexpectedly passed away at his home in Grass Valley, CA. He was 63 years old.

Like so many of our afternoon talks that transformed from work to life and back, after hearing the news I found myself in a stream of consciousness that jumped from our first in-person meeting at the 2011 AdvancedTCA Summit to when he met my now fiancee to one of his favorite sayings: “You’re like a one-legged man in an ass-kicking contest.” It was a hard day to say the least, the kind with grinning memories, wateryeyed retrospection, and even a beer or two.

I owe a large portion of the success I’ve had in my brief career to Joe, and am proud to have called him not only a mentor, but also a good friend.

Joe, you will be sorely missed.

PICMG Systems & Technology Buyer’s Guide | Winter 2016 |

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Technology Focus

PICMG COM Express Type 7 includes 10 GbE

By Jeff Munch A new COM Express specification developed by the PICMG is soon to be released. One of the upcoming major advancements is the COM Express Type 7 pinout, supporting up to four 10 GbE-KR interfaces, making it ideally suited for the new edge node servers required by Internet of Things (IoT) and Industry 4.0 applications.

By 2020, it is expected that data created and copied annually (much of it from IoT, cloud, and big data applications) will increase to around 44 zettabytes. That’s 44 trillion gigabytes. In order to minimize traffic between clients, central clouds, and data centers, data should be processed as close as possible to its place of origin or inquiry location. IoT and Industry 4.0 applications need this decentralized capacity to process sensor and measurement data in real time. In particular, dataintensive video streaming applications need local, virtualized systems with multiple cores and larger caches to achieve the required transcoding performance.

This is not only relevant for video-ondemand in the telecom segment, but also for medical and security applications.

Another important application for edge servers is deep-packet inspection, which

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ensures data security and optimal quality of service.

The structure of the network is thus transformed to an infrastructure which uses high-performance edge node servers distributed over the whole network that perform their functions close to the end user, reducing latency and backbone traffic. A high bandwidth of 10 GbE is essential for such appliances.

Examples of system-on-chip (SOC) solutions which provide this performance at a relatively low power consumption of 65 watts or less are the Intel Xeon processor D family and the Intel Atom processor C family. ARM designs are also interesting, such as the recently launched AMD Opteron A1100 ARM processor and various PowerPC platforms, such as the QorIQ family from

| Winter 2016 | PICMG Systems & Technology Buyer’s Guide

NXP. Developers do not, however, need to decide today which processor is the best platform. They can stay flexible using the new COM Express specification with Type 7 pinout (Figure 1.)

The new Type 7 pinout One of the most fundamental innovations of the COM Express Type 7 pinout is the support of up to four 10 GbE interfaces, essential for the next generation of edge node appliances (Figure 2).

On the module they are implemented as 10 GbE-KR, i.e. as single backplane lanes according to IEEE 802.3, paragraph 49. The physical implementation of the 10 GbE interfaces takes place on the carrier board itself. Developers can define the signal transmission as optical (SFP+), copper cable (T). This provides flexibility for new designs. www.picmg-systems.com

To a large degree, the Type 7 pinout follows that of Type 6. To create the capacity for up to four 10 GbE interfaces, the signal lines of the digital display interfaces (DDIs) on the CD connector of the Type 6 pinout are used. Since most new edge node appliances do not require high-resolution, multiscreen outputs, multiple DDI interfaces are not needed for these applications. For local management and maintenance consoles, the eDP/LVDS interface is still available and located on the AB connector. If developers wish to retain DDI, a hybrid solution with 2x 10 GbE and a DDI interface will be supported by the specification. Together with the eDP/LVDS interface on the AB connector, solutions that offer both high network and video performance are also possible.

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Figure 1 | The new Type 7 pinout provides up to four 10 GbE-KR ports for bandwidth- and data-intensive designs.

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Figure 2 | The new Type 7 pinout provides up to 4x 10 GbE-KR--single-backplane lanes that conform to the IEEE 802.3/paragraph 49 standard.

www.picmg-systems.com

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Technology Focus No change is expected to the existing 1 GbE port on the Type 6 AB connector. However, there are discussions on expanding this port to 10 GbE, including the physical definition and PHY for 10GBASE-T. This matter can only be decided when conventional nonserver processors such as the Intel Core processor family have comprehensively integrated 10 GbE including PHY, which is not likely to take place before 2018.

1U with up to 10 modules With COM Express Type 7, the benefits of the COM Express specification are made available to new, high-bandwidth, data-intensive edge node server applications. Thanks to the core-module design concept and standardized pinout, system design becomes independent of processor technology. Systems can be upgraded with a simple module exchange. Moreover, thanks to its compact dimensions, COM Express modules enable a

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Figure 3 | ADLINK COM Express Type 7 block diagram.

Rugged HPEC boards for your OpenVPX Systems Digital Signal Processing DSP boards

10/40 GigaEthernet managed Switches

• Intel® Xeon Broadwell DE • Dual processor (8 cores per processor) • PCIe / 10/40 Gigabit dataplaneFMC site • Up to 48*10GBase-KR or 16 * 40Gbase-KR4 on data plane • Up to 12* Gigabit ports and 6*10G/40G ports

Front End processing boards

• Virtex®-7 & QorIQ 6U VPX processing board

Signal processing and communication FMCs

DESIGN CONCEPT AND STANDARDIZED PINOUT, SYSTEM DESIGN BECOMES INDEPENDENT OF PROCESSOR TECHNOLOGY.

high packing density: Ten modules can be integrated in a 1U enclosure, providing a maximum combined data transfer rate of 0.4 terabits per second. The modular COM Express design makes this type of solution highly flexible and scalable, minimizes development costs, and shortens time to market. OEMs also gain more design security and can use their designs for longer, thereby increasing their return on investment (Figure 3).

Further upgrades ADLINK has played a leading role in the PICMG subcommittee that is currently defining the new COM Express 3.0 specification. The new specification, which benefitted from the technical contributions of several key PICMG member companies, is expected to become available at the end Q2 2016, with the Type 7 CD connector pin assignment expected to be released at the end of Q1 to allow vendors to begin working on new designs. The COM Express Rev. 3.0 specification will include both the new Type 7 pinout as well as expected changes to existing pinout types to address minor issues and to migrate from the legacy LPC bus to the eSPI bus. The group is also trying to achieve greater unification on the AB connector between the existing Type 6 and Type 10 pinouts in order to simplify design considerations for manufacturers.

• Vita 57.1/4

lications • Harsh environment app of Development set l Ful a h wit d • Supplie ware) itch tools (firmware and sw t por sup • High-technical • High-performance boards

+33 (0)2 98 57 30 30 • info@interfaceconcept.com • www.interfaceconcept.com

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THANKS TO THE CORE-MODULE

| Winter 2016 | PICMG Systems & Technology Buyer’s Guide

Jeff Munch, chief technology officer of ADLINK, has been Chairman of most PICMG COM Express subcommittees since 2009. In this role he has headed the last five of seven COM Express initiatives, including COM Express Type 7, and has brought together companies such as Advantech, Congatec, Kontron, MSC/Avnet, and Intel. www.adlinktech.com www.picmg-systems.com

Technology Focus

Enhance cooling on COM Express Type 7 serveron-modules

By Franz Fischer The processing demands in carrier-grade telecommunication infrastructures, server farms, and distributed Internet of Things (IoT) edge and fog server applications are increasing rapidly. The level of processing now needed is driving the development of a new generation of modular servers that are more powerful but smaller, and integrate more cores but consume less power per core.

Computers-on-module (COMs) that are designed in accordance to the brand-new COM Express Type 7 specification are a perfect fit for such modular systems. For the first time, they feature multiple 10 Gbit Ethernet ports, more PCIe lanes supporting the latest solid-state storage interfaces, and scalable server class performance with headless Intel Xeon processors that now offer up to 16 processing cores on a single die. But how do developers of high-density, server-like applications make full use of this power? When you are able to squeeze a server module with a footprint of just 95 by 125 mm into a compact casing, or mount several modules in one high-density 19-inch 1U system, heat dissipation becomes critical.

This is especially relevant now that COM Express Type 7 server-on-modules use up to 65 W. If you want to harvest their full potential, you must have a very efficient cooling solution because these high-end embedded processors have been designed to automatically throttle back their core frequency – and thus, their computing power – to remain within their safe operating thermal envelope. By employing an efficient cooling solution, the CPU is able to operate at its maximum speed for more of the time, delivering consistently high computing performance the entire time the processor is cool enough. This makes an efficient cooling solution a decisive factor for application performance and reliability.

The COM Express specification defines a standard footprint for distributing the heat generated by the processing cores across a wider area, ensuring interchangeability is maintained between suppliers. Today, most standard cooling solutions for COM Express modules are limited to 35 W heat dissipation – primarily by the heat path from the processor to the heat spreader. But high performance server-on-module applications require more, as COM Express Type 7 cooling solutions must transfer up to 65 W. One solution would be to use physically larger cooling solutions, but for server modules, space is highly restricted. Thus, the cooling solution must be improved using more efficient solutions, such as the patented heat pipe technology developed by congatec. www.picmg-systems.com

Unlike solid pipe designs, it harnesses the evaporation and condensation of a working fluid inside the pipes. The fluid circulates through capillary action, transferring heat as it does so. This has been shown to improve heat transport by up to 1,000 times over a heat pipe made from solid copper. The technology uses flattened pipes to transfer heat from the processor to the heatspreader plate while remaining within the specified mechanical dimensions. The design is appropriate even for fanless enclosures and flexible enough to meet customerspecific designs. By improving thermal efficiency, a COM Express Type 7 module can be deployed almost anywhere in a network, further driving innovation in the virtualized telecommunication and connected IoT industries.

Franz Fischer is Director of the Technical Solutions Center – Americas for congatec in San Diego. Franz has over 20 years’ experience in hardware design, EMC, avionics engineering, and graphics. www.congatec.com

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Application Feature

Unmanned aircraft leverage COM Express and other small form factors

By John McHale, Editorial Director The MQ-1 Predator assigned to the 163rd Reconnaissance Wing flies over Southern California Logistics Airport in Victorville, California. U.S. Air Force photo by Tech Sgt. Effrain Lopez.

Unmanned aircraft systems (UASs) continue to shrink in size, as do their payloads, requiring system designers to leverage small-form-factor, embedded-computing standards like COM Express, PC/104, and others.

Reduced size, weight, and power (SWaP) requirements in military UAS payloads, ground-control stations, avionics, reconnaissance (ISR) applications, and other military electronics systems are forcing designers to leverage small-form-factor designs such as COM Express, SMARC, and the PC/104 standard.

While PC/104 has been around for decades, it has never been healthier. Its main advantages – ruggedness, compact size, and modularity – have never been more in demand in the military electronics market, especially in unmanned systems.

“Because of their low-SWAP characteristics and affordability, systems based on embedded PC/104 and computer-on-module (COM) technologies routinely find a home in a multitude of military and civil applications, including MALE and HALE UAS platforms in ISR/combat roles, attack/utility/cargo helicopters, various fixed-wing cargo/fighter/ISR aircraft, and a host of tactical and combat ground vehicles, along with missile defense platforms and shipboard applications,” says Mike Southworth, Product Marketing Executive at Curtiss-Wright Defense Solutions. “As electronics payloads on board manned and unmanned platforms look to add new technical capabilities – such as high-speed network backbones, ISR sensor/video processing, and/or avionics databus interfaces – the smaller system architectures like PC/104 and COM modules have been well received by [our] customers.”

Not just SWaP, but stringent ruggedization and extreme environmental requirements may also preclude users from choosing PC/104 products.

“With the long history that PC/104 has in the marketplace, the list of applications is significant, the technology is an ideal fit for any rugged commercial, industrial, or military applications,” says Michele Kasza, vice president of sales for Connect Tech in Guelph, Ontario. “PC/104 is as well-suited to vehicle-based solutions, manned

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| Winter 2016 | PICMG Systems & Technology Buyer’s Guide

or unmanned, as in industrial environments where unregulated power is a concern as is dirt and dust; also outdoor applications where extreme temperatures, rain, humidity, and salt can be factors. PC/104 is often living in environments where the user may not realize that PC/104 is the architecture driving their application. Crack open a number of small-form-factor, rugged system solutions and you will find PC/104 at its finest; quite often a multi­ vendor stack carefully architected for the ultimate in interoperability.”

Smaller formats in demand “I believe that in the case of PC/104 [military users] are looking to use a proven platform that they have seen years of success with,” Kasza says. “These customers may also prefer to stay with a known footprint as it may reduce their design efforts from a mechanical perspective. That said, we at Connect Tech are seeing our military customers wanting the rugged and compact features of the PC/104 of the past combined with the most current technologies. www.picmg-systems.com

“Here is where PCIe/104 (The PCI Express version of PC/104) comes into play, offering single-board computers (SBCs) with the latest generation low-power Intel Atom [processors], through to high-performance Intel Core i7 options,” Kasza continues. “Stack this with high-end GPU solutions such as NVIDIA GTX950Ms and high port density Managed Carrier Ethernet Switches or a 10G Ethernet Controllers and suddenly what was old technology is now leading edge.” Connect Tech offers the Xtreme/GbE 24-Port Managed Carrier Ethernet Switch solution for military smallform-factor requirements. Ports can be accessed via a breakout board/carrier that can mate directly to the XDG024/25 or by mating to a high-density high-speed Twinax cable. The XDG025 is designed for standalone applications, with all thermal extraction on one layer and connector/cabling on the opposite layer, whereas the XDG024 is intended to stack directly into a PCIe/104 stack. (See Figure 1.)

Reliability and consistency have ensured continued support for the PC/104 standard in military applications that often have various levels of requirements.

“The requirements of military customers for PC/104 varies from program to program,” says Dr. Paul A.T. Haris, president and CEO of RTD Embedded Technologies, Inc., in State College, Pennsylvania. “But some of the common threads have included a need for rapid prototyping, development, and uptime that the PC/104 architecture provides, given its vast array of product functionalities and numerous manufacturers found on the market.

“Additionally, users have required the need for an inherently rugged architecture at the board level, which also provides modularity for future maintainability and upgradeability,” he continues. “Very few standards over the history of the embedded market have been able to provide these capabilities in such a small form factor. And none can boast the history of this standard and its ability to advance with time while maintaining backward compatibility. This provides military customers with the ability

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Figure 1 | The XDG024 from Connect Tech is intended to stack directly into a PCIe/104 stack for small-form-factor embedded computing applications.

to reduce total lifetime program costs as well as reduce the need for product changeovers. This is why you find many military customers making the PC/104 architecture the architecture of choice for a vast number of military applications in all extremes of environments.”

Military users “are increasingly looking for small-form-factor embedded technologies that reduce the size, weight, and

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Application Feature power for their deployed line-replaceable units (LRUs) and reduce or eliminate NRE fees and development schedules,” Southworth says. “At the same time, [they] are seeking increased multicore processor and graphics performance, along with I/O scalability from modular open standard PCI-Express based architectures like PCIe104 [as well as] COM Express, SMARC, and Mini-PCIe.” Reduced SWaP Every defense application today wants five to 10 times more performance in system upgrades, but they want it in the same – if not smaller – footprint of the previous system and with lower power characteristics. This is something PC/104 has been doing for years; it is also a feature of standards such as COM Express and SMARC. “The PC/104 architecture family of specifications has been serving SWaP requirements even before SWaP was an acronym,” Haris says. “The unique stackable architecture, which also can

serve as a true SBC architecture, as well as a mezzanine architecture, has been providing the military with embedded, rugged board, and system-level solutions for years. With its embedded stackable bus system and onboard I/O connectivity, reductions in enclosure size and weight can be either tailored for each application or realized in standard modular enclosures. With the addition of considering the overall program life cycle cost factor, the PC/104 architecture enables users to quickly upgrade and maintain their systems with backward compatibility and interoperability of multivendor products, all based on well-defined and controlled standards and specifications.”

Just as no military application is the same with the same embedded computing requirements, no small-formfactor architecture is the right size for every application.

“We live in a world of many small-formfactor options which simply means that

one size does not fit all,” Kasza says.

“At a small footprint size of 90 mm by 96 mm, PC/104 has a solid ecosystem that allows for easy integration of current technologies with multivendor support and interoperability. In some cases, the physical footprint of a system is what a customer least wants to change as they may be working within a space that was previously defined around PC/104. From a processor perspective, PC/104 singleboard computers are available with lower-power ARM processors as well as x86 options ranging from low-power solutions through to Intel Core i7s.”

“Small-form-factor CPU card standards like PC/104, COM Express, and SMARC offer a physical size that is a fraction of traditional 3U or 6U VME/VPX architectures,” Southworth says. “This provides an obvious advantage when it comes to packaging for lowest SWaP. In addition, COM Express and SMARC have multiple physical footprint options, including boards roughly the size of a credit card, which allow for further miniaturization

MISSION-CRITICAL I/O SOLUTIONS

Alphi Technology designs and manufactures board level products.

PCIe-Mini-1553/ARINC 429

PCIe-Mini-CAN-USB

PCIe-Mini-AD8200

PCIe-Mini-FastDAC-4

Designed and manufactured in the USA. | 480.838.2428 | www.AlphiTech.com | sales@alphitech.com

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| Winter 2016 | PICMG Systems & Technology Buyer’s Guide

www.picmg-systems.com

that any one application dominates would be misleading and would do a disservice to the PC/104 architecture: PC/104 is based on standard stackable and modular bus architectures widely accepted across most industries and then packaged on a standard small form factor. The use of the vast array of functionalities of these products is endless.

›

Figure 2 | The Parvus DuraCOR 310 from Curtiss-Wright Defense Solutions integrates a low-power SMARC computer-on-module (COM) CPU card with Mini-PCIe I/O card expansion slots for military small-form-factor applications.

“The architecture provides all the building blocks for designing SWaP-based products to enable overall lifetime program cost reductions,” Haris continues. “This architecture has been proven from the depths of the oceans to outer space, and from the Antarctic ice caps to the desert sands. You will find PC/104 running mission-critical weapon systems as well as general-purpose monitoring, tracking, and processing systems. In the end, the question should not be what are the types of applications that often make use of PC/104 technology, but are there any applications that have not made use of it.”

targeted at demanding SWaP requirements. For this space, Curtiss-Wright offers the 39-inch, 1.5-pound rugged mission processor, the Parvus DuraCOR 310, which makes use of integration of a low-power SMARC COM CPU card with Mini-PCIe I/O card expansion slots,” Southworth says. (Figure 2.)

Other companies – such as Diamond Systems and WinSystems – continue to offer PC/104-based products to meet the demand for reduced SWaP in military systems.

Diamond Systems has a family of Jupiter PC/104 & PC/104-Plus DC/DC highefficiency, high-precision power supply modules. Each power supply consists of a PC/104 form factor module with complete DC-DC voltage regulator circuitry, integrated thermal solution, detachable screw terminal block I/O connections, and PC/104 bus connectors. Its input voltage range of 7 to 34 VDC is compatible with industry-standard 12 V, 24 V, and 28 V inputs.

Engineers at WinSystems leverage the Intel E3800 Atom processor family for their PPM-C407, a fanless low-power PC/104 SBC. The solution is designed for harsh environments and has soldered RAM for added shock and vibration resistance with an operating temperature range from -40 °C to +85 °C. Looking forward for reduced SWaP “The number of applications where one finds PC/104 is vast,” Haris says. To say www.picmg-systems.com

PICMG Systems & Technology Buyer’s Guide | Winter 2016 |

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PCI Industrial Computer Manufacturers’ Group (PICMG) Consortium Info

Thousands of PICMG-compliant products, ranging from components and subsystems to complete applicationready systems, are commercially available, representing more than $5 billion yearly in global revenue.

PICMG is a nonprofit consortium of companies and organizations that collaboratively develop open standards for high-performance telecommunications, military, industrial, and general-purpose embedded computing applications.

Founded in 1994, the group has more than 250 member companies that specialize in a wide range of technical disciplines, including mechanical and thermal design, singleboard computer design, very-high-speed signaling design and analysis, networking expertise, backplane and packaging design, power management, high-availability software, and comprehensive system management.

Key standards families developed by PICMG include CompactPCI, AdvancedTCA, MicroTCA, AdvancedMC, CompactPCI Serial, COM Express, SHB Express, and HPM (Hardware Platform Management). In its more than two decades of operation, PICMG has published over 50 specifications developed by participants from hundreds of companies. Work on standards across a wide range of markets, applications, and technologies continues as the boundaries of datacom, telecom, military and aerospace, industrial, man/machine interface applications, and deeply embedded computing continue to blur.

Equipment built to PICMG standards is used worldwide, with any company allowed to build or use equipment without restriction (although certain technologies used for some military applications may be subject to U.S. export restrictions governed by ITAR rules).

A rigorous intellectual property (IP) policy ensures early discovery of any memberowned IP; moreover, all members must agree to “reasonable and non-discriminatory” (RAND) licensing of any IP written into a standard. To date, no PICMG standard requires any license or royalty to build or operate.

PICMG adheres to a formal, multistep development process. Development work can be periodically be reviewed by all member companies, although work inside of a technical subcommittee is confidential to the members of that committee until that work

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| Winter 2016 | PICMG Systems & Technology Buyer’s Guide

is ready for broader review by other members. Until a specification or standards-related document is ratified by the entire membership, it is confidential to PICMG. After ratification, all documents are available to the general public.

Why use PICMG standards?

PICMG standards – because the organization has such a large number of contributing companies – reflect the extremely wide and deep technical capabilities of its members. By using well-understood and proven open standards, vendors can bring products to market quickly. Customers gain from the price and performance competition that results from many vendors operating in an open marketplace.

Thousands of PICMG standards-­compliant products – ranging from components and subsystems to complete applicationready systems – are commercially available, representing more than $5 billion per year in global revenue.

To Learn More To learn more about the PICMG organization and membership, please visit www.picmg.org/membership/ or email info@picmg.org. www.picmg-systems.com

OPEN MODULAR COMPUTING STANDARDS There are nine distinct “families” of PICMG standards. Many have subsidiary specifications that are designed to add additional capability.

Please visit www.picmg.org/openstandards/ to learn more about each one. ›› Advanced TCA: This high-performance modular standard, also called ATCA, was developed for critical central-office telecommunications applications and is also used for a wide range of commercial and military applications. It offers a complete management infrastructure so that high-availability systems with “six nines” reliability can be deployed. ›› CompactPCI: A modular general-purpose computing system based on 3U and 6U Eurocard mechanical standards, it features hot-swap capability and can be either convection- or conduction-cooled. With hundreds of thousands of installations worldwide, this popular architecture is one of the most successful and popular standards in use today. ›› COM Express: This small-form-factor (SFF) standard is designed for deeply embedded applications where space is at a premium but high performance is required. COM Express boards can be used as standalones or plugged onto an application-specific baseboard with I/O expansion. ›› MicroTCA: Often called “AdvancedTCA’s little brother,” MicroTCA is a modular platform for building smaller and less-expensive systems that AdvancedTCA while retaining the high-availability architecture of AdvancedTCA. MicroTCA systems use AMC modules as their basic computing and I/O building blocks. ›› Advanced MC: This standard defines a family of small, hot-swappable, and fully managed mezzanine cards that can be used to tailor I/O for large AdvancedTCA systems or used as the basis for building MicroTCA systems. They are commonly called “AMCs.” ›› CompactPCI Serial: This relatively new standard uses CompactPCI’s mechanical structure but updates the system interconnects to include PCI Express, Ethernet, SATA, and USB. It offers 20 to 40 times the backplane bandwidth of CompactPCI and is ideal for new applications or upgrades to older systems. ›› SHB Express: This upgrade to the PCI-ISA standard replaces parallel PCI interconnects with serial PCI Express lanes, improving performance and increasing compute power. A passive backplane is used, and standard desktop PCI Express cards can be used for I/O customization. ›› Hardware Platform Management: Also known as “HPM,” this software standard defines how to build fully managed, high-availability AdvancedTCA or MicroTCA systems. It is the first, and currently the only, open standard for system management. ›› PCI-ISA: PICMG’s first open standard, PCI-ISA is used to build rugged, reliable, and maintainable computers that are designed to replace desktop PCs in industrial-control communications or data-acquisition applications.

The PCI-ISA standard moves all of the active circuitry normally found on a motherboard to an easily replaceable and upgradable plug-in card.

While standard PC cards plug into other slots to customize a system, a PCI-ISA system uses a passive backplane consisting of connectors with no active components. ›› Under Development: New standards arise when members identify the need to create a new embedded computing standard for a particular market or application. This is a structured process, but is relatively simple to initiate.

All it takes to begin the development process is an initial “Statement of Work,” sponsored by three or more Executive members, that describes the market need and a rough proposal of what a standard addressing that might look like. www.picmg-systems.com

Reliable Embedded Computing for a World in Motion.

» Safe computers for rail, road and air, up to SIL 4/DAL-A » Modular box and panel PCs for industry and transportation » Powerful system solutions on CompactPCI®/PlusIO/Serial » Robust, standard Computeron-Modules (COMs) » Fast time-to-market with built-to-order box PCs & half „ 19 systems » Market-specific Ethernet switches and fieldbus interfaces

www.menmicro.com

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PCI Industrial Computer Manufacturers’ Group (PICMG) Consortium Info

THE VALUE OF OPEN STANDARDS What makes PICMG a leading standards organization?

PICMG has more than 250 member companies, all of which combine to bring an extremely wide and deep talent base to the table.

Unlike some other consortia, PICMG is not controlled by one or a few companies: It is governed by the Executive Members that work together to ratify processes and procedures, elect officers, and approve budgets. PICMG maintains a “one company-one vote” policy, which means that no single company can dominate the standards-development process.

Over the last several decades, open standards have become increasingly important for a wide range of embedded and specialized computer applications, both big and small. While the definition of “open standard” can vary, for the embedded computer world it usually means a succinct definition of everything a vendor needs to know to build equipment and write software that will work with compatible products offered by other vendors.

In an organization like PICMG, all players, whether large or small, can take an important role. Participants have access to thought leaders in areas they or their company may lack expertise. They also can meet experts in a wide range of engineering disciplines.

PICMG also has an outstanding intellectual property (IP) policy that ensures that members must submit IP declarations throughout the standards-development process, where they can be accepted for use or rejected. To date, no PICMG standard or specification has required any user licenses or royalties. Moreover, anyone can build equipment in accordance with or use PICMG standards whether they are members or not. PICMG is truly an open organization. Dues are low: In fact, the cost of a yearly Executive membership has not changed in 20 years.

To Learn More To learn more about the PICMG organization and membership, please visit www.picmg.org/membership/ or email info@picmg.org.

OpenSystems Media works with industry leaders to develop and publish content that educates our readers.

Implementing high performance embedded computing hardware

By Trenton Systems The white paper discusses several hardware solution platforms for high-end embedded applications, including a dual-processor system host board and related PCIe Gen3 backplanes, referred to as HDEC, or high density embedded computing.

HDEC builds upon the basic PICMG 1.3 specification by increasing the base number of PCIe lanes between the HDEC Series SHB and backplane from 20 to a maximum allowable limit of 88 lanes.

http://embedded-computing.com/white-papers/white-embedded-computing-hardware/

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Check out our white papers at www.picmg.mil-embedded.com/ white-papers/ www.picmg-systems.com

PCI Industrial Computer Manufacturers’ Group (PICMG) Consortium Info

JOINING PICMG Why join PICMG? By joining an organization like PICMG, anyone can play an important role. Participants have access to thought leaders in areas they or their company may lack expertise. They come to know experts in a wide range of engineering disciplines. The groups that develop these open standards do so because they are interested in getting something done in a finite amount of time; whenever possible, bureaucracy and politics are kept to a minimum. Members of these development groups have a common goal: To create standards that are widely used and that each company involved can make money from. Companies can specialize in their areas of expertise without needing to be good at everything. In addition to technical collaboration, business collaborations often evolve in a symbiotic way.

Companies that participate in standards development also have a very important advantage: They are already up to speed when the standard is released and can thus be first to market with compliant and leading-edge products.

In its 20-plus years of operation, PICMG has published almost 50 open industry specifications that encompass nine basic standards families developed by participants from hundreds of companies.

To Learn More To learn more about the PICMG organization and membership, please visit www.picmg.org/membership/ or email info@picmg.org.

Verotec Integrated Packaging • Ph: 603.821.9921 • sales@verotec.us • www.verotec.us 19”DIPLOMAT AND VEROTEC CASES Stylish desktop cases for 19” systems

19” RACK CASES

Standard Veroshield EMC screened and IP sealed Eurocard mounting

INTEGRATED SYSTEMS

Horizontal and vertical board mounting 19” Rack Mount and Desktop Systems TecSYS ‘Ready to Run’ Development Systems

CARD CAGES AND COMPONENTS

DIN41494 and IEC60297 general purpose IEEE1101.10/11 for cPCI , VPX, VME64x, PXI etc.

MIL-STD-167 IEEE1101.10/11 for rugged applications

BACKPLANES AND EXTENDERS

VME, VME64x, VXI. OpenVPX, cPCI and PXI Custom Design Capability

PLUGGABLE PSU

THERMAL SOLUTIONS

Intelligent, ltered and standard 19” 1U fan trays

20 - 240W General Purpose 200 - 600W PICMG 2.11

Instrument Cases • Card Cages • Integrated Systems • 19” Fan Trays Backplanes and Extenders • Rack Cases • Pluggable PSU

TecServ + Modication Services

Continuing 50 years of excellence in functional and elegant electronic packaging

E L E C T R O N I C S PA C K A G I N G

Standard, modied and custom products and systems to meet specic requirements www.picmg-systems.com

PICMG Systems & Technology Buyer’s Guide | Winter 2016 |

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PCI Industrial Computer Manufacturers’ Group (PICMG) Consortium Info

LIST OF PICMG EXECUTIVE MEMBERS ADLINK Technology Inc. www.adlinktech.com

General Micro Systems Inc. www.gms4sbc.com

Advantech Co., LTD www.advantech.com

Harting Inc. www.harting-usa.com

Airbus Defence & Space airbusdefenceandspace.com

HEITEC AG www.heitec.de

Amphenol FCI (AFCI) www.fci.com

Huawei www.huawei.com/en

Artesyn Embedded Technologies www.artesyn.com

IN2P3-CNRS www.in2p3.fr

BAE Systems www.baesystems.com

Institute of High Energy Physics english.ihep.cas.cn

congatec AG www.congatec.com

Intel Corporation www.intel.com

Dawn VME Products www.dawnvme.com

Keysight Technologies www.keysight.com

DESY www.desy.de

Kontron www.kontron.com

Elma Electronic Inc. www.elma.com

Meinberg Funkuhren GmbH & Co. KG www.meinberg.de

Ennoconn Corporation www.ennoconn.com

MEN Mikro Elektronik GmbH www.menmicro.com

Ericsson AB www.ericsson.com

Mercury Systems, Inc. www.mrcy.com

ERNI Electronics GmbH www.erni.com

MSC Technologies GmbH www.msc-technologies.eu

European Spallation Source ERIC europeanspallationsource.se

N.A.T. GmbH www.nateurope.com

Eurotech S.p.A. www.eurotech.com

National Instruments www.ni.com

Extreme Engineering Solutions www.xes-inc.com

Parpro Systems parpro.com

Fivetech Technology Inc. www.fivetk.com

Pentair Electronics Protection www.pentairprotect.com

Fraunhofer FOKUS www.fokus.fraunhofer.de

PFU Limited www.pfu.fujitsu.com

Fujitsu Limited www.fujitsu.com

PICMG China www.picmg.org/member/picmg-china

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www.picmg-systems.com

PCI Industrial Computer Manufacturers’ Group (PICMG) Consortium Info

Pixus Technologies Inc. www.pixustechnologies.com

Simonson Technology Services www.simonsontech.net

Polyrack Electronic-Aufbausysteme GmbH www.polyrack.com

SLAC National Accelerator Laboratory www6.slac.stanford.edu

Portwell, Inc. www.portwell.com

Southco Inc. www.southco.com

Prodrive B.V. prodrive-technologies.com

TE Connectivity www.te.com

Radisys Corporation www.radisys.com

Trenton Systems, Inc. www.trentonsystems.com

RECAB recab.com

VadaTech Inc. www.vadatech.com

RTD Embedded Technologies, Inc. www.rtd.com

Yamaichi Electronics yamaichi.com

Sanritz Automation Co., Ltd. www.sanritz.co/jp

ZTE Corporation www.zte.com

OpenSystems Media E-cast Enabling SIGINT thru Deep Learning Tech & HPEC Sponsored by Kontron Image processing and military signal intelligence (SIGINT) applications require the processing of very large data sets to predict and evaluate future courses of action. These complex applications require extremely high processing power in small footprints, a solution that has only recently become available with the onset of high performance embedded computing (HPEC).

This webinar with industry experts from Kontron discusses how HPEC systems that leverage the latest Intel technology can enable deep learning in SIGINT, image processing, and other defense applications.

ecast.opensystemsmedia.com/689 www.picmg-systems.com

PICMG Systems & Technology Buyer’s Guide | Winter 2016 |

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PCI Industrial Computer Manufacturers’ Group (PICMG) Consortium Info

PICMG ORGANIZATIONAL STRUCTURE PICMG is a 501(c)(3) organization that is organized to collaboratively develop open standards for high-performance telecommunications, military, industrial, and general-purpose embedded computing applications.

Executive Members have the right of full participation in standards-development activities, may propose new standards work, and provide full governance of the organization, functioning as the Board of Directors.

Associate Members may participate in all standards-development activities, with full participation and voting rights relative to those standards. Associates must agree to abide by PICMG’s governance documents, including the Intellectual Property Policy. Affiliate Membership is a document subscription service for those who need only that level of information.

To Learn More To learn more about the PICMG organization and membership, please visit www.picmg.org/membership/ or email info@picmg.org.

22ew17_177_799x123_825_PICMG_Systems_2ew17P.indd | Winter 2016 | PICMG Systems & Technology Buyer’s Guide 1

www.picmg-systems.com 04.10.16 09:43

PICMG Systems & Technology Buyer’s Guide

Military & Aerospace

Mil & Aerospace Sponsored By:

Alphi Technology Corporation PCI Express Mini ARINC 429 Controller up to 4 TX/8 RX Features ñ ARINC 429-based PCIe-Mini card ARINC controller ñ Up to 4 transmitters and 8 receivers channels for ARINC controller ñ Programmable label recognition for 256 labels per channel ñ 32 x 32 Receive FIFOs and Priority-Label buffers ñ Dependent data rates for Transmit and Receive ñ Meets the ARINC 429 specifications for loading, level detection, timing, and protocol ñ Software selected data rate of 12.5kbps or 100kbps with automatic slew rate adjustment ñ Burst and continuous mode available ñ Programmable word length selection, with the parity bit generated automatically ñ Programmable Interrupt support ñ Differential IRIG B Input www.alphitech.com http://picmg.opensystemsmedia.com/p372995

Military & Aerospace

ATC-ETH-DIG-I/O

Rugged, Small, Lightweight, Ethernet, FPGA-Based Multi-Function I/O Controller

Hartmann Electronic is on the Backplane and System Platform business since more than 40 years. All the established standards like VME, cPCI and VPX are available from stock, but the main business are custom Backplanes and System Platforms.

One of our newest product family is the CompactPCI-Serial, were we can offer different sizes of Backplanes, Power Supplies (also conduction cooled) and System Platforms.

The CompactPCI-Serial Standard allows the direct routing of PCIexpress, Ethernet, SATA and USB signals over the Backplane from slot to slot. With controlled high speed layout, Hartmann guarantees the maximum specified data transmission.

The ATC-ETH-DIG-I/O is an Ethernet based Multi-Function I/O module that employs dual Altera Cyclone® FPGAs for maximum deterministic performance and I/O capability.

The module provides an Ethernet network interface for Digital I/O, Analog and Serial communication. Although it is fully functional as delivered, the User FPGA can be modified for custom bus implementations, which allows maximum flexibility and pre-processing capability for time-sensitive applications.

To communicate with the host, the ATC-ETH-DIG-I/O uses simple standard networking protocol – Modbus – that allows for control and data transfers.

The ATC-ETH-DIG-I/O uses a single 160 pin I/O connector for all system inputs and outputs. The I/O connector is a high density D-type connector with female pins. The mating cable end connector is available in a number of configurations to meet specific application requirements.

Features ñ User FPGA for applications requirements via RS-232/422/488 (encryption, custom communication protocols, etc.) ñ One GigE port with ModBus TCP ñ Up to three RS-232/422/485 ports via User FPGA ñ Thirty six general purpose LVTTL lines with 1KΩ pull up resistor ñ Twelve buffered general purpose LVTTL lines with 24mA drive per line ñ Four low-side open drain putout channels with 1A drive per channel ñ Eight RS-422 output channels, twelve input channels ñ One I2C interface channel ñ One SPI interface channel ñ Eight 16-bit A/D channels for external voltage monitor ñ Internal voltage monitor capability ñ Designed and manufactured in USA Environment ñ Operating temperature: -40° to +85° C ñ Shock: 30G, 15ms sawtooth ñ Vibration: 15G, 5-2000 Hz ñ Input voltage: +12 to +28 VDC Mechanical ñ Size: 5.4” x 5.5” x 1.6” (WDH) ñ Rear panel I/O: 160-pin Molex ñ Weight: 1.67 lbs ñ MTBF: >250,000 hours

www.hartmann-electronic.com http://picmg.opensystemsmedia.com/p373845

www.Alphitech.com http://picmg.opensystemsmedia.com/p373848

Extreme Engineering Solutions (X-ES) XPand6052

XPand6052 is a Small Form Factor (SFF) system that features an XPedite5205 XMC/PMC Embedded Services Router, which runs Cisco IOS® Software with Cisco® Mobile Ready Net capabilities, and an XPedite7450 COM Express® mezzanine module for general processing. This combination provides a high-performance router with plenty of computing power for any application. ñ XPedite5205: NIST FIPS 140-2 Overall Level 1 validated on certificate #2242 and NIAP Common Criteria Certified ñ Hardware acceleration and encryption ñ Integrated threat control using Cisco IOS® software ñ Identity management using authentication, authorization, and accounting (AAA) and public key infrastructure ñ Dimensions: 8.2 in. (L) x 4.88 in. (W) x 1.85 in. (H), Weight: 4lbs. ñ Conduction cooling and environmentally sealed https://www.xes-inc.com/products/rugged-systems/xpand6052/ http://picmg.opensystemsmedia.com/p373878

Transportation & Energy

Hartmann Electronic GmbH

CompactPCI-Serial Backplane, System Platform, Power Supply

www.picmg-systems.com

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