PICMG Systems & Technology with Application Guide Fall/Winter 2017

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FALL/WINTER 2017 VOLUME 21 NUMBER 2

Standards-based technology platforms for open innovation picmg-systems.com

@PICMG_Tech

On the cover The PICMG Systems & Technology 2018 Application Guide highlights some of the hot technologies designers can expect to see on the market in the coming year and beyond.

Also in this issue: The use of PICMG-compliant technologies in the military electronics arena, and a Q and A with PICMG’s Doug Sandy on its growing role in the IIoT. COM Express hot among military electronics users while CompactPCI levels off

By John McHale, Editorial Director

Technology Focus

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President’s Corner | Jessica Isquith

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Collaboration equals innovation

Technology Focus

Seeking a unified hardware approach for IIoT control

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COM Express hot among military electronics users while CompactPCI levels off

By John McHale, Editorial Director

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Seeking a unified hardware approach for IIoT control

An interview with Doug Sandy, Vice President of Technology for PICMG

By Brandon Lewis, Technology Editor

An interview with Doug Sandy, Vice President of Technology for PICMG

By Brandon Lewis, Technology Editor

Technology Focus

PICMG Consortium

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PCI Industrial Computer Manufacturers’ Group (PICMG) Consortium Info

2018 Application Guide 20

Background, membership, and open standards information

PICMG Consortium Info

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Communications & Networking Industrial Automation & Control Military & Aerospace

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| Fall/Winter 2017 | PICMG Systems & Technology Application Guide

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President’s Corner

Collaboration equals innovation

By Jessica Isquith, President of PICMG

What continues to make PICMG successful as a standards body is our community of members and your collaboration in pursuit of innovation. As officers of PICMG, our mission is to shepherd and encourage that collaboration, making sure that the process moves along and that member voices are heard. The standard development process within PICMG is flexible – members can prepare pre-work of a potential standard before coming to PICMG (CompactPCI was introduced this way) or develop them within open committees under the aegis of PICMG. It’s all about collaboration. The value of open standards adoption is that it helps the industry by enabling interoperability, multivendor solutions, flexibility, and reduced time to market for end users.

My column reviews the great progress we have made in 2017 and some of the exciting new initiatives underway.

Distinguished Service Awards Program Over the last 23 years, PICMG members have spent hundreds of thousands of hours collaborating on open standards, leading to nine standards families that have generated billions of dollars of products. The PICMG officers felt we should celebrate some exceptional members, both past and present, who have been instrumental to the success of PICMG. This admirable group contains founding members and leaders of previous and current efforts. We will continue to highlight the Distinguished Service honorees with articles in our newsletter, and on our website, about their valuable contributions and accomplishments.

Doug Sandy’s reelection Doug Sandy has been re-elected the Chief Technology Officer (CTO) of PICMG, a post he has held since 2009. Doug recently retired from his role at Artesyn Embedded Technologies and has taken a position in academia, becoming even more of an evangelist for PICMG and open standards overall. As CTO, he is responsible for the definition and administration of the specification development process. With his 24-plus years of industry experience and over 20 years at PICMG, Doug’s expertise in driving the formation and successful adoption of open specifications is unprecedented. PICMG will greatly benefit from Doug’s reelection.

Specifications ratified in 2017 COM Express Rev.3 Revision 3.0 of COM Express was ratified this spring, a drive led

by Jeff Munch. This high-performance revision adds server-grade functionality to the COM Express standard. COM Express is widely used in industrial automation, military/aerospace, gaming,

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medical, transportation, Internet of Things (IoT), and other applications. Revision 3.0 of COM Express provides for a new Type 7 connector and the addition of up to four 10 Gigabit Ethernet (10GbE) interfaces on the board. Previous revisions of the specification (connector types 3 and 5) supported up to three Gigabit Ethernet ports. The higher-speed ports open up new markets such as data centers, where the high compute density of COM Express can result in increased rack utilization. The 10GbE ports are also ideal for high-bandwidth video applications like surveillance. Another change to the specification includes increasing the number of PCI Express lanes to 32 across the Type 7 connector. This move provides increased connectivity and interface options including the ability to use general-purpose graphics processing units (GPGPUs). COM Express Type 7 pinout also supports up to four 10GbE-KR interfaces, making it ideally suited for the new edge-node servers required by IoT and Industry 4.0 applications. cPCI Serial Space A derivative of CompactPCI Serial, the cPCI Serial Space specification was ratified in August 2017. cPCI Serial Space is intended to be used in space, for example on board satellites as the platform system and the payload controller as well as on Earth for the control systems and ground stations.

CompactPCI Serial products can also be combined with cPCI Serial Space products to develop test and simulation systems. As led by Manfred Schmitz, the two main changes in the CompactPCI Serial specification are the definition of a dual star architecture for increased availability and the ability to integrate different communication protocols common in space applications.

We are proud that cPCI Serial Space has been selected for the OneWeb program, where over 900 satellites will utilize the technology. The technology is being further evaluated for a wide range of other programs.

MicroTCA Design Guidelines for Physics Community Throughout 2017, the MicroTCA.4 committee, led by Ray Larsen, developed and ratified four new design guides to aid engineers.

They cover topics including hot-plug capabilities for advanced mezzanine card/rear transition module (AMCs/RTM), functions, and APIs for standard device model (SDM) and standard process model (SPM). It is recommended, but not required, that applications developed for use with MTCA.4 or MTCA.4.1 systems make use of these guidelines to the greatest reasonable extent. All the design guidelines are available for download at picmg.org.

| Fall/Winter 2017 | PICMG Systems & Technology Application Guide

www.picmg.mil-embedded.com

PICMG Industrial IoT initiatives We have held a number of open calls with members and additional industry experts to discuss Industrial IoT requirements, and have found quite keen interest in creating a specification in that area. However, there are many challenges that must be first be addressed, from discovery, security, monitoring, and management of nodes to reliability and rugged packaging.

Today, many leaders in IIoT have selected COM Express as their preferred platform due to its size, performance, flexible I/O, and ability to address many of the challenges listed above. With the addition of COM Express Type 7, we expect even greater adoption because COM Express can meet new, high-bandwidth, data-intensive edge-node server application requirements.

To position COM Express as the standard for Industrial IoT platforms, we are developing application guides, short-form specs, promotional campaigns, and other tools. The goal is to make COM Express easier to adopt and also to reduce the time it takes for companies to deploy industrial grade solutions. We hope that increased adoption will lead to greater participation in PICMG and industry-specific standards development to meet emerging IIoT requirements.

In the coming year, we will continue reaching out to industry leaders and other consortia (including the TCG, IIC, and FOG) with complementary sets of expertise to collaboratively address rapidly developing requirements.

Where to see PICMG in 2018 Currently, we have approximately one-third of our members in North America, one-third in Asia, and one-third in Europe. We have started to invest more PICMG resources to support international efforts. We are determining the interest level in setting up regional groups and will attend a number of events in 2018 to further support international and regional efforts.

The event with the greatest number of members exhibiting is embedded world this winter in Nuremberg (February 27 – March 1, 2018). In addition, DESY will be holding its 6th MicroTCA Workshop in December. PICMG will also have a presence at a few events in Japan, including IT Week; the officers will also be walking and attending various IoT, industrial, and military events throughout the coming year.

PICMG next steps: #1 – Increase member participation Much of my work in 2017 has in been streamlining operations: reworking the expenses to enable greater investment in valueadded offerings for our members, modernizing specification distribution, and responding to member questions. In the coming year, I will focus even more time on our members.

The officers are exploring the possibility of providing a second path for engagement with PICMG that would enable members to bring forward more pre-work on specifications into an expedited path. This investigation may lead to PICMG-endorsed specifications that have not been fully vetted to a true PICMG Standard level. www.picmg.mil-embedded.com

In 2018, we will continue to prepare PICMG to meet the next decades of embedded computing challenges through working closely with industry leaders to enable companies’ use of PICMG processes. We will further educate and evangelize about the value of open standards to both current and upcoming generations of engineers. University and student involvement will be important to recruit the next generation of engineers by making them aware of PICMG standards and embracing the value of open standards. Our long-term goal: getting new engineers to actively participate in defining new standards.

There is an opportunity to expand our membership among hundreds of companies who have purchased COM Express and CompactPCI Serial specifications, but who have not yet joined PICMG. We will encourage them to join so that they can participate in the specification development process; we will also continue to encourage engineers and marketers from our member companies to participate in the development and promotion of open standards and PICMG specifications.

I am confident that increased participation will lead to the innovations which will meet our industry’s evolving needs.

Whether you are currently a member or planning to become one­, I encourage you to contact us at officers@picmg.org and let us know how we can work together.

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Technology Focus

COM Express hot among military electronics users while CompactPCI levels off

By John McHale, Editorial Director

Photo courtesy U.S. Department of Defense.

PICMG standards such as CompactPCI have been leveraged for years in aerospace and defense applications such as communications, avionics, and satellites. Today, the fastest growing standard from the PICMG experts is COM Express, thanks to its flexibility and reduced size, weight, and power (SWaP) characteristics.

Standards such as CompactPCI, Advanced TCA, and – to some extent – MicroTCA have played a role in aerospace and defense electronics applications. CompactPCI led the way, as it provided a robust, cost-effective alternative to VME, especially in the 3U form factor. Today, however, stringent SWaP requirements are requiring form factors smaller than 3U; this area is where the Com Express standard is thriving.

two PCIe 8 outputs, which translates to a lot of I/O coming in a small package. You can also tailor the compute power based on SWaP requirements – from a Xeon to a Corei5.” (Figure 1.)

“COM Express is very hot right now,” says Roy Keeler, senior product manager and manager of business development, aerospace and defense, ADLINK Technology (San Jose, California). “COM Express can be used in multiple military applications where reduced SWaP is a priority, such as unmanned aerial vehicles (UAVs), avionics, and more.

“COM Express is also a busless system, so you don’t need a backplane, which makes it attractive for customers who do not need the high-speed switched fabrics that come with a VPX system,” Keeler notes. “It has the same processing power and no backplane.”

“It is being used to operate subsystems, for instance. Mostly subsystems have a box with some I/O added to it and use Com Express as a controller,” he continues. “In areas where you don’t need high compute power, you can build a standalone solution that leverages a NVIDIA Jetson TX2, for instance. The enticing thing about Com Express is its flexibility when it comes to multiple pinouts and module sizes that are all available right off the shelf. It also has multiple display and video outputs with 16 lanes of PCIe 16 or

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“From the Connect Tech perspective, we are seeing a significant interest in COM Express Type 7, the ability to leverage server-class processing power that was www.picmg.mil-embedded.com

processors, makes Type 7 an exciting new option. What was originally only available in large rackmount systems can now be accessed in small-form-factor solutions, ­ruggedized, and ready-to-deploy compute platforms. The other key feature is the introduction of high-bandwidth 10 Gigabit Ethernet (10GbE) network communication.

Our customers can now make use of this high bandwidth connectivity using native Xeon D 10G capabilities.”

“THE ENTICING THING ABOUT COM EXPRESS IS

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ITS FLEXIBILITY WHEN IT COMES TO MULTIPLE PINOUTS

Figure 1 | ADLINK’s Express-BD7 – a COM Express COM.0 R3.0 Basic Size Type 7 module supporting the 64-bit Intel Xeon processor D and Pentium D processor system-on-chip (SoC) – is specifically aimed at designers needing excellent computing performance with balanced power consumption and multiple 10G Ethernet connectivity in a long-product-life solution.

AND MODULE SIZES THAT ARE ALL AVAILABLE RIGHT OFF THE SHELF. IT ALSO HAS MULTIPLE DISPLAY AND VIDEO OUTPUTS WITH 16 LANES OF PCIE 16 OR TWO PCIE 8 OUTPUTS, WHICH TRANSLATES TO A LOT OF I/O COMING IN A SMALL PACKAGE.”

previously unavailable under the COM Express standard,” says Michele Kasza, vice president of sales at Connect Tech (Guelph, Ontario). “Access to Intel Xeon D processors and being able to hit scalable computing performance with access to four, eight, and 16 core

– ROY KEELER, ADLINK TECHNOLOGY

COM Express update added functionality As Kasza mentions, the latest update to COM Express adds server-grade functionality to COM Express embedded computing systems. Revision 3.0 of COM Express provides for a new Type 7 connector and the addition of up to four 10GbE interfaces on

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Technology Focus the board, according to PICMG. According to the organization, previous revisions of the specification were limited to a single Gigabit Ethernet interface. The higher-speed ports open up new markets such as data centers, where the high compute density of COM Express can result in increased rack utilization. The 10GbE ports are also ideal for high-bandwidth video applications such as surveillance. Another change to the specification includes increasing the number of PCI Express lanes to 32 across the Type 7 connector, a move that provides a wealth of connectivity and interface options, including the ability to facilitate the use of general-purpose graphics processing units (GPGPUs). (Figure 2.)

“It’s COM Express, number one,” says Mark Littlefield, head vertical product manager, defense, for Kontron. “While COM Express was not explicitly designed with rugged deployed military systems in mind, it has proven to be tremendously versatile and is allowing us to design and deploy smaller and less expensive systems than bladebased approaches could support. Type 6 COM Express is ideal for general solutions where the typical complement of I/O (USB, SATA, serial ports, audio, video, GPIO, etc.) is needed, while Type 7 swaps video and audio for 10GbE and more PCI Express ports for more demanding streaming I/O processing applications.”

COM Express growth is emblematic of the strength of the overall computer-onmodule market.

“Computer-on-module market growth is just outstanding for certain types of form ­factors, and COM Express crosses both industrial and military lines. Curtiss-Wright uses it in a healthy number of systems, as we’ve found it to have significant advantages over PC/104 systems,” says Mike Southworth, a product marketing executive with Curtiss-Wright Defense Solutions (Ashburn, Virginia). “Historically, Parvus [acquired

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Figure 2 | Connect Tech has released an off-the-shelf COM Express Type-7 carrier board. This carrier occupies the same footprint as COM Express Basic at only 95 by 125 mm.

by Curtiss-Wright in 2013] mission computers were designed with PC/104 technology, which helped us achieve a great degree of modularity. However, PC/104 SBCs [single-board computers] didn’t have standardized I/O connectors like COM Express, and this led to longer engineering development cycles for system integration, which meant longer time to market. In addition, PC/104 introduced thermal management challenges when using hotter CPUs.

www.picmg.mil-embedded.com

“CompactPCI is still being used in military applications in the U.S., but it it’s not getting new designs as the industry continues to migrate to VPX,” Keeler says. “We still support a mix of 3U and 6U CompactPCI products military applications such as communication racks.”

“Curtiss-Wright consciously moved away from CompactPCI some number of years ago as 3U VPX began to rise and become the preferred choice among our military customers,” Southworth says. “We don’t see CompactPCI having a resurgence, rather only for legacy program support.”

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Figure 3 | Curtiss-Wright leverages COM Express for its ultrasmall-form-factor (USFF) mission computer, the Parvus DuraCOR famil

Others are much more bullish on CompactPCI in defense applications: “CompactPCI is still a surprisingly strong seller, both within the U.S. and internationally,” Littlefield says. “As a result, we are continuing to refresh both our 3U and 6U product lines.

(See Figure 4.) One may have thought that VPX would do the same to CompactPCI

“When we started to integrate COM Express modules into our system architectures, we reduced our legacy system size by more than 25 percent, increased system technology re-use, and overcame our traditional thermal management challenges,” Southworth continues. “COM modules works quite well for reduced SWaP applications in avionics and other applications that require the smallest SWaP possible.” (Figure 3.)

ATCA and MicroTCA Use of Advanced TCA and MicroTCA standards are declining within the defense market, according to many in the industry.

“ACTA and µTCA seem to both have fallen by the wayside,” Littlefield says.

“I think that VPX has done a pretty good job at supplanting them within the defense market.”

“We see a little bit of ATCA and MicroTCA, but ATCA in military applications is declining according to a merchant embedded board market survey,” Keeler says. “The issue is that the form factor is too big for anything but wide-body type aircraft.”

CompactPCI The CompactPCI standard first became popular in 6U form factors with telecommunications applications, then as a cost-effective alternative to VME in military electronics applications, eventually becoming the choice standard in military 3U applications until the VPX standard was released. Today it has a strong legacy business, but not everyone agrees on its future growth within military applications. www.picmg.mil-embedded.com

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Technology Focus as it did to ATCA and µTCA, but that hasn’t been the case. CompactPCI continues to be an attractive solution, especially for systems that don’t have the huge backplane and out-of-box I/O requirements that VPX is more geared for – although there are customers out there that opt for the CompactPCI Serial route in order to leverage infrastructure, IP, and technical expertise gained from previous projects. We see at least a couple more generations of CompactPCI product in our future, and perhaps even more.”

CompactPCI Serial CompactPCI Serial is PICMG’s serial answer to the VPX standard out of VITA. It has yet to gain much traction in U.S. defense applications, but interest is mounting and the new standard is gaining ground in Europe.

The core CompactPCI Serial specification provides high-speed serial performance to the 3U/6U Eurocard form factor, according to a PICMG release. It enables the use of PCI Express Gen3, 40GbE, or other high-speed protocols with a rugged and cost-effective connector solution. It is used in a wide range of applications, including railway/transportation, military/aerospace, industrial automation, and more.

Engineers at Elma Electronic (Fremont, California) have sold a CompactPCI Serial 3U solution to a defense customer for a significant upgrade of CompactPCI in a maritime application, says Steven Gudknecht, product marketing manager for Elma. In some cases CompactPCI Serial can be as much as 75 percent more affordable than VPX without a loss in performance, he adds.

“There are customers out there who are finding success with CompactPCI Serial – enough that we support them with new products,” says Mark Littlefield. “What

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In this e-cast, industry experts will cover methods for removing heat in military signal processing systems of all sizes, from small form factors to larger designs.

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Figure 4 | Kontron offers the 6U CP6006(x)-SA, a Xeon-D-based SBC that is highly scalable (from two to 16 cores).

For 3U, the CP3004-SA – a 5th-generation Core-i7 based SBC with a range of expansion options – is available.

we’re finding is that these customers all have a long legacy of working with CompactPCI, but their applications require them to make use of highspeed serial I/O. It only makes sense, then, to leverage all of the assets acquired through that legacy and adopt CompactPCI Serial rather than jump to an entirely new form factor like VPX.” ADLINK has yet to see that kind of activity for military applications, Keeler says. “We not getting much uptake on it and have not put into a road map yet as there have not been a lot of inquiries for it.”

PICMG members recently ratified the CompactPCI Serial Space specification, which is a ruggedized version of CompactPCI Serial that specifically addresses the extreme environment requirements for outer space. The CPCI-S.1 R1.0 specification, ratified in August 2017, is intended for use aboard deployed satellites as the platform system and the payload controller; it can also be used on Earth for the control systems and ground stations. According to the spec, regular CompactPCI Serial products can be combined with CompactPCI Serial Space products to develop test and simulation systems.

CompactPCI Serial Space was selected for the OneWeb program, under which more than 900 satellites will use the technology to logically interlock with each other to create a high-speed connectivity coverage footprint over the entire planet. www.picmg.mil-embedded.com

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Technology Focus

Seeking a unified hardware approach for IIoT control

By Brandon Lewis, Technology Editor Although the Internet of Things (IoT) has emerged in every market segment, its implementation varies widely. In the Industrial IoT (IIoT), for example, a much more robust, reliable set of technologies is required than in the consumer world. Here, technology standards organizations will play an important role in ensuring that safety-critical IIoT systems can be developed at the lowest cost, fastest time to market, and minimize the low-level software engineering burden.

Doug Sandy

In this Q and A with Doug Sandy, Vice President of Technology for PICMG [PCI Industrial Computer Manufacturers Group], he discusses standardization and interoperability, the baseline requirements for IIoT standards, existing PICMG technologies that are well suited for the job, and the need for baked-in security compliance in future specifications.

PICMG TECHNOLOGIES: Given the diversity of the Internet of Things (IoT), how deep can standards take us? Obviously IP is one issue, but lower-level protocols, middleware, security, and the like are more difficult, not to mention hardware.

SANDY: You are right in pointing out the diversity of IoT. We often talk about IoT as if it is a monolithic marketplace, but really it is more of an enabling technology.

Everything from consumer-fitness devices to power-grid controllers and automated vehicles have been referred to as IoT. Clearly, there are big differences in the needs of each of these.

Within PICMG, we are focusing primarily on the needs of IIoT. This is a natural outgrowth of the automated industrial computing segment that we have served for over twenty years.

Here, the requirements for reliability, rugged packaging, safety, and security are more

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important than the typical consumer device. Furthermore, hardware and software interoperability also tends to be more important as sensors, actuators, and controllers from multiple vendors must work together seamlessly. All of this can benefit from standardization.

A similar story has already played out in telecommunications. Network functions virtualization (NFV) enabled operators to decouple their hardware and software purchasing decisions and move away from expensive, purpose-built proprietary www.picmg.mil-embedded.com

systems. This enabled new companies to enter the market by focusing on either high-quality software solutions or “white box” hardware solutions. Operators have the freedom of choice to select the best hardware solution to meet their installment requirements independent of their software selection.

PICMG TECHNOLOGIES: What benefits do uniform hardware platforms bring in terms of programming? Can they enable more “IT” type engineers to develop solutions for the operational technology [OT] domain?

SANDY: Can IT development resources be used to monitor and control a large array of sensors and actuators? If cloud computing is an indicator, the answer is a resounding “yes.” Here, huge racks of equipment are provisioned, monitored, and controlled using predominantly IT techniques such as RESTful interfaces. In each installment, data from thousands of rack-level sensors are constantly being monitored in order to provide us with the efficiency and reliability of cloud services that we have come to expect.

Granted, there are differences between cloud data centers and industrial deployments, such as safety issues related to equipment control. In these cases, it’s likely that additional non-IT personnel will be required to configure the system and verify its integrity.

PICMG TECHNOLOGIES: What do you envision as the baseline requirements of such a platform (I/O, networking, modularity, SWaP [size, weight, and power], etc.)?

SANDY: Typical hardware requirements include Ethernet networking for upstream connections as well as a variety of downstream control networks such as CAN, Industrial Ethernet, and I2C. More importantly, however, the manner in which the controller gathers information and reacts to events from downstream devices also requires standardization if the controller is to be useful. www.picmg.mil-embedded.com

WITHIN PICMG, WE ARE FOCUSING PRIMARILY ON THE NEEDS OF IIOT ... HERE, THE REQUIREMENTS FOR RELIABILITY, RUGGED PACKAGING, SAFETY, AND SECURITY ARE MORE IMPORTANT THAN THE TYPICAL CONSUMER DEVICE. FURTHERMORE, HARDWARE AND SOFTWARE INTEROPERABILITY ALSO TENDS TO BE MORE IMPORTANT AS SENSORS, ACTUATORS, AND CONTROLLERS FROM MULTIPLE VENDORS MUST WORK TOGETHER SEAMLESSLY. ALL OF THIS CAN BENEFIT FROM STANDARDIZATION.

From a hardware perspective, we are seeing a lot of interest in COM Express. This makes sense because its small form factor, processing performance, and flexible I/O configuration make it a natural fit for small gateways and control functions in small to medium installations, with distributed controllers for larger deployments. CompactPCI Serial has been adapted for railway control and space and may also serve as a flexible gateway/controller in larger installations.

Pieces of the existing PICMG hardware platform management (HPM) solution may also be useful within a rack or over a local sensor network. When communicating upstream, however, I believe interfaces based on a uniform data model and RESTful interfaces are probably the best way to go. Because of PICMG’s expertise in industrial control we are currently investigating the unique requirements of IIoT control and management in order to determine what software standardization might be needed.

PICMG TECHNOLOGIES: Do you see a need to build security and/or wireless components/certification into future PICMG IoT standards?

SANDY: With news about hacks occurring regularly, security is top of mind for everyone involved with IIoT. Potential damage due to hacking a factory or power grid has immediate and long-reaching implications that go far beyond the typical case of identity theft or credit fraud. This being said, PICMG recognizes that security is not owned by any single entity, but rather by each and every entity within the supply chain. Our IoT specifications will include requirements for compliance with all security standards that are relevant to IIoT deployments.

Doug Sandy, the Vice President of Technology for PICMG, has more than 24 years of industry experience in the embedded computing, industrial automation, telecommunications, and cloud computing spaces. Doug has worked as technical fellow, chief technology officer, and chief architect for major corporations including Motorola, Emerson, and Artesyn Embedded Technologies.

Sandy has focused much of his career on advancing industry standards that provide multivendor interoperability and commercial off-the-shelf (COTS) solutions such as DeviceNet, ETSI NFV, and the PICMG families of specifications. He now enjoys training the next generation of engineers at Arizona State University’s Polytechnic Campus, where he is a full-time educator and program coordinator for software engineering capstone projects.

PICMG [PCI Industrial Computer Manufacturers Group] www.picmg.org Fall/Winter 2017 | PICMG Systems & Technology Application Guide |

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PCI Industrial Computer Manufacturers’ Group (PICMG) Consortium Info

Thousands of PICMG-compliant products, ranging from components and subsystems to complete applicationready systems, are commercially available, representing more than $5 billion yearly in global revenue.

PICMG is a nonprofit consortium of companies and organizations that collaboratively develop open standards for high-performance telecommunications, military, industrial, and general-purpose embedded computing applications.

Founded in 1994, the group has more than 250 member companies that specialize in a wide range of technical disciplines, including mechanical and thermal design, singleboard computer design, very-high-speed signaling design and analysis, networking expertise, backplane and packaging design, power management, high-availability software, and comprehensive system management.

Key standards families developed by PICMG include CompactPCI, AdvancedTCA, MicroTCA, AdvancedMC, CompactPCI Serial, COM Express, SHB Express, and HPM (Hardware Platform Management). In its more than two decades of operation, PICMG has published over 50 specifications developed by participants from hundreds of companies. Work on standards across a wide range of markets, applications, and technologies continues as the boundaries of datacom, telecom, military and aerospace, industrial, man/machine interface applications, and deeply embedded computing continue to blur.

Equipment built to PICMG standards is used worldwide, with any company allowed to build or use equipment without restriction (although certain technologies used for some military applications may be subject to U.S. export restrictions governed by ITAR rules).

A rigorous intellectual property (IP) policy ensures early discovery of any memberowned IP; moreover, all members must agree to “reasonable and non-discriminatory” (RAND) licensing of any IP written into a standard. To date, no PICMG standard requires any license or royalty to build or operate.

PICMG adheres to a formal, multistep development process. Development work can be periodically be reviewed by all member companies, although work inside of a technical subcommittee is confidential to the members of that committee until that work

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is ready for broader review by other members. Until a specification or standards-related document is ratified by the entire membership, it is confidential to PICMG. After ratification, all documents are available to the general public.

Why use PICMG standards?

PICMG standards – because the organization has such a large number of contributing companies – reflect the extremely wide and deep technical capabilities of its members. By using well-understood and proven open standards, vendors can bring products to market quickly. Customers gain from the price and performance competition that results from many vendors operating in an open marketplace.

Thousands of PICMG standards-­compliant products – ranging from components and subsystems to complete applicationready systems – are commercially available, representing more than $5 billion per year in global revenue.

To Learn More To learn more about the PICMG organization and membership, please visit www.picmg.org/membership/ or email info@picmg.org. www.picmg.mil-embedded.com

OPEN MODULAR COMPUTING STANDARDS There are nine distinct “families” of PICMG standards. Many have subsidiary specifications that are designed to add additional capability.

Please visit www.picmg.org/openstandards/ to learn more about each one. ›› Advanced TCA: This high-performance modular standard, also called ATCA, was developed for critical central-office telecommunications applications and is also used for a wide range of commercial and military applications. It offers a complete management infrastructure so that high-availability systems with “six nines” reliability can be deployed. ›› CompactPCI: A modular general-purpose computing system based on 3U and 6U Eurocard mechanical standards, it features hot-swap capability and can be either convection- or conduction-cooled. With hundreds of thousands of installations worldwide, this popular architecture is one of the most successful and popular standards in use today. ›› COM Express: This small-form-factor (SFF) standard is designed for deeply embedded applications where space is at a premium but high performance is required. COM Express boards can be used as standalones or plugged onto an application-specific baseboard with I/O expansion. ›› MicroTCA: Often called “AdvancedTCA’s little brother,” MicroTCA is a modular platform for building smaller and less-expensive systems that AdvancedTCA while retaining the high-availability architecture of AdvancedTCA. MicroTCA systems use AMC modules as their basic computing and I/O building blocks. ›› Advanced MC: This standard defines a family of small, hot-swappable, and fully managed mezzanine cards that can be used to tailor I/O for large AdvancedTCA systems or used as the basis for building MicroTCA systems. They are commonly called “AMCs.” ›› CompactPCI Serial: This relatively new standard uses CompactPCI’s mechanical structure but updates the system interconnects to include PCI Express, Ethernet, SATA, and USB. It offers 20 to 40 times the backplane bandwidth of CompactPCI and is ideal for new applications or upgrades to older systems. ›› SHB Express: This upgrade to the PCI-ISA standard replaces parallel PCI interconnects with serial PCI Express lanes, improving performance and increasing compute power. A passive backplane is used, and standard desktop PCI Express cards can be used for I/O customization. ›› Hardware Platform Management: Also known as “HPM,” this software standard defines how to build fully managed, high-availability AdvancedTCA or MicroTCA systems. It is the first, and currently the only, open standard for system management. ›› PCI-ISA: PICMG’s first open standard, PCI-ISA is used to build rugged, reliable, and maintainable computers that are designed to replace desktop PCs in industrial-control communications or data-acquisition applications.

The PCI-ISA standard moves all of the active circuitry normally found on a motherboard to an easily replaceable and upgradable plug-in card.

While standard PC cards plug into other slots to customize a system, a PCI-ISA system uses a passive backplane consisting of connectors with no active components. ›› New standards and under development: The cPCI Serial Space specification, a ruggedized version of CompactPCI Serial that specifically addresses the extreme environment requirements for outer space, was ratified in August 2017.

New standards arise when members identify the need to create a new embedded computing standard for a particular market or application. www.picmg.mil-embedded.com

Fall/Winter 2017 | PICMG Systems & Technology Application Guide |

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PCI Industrial Computer Manufacturers’ Group (PICMG) Consortium Info

THE VALUE OF OPEN STANDARDS What makes PICMG a leading standards organization?

PICMG has more than 250 member companies, all of which combine to bring an extremely wide and deep talent base to the table.

Unlike some other consortia, PICMG is not controlled by one or a few companies: It is governed by the Executive Members that work together to ratify processes and procedures, elect officers, and approve budgets. PICMG maintains a “one company-one vote” policy, which means that no single company can dominate the standards-development process.

Over the last several decades, open standards have become increasingly important for a wide range of embedded and specialized computer applications, both big and small. While the definition of “open standard” can vary, for the embedded computer world it usually means a succinct definition of everything a vendor needs to know to build equipment and write software that will work with compatible products offered by other vendors.

In an organization like PICMG, all players, whether large or small, can take an important role. Participants have access to thought leaders in areas they or their company may lack expertise. They also can meet experts in a wide range of engineering disciplines.

PICMG also has an outstanding intellectual property (IP) policy that ensures that members must submit IP declarations throughout the standards-development process, where they can be accepted for use or rejected. To date, no PICMG standard or specification has required any user licenses or royalties. Moreover, anyone can build equipment in accordance with or use PICMG standards whether they are members or not. PICMG is truly an open organization. Dues are low: In fact, the cost of a yearly Executive membership has not changed in 20 years.

To Learn More To learn more about the PICMG organization and membership, please visit www.picmg.org/membership/ or email info@picmg.org.

JOINING PICMG Why join PICMG? By joining an organization like PICMG, anyone can play an important role. Participants have access to thought leaders in areas they or their company may lack expertise. They come to know experts in a wide range of engineering disciplines. The groups that develop these open standards do so because they are interested in getting something done in a finite amount of time; whenever possible, bureaucracy and politics are kept to a minimum. Members of these development groups have a common goal: To create standards that are widely used and that each company involved can make money from. Companies can specialize in their areas of expertise without needing to be good at everything. In addition to technical collaboration, business collaborations often evolve in a symbiotic way.

Companies that participate in standards development also have a very important advantage: They are already up to speed when the standard is released and can thus be first to market with compliant and leading-edge products.

In its 20-plus years of operation, PICMG has published almost 50 open industry specifications that encompass nine basic standards families developed by participants from hundreds of companies. The Consortium plans to continue its work across a wide range of technologies. Member companies of PICMG have some big plans for the next decade, as designers in the data communications, telecommunications, industrial, and military/aerospace arenas embed technology ever more deeply into specialized and everyday products.

To Learn More To learn more about the PICMG organization and membership, please visit www.picmg.org/membership/ or email info@picmg.org.

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www.picmg.mil-embedded.com

PCI Industrial Computer Manufacturers’ Group (PICMG) Consortium Info

LIST OF PICMG EXECUTIVE MEMBERS ADLINK Technology Inc. www.adlinktech.com

Keysight Technologies www.keysight.com

Advantech Co., LTD www.advantech.com

Kontron www.kontron.com

Airbus Defence & Space airbusdefenceandspace.com

Meinberg Funkuhren GmbH & Co. KG www.meinberg.de

Amphenol FCI (AFCI) www.fci.com

MEN Mikro Elektronik GmbH www.menmicro.com

BAE Systems www.baesystems.com

MSC Technologies GmbH www.msc-technologies.eu

congatec AG www.congatec.com

N.A.T. GmbH www.nateurope.com

Dawn VME Products www.dawnvme.com

National Instruments www.ni.com

DESY www.desy.de

Parpro Systems parpro.com

Elma Electronic Inc. www.elma.com

Pentair Electronics Protection www.pentairprotect.com

Ennoconn Corporation www.ennoconn.com

PICMG China www.picmg.org/member/picmg-china

Ericsson AB www.ericsson.com

Pixus Technologies Inc. www.pixustechnologies.com

ERNI Electronics GmbH www.erni.com

Polyrack Electronic-Aufbausysteme GmbH www.polyrack.com

European Spallation Source ERIC europeanspallationsource.se

Portwell, Inc. www.portwell.com

Eurotech S.p.A. www.eurotech.com

Radisys Corporation www.radisys.com

Extreme Engineering Solutions www.xes-inc.com

RECAB recab.com

Fraunhofer FOKUS www.fokus.fraunhofer.de

RTD Embedded Technologies, Inc. www.rtd.com

Fujitsu Limited www.fujitsu.com

Sanritz Automation Co., Ltd. www.sanritz.co/jp

General Micro Systems Inc. www.gms4sbc.com

Simonson Technology Services www.simonsontech.net

Harting Inc. www.harting-usa.com

SLAC National Accelerator Laboratory www6.slac.stanford.edu

HEITEC AG www.heitec.de

Southco Inc. www.southco.com

Huawei www.huawei.com/en

TE Connectivity www.te.com

IN2P3-CNRS www.in2p3.fr

VadaTech Inc. www.vadatech.com

Institute of High Energy Physics english.ihep.cas.cn

Yamaichi Electronics yamaichi.com

Intel Corporation www.intel.com

ZTE Corporation www.zte.com

www.picmg.mil-embedded.com

Fall/Winter 2017 | PICMG Systems & Technology Application Guide |

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PICMG Systems & Technology Application Guide

Communications & Networking

Communications & Networking

Sponsored By:

AMTELCO XDS T1/E1 Gateway & E&M Radio Interface Appliances

Sponsored By:

NAMC-ODSP-W – small cell and wireless processing for LTE, LTE-A, 5G and MIMO

The NAMC-ODSP-W is aimed at LTE, LTE-A and 5G systems that require MIMO technologies and enables complete RF to Layer 3 wireless basestation functionality to be implemented on a single mid-size AMC.

AMTELCO is pleased to announce two new Appliances: The XDS T1/E1 Appliance, and the XDS E&M Appliance. Both appliances are small, compact, highly cost-effective, and are Asterisk™-based for quick implementation of applications.

The XDS T1/E1 Appliance includes a single T1/E1 span, and an Ethernet port, and can be used as a VoIP gateway using the SIP capabilities of Asterisk. AMTELCO’s highly successful T1/E1 protocols are used for the T1/E1 interface. The T1/E1 Appliance is the perfect solution for systems requiring a T1 or E1 to VoIP gateway, a VoIP PBX with T1 or E1 telecom input, or any other Asterisk-based switching application requiring T1 or E1 input.

The XDS E&M Appliance is designed to interface with radios.

Bidirectional connection of the single 4-wire E&M interface to a corresponding SIP channel on the Ethernet interface is implemented through standard Asterisk dialplan entries. Independent control of the M-lead signaling is supported for radio push-to-talk (PTT) compatibility. External LED indicators provide visual confirmation of E-lead and M-lead signaling activities. Protocol support is available for Type I, Type II, Type IV, Type V, and Manual signaling.

Both AMTELCO Appliances include an internal web server allowing user-programmable port settings and arrangement of the Asterisk dialplan through a custom designed web interface. Additional connectivity to the Linux and Asterisk environments is available through SSH. AMTELCO XDS also offers a complete line of HMP, PCI, and PCI Express Boards, helping developers meet their application needs. Boards are available for T1/E1/J1, Station, Conference, BRI, E&M, and Loop Start.

Combining four RF channels with DSP, FPGA and ARM based processing, this module includes a comprehensive range of software including Linux , L2/L3 stack, virtualized core network software and PHY firmware.

A GPS antenna input on the front panel connects to GPS receiver circuitry for GPS clock synchronization. The front panel also features a control connector for an external power amplifier.

A variant of the NAMC-ODSP-W offers a dual SFP connector to the front panel to enable a CPRI link to external RF, allowing the module to be used in conjunction with third party remote radio head (RRH) solutions i.e. like the N.A.T. NAMC-SDR. The standard variant of the NAMC-ODSP-W, with dual AD9361 RF-SoC devices, two channels of any cellular standard can run independently of each other. In the NAMC-ODSP-W variant with dual SFP connectors, each DSP will function independently, therefore the NAMC-ODSP-W can run up to two separate cellular channels of any cellular standard and use CPRI links.

Please contact us for a four channel version.

Features • Four OCT2224W DSPs • Xilinx Kintex-7 XC7K160T FPGA • Two quad-core ARM NXP LS1043A CPUs • Broadcom BCM5396 • On-board GPS receiver circuitry • Control connector to external power amplifier Supports up to: • 64 3G users • 130/50 Mbps LTE throughput • 20 Km range for all cellular standards

For more information, email xds@amtelco.com or contact us at 800-356-9224 or 608-838-4194.

Applications • LTE • LTE-A

http://xds.amtelco.com/appliances.php http://picmg.opensystemsmedia.com/p374412

www.nateurope.com/products/NAMC-ODSP-W.html http://picmg.opensystemsmedia.com/p374417

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• •

5G Network Testing MIMO

www.picmg.mil-embedded.com

Communications & Networking PICMG Systems & Technology Application Guide

Communications & Networking

Sponsored By:

HEITEC Bench-top and Rack-mount Systems for CompactPCI, CompactPCI Serial HEITEC supplies complete plug & play system platforms for CompactPCI and CompactPCI Serial applications. The systems are based on robust mechanics and standardized components which can be individually combined, depending on the individual project requirements.

They include power supply, backplane, EMC and ESD protection, and cooling; fully assembled, pre-wired and tested. The line-up spans platforms with 4-8 vertical or horizontal slots in different heights (1-9U) and widths (40HP to 84HP); examples are the HeiPac Vario VM-R CPCI-S – a 4U, 5 slot CompactPCI Serial platform for 3U modules with radial fans and the HeiPac Vario-A CPCI-S rack mountable version with axial fans.

HEITEC’s AdvancedTCA System Platforms for Customized High-Availability Applications

www.heitec-eps.com http://picmg.opensystemsmedia.com/p374460

Communications & Networking

N.A.T. GmbH NATIVE-R2 – 2U MTCA.4 Chassis The NATIVE-R2 is a 2U MTCA.4.1 chassis that is particularly suited to telecommunications, industrial and research applications.

Supporting one double full-size MCH and its RTM and a standard power module the NATIVE-R2 can accommodate • Five mid-size and one full-size double AMCs • Up to five uRTMs • One JTAG switch module This enables you to build a compact, multi-purpose compute system for a wide variety of applications. The compact design and support for PCIe Gen3 x8 makes the NATIVE-R2 ideal for applications with high connectivity requirements, such as high energy physics and telecom edge, access and aggregation equipment. www.nateurope.com/products/NATIVE-R2.html http://picmg.opensystemsmedia.com/p374414

Communications & Networking

N.A.T. GmbH NAMC-SDR – RF Interface Card for Software Defined Radio The NAMC-SDR is a flexible software defined radio (SDR) platform for developing, prototyping and testing 5G massive MIMO base station transceiver systems (BTS) and proprietary or standard implementations of UMTS, LTE / LTE-Advanced systems, as well as a variety of applications ranging from cognitive radios to resilient security networks.

The NAMC-SDR can easily scale up to dozens of antennas on the access link, providing higher data rates by advanced beamforming techniques. The NAMC-SDR can also connect to the NAT NAMC-ODSP-W for baseband processing and be integrated with other N.A.T. products to provide a complete BTS infrastructure solution in-a-box. www.nateurope.com/products/NAMC-SDR.html http://picmg.opensystemsmedia.com/p374413

www.picmg.mil-embedded.com

HEITEC supplies systems that are based on standardized components which can be individually combined and customized to meet specific project requirements. HEITEC offers customized system platforms based on the AdvancedTCA-architecture, thus ideally suited for the demands of communication applications. As the base architecture, AdvancedTCA provides access to off-the-shelf technologies and long-term, future-proof product availability. Thanks to the innovative and modular housing concepts, compact and highly service-friendly solutions can be implemented very cost-effectively and quickly, reducing development, product and lifetime costs.

Designs for the communications infrastructure are typically characterized by extremely high data throughput and complex data processing. In addition, the systems must provide high availability and operate without interruptions. Furthermore easy maintainability has to be provided with features such as redundancy and hot-swap capabilities of all major system building blocks. Cooling of the ATCA blades in the system platform has to be ensured even if one or multiple fans fail.

HEITEC’s capability to provide powerful AdvancedTCA system platform solutions is based on many years of extensive design and manufacturing experience. Having taken over Rittal’s Electronic Packaging product line in 2010 and combining it with more than 30 years of HEITEC’s expertise in designing and manufacturing high performance electronics systems, enables us to create the system platforms for our customers that exactly meet their needs.

The system platform above is one example of such a customer specific solution based on the AdvencedTCA architecture featuring a 6U, 5-slot chassis with redundant PEMs, redundant fan trays providing more than 300 Watt cooling performance per slot and a high-performance backplane with more than 100Gbit/sec throughput per slot. www.heitec-eps.com http://picmg.opensystemsmedia.com/p374461

Fall/Winter 2017 | PICMG Systems & Technology Application Guide |

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PICMG Systems & Technology Application Guide

Industrial Automation & Control Sponsored By:

Industrial Automation & Control

EKF Elektronik GmbH SC5-FESTIVAL – Intel Xeon equipped CompactPCI Serial CPU

conga-B7XD

The SC5-FESTIVAL is a rich featured high performance CompactPCI® Serial CPU board, equipped with an Intel® Xeon® E3 familiy processor (Kaby Lake platform) and 32GB of DDR4 ECC memory for demanding applications.

The front panel is provided with two Gigabit Ethernet jacks, two USB 3.0 receptacles, and two DisplayPort connectors. In addition, up to two USB Type-C front panel receptacles are available as an option, one of them usable alternatively as (third) DisplayPort.

On-board mass-storage solutions are based on a low profile mezzanine expansion card, which accommodates for M.2 NVMe (PCIe Gen3 x4) SSD modules. http://www.ekf.de/s/sc5/sc5.html http://picmg.opensystemsmedia.com/p374396

Military & Aerospace

The new conga-B7XD COM Express Type 7 Server-on-Modules features 10 Gigabit Ethernet interfaces, 32 PCIe lanes and headless server performance currently with up to 16 server cores and 48 gigabytes of DDR4 ECC RAM. Target applications for the new Server-on-Modules are industrial automation, storage and networking appliances as well as modular server designs and base stations for telecom carriers, service providers’ server farms , additionally cloud, edge and fog servers for IoT and Industry 4.0 applications.

The long-term available Server-on-Modules come applicationready, offering a standardized footprint, carrier board interfaces and a cooling concept, which significantly simplifies system designs – accelerating the launch of new, robust server technology. Future performance upgrades are remarkably simple and cost-efficient, as only the Server-on-Module needs to be exchanged for new processor architecture.

Feature set: • Available in 16 Core Intel® Xeon® processor to 2 Core Intel® Pentium® processor. They target commercial temperature (0°C to 60°C) as well as extended temperature ranges (-40°C to +85°C) for the industrial temperature range (-40°C to +85°C).

•

2x 10 Gigabit Ethernet ports

•

Supporting up to 48 gigabytes of 2400DDR4 (ECC or Non ECC)

•

NC-SI Network Controller Sideband Interface support.

•

24 PCIe Gen 3.0 Lanes and 8 PCIe Gen 2.0 Lanes

•

2x SATA Gen3 (6 Gbs) Further I/O interfaces, including 4x USB 3.0/2.0, LPC, SPI, I2C Bus and 2x legacy UART

•

OS support for Linux and Microsoft Windows variants

Alphi Technology Corporation XMC-CIV-FPDP The XMC-CIV-FPDP front-panel data port is a single-wide XMC mezzanine card that provides a high-speed bidirectional digital interface from the XMC bus to the front-panel data port (FPDP).

32-bit wide bus with selection of interfaces: TTL, RS-422 and can support a data rates from 80 MB/s up to 160 MB/s ANSI/VITA 17-1998 can be configured as a transmitter master, a receiver master, or a receiver.

Features • Single-wide XMC VITA 42 mezzanine • Front-panel data port industry standard ANSI/VITA 17-1998 compliant • Maximum data rate supported: up to 160 MB/s • Transmitter master, receiver master, or receiver mode • 128 KBytes deep Fifo www.alphitech.com http://picmg.opensystemsmedia.com/p374435

THE SPRING 2018 PICMG SYSTEMS & TECHNOLOGY RESOURCE GUIDE COVERS

COMING IN SPRING 2018

INNOVATIVE PRODUCTS | MARKET TRENDS

SUCH MARKET SEGMENTS AS TELECOM, ENTERPRISE, MILITARY/ EXTREME ENVIRONMENT, MEDICAL, AND

www.congatec.com http://picmg.opensystemsmedia.com/p374036

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www.picmg.mil-embedded.com

Military & Aerospace Sponsored By:

LinkedHope Intelligent Technologies CP62201 Based on Intel® 4th generation Core™ i7/i5 processors, CP62201 is a 6U CompactPCI Express board up to 4 cores/8 threads, with base frequency at 2.4GHz and turbo frequency up to 3.4GHz. CP62201 supports up to 16GB onboard soldered low voltage SDRAM. CP62201 integrates Intel® HD Graphics 4600 controller, supporting rich display interfaces, that can be up to “4K” with HDMI, DP or eDP outputs. CP62201 uses high-speed ZD connectors to transmit 4/2x 1Gb/10Gb Ethernet, up to x24 PCIe3.0, 2/8x USB3.0/2.0, 2/2x SATAII/III and other high-speed signals.

Target Applications: Video processing, Command & Control, Test & Measurement, Data-intensive processing system. www.linkedhope.com/Item/Show.asp?m=5&d=346 http://picmg.opensystemsmedia.com/p374411

Military & Aerospace

N.A.T. GmbH NAMC-ARRIA10-FMC – ARM/ FPGA Board with FMC-HPC Slot The NAMC-ARRIA10-FMC features the Intel® Arria® 10 GX or SX FPGA and a high pin-count FMC slot (VITA 57.1). Intel® Arria® 10 FPGAs deliver massive performance and power consumption improvements compared to prior generation FPGAs, both midrange and high-end devices.

Utilizing the FMC slot, which accepts a wide variety of modules providing data acquisition, networking, RF or other functionality, one can create a range of powerful single-slot embedded computing solutions.

Application examples include computing node, data acquisition and processing engine or SDR for wireless backhaul, optical transport, military radar, test and measurement, as well as video and image processing for broadcast, medical imaging and therapy. www.nateurope.com/products/NAMC-ARRIA10-FMC.html http://picmg.opensystemsmedia.com/p374415

Military & Aerospace

N.A.T. GmbH NAMC-ZYNQ-FMC – FMC Carrier AMC with XILINX ZYNQ-7000 The NAMC-ZYNQ-FMC features a Xilinx ZYNQ®-7000 FPGA and an FPGA mezzanine card (FMC) slot. This single-width, mid-size AMC is designed for data acquisition and processing applications and computing nodes. The ZYNQ-7000 FPGA provides the software programmability of an ARM®-based processor with the hardware programmability of an FPGA, enabling key analytics and hardware acceleration while integrating CPU, DSP, ASSP, and mixed signal functionality on a single device.

This module combines performance with the ability to add functionality through a wide range of commercial-off-the-shelf FMCs, including analogue-to-digital and digital-to-analogue converters, digital I/O and RF modules. N.A.T. can also customize this module. www.nateurope.com/products/NAMC-ZYNQ-FMC.html http://picmg.opensystemsmedia.com/p374416

www.picmg.mil-embedded.com

Rugged CompactPCI Serial HD-SDI H.264 Video Encoder

The HDCorder-SDI is an intelligent high definition video recording solution that accepts a HD-SDI input at up to 1080p60 and encodes it to the H.264 video encoding standard. The CompactPCI-Serial board solution is ideal for demanding applications in Military, Communications, Transportation, Mining and Energy industries.

In addition to capturing video and stereo audio data the HDCorder-SDI supports extraction of KLV (MISB 0605.3 compliant) embedded data contained within the HD-SDI signal. The video, audio and metadata are synchronized and transferred to the host system over the CompactPCI-Serial bus. An SDI monitor output is provided.

The HDCorder-SDI also features optional on-board redundant storage to compliment the host system storage and improve data integrity. This on-board cache acts as a rolling buffer, storing the most recently recorded data. This storage redundancy ensures no mission data is lost even when starved of host CPU attention in heavily loaded system configurations.

The HDCorder-SDI is a standard 3U CompactPCI-serial module and supported for Linux and Windows.

Features: • 1x HD-SDI input up to 1080p60 • Real-time HD H.264 encode at 1080p60 • Stereo audio capture from HD-SDI • KLV Metadata capture from HD-SDI • HD-SDI monitor output • Optional onboard redundant storage (up to 16GBytes) • Standard 3U CompactPCI-Serial mechanical form factor Applications: • Unmanned vehicles (UAV, ROV) • Mission Recorder • Rugged video recorders for marine, aviation • Border Security The CompactPCI serial standard is a logical progression of the highly successful PICMG 2.0 specification, bringing in multiple high-performance PCI Express connections. AMP is adding to the growing ecosystem of cPCI-S cards with a range of highperformance video and communications 3U cPCI-S cards. www.ampltd.com http://picmg.opensystemsmedia.com/p374018

Fall/Winter 2017 | PICMG Systems & Technology Application Guide |

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PICMG Systems & Technology Application Guide

Military & Aerospace