How Wafer Automation Helps Overcoming Productivity Challenges?

Introduction • The complexity in the outsourced assembly and test (OSAT) industry is blowing up owing to higher functionality demand, longer battery life and thinner forms in handheld devices. • OSAT factories are readily using complex packaging technologies for blurring the line between wafer packaging and wafer processing. • Through Wafer Automation we are able to meet the challenges of various wafer-level architectures, like modern wafer fabrication.

Comparison • Traditional OSAT production is relatively low-margin, and all the packaging services were in support of wafer requirements. • The advanced packaging applications have relatively high margins and are growing much faster than the semiconductor industry. • The OSAT companies are overcoming the competitive and technological challenges using wafer automation to reduce waste and errors, and get higher levels of output. • The various automation strategies increase responsiveness and flexibility leading to more efficiency.

What Are The Automation Strategies For WLP? •

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WLP factories face challenges to deliver multiple products of various sizes at acceptable yield levels that manage varying levels of complexity and handles time commitments with the latest methodologies. They closely resemble wafer fabrication in structure, performance, and operations. The WLP factories need tools for photolithography, sputter, CMP, dielectric deposition, plating, cleaning, inspection, measurement, and testing. Each equipment to be used should be singlewafer, so that batch operations meet the production requirements. The production tools and automated material handling systems should be 300mm for operations. The monitoring and controlling of such complex production operations are beyond the OSAT companies did in the past.

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