A Brief Introduction to Wafer Handling Equipment MultiLink SCARA Wafer Robot
There are several processes, including the transformation of wafers can be made by the wafer handling equipment to increase the speed of the machines. The implementation of high-tech control methods, fully-improved manipulation capabilities, elegant mechanical design systems, and direct-drive actuation are the various operations that boost the performance with high accuracy. How Robot Handling Systems Support in Task Manipulation?
The essential functions of robot handling systems for task manipulation are given below: The RHS allows a restricted straight-line movement to place the wafer in the center position. Once the wafer sets the positioning in the center, the straight line segment connects the process chamber, open cassette, FOUP with the longitudinal axis. In the next step, the linear motion coordinated with vertical movement to adjust the in-accurate positioning of the robotic-arm deflection. Based on the straight line segment, the wafer handling equipment works on the distinct RHS mechanical structures and functions to manipulate the task operations.
TYPES OF WAFER HANDLING EQUIPMENT/ WAFER HANDLING ROBOTS
Multilink Scara Wafer Robot The Multilink Scara wafer robot is the reliable and robust semiconductor wafer handling robot/equipment which fulfills the needs of quartz substrate by using the beam wafer sensors and end-grip end-effector.
Random Access Cylindrical WFH (Wafer Handling Robot) It is another fully reliable cylinder-shaped wafer managing robot that gives high-throughput, broad recovery intelligence, simple commands, real-time sensing, an off-axis barcode reader to maintain the process. WFH proffers a class 1 cleanroom applications, exceptional repeatability, flexible Wafer end-effectors to meet the high standards of performance capabilities.
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