EPT SEPT24

SEPTEMBER 2024

CANADA’S INFORMATION LEADER FOR ELECTRONIC ENGINEERS AND DESIGNERS

EPT.CA

ASIC OR FPGA?

Selecting the right IC for your design p.10

BENDABLE BATTERY Flexible power sources serve a range of applications p.12

SPECIAL SUPPLEMENT

CONTRACT ELECTRONICS MANUFACTURER GUIDE Find the best CEM partner for your project on pages 17-25

WHAT’S THE DIFF?

3D printing vs. pcb printing in the world of additive fabrication p.16

BE FLEXIBLE

The transformative impact of printed electronics on stretchable designs p.8

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INSIDE Cover photo: Sralon Photos (this page, from top): Sralon; Swindon Systems; IDtechEx; Voltera

Columns

4 EDITORIAL Transformative tech brings flexibility to design process 6 WEST TECH REPORT Symroc goes seismic with its low frequency monitoring 7 THINK GREEN Tektronix’ purchase of Elektro-Automatik makes for greener testing

In every issue

5 NEWSWATCH 26 NEW PRODUCTS 28 SUPPLY SIDE 29 AD INDEX 30 DEV BOARDS Eggtronic eval board boosts performance in wireless charger

SEPTEMBER 2024

COVER STORY

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THAT’S A STRETCH Discovering the advantages of printing functional inks on substrates.

ASIC OR FPGA? When it comes to hardware design, system engineers have more than one architecture to choose from.

THIN, PRINTED INTEGRATED Flexible batteries suit wearable and smart label markets.

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3D VERSUS PCB PRINTING Two technologies that stand out for their transformative potential.

XGL3014 Series

Ultra-low Loss Power Inductors • The lowest DCR and ultra low AC losses for greatest efficiency • Current ratings up to 16.0 A with soft saturation • Wide inductance range from 0.082 to 1.8 µH • Industry-leading 80 V voltage rating — suitable for wide VIN DC-DC converters

Free Samples @ coilcraft.com /XGL @EPTmagazine EPT_Coilcraft_Sept24.indd 1

September 2024 / EP&T

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2024-07-19 10:19 AM

EDITORIAL

Try to be more flexible

Canada’s information leader for electronic engineers and designers

SEPTEMBER 2024 Volume 46, Number 6

FPE adds innovation to electronic design process In an industry that thrives on the synergy between form and function, the advent of flexible and printable electronics represents a seismic shift for electronic designers.

These emerging technologies are not just the next big thing— they’re a transformative force that promises to redefine the boundaries of creativity, functionality and manufacturability.

Flexible Printed Electronics or FPE refers to lightweight, bendable electronic components printed on flexible substrates, enabling a range of innovative applications. And, this market is experiencing rapid growth, fueled by trends towards miniaturization, increasing demand for wearable technology and advancements in materials and printing techniques.

Currently valued at several billion dollars, the market is witnessing significant interest from sectors such as consumer electronics, automotive, healthcare and smart packaging. As manufacturers focus on enhancing performance and reducing costs, the adoption of flexible electronics is set to rise. Innovations in conductive inks and substrate materials are also facilitating this transition.

Flexible electronics includes circuits and devices that can bend, stretch, and conform to various shapes without losing functionality. Unlike traditional rigid silicon-based circuits, flexible electronics are built on substrates like plastic, metal foil, or even paper, offering a remarkable degree of physical adaptability.

The implications for design quite profound. Imagine wearables that truly conform to the human body, electronic devices integrated seamlessly into

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clothing, or medical sensors that wrap around limbs with precision.

These are no longer futuristic concepts; they are achievable realities thanks to flexible electronics.

For designers, this means an unprecedented freedom to innovate. The constraints of rigid circuit boards are no longer a bottleneck. Instead, you can explore organic, flowing shapes and create products that integrate more naturally into users’ lives. Whether you’re working on consumer electronics, healthcare devices, or even automotive interfaces, the ability to design around human or environmental contours rather than imposing rigid structures is a game-changer.

New techniques

shift rapidly, and the ability to pivot and respond can be a key competitive advantage.

With wearables, healthcare and the automotive industry serving as fertile ground for flexible implementation, the possibilities extend into the realm of the Internet of Things (IoT). With printable electronics, designers can create low-cost, disposable sensors that can be deployed in vast quantities to collect data in real-time across large areas, from smart cities to agricultural fields.

The low production cost and versatility of these sensors make IoT deployment more scalable and economically viable.

Challenges and considerations

Complementing the flexibility in While the potential of these techform is the innovation in produc- nologies is vast, it’s important to tion methods—namely, printable acknowledge the challenges that electronics. Using techniques come with adopting these techsuch as inkjet printing, screen nologies. Durability, for instance, printing, or gravure, electronic is a key concern. Flexible devices circuits can be produced on a are subjected to mechanical wide range of substrates with the stresses—bending, stretching, twisting—that rigid electronics same ease as printing on paper.

This technology democratizes are not. Ensuring that these dethe production of electronics vices maintain their functionality in two significant ways. First, it over time requires new materials reduces the cost of manufactur- and design approaches. ing. Traditional semiconductor Moreover, the integration of fabrication is capital-intensive, flexible / printable techniques requiring clean rooms, expen- into existing production lines is sive machinery, and significant not without hurdles. Standardoverhead. Printable electron- ization is still in its infancy, and ics, however, can be produced designers must navigate a landusing less costly materials and scape where material properties, methods, opening the door to manufacturing processes, and smaller firms and even startups performance characteristics can to innovate without the burden vary significantly.

For designers, this means of massive upfront investment.

Second, printable electronics staying ahead of the curve not support rapid prototyping and just in terms of creative applicacustomization. Designers can tion, but also in understanding experiment with circuit layouts, the technical nuances of these test iterations quickly, and refine emerging technologies. their designs in real-time. This agility is particularly valuable STEPHEN LAW in today’s fast-paced market Editor where consumer preferences slaw@ept.ca

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ELECTRONIC PRODUCTS & TECHNOLOGY / September 2024

info@ept.ca

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ARTIFICIAL INTELLIGENCE

AI PHONES TREND TOWARDS 70% OF MARKET

The future of the smartphone industry is set to be transformed as worldwide generative AI (GenAI) smartphone shipments are forecast to grow 363.6% year over year in 2024 to 234.2 million units, according to a new International Data Corporation (IDC) forecast.This represents 19% of the overall smartphone market in 2024.

IDC defines GenAI smartphones as devices that feature a system-on-a-chip (SoC) capable of running on-device GenAI models more quickly and efficiently leveraging a neural processing unit (NPU) with 30 tera operations per second (TOPS) or more performance using the int-8 data type.

Despite the challenges of elongated refresh cycles and macroeconomic uncertainties, GenAI capabilities on the smartphone will drive upgrades and represent a significant opportunity for both vendors and application developers alike. The dramatic growth seen in 2024 will carry into 2025 with shipments of GenAI smartphones expected to grow 73.1% year over year.

Unlike conventional medical imaging methods that produce images requiring expert interpretation, the system detects cracks and breaks clearly, providing straightforward information that is crucial in emergencies. It works by positioning two antennas on opposite sides of the suspected fracture site, with one antenna transmitting low-frequency microwaves through the bone to the other. The received data is then analyzed by a deep neural network — an AI model trained on extensive datasets of human body parts and bone fracture types.

EDUCATION

SIEMENS GIFT HELPS USASK DEVELOP CHIP DESIGN TALENT

MEDTECH

Photo (right): Huseyin Asliyuce / iStock/Getty Images Plus / Getty Images

AI-POWERED ANTENNA DIAGNOSES BONE FRACTURES

A University of Waterloo engineer has paired inexpensive wireless communication antennas with artificial intelligence (AI) to improve how doctors can detect bone fractures.

Determining bone fractures using traditional diagnostic methods such as x-rays, computed tomography (CT) scans, and magnetic resonance imaging (MRI) takes time — such equipment is not readily available in ambulances or primary care facilities and, with health care services in high demand, many people have to wait for an x-ray or scan once they arrive at the hospital. @EPTmagazine

An example of Dr. Omar Ramahi’s lab set-up shows a cow leg bone sitting between a dipole antenna and a horn transmitting antenna. The horn transmitting antenna sends a microwave signal towards the bone which is then received and classified based on the type of fracture in the bone.

The University of Saskatchewan (USask) has received a gift from Siemens to create a tenured professor chair in the USask College of Engineering for research and teaching that develops local talent in the large, fast-growing industry of electronic design automation (EDA).

EDA software is used to create electronic chips, which are used in almost all modern electronic devices. Siemens’ EDA software is used by the world’s largest technology companies to make better performing, higher quality electronic chips more quickly.Their Saskatoon office is a centre of excellence for research, development and customer applications, that employs engineers and computer scientists.

The Siemens EDA Chair, based in the Department of Electrical and Computer Engineering, will develop and teach undergraduate and graduate courses in EDA. The chair will also

supervise and mentor undergraduate research interns, master’s and PhD students, as well as visiting students and post-doctoral fellows.

AUTOMOTIVE

KEYSIGHT AND NXP SET AUTOMOTIVE SECURITY STANDARD

Keysight Technologies and device security research lab Riscure Security Solutions, have successfully completed the first Car Connectivity Consortium (CCC) Digital Key Applet (DKA) certification for NXP Semiconductors, global provider of secure connectivity solutions for embedded applications.

The two companies worked together to evaluate and certify NXP’s automotive Digital Key solution, helping further the development of this new standard.

The CCC DKA program focuses on securing digital key solutions for the automotive industry that safeguard the privacy and security of users. This is achieved by implementing stateof-the-art public key protocols, hardware-based key storage, and wireless transmission standards to securely authorize user access in proximity of the key with the vehicle.

COMPUTING

AVNET CONSOLIDATES EMBEDDED OPTIONS

Avnet has launched a product brand Tria and corresponding business called Tria Technologies to consolidate its compute design and manufacturing.

The new brand will represent embedded compute boards, systems and associated design and manufacturing services at Avnet.

“The new brand embodies Avnet’s unique ability to deliver standalone modular embedded compute solutions in a world where OEMs are increasingly looking to move from their own chip-down manufacturing to part- or full- pre-made embedded compute platforms,” said Thomas Staudinger, president of Embedded Solutions, Avnet.

September 2024 / EP&T

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WEST TECH REPORT

Symroc goes seismic with its low frequency monitoring

Sensors leverage wireless communication while boosting performance

BY MIKE STRAUS, WEST COAST CORRESPONDENT

Wilson Howe, CEO & co-founder of Symroc says that his technology enables sensors to clearly identify a seismic event, such as an earthquake.

Overcoming traditional hurdle

Howe says he and his business partner were struck by the problems with traditional seismic monitoring systems: Namely, their inconvenience and their lack of performance. Ground movement is typically measured via geophones and seismometers; seismometers are large, power-hungry, difficult-to-install, and require a great deal of supporting infrastructure, all of which makes for high installation and operating costs.

Meanwhile, traditional geophones don’t perform well below 1Hz, making it difficult to detect low-frequency vibrations. In response to those challenges, Howe and his business partner developed a system that’s easy to install, that uses wireless communication, and performs as well as seismometers but at a lower cost.

Howe notes that initially, the company faced challenges in explaining its technology.

“There’s a lot of education and explanation involved to get people to understand the issue,” Howe says.

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ELECTRONIC PRODUCTS & TECHNOLOGY / September 2024

“The market in general has a lot of uncertainty in terms of how fast changes can happen. But we’ve proven that our system performs well every time we have a project.”

Symroc’s sensor systems have moving parts in the design that are integrated with a digital system. An internal feedback system supports the design, enabling the sensors to provide real-time data. On-board electronic systems provide for recording, and on-board timestamp systems ensure the accuracy of data down to 1 microsecond. Howe explains that this technology enables Symroc sensors to clearly identify a seismic event in a similar way that earthquake monitoring stations work. However, with Symroc’s low-power methodology, the company can set up small earthquake monitoring stations freely.

Symroc’s sensors provide bandwidth coverage ranging from 0.001Hz to 1600Hz, with >120dB dynamic range across the entire passband.

The sensor systems can operate for years with a 50-100W solar panel, will operate in temperatures ranging from -40 to +70 degrees Celsius, and are outdoor-proof. The system’s built-in transmission module enables wireless data transmission through LTE, WiFi, radio frequency, satellite, Bluetooth, and wireless cell data networks.

Howe says Symroc’s sensors have several use cases, most notably in fracking. In northern British Columbia, there’s a significant amount of oil and gas drilling and fracking activity.

Howe notes that part of the problem with fracking is understanding how subsurface injection activities are related to earthquakes. While the best way to monitor for fracking earthquakes is with high-density ground monitoring stations, the oil and gas industry currently lacks a good system for such monitoring.

“Most of these companies are still using traditional earthquake monitoring systems, which are bulky, power-hungry, and are supplied by just one supplier in Canada,” Howe notes. “We worked with the National Resource Council of Canada to

develop an earthquake sensor system for fracking, and we’re showing the best results in the industry. When people can see location details, they can correlate it with their work and try to adjust the speed and volume of the injection. They can adjust the operation parameters to help mitigate larger events.”

Another use case where Symroc’s technology is in use is structural monitoring, particularly for older railway bridges. Symroc’s seismic sensors are in use by CN Rail and CP Rail for structural monitoring. In a recent rail project, Symroc’s sensors could identify how the bridge was moving under the train load, and using that information, Symroc trained its system to detect any changes to normal operations. This application is very useful for preventative maintenance repairs, enabling railway companies to identify abnormal bridge movements before an event occurs.

Disruptive solutions

Howe says that the company is now looking at several areas where Symroc’s sensors could serve as disruptive solutions to help solve challenges. The next milestone, he says, will be seeing a shift in the industry’s approach from reactive to proactive.

“Part of the uncertainty in the industry is related to how fast adoption can happen when it’s government regulators responsible for these areas,” Howe explains. “Our sensors are very much related to critical infrastructure and public safety, which isn’t a typical private company demand. We do see things change pretty fast when incidents happen, but it’s not ideal to work that way. You can’t plan for when disasters happen.”

Howe says that Symroc is eagerly anticipating the day when the industry shifts its safety approach to a proactive model. Until then, Symroc is focused on providing its clients with exceptional service on every project.

Symroc is a Calgary-based provider of low-power, low-frequency seismic sensor technology. www.symroc.com EPT.CA

Photo: Symroc

Boasting clients and partners like CP, CN, and Natural Resources Canada, Calgary-based Symroc has revolutionized the world of seismic monitoring. Co-founder and CEO Wilson Howe says the company began as an engineering project management solutions company; a few years in, the company found an opportunity in ground motion monitoring. Howe notes that ground sensors at the time were lacking an easy-toinstall solution, especially for low-frequency data acquisition.

“My business partner and I had an idea, and then we tested that idea in our lab,” Howe explains. “When we tested the idea, it showed good results.

Then we showed our information to the National Research Council of Canada, who supported us fairly quickly through the IRAP program.

With that support, we started a full research team to develop the technology. Everything we do today is based on that initial hardware.”

THINK GREEN

Tektronix’ addition of Elektro-Automatik seeks to ‘green-up’ test options

BY STEPHEN LAW, EDITOR – EP&T Taking a big step to expand its capabilities in the rapidly evolving clean energy sector, earlier this year Tektronix Inc. announced its acquisition of EA Elektro-Automatik, a leading EU-based manufacturer of power supplies and electronic loads.

The move is expected to bring significant benefits to both companies, as well as their shared customer base, especially in the automotive powertrain, battery chemistry and design spaces.

James Hitchcock, general manager of Keithley Instruments, a Tektronix company, elaborated on the motivations behind the acquisition: “Tektronix has been engaged with our engineers for many years - especially in the automotive powertrain and the battery chemistry and design space. Our isolated probing and main Series scopes were used by engineers designing new solutions for electric vehicles for years. However, our customers faced challenges with higher energy requirements at the module or pack level, which we couldn’t address.

This led us to explore opportunities in this space. We found that EA Elektro-Automatik’s products aligned with our values of high quality and performance, making them a perfect fit,” said Hitchcock.

Source: EA Elektro-Automatik

Integrating strengths

The merger of the two test brands is poised to create substantial synergies and open new market opportunities, according to Hitchcock.

“Tektronix will benefit from access to EA’s technologies, enabling us to build out comprehensive solutions for customers in the decarbonization and energy sectors,” he highlighted. “By integrating EA’s bi-directional power supplies, loads, and power supplies with Tektronix and Keithley’s measurement capabilities, we can address power efficiency and integrity measurements from microvolt levels for IoT devices to megawatt levels, a range we previously couldn’t cover. This integration allows us to deliver deeper value in the clean energy market.” @EPTmagazine

The Keithley Series 2200 offers five dc power supply models that have voltage outputs from 20V to 72V to address a wide range of power requirements.

For EA Elektro-Automatik, the acquisition offers significant advantages as well, as the brand will gain access to Tek’s advanced measurement technologies, enabling them to develop more complete solutions for battery testing and emulation. Incorporating Tektronix’s switching and measurement technologies into EA’s systems will also allow them to offer a full suite of solutions, enhancing their existing power source capabilities.

James Hitchcock, general manager of Keithley Instruments, a Tektronix company, shares his insights relateing to the acquisition of AE ElektroAutomatik

Understanding needs

Addressing potential concerns about product line integration and market overlap, Hitchcock noted, “Currently, our primary focus is on supporting our customers. We haven’t decided on brand integration yet. Interestingly, there is minimal overlap between EA’s and Tektronix’s product portfolios. EA focuses on industrial power sourcing, while Tektronix and Keithley cater to engineering R&D benches requiring precise voltage and current measurement. By understanding our customers’ needs, we can position the right product at the right time, avoiding cannibalization.”

The acquisition also has the potential to redefine standards in electronic testing, particularly in the battery market.

“One of our customers’ challenges is understanding battery quality

over time and validating it throughout its lifecycle. The combination of Tektronix and EA will provide all the tools needed to characterize batteries fully,” explained Hitchcock.

“With Tektronix’s expertise in measurement standards and reporting, and EA’s sourcing capabilities, we can support our customers in developing and adhering to emerging standards, such as Europe’s battery passport concept.”

Ultimately, the strategic acquisition positions both Tektronix and EA Elektro-Automatik at the forefront of innovation in the electric vehicle and clean energy sectors, promising to deliver comprehensive, high-quality solutions that meet the evolving needs of their customers.

“Tektronix and EA are here for the full design lifecycle and product realization, from early stage research and education, learning about new capabilities, new chemistries, new topologies, and techniques for power efficiency – right through to validation and automation into production,” notes Hitchcock. “The commitment that Tektronix brings is applications support and partnership to solve challenging problems to realize new products into the energy ecosystem.

That’s the unique value proposition that that we bring as a company.”

September 2024 / EP&T

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FLEXIBLE ELECTRONICS

FEATURE

The added touch in making electronics Additive manufacturing for flexible and stretchable printed electronics

BY STEVE PASCHKY, SARALON

Evolution – pushing boundaries

Building on existing foundations of electronics industry, flexible hybrid and Printed Electronics emerge as the natural evolution of electronics technologies rather than a revolution or complete departure. In fact, the core electronics principles remain the same while materials and manufacturing processes differ.

As the name suggests, Printed Electronics (PE) involves printing functional inks on the chosen substrates. These functional inks include conducting, sensing, heating, electroluminescent, electrochromic, even

inks for printable batteries, etc. The variety and availability of these inks are continually expanding and depending on the application, different materials like silver, copper, carbon and others are used.

Printed Electronics is an additive manufacturing technique that minimizes material waste and facilitates rapid prototyping, customization, and potentially lower production costs. Conventional printers, primarily screen-printers, are used to create complex circuits by layering functional inks on a single substrate. This integration of different functionalities without the need for new machinery or production systems makes PE the promising approach for meeting the demands of modern electronics.

The transformative impact of PE is not only due to enabling experimentation with various ink materials and functionalities, but also encouraging the use of diverse substrate materials.

While thin flexible plastic substrates such as PET, PC, and PI are commonly used, more peculiar alternative substrates like paper, stretchable TPU, and textiles are also within the realm of PE possibilities.

Fig 1 Stretchable electronics on TPU substrate using Saral StretchSilver 800 and Saral SilverGlue Alpha 600.

Fig 2 Printed shoe sole sensing system consisting of pressure, temperature and humidity sensors.

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ELECTRONIC PRODUCTS & TECHNOLOGY / September 2024

Key application areas / emerging innovation trends

The inherent flexibility of printed and hybrid electronics allows for innovative form factors, such as bendable, stretchable, and conformable devices that can be integrated into unconventional surfaces and environments.

Among the emerging areas for printed electronics, wearables, automotive, and smart packaging sectors are rapidly adopting the technology on a commercial scale.These industries are heavily investing in PE due to its several advantages mainly its huge advantages in supporting invisible electronics on complex geometries, eliminating the difficulties of bulky electronics integrations, and direct printing on lightweight substrates, leading to substantial weight reduction.

Automotive industry is a major driver of Printed Electronics growth and a significant focus on differentiation within the automotive industry is directed toward interior design. From printable sensors for increasing safety and comfort and printable heaters for EV thermal management and battery performance enhancement to stretchable and thermoformable conductive inks for electronics on more complex geometries like steering wheel and 3D shapes, PE industry is increasingly addressing gaps and overcoming challenges that traditional electronics struggle with.

PE significantly reduces weight and simplifies wiring complexities.

EPT.CA

Photo: Sralon

The design and manufacturing processes for traditional (rigid) electronics are well-established, offering reliable solutions to various industries. However, there is an increasing demand for smarter everything highlighting the need for more complex electronics that are easier to integrate on almost every surface through a resource efficient process that facilitates recycling and minimizes the use of toxic chemicals.

easily to the human body. PE allows for the creation of invisible electronics and non-bulky sensing devices, essential for wearables.

There are two primary strategies for embedding sensors in PE wearable devices: Either sensing inks are directly printed on the chosen substrate to create printed sensing nodes and surfaces, or printable conducting adhesive inks are applied to attach sensors (as SMD) on flexible and stretchable substrates.

Recyclable & eco-friendly

Wearable PE devices hold great promise for addressing healthcare needs, particularly in Remote Patient Monitoring (RPM) and elderly care systems.These solutions are in general preventive, using advanced sensing and monitoring systems to collect real-time data, predict, and prevent emergencies. Specially in elderly care, wearables must ensure safety and comfort without disrupting daily lives of older adults. PE enables the development of comfortable, simple, effective, and also aesthetically pleasing healthcare wearables. @EPTmagazine

Fig 3 Temperature logger with integrated printed battery.

Another rapidly growing wearable market is Remote Patient Monitoring (RPM) devices. The idea here is to replace episodic doctor visits and occasional data capture with continuous streams of data.This introduces a new paradigm where RPM is a means to gain predictive insights into health status by inferring trends from a large set of basic sensor data.

Printed Electronics (PE) offers significant advantages in this context, enabling the integration of smart solutions into flexible, bendable, and stretchable surfaces that conform

Smart packaging and logistics systems increasingly demand electronics in thin, flexible formats, ideally on recyclable and eco-friendly substrates like paper. Printed batteries are well-suited for this market, consisting of non-toxic functional inks printed on ultra-thin flexible substrates. Additionally, printed sensors and RFID tags are widely adopted PE technologies in this sector. According to a recent IDTechEx report, the flexible battery market for smart labels and RFID tags is projected to reach US$14.3 million by 2025, with an expected annual growth rate of 23.9% over the next decade.

The future holds numerous possibilities and opportunities. Another compelling example is the smart textiles industry, which is increasingly adopting PE techniques to directly print stretchable conducting inks, sensors, heaters, and other elements onto fabrics, thereby adding advanced smart functionalities to them.

A growing and diverse range of OEMs are now considering the use of functional inks for printed and hybrid electronics. These include research institutes and universities developing new applications, conventional electronics manufacturers seeking innovative solutions, PE and hybrid electronics developing pilot projects, print houses, and contract manufacturers.

Close collaboration across various industries, such as advanced materials, electronics, information and communications technologies, printing, and advanced manufacturing is crucial for staying competitive in emerging smart markets.

Steve Paschky is co-founder, sales & marketing director at Saralon, German-based developers of functional inks for clients in the flexible hybrid and printed electronics space. https://www.saralon.com/en September 2024 / EP&T

9

SEMICONDUCTORS ICS

FEATURE

uniquely for its target application, whereas an FPGA is typically a standard part that is user-configurable and can fulfil multiple purposes. FPGAs can be reprogrammed one or more times to perform a variety of tasks.

At first glance, the distinction between the two seems simple: one has been carefully optimised, the other built for flexibility. But when it comes to choosing between an ASIC and an FPGA for your specific application, the differences can be a lot more nuanced.

So, what factors should you consider?

Getting to market?

If time-to-market is of the utmost priority, an FPGA will likely be the preferred route. Unlike ASICs, which involve a rigorous custom design process, FPGAs are typically sourced off-the-shelf. Equipped with a standard interface, FPGAs can be easily reprogrammed by the customer for specific functions, enabling quick and easy product integration. This makes them ideal for dynamic fields where the environment and expectations are changing quickly, and these factors are prioritised over cost considerations.

But if you’d like the optimized performance of an ASIC without an extensive timeframe, there are routes available to make this possible. ASIC designers have access to one or more libraries of foundry and third-party IP. These IP blocks can be used to form the basis of a custom IC design, shortening development time without losing the optimisation benefits of an ASIC. Software can also be developed in parallel to the hardware, further shortening the project timeline.

ASIC or FPGA?

Selecting the right IC for your application When it comes to hardware design, system engineers have more than one architecture to choose from.

Both Application Specific Integrated Circuits (ASICs) and Field Programmable Gate Arrays (FPGAs) can offer benefits, but which one is best for your application? Here, Ross

Turnbull, Director of Business Development and Product Engineering at ASIC design and supply company Swindon Silicon Systems, explains what to consider.

To start understanding the differences between an ASIC and an FPGA, we begin by defining the two. An ASIC is a type of IC that has been designed

If time-to-market is of the utmost priority, an FPGA will likely be the preferred route. Unlike ASICs, they are typically sourced off-the-shelf.

10 ELECTRONIC PRODUCTS & TECHNOLOGY / September 2024

Ross Turnbull, director of business development and product engineering at Swindon Silicon Systems, a UK-based ASIC design and supply company.

FPGAs are best suited to realise digital circuitry. While it’s possible to include analogue blocks onto the FPGA silicon to provide both digital and analogue compatibility, these blocks often don’t have the desired performance.

In this scenario, the ASIC provides a distinct advantage. A variety of analogue components including analogue to digital converters (ADCs), amplifiers, voltage regulators, filters and synthesizers can be combined with digital devices in a mixed-signal ASIC solution. Advanced communication protocols such as Bluetooth Low Energy (BLE) can also be incorporated into the design.

EPT.CA

Photo: Swindon Silicon Systems Ltd.

Digital, analog or both?

BY ROSS TURNBULL, SWINDON SILICON SYSTEMS LTD.

While FPGAs can perform a wider variety of tasks, an ASIC will always offer the superior performance Cost & volume

The cost factor depends largely on the scale of production required. ASIC design and development stages mean that they typically have a higher non-recurring engineering cost (NRE) than FPGAs. However, ASICs will often have a lower cost per unit. This is due to the removal of unneeded functionalities, reducing overall silicon size and bill of materials. As a result, while the initial cost and time investment for ASIC design is higher, it typically offers a much better ROI on for larger or longer production volumes.

While a reprogrammable FPGA will be able to perform a wider variety of tasks, an ASIC will always offer the superior performance for the exact task it’s been designed for. This tailored approach means that the ASIC can offer significant technical advantages over FPGAs and other solutions on the market. For instance, wearable applications requiring a compact chip with an extended battery life will likely benefit from the ultra-low power circuitry that can be best achieved with an ASIC.

these steps can be taken alongside the commencement of a new ASIC project. The benefit of this rounded approach is it means the customer will always have sufficient product to fulfil orders between the old and new ASIC. At first, the differences between an ASIC and FPGA can seem quite straightforward.

But when it comes to identifying how each one might benefit your specific application, it requires a much more thought-out

approach. Considering cost, time-to-market, obsolescence, and other key factors is essential to ensure you have a chip that meets all your product’s needs, both for the current and future iterations.

Swindon Silicon Systems Ltd. is a UK-based custom integrated circuit (IC) solutions firm with five decades of experience in the design, production test and supply of ASICs for industrial and automotive applications. https://www.swindonsilicon.com/

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Decline and obsolescence

FPGA supply, like many other off-theshelf solutions, is determined by the manufacturer. If supply drops below a minimum level, the manufacturer may halt production of new FPGA chips and issue a notification of obsolescence. Following this, it’s down to the customer to identify an alternative. This could be the purchase of leftover chips or sourcing a similar product from a different supplier. Either way, obsolescence is often a tricky area to navigate and a headache for purchasing and procurement professionals.

An ASIC is slightly different. Rather than the manufacturer deciding to halt production, the equivalent in ASIC terms would be the silicon process going obsolete.

When designing a custom IC, the supplier will take care to ensure the silicon process chosen meets the expected lifetime of the product. But in the unlikely event obsolescence occurs earlier than expected, a reputable ASIC company will work with the customer to find an alternative solution.

It’s possible to port the design onto a newer silicon process instead. Wafers can also be purchased and stored for several decades in dry nitrogen cupboards. Depending on the needs of the customer, September 2024 / EP&T

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2024-08-09 7:31 AM

FLEXIBLE ELECTRONICS

FEATURE

Flexible battery applications range from smart labels to wearables IDTechEx explores the limits of this emerging component sector

BY DANIEL PARR, TECHNOLOGY ANALYST AT IDTECHEX, CAMBRIDGE UK Since the conception of flexible battery technologies, suppliers have searched for strong application markets for their products. In the last five years, niches have finally begun to materialize, though the specific use case depends on battery technology. Some of the earliest examples of commercialized flexible batteries were thin-film solid-state micro-power batteries that used the LiPON electrolyte developed

by Oak Ridge National Laboratory in Tennessee.

In the last decade, other flexible battery options have been semi-commercialized, including zinc-carbon, zinc-silver, and primary lithium chemistries. Bulk solid-state and advanced lithium-ion technologies are now also on the brink of commercialization, and opportunities for their products are being searched for.

Two broad categories of flexible battery technology can be identified as lower and higher capacity. To the first belongs thin-film and micro-battery technologies: zinc-carbon, zinc-silver, primary lithium, and thin-film

FIG 1 Differentiation of the six major flexible battery technologies.

solid-state. Of these, zinc-carbon, zinc-silver, and thin-film solid-state may be rechargeable or non-rechargeable, while primary lithium is always non-rechargeable. Printing is the most common manufacturing method for zinc chemistries, while

lithium chemistries use alternative manufacturing methods such as sputtering.They are defined either by their chemistry (zinc-carbon, zinc-silver, primary lithium) or by their electrolyte (thin-film solid-state). All are expensive to scale up in terms of size and capacity, and their areal energy density is limited, making them best suited for micro-power applications.

The second category includes advanced lithium-ion and bulk solid-state technologies -the less mature flexible battery technologies. Both are based on rechargeable lithium-ion technologies. Advanced lithium-ion, in this case, describes a battery structure that is similar in chemistry to traditional lithium-ion cells but with innovations that enhance flexibility, e.g., cell packaging or electrolyte.

Both liquid electrolyte batteries and semi-solid polymer electrolyte batteries can be included in this category.

Bulk solid-state describes a non-thin battery with a solid-state electrolyte, though it need not be 100% solid.

Examples of solid-state electrolytes include ceramics and sulfides.

FIG 2 Smart labels and wearables requirements lead to the use of different flexible battery technologies.

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ELECTRONIC PRODUCTS & TECHNOLOGY / September 2024

The advantages of flexible batteries are self-evident. A battery that can be rolled, stretched, and bent without losing functionality could prove a significant advantage in the right use case. However, flexible batteries are competing with significantly cheaper traditional technologies such as coin cells. For comparison, coin cells can be less than US$0.50/Wh, while the cheapest flexible battery options are around US$3/Wh. In fact, some technologies cost tens of dollars per Wh. In most use cases, the price of flexible batteries is too high to warrant their use. Instead, suppliers have needed to find niches where extreme flexibility is required and which are relatively price-insensitive, high-end, specific form-factor applications.

EPT.CA

Photos: IDTechEx

Advantages are self-evident

Smart labels have become the primary niche for the first category of low-capacity batteries.Thin batteries, usually printed, are integrated into labels, tags, and sensors that are used for quality control and logistics in industry settings. For example, RFID tags with temperature sensors or chemical sensors are used to monitor produce. The advantage of these tags is significant - produce that would otherwise be lost in transit due to poor temperature control can be saved, reducing waste. Other types of smart labels are used to communicate the position and condition of shipments.

Not all smart labels use flexible batteries, however increasingly flexible battery companies have targeted this application. Thinness is the major driver of flexible battery uptake in this instance. Thin labels require thin batteries, which happen to be flexible. While flexibility is an advantage when the label is applied to a curved or irregular surface, in most cases, it is not a requirement. Zinergy and CCL Design (after the acquisition of Imprint Energy) are two flexible battery players who have increasingly targeted this niche. The flexible battery market for smart labels and RFID tags is valued at US$14.3

million in 2025 and is expected to grow with a CAGR of 23.9% over the next decade.

Meanwhile, companies supplying the second category of higher-capacity batteries are increasingly focusing on wearables applications. Wearables include a diverse range of products, from hearables and smartwatches to XR headwear and e-textiles. Unlike consumer electronics, products worn on the body frequently require tailored form factors as they must be comfortable when worn.

Aligning with wearables

As a result, wearables companies have shown interest in curved and flexible battery options in the past as a means of removing unnecessary bulk. However, the flexible batteries of the past were unable to meet wearable product requirements for energy density and lifetime. Only recently has flexible battery supply begun to align with the demand for wearables.

Advanced lithium-ion and bulk solid-state flexible batteries have begun to move from the development stage into semi-commercialization, finally providing energy storage solutions that can meet energy density and lifetime requirements while still retaining a

flexible form factor. Suppliers of both technologies have targeted wearables opportunities, especially wrist-worn wearables and electronic headwear.

Low-end, mass-produced hearables and wrist-worn wearables make up the largest proportion of the overall wearables market but present no opportunity for flexible batteries, and the high cost of flexible battery options cannot be justified for low-cost, mass-produced products. However, the wearables market still presents significant opportunities at the high end.

LiBEST, for example, is a Korean company that, since 2024, has focused on advanced lithium-ion batteries for XR headsets and high-end hearables, where products are price-insensitive and bulkiness is not favored. The total wearables market for flexible batteries (which includes skin patches) is valued at US$43.3 million in 2025 and is expected to grow with a CAGR of 21.6% over the next decade.

The overall flexible battery market remains small, at just US$71.7 million in 2025, compared to a global lithium-ion battery market of over US$50 billion. www.IDTechEx.com/Flex

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02/08/2024 September 2024 / EP&T11:0513 2024-08-06 9:19 AM

WIRELESS TEST

FEATURE

Practical considerations for cross-domain measurements in ‘RF to Bits’ systems Testing of ‘direct RF’ sampling transceivers in wide-band RADAR and AESA devices For decades, the design of RF systems has been split into well-defined subsystems: RF subsystem interfaces were analog RF on one side (for the cable or antenna connection) and either RF, IF or IQ analog on the other side.

Stimulus-response devices like a VNA or VST (combination of VSA & VSG) were specifically designed and well suited to fully validate and produce those designs. Similarly, digital designers have used VHDL or Verilog for their FPGA or ASIC designs, and mixed-signal oscilloscopes to verify timing and signal integrity.

While traditional converter technology (DAC/ADC) crossed the boundary between analog and digital, sample rates and digital bandwidths were not significant enough to push the boundaries of traditional techniques.

Digital interfacing

Many digital interfacing standards have been created over the last several decades; helping to enable the increasing bandwidth demands of modern RF systems. While the pace of new interfaces is emerging quickly for commercial wireless, aerospace and defense applications often need relatively longer consistency in interfaces.

In the early 2000’s, a typical ADC interface would be a wide parallel bus, likely employing DDR (double data rate) LVDS with source synchronous timing (e.g. the clock traveled along with the data). This made it possible to close timing on the interface, but difficult to achieve a deterministic system delay.

By the early 2010’s, ADC interfaces had moved over to JESD204B, a high-speed serial bus. This made interface timing easier for these multi GS/s converters, but introduced even more indeterminism in the system delay. JESD204B subclass 1 added a provision for deterministic system latency at the expense of complicated clocking.

These (and many other) interfaces were used within the baseband subsystem, but often not exposed at a system interface boundary.

14

Standards such as FMC and FMC+ were introduced to attempt to unify the digital interface between FPGA/ASIC and the ADC/DACs, but these were often limited to R&D applications and each vendor had their own flavor.

As modularized sub-systems embrace a “Direct RF to Bits” approach, the digital interfaces used will likely come in many varieties (lane rates, bit widths, voltage levels, connector types, etc) in addition to the protocol being used (JESD204B/C, 100GbE, proprietary, etc).

Worlds Colliding

Those highly orthogonal domains, and the boundary between them, are rapidly disappearing with the introduction of direct sampling RF-to-bits devices in the marketplace.

RFSoC and chiplet based designs, capable of sampling above 60GSa/s, are seeing the convergence of RF and digital into a single atomic RF component.

To complicate matters further, these devices are not simply high-rate, single channel, single direction devices like an ADC, but rather multi-channel fully duplex transceivers, like the Eelctra line from Jariet with 4 TX and 4 RX up to 64 GSa/s, or the Apollo MxFE chipset from ADI with 8 TX and 8 RX channels and rates up to 28 GSa/s, enabling RF transmit and receive up through

ELECTRONIC PRODUCTS & TECHNOLOGY / September 2024

K band and above without any traditional mixers or local oscillators.

State of the art RADAR, EW, and military communications systems are paving the way to leverage these cross-domain RF platforms in beamforming active electronic scanned array (AESA) systems, typically comprised of over one-thousand antenna elements and hundreds of transmit receive modules (TRM). This convergence of cross-domain RF to digital devices is being driven by a desire to reduce SWaP-C (size, weight, power, cost) and enable high channel count systems with capabilities far beyond what the RF designers of yesteryear could have imagined.

Along with the advantages noted above, the total reduction in discrete testable components will significantly reduce the diversity and number of unique test systems required to bring a design to life.

However, as with all new technology, new challenges arise. This cross-domain convergence fundamentally challenges the tool flow traditionally employed by subsystem developers.

For example: how do you measure the S-Parameters of a transceiver when one side is digital and the other RF? How do you validate your digital implementation? How do you adapt and scale your instrumentation and measurement techniques?

EPT.CA

Photo: NI Emerson

BY NORM KIRCHNER & DAN BAKER, NI / EMERSON T&M

Functional but painful

In this new world of RF-To-Bits based systems, where RF engineers are questioning how to test, digital design teams are being asked to create some type of mock digital instrumentation to enable the RF validation of their components and systems.

While creating a digital system that can connect to the digital interface of their system-under-test (SUT) is well within a digital engineers capabilities, developing a system of hardware, software, and measurement science capable of supporting the testing and production needs of an organization would be the functional equivalent of asking analog designers to create their own oscilloscopes.

It’s possible, but painful.

Counter to the points made above, this can be a very attractive approach for organizations, because the first implementations of digital connectivity are already achieved by those same digital engineers. A time investment has already been made and teams are looking to simply move onto the next stage of development. The platforms commonly used are FPGA development boards and converter evaluation boards from vendors like AMD or ADI. While a functional implementation, these development platforms are not designed to meet the multitude and variety of demands of a practical test or production system.

Common challenges include: • Test departments not equipped with High-Speed-Serial (HSS) interfaces.

• Home-grown digital solutions costly and difficult to produce at scale, maintain and deploy over a program’s lifecycle.

• Evaluation boards not designed or manufactured to be long term scalable solutions.

• Memory and data transfer size and rates limit test time performance.

• Not suited for the scalability of production or SUT connectivity demands.

Scalable, modular, reusable & extensible

One of the keys to success in any program leveraging a direct sampling RF system is the selection of instrumentation that can scale with the needs of a program and an organization.

As the number of analog ports for single components grow exponentially, and the bandwidth of the digital streams increases to hundreds of gigabits per second, PXI based modular RF instruments and instrument-grade open-FPGA digital processors are an exceedingly natural fit. These devices are purpose-built to co-exist within a mixed domain test system and enable the scalability of quality RF measurements. @EPTmagazine

The PXI platform allows for RF instruments, like a PXIe-5842 VST from NI, to be used along with NI’s Digital Signal Transceiver (DST) to allow synchronization and control of both RF and digital instruments in the same system. This allows engineers to perform measurements like Power Added Efficiency, S-Parameters and Pulse measurements on Direct RF using a single setup and connection.

Devices like the PXIe-7903 FlexRIO FPGA, based on the Xilinx Virtex UltraScale+ FPGA, VU11P, can service line rates up to 28.2Gbps on 48 TRX lines across 12 discrete connectors. When combined with modular RF instruments like the PXIe5842 VST + 5633 VNA, capable of 4GHz of instantaneous bandwidth and tunable to 26.5GHz, engineers can achieve the full instrumentation experience, even for “RF to Bits” systems under test.

Synonymous to using analog instruments, engineers testing these digital systems would greatly benefit from a feature rich experience

when interfacing to the digital ports of their SUT. Features like automatic triggering and synchronization to align with the analog, responsive interactive GUIs for rapid development and debug and an API purpose built for high-speed automation. Each of these capabilities and more will enable and accelerate an engineer’s workflow, whether it be in design or production.

Conclusion

In summary, adapting to the evolving requirements of ‘Direct RF’ systems, with a forward-looking plan that recognizes the requirement to provide an open, flexible and feature rich solution, will lead to faster development, cost savings, greater insights, and improved quality.

Emerson’s Test and Measurement business, formerly NI, a leading provider of software-connected automated test and measurement systems. https://www.ni.com/en.html September 2024 / EP&T

15

FLEXIBLE ELECTRONICS

FEATURE

3D printing vs. pcb printing — What’s the difference?

BY SHUXUAN JIANG, VOLTERA In the world of additive fabrication, two technologies stand out for their transformative potential: 3D printing and printed circuit board (pcb) printing. They share the fundamental principle of additive manufacturing, but are different in a number of ways.

In this article, we will delve into the main differences between traditional 3D printing and additive pcb printing in order to clarify their distinct roles in modern manufacturing.

Notably, machines that use direct-ink-writing technology, enable the production of features as small as 100 µm.

Capabilities and applications

How does 3D printing and pcb printing work?

With 3D printing, printers create objects by layering material, typically thermoplastic, from the bottom up.

You begin with designing a model using computer-aided design (CAD) software. Next, you export the .stl file to your 3D printer software which will slice the model into thin horizontal layers, generating G-code for each layer. Depending on the type, your 3D printer will then extrude or solidify material layer by layer to form the final object.

Pcb printers utilize conductive inks, such as silver, copper or graphite to create functional circuit boards.

PCB printing

Additive pcb printing shares similarities with 3D printing in terms of its workflow. Using electrical computer-aided design (ECAD) software, you design your project, then export the Gerber file and upload it to your printer’s software. Pcb fabricators, RFID tag printed on paper using nano copper ink.

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ELECTRONIC PRODUCTS & TECHNOLOGY / September 2024

such as V-One, will then interpret the Gerbers and deposit conductive materials to construct the layers of a printed circuit board.

Key differences between 3D printing and pcb printing Materials and substrates The most apparent difference lies in the materials used. Traditional 3D printers work with a wide array of materials, including plastics such as PLA, PETG, TPU, ABS, and resin, as well as nylons and metals. In contrast, pcb printers utilize conductive inks, such as silver, copper, or graphite, and more to create functional circuit boards.

While you can print a three-dimensional object directly on the heated bed of a 3D printer, pcb printing requires fixing a substrate to the bed.

Depending on your specific needs, you can choose more rigid substrates such as FR1, FR4, or more flexible ones such as TPU, paper or fabric.

Precision 3D printers are generally used for larger objects and may not achieve the fine detail required for pcb manufacturing. The accuracy of desktop 3D printers varies, ranging from ± 0.1 mm to ± 0.5mm.

In contrast, pcb printers are designed for high precision, which is crucial for the intricate pathways and components of circuit boards.

Costs Due to the differences in all the aforementioned aspects, these technologies are available at varying costs. Desktop 3D printers can be priced anywhere from USD $200 to $2,500, whereas desktop pcb printers tend to range from USD $5,200 to $27,800.

Conclusion 3D printing allows for the creation of a broad spectrum of objects, whereas pcb printing offers a specialized, rapid, and cost-effective solution for circuit board production. Despite their differences, 3D printing and pcb printing can be highly complementary. Leveraging these technologies together will streamline the electronics prototyping process. As the technology continues to evolve, there is tremendous potential for further integration and innovation in both fields. https://www.voltera.io/ EPT.CA

Photos: Voltera

3D Printing

3D printers are handy when it comes to producing complex geometries and shapes. Some industries use 3D printing to manufacture the final product, such as architectural models, automotive parts, and dentures.

However, these 3D printed projects, on their own, cannot perform functions such as sensing, monitoring, moving, amplifying, controlling, or mirroring, which require a printed circuit board and a range of electronic components.

In order to test and iterate electronics projects, you will need a pcb printer.

The applications of pcb printers range from simple personal projects such as a weather station that monitors temperature, humidity, and atmospheric pressure, to complex R&D endeavors such as a prototype for robotic arms capable of performing surgeries.

CONTRACT ELECTRONICS MANUFACTURING (CEM) PROVIDERS IN CANADA

ELECTRONIC MANUFACTURING SERVICES GUIDE 2024

SOURCING CEM PARTNERS

CONTRACT MANUFACTURING

Source: gorodenkoff / iStock / Getty Images Plus / Getty Images

A list of CEMs and EMS providers across Canada

FLEXIBLE ELECTRONICS

FEATURE

AirBorn gets flexible in MilAero, medical, industrial design spaces Toronto-based flexible circuit manufacturer delivers personalized support Electronic designers looking for a supplier that demonstrates flexibility, might get more than expected when dealing with AirBorn Flexible Circuits Inc. (AFC), a Toronto-based developer of rugged connectors, custom assemblies and engineering services for defense, space, aerospace, medical and industrial applications.

Operating as Strataflex since the mid1950s, the Toronto electronic assembler was purchased in 2008 by AirBorn Inc. – headquartered in Georgetown, Texas. Since then, the firm has been producing integrated component and flex circuit design solutions to a large base of North-American and European customers. From initial CAD models to full-scale production, AirBorn guides the customer’s application through the design, prototyping, testing and qualification process – before ramping into full scale production.

“We have expanded from the early days of just being a component supplier. We’ve taken that business model and grown it to include cable assemblies, flexible circuits and flex assemblies, all the way to complete box build integration,” says Billy Rhea, product director of embedded systems with AirBorn, based out of the firm’s HQ. AFC develops many of its client’s designs using a wide range of connectors, terminations, components, and devices, providing

Photo: Airborn Flexible Circuits Inc.

BY STEPHEN LAW, EDITOR – EP&T

automatic and Mil-certified precision hand soldering. Some of the relevant military standards (MIL-STD) they typically adhere to include: MIL-PRF-31032; MIL-P-50884; MIL-STD-883; MIL-STD-202; MILSTD-810; IPC-6013 and AS9100.

Approved vendors

“If a customer has an existing design, we can just build to their specification. If they need

help designing, we can do that as well. We also conduct services that include manufacturability, repairability, reliability, and testability. We also help the customer create a bill of material (BOM) if they need it – especially If they don’t have approved vendors,” states Peter Pialis, director of engineering at the Toronto facility. “The customer literally just takes out the flex assembly, plugs it in, and they’re good to go.”

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ELECTRONIC PRODUCTS & TECHNOLOGY / September 2024 EPT_EMS23_DATA CABLE.indd 1

TOLL FREE: 1-877-395-5133 EMAIL: information@datacable.ca WEBSITE: www.datacable.ca

EPT.CA 2024-08-15 2:54 PM

60% reduction in mass

“Integration of high-speed AirBorn connector product into our flex options has allowed customers to replace these big, heavy cable assemblies,” adds Rhea. “They’re using high-end twinax, coax type of cables that can be replicated in flexible circuits. We’re implementing that into a flex and sculpting it – putting in whatever format they need.

As a result, we’ve seen as much as 60% reduction in mass, which translates to a huge saving for them over space and weight.We’re getting great performance out of that flex, especially the military and space customers, and they are raving over it.”

AirBorn employs a team of product engineers, who conduct product realization

@EPTmagazine EPT_DiverseLoctite_CEM_Sept24.indd 1

Photo: AirBorn

Primarily focused on applications relating to defense, space, aerospace, medical and industrial industries, AirBorn produces highly reliable, flexible, printed circuit and assembly solutions including single-sided, double-sided, multi-layer, rigid-flex and sculptured flex. The benefits of flex, is it provides certain designs with a customizable solution for wire harnesses, including repeatability, consistency, and cost-effectiveness for high-volume orders.

“Most people don’t understand what flex can do in their design, which is quite surprising.We recently hosted a lunch and learn for 20 design engineers and they were not aware of the benefits flexible circuits can bring to their design.” says Pialis.

AirBorn also provides a full range of integrated services comprising design, DFm, DFt, prototypes, production manufacturing, hand and automated assembly, as well as testing. This also includes fully populated flexible circuit assembly (adding PCB components to the flex circuit). AirBorn will often add a flexible circuit into the customer’s finished product, sometimes as much as up to 100-feet long.

– from specifications to an actual manufactured product. The product development also leverages process engineers, led by electrical engineers, chemical engineers, and mechanical engineers.

“We’ve got multiple design engineers on staff to help with customer’s design applications. Some clients already have their Gerber files ready when they come through our door, others just want to know, ‘can we build it’,” notes Rhea.

Raw materials

AirBorn uses a variety of raw materials to produce flexible circuits, tailored to meet the specific needs of their customers. Some of the primary raw materials include: • Polyimide Films: Kapton and Apolong; • Copper Foils: Electro-deposited (ED) Copper and Rolled-Annealed (RA) Copper; • Adhesives: Acrylic, Epoxy and Pressure-Sensitive Adhesives (PSAs); • Coverlays: Polyimide Coverlays, and Flexible Solder Masks; • Conductive Inks and Pastes: Dielectric, as well as Silver and Carbon Inks; • Reinforcement Materials: Stiffeners and Bondplys;

• Protective Coatings: Conformal Coatings and encapsulants; • Specialty Films and Laminates: PTFE (Teflon) Films, and Liquid Crystal Polymer (LCP) Films.

Supported by on-going investment in new equipment, AirBorn’s 37,000-sq. ft. production space boasts state-of-the-art automated optical inspection (AOI) systems; Laser cutting and drilling machines; Roll-to-roll processing equipment; Soldering and reflow ovens; Vacuum lamination presses; X-ray inspection systems; Etching and plating equipment; and clean room facilities.

While 90% of the Toronto facility serves U.S.-based clients, AirBorn’s goal remains focused on increasing market share of home-grown design customers.

“Our biggest selling point is our design service capabilities, and our customer service,” Rhea concludes. “We are equipped to expand our business with the Canadian military market, based on our current success in the US as a second- or third-tier type supplier for players like Lockheed, Raytheon, BAE and Boeing.”

September 2024 / EP&T

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2024-08-15 9:38 AM

Electronic Manufacturing Services Guide 2024

P

laying an integral role in the eco system of the electronics industry in Canada, Contract Electronics Manufacturers (CEMs) or Electronic Manufacturing Services (EMS) providers represent one of the most important players in any design cycle.

CEMs are crucial in the ecosystem for electronic engineers and designers across Canada. They provide essential services such as prototyping, production, and testing, allowing engineers and designers to focus on innovation and development. CEMs offer advanced manufacturing capabilities, cost efficiency, and scalability, which are vital for bringing new electronic products to market quickly and reliably. By partnering with CEMs, Canadian electronic engineers and designers can

leverage specialized expertise and state-of-the-art facilities, fostering growth and competitiveness in the electronics industry.

Flexible and adaptable to a wide variance of needs and services from its customer base, CEMsconstantly demonstrate the ability to meet the requirements of a vast array of industry sectors. Whether high or low complexity, volume production or prototyping, Original Equipment Manufacturers (OEMs) turn to their contract manufacturing partners for their expertise in everything from engineering services, supply chain management, printed circuit board assembly, testing and final integration capabilities.

This guide is designed to serve our OEM readership base as a helpful source to locating a contract manufacturing partner in Canada.

WESTERN CANADA

223 – 8678 Greenall Avenue, Burnaby, BC, V5J 3M6, Canada Tel: 604 - 430 – 2027 media@brio-tech.ca https://www.brio-tech.ca

BRITISH COLUMBIA

Tel:1-604-472-3800 Toll-Free: 1-800-663-5482 info@ampcomfg.com https://www.ampcomfg.com

Active Electronic Manufacturing PCB assembly line includes high-speed pick and place machines.

8 - 12357 82a Ave, Surrey, BC V3W0L5 Tel: 778-591-2361 Email: info@activeelectronic.com http://activeelectronic.com

Canadian Circuits Inc. (CCI) Quick-turn pcb board shop. #12 – 13140 88th Avenue, Surrey, British Columbia Tel: 604.599.8600 Toll-Free: 1-888-590-6464 sales@canadiancircuits.com http://www.canadiancircuits.com

Ampco Advanced manufacturing and printing company. #101 – 9 Burbidge Street, Coquitlam, British Columbia, V3K 7B2

Canada Brio Sales and technical support centre for North American clients of BRIO Technology, an EMS provider in Northern China.

CIMtech Mfg. Inc. AS9100D Certified Machining; Experienced in aerospace assembly, tooling and parts: prototyping, production and sub-assemblies.

17942 55 Ave #8, Surrey, BC V3S 6C8 Tel: 604-807-4850 Toll Free: +1 877-999-5049 Email: machining@cimtechmfg.com https://cimtechmfg.com

Dena Technologies BC-based designs and assemblies high performing PCBs. 8170 Winston St, Burnaby, BC V5A 2H5 Tel: 604-765-0880 https://denatechnologies.com Dorigo Systems Ltd. Full turnkey CEM. 5085 North Fraser Way, Burnaby, BC V5J 0J2 Tel: (604) 294-4600 Fax: 604-294-4609 Sales@dorigo.com https://www.dorigo.com

Artaflex Inc.

Artaflex Inc. is a multinational, integrated, electronics manufacturing services (EMS) company serving high-mix, high reliability Original Equipment Manufacturers (OEMs). With multiple facilities in the United States and Canada, Artaflex and its numerous brands of companies, offers expert electronic manufacturing services, complex system integration, custom cable and harness interconnect, advanced test, and clean room capabilities to its customers: enabling the delivery of highquality products and services in a timeframe that meets todays ever shortening delivery cycles. Artaflex is a market leader in customer service and operational excellence. Artaflex’s customer-focused teams provides customers a virtual extension of their own operations department through expertise in supply chain management, manufacturing, and engineering.

Artaflex is focused on total cost of ownership through the evolution of its value proposition.

Head office: 181 Whitehall Drive Markham, ON L3R 9T1 Canada Ph: 1-866-502-3378 email: sales@artaflex.com website: https://artaflex.com

Artaflex Kanata 360 Terry Fox Drive Kanata, ON K2K 2P5 Canada Ph: 1-888-773-7832 email: sales@artaflex.com website: https://artaflex.com

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GS Networks 360 Terry Fox Drive Kanata, ON K2K 2P5 Canada Ph: 1-877-225-2555 email: gsninfo@gsnetworks.ca website: https://gsnetworks.ca

Artaflex Buffalo 330 Fillmore Ave. Tonawanda, NY, 14150 U.S.A. Ph: 1-866-502-3378 email: sales@artaflex.com website: https://artaflex.com EPT.CA 2024-08-16 9:59 AM

EMS2020 Technologies Ltd. Electronic manufacturing company 570 Ebury Pl, Delta, BC Tel: (604) 525-3133 sales@ems2020tech.com http://ems2020tech.com

Link2 Manufacturing Full service solution electronics assembly company.

7177 Vantage Way #150, Delta, BC Tel: 604-940-4556 sales@link2mfg.com http://link2mfg.com

Enigma Interconnect Corp.

Manufacturer of quality bare pcbs.

8070 Winston St, Burnaby, BC V5A 2H5 Tel: 604-420-3313 https://www.enigmacorp.com

Maxtech Electronics Inc. One-stop electronic manufacturing service provider.

102-1750 Hartley Avenue, Coquitlam, BC, V3K 7A1 Tel: 604-998-1564 Email: info@maxtechelectronics.com http://maxtechelectronics.com

Euro Solutions Makes flexible, customized electronics manufacturing solutions.

Unit E104 - 19720 94a Ave, Langley City, BC V1M 3B7 Tel: (604) 513-8584 https://www.eurobc.com ForeSeeson Electronic manufacturing services provider. #2105-11980 Hammersmith Way, Richmond, BC, V7A 0A4 Toll Free 1-866-233-0247 (604) 233-0247 Email: info@foreseeson.com www.foreseeson.com Leach Pcba Inc. EMS services provided for industrial and medical clients worldwide.

107-7188 Progress Way, Delta, B.C. Tel.: 604-940-6797 https://www.leach-pcba.com/en

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MechWareTronik Inc. Delivering high quality SMT (Surface Mount Technology) laser cut stencils for the electronics printed circuit board assembly industry.

215-12837 76th Avenue, Surrey, BC Tel: (778) 590-0358 http://www.stencil-express.com Mountain Technologies Ltd. Electrical sub-assemblies, cable assemblies and wiring harnesses.

35 Gostick Pl, North Vancouver, BC Tel: (604) 986-9008 https://www.mtntech.com NDS Electronic Solutions Electronics manufacturing services provider.

2425 Canoe Ave., Coquitlam, BC Tel: 604-474-4040 http://www.ndselectronics.com

SAPA Technologies Ltd. Turnkey electronics manufacturing services provider.

3202 Beta Ave, Burnaby, BC V5G 4K4 Tel: 604-520-5611 info@sapatechs.com http://www.sapatechs.com Selcom Industries Inc. Turnkey electronic manufacturing services provider.

112 - 3011 Underhill Ave. Burnaby, B.C. V5A 3C2 Tel: 604-420-7575 Email: info@selcom.com https://www.selcom.com Surtek Industries Inc. Specializes in the assembly of pcbs, connector cables, motor controllers, electrical control panels.

13018 84 Ave, Surrey, BC V3W 1L2 Tel: 604-590-2235 https://www.surtek.net U Choice Manufacturing Inc. Quick turn pcb assembly.

17665 66A Ave #505, Surrey, BC Tel: 778-574-2570 https://www.uchoice.ca

ALBERTA August Electronics End-to-end electronic manufacturing services from prototyping to production.

1810 Centre Ave NE Calgary, AB Tel: 403-273-3131 info@eeicm.com https://aeicm.com BCS Core competencies ranging from contract electronic manufacturing to product development and deployment.

777 64 Ave SE Unit 31, Calgary, AB Tel: 403-216-3760 contactus@bcsinc.ca https://bcsinc.ca Commutron Industries Ltd Calgary based pcb board shop.

302 Stanley St, Elbow, SK S0H 1J0 Tel: 306-854-2265 https://commutron.ca Dynamic Source Manufacturing Full suite of EMS services including quick-turn- prototyping, volume manufacturing, testing, component sourcing and box build assembly.

2765 48 Ave NE Unit 117, Calgary, AB Tel: 403-516-1888 https://dynamicsourcemfg.com

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ELECTRONIC MANUFACTURING SERVICES GUIDE 2024

IMS Innovative Manufacturing Source Specialize in circuit board assembly, cable assembly, sheet metal fabrication, testing, vertical integration (box-build), and quality assurance.

Bay #3, 3855 64 Ave SE, Calgary, AB Tel: 403-279-7702 https://imsmfg.ca MANITOBA Price Electronics Ltd. Contract pcb assemblies.

638 Raleigh St, Winnipeg, MB Tel: 204-669-4220 info@priceelectronics.ca https://www.priceelectronics.ca SmartTrend Manufacturing Group Single source supplier of customer specific engineered components and assemblies to OEMs. 6 – 1249 Clarence Avenue Winnipeg, MB R3T 1T4 Tel: 204-489-7237 https://smartrendmfg.com EASTERN CANADA ONTARIO AAC – Accu-Automation Corp.

R&D, software and hardware design, and pcb manufacturing.

141 Dearborn Place, Waterloo, ON Tel: 519-725-9090 E: info@accuauto.com http://www.accuauto.com

Alta Electronics Supplier of quality interconnect products and custom services.

148 Armstrong Avenue, Georgetown, ON L7G 4S3 Phone: 905-702-9588 Fax: 905-702-7501 Toll Free: 1-800-257-2927 https://www.alta-electronics.com Artaflex Inc. Multinational and integrated EMS firm serving high-mix and high reliability OEMs, with multiple facilities in USA and Canada.

181 Whitehall Drive, Markham ON L3R 9T1 Tel: 905 470-0109 Toll Free: 1 (866) 502-3378 sales@artaflex.com https://artaflex.com Bittele Electronics Inc 2680 14th Ave Unit 1&2, Markham, ON L3R 5B2 Tel: 416-800-7540 Toll free: 1-888-812-1949 sales@7cpb.com https://www.7pcb.com Data Cable Company Custom cable assembly & connectivity solutions provider for a diverse group of industries.

31 Robb Boulevard, Orangeville, ON L9W 3L1 Tel: 1-877-395-5133 information@datacable.ca https://www.datacable.ca

Celestica Canadian multinational electronics manufacturing services company.

1900-5140 Yonge Street PO Box 42 Toronto, ON M2N 6L7 Tel: 416-448-5800 Toll Free: 1 888-889-9998 https://www.celestica.com Creation Technologies Global EMS solutions partner from design, prototyping, to logistics for OEM products.

6820 Creditview Rd, Mississauga, ON L5N 0A9 Tel: 905.814.6323 Toll Free: +1 877-812-4212 https://www.creationtech.com Crest Circuits Inc. Pcb board shop.

2701 John St, Markham, ON L3R 2W5 Tel: 905-479-9515 http://www.crestcircuit.com Custom Rapid Solutions Inc. Medical products design and development - embedded systems design.

377 Canarctic Dr, North York, ON M3J 2P9 Tel: 416-663-1277 info@customrapidsolutions.com https://customrapidsolutions.com ECI Technology Group Inc. A trusted full turn-key partner for OEMs through a responsive and responsible approach.

815 Middlefield Rd #1&2, Scarborough, ON M1V 2P9

Tel: 416-291-2220 https://ecitech.com Elrex Manufacturing Inc. Provider of quality custom fabrications and reliable solutions for your manufacturing challenges.

2413 Stevenage Drive, Unit 8, Ottawa ON Tel: 613-247-0404 info@elrexmfg.com https://elrexmfg.com Fidus Systems Specializes in leading-edge electronic product development with offices in Ottawa & Waterloo.

375 Terry Fox Drive Ottawa, ON K2K 0J8 Tel: +1 (613) 595-0507 x200 https://fidus.com Flex Design services and prototyping 3001 Solandt Rd., Kanata, ON K2K 2M8 Tel: 613-895-2050 https://flex.com/connect/ global-locations Invotek Group Inc. (Mara Tech) Provides reliable product design, engineering services & EMS services.

5680 14th Avenue, Markham, ON L3S 3K8 Tel: 905-201-1787 sales@invotekinc.com https://invotekgroup.com

LEACH makes assembly easier LEACH has provided PCB assembly since 1999. We provide DFM improvements, sourcing and supply-chain management, high-mix engineering and flexible production. We specialize in PCB assembly, IC programming, function testing, box build, global logistics and delivery. Primarily focused within the communications, industrial, medical, RF/GPS, automotive and lighting markets.

Canada Office: 107- 7188 Progress Way, Delta, BC VG4 1M6 Phone: 1 604 940 6797. Email: info@leach-pcba.com Website: www.leach-pcba.com China Factory: Floor 2 & 4, Block 2 Wandl Industrial Park, Guanlan, Shenzhen Guangdong Province, China 518110

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Kingstec Technologies Inc One-stop engineering, manufacturing and logistics business partner.

2335 Argentia Road, Mississauga, Ontario L5N 8K4 Tel: 905- 712-2171 http://www.kingstec.com Mektronix Specializes in setting up SMT lines, including equipment specification, line/plant layout, training and process development.

186 Manitoba Street, Stouffville, Ont L4A 4Y3 Tel: (705) 795-4467 https://www.mektronix.com Microart Services Inc. Electronic manufacturing and design services company providing pcb layout, bare board, pcb assembly testing and box build for proto-type and low-to-mid volume productions.

190 Duffield Dr, Markham, ON L6G 1B5 Tel: 905-752-0800 Toll Free: 1-833-722-3278 Email: inquiries@microartservices.com https://microartservices.com M.I.S. Electronics Inc. End-to-end EMS player and pcb board specialists.

174 West Beaver Creek Rd., Richmond Hill, ON L4B 1B4 Tel: 905-707-2305 https://miselectronics.com

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NeuronicWorks Design engineering & manufacturing company specializing in the development of custom electronics and software products.

210 Lesmill Rd, North York, ON M3B 2T5 Tel: (416) 546-1575 info@neuronicworks.com https://neuronicworks.com OCM Manufacturing Inc. Electronics manufacturing services (EMS) for low-to mid-volume products, plus turnkey product development for industrial controls.

2183 Thurston Dr, Ottawa, ON K1G 6C9 Tel: +1 800-268-3961 info@ocmmanufacturing.com https://ocmmanufacturing.com OES Manufacturing Firm manages electronic products across a wide range of industries including environmental, healthcare, automotive and defense.

4056 Blakie Road, London, ON N6L 1P7 Tel: 877-652-5833 https://www.oes-ems.com PCBIEX Electronics One stop shop for cost-effective pcb solutions.

380 Alliance Ave Toronto, ON Tel: 416-731-2455 Info@pcbiex.ca https://pcbiex.ca

RMF Design and Manufacturing Inc. Electronic design and manufacturing services to clients across Canada and United States.

5675 Timberlea Blvd., Mississauga, ON L4W 2S4 905-602-6777 mdenicola@rmfdesign.com http://www.rmfdesign.com Sanmina Facility partners with some of the world’s most advanced technology leaders to create complex optical and RF/Microwave products.

500 March Road, Kanata, ON K2K 0J9 Tel: 613-886-6000 http://www.sanmina.com

Starfish Medical Medical device development, design and flexible manufacturing.

Box build, complex low-mid volume production.

455 Boleskine Road Victoria, BC Tel: (250) 388-3537 139 Mulock Ave, Toronto, ON M6N 1G9 877-822-3537 Toll Free info@starfishmedical.com https://starfishmedical.com Stim Canada Inc Specialists in pcbs and assemblies.

85 Toro Rd, North York, ON M3J 2A4 TEL: 416-636-4584 https://stimcanada.com

SigmaPoint Technologies Inc Turnkey contract manufacturer, with satellite facility at Catalyst 137 in Kitchener/Waterloo.

2880 Marleau Ave, Cornwall, ON K6H 6B5 Tel: (613) 937-4462 http://www.sigmapoint.com

Symtco Inc. Provider of surface mount equipment for the electronics manufacturing industry.

190 Degraaf crescent, Aurora, Ontario L4G 0X1 Tel: 416-346-1222 http://symtco.com

SMTC Corporation Corporate HQ & operates as Center of Excellence (COE) to global advanced EMS locations.

7050 Woodbine Ave #300, Markham, ON L3R 4G8 Tel: 905.479.1810 contact.us@smtc.com https://www.smtc.com/about/ locations/toronto-canada

Torontronics Circuit Technology Inc. Handles all production needs from low to high volume runs, while delivering cost-effective solutions and expertly crafted products.

110 Ironside Crescent, Unit 20, Toronto, Ontario M1X 1M2 Tel: 647-400-0018 https://www.torontronics.com

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ELECTRONIC MANUFACTURING SERVICES GUIDE 2024

Urtech Manufacturing Inc. Product prototyping, engineering, production-scale manufacturing & post production.

835 Harrington Ct, Burlington, ON Tel: 905-667-2310 Toll Free: 1-877-369-6099 sales@urtechmfg.com https://www.urtechmfg.com Vexos Full service, high-mix, low- to mid-volume electronics manufacturing and custom material solutions provider.

195 Royal Crest Ct, Markham, ON L3R 9X6 Tel: +1 905-479-6203 Toll Free: 1-800-965-4446 https://www.vexos.com/can-markham Vision Circuit Technologies Pcbs developed, manufactured, assembled, tested, and qualified.

HQ; 1755 Woodward Dr., Suite 200,

Ottawa, ON K2C 0P9 Tel: 613.729.1022 Toronto Location: 399 Denison St, Markham, ON L3R 1B7 Tel: 289-846-3394 http://visioncircuits.com XPtronics Inc. Pcb assembly shop focusing on prototypes and low volume, high variety production.

2220 Midland Ave Unit 72BR, Scarborough, ON M1P 3E6 Tel: 905-940-5656 https://www.xptronicsinc.com QUEBEC A1 Electronics Inc. 3160 Rue De Miniac, St-Laurent, Montréal, QC, H4S 1N5 EMS services including BGA and mixed, surface mount technology, through-hole technology, prototype and rapid turn-around pcb assembly.

Tel : 514-956-0777 http://www.a1-electronicsinc.com/en AKT Electronics Inc. Electronic pcb assembly.

5595 Chemin de la Cote-de-Liesse, Suite: 205, Saint-Laurent, QC Tel: 514-747-5960 info@aktelectronics.com https://www.aktelectronics.com Castonguay Electronique Provides a broad range of electronic manufacturing services, including pcbs.

792 Guimond Boulevard, Longueuil, QC J4G 1T5 Tel: 450-463-0685 info@castonguay-electronique.com https://castonguay-electronique. com/en

C2MI - MiQro Innovation Collaborative Centre Fundamental link between applied research and the rapid commercialization of microelectronic products.

45 Boulevard de l’Aéroport, Bromont, QC J2L 1S8 Tel: (450) 534-8000 https://www.c2mi.ca/en Cancino Technologies Comprehensive electronics manufacturing services including in-house pcb assembly, electronics design, and pcb layout services, supporting the entire lifecycle of electronic products from prototype to volume production.

535 Av. Lépine, Dorval, QC H9P 2S9 Tel: 514-631-7667 https://www.cancinotec.com

Dynamic Source Manufacturing (DSM) supports global businesses by bringing their products to market efficiently and with peace of mind, collaborating with them on the entire production cycle.

With electronics manufacturing facilities in Canada and the USA, our success is built on trust, integrity, and focusing on our partners to make connections that last.

We serve diverse industries like automotive, communications, energy, and security & defense.

Along with our ISO 9001:2015 certification, we are certified through Canada’s Controlled Goods Program and the USA’s International Traffic in Arms Regulations.

We proudly hold ourselves to a high standard to provide you with an exceptional customer experience. Connect with us today.

130 6285 76 Ave SE, Calgary, AB, T2C 5L9 • Phone: 403-516-1888 Website: www.dynamicsourcemfg.com @dynamicsource_ linkedin.com/company/dynamicsourcemfg

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CMAC Manufacturer of high reliability electronics solutions for harsh environments – including automotive, aerospace, industrial & medical electronics assembly solutions.

3000 Industrial Boulevard, Sherbrooke, QC J1L 1V8 Tel: 819-821-4524 https://cmac.com Circuits Imprimés De La Capitale Comprehensive range of services, including quick prototype production, CAD design, pcb assembly, conformal coating, technical validation and pcb system integration.

925 Avenue Newton #104, QC, G1P 4M2 Tel: 418-877-9047 https://www.pcbcic.com/en Digico Specialists in complex electronic material, including printed circuits, cables and harness, conformal coating, performing client test and electromechanical integration.

950 rue Bergar, Laval, QC, H7L 5A1 Tel: 450-967-7100 http://www.digico.cc/en Diverse Electronics Authorized electronic components and electromechanical parts distributor.

5400 Boulevard Thimens, SaintLaurent, Quebec H4R 2K9

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(514) 388-7308 Toll Free: 1 (800) 381-7308 sales@diverseelectronics.com https://www.diverseelectronics.com M2S Electronique Full turnkey pcb and pcb assembly services.

2855 rue de Celles, Québec, QC, G2C 1K7 Tel: 418-842-1717 https://www.m2selectronique.com Meatec Inc. PCBA electro-mechanical assemblies and cable harness assemblies 6405 Rue Abrams, Saint-Laurent, QC Tel: 514-340-0033 Toll Free: 1-866-246-0033 info@meatecinc.com http://meatecinc.com Micro PCB Printed circuit board assembly.

1480 Hymus Blvd, Dorval, QC H9P 1J6 Tel: 514-542-4424 https://micropcbinc.com Optimont Inc. Electronic manufacturing service provider, SMT and through hole, PCB and box level, consignment and turnkey.

9995H rue de Châteauneuf, Brossard, QC, J4Z 3V7 Tel: 450-465-1818 Email: info@optimont.com https://www.optimont.com

Orbit Technologies Inc. Specializes in pcb design, manufacturing and assembly services.

2020 Trans-Canada Hwy, Suite 107, Dorval, QC H9P 2N4 Tel: 514-856-0451 Toll-Free: 1-855-344-0451 sales@orbittech.com https://www.orbittech.com Prodexport Technologie Inc. Specializes in the manufacturing of electronic products.

4780 Rue Saint-Félix, Entrée #1, Local 205, Saint-Augustin-deDesmaures, QC G3A 2J9 Tel: 418-266-7977 http://prodexport.ca RS Electronics Pcb assembly services ranging from low to mid-volume production.Sservices include turnkey solutions, component procurement and pcb fabrication.

5580 Rue Vanden Abeele, Saint-Laurent, QC H4S 1P9 Tel: 438-833-8477 https://rspcbassembly.com Starbord Technologies Inc. Provider of smart assembly solutions and consultant, offering a comprehensive range of industryleading solutions for assembly, test, inspection and automation.

Montreal QC Tel: 514-234-2568 1-855-234-4768 info@StarbordTech.com https://starbordtech.com

Varitron End-to-end services in electronic design and manufacturing services.

4811 Ch de la Savane, Saint-Hubert, QC J3Y 9G1 Tel: 450-926-1778 #245 plavoie@varitron.com https://varitron.com

ATLANTIC PROVINCES NOVA SCOTIA Allendale Electronics Ltd. 41 S Water St, Lockeport, Nova Scotia B0T 1L0 Tel: 902-656-2652 https://www.allendale-electronics.com/ Sunsel Systems Manufacturing Corp.

433 Cutler Ave, Dartmouth, Nova Scotia B3B 0J5 902-444-7867 ext. 433 North America: +1-855-718-4787 sunsel@sunsel.ca https://www.sunsel.ca NEW BRUNSWICK CE3 Electronics Inc. Specializes in advanced pcb assembly and complex cable and wire harness manufacturing.

1055 Aviation Ave., Dieppe, New Brunswick E1A 9S5 Tel: 506-858-7817 info@ce3electronics.com www.ce3electronics.com

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DESIGN SOURCE

NEW PRODUCTS

larger parts since it has a working life of 60-90 minutes (at room temperature for a 100-gram batch), making it suitable for demanding situations where more time for fixturing is needed. Product has reliable electrical insulation properties with a volume resistivity exceeding 1014 ohm-cm at 75°F. https://www.masterbond.com/ properties/low-outgassing

POWER SUPPLIES WITH ETHERCAT INTERFACE DELIVER REAL-TIME DATA POWER FACTOR CORRECTION CHOKES BOOST CURRENTS

ITG ELECTRONICS PFC383637B Series power factor correction chokes (PFCs) are designed for comparatively high-wattage applications. Devices can handle up to 3,300 Watts and include CCM PFC boost converters with switching frequencies from 60-200Khz. Solutions are suitable for Inductance ranges from 180360uH, and have footprints up to 37.5 x 36.5mm and maximum heights of 36mm. Products feature a flat wire and square core construction to save space and increase power density.

Devices are up to 50% smaller. www.ITG-Electronics.com/ category/3

SMALL-SIGNAL MOSFETS ARE AECQ101-QUALIFIED TAIWAN SEMICONDUCTOR

400 - 750W RUGGEDIZED BUCK DC-DC CONVERTERS CONDUCTION COOL

PULS

TDK LAMBDA

RGB series of 400 to 750W rated, ruggedized, non-isolated dc-dc converters operate from input voltages of 9 to 18V, 18 to 32V or 18 to 60V. The buck step-down converters deliver output voltages adjustable from 0.8 to 8V or 3.3 to 24V with output currents of up to 60A (depending on the power level).

Efficiencies of up to 98.5% allow the product to deliver high usable power in demanding thermal environments with case temperatures of -40C to +115oC, while providing a longer battery life. https://www.emea.lambda.tdk. com/uk/products/rgb

240W and 480W DIN rail power supplies equipped with integrated EtherCAT interface enable efficient and time-saving configuration, operation monitoring and remote control. Devices provide a wide range power supply and application data, such as voltage and current characteristics on the input and output side.

Products are connected directly to an EtherCAT controller without requiring additional gateways, which allows easy and fast access to all measured values and power supply functions. https://products.pulspower.com/ en/power-supplies-with-ethercat

26 ELECTRONIC PRODUCTS & TECHNOLOGY / September 2024

Redel MP series (‘M’ for modular and ‘P’ for plastic) Push-Pull connector series provides a modular system allows engineers to easily configure, design with flexibility. Product series features a broad range of standard modules for power, signal, data, fibre optic and fluidic connectivity that can be combined into one single hybrid connector. Product series also includes high contact density modules, which allows up to 144 contacts in a compact connector by using the Card Edge concept. These pcb modules can be further customized with the integration of intelligence, such as an EPROM. https://www.lemo.com/en/ solutions/highlights/redel-mp-series

CONTROLLERS UPGRADE FEATURES, CAPABILITIES WAGO

RALTRON

MASTER BOND

Supreme 11AOHTLP two-component epoxy provides thermal conductivity and electrical insulation. The system is specifically designed for bonding

LEMO

MOBILE SPEAKERS ARE IP67/68 RATED

EPOXY MEETS NASA LOW OUTGASSING SPECS

TQM Family of AEC-Q101-qualified, small-signal MOSFETs includes 10 new parts that meet the AEC-Q101 global automotive standard for reliability. Devices are available in N-MOS or P-MOS and in single- or dual-channel configurations. All come in industry-standard packages and provide leading >2KV ESD withstanding capability. http://www.tscus.com

MODULAR CONNECTOR SYSTEM PERMITS CUSTOMIZATION

RSP-900 line of mobile speakers with IP67/68 ratings for use in IoT, wearable, headset/hearing, smart home, consumer and medical devices. Speakers can withstand immersion in water up to 50+ meters. Available in solder pad or spring termination with sizes ranging from as small as 12x5.5x3mm to 38x13x3.7mm.

Devices feature sound pressure levels (SPL) from 87.5db to 103db. https://www.raltron.com/speakers

PFC100 family of four second generation (G2) controllers include increased memory, and are programmed with CODESYS 3.5 and can be easily configured using the controller’s Web Based Management System. With TLS encryption, VPN capabilities and a built-in Firewall these controllers are equipped with optimum security standards.

Products support multiple fieldbus protocols enabling gateways between many of these interfaces. www.wago.us EPT.CA

ELASTOMER SOCKET VERIFIES PERFORMANCE OF AI CHIP IRONWOOD

To verify the performance of high power artificial intelligence chip, 80+ GHz bandwidth elastomer socket can be used with heatsink/axial flow fan to remove 250+ watts of heat generation. Elastomer socket is transparent such that the performance is equivalent to direct solder version. Self inductance of elastomer is 0.1nH and the socket can be operated from -55C to +160C. https://www.ironwoodelectronics.com/press/elastomer-socketfor-ai-chip

COMPACT TACT SWITCH DELIVERS SURFACE MOUNT DESIGN E-SWITCH

TL1030 Series tactile switch features a surface mount design and a compact size of 3.5 x 2.9mm. There are four different operating force options to

choose from: 160, 200, 350 (200,000 life cycles) and 500gf (100,000 life cycles). Device also comes with (or without) a ground terminal and has an electrical rating of 50mA at 12Vdc. Product’s precision and versatility makes it suitable for portable devices and advanced technology applications.

Available in tape and reel packaging. https://www.e-switch.com/ wp-content/uploads/2024/07/ TL1030.pdf

FAULT LOCATOR TROUBLESHOOTS ELECTRONIC ASSEMBLIES POLAR INSTRUMENTS

GRS200 fault locator uses the proven passive analog signature analysis and compares a faultless electronic assembly with the board under test.

This method detects typical faults in electronics production, service and repairs quickly and without extensive circuit knowledge. Product detects missing or reversed components, incorrect component values or component types, counterfeit components, as well as short circuits or opens can be recognized very easily. System consists of analog signature hardware and powerful software with LIVE signature analysis, program mode and CAD data display. https://www.polarinstruments. eu/en/

PCB TERMINAL BLOCKS DELIVER PUSH-IN SPRING TECHNOLOGY

factor, a 0.4mm pitch, and a stacking height of 3.0 to 4.5mm. Suitable for pcbs with multiple connector sets, connector delivers a wide floating range of ±0.4 mm in XY direction. By absorbing board misalignment errors, floating simplifies assembly and improves assembly work efficiency. https://www.hirose.com/en/ product/pr/BM54

DEGSON newly developed pcb terminal blocks with ‘push-in’ spring technology respond to market demands. The outlet direction and operating direction are on the same side, which can integrate pcb terminal blocks into the front of the device to save device space. At the same time, the front of the product integrates test holes, allowing customers to easily and safely perform electrical test. https://s-pintl.com/degson-pcbterminal-blocks-with-push-inspring-technology

400VDC INLET CONNECTORS OPERATE TO IEC TS 62735

SP INTERNATIONAL

FLOATING BOARD-TOBOARD CONNECTOR IS TINY HIROSE ELECTRIC

BM54 Series board-to-board connector combines floating functionality and miniature size to meet automotive specifications.

Product series features compact design, while boasting a tiny width class for its category. The space-saving device features a small form

SCHURTER

400Vdc family now includes GC21 and GH21/GI21 400Vdc appliance Inlet connectors that operate in accordance with IEC TS 62735, on the device side – and are IECcompliant. Dc connector systems are standardized according to IEC TS 62735-1 for efficient power distribution in data centres, for power distribution strips and UPS applications back in 2019. GI21 model is designed for pure dc operation, while the GH21 is a hybrid version and can therefore accept both ac and dc current. Both units are hot plug-capable for disconnection under load up to 2.6 kW and up to 105°C operating temperature. Use of bio-based plastics on the appliance side. https://www.schurter.com/en/ datasheet/GC21

Don't Let Uncertainty Define Your Production Eliminate worries with timely deliveries and transparent communication.

Master your supply chain with DSM for seamless operations and unmatched efficiency.

dynamicsourcemfg.com

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Electronics Manufacturing Services Canada: 403 516 1888 | USA: 602 833 8591

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SUPPLY SIDE NEWARK EXPANDS EDUCATIONAL OFFERINGS

ROBOTICS

NVIDIA ACCELERATES HUMANOID ROBOTICS DEVELOPMENT

In an effort to accelerate humanoid development on a global scale, NVIDIA is providing leading robot manufacturers, AI model developers and software makers with a suite of services, models and computing platforms to develop, train and build the next generation of humanoid robotics.

Among the offerings are new NVIDIA NIM microservices and frameworks for robot simulation and learning, the NVIDIA OSMO orchestration service for running multi-stage robotics workloads, and an AI- and simulation-enabled teleoperation workflow that allows developers to train robots using small amounts of human demonstration data.

“The next wave of AI is robotics and one of the most exciting developments is humanoid robots,” said Jensen Huang, founder and CEO of NVIDIA, a global leader in accelerated computing. “We’re advancing the entire NVIDIA robotics stack, opening access for worldwide humanoid developers and companies to use the platforms, acceleration libraries and AI models best suited for their needs.”

SOFTWARE

ULTRA LIBRARIAN, FOOTPRINTKU AI PARTNER ON EDA

Ultra Librarian, an Accelerated Designs brand and the world’s largest online CAD library with

over 16 million parts and counting, is pleased to announce a strategic partnership with Footprintku AI, the leader in DFMaware CAD library development.

This partnership aims to solve one of the largest manufacturing issues plaguing hardware design teams today, CAD library DFM.

“The CAD library is the core building block of any PCB design flow.These libraries need to accurately represent all aspects of the parts being designed, ensuring the manufacturing systems being used to ultimately build the boards can run without issue,” said Manny Marcano, president, Accelerated Designs LLC. “Working with Footprintku AI will enable us to further enhance the DFM capabilities of our library across all the CAD tools we support, giving design teams the security that they can go to manufacturing with confidence.”

The two companies will work to bring Footprintku AI’s pioneering technologies in Design-for-Manufacturing (DFM) processes into the Ultra Librarian CAD library. As part of the Ultra Librarian Virtual Librarian Service (VLS), this collaboration will provide a new on-demand DFMaware library for companies looking to enhance and validate their libraries for DFM.

28 ELECTRONIC PRODUCTS & TECHNOLOGY / September 2024

Digilent and NI engineering teaching solutions are now available from Newark to empower educators and researchers with a suite of hardware and software tools to support learning experiences in both traditional and remote learning environments.

Digilent excels in providing affordable and portable devices for learning circuits and digital logic remotely, making them a perfect fit for the recent rise of remote and hybrid learning environments. Their products are lightweight, USB-connected, and cater to the needs of both students and educators.

Digilent’s popular products, like the Analog Discovery 3 and the Analog Discovery Studio, allow students to use a Windows/ Mac/Linux machine to become one of many real-world test devices like an oscilloscope, logic analyser, pattern generator, and more. Powered by Digilent’s own WaveForms software, these tools – small enough to fit in a backpack – give professors and students the flexibility to teach or learn in a way that’s best for them.

SEMICONDUCTORS

DIGIKEY IMPROVES MEMORY, ADDS KINGSTON TECH

DigiKey has partnered with Kingston Technology to offer its memory and storage solutions.

Source: Kingston Technology

DigiKey has partnered with KingstonTechnology to distribute its memory and storage solutions globally.

As the world’s largest independent manufacturer of memory products, Kingston offers a wide variety of options, including eMMC, eMCP, ePoP, UFS and DRAM components for industrial and embedded OEM customers of all sizes. The company also provides an industrial SSD line of SATA and NVMe solid state drives (SSDs) created specifically for system designers and builders.

With this agreement, DigiKey can now offer Kingston’s products worldwide for immediate shipment, including embedded products, USB drives, enterprise solid state drives (SSDs), industrial SSDs, and Kingston memory modules for use in IoT, networking and communications, embedded, infotainment, bio-medical, industrial.

ENVIRONMENTAL

ENVIROPASS OPENS COMPLIANCE LAB IN MONTREAL

Environmental compliance consultancy Enviropass marked the grand opening of its new stateof-the-art laboratory in Montreal. This cutting-edge facility marks a significant milestone in Enviropass’s commitment to providing top-tier services and advancing sustainable practices across various industries.

The new lab features the latest technology and instruments to handle environmental testing and analysis. The facility also offers comprehensive testing services, including chemical analysis, material characterization, and product compliance testing, ensuring that businesses meet critical environmental standards such as RoHS, packaging, and battery regulations.

EPT.CA

Photo: NVIDIA; Accelerated Designs; Newark; Kingston Tech; Enviropass

EDUCATION

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29

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DEVELOPMENT BOARDS Wireless charger evaluation board boosts performance, lowers BOM VENDOR: EGGTRONIC 30W WIRELESS CHARGER EVAL BOARD 30W wireless charger evaluation board will speed the prototyping and development of ultra-high-efficiency, low-component-count wireless power transfer applications ranging from electric bikes and scooters through home appliances and industrial tools to drones and domestic robots.

The eval board is a high-performance wireless charger in which the transmitter works with a direct ac input, eliminating the need for external adapters. The receiver supports CC/ CV battery charging (other options are fixed voltage, and USB-C Power Delivery output), eliminating the need for a standalone PMIC. The key components of the board include the EPIC (Eggtronic Power Integrated Controller), which includes a RISC-V core, a rich set of analog and digital peripherals, a patented interconnection matrix to run multiple virtual ASICs inside the chip, and a number of proprietary peripherals. EPIC is designed to be the perfect controller for Eggtronic-patented power conversion and wireless power architectures, reducing the number of ICs on pcbs and improving performance. This integration also reduces the Bill of Materials (BOM) by minimizing the number of ICs required.

The new board is based on a series-resonance wireless power transfer, which can be compatible with the Qi standard.

The eval board achieves an overall efficiency higher than 82% from ac input to dc output, and above 91% dc to dc (coil-tocoil) efficiency at 30W - an efficiency that is similar to conventional corded power adapters at the same time as offering the convenience of wireless power.

Key features of eval board.

Operating with up to 92% efficiency and delivering up to 300W, eval board delivers all the benefits of wireless power transmission with performance comparable to top-tier wired ac adapters, while reducing both active and passive component counts by 50%.

Photos: EGGTRONIC

• Up to 30W continuous output power • AC/DC stage Integrated - Single EPIC controls both AC/DC and transmitter.

• CC/CV battery charger capabilities integrated with the receiver EPIC IC. • Peak efficiency > 82% from AC input to DC output • High Coil-to-Coil efficiency > 91% • FOD (foreign object detection) protection • Multiple safety protections: OPP, OVP, OTP, SCP, BOP…

Relevant Link: https://www.eggtronic.com/ wireless-power/e2watt/

30 ELECTRONIC PRODUCTS & TECHNOLOGY / September 2024

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