Electronic Products & Technology September 2018

SEPTEMBER 2018 CANADA’S INFORMATION LEADER FOR ELECTRONIC ENGINEERS AND DESIGNERS

EPT.CA

RUGGED CONNECTORS

Deliver the speed and power of communication protocols p. 15

WIRELESS DESIGNS Merging antenna and electronics boosts energy and spectrum efficiency p. 21

EMBEDDED SYSTEMS & AI

Embedded systems help AI programs interact with the physical world p. 24

SENSOR TECH

LeddarTech’s sensing technology alters path of autonomous vehicles p. 10

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Cover photo:LeddarTech Photos (this page, from top): LeddarTech, Fischer, Georgia Institute of Technology, Total Phase

INSIDE Columns

4 EDITORIAL State of the Canadian wireless industry 13 WEST TECH REPORT Aurora Solar Technologies grows via partnerships

In every issue

7 NEWSWATCH 29 PRODUCT SOURCE 29 AD INDEX 30 TEARDOWN BEAM smart button

SEPTEMBER 2018

COVER STORY

10 15 21

24

SENSORS LeddarTech seeks to make automobiles more ‘sensitive’ CONNECTORS Rugged connectors support the power of high-speed communication protocols 17 ‘Connecting’ within the nuclear power industry 19 New Products

15 24

WIRELESS Merging antenna and electronics boosts energy and spectrum efficiency 23 New Products EMBEDDED SYSTEMS The future of AI and the embedded system 25 New Products

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EDITORIAL

Wireless industry poised to drive future innovation

Canada’s information leader for electronic engineers and designers SEPTEMBER 2018

Volume 40, Number 6 EDITOR Stephen Law slaw@ept.ca · (416) 510-5208 WEST COAST CORRESPONDENT

Wireless technology is the backbone of innovation – serving up a bright future for all industry sectors, good jobs for Canadians, and increased coverage across all provinces and territories. A future built on innovation and continued investment is only possible when we have stable policies that recognize facilities-based competition.

Those were the words of Robert Ghiz, president & CEO of the Canadian Wireless Telecommunications Association (CWTA) while addressing members of the wireless industry during the Canadian Telecom Summit in Toronto this summer.

connected. And, most impressively, not only are Canadians high adopters of wireless services they are also high adopters of the latest wireless products. Forecasts show this trend will continue.

“This growing demand is incredible when you think about it.

Very few industries — if any — can look ahead and forecast a growth in demand of 500%,” Ghiz said.

High adoption of wireless services, high penetration rates for the latest wireless devices, and ever-growing demand for mobile data all point to Canada’s leadership in wireless, and a Canadian innovation success story for which all Canadians can be proud, Ghiz stated.

So where are we going? Where will this path forward lead us?

The whole world is now on the cusp of this next great wireless revolution and staying the course will ensure Canada is well poised to maintain its leadership status through the coming transition.

According to Ghiz, it’s become increasingly obvious that the wireless sector is one of the most important industries in Canada, as every other industry depends on its infrastructure.

“Our industry has been shaped by some of the greatest innovators in Canadian history, whose efforts to deploy world-class wireless networks all across our vast nation serve not only the needs of consumers, but also vertical industries too numerous to list. Virtually every sector in our economy depends on Canada’s wireless industry for its continued growth and success,” Ghiz said.

According to the most recent CRTC numbers, more than 30 million Canadians are wirelessly

The answer is obvious to Ghiz: 5G. “The whole world is now on the cusp of this next great wireless revolution and staying the course will ensure Canada is well poised to maintain its leadership status through the coming transition,” Ghiz said.

Smart cities, remote medicine and advanced agriculture and manufacturing are just a few of the applications that 5G will further enable according to Ghiz, and with them deliver the innovation, economic growth and well-paying middle-class jobs that the Government of Canada has identified as cornerstones of its agenda.

To do its part, CWTA has established the 5G Canada

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Council, seeking input from a wide range of stakeholders and ensuring the smooth rollout of 5G infrastructure, which may require streamlining regulations and approval processes in Canada.

CWTA is doing its part in that regard by meeting with relevant authorities at all levels of government. Ghiz says that continued collaboration and ongoing dialogue between all stakeholders will be key.

“All levels of government, all facilities-based carriers, and all network equipment and handset manufacturers need to have a collective understanding of the evolving challenges and opportunities in 5G, and collaboratively tackle issues as they emerge to ensure Canada remains among the global leaders in wireless,” says Ghiz. “This drove home the point that we must work together – industry, regulators, and government – to ensure that Canada remains a leader in wireless services.”

As a complement to its work through the 5G Canada Council, CWTA has also commissioned a study on the predicted economic impacts of 5G in Canada, which it expects to release later this year.

“As I said earlier, we are a global wireless success story. We are a leader right now. But, if we want an innovative economy for the future, we need to stay the course. We need to maintain a regulatory environment that will not stand in the way of investment,” enthused Ghiz. “If we want future generations of Canadians to enjoy the benefits of wireless leadership that we enjoy today, we need to move forward, and do it together.”

STEPHEN LAW Editor slaw@ept.ca

Sohail Kamal sohail@nextgear.ca

ASSOCIATE PUBLISHER Scott Atkinson satkinson@ept.ca · (416) 510-5207 ACCOUNT MANAGER Joanna Malivoire

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NEWSWATCH WEARABLE

MYANT & BUTLER FORM WEARABLE TECH PARTNERSHIP

Toronto-based Myant Inc., designer developer of textile computing products, has reached a licensing agreement with Butler Technologies Inc. (BTI), a Pittsburgh-based developer and manufacturer of printed electronic solutions. The deal involves Myant’s wearable electro-luminescent (EL) lamp technology and a partnership for the advancement of textile computing through Butler’s participation in Myant’s Digital Textile Factory initiative.

Myant’s patented EL lamp technology emits light visible under any weather conditions and from any angle. More visible than LED light in inclement visibility, the EL technology shines a blue light, the colour the human eye registers first, to make the LeddarCore LCA2 system-on-chip (SoC). wearer as visible as possible.

This technology builds on a naturally occurring phosphor powered by with post-secondary institutions, as a small power source and is completewell as opportunities for start-ups and ly washable and flexible. In addition to other industry players to participate. the technology licensing agreement, BTI will join Myant’s Digital Textile The Digital Textile Factory will give Factory initiative as a trusted expert entrepreneurs, innovators and established industry players access to a on printed electronics. virtual factory for ideation, research & “The collaboration with Butler is a development, access to yarns and strong example of our efforts to develop a distributed model of advanced connectors, and design and manufacturing at scale. manufacturing in North America, one that will help recreate the culture of SENSORS ‘making’ right here at home,” says Myant executive VP Ilaria Varoli.

LEDDARTECH DELIVERS “Myant has been investing in the development of a valuable portfolio of LCA2 LIDAR CHIPS TO technologies and intellectual property AUTO PARTNERS LeddarTech, Quebec City, has delivrelated to textile computing, printable ered the first A-samples of its Leddarelectronics and electroluminescent Core LCA2 system-on-chip (SoC) to lighting applications since 2010,” an automotive partner that will be Varoli adds, publicly disclosed at a later date this Nadine Tripodi, president and year. owner of BTI concurs. “This partnership will extend our established experThe LCA2 is the autonomous vehicle Digital Textile tise in functional printing and printed industry’s first 3D solid-state LiDAR Factory will give electronics into new applications, (SSL) SoC and is available now to notably as they relate to textile com- entrepreneurs and Tier-1 automotive manufacturers and puting and its application in military, established players system integrators via purchase of the access to a virtual industrial, medical, apparel and other LeddarTech LCA2 evaluation kit. factory for ideation. High-volume delivery of the LCA2 industries.”

Future collaboration between will begin in the first half of 2019 for Myant and BTI will likely include the deployment in Autonomous Driving installation of a Myant Digital Textile (AD) and Advanced Driving Assistance Systems (ADAS).

Factory in the Pittsburgh area. Doing The LCA2 uses LeddarTech’s Ledso will provide the foundation for the darSP signal processing software to development of an ecosystem for textile computing and printed electronics produce raw LiDAR data such as in Pennsylvania with significant opdistance, position, and intensity of portunities for research collaboration echoes. LCA2 is suitable for a wide

Photos: Mirna Chacín; Borealis AI

R&D

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range of applications, can be produced in high volumes for rapid mass-market deployment, and is ideal for SSL used in AD/ADAS. LeddarTech’s technology – including the LCA2 and LeddarSP – is supported by an IP portfolio containing 58 patents (44 granted, 14 pending).

“We’re proud to be the first company in the industry to deliver 3D solid-state LiDAR SoCs,” says LeddarTech general manager of automotive business unit Michael Poulin.

“This announcement shows that LeddarTech is a company that’s beyond the point of conceptualization and delivers on its ideas and promises.”

LCA2 evaluation kits are available to prospective automotive partners and benchmark the technology against intended application requirements. Kits contain: One fully-functional solid-state LiDAR unit integrating an LCA2 SoC LeddarSP signal processing software Additional software to facilitate evaluation and application development Tier-1s and OEMs that order an evaluation kit are able to immediately begin application development and integration efforts of their custom LCA2-based LiDAR. To accelerate and suppor t par tner development of LCA2-based LiDAR, LeddarTech is providing engineering services and access to the company’s SSL experts.

• • •

EDUCATION

LG UNVEILS TORONTO AI RESEARCH LAB

LG Electronics Inc. has launched an AI Research Lab in Canada, an extension of the newly expanded LG Silicon Valley AI Lab in Santa Clara, CA. Supporting LG’s vision of AI as a key future growth engine, the North American labs further enhance LG’s global research capabilities, which include AI labs in South Korea, India and Russia.

In addition, LG is entering into a new research partnership with the University of Toronto, which is recognized worldwide for its AI and machine learning expertise, particularly in the area of deep learning.

“AI will ultimately touch everybody’s lives, transforming the way we live, work and play,” said LG Electronics president and CTO Dr. I.P. Park.

“Early implementations of AI in connected devices today are setting the stage for tomorrow’s smart cities, smart homes, smart businesses and September 2018 / EP&T

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NEWSWATCH smart devices, all with capabilities that no one has even dreamed of yet.”

He said the North American labs and LG’s research partnership with the University of Toronto will play a key role in developing source technologies defining that future.

Under its five-year, multimillion-dollar research partnership with UofT, LG will build on its Open Platform-Open Partnership-Open Connectivity strategy to expand the AI ecosystem.

The lab will capitalize on the

expertise of researchers at UofT, who will now have the opportunity to work collaboratively with LG’s growing U.S. and Canadian AI R&D teams. Complementing this work, LG intends to collaborate with and invest in North American start-ups.

“The presence of such leading, multi-national firms in our innovation ecosystem strengthens opportunities for our faculty, students and start-up companies across a whole range of disciplines,” says UofT president Meric Gertler.

Dr. Meric Gertler, president, University of Toronto, and Dr. I.P. Park, president & chief technology officer, LG Electronics, finalize the 5-year, multi-million dollar AI research partnership with the University of Toronto.

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The Information and Communications Technology Council (ICTC) and Carleton University’s co-operative education office announced a partnership to expand career opportunities for students within the autonomous vehicle (AV) sector and to advance Ottawa’s position as the AV capital of Canada.

The partnership is expected to help fulfill a core part of ICTC’s Work Integrated Learning (WIL Digital) program by creating high-quality subsidized work placements at AV companies across Canada.

The aim of the partnership is also to strengthen industry-academia collaboration and prepare students for the jobs of the future.

According to a recent ICTC report AVs will create more than 34,000 high-quality jobs in Canada over the next five years.

ICTC and Carleton University co-op are ensuring that Ottawa cultivates the workforce necessary for the future and becomes Canada’s AV capital.

“Our government is putting Canada’s skilled, talented and creative people at the heart of a more innovative economy.

Through the Student Work Placement Program, we are helping students today get the education and on-the-job experience they need to succeed and build better futures for themselves,” says Patty Hajdu, Minister of Employment, Workforce Development and Labour.

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SENSORS

COVER STORY

LeddarTech senses the future of transportation with its leadingedge LiDAR technology Quebec City-based developer and owner of Leddar light detection details its use in autonomous vehicles. BY STEPHEN LAW, EDITOR EPT

Level 2 and 3 advanced driver-assistance systems (ADAS) represent the single largest opportunity for near-term adoption of SSL solutions.

LeddarTech Inc. is a Quebec City-based developer and owner of Leddar, a patented solid-state LiDAR sensing technology that constitutes a novel approach to light detection and ranging. Developed over 10+ years of R&D, Leddar is a unique combination of advanced light wave digital signal processing and software algorithms that enable the production of solid-state LiDARs. EP&T takes this opportunity to pose some questions to Michael Poulin, General Manager of Automotive Business Unit at LeddarTech. go beyond mobility to less traditional vehicles like drones, robotics and other fields. For autonomous vehicles, L2 and L3 ADAS (advanced driver-assistance systems) applications represent the single largest opportunity for near-term adoption of SSL solutions.�

With customers ranging from specialized integrators to tier-1

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Photo: LeddarTech Inc.

Describe the multiple applications solid-state LiDAR is used in today (automotive, intelligent transportation systems, drones and UAVs, industrial commercial vehicles). “When it comes to solid-state LiDAR, anything that needs to have a perception of its environment is a target, and this can

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manufacturers, describe the type of work LeddarTech performs as a ‘technological partner’.

“There are two parts to this. The first part is the technical service we provide directly to our partners: LeddarTech offers direct LiDAR engineering support to our partners to assist with development of their custom solutions. Through our LeddarEngine Development Platform, we provide Tier-1s with the key

sectors were most impacted within your Canadian customer base.

“We saw growth in Canada for multiple applications, namely intelligent transportation systems (ITS) and industrial vehicles. ITS is an exciting sector because of the number of use cases is has for LiDAR, like traffic monitoring, automated tolling, speed enforcement, and vehicle measurement. When you think about smart cities, these are applications that are essential.”

Describe LeddarTech’s mission to solve intelligent mobility sensing application challenges with the many advanced solutions in electronic designs today.

“LeddarTech’s unique technology and know-how enables high-performance, low-cost LiDAR solutions that are very well adapted to mobility applications. This includes automotive passenger cars and commercial vehicles, as well as many other types of vehicles used for the

LeddarTech provides direct LiDAR engineering support to its partners to assist with development of its custom solutions. We have seen growth in Canada for multiple applications, namely intelligent transportation systems and industrial vehicles. components and tools needed to develop and produce differentiated SSL solutions tailored to OEMs’ specific ADAS and AD requirements. Working closely with our partners in this manner allows us to deliver a solution that meets the exact specifications they’re looking for, while accelerating development for our partners. This LeddarEngine platform is based in part on a LeddarCore SoC, which is why the delivery of our LCA2 SoC is prominent news for businesses looking to advance their ADAS system timeline.

Second, our LeddarTech Ecosystem is a tremendous asset to Tier-1s and OEMs. The Ecosystem is a group of world-class suppliers of component and software development tools prequalified to integrate with LeddarCore SoCs like the LCA2, which cuts down on time and risk in the development and deployment cycle for our partners. Partners working with LeddarTech benefit from the strength of our Ecosystem by seeing reduced technical risks, increased design agility, and a faster path to high-volume commercial deployments.”

Describe the importance of recent release LeddarCore LCA2 system-onchip (SoC) within the automotive sector. What impact will it have to the evolution of autonomous vehicles?

“The LCA2 will be the first SoC widely available to the automotive industry for implementation of cost-optimized 3D SSL meeting the requirements of autonomous driving at L2 and above. Clients developing on the LCA2 can supply LiDAR to OEMs for MY2020, and its availability in samples enables fully-working LiDAR units and application software with function and form factor very close to the final products.” @EPTmagazine

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transportation of people and goods such as shuttles, buses, various utility vehicles and even off-road vehicles.

On one end, we provide a LiDAR development platform centered on the LeddarCore LCA SoCs for volume applications where clients are supplying to vehicle manufacturers. On the other, we sell LiDAR modules for integration into lower-volume applications where custom LiDAR development is not required or justified.”

Define the size and scope of LeddarTech’s engineering team. How important is it to have all the different levels of engineering disciplines communicating openly with each other?

“We are in accelerated-growth mode, and the past year and a half have been transformative for us in size and scope across the company. We grew our team by 70% last fiscal year, and then followed that up with about 40 more hires primarily within the automotive and R&D teams. As of August, we stand 115 employees strong. We’re also expanding out of Quebec City, adding talent that’s experienced in automotive and semiconductors. Within our engineering departments, some of our engineers support our customers, and some hold experience in managing products. This breadth of knowledge across disciplines gives us the luxury of having a large engineering team that’s agile. Communication is especially important when a company is growing, and we keep that in mind whenever we outline processes.”

In the first half of its fiscal year, LeddarTech’s general-purpose LiDAR module solutions experienced growing customer traction. Describe which

Michael Poulin is the General Manager of Automotive Business Unit at LeddarTech.

Recent reports from industry analysts on LiDAR market opportunity confirm the strategic position of SSL technology in terms of enabling mass-market autonomous driving deployments.

Describe the challenges for LeddarTech to remain relevant and at the top of this emerging design space.

“We’re in an advantageous position in the market, with terrific leadership in place with Charles Boulanger and Frantz Saintellemy. Our challenge for the remainder of 2018 is to continue to foster automotive partners which we can deliver product to, thereby demonstrating our ability to deliver industry-first innovations.

We’ve demonstrated our ability to execute, develop, and deliver with the LCA2, and are already repeating the cycle with the LCA3 SoC, further gaining traction in the industry. In the long term, we are working on our next generation of LiDAR solutions that will bring increased performance and cost reduction.”

As the first company in the industry to deliver 3D solid-state LiDAR SoC, describe how this demonstrates LeddarTech has ‘arrived’ – as a company that’s beyond the point of conceptualization.

“There’s an unquestioned amount of anxious anticipation for autonomous vehicles, and new developments in our industry attract considerable attention.

Unfortunately, many of those developments are misunderstood by the general public, especially in situations where industry competitors refer to the potential of a product without a shipment timeline.

With the LCA2, we’re not talking about a future possibility – we’ve produced a real product and shipped it to our partners, pushing the industry forward with something that actually exists and can be evaluated. We say we’ve arrived because we’re well beyond a theoretical model of transportation; We’re pushing the industry forward with our actions.”

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September 2018 / EP&T

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CPS

SENSORS

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HUMIDITY SENSOR SERVES BATTERYDRIVEN APPLICATIONS SENSIRION SHTC3 ultra-low power, digital humidity sensor is optimized for battery-driven applications and

high-volume consumer electronics.

Device overcomes conventional limits in size and power consumption in order to fulfill current and future requirements and boosts performance-price ratio. Device improves the performance and flexibility of the SHTC1, while maintaining its proven reliability. www.sensirion.com/shtc3

OPTICAL ENCODERS SERVE WIDE RANGE OF DESIGN OPTIONS

GRAYHILL Series 62AG, 62NG and 62SG Optical Encoders feature optical switching technology for high operational life and provide enhanced tactile

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feedback to the user in a wide range of applications. Devices deliver improved advantages in reducing shaft wobble; durability, including side load, impact load, and pull out strength; life rating; switch haptics, such as torque consistency; and seal integrity. Output options include absolute or quadrature 2-bit binary code.

Custom shaft and threaded bushing sizes are available, as well as other customized features such as detents and tactile feel, termination and cabling and mounts. www.grayhill.com

MINIATURE LVDT POSITION SENSORS OPERATE IN HARSH ENVIRONMENTS

NEWTEK SENSOR SOLUTIONS M-375 miniaturized series of ac-operated LVDTs position sensors provide a lightweight and compact 3/8” diameter size that delivers reliable linear position feedback in rugged industrial applications with tight space and weight restrictions.

Compact devices provide high response dynamic measurement for machine operations, with a corrosion-resistant, nickel-iron alloy

housing and core. Environmentally-robust devices operate in temperature extremes of -55°C to +°135C with optionally extended ranges of -55°C to 204°C. www.newteksensors.com/ products/m-375-series/ For more “From the archives,” check out ept.ca.

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WEST TECH REPORT

Aurora Solar Technologies sees sunny days through solar cell partnerships Founded in 2009, Aurora Solar Technologies Inc. is a Vancouver-based company that assists solar cell manufacturers improve in-line processes. By measuring, visualizing and controlling critical processes, Aurora Solar decreases the variability of cell power in the individual cells produced and reduces the amount of scrap and rework in the production process.

West Tech Report speaks with Steve McDonald, Aurora’s VP of business development about the firm’s technologies and its growth.

What was the impetus for starting Aurora Solar Tech and what has aided its recent growth?

“We saw a significant opportunity for inline process

control in the photovoltaic (PV) space. The PV industry was expanding rapidly and production capacities were steadily increasing, but the production procedures were not being optimized for high volume manufacturing. There was a wide quality variance at the end-of-lines, and a significant amount of manual labour was required during production. As the PV industry matures, quality control and efficiency become more important.

We saw early on that automation and process control would represent a substantial opportunity for Aurora’s customers to reduce operating costs while improving quality. Since deploying our first inline process control solutions, we’ve seen a dramatic shift in the industry. Manufacturers now see the value of inline process control,

and this has supported our growth significantly.”

Has it helped to be located within Vancouver’s tech community?

“It has been very helpful. From a staffing standpoint, we have exceptional access to local talent with clean-tech experience. From a geography standpoint, we have easy access to Asia where the vast majority of our customers are located.”

Can you share a challenge that Aurora has had to overcome, and how others can avoid?

“Ramping up production volumes.

Aurora saw sales rise from a few to dozens of systems per year, which strained our supply chain and

production team. To avoid this pitfall, Aurora had to set-up detailed production processes and procedures very early in the ramp-up process. Formalizing the production process takes time and effort, but the benefits are well worth it.”

Was this a result of being surprised by your success or were you not prepared enough?

“We weren’t surprised by our growth, but the increase did force us to work more closely with supply chains to ensure we get the volume of parts required.”

Any advice for entrepreneurs?

“Listen to your customers. They have a far better understanding of their operational needs, and thus they are invaluable when launching new products.

THE WAY TO CONNECT

Sohail Kamal is EP&T’s West Coast correspondent. sohail@nextgear.ca

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COMBITAC

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CONNECTORS INTERCONNECT

FEATURE

Rugged connectors and the power of high-speed communication protocols

The most relevant parameters that determine whether a connector or cable assembly can deliver the speed of your selected protocol. BY JEAN-MARIE BUCHILLY No one has to tell an engineer that modern equipment demands high-speed data transfer. However, making sure those high speeds are maintained continues to challenge the best of us.

It makes sense that engineers look closely at all components, including cables and connectors, when they need to deliver data at top speeds throughout their system.

This article provides an overview of the most relevant parameters that determine whether a connector and/or cable assembly can deliver the speed of your selected protocol. Selecting the right protocol for a new digital system or technology requires consultation with a reputable connectivity supplier that can help the design team make the right decisions.

So what does a ‘communication protocol’ actually define? It is a system of digital message formats and rules for exchanging messages in, or between, computing systems or in telecommunications. Communication protocols can include signaling, authentication, and error detection and correction capabilities.

A protocol can be implemented as hardware, software or both.

The systems designers and component suppliers must agree upon the relevant communication protocols in order to ensure proper performance and operation of the new technology.

Images: Fischer

Communication Protocol IEC 11801

International standard ISO/IEC 11801 specifies general-purpose telecommunications cabling systems (structured cabling) that are suitable for a wide range of applications– analog and ISDN telephony, various data communication standards, building control systems, factor y @EPTmagazine

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Attenuated Signal

Vin

1A

Incident Signal Vin

Vout

Vout

Attenuation (ƒ) = 20 • log10

Vin

[dB]

Vreflected

ReturnLoss (ƒ) = -10 • log10

1B

Vin

Reflected Signal Preflected Pin

Vin Interference

Interference

VNEXT

1C

[dB ]

VFEXT

NEXT (ƒ) = -20 • log10

VNEXT Vin

[dB ]

1D

FEXT (ƒ) = -20 • log10

VFEXT Vin

[dB]

Figures 1A, B, C, D.

automation, etc. The standard defines several link/channel classes and cabling categories of twisted-pair copper interconnects, which differ in the maximum frequency for which a certain channel performance is required.

There is a set of parameters available within the IEC 11801 standard that help define balanced cabling performance. The most relevant are listed below.

Insertion Loss (IL)

Insertion Loss, or attenuation, is the reduction in amplitude of a transmitted signal in a wire pair as a function of the frequency.

(Fig. 1A)

Return Loss (RL)

Return Loss is the measurement of the intensity of the reflected signal in a wire pair (measured on the same side of the cable from where the signal is emitted). The signal reflection is due to impedance mismatches (usually caused by manufacturing defaults). (Fig. 1B)

Near End Crosstalk (NEXT)

Near End Crosstalk (NEXT) is

the ratio of the amplitude of the transmitted interference and the amplitude of the signal creating this interference applied on another wire pair, measured on the same side of the cable from where the signal is emitted. (Fig. 1C)

Far End Crosstalk (FEXT)

Far End Crosstalk (FEXT) is the ratio of the amplitude of the interference transmitted and the amplitude of the signal creating this interference applied on another wire pair. The transmitted interference is measured on the other side of the cable from where the signal is emitted. (Fig. 1D)

Components category and balanced cabling performances

According to the ISO/IEC standards, structured cabling components (e.g. cables, connecting hardware, and patch cords) are characterized by a performance ‘category’, and are mated to form a permanent link or channel that is described by a performance ‘class’ in Telecommunications Industry Association (TIA) Standards, components and cabling are both characterized by a

performance ‘category’.

ISO/IEC 11801 defines the following correspondences between component category and balanced cabling performance class: Category 5 components provide Class D balanced cabling performance; Category 6 components provide Class E balanced cabling performance; Category 6A components provide Class EA balanced cabling performance; Category 7 components provide Class F balanced cabling performance; Category 7A components provide Class FA balanced cabling performance. * ISO/IEC 11801 defines what performances have to be achieved within the frequency range for all classes. ISO/IEC 11801 also defines the balanced cabling class that is recommended for the type of application.

Here is a practical example of how these classes can be applied to a system design. You need Category 5 (Cat. 5) components to produce a Class D balanced cabling that can be used for

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Figure 3: A sample testing system for connector speed and protocol qualification.

Ethernet 1000base-T applications (Gigabit Ethernet, IEEE 802.3ab).

A manufacturer should also consider that the USB 2.0 protocol is less severe and only requires a minimum Insertion Loss value in the 0-400MHz frequency range. Other common parameters, such as Return Loss, Near End Crosstalk and Far End Crosstalk, are not specified in the USB 2.0 Specifications. The USB 2.0 standard is capable of transfer rates as high as 480

megabits per second (mbps), or 60 megabytes per second (MBps). The newer USB 3.0 protocol can, by comparison, handle transfer data rates up to 5 gbps (640 MBps). This makes it ten times as fast as the USB 2.0 maximum.

Design rules and simulation

Designing a connectivity solution for a specific data protocol requires optimizing the design of both the connector and the

Characterization and qualification

Once the design has been optimized for a defined protocol, a physical product prototype needs to be tested. This testing is a critical step in designing and developing a quality connectivity solution for a new technology.

Without the testing, a manufacturer could have costly issues during production, or could face failures in the field. (Fig. 2) S-parameters of the cable assembly are measured and compared with the target values defined in the protocol specification (e.g. USB 3.0, HDMI,

Ethernet). If one of the parameters fails, an iteration loop will be made on the design until the cable assembly fulfills all protocol requirements. At this time, the product can be declared ‘protocol compatible’.

When it is critical that a connector solution achieves a certain speed such as USB 3.0 (5 Gbit/ sec), designers should work with their connector suppliers to get specific cable recommendations.

It will save the trial and error that the supplier should have already gone through to find the solutions that will work best for a manufacturer’s application.

Summary

Understanding the impact a connectivity solution has on communication protocols allows you to build a more robust solution.You can avoid the ‘data bottleneck’ by approaching this challenge early in your design cycle. The goal is to build a system that performs flawlessly and transparently through the lifecycle of its application. Take a close look at your connectors and connectivity solution, test prototypes thoroughly with a professional organization, and move forward with confidence.

(Fig. 3A).

Jean-Marie Buchilly is the new product development manager, Fischer Connectors.

Photo:Fischer

Figure 2: Above is an example software simulation analysis for specific connection impact on overall performance.

cable. The first condition for a functional solution is to have a connector that is capable of handling the specified communication protocol.

Each protocol requires specific design rules for the connector.

All of these specific rules are combined for multi-protocol connectors. Software simulation is the perfect tool for this design process, since it allows the designer to check the compatibility of the designed connector/cable assembly with the targeted protocol. The effects of design modifications can immediately be evaluated in time and in the frequency domain, which enables an optimized design with a high confidence level that the connector will perfectly match the desired protocols.

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Prototype to Production Volumes | IC Sockets | Adapters | Board to Board Connectors 16 ELECTRONIC PRODUCTS & TECHNOLOGY / September 2018

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CONNECTORS INTERCONNECT

FEATURE

Challenges of ‘connecting’ within the nuclear power industry

BY PETER DENT & MARIO COLACINO Around the world, nuclear facilities are reaching the end of their lives as they pass half a century of service.

The Canadian nuclear industry is becoming recognized as a driving force behind the global development of decommissioning equipment. The intensive decommissioning and clean-up process takes decades and involves extensive equipment to complete nuclear waste disposal and decontamination of the site.

This is creating a robust market for connectors that can perform in these roles.

components need to withstand decontamination processes that involves a mild acid wash. Coupled with the unique material requirements, most tele-manip​

ulators are mechanical devices that operate on a 1:1 ratio and therefore, the forces exerted at the slave side are limited by the human element input on the

master side.

Highly sophisticated force reflecting master-slave servo manipulators have been developed for heavier operations, but these

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Unique challenges of nuclear industry

Working within the nuclear industry presents many unique challenges, as exposure to hazardous conditions means that many of the processes need to be controlled, monitored and maintained, remotely. These tasks are managed remotely as the governing bodies operating these facilities attempt to minimize operator exposure to harmful radiation.

To manage this requirement safely and efficiently a specialist branch of robotics known as tele-manipulators has evolved over the last few decades. They are similar in technology to traditional robots other than the operator remains an active element in the process loop.

Tele-manipulators act as a natural extension of the human operator, enabling the user to complete a task at a safe distance whilst providing them with a sense of touch and feel.

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® E L E C T R O N I C S

Designing a device for use in a radioactive environment has considerable challenges, since many common materials and components have a short-life expectancy in high radiation. In addition, these devices and/or @EPTmagazine

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C O R P.

EMX Enterprises Ltd Vancouver • Toronto • Montreal Tel: (905) 764-0040 • 1-800-268-6822 • Web: www.emx.ca • e-mail: sales@emx.ca

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THE ORIGINAL PUSH-PULL CONNECTORS

A large selection of Push-Pull connectors from 2 to 114 contacts in IP 50 and IP 68.

High pressure connectors Screw coupling underwater connectors suitable for pressure up to 60 bars.

Harsh environment connectors Ratchet screw system or compact Push-Pull connectors for harsh environment with multiple alignment keys.

REDEL P & SP plastic series Self-latching plastic connectors, sterilizable for medical applications.

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are less common due to the obvious costs involved.

Electrical connectors designed for use in these environments have also evolved unique features as, critically, the main design consideration is a remote coupling requirement.

With operators observing movements through a radiation shielding window or via a CCTV System, connectors need to have a large mating capture area, as well as a self-coupling system that can be de-activated by gripper controls. In addition, low mating forces are an obvious benefit as this negates force restrictions associated with certain types of manipulators. Furthermore, observing operations through a window or via a monitor naturally impairs a depth perception in the Z axis and therefore designs also need to cater for this requirement by providing guiding aids to ensure precise interconnection.

Connector material selection is key

LEMO has supported the nuclear industry for many decades and during this period it has developed the N-Series range of connectors specifically designed for use in remote handling applications.

Given the hazardous environment, the material selection of the connector housing is stainless steel 304, while contact insulators are manufactured from Polyether ether ketone (PEEK) Thermoplastic and seals from Ethylene propylene diene monomer (EDPM) Elastomer, all of

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which exhibit radiation resistant properties.

The second feature is the coupling / decoupling mechanisms.

Products need to be robust and designed so they can be coupled by remotely controlled robots.

Therefore, self-guiding features are a pre-requisite.

The LEMO N series connectors provides an additional depth aid (bump bar) designed-in to help operators align the Z axis. In addition, latching systems are automatic with visual aids to help operators determine whether the connector has been fully engaged. Uncoupling these connectors is like other LEMO push-pull connectors, except the collar has flats for gripper operation. Furthermore, relatively low mating forces and optional CAM-assisted operation are also features you will find on these heavy-duty connectors.

As with the other processes within the industry, operations need to be completed remotely where achievable and therefore purpose built tele-manipulators are also widely used in this stage of the life-cycle.

Products need to be ‘fit for purpose’ as this process can take years and therefore products need to be specifically designed and manufactured with this inmind. Furthermore, the issue of low maintenance is another consideration for design engineers within these complex environments.

Peter Dent, LEMO UK, Mario Colacino, LEMO Canada.

Photo: Lemo

Multipole low voltage connectors

The material selection of the connector housing in a nuclear facility must exhibit radiation resistant properties.

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CONNECTORS INTERCONNECT

NEW PRODUCTS machine sector. With straight male and female, right angle and open ended cordsets offered, device’s durable and reliable connectivity helps maximize output in several applications. Devices come in PVC or PUR cable jacket, as well as 2m, 3m, 5m, 10m lengths. www.xtronics.ca

PLUG & PLAY CONNECTOR PERMITS 360-DEGREE MATING

FISCHER CONNECTORS Freedom Series LP360 plug & use connectivity technology requires no key code, allowing for 360-degree mating ‘freedom’. Low-profile, rugged and versatile devices provide ball-locking mechanism with sealing and variable pre-defined force (patent pending). Specially designed pins on the plug are IP68 sealed with a membrane (patent pending).

Resistant to shock, vibration, torque and extreme temperatures, devices are made of stainless steel & brass design for longevity www.fischerconnectors.com

FILTERED POWER ENTRY MODULE EXTENDS MOUNTING OPTIONS SCHURTER

DD12 power entry module series comes with screw and snap mounting options. An integrated ground line choke for suppressing high-frequency interference on the ground conductor is also an option.

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RJ45 BLOCKOUT DEVICES SECURE INDUSTRIAL NETWORK

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Visit ept.ca for the latest new products, news and industry events.

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THE RELIABLE EXPERT

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When you’re dangling 150 miles above the stratosphere, systems failure is not an option.

At Positronic, we build high reliability power and signal connectors. But our true call is to provide certainty. Rock solid, mission-critical performance upon which you can bank life and limb, family and fortune. We consider it an honor. We consider it an inviolable trust.

POSITRONIC. THE SCIENCE OF CERTAINTY. // www.connectpositronic.com/ept_sept2018

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WIRELESS DESIGNS

FEATURE

Merging antenna and electronics boosts energy and spectrum efficiency

Photo: Credit CAllison Carter, Georgia Tech

Research could lead to longer talk time and higher data rates in 5G devices. BY JOHN TOON By integrating the design of antenna and electronics, researchers have boosted the energy and spectrum efficiency for a new class of millimeter wave transmitters, improving modulation and reduced generation of waste heat. The result could be longer talk time and higher data rates in millimeter wave wireless communication devices for future 5G applications.

The new co-design technique allows simultaneous optimization of the millimeter wave antennas and electronics. The hybrid devices use conventional materials and integrated circuit (IC) technology, meaning no changes would be required to manufacture and package them.

The co-design scheme allows fabrication of multiple transmitters and receivers on the same IC chip or the same package, potentially enabling multiple-input-multiple-output (MIMO) systems as well as boosting data rates and link diversity.

One of the packaged millimeter wave transmitters with antennaelectronics. The ultraminiaturized IC chip contains on-chip antenna and all the required electronics for millimeter wave signal generation and transmitting. Multiple IC chips can be tiled together to form a large array of 5G MIMO applications.

Researchers from the Georgia Institute of Technology presented their proof-of-concept antenna-based outphasing transmitter earlier this summer. Their other antenna-electronics co-design work was published in multiple peer-reviewed IEEE journals.

“Our electronics and antenna were designed so that they can work together to achieve a unique on-antenna outphasing active load modulation capability that significantly enhances the

efficiency of the entire transmitter,” said Hua Wang, assistant professor in Georgia Tech’s School of Electrical and Computer Engineering. “This system could replace many types of transmitters in wireless mobile devices, base stations and infrastructure links in data centers.”

High energy efficiency

Key to the new design is maintaining a high energy efficiency regardless of whether the device is

operating at its peak or average output power. The efficiency of most conventional transmitters is high only at the peak power, but drops substantially at low power levels, resulting in low efficiency when amplifying complex spectrally efficient modulations.

Moreover, conventional transmitters often add the outputs from multiple electronics using lossy power combiner circuits, exacerbating the efficiency degradation.

“We are combining the output power though a dual-feed loop antenna, and by doing so, we can substantially improve the energy efficiency,” said Wang, who is the

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co-design also facilitates spectrum efficiency by allowing more complex modulation protocols. That enables transmission of a higher data rate within the fixed spectrum allocation that poses a significant challenge for 5G systems.

“Within the same channel bandwidth, the proposed transmitter can send 6 to 10 times higher data rate,” Wang adds. “Integrating the antenna gives us more degrees of freedom to explore design options, something not be done before.”

Bring disciplines together

Sensen Li, a Georgia Tech graduate research assistant, says the innovation resulted from bringing together two disciplines that have traditionally worked separately.

“We are merging the technologies of electronics and antennas, bringing these two disciplines together to break through limits,” he said. “These improvements could not be achieved by working on them independently.”

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Georgia Institute research team includes Taiyun Chi, Huy Thong Nguyen and Tzu-Yuan Huang.

The new designs have been implemented in 45-nanometer CMOS SOI IC devices and flipchip packaged on high-frequency laminate boards, where testing has confirmed a minimum twofold increase in energy efficiency.

The antenna electronics co-design is enabled by exploring the unique nature of multifeed antennas.

“An antenna structure with multiple feeds allows us to use multiple electronics to drive the antenna concurrently. Different from conventional single-feed antennas, multi-feed antennas can also function as signal processing units that interface among multiple electronic circuits,” said Wang. “This opens a completely new design paradigm to have different electronic circuits driving the antenna collectively with different, but optimized signal conditions, achieving unprecedented energy efficiency, spectral efficiency and reconfigurability.”

Cross-disciplinary design

The cross-disciplinary co-design could also facilitate fabrication and operation of multiple transmitters and receivers on the same chip, allowing hundreds or even thousands of elements to work together as a whole system.

Having large numbers of elements working together becomes more practical at millimeter wave frequencies because the wavelength reduction means elements can be placed closer together to achieve compact systems, he pointed out. These factors could pave the way for new types of beamforming that are essential in future millimeter wave 5G systems.

John Toon, Georgia Institute of Technology.

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Photo credit: CAllison Carter, Georgia Tech

Demetrius T. Paris Professor in the School of Electrical and Computer Engineering. “The innovation in this particular design is to merge the antenna and electronics to achieve the so-called outphasing operation that dynamically modulates and optimizes the output voltages and currents of power transistors, so that the millimeter wave transmitter maintains a high energy efficiency both at the peak and average power.”

Beyond energy efficiency, the

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WIRELESS DESIGNS

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ANRITSU Three software packages serve firm’s MS269x series signal analyzer that support measurements of RF Tx characteristics of 5G New Radio (NR) base stations and mobile devices. Installing the 5G Measurement Software (MX269051A) and NR TDD sub-6 GHz options (MX269051A-011 and MX269051A-061) in the signal analyzers creates a cost-efficient and flexible solution for chipset and device makers, and mobile operators to verify sub-6 GHz equipment being developed for the rollout of 5G. www.anritsu.com

BLUETOOTH AUDIO SOC HELPS CREATE HIGHREZ AUDIO DEVICES

MICROCHIP TECHNOLOGY IS2064GM-0L3 fully-certified, Bluetooth 5-compliant System-onChip (SoC) with Sony’s LDAC audio codec technology allows OEMs to develop next-gen audio devices with an advanced codec, extending high-resolution audio beyond audiophiles and into mass market Bluetooth wireless products. Device comes in an 8 x 8 mm LGA package and transmits up to 990 kbps data throughput, which is three times higher than the standard Bluetooth

applicability to Intel LTE, millimeter-wave wireless, Wi-Fi, Bluetooth, and GNSS solutions. Collaboration with SiTime on MEMS-based silicon timing solutions will increase performance and capacity in Intel’s 5G multi-mode radio modem platforms MEMS timing solutions are tiny in size and deliver high immunity to vibration and ability to withstand fast temperature ramps. maximize battery life. www.sitime.com

Sub-band Codec (SBC), and maintains frequency and bit depth of up to 96 kHz/24-bit. The high compression and reproduction efficiency enables high-resolution audio listening experiences for Bluetooth audio devices. www.sony.net/Products/LDAC/ index.html

LOW NOISE AMPLIFIER, PHASE SHIFTER MMICS SERVE RF DESIGNS

CUSTOM MMIC CMD270P3 C Band, 4-8 GHz low noise amplifier is housed in a leadless 3x3 mm plastic surface mount package. Device delivers greater than 16dB of gain with a corresponding output 1dB compression point of +18dBm and a noise figure of 1.7dB. Product is a 50 ohm matched design eliminating the need for

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MEMS SOLUTION SOLVES CRITICAL TIMING CHALLENGES FOR 5G SI TIME SiTime Corp. and Intel collaborate on integrating timing solutions for Intel’s 5G multi-mode radio modems, with additional

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FEATURE

The future of AI and the embedded system Embedded systems help AI programs to interact with the physical world around them, serving as an important part of preparing for or developing new innovations. BY GIL BEN-DOV Artificial intelligence, or AI, is one of the most controversial and thought-provoking topics in the world of technology today. Given the potential AI offers and the problems it can solve, the attention is certainly warranted. However, one of the topics that is often overlooked is the role embedded systems will play as the businesses continue to adopt and implement AI. While AI programs help businesses make better decisions and automate processes, embedded systems help AI programs to interact with the physical world around them. This makes understanding how these two powerful platforms interact with one another an important part of preparing for, or even developing, the innovations to come.

In this piece, we will explore AI, the role embedded systems play, some real-world use cases, and discuss some helpful tools for developing embedded systems for AI applications.

What is AI?

For a computer program to be considered an AI program, it should be able to analyze data inputs and make rational, intelligent decisions based on those inputs. As it gathers more data points, an AI program should be able to learn and make better decisions.

Oftentimes the media gets caught up in the sensationalized stories of AI leading to machines rising to world domination.

This can lead to us missing out on the practical use cases for AI that exist today, such as Nest’s learning thermostat that can program itself and “learn” how to save consumers money on their energy bills. Innovations like these give us a great way to conceptualize exactly what AI can do: enable computer programs to learn and iterate based on data inputs.

Use cases for AI

Now that we have established what artificial intelligence is and the role embedded systems play, we will dive into some real-world use cases for AI.

Analytics

What role do embedded systems play?

Embedded systems are often overlooked when discussing artificial intelligence. AI is a more flashy and headline-grabbing topic, but in a large number of scenarios, embedded systems are required to make AI useful.

When you consider the role of data inputs in enabling AI and the benefits of AI being able to interact with the physical world, the importance of embedded systems becomes clear.

While AI can take data and ‘learn’ from it to make better decisions, the Internet of Things (IoT) and embedded systems are the physical devices that generate the data required to achieve useful functionality.

The more data an AI system has, the better the outcomes it can produce. Since embedded systems are near ubiquitous in modern society, they are an ideal source of data inputs.

To provide just a few examples: Almost every adult has a smartphone and other mobile devices.

Automobiles have built-in GPS systems and cameras.

Smart homes have a variety of intelligent consumer electronics.

Emergence of smart cities creates more connected urban areas.

Health conscious individuals are using smart heart rate monitors and fitness trackers to better understand

• • • • •

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their health.

All these devices are capable of capturing and reporting data that can then be fed to an AI system for analysis. Similarly, to enable automation of processes that involve physical devices (e.g. controlling the lights in a smart home, starting or stopping a production line in a factory, etc) artificial intelligence programs need to be able to control embedded systems.

AI

Embedded Systems are often overlooked when discussing artificial intelligence

Analytics is one of the ideal use cases for artificial intelligence. Over the past decade, firms have embraced Big Data and amassed a wealth of info that can be processed by AI programs.

We are all familiar with the stories of Netflix, Amazon, and Google using AI to provide custom recommendations based on what they have been able to learn about consumers using AI and machine learning. However, not everyone is aware that similar benefits are available in fields like digital factories, energy management, and other industrial applications.

For example, consider MindSphere an AI solution from Siemens designed to improve analytics for industrial (and other) applications. MindSphere enables users to interface with a wide variety of devices to help improve the value chain of businesses in a wide variety of markets. A large part of what makes MindSphere so powerful is its ability to capture data from smart meters, programmable logic controllers (PLCs), and other devices common in industrial applications.

Smart cars

Smart cars are vehicles that provide some level of autonomous driving made possible by artificial intelligence. We are now seeing more and more automobile manufacturers beginning to offer more advanced autonomous driving features like the ability to control speed and steering for extended periods. These are referred to as level 2 autonomous vehicles. While a fully autonomous level 5 vehicle is not yet available, manufacturers like Cadillac, BMW, Telsa, Volvo, Audi, Toyota, and Honda all have level 2 products on the market. Additionally, Waymo, which started as a Google project, is working towards

Photo: Fotolia

EMBEDDED SYSTEMS

EPT.CA

2018-08-22 11:02 AM

making a “level 3” autonomous vehicle a reality for consumers in the near future.

Smart Manufacturing & Industry 4.0

Industry 4.0 is a hot topic in tech and is likely to make major waves across the globe over the next decade. This is demonstrated by news items like the mayor of Cincinnati, Ohio announcing the city will be an “Industry 4.0 Demonstration City” and TrendForce projecting that by 2020 investment in smart manufacturing will exceed $320 billion USD. AI platforms like Siemens

EMBEDDED SYSTEMS

Tools for designing and debugging intelligent embedded systems

With the opportunities created by merging AI and embedded systems providing businesses with an excellent way to improve their value chain, it is important for developers to understand what tools are required to design

and debug embedded systems.

Host bus adapters (e.g. the Cheetah SPI Host Adapter) allow developers to develop embedded applications quickly and efficiently. Similarly, protocol analyzers (e.g. the Beagle USB 12 Protocol Analyzer) are vital to the development and debugging of embedded applications as they allow for report generation and data analysis.

Conclusion

As we move towards Industry 4.0, artificial intelligence and embedded systems will play a large part in shaping the

MEN MIKRO ELEKTRONIK BC51M box PC is modular, fanless and maintenance-free for use in graphics and memory intensive applications.

Scalable and powerful for communication and memory intensive applications, unit is based on the Intel Atom E3900 series - optionally with two or four cores, up to 1.6GHz. Unit provides 8 GB DDR3 SDRAM memory, a rear accessible SD card, an integrated eMMC memory and an optional SATA HDD/SSD. Unit supports up to two DisplayPort interfaces with a maximum resolution of 4K, as well as two Gigabit Ethernet interfaces. www.men.de

IOT/EMBEDDED COMPUTING TECHNOLOGY COMES IN MISSION-READY PLATFORM

KONTRON COBALT 901|400 Series mission-ready computing platform

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with MIL-STD-1553 provides complex serial data bus sub-system support. Product’s 1553 data bus is deployed in applications beyond avionics flight control to new intelligence, surveillance and reconnaissance (ISR) designs. Product includes an L2 Ethernet switch and integrated MIL-STD-1553A/B interface with two dual-redundant channels. Platform delivers higher CPU and graphics performance necessary to support data-intensive electro-optical and infrared (EO/IR), advanced voice, video, data link processing. It also features 16 or 32 gigabytes (GBs) of ECC RAM, and has a removable solid state drive bay option that supports two RSSDs. www.kontron.com Visit ept.ca for the latest new products, news and industry events.

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landscape of technology over the next decade. These two platforms complement one another well and come together to create holistic solutions that solve real-world problems.

Businesses that understand how to work with AI and develop intelligent embedded systems will be well positioned to take advantage of the many opportunities these technologies will create.

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@EPTmagazine

MindSphere and General Electric’s Predix will provide the intelligence that drives the shift in manufacturing while a myriad of embedded devices and robotics will help these solutions interact with the physical world.

September 2018 / EP&T 25 2018-08-14 11:53 AM

2018-08-22 11:02 AM

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ELECTRONIC DESIGN SOURCE

NEW PRODUCTS productivity through integration with information utilization, quality management and safety. omron247.com

1200 TO 1500W MODULAR POWER SUPPLIES HAVE FULL MOPPS ISOLATION

TDK-LAMBDA AMERICAS QM8 modular power supplies, rated at 1200 to 1500W, are available with up to 18 outputs, have full MoPPs (Means of Patient Protection) isolation and low acoustic noise.

With medical and industrial safety certifications, products accept a wide range 90 to 264Vac, 47-440Hz input and can deliver 1200W at low line and 1500W with a high line 150-264Vac input. Products can be configured using a simple on-line configurator to provide 1 to 18 independently regulated outputs. www.us.tdk-lambda.com/lp/ products/qm-series.htm

ADHESIVES CUSTOM FORMULATED IN DIFFERENT COLORS

MASTER BOND Custom colored adhesive system uses an epoxy adhesive formulation to match a special Pantone color according to customer requirements. System provides no change in performance properties and reproducible batch to batch consistency. Easy, efficient application, system delivers improved aesthetics and end-product differentiation. www.masterbond.com

CONTROLLER FOR IIOT DESIGNS WITH OPC UA AND SQL CONNECTIVITY OMRON AUTOMATION NX1 series machine automation controller is compact and enables smart factories at all levels by providing the link between compact machines and the Industrial Internet of Things. Compact unit improves @EPTmagazine

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INTERPOWER Firm adds Japanese power cords and cord sets - all made in USA VCTF or HVCTF Japanese approved cable. Cords made on 3 x 1.25mm2 VCTF cable, part # 86277150 (black power cord) & 86277160 (black cord set with an IEC 60320 C13 connector). Cords made on 3 x 1.25mm2 HVCTF cable, part # 86277170 (black power cord) and 86277180 (black cord set with an IEC 60320 C13 connector). Cords made on 3 x 2.00mm2 HVCTF cable: 86277190 and 86277200. rbright@interpower.com

SMART ELECTRONIC PROTECTION SYSTEM TARGETS INDUSTRY 4.0

E-T-A CIRCUIT BREAKERS REX12D-T REX electronic circuit protector has modular architecture to allows customization. In combination with the EM12D-TMB supply module that communicates via Modbus-RTU protocol, device is suitable for those looking to incorporate condition monitoring and predictive maintenance into their systems to increase machine transparency and system consistency. Device is available in a single or double channel version. The single-channel version is available in 8A and 10A fixed current ratings. The double-channel version saves space in the control panel by offering double load protection in a 12.5mm wide device. www.e-t-a.com/

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September 2018 / EP&T 27 2018-08-10 2:06 PM

2018-08-22 11:02 AM

ELECTRONIC DESIGN SOURCE

NEW PRODUCTS

DC PANEL METERS ARE MULTIFUNCTION MURATA

DCM20 series of multifunction panel meters measure dc voltage and current for dc systems, calculate power up to 96kW and display values either manually selected or continuously cycling. The miniature panel-mount product provides an input voltage range of 0.5 to 72Vdc, with 10mV of resolution. Device also supports current measurement ranges from 5A to 1200A when used with an external user-supplied resistive shunt. Targeted for use in 12V, 24V or 48V systems, out-of-thebox accuracy of the product is +/-1 % for voltage and +/-2 % for current.

Packaged in a rugged, one-piece polycarbonate housing, with dimensions of 2.1”(h) x 1.43”(w) or 53.3 x 36.3mm, product fits in ‘0U’ and ‘1U’ racks suitable for laboratory instrumentation, as well as industrial and telecom equipment. www.murata-ps.com/en/news/ new-products/4360.

STARTER KITS HELP CREATE INDUSTRIAL IOT SOLUTIONS

HARTING Industrial IoT (IIoT) starter kits contains all of the necessary hardware and software for a basic

application, removing the risk and guesswork for firms looking to embrace IIoT. Kits provide everything you need to prototype an IIoT solution.

MICA CISS Complete IIoT Starter Kit, for a basic condition-monitoring application, comes with a sensor that can measure seven different parameters, including vibrations, acoustics, temperature, humidity and more.

MICA RF-R300 Complete RFID Starter Kit contains everything needed for a basic RFID asset tracking application – industrial RFID tags, the MICA RF-R300 reader, two antennas and all cabling.

MICA Basic Ethernet Starter Kit connects peripheral devices through Ethernet using communications protocols such as Modbus-TCP or OPC UA. Kit contains all of the cabling required to get started. www.HARTING.com

COMPLETE SET OF HAND-PIECES COMPLIMENT REWORK SYSTEM

EMX ENTERPRISES Metcal introduced seven new hand-pieces to complement its Connection Validation (CV) soldering system, suitable for a wide variety of

applications.

System evaluates the quality of the solder joint and provides closedloop feedback to the operator, delivering repeatability and a measurable standard. The new hand-pieces include: Ultrafine Hand-piece for use on delicate components; Ultrafine Tweezer Hand-piece for more versatility on micro-components; Precision Tweezer Hand-piece turns CV into a rework system; Desolder Hand-piece for use on through-hole components; High Thermal Demand Hand-piece; and Solder Wire Feeder Hand-pieces. www.emx.ca

5-PORT ETHERNET SWITCH IS 8CM HIGH

ADVANTECH EKI-2525LI Ethernet switch is 8cm high and aimed at applications where space is a critical. The unmanaged 5-port Ethernet switch in an ultra-small enclosure which fits in the palm of a hand. Device can be easily fitted into a rack-mount cabinet to maximize space utilization and provide a simple and immediate upgrade for industrial IoT applications.

Product can also be fitted into any already-wired electronic cabinets, racks or shelves where extra connectivity and communication services are require but space is limited, providing businesses with key infrastructure upgrades. www.advantech.com

12MM MATED CONNECTORS COMPLY WITH ANSI/VITA 42.0 XMC STANDARD

SAMTEC 12mm stack heights of connector sets comply with recent ANSI/VITA 42.0 XMC standard, which defines an open standard for supporting high-speed, switched interconnect protocols on an existing, widely deployed form factor. Product revision further defined the concept for the preferred Standard connectors in XMC applications including: Solder ball attachment replaced Paste-On-Pad (POP) for improved solder joints; Low Insertion Force (LIF) sockets to ease mating and un-mating; Tin-lead alloy available as a solder option; Revised ASP catalog numbers; 12 mm stack height. www.samtec.com Visit ept.ca for the latest new products, news and industry events.

ACCREDITED IECEx TEST LAB IN EDMONTON ALBERTA

London, UK – Edmonton-based Intertek test lab, a leading Total Quality Assurance provider has gained IECEx Test Laboratory approval for equipment used in explosive atmospheres. This new accreditation enables Intertek, Edmonton to locally test electrical products that are destined for potentially explosive (Ex) environments to applicable International Electrotechnical Commission (IEC) standards.

Intertek provides global solutions to the hazardous locations FOR MORE INFORMATION

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28 ELECTRONIC PRODUCTS & TECHNOLOGY / September 2018 EPT_Sept_Intertek.indd 1

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industry with a proven track record of success supporting clients.

From the widely recognized ETL mark and OSHA NRTL approval for North America, to ATEX notified body status for Europe and IECEx certification for global markets, Intertek’s network of professionals have the experience and know-how to help with the certification process and provide training and technical service solutions in over 100 countries. intertek.com

EPT.CA 2018-07-16 2:36 PM

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PRODUCT SOURCE GUIDE

EPOXY for DAM

Ultra-Rugged DC Link Film Capacitors New EPCOS film capacitors by TDK are ideal for use in extremely harsh environmental conditions. The resilience of the B3277*H series has been verified in a temperature, humidity, bias (THB) test at 60 °C, 95 percent relative humidity, and the rated Metal pushbutton switch with voltage for 1000 hours.

This series is available with rated voltages up to 1100 V DC and are AEC-Q200D compliant.

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& FILL ENCAPSULATION

65 - 130 AMPS on a P.C. BOARD W Go e t It !

SUPREME 3HTND-2DM

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TouchKit is designed for development engineers to experience the advantages of projected-capacitive technology. Touchscreen is 10.1” and features multi-touch capability, two sensitivity modes, and simultaneous detection of up to ten fingers.

Included stylus offers high accuracy and pressure sensing.

Touchscreen is Electromagnetic Compatible, immuned to conducted interferences up to10Vrms and radiated interferences up to 10V/m.

2018-05-23 9:37 AM

Find the Answers to Life, the Universe, and Everything PCB Get the Ebook now: www.go.ema-eda.com/DownloadTheGuide

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Advanced Interconnections . . . . . . . . . . 16 Allied Electronics and Automation . . . . OBC BEA Lasers . . . . . . . . . . . . . . . . . . . . . . . 29 Blockmaster Blocks . . . . . . . . . . . . . . . . 29 Coilcraft . . . . . . . . . . . . . . . . . . . . . . . 21, 23 DFI, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . 25 Digi-Key Corporation . . . . . . . . . . . . . . . 1,2 Electro Sonic Group Inc. . . . . . . . . . . . . . . 5 EMA Design Automation Inc. . . . . . . . . . 29 EMX Enterprises Ltd. . . . . . . . . . . . . . . . .17 EPCOS Inc., a TDK Group Company . . . . . 29 Fisher Connectors Inc. . . . . . . . . . . . . . . 19 @EPTmagazine

Shield your Raspberry Pi B2 and B3 models from mechanical and physical influences with reliable IP40 housings.

Universal electronics housings for Raspberry Pi computers (UCS-RPI) complete Phoenix Contact’s UCS product family and are suitable for desktop, wall, and DIN rail mounting.

The CoaxStrip 6380 is the first machine of a new generation of coaxial cable stripping machines. With newly implemented processing functions and innovative stripping head, the machine’s flexibility, precision, and reliability are guaranteed to increase your production rates and quality.

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Hammond Mfg. Co. . . . . . . . . . . . . . . . . . 6 HARTING Canada Inc . . . . . . . . . . . . . . . . 3 Intertek Testing Services NA Ltd. . . . . . . 28 LEMO Canada Inc. . . . . . . . . . . . . . . . . . 18 Master Bond Inc. . . . . . . . . . . . . . . . . . . 29 Mouser Electronics . . . . . . . . . . . . . . . . .IBC Murata Americas . . . . . . . . . . . . . . . . . . 22 Newark element 14 Electronics. . . . . . . . . 9 Phoenix Contact Ltd. . . . . . . . . . . . . . . . 29 Positronic Industries, Inc. . . . . . . . . . . . . 20 Protocase . . . . . . . . . . . . . . . . . . . . . . . 27 Schleuniger . . . . . . . . . . . . . . . . . . . . 8, 29

12:46 PM

2018-08-13 11:59 AM

Schurter Inc. . . . . . . . . . . . . . . . . . . .12, 29 Staubli Electrical Connectors, Inc. . . . . . 14 TDK-Lambda Americas Inc. . . . . . . . . . . .26 Transducers USA . . . . . . . . . . . . . . . . . . 29 Wago Corp. . . . . . . . . . . . . . . . . . . . . . . .13 TO ADVERTISE in an upcoming issue of EP&T, contact Scott Atkinson, Associate Publisher, satkinson@ept.ca or (416) 510-5207) or Joanna Malivoire, Account Manager, jmalivoire@ept.ca or direct 866-868-7089.

September 2018 / EP&T 29

2018-08-22 11:02 AM

TEARDOWN

BEAM Smart Button packs it all in

BY JIM MIELKE, VP TEARDOWNS, ABI RESEARCH Since 2011, ABI Research’s Teardowns has been uncovering innovative design features and new semiconductor components to guide enterprises toward more streamlined solutions in future designs.

A new and unique wearable device hit the market this year- a wireless, wearable button. The BEAM Authentic Smart button is a battery powered 400x400 1.4” round AMOLED color display that is worn on clothing, handbags, or backpacks to convey a message. The content for the button is created on a smartphone and then sent to the button via Bluetooth (BT). In addition to conveying the wearers’ current beliefs, for example, the button has a nice safety feature: a panic button on the side of the display is used to send an SOS message including GPS coordinates to a predefined number. The panic button does not send the message directly but rather it triggers the user’s smartphone to send out the message, so the smartphone does need to be nearby.

The BEAM Authentic Smart Button is surprisingly packed with components. Here’s a look into what makes the US$99 Smart button smart:

Connectivity

The connectivity inside the BEAM Smart button is provided by a single BT SOC (system on a chip) provided by Nordic Semiconductor. The chip provides BT Le connectivity with an embedded ARM Cortex M4 processor.

Sensors

There are two sensors in the BEAM Smart button. A light sensor is used for adjusting the brightness of the display and an accelerometer from STMicroelectronics (LIS2DH) to monitor the orientation of the button.

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Audio and power management

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The power management within the BEAM Smart button is comprised of four chips. A battery charger from microchip (MCP73831), a fuel gauge from STMicroelectronics STC3115), and a couple of regulators (TI TPS65631, and TI TPS6220x).

These chips are minimal but get the job done.

Application processor

STMicroelectronics supplies the application processor (STM32F469) which embeds another ARM Cortex M4 core.

30 ELECTRONIC PRODUCTS & TECHNOLOGY / September 2018

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Beam Authentic Smart Button

These findings are from ABI Research’s Teardowns (https://teardowniq.com/).

EPT.CA

2018-08-22 11:02 AM

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Join the Band

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ORDER CONFIDENCE WITH

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