EP&Dee no 6

JULY, 2015 足 ISSUE NO. 6, VOL. 13

DESIGN & MANUFACTURING

EP&Dee ELECTRONICS

PRODUCTS

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JULY 2015 Table of Contents

DESIGN FEATURES 4 Atmel WIFI & BLE Modules These are already certified modules with the focus on low power IoT applications. This makes it possible for almost any design to be integrated quite easily into the IoT network, and to do it the developer does not need any know-how with regard to Wifi, RF, or the Internet.

10 Performance, security and power core to the new era of Internet of Things devices In the accelerating consumer and industrial Internet of Things marketplace, the need for enhanced performance, security and power management has never been more prevalent. With an increasing number of power hungry, graphically intense devices entering the market daily, it’s clear the process for system developers is becoming more and more complex – and this is just the beginning.

12 How wireless modules bring the Internet of Things to life Dramatic growth in the Internet of Things (IoT) has been widely reported in recent times. While many media reports have focused on rather trivial consumer applications – the toothbrush connected to your smartphone being one example – those discussed here relate to the “Internet of Things that Really Matter”.

16 Finding the range How to use an ultrasonic device for range detection.

20 Employing SoCs for analytics 21 Mouser Sponsors Student Solar Car Team in Upcoming Challenge 22 Motors & MCUs - The hidden heroes of the modern home 24 Migrating to Advanced Displays No doubt Steve Jobs did a great job at Apple, some might say he even changed the world! Today a simple 7-segment display is not enough for even the simplest of applications. Marketing teams are increasingly asking the engineering department for bigger displays with more impressive graphics on their next generation of products.

28 Functional Safety for Electronically Controlled Devices Electronic control mechanisms are increasingly taking control – be it in cars, production, households, or even in the human body.

34 Leuze packaging sensors Foil, cardboard, glass - coloured, glossy or transparent? Of course we can detect them!

42 MTCS-C3 Colorimeter: Test system for LED quality control, color measurement and more The new MTCS-C3 product family enables users to implement their own True Color Colorimeter into lighting, backlight, LED tests, color selection or other applications. The MTCS-C3 is ideal to measure color coordinates (XYZ), CCT or brightness levels.

44 The Sirius Act Discover what you can do with Siemens SIRIUS ACT, the newest generation of pushbuttons and signalling devices. This device offers you unique features for your machines, like: elegantly designed, indicator lights for Push Buttons and switches with a perfect embodiment of intelligence, style and physical toughness.

PRODUCT NEWS 7 Embedded Systems (p 4, 5, 6, 7, 8, 9, 21) Sensors (32, 33, 34, 36, 37) Active Components (p 38 - 41) Lighting Solutions/Display (p 42, 43)

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40 Group Publishing Director Gabriel Neagu Managing Director Ionela Ganea Accounting Ioana Paraschiv Advertisement Irina Ganea WEB Eugen Vărzaru © 2015 by Eurostandard Press 2000

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Contributing editors Radu Andrei Ross Bannatyne Consulting Marian Blejan Bogdan Grămescu Mihai Savu Asian Reprezentative Taiwan Charles Yang Tel: +886­4­3223633 charles@medianet.com.tw

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EP&Dee (Electronics Products & Design ­ Eastern Europe) is published 10 times per year in 2015 by Euro Standard Press 2000 s.r.l.

It is a free to qualified electronics engineers and managers involved in engineering decisions. Starting on 2010, this magazine is published only in digital format.

Copyright 2014 by Euro Standard Press 2000 s.r.l. All rights reserved.

INDUSTRY NEWS Altera FPGA-Based Storage Reference Design Doubles Life of NAND Flash Altera Corporation has developed a storage reference design, based on its Arria® 10 SoCs, that doubles the life of NAND flash and can increase the number of program-erase cycles by up to 7X compared to current NAND flash implementations. The reference design includes an Arria 10 SoC with an integrated dual-core ARM® Cortex®A9 processor, in an optimized, cost-effective, single-chip solution,

leveraging a solid-state disk (SSD) controller from Mobiveil and NAND optimization software from NVMdurance. This reference design provides improved performance and flexibility in NAND utilization while reducing the cost of the NAND array by increasing the lifetime of data center equipment.

Using FPGAs with integrated hard processor systems, designers can quickly take advantage of the cost savings offered by next-generation NAND devices while retaining the flexibility to customize a solution that maximizes the performance, durability and storage capacity of their system. This storage solution implements Mobiveil’s Universal NVM Express Controller (UNEX), a configurable controller for PCIe-based SSDs, and NVMdurance’s NAND flash optimization software in an Arria 10 SoC, enabling data centers to leverage the most advanced 3D NAND technology without the long design cycles required with ASIC designs. In this reference design, Mobiveil’s controller supports multi-core architectures, enabling threads to run on each core with their own queue and interrupt without any locks required.

NVMdurance’s NAND flash optimization software constantly monitors the condition of the NAND flash and automatically adjusts the control parameters in real time, greatly extending the flash system’s endurance.

ALTERA 4

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EMBEDDED SYSTEMS

Atmel WIFI & BLE Modules Now new from ATMEL - Wifi and BLE modules as well. These are already certified modules with the focus on low power IoT applications. This makes it possible for almost any design to be integrated quite easily into the IoT network, and to do it the developer does not need any know-how with regard to Wifi, RF, or the Internet. The module works entirely independently and is easily addressed via a serial interface. Target applications are in the wide field of battery-powered devices, industrial applications, and medical situations.

The modules from ATMEL have been optimized for battery applications, operating with an input voltage of 1.8V to 3.6V, and requiring only 4μA in stand-by mode. This means that IoT nodes provided with ATMEL modules and powered by batteries can send data to an SSI server for a very long time.

If you already have a high-performing controller in your application with an Internetcapable operating system, then you also have the possibility of using what is known as a link controller. This form is available from ATMEL as well. A link module consists essentially of the entire RF functional performance capacity in the form of one module. In this situation, however, the individual network protocol and the application need to be processed in the main processor of the application in hand.

The Wifi link module has been given the designation ATWILC1000. This involves an IEEE 802.11 b/g/n IOT link controller, which is addressed via an SDIO interface. The ATWILC3000 is a com-

bined Wifi IEEE 802.11 b/g/n and Bluetooth 4.0 IOT link module, addressed via the UART or SDIO interface. Most customers, however, are interested in a more complete solution with which the entire protocol processing is carried out in the module. In this situation, on the one hand ATMEL can offer the ATWINC1500 module, an IEEE 802.11 b/g/n IOT network controller which is addressed via UART or SPI. On the other, there is also the ATWINC3400 module, which offers IEEE 802.11 b/g/n and BT 4.0 IOT. As the interface, use can also be made here of UART, SPI, I2C or SDIO. All the modules and starter kits are available from CODICO for easy evaluation.

Contact us if you have any further questions, or just ask for additional documentation.

Johannes Kornfehl johannes.kornfehl@codico.com +43 1 86305 149

CODICO www.codico.com

INDUSTRY NEWS

EMBEDDED SYSTEMS

Microchip announces projected-capacitive touch screen controller with noise-robust, advanced multi-touch and gesture performance

Win a Microchip dsPICDEM™ MCSM Development Board!

Win a Microchip dsPICDEM™ MCSM Development Board (DV330021) from EP&Dee. The development board is targeted to control both unipolar and bipolar stepper motors in open-loop or closed-loop (current control) mode. The hardware is designed in such a way that no hardware changes are necessary for 8-, 6- or 4wire stepper motors in either bipolar or unipolar configurations. Software to run motors in open-loop or closed-loop with full or variable micro-stepping is provided.

Microchip announces a new addition to its Human Interface Solutions portfolio with the MTCH6303, an innovative, turnkey projected-capacitive touch controller for touch pads and screens. Touch sensors with up to 1000 nodes and diagonals of up to 10” are supported. The MTCH6303 provides multi-touch coordinates as well as a ready-made multi-finger surface gesture suite that brings modern user interface (UI) elements, such as pinch and zoom, multi-finger scrolling, and swipes, to any embedded design, with minimal host requirements.

The MTCH6303’s advanced signal processing provides noise-avoidance techniques and predictive tracking for 10 fingers, at scan rates of up to 250 Hz with a minimum of 100 Hz each for five touches. It also combines with Microchip’s MTCH652 high-voltage line driver to achieve a superior signal-to-noise ratio (SNR) for outstanding touch performance in noisy environments.

When combined with the MGC3130, the MTCH6303 solution is capable of supporting 3D air gestures up to 20 cm distance from the touch panel.

Microchip’s MGC3130 E-field-based 3D tracking and gesture controller includes Microchip’s patented GestIC® technology, allowing user input via natural hand and finger movements in free space. This unique combination empowers designers to create interface-control possibilities in two and three dimensions that differentiate their products from the competition.

The advanced capabilities of the MTCH6303 create robust, ready-to-go touch and gesture solutions for the rapid growth of human-interface applications and requirements in: industrial equipment such as machine control panels, HVAC controls, metering and test equipment; in homeautomation products including security control panels, thermostat and lighting controls; and in office equipment such as printers, copiers and fax machines; among other applications.

The MTCH6303 is supported by Microchip’s new Multi-Touch Projected Capacitive Touch Screen Development Kit (DV102013) which is priced at $149.00 and available to order today with free, downloadable software.

The DV102013 incorporates the MTCH6303 projected-capacitive touch controller and the MTCH652 high-voltage driver on a controller board, and includes a transparent, 8” ITO touch panel for easy demonstration of the MTCH6303’s touch-controller capabilities and supporting graphical user interface (GUI) functionality.

MICROCHIP TECHNOLOGY

A GUI for controlling step commands, motor parameter input, and operation modes is included. This flexible and cost-effective board can be configured in different ways for use with Microchip’s specialized dsPIC33F Motor Control Digital Signal Controllers (DSCs). The dsPICDEM MCSM Development Board offers a mounting option to connect either a 28-pin SOIC device or a generic 100-pin Plug-In Module (PIM). A dsPIC33FJ32MC204 DSC PIM (MA330017) is included.

The dsPIC DSC devices feature an 8-channel, high-speed PWM with Complementary mode output, a programmable ADC trigger on the PWM reload cycle, digital dead time control, internal shoot-through protection and hardware fault shutdown. These features make the dsPIC DSC an ideal solution for high-performance stepper motor control applications where control of the full-bridge inverter is required.

For the chance to win a dsPICDEM™ MCSM Development Board, from Microchip, please visit: www.microchip-comps.com/epdee-mcsm and enter your details in the entry form.

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INDUSTRY NEWS

EMBEDDED SYSTEMS

Intersil Announces Industry’s Highest Efficiency Buck-Boost Regulator for Wearables and Other Mobile Devices Intersil Corporation announced the ISL9120, a buck-boost switching regulator that enables efficient power management of system power supplies and peripherals such as Wi-Fi, Bluetooth®, memory cards or LCD modules. Its adaptive current limit PFM architecture delivers industry-leading efficiency up to 98%, while providing smooth transitions from buck-to-boost to prevent glitches in applications where light load efficiency and fast transient response are critical. An ultrasmall form factor makes the ISL9120 ideal for the connected devices making up the Internet of Things (IoT) including wearables, smartphones, smart thermostats and point-of-sale devices that run on single-cell Li-ion or Li-polymer batteries, or 2-cell alkaline, NiCd or NiMH batteries.

With the pervasiveness of mobile devices and growing popularity of wearables, power designers are challenged to balance cost, form factor and power efficiency. Typical power solutions for wearables use three DC-DC regulators and 3-5 LDOs, which takes up valuable board space. LDOs also lack the high efficiency and reliability of a buck-boost regulator, sacrificing performance as well. For example, when LDOs are used to power peripherals in a system running on a Li-ion battery with the Vout near 3.3V, a large burst current from the applications processor can cause the Vin to droop below the LDO regulation voltage, causing a memory reset or application shutdown.

The ISL9120 buck-boost switching regulator eliminates this problem by addressing a wider Vin range and providing boost to avoid low voltage glitches that can cause a battery brownout when the Vin droops below the output voltage. Requiring only a single inductor and available in a small 1.41mm × 1.41mm package, designers no longer have to compromise efficiency or form factor.

The ISL9120 offers designers the flexibility to cover a variety of design needs by operating from a Vin of 1.8V to 5.5V and an adjustable output voltage from 1V to 5.2V. Its adaptive PFM operation with forced bypass mode and 2A switches support both low load and high load currents with high efficiency, ensuring longer battery life and less heat buildup. The regulator also delivers 800mA current with 2.5V input and 3.3V output. During system stay alive conditions when regulation is not required, the ISL9120 goes into forced bypass mode, which reduces power consumption to a miniscule quiescent current of less than 0.5uA. INTERSIL 6

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Renesas Electronics Delivers Bluetooth® Smart Wireless Solution to Accelerate Use of Embedded Devices in IoT Applications Renesas Electronics announced a new wireless solution that supports the Bluetooth® Smart near field wireless communication standard. The new RL78/G1D Group of microcontrollers (MCUs) has been developed by combining the low-power RF Transceiver Technology for Bluetooth® Low Energy (BLE), which the company presented at the International Solid-State Circuits Conference (ISSCC) held in February, 2015, with Renesas’ expertise on consumer and industrial MCUs, and on-chip peripheral devices necessary for wireless communication. By employing an evaluation kit and Bluetooth-SIG qualified protocol stack, the new MCUs enable system designers to conduct evaluation of wireless characteristics and initial evaluation of communication behaviors.

The new MCUs are also provided with PC GUI tool for easy manipulation of these components. These will enable customers to easily develop Bluetooth Smart applications and reduce the time required for development while making effective use of development environment and software resources.

BLE is a near field wireless communication technology that holds great potential for connecting smartphones and a variety of other devices. In addition to smartphones, it is also suitable for use in devices linked by serial communication technologies such as UARTs and for implementing communication between units within a single piece of equipment. Eliminating the need for wired connections between such units provides greater design freedom and simplifies maintenance. This technology therefore has the potential to bring about major changes in embedded devices. The Bluetooth Smart compliant RL78/G1D MCUs have been developed by combining the ultra-low-power RL78 MCU, which has achieved widespread adoption in the consumer and industrial fields, with the highly regarded low-current-consumption Bluetooth® low energy transceiver technology announced at the ISSCC in February 2015. The current consumption of the RL78/G1D is among the lowest in the industry (3.5 milliamperes (mA) during reception and 4.3 mA during transmission), delivering substantially reduced power consumption that is a key consideration for wireless devices.

RENESAS ELECTRONICS EUROPE www.renesas.eu

INDUSTRY NEWS

EMBEDDED SYSTEMS

Silicon Labs Simplifies IoT Connectivity with Best-in-Class Thread Solution Silicon Labs introduced its highly anticipated Thread networking solution, delivering a software stack built upon years of mesh networking expertise and the industry’s most advanced mesh networking software development tools. Silicon Labs’ Thread solution offers developers the fastest path to developing Thread-compliant products for the IoT including thermostats, wireless sensor networks, smoke/carbon monoxide detectors, connected lighting devices, control panels, wireless access points and gateways.

Thread technology fills a critical gap in the IoT ecosystem by providing the industry’s first standards-based, low-power mesh networking solution based on Internet Protocol (IP), enabling reliable, secure and scalable Internet connectivity for battery-powered devices in the connected home. As a founding member of the Thread Group and the chair of the Group’s technical committee, Silicon Labs has been instrumental in defining and developing the Thread specification introduced today.

Silicon Labs’ Thread solution offers a simple, secure and scalable way to wirelessly interconnect hundreds of connected home devices and to seamlessly bridge those devices to the Internet. Thread software provides a self-healing, IPv6-based mesh network capable of scaling to 250+ nodes with no single point of failure. The protocol provides extensive support for “sleepy” end nodes to enable years of lowenergy operation using a single battery as well as simplified commissioning. Users can easily add nodes to a network using a smartphone or browser. Silicon Labs’ Thread stack uses banking-class, end-toend security to join nodes to the network and proven AES-128 cryptography to secure all networking transactions.

Silicon Labs offers a comprehensive suite of development and debugging tools to accelerate the introduction of Thread-compliant products. Silicon Labs’ AppBuilder tool simplifies and accelerates the development of IP-based mesh networking applications.

AppBuilder enables developers to easily configure mesh networking applications for Thread protocol using Silicon Labs’ application framework, which isolates application code with a set of easy-to-use call backs and plugins, making the customer’s software portable and reusable across supported wireless SoCs in Silicon Labs’ portfolio.

Silicon Labs also offers a powerful Desktop Network Analyzer tool that, unlike traditional wireless sniffers, provides complete visibility of all wireless networking activity by using the unique packet trace port available in Silicon Labs’ mesh networking SoCs. SILICON LABS

www.silabs.com/thread

AUTOSAR Integrated With MOST® Infotainment and Advanced Driver Assistance Networking Technology Bosch Subsidiary ETAS Demonstrates Automotive Industry Standard AUTOSAR Solution for Connecting With a MOST Network Using Microchip’s Devices Microchip Technology Inc., a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions, today announced that designers using the Automotive Open System Architecture (AUTOSAR) to develop and reuse their in-vehicle software can now connect their systems to not only networking technologies such as CAN and LIN, but also to the MOST® Cooperation’s automotive-proven MOST networking technology. This means that Microchip’s MOST Intelligent Network Interface Controllers (INICs) can be used for crossdomain communication in an AUTOSAR system, such as Advanced Driver Assistance Systems (ADAS), which simplifies automotive networking and diagnostics.

AUTOSAR has developed a standardized, open software architecture for automotive electronic control units, which is increasingly being applied in traditional vehicle electronic domains. For example, after the major German vehicle OEMs successfully utilized AUTOSAR in the central areas of their electrical/electronics architectures, they are now extending its use into additional domains. With the introduction of the AUTOSAR 4.x standard, most other OEMs are now also investigating or actively migrating to AUTOSAR. Therefore, it is increasingly important that the infotainment domain of a vehicle is able to support AUTOSAR, at least where an interaction with other domains is necessary.

To date, more than 170 million MOST interface controllers have been installed in 184 car models since 2001. All major carmakers have for many years successfully implemented MOST technology in their multi-node infotainment networking systems, as it provides a field-proven, low-risk, whole-system solution. The MOST150 standard also meets designers’ Internet-connectivity requirements. This latest version of MOST technology continues to predictably and efficiently transport video, audio, packet and control data throughout the vehicle without time-synchronization protocols, using dedicated channels for minimal processor overhead in the main infotainment control unit processors.

MOST150 also provides 150 Mbps performance and proven electromagnetic-compatibility (EMC) behavior.

MICROCHIP TECHNOLOGY

www.microchip.com/Homepage-070715a

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INDUSTRY NEWS Altera Brings the Value of FPGAs to Network Function Virtualization Altera Joins Open Platform for NFV (OPNFV) Project Altera Corporation (NASDAQ: ALTR) today announced the company has joined the Open Platform for NFV (OPNFV), a community-led, industry-supported, open-source reference platform for network function virtualization (NFV). NPV uses IT virtualization technologies to virtualize entire classes of network node functions into building blocks that may be connected, or chained, to create communication services. Altera will join working groups inside the OPNFV to enable expand the use of FPGA accelerators in virtual machines running different software and processes on top of industry-standard, highvolume servers, storage and cloud computing infrastructure.

FPGAs act as accelerators by offloading compute workloads, using less power than general-purpose graphics processing units (GPGPUs) and central processor units (CPUs) —which helps data centers run cooler.

FPGA- and SoC-based solutions are already accelerating servers in the data center in search and convolutional neural networks applications.

The OPNFV’s Work Benefits Service Providers Initial interest in working with the OPNFV has come from the network service provider community, including OPNFV founding members AT&T, China Mobile, NTT DOCOMO, Telecom Italia and Vodafone, among others. In addition, other industries such as the financial services industry, large enterprises and cloud service providers are showing interest as their needs for NFV. ALTERA www.altera.com OPEN PLATFORM FOR NFV (OPNFV) www.opnfv.org 8

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EMBEDDED SYSTEMS congatec launches COM Express Basic module with 14nm Intel Xeon processors and Intel Iris Pro graphics congatec AG, a leading technology company for embedded computer modules, single board computers (SBCs) and embedded design and manufacturing (EDM) services, announced the latest addition to its COM Express Basic portfolio: the new conga-TS97 computer module with either Intel® Core™ or Intel® Xeon® processors (codename Broadwell) manufactured in 14nm technology. The new conga-TS97 COM Express Basic module in the Intel® Xeon® version delivers server-grade performance for the first time and, compared to its predecessors, excels not only with its overall performance but particularly in terms of graphics due to the featured Intel® Iris™ Pro technology. Intel's most powerful processor-integrated graphics and media engine offers an immersive user experience with fast 3D rendering and realistic shading at high frame rates.

The new conga-TS97 high-end module is designed for any industry sector where applications with customized I/O and IoT interface configurations must meet the highest performance standards in the smallest space. While the Intel® Core™ processorbased modules are well suited for applications ranging from industrial automation to medical, retail and gaming, the Intel® Xeon® processor-based modules are designed for industr y-standard server platforms. Areas of application include carrier-grade edge node servers as well as industrial cloud servers with high packing density and/or minimum footprint. The high graphics performance of the integrated Intel® Iris™ Pro technology, useful in carrier-grade applications for content delivery platforms with real time video transcoding and network functions virtualization (NFV), will also work well in industrial applications to fulfill important situational awareness tasks - for example in autonomous vehicles. GPGPU-based applications can also be found in parallel deep packet inspection or content encryption and decryption. For server-based applications, the graphics engine delivers distributed clients rich and responsive 3D performance for CAD, 3D modeling and video rendering.

Since the new processors are manufactured at the 14nm node of the new microarchitecture, performance upgrades are quick and efficient to implement. Existing product lines can be enhanced with new performance classes and optimized TDP, while the immediate availability of evaluation boards speeds up the evaluation process for new applications.

The feature set in detail The conga-TS97 modules are equipped with the latest 14nm quad-core Intel® Core™ and Xeon® processors and offer 6MB of L2 cache with a TDP of 47 watts. The following Intel® processors are supported: Core i7-5700EQ, Core i7-5850EQ, Xeon E31258L v4 and E3-1278L v4. Thanks to super-fast 32 GB 1600 DDR3L memory support, the modules meet server-grade requirements and are specifically designed for use in data-intensive applications. With support for AVX 2.0, SSE 4.2 and OpenCL 2.0, the new modules are also capable of processing high-parallel tasks quickly and efficiently.

The integrated Intel® Gen 8 HD Graphics scales to Intel® Iris™ Pro P6300 with 48 execution units. This allows operation at 60 Hz of up to 3 independent 4K displays (3840 × 1260) via HDMI 1.4, DVI and DisplayPort 1.2. An additional dual-channel LVDS output is provided while OpenGL 4.3 and DirectX11.2 ensure high-quality images and the latest 3D features. The integrated video transcoder relieves the CPU by providing H265, H264, MPEG2 and VC1 video streams in real time.

CONGATEC AG

www.congatec.com

INDUSTRY NEWS

EMBEDDED SYSTEMS

Intersil Unveils New Radiation Hardened Multiplexers for Space Flight Data Acquisition Systems Intersil Corporation introduced the ISL71840SEH and ISL71841SEH, new radiation hardened (rad hard) multiplexers that offer best-in-class electrostatic discharge (ESD) protection, and the industry’s highest signal chain accuracy and timing performance. The ISL71840SEH 30V 16-channel multiplexer is a drop-in replacement for Intersil’s widely adopted HS9-1840ARH, which has been aboard nearly every satellite and space exploration mission, including NASA’s recent Orion spacecraft flight test.

For applications with form factor constraints, the new ISL71841SEH 30V 32-channel multiplexer offers high performance and 41% reduced board space compared with an ISL71840SEH two-chip solution.

The ISL71840SEH and ISL71841SEH rad hard multiplexers deliver ultrahigh performance in the most demanding environments by leveraging Intersil’s proprietary silicon on insulator process, which provides single event latch-up (SEL) robustness in heavy ion environments. The enhanced 8kV ESD protection feature of these devices eliminates the need for costly external protection diodes on the input pins. And their reduced RON of 500 Ohms at ±5V and propagation delays of less than 800ns increase the overall performance and accuracy of telemetry signals processed and multiplexed into an analog-to-digital converter (ADC) input.

The ISL71840SEH and ISL71841SEH offer over-voltage protection on a per-switch basis to maintain the continuous processing of telemetry test points. If any input channel experiences an over-voltage condition, the remaining channels continue sending data to the ADC. Both multiplexers provide a “cold spare” redundant capability, allowing the connection of 2-3 additional unpowered multiplexers to a common data bus. This is an especially important feature for mission-critical space flights lasting up to 20 years. If required for any reason, a redundant multiplexer is immediately activated. Both multiplexers provide a wide supply range with splitrail operation from ±10.8V to 16.5V and an absolute maximum of ±20V, providing designers with plenty of de-rating headroom.

“The ISL71840SEH and ISL71841SEH multiplexers build upon the performance and reliability of the HS9-1840ARH, while providing additional features to support the latest needs of data acquisition systems,” said Philip Chesley, senior vice president of Precision Products at Intersil. “The 16channel and 32-channel devices are ideally suited to meet the mission assurance needs of next-generation satellites and manned spacecraft for deep space exploration.”

INTERSIL

www.intersil.com/products/isl71840seh

RUTRONIK EMBEDDED: Progressive IoT Computing from Advantech with RISC Technology Distributor Rutronik presents the new palm-sized UBC220, an ARM-based compact box computer powered by a Freescale ARM® Cortex™-A9 i.MX6 Dual Lite highperformance processor. Designed with compact size, high capability, and superior connectivity, UBC-220 is an ideal indoor computing gateway suitable for smart buildings, parking lots, and public spaces.

Advantech’s UBC-220 is equipped with a Freescale ARM® Cortex™-A9 i.MX6 Dual Lite 1GHz processor, 1GB of onboard memory, and 4GB of eMMC flash memory storage. Featuring dual display support for Full HD 1080P HDMI and single-channel LVDS, UBC-220 is an ideal solution for HMI and instant signage. In addition, with USB 2.0 and OTG expansion compatibility, as well as Gigabyte Ethernet and dual mini-PCIe slots for optional Wi-Fi and 3G modules, the box computer has the connectivity to bridge multiple devices in the same network and efficiently acquires raw data for the next generation of cloud-based services. Furthermore, the palm-sized UBC-220 supports various mounting methods including VESA, DIN rail, and flexible wall mounting. With the specially designed VESA bracket, UBC220 can be integrated with Advantech openframe monitors to provide a fanless standalone system with rich I/O capabilities that supports device management for complex IoT infrastructures.

As the default operating system, UBC-220 is equipped with embedded Linux. For experienced Yocto Linux developers, Advantech also provides a Yocto Linux board support package as an optional design-in service. Advantech also provides a complete software toolchain, Linux source code package, and software support service for SW developers, intending to develop a new-generation IoT gateway based on UBC-220. It offers not only a stable H/W platform, but also the software package and service enable customers to more easily and quickly develop their own apps. In addition to Linux support, an Android OS image and BSP source code for application development are offered, Android Apps can also be integrated.

RUTRONIK

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DESIGN

IoT

Performance, security and power core to the new era of Internet of Things devices In the accelerating consumer and industrial Internet of Things marketplace, the need for enhanced performance, security and power management has never been more prevalent.

With an increasing number of power hungry, graphically intense devices entering the market daily, it’s clear the process for system developers is becoming more and more complex – and this is just the beginning.

In response to these growing complexities and demand from developers, we’ve introduced our newest family of applications processors – the i.MX 6DualPlus, i.MX 6QuadPlus and i.MX 6UltraLite – to deliver the highest levels of performance, power management and security for both high and low-end applications.

By Freescale Staff These newest additions to our i.MX 6 series represent the most versatile platform for multimedia and display applications to date, providing newfound performance to the seamless next generation user experience of an evolving and highly dynamic Internet of Things. With this expansion, system developers can now leverage Freescale’s power management integrated circuits (PMIC) along with pin compatibility and scalability across the i.MX 6 series.

Visually Stunning Solutions for High-end, Multi-market Applications The i.MX 6DualPlus and i.MX 6QuadPlus are based on the ARM® Cortex®-A9 core and build upon the solid foundation of i.MX 6Dual and i.MX 6Quad processors by more than doubling the graphics performance and improving memory utilization by more than 50%. i.MX 6DualPlus and i.MX 6QuadPlus are part of our growing line of multimedia and display focused products that offer highperformance processing with a great degree of functional integration for intense, featurerich graphics that can handle additional power requirements.

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Key Features of the i.MX 6DualPlus and i.MX 6QuadPlus • Each processor provides a newly optimized 64-bit DDR3/LVDDR3/LPDDR2-1066 memory interface to increase bus bandwidth.

• Embedded SRAM has been increased, while pre-fetch and resolve engines have

been added to increase efficiency.

• These processors come equipped with hardware enabled security features ideal for secure e-commerce, digital rights management, information encryption and secure software downloads.

• TrustZone® architecture – including security extensions in the Cortex-A9

DESIGN

cores as well as generic interrupt controller, on-chip RAM and a TrustZone Address Space Controller – help prevent malicious security access.

• Enhanced power management enables a rich suite of multimedia features and peripherals to conserve power in both active and low power modes. The Freescale PF0100 PMIC satisfies the power required for the i.MX 6QuadPlus and i.MX 6DualPlus.

The Coolest, Smallest Cortex-A7 Microprocessor on Market

IoT

Leveraging the most energy-efficient ARM Cortex-A7 core in 14x14mm and 9x9mm BGA packages, the i.MX 6UltraLite is designed to provide rich performance in low-power for space constrained embedded applications such as financial payments, industrial HumanMachine Interface (HMI) and building control.

• Advanced power management architecture features multiple energy saving modes and dynamic voltage and frequency scaling as well as integrated power switch for flexible power gating in low power modes.

• Robust security supporting high assurance (secure) boot, hardware cryptographic cipher engines and random number generation allows peripheral and memory access requests to be hardware-verified, providing secure isolation and system resources tainting prevention. Hardware tamper detection and an integrated on-the-fly DRAM encryption/decryption engine make the i.MX 6UltraLite among the most secure ARM Cortex-A7 microprocessor solutions available.

• The i.MX 6UltraLite is designed for streamlined integration and connectivity and is optimized for ease-of-use and faster time to market. It offers great functionality at a competitive BOM. • The i.MX 6UltraLite is supported by Freescale’s recently announced PF3000 PMIC and other low cost power supply solutions including discrete circuits are ideally suited for the lower end Cortex-A9 and Cortex-A7 based i.MX 6 series of applications processors.

The current developer requires efficient, power performing tools that work within the constraints of their devices. The i.MX 6DualPlus, i.MX 6QuadPlus and i.MX 6UltraLite were designed with Internet of Things developers in mind to deliver the highest levels of performance, power management and security possible. With this latest announcement, our i.MX family of processors continues its legacy of innovation – a testament to Freescale’s foresight in solving the design challenges of tomorrow by empowering engineers to build our world of a dynamic Internet of Things today ￭ Freescale Semiconductor www.freescale.com

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IoT

How wireless modules bring the Internet of Things to life

By Tony Milbourn Vice President Corporate Strategy u-blox AG

Tony Milbourn is responsible for Strategy at u-blox AG. u-blox is a Swiss supplier of location and communications modules and chips focused on industrial, automotive and consumer applications, particularly in the Internet of Things.

Tony has 30 years’ experience in the mobile communications industry. He was a founder and for almost 20 years CEO of TTP Communications plc, a major licensing business in cellular protocol stacks, chips and application software, that IPO’d in London in 2000 and was acquired in 2006 by Motorola. He was also a founder of ip.access, the leading femtocell business, and more recently led the spin-out of a soft modem start-up, Cognovo, from ARM Holdings. u-blox acquired Cognovo in 2012, since then Tony has helped direct the growth of u-blox and set the agenda for the future of the business. He is interested in creating new opportunities at the point where communications and computing converge.

Dramatic growth in the Internet of Things (IoT) has been widely reported in recent times. While many media reports have focused on rather trivial consumer applications – the toothbrush connected to your smartphone being one example – those discussed here relate to the “Internet of Things that Really Matter”. In other words, the article highlights just a few examples of those applications that improve our lives through greater security, productivity or convenience, or a combination of these factors.

Short range wireless connectivity is the enabling technology for the IoT The IoT means different things to different people but there are common fundamental elements to most applications: one or more sensors, an application processor, a connec12

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tion to the Internet - usually via one or more wireless protocols - and data analysis in computers in the cloud. In fact, one distinction between M2M and IoT is that IoT includes data analytics that may sometimes be based on data coming from different systems owned by different companies.

When the “things” are mobile, for example in a truck or car, there may also be a need to determine their location in using satellite global positioning (GNSS) receivers or, for greater accuracy, a combination of data from GNSS, cellular networks, Wi-Fi hotspots and perhaps even wheel tick sensors on the vehicle.

(Wheel tick sensors are used for Dead Reckoning to track a vehicle’s position when it is out of GNSS range – in a tunnel, for example.)

Where large volumes of data are aggregated from many sensor nodes, powerful computers in the cloud can host complex databases and analysis tools then deliver information services to customers. Figure 1 gives an overview of IoT connectivity.

Because Bluetooth is now ubiquitous in smartphones, tablet computers and notebooks, it often forms the first link in a chain of connectivity from sensors to the Internet.

The subsequent link can be via a wired network, Wi-Fi gateway or cellular radio connection.

Bluetooth low energy, popularly known as Bluetooth Smart, has been a key enabler for many IoT applications thanks to its much lower energy consumption (in some applications 100x lower) and lower latency than Classic Bluetooth.

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IoT

parts, for many designs it makes sense to design with some degree of future-proofing in mind. This can mean implementing a 4G connection now – particularly if it features automatic “fallback” to 3G or 2G when a 4G network is not accessible. Incidentally, ublox has been helping its customers through the 2G-3G-4G transition by using a nested design philosophy for its GNSS and wireless modules. This means maintaining form factor and software continuity. Customers simply drop the upgraded version of each module onto an unchanged printed circuit board and start testing. The principle is illustrated in Figure 2.

Figure 1: IoT connectivity is heavily dependent upon wireless technologies: Bluetooth, Wi-Fi, cellular networks from 2G to 4G, and GPS/GNSS being the most prevalent.

Wireless connectivity is the glue that binds the IoT together. An important decision for product designers is which wireless technology to adopt for which task.

Sometimes choices are limited by available infrastructure, or answers are very obvious for other reasons. At other times, there is an opportunity for choice, or to adopt a multiradio strategy and allow the end customer to choose.

This comes at some penalty in terms of maximum data rates. Many sensors don’t produce much data so the 100 kbps application throughput of Bluetooth Smart versus the 2.1 Mbps gross throughput rate (1.5 Mbps net) of Classic Bluetooth v2.1 with Enhanced Data Rate (EDR), is perfectly adequate.

For example, utility meters or heart rate monitors require only minimal bandwidth to deliver data as they perform their respective tasks. Another advantage of Bluetooth Smart over Classic Bluetooth is its improved data security. It uses AES-128 encryption – sometimes described as bank level security – an important factor if wireless links are going to be carrying sensitive information that could be intercepted, such as a person’s medical data.

The next link in the Internet connectivity chain will usually be via Classic Bluetooth, Wi-Fi or cellular radio. Wi-Fi offers much greater bandwidth than Bluetooth, up to a theoretical maximum of 600 Mbps using 802.11n and the latest cellular radio networks allow up to 150 Mbps download and 50 Mbps upload speeds.

Standards for cellular radio networks have evolved rapidly. Although data rates for some applications may be modest, and 2G radios are cheaper than their 4G counter-

Figure 2: A “nested’ design philosophy for cellular radio modems makes it easier to upgrade as standards evolve (2G-3G-4G) and product improvements are implemented. www.epd-ee.eu |

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While some companies will opt to create proprietary wireless designs around one or more chips or chipsets, maybe even writing their own Bluetooth stacks, many are turning to ready-certified modules to simplify and accelerate product development, reduce engineering risk, guarantee quality and lower both non-recurring engineering (NRE) costs and unit costs.

Furthermore, many modules now integrate more than one wireless technology, which promises further space and cost savings in the end product. Development time is reduced, the potential interference issues associated with co-located radios operating within the same frequency band have already been addressed, and the technical risks of implementation are minimised by using these multiradio modules.

exactly this kind of application. It measures 14.8 x 22.3 x 4.5 mm and supports multiple, concurrent Wi-Fi (2.4 GHz and 5 GHz), Classic Bluetooth and Bluetooth Smart links.

This gives great design flexibility and the module is simply configured for the application using AT-commands. Radio type approved in countries throughout the world, it even has a built-in antenna to make adding multi-protocol wireless connectivity to any product as quick and easy as possible.

In-car connectivity streams HD video and more There’s growing demand for in-car wireless connectivity, not just for hands-free phones but also for rear-seat streaming of HD video and audio entertainment, rear view camera communications and even graphical user interface mirroring so that your car’s touch screen can look exactly like exactly like your smartphone screen, when you want it to.

While there will always be some applications where it is more economical to create wireless designs based around a chip, wireless modules are now manufactured in such high volume that there is rarely a cost penalty for the many benefits they offer. Here are a few examples of how they are being used today and how they may be used tomorrow.

A medical infusion pump that communicates over Bluetooth Smart and Wi-Fi Bluetooth Smart may be used with a handheld scanner to make sure that a medical infusion pump is connected to the right patient and that the right medication is being given. The Bluetooth connection carries very little data but within the same pump a higher bandwidth Wi-Fi link sends continuous monitoring data over the hospital network, as shown in Figure 3.

The u-blox ODIN-W262 multiradio wireless module, shown in Figure 4, is designed for

Figure 4: The ODIN-W262 module supports multiple, concurrent Wi-Fi (2.4 GHz and 5 GHz), Classic Bluetooth and Bluetooth Smart links.

This flexible module may also be used in point-of-sale retail applications. Here, Bluetooth Smart can be used as a proximity beacon so that a hand-held payment device knows which receipt printer is nearest to it.

Data can then be transferred to that printer over Classic Bluetooth or Wi-Fi.

Once again, because so many wireless technologies are involved, multiradio modules make a lot of sense. The u-blox EMMY-W1 automotive-grade module is designed for just such applications. It combines dualband Wi-Fi with IEEE 802.11 ac with dualmode Bluetooth Smart Ready v4.1 and near

Figure 3: Using a multiradio module in an infusion pump is a compact, cost-effective way to integrate a variety of configurable wireless standards.

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DESIGN

field communications (NFC) for keyless entry. In addition, it has an integrated LTE co-location filter so that both Wi-Fi and cellular antennas can be located in close proximity to each other, for example in a sharkfin antenna on the car’s roof.

4G LTE cellular radio modem modules like those in the u-blox TOBY-L200 family are now capable of up to 150 Mbps download

IoT

Fleet management costs are reduced Many of the wireless technologies used in cars are equally valuable in commercial vehicles, as shown in Figure 5.

Using GNSS, fleet operators can know the precise location of every vehicle in a fleet and track vehicle performance at the individual and fleet level.

used to communicate engine data, to connect to hand-held terminals, including mobile phones, or to alert drivers to open doors or other vehicle problems.

Cellular radio modules (like the TOBY-L200 devices) then transmit data back to the fleet operator, perhaps enhancing it along the way using a cloud-based service.

Figure 5: There’s now a place for GNSS, cellular, Wi-Fi and Bluetooth wireless connectivity in commercial vehicles. speeds - sufficient to stream 8 simultaneous HD video feeds.

These modules feature the HSPA+ and GSM/GPRS fallback function mentioned earlier to ensure that they still function, albeit at reduced performance, when a 4G network is not available.

Of course, GNSS modules are already used extensively in vehicle navigation systems.

When real-time GNSS data is combined with cellular base station and Wi-Fi hotspot information, the accuracy of mapping and navigation systems is enhanced, particularly where satellite visibility is compromised, for example in tunnels or underground car parks.

Wireless connectivity in cars will also be a facilitating technology for vehicle to vehicle (V2V) and vehicle to infrastructure (V2X) communications. Making driving safer is the prime motivation for the implementation of advanced driver assistance systems (ADSAS) that are enabled through this.

They can monitor fuel usage, idle time and vehicle diagnostic codes. They can optimize scheduling and routing, improve customer response times all while reducing fleet administrative overhead. This monitoring also helps reduce speeding violations and other and deters vehicle theft and unauthorized use. In addition, by integrating cellular data from a suitable module, real-time traffic information can be received.

Modules such as the u-blox CAM-M8C offer simultaneous GNSS operation for GPS/GLONASS, GPS/BeiDou, or GLONASS/ BeiDou to deliver accurate, jamming-resistant and reliable positioning anywhere in the world. It has a built-in antenna and integrates a u-blox M8 satellite receiver, crystal oscillator, SAW filter and low-noise amplifier to minimize implementation time and effort.

Short-range radio modules, perhaps employing Wi-Fi and Bluetooth links, can be

Summary These are just a few of examples of “Internet of Things that Really Matter” applications we see today. The growth in LTE networks in particular, will encourage product designers to include Internet connectivity in devices that have never before used it.

This will improve the user experience of these products, provide manufacturers with information that will help them make better products, and enable service providers to deliver new services to consumers, creating new business models and profit opportunities along the way. In all of these applications, wireless modules make it as easy as possible for designers, even those without wireless experience, to make their innovations part of our connected world – the IoT. ￭ u-blox www.u-blox.com www.epd-ee.eu |

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ULTRASONIC DEVICES

Finding the range How to use an ultrasonic device for range detection Author: Keith Curtis, Microchip Technology Inc.

Ultrasonic range detection can be accomplished with an ultrasonic device added to just an op amp and a microcontroller with four available I/O pins, including an internal integrated comparator.

To see how this works, take an ultrasonic transmitter that broadcasts a 40kHz pulse or several oscillations at that frequency. A square wave of one to several wavelengths can be driven from the microcontroller to the ultrasonic device to create the pulse. The pulse is reflected by any object of greater density than air, and part of the emitted pulse returns to the receiver. The round trip travel time can be measured and converted to distance via the speed of sound.

Sound requires a medium to travel through, such as air, water or steel. In general, the denser the medium, the faster sound propagates. The speed of sound in air varies based on temperature, humidity and altitude. At room temperature it can be assumed to be constant at about 343m/s. This is an ideal speed to use microcontrollers to time the round trip duration of an emitted pulse over a few meters.

The type of reflection surface is not critical; at 40kHz almost all surfaces reflect the oncoming sound wave. Perpendicular contact with a surface is preferable as the deflected pulses are directed back towards the receiver. As the angle of incidence with the surface increases, the proportion of the pulse reflected back to the receiver decreases.

An ultrasonic transducer operates similar to a piezo buzzer, but at a higher, inaudible frequency. When an electrical current is passed through the piezoelectric device, it deforms or bends and returns to its original shape when the current is removed. When a 40kHz square wave is applied to the pins of the device, a 40kHz sound 16

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pulse is radiated. An ultrasonic receiver works in the opposite fashion, producing a voltage, but at a much lower amplitude from incoming ultrasonic sound.

Figure 1: Equivalent circuit of an ultrasonic device.

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An ultrasonic device can be a transmitter, receiver or both, and be in an open or closed waterproof cover. This demonstration uses separate receive and transmit open type devices. This type is the easiest to use as a larger drive voltage is required to use waterproof transmitters.

Figure 1 shows the equivalent circuit of an ultrasonic device. It acts as a capacitive load, but because of inductive and capacitive aspects, it is tuned to a 40kHz resonant frequency. The transmitter is tuned for maximum output while the receiver is tuned for maximum voltage output at an incoming 40kHz signal. This has an attenuating filtering effect on all other frequencies and is useful in eliminating noise when amplifying the received signal. Typical values for the devices used in the demonstration are listed at the bottom of Figure 1.

Driving an ultrasonic device Driving the capacitive ultrasonic transmitter with a differential signal gives the greatest transmit strength while maintaining a 0.0V offset across the device. Driving the pins differentially also eliminates the need for a negative supply to drive the device.

One problem with ultrasonic transducers is they will continue to oscillate or ring after the removal of the drive signal. This ringing is due to the resonant mechanical behaviour of the transducer. The transducer is tuned to ring like a bell at its specified ultrasonic frequency when driven, and it takes a short period of time for the ring to dampen out after the drive is removed. While the transmitter is ringing, the signal will couple through the PCB or travel through the air between the transmitter and receiver, and look like a received signal. Therefore, a delay before the receiver is turned on is needed to ensure the ringing has damped out, and any signal received is that of a reflected pulse. The amount of time required for the ringing to dampen out determines the minimum detectable distance of the receiver, see Figure 2.

ULTRASONIC DEVICES

ple, can easily be divided down to create a 40kHz drive signal. Two I/O pins of a PIC microcontroller can be used to generate the differential 40kHz signal that drives the ultrasonic transmitter. This demonstration is using Timer0 interrupt-on-overflow to create the time basis for the output.

An alternative, more automated method of driving an ultrasonic device would be to use the ECCP module offered on many PIC MCUs. The module can be set up to output a PWM of a selected frequency on two pins, P1A and P1B, in half-bridge mode, with one output inverted. The ECCP module uses Timer2 to establish a time base for PWM. Enabling the Timer2 post-scaler lets the user set the number of pulses generated before setting the interrupt flag. This allows an ultrasonic pulse to be sent with a single interrupt.

Once an ultrasonic signal is created and output from the ultrasonic transmitter, the next task is to detect and time a returning reflected pulse. The returning sound wave is significantly attenuated and amplification is necessary before the signal can be detected by a comparator. This amplification can be a single op amp in a difference amplifier configuration.

Difference amplifier An example circuit for a difference amplifier is shown in Figure 3.

This op amp circuit amplifies the voltage across the ultrasonic receiver connected between the two input pins. The common mode noise at the output is reduced by matching the input bias current through resistors R2 and R4 and resistors R1 and R3.

Figure 3: Circuit for a difference amplifier.

The ultrasonic receiver acts like a tuned high Q filter. The difference op amp amplifies the filtering effect of that receiver. The first op amp amplifies and filters the incoming signal versus common mode noise. All subsequent op amp stages will amplify any noise and require additional filters. Selecting the proper op amp for the first gain stage of the ultrasonic receiver can eliminate the need for more than one op amp and filters.

Figure 2: Ultrasonic device.

Ultrasonic devices should be driven as close as possible to their specified frequency to increase the output power. The 8MHz internal oscillator of the Microchip PIC16F690 microcontroller, for exam-

This demonstration uses the Microchip MCP6022 op amp because it has a unity gain bandwidth (UGBW) of 10MHz. A higher UGBW means the gain of the op amp is higher at a specified frequency, such as 40kHz. The demonstration circuit has a gain of 250 to 300 at 40kHz because the gain is limited by the UGBW and is not described by R1/R2. www.epd-ee.eu |

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A data slicer is a circuit common to many communications applications. A threshold voltage, V_th, is compared with the amplified input to detect the signal. V_th in Figure 4 is set slightly below the average value of the amplified ultrasonic signal, V_US. Any time an ultrasonic pulse is amplified, the value at the C2IN- pin will fall below the value of C2IN+, causing the value of the comparator to switch. The value of R2 should be much larger than the value of R1, but not so large it causes the comparator to switch because of noise on the amplified signal. Ideally, R1 is set so the value of the threshold voltage is just above the noise of the received ultrasonic signal. The closer the threshold voltage to the received signal, the greater the detectable distance of the receiver.

The C2OUT pin of the PIC microcontroller can be used to debug this stage of the ultrasonic receiver. A common problem is that the threshold voltage is set incorrectly. If it is too low, the detectable range of the receiver will be limited. If it is too high, the comparator will switch from noise spikes on the line making it impossible to tell when a signal is present.

and delays in the signal propagating through a more involved filter.

All considered, the resolution for an ultrasonic system operating at 40kHz can be about 1cm and does not depend on range, only the returning pulse being detected.

There are two ways of increasing the maximum detectable distance in this application: increased transmission power and increased receiver sensitivity. This demonstration uses I/O pins to drive the transmitter at a maximum of 20mA and 5V; MOSFET drivers could be used to boost the drive current and voltage. The gain of the receiver at 40kHz determines what can be detected by the comparator.

The demonstration uses only one op amp as a difference amplifier.

Because there is only one gain stage, no filtering is needed. A multistage receiver would need to do some filtering between the first gain stage and the comparator to reduce noise. Carefully controlling the threshold voltage to the comparator will also ensure that the smallest return pulse is positively detected.

If a separate transmitter and receiver are used, they should both be aligned in the same direction. The transmitted signal and any subse-

Figure 4: Data slicer.

The Timer1 gate function provides an enable signal for the clock signal to the 16bit Timer1 counter. The output of the comparator, C2OUT, can be selected as an internal source to the Timer1 gate.

Counting is enabled while the C2OUT signal is low. Once an ultrasonic signal is detected and the C2OUT value changes, counting stops. The value stored in the Timer1 registers is the round trip time in the form of counts of the ultrasonic signal. Depending on the oscillator speed of the device, these counts will have a specific time value.

After detecting the returning ultrasonic pulse, Timer1 stores a count value corresponding to the travel time of the ultrasonic pulse. These counts can be converted to distance by dividing by two and multiplying by the speed of sound. The divide by two is because it is a round trip measurement and can be accomplished by shifting the count value right one bit.

The wavelength of the carrier frequency determines the resolution of the system. A frequency of 40kHz has a wavelength of about 0.85cm. Going to a higher carrier frequency increases resolution but narrows directivity and reduces range. Resolution can also be affected by the accuracy of the oscillator used to time the returning pulse, 18

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quent ringing will leak through the PCB to the receiver circuitry.

Placing more space or a cut-out between the devices on the board will help to reduce this leakage. Ultrasonic transducers are often mounted using rubber or silicon to limit the amount of leaked ultrasonic signal to and from the surrounding material.

Conclusion Ultrasonic range detection can be accomplished using a PIC16F690, MCP6022 op amp and MuRata MA40S4R/S ultrasonic device. Two port pins of the PIC microcontroller provide enough drive strength to transmit an ultrasonic pulse. Timer0 and Timer1 were used to create a 40kHz signal and time the returning pulse. The MCP6022 amplified the signal at the receiver, and the PIC16F690 internal analogue comparator was used to detect the presence of the returning pulse in the signal ďż­

Microchip Technology www.microchip.com

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SoCs

Employing SoCs for analytics This post was originally published in Machine Design by Toby Foster, Digital Networking Group of Freescale.

As the amount of data continues to grow, it is becoming increasingly apparent that the traditional, compute-centric data center architecture may not be the best configuration for many computing applications especially analytics. Traditional servers are very energy- and space-intensive, not to mention pricey. On top of that, the majority of the energy cost in a traditional server environment comes from moving data from point A to point B, rather than from processing the raw data into value-add information (i.e., analytics). What is needed in this era of analyzing “big data” is a trusted architecture that combines the data with the high-performance compute.

Creating compute-dense processing nodes or appliances that are hyper-efficient - with ultra-low power, small form factor and high performance compute nodes - are built by integrating a system-on-a-chip (SoC) processor with DRAM (Dynamic random-access memory), flash memory, and the power conversion logic using open standards interfaces and software. These appliances are emerging as a new option for more efficient data processing per dollar spent.

By localizing the data with the compute, these powerful appliances first and foremost provide lower energy consumption, which significantly decreases the operating costs. How much performance for the power consumption can they provide? An Exabyte*-class machine utilizing these nodes and appliances is currently being built by IBM Research in Zurich, Switzerland. The challenges being addressed are daunting: analyzing 14 Exabytes of data per day in a system deployed in the desert, with limited power and networking infrastructure on a limited budget. This appliance will provide 1,536 processing cores with 3,072 threads, and up to 6 Terabytes, all on a 2U shelf.

Each compute node in the appliance consists of a 12-core, 24-thread SoC, 48GB DRAM, 2 SATA*, 4 10Gb Ethernet, SD and USB2 interfaces - yet is only 139 mm wide by 55 mm high and uses an inexpensive DIMM (dual in-line memory module) con20

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nector. 128 of these nodes are provided within each appliance which consumes about 6 kW. It runs standard Fedora 20 Linux and the IBM DB2 database. IBM researcher Ronald Luijten calls their creation the “datacenter in a box.” Ronald and his Freescale co-authors, Dac Pham, Mihir Pandya, and Huy Nguyen, presented the results of this work to date at the2015 ISSCC conference.

candidate for low power exascale*.” These two examples demonstrate that combining powerful, low-power compute with the integration of networking infrastructure on a single SoC can enable an appliance platform to scale efficiently to Exabyte levels of performance. *Exascale: A computing system capable of a billion billion calculations per second.

Complex systems on a chip are becoming more in demand as the internet of things and machine to machine (M2M) are growing. The systems are becoming more complex by adding cores and features as shown by the T4240 from Freescale.

What are some of the use cases that compute-dense appliances are uniquely suited for?

• In developing regions, the power and communications infrastructure is limited.

Carrying physical currency can also be dangerous. Therefore, mobile payments have emerged as a safer way to conduct business, including transactions as basic as buying groceries. Unfortunately, the infrastructure doesn’t exist to support that, but kiosks supported by low-power, compute-dense appliances - powered by cheap diesel engines or another inexpensive energy source - are considered a viable option to support the need for mobile transactions, without requiring a full mobile infrastructure build-out.

• In the Netherlands, ASTRON (The Netherlands Institute for Radio Astronomy) is collaborating with the aforementioned IBM researcher on a

*Exabyte: A unit of information equals one billion gigabytes. *SATA: An integrated drive electronics (IDE) device, which means the controller is in the drive, and only a simple circuit is required on the motherboard.

In another example, System Fabric Works demonstrated another implementation at Super Computing 2013 using the exact same SoC, which they called the “strongest

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project called DOME, in which researchers are utilizing a very large array of radio antennas to listen in on the Big Bang from 13 billion years ago. These antennas generate 14 Exabytes of data per day They are deployed in remote locations, such as in a desert, where the power and network infrastructure is fairly limited. Where did IBM look when they needed to work with a partner to develop a prototype for such challenges?

Freescale and the QorIQ T4240 SoC. To further address energy efficiency, the prototype is fan-less, as it utilizes hot-water cooling.

• Autonomous vehicles will generate huge amounts of data, which will need to be processed locally rather than in a remote data center in order to maintain the safe and efficient operation of the car. Some OEMs are estimating that to be truly autonomous, these self-driving cars will require 2-3 server class machines to analyze and process the data in real time.

These need to be low-power, small-form factor machines that can locally process and analyze the large amounts of data that the car will generate. Once again, these compute-dense analytic appliances perfectly fit that need.

Low-power, compute-dense analytic appliances have not yet fully come into their own. Right now, it is common to rely on the established data center technology. As big data continues to grow, and the business value of getting to the answers quickly and efficiently becomes the demand, rather than paying for the movement of data, a paradigm shift will take place. As this shift occurs, high-performance multicore processors will be needed to help address many challenges to optimize the system architecture for their specific application requirements.

Projects like DOME, work being done with deployments in developing regions, and other uses will pave the way for a new generation of compute-dense appliances to meet our local, low power, higher efficiency compute needs.

With this latest announcement, our i.MX family of processors continues its legacy of innovation – a testament to Freescale’s foresight in solving the design challenges of tomorrow by empowering engineers to build our world of a dynamic Internet of Things today ￭ Iain Davidson also contributed to this post. www.freescale.com

INDUSTRY NEWS EMBEDDED SYSTEMS Mouser Sponsors Student Solar Car Team in Upcoming Challenge Mouser Electronics, Inc. is pleased to announce that for the fourth straight year it is sponsoring the Ben Barber High School solar racing team of Mansfield, Texas, as it competes in the 2015 Solar Car Challenge. The event will be July 18-23 at Texas Motor Speedway.

The Solar Car Challenge was established in 1993 to help motivate students in science and engineering and to increase alternative energy awareness. The Challenge teaches high school students around the world how to build roadworthy solar cars.

“Supporting and encouraging the engineers of tomorrow is a large part of our mission at Mouser,” said Kevin Hess, Mouser’s Vice President of Technical Marketing. “We are very proud to again support our local Ben Barber solar racing team. It is exciting for us to have a role in supporting this important team project that encourages STEM education.”

The Mouser-sponsored team at Ben Barber Career Tech Academy will be competing against 29 teams from across the nation. Most are from Texas, but others come from as far away as Pennsylvania, Michigan, South Carolina, Florida and California.

The Ben Barber Career Tech Academy solar racing team, sponsored by Mouser Electronics last year as well, finished 4th overall in 2014 in a race from Fort Worth to Austin. The team - the Shine Runners - also won the Michael Foree Award, presented to the solar car team best utilizing computer technology in the design, production, and racing of their solar car.

On alternating years, the teams race at the world-famous Texas Motor Speedway or drive cross-country to share their projects with millions of people. In 2013, the Shine Runners won the State Energy Conservation Award from the State of Texas. The Conservation Award is presented to the solar car team displaying outstanding engineering excellence. The team also received a special proclamation from the Texas State Senate. Mouser’s sponsorship of the Ben Barber program has included financial support, as well as providing parts for the car and giving recommendations on development of the vehicle. To learn more about the Solar Car Challenge, visit http://www.mouser.com/solarcarchallenge/.

With its broad product line and unsurpassed customer service, Mouser caters to design engineers and buyers by delivering What’s Next in advanced technologies.

Mouser offers customers 21 global support locations and stocks the world’s widest selection of the latest semiconductors and electronic components for the newest design projects. Mouser Electronics’ website is updated many times per day and searches more than 10 million products to locate over 4 million orderable part numbers available for easy online purchase. Mouser.com also houses an industry-first interactive catalog, data sheets, supplier-specific reference designs, application notes, technical design information, and engineering tools.

MOUSER ELECTRONICS

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Motors & MCUs The hidden heroes of the modern home

By Dugald Campbell Dugald Campbell is an MCU systems architecture engineer for Kinetis MCUs

Without motor control, our homes and lives would be far less convenient than they are today – we’d still be washing our clothes by hand, cooking over open fires and desperately searching for the nearest ice cave in which to chill our beers. Outside of the kitchen the effect would be equally troublesome – HVACs replaced by hand fans, garage door/gate opening would require manual labor (shriek with horror!), and filtering the pool/jacuzzi would take months with only that lukewarm beer in hand to dull the pain. Jokes aside, motors are a BIG deal and represent a huge area of opportunity for electronic control using microcontrollers (MCUs), which bring increased automation and energy efficiency benefits to the appliance.

Within such applications, the MCU performs several functions. Its timers generate up to 6 channel PWMs which drive, via an inverter stage, the AC motor’s 3-phases that essentially make the motor spin. Analogue to Digital (ADC) module(s) are used to measure the various phase currents to track the speed and/or position of the motor as it rotates, known as sensor-less feedback control.

Several household applications also use 2 motors: washing machine (big drum and pump), dishwasher (sprays the water and drains), fridge/freezer (compressors, air-flow to stop frost), and HVAC/air conditioner (compressors and air flow). Many MCUs contain two sets of 6 channel PWMs allowing them to drive two inverter stages and in turn spin two motors. Generally, the sensor-less monitoring of speed and position is completed using one or two ADC modules.

Sensor-less speed algorithms work with less errors if they can simultaneously acquire two of the phase currents at specific times of the PWM period, but error adjustments can be 22

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made if only one ADC module exists, and the two phase currents are measured back to back. For driving a dual motor control application with two ADC modules, the application can assign one ADC per motor and include some error correction in the speed calculation. Alternatively, the dual motor drives can be synchronized by having one set of PWMs 180 degrees out of phase from the other, and making use of both ADCs for both motors by assigning different input channels. An MCU with four ADC modules allows true, independent dual 3-phase motor control which helps simplify application code and minimizes acquisition errors.

The trade-off that often arises in such integrated solutions is the cost of having four ADC modules, versus the level of power efficiency savings that will impact the end consumer.

The latest member of Freescale’s fast emerging Kinetis V series of ARM® Cortex®-M class MCUs – the Kinetis KV5x MCU family – is well equipped to handle the demands of multi-motor applications. With multiple

timers, four high-speed ADCs (sampling at up to 5 Msps), and a 240MHz capable Cortex-M7 core, fully independent sensorless control of two 3-phase motors can be accomplished with ease. With CPU MIPS to spare, the KV5x MCU can also perform other functions including adding secure internet connectivity via its on-chip Ethernet , multiple CAN and UARTs, and Encryption modules. With the embedded market currently ablaze with IoT (Internet of Things) concepts, the opportunity to remotely monitor and manage countless motorized appliances in the home and beyond can now be realized from the comfort of our armchairs, workplaces or further afield. So you can rest easy, thanks to the humble MCU it should be some time yet before we need to search for that elusive ice cave ￭ To learn more about Freescale’s motor control solutions, Kinetis V series MCUs, visit:freescale.com/Kinetis/Vseries #KinetisConnects www.freescale.com

DESIGN

DISPLAYs

Migrating to Advanced Displays

No doubt Steve Jobs did a great job at Apple, some might say he even changed the world! Today a simple 7-segment display is not enough for even the simplest of applications. Marketing teams are increasingly asking the engineering department for bigger displays with more impressive graphics on their next generation of products. This is true for many applications, such as coffee machines, ovens, factory automation and household boilers, and is naturally presenting a new and interesting challenge for engineering teams.

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DESIGN

So the simple question is: How to add a display into your application?

Let us first have a look at what different options you have in selecting a display.

There are lots of TLA’s (Three Letter Acronyms) used in the industry which are actually very simple but can lead to a bit of confusion.

Everyone in the engineering community is familiar with the Liquid Crystal Display (LCD) concept; even if they have subsequently moved to the dark side and are now working in “sales” they will likely remember the calculator that they once had to use for real work, that had an LCD screen on it. The basic concept is very simple. A layer of liquid crystals is arranged between two polarised layers (at 90 degrees to each other) such that, without the liquid crystal, no light would pass through at all. However, the crystal is arranged in a kind of helix pattern which rotates the polarisation of the light between the two polarised screens, meaning all the light can pass though. When an electric charge is applied to the liquid crystals, they unroll or straighten out, thus no longer rotating the light and will appear black.

This “twisted” orientation is the most common configuration inside and LCD, and this is where the TN-LCD (Twisted Nematic Liquid Crystal Display) comes from.

“Nematic” is just a way of describing the physical state of the liquid crystal.

DISPLAYs

A colour display can be built using three separate LCD cells per pixel and applying a red, green or blue filter to each one. The pixels are then lined up in columns and rows, and by applying a voltage to the column and grounding the row, a specific pixel can be turned on or off. The problem with this approach is, however, that for larger screens, when several pixels in one column and in another row are switched concurrently, there is a long delay as the charge propagates through the matrix, as well as a poor contrast as the charge is distributed across this matrix. This problem is somewhat overcome by using the STN-LCD module. The STN in this case stands for Super Twisted Nematic screen. In an STN screen, the 90 degree rotated liquid crystal is replaced by a “super-twisted” – or typically 270 degree twisted - liquid crystal.

This is, however, still building up a matrix of charged columns and grounded rows, also known as a passive, which has inherent limits as described before. Moving to an active control gives a much better contrast and a much faster response time. In an active LCD system, there is a dedicated transistor for every single LCD cell, and as such, the transistor controls the switching of that cell or pixel. This gives rise to the phrase “TFTLCD” which is then an LCD screen controlled by a Thin Film Transistor, and is the most common screen used in graphical display applications today.

The alternative, though not as popular a display technology in this market, is the OLED display. This is essentially a matrix of LEDs, with one OLED per pixel. They are lower power, lighter and can be put on flexible surfaces when compared to their LCDbased counterparts, however, the expensive manufacturing process and the somewhat limited lifetime of the blue component in the displays has delayed their full-scale introduction into the market.

Of course, there are a few other alternatives that are less popular but should nonetheless be understood, and these are listed below: • EPD – the so-called e-paper used in ereaders and in some watches, but not yet suitable for the embedded, non-consumer space.

• LCOS – Liquid Crystal on Silicon, used for “near eye” or projectors but have not taken off in the industrial market as yet.

• PDP or plasma – used in older, larger screens but are quickly being replaced

by LCD or LED screens.

Driving the display Now that we know how the picture is actually displayed on the screen and what the technology looks like, let us have a look at how the screens are actually driven.

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DESIGN

DISPLAYs

For smaller screens, often using a passive control system, it is common to see new COG (Chip on Glass) technology coming through, where the driver IC for the LCD is actually integrated onto the glass of the panel. This can provide a good cost reduction for smaller screens but is yet to make the breakthrough into larger colour screens, the likes of which the aforementioned Steve Jobs would have put onto his smartphones or other gadgets. These screens for the most part include an additional PCB, which contains the control mechanism for the screen and can additionally contain a controller for the touch interface.

colour display there will be 24 “data” bits.

This is the most simple of interfaces as there is a standard one to one transfer of every pixel data on the bus to the way it is stored in RAM. There are several different notations of RGB standards, such as RGB565 of RGB666, which simply denotes the number of bits taken for each colour. In RGB666, there are 6bits reserved for each colour, and it is therefore an 18bpp colour. In addition to these data signals there are also the clock signals to synchronise the panel.

There are then two further options available in terms of displays. There are so-called display modules, and there are standard displays. A module is just as you‘d expect – a complete module with all the memory required to save the picture data which is being displayed on the screen and normally a simple SPI interface. We will not go into these in much more detail, but suffice to say that they are slightly more expensive than a standard display but offer a much simpler solution for the novice user.

the data transfer occurs. There is then an Hsync clock, or horizontal synchronisation clock, which indicates after a number of pixel clocks when to jump to the next line.

Then at an even slower frequency, there is the Vsync signal (vertical synchronisation) which in turn indicates when all the rows have been written to, and it is possible to then start the next picture or frame.

There are two standard interfaces to a standard display – RGB signals or LVDS signals. It tends to be that displays over a certain size (about WVGA) will offer an LVDS interface and smaller ones will offer an RGB interface. There is of course no hard and fast rule here but the bigger the screen the more likely it will be to have only an LVDS interface.

RGB is essentially a parallel interface whereby each colour (Red, Green and Blue) is represented by a parallel bus. Thus for a 24-bit 26

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A panel clock (or pixel clock) sets the pace for the whole interface and subsequently

Of course, the bigger the display, the higher the speed required for the pixel clock in order to meet the refresh rate of the screen.

As external signal frequencies get higher, the risk of signal corruption also increases. For this reason, larger screens now tend to use an LVDS interface instead of the standard parallel RGB. LVDS stands for Low Voltage Differential Signal.

LVDS technology is used in many applications where signal integrity is very important, especially at high frequencies. The LVDS signal uses a two-wire interface (per channel) and has a common voltage (normally 1.2 V).

Then to create a “high” signal, the voltage on one line is raised by 100 mV and the signal on the second line is lowered by 100 mV. This allows for low power, high frequency, high-reliability signals to be transmitted. In a display, there are typically four LVDS channels. These channels are used for the red, green, blue and clock signals in turn, and then the data is transferred serially rather than in parallel.

Managing content Now we know how the screens are set up, let us move to the other side of the application and see how the graphical content is

created. Let’s look first at how the images are stored in memory. We are all now familiar with our holiday photos being stored as a JPEG on our PCs at home. Sadly, this is not the format that is used; the image is saved as a raster image or a bitmap. This is, of course, significantly larger than the JPEG that you use for your holiday photos, so let’s have a look at the way that these images are actually saved in RAM and how much of it you actually need.

As we said, the basic picture is stored as a bitmap, whereby every pixel in the picture is stored and represented by unique data.

There is no data compression, like in other formats. It could be a 16-bit or 24-bit colour depth; for a 24-bit colour, that each pixel would be represented by 3 bytes. You can then immediately see that this means a lot of memory will be used. For example, a VGA screen of 640 by 480 pixels would have 307K pixels, and as such need about 900 KB of data per image on the screen. Sadly, however, the RAM usage story is not over yet.

DESIGN

A typical GUI application will be made up of several picture layers. These layers would be then displayed on top of each other. For example, one layer could be the corporate background image, and the next layer might be a frame around the outside of the picture with some data displayed on it, such as the temperature and the time. A third layer could then be a graph showing real-time measured data in your application. The reason that you store these pictures in different layers, and therefore in different areas of the RAM, is so that you only need to change one small picture rather than re-calculate the whole image. If you needed to re-work the entire GUI every time that the graph was updated or the temperature changed, it would just take too much CPU power.

These layers are then combined together, either by hardware acceleration or by software, using a number of different mechanisms. The two key concepts here are alpha blending and chroma keying. Alpha blending defines what is known as an alpha channel, which is an additional 8-bit value added to the 24-bit colour signal for every pixel.

This alpha value defines the transparency of each pixel such that the layers can be placed as semi-transparent on top of the background layers. Chroma keying is slightly less memory intensive, and is again very useful for combining pictures.

Chroma keying is the special effect which we are all familiar with from the movies, which is also known as “green-screen” whereby the actor stands in front of a green curtain and the green is replaced by a film showing the angry dinosaurs that are chasing him. In the movies, green or blue is used most often as the human skin tones are not affected, but actually, you could use red as well. This effect is really useful for creating different shaped objects, as you can simply use a square and then colour the area around the object with the colour to be removed.

In the previous example, we used a 24-bit colour depth VGA screen and needed 900 kB for the image. Now let us suppose that this image is just the background of the image and that there are two other pictures to be displayed on top of it. There is a graph and the frame that will be the other layers.

These don’t have to be a full screen so in this case we could just use a smaller size image, perhaps QVGA size, needing then 225 KB each, and now the total RAM needed now

DISPLAYs

comes in at about 1.3 MB. Therefore, you have your 1.3 MB of data for the current data that you are showing on the screen, but sadly, you still need a bit more than just 1.3 MB. The problem here is quite simple. If you change a picture, for example, because the background in one screen is different to the one on the next screen, you would have to get the CPU to change the data in the RAM whilst it is still being written to the screen. This causes a visible flicker on the screen and can cause a situation where the screen shows half of one image and half of the next one. This clearly looks poor; especially when we consider that the screen is being added to create a higher value proposition for the end customer.

This issue can be overcome very simply by using a concept such as double buffering. In double buffering, you actually double-up all of the RAM in the system so that the next picture can be set up in the back buffer and then you simply switch from one area of RAM to the next once the picture is ready.

This doubles the RAM use and now we end up with a RAM requirement of 2.6 MB. Now we have RAM filled with 2.6 MB of picture data for our VGA screen with 24-bit colour depth. There are, of course, ways to both scale this up and scale this down. It is possible to take a smaller screen and this will reduce your memory requirement. For every less pixel wide your screen is, you save the 480 other pixels in the column, but the same is true in the other direction too. The XGA screen, which is 720 × 1024 pixels, needs 2.1 MB of RAM for the background image using 24bpp colour depth, rather than the 900 KB of the VGA screen.

The other thing that can been changed is how many bits need to be used for the colour of each pixel. We have used 24-bits per pixel in this example, as it is the most popular choice at the moment. It gives the most flexibility and ensures that the display does actually show what the graphical team would like to be on there. It is, of course, possible to use an 8-bit colour set up, however this brings with it some other issues.

With only 255 colours, there are many issues that will be encountered.

ber of pixels. Even simple letters are made up of an array of blacks and greys so they are easily recognizable to the human eye. It is then possible to use a small screen and an 8-bit colour to display some data, but it is questionable as to whether Steve Jobs would have put the Apple name on your end product! With this in mind, there are a number of options in terms of processor or controller to drive the screen.

The general rule of thumb is that a microcontroller is a good low cost option to drive smaller screens with a lower colour depth; this makes sense up to about QVGA (320 x 240) size, which needs only about 150 KB (using 16bpp) of RAM for the background image. However, above this, very often the bandwidth of the MCU and the performance of the core in the MCU is insufficient to create a truly rich user experience. Thus, above the QVGA size, the standard choice tends to be either an MPU, or a new embedded-MPU, now available from a number of suppliers and is essentially an MPU with the memory embedded in the device already.

In conclusion So in summary, the embedded electronics world is being swept along by the consumer trend of adding a screen to many systems.

This simple step allows OEM’s to differentiate and add value to their end products, but creates a new challenge for design engineers taking their first step into this world.

There are many different options of screen in terms of technology, colour and size. It is also an area where there are many new changes happening on a near daily basis, as the mobile and consumer world continues to drive the display technology in new and interesting directions.

For the engineer newly moving into the arena, the key design criteria to be fixed early in the process is what the screen size will be (measured in pixels), and from there most of the other decisions are relatively simple. If the screen is going to be large, then you will need a lot of RAM and you will need a controller/processor that supports that much RAM, supports that interface and also has sufficient performance to drive it ￭ www.renesas.com

For example, something as simple as displaying text is difficult. Modern fonts are not simply made up of white background and black letters with a width of an exact numwww.epd-ee.eu |

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DESIGN

MCUs

Microcontrollers

Functional Safety for Electronically Controlled Devices

Electronic control mechanisms are increasingly taking control – be it in cars, production, households, or even in the human body. What used to be connected by a mechanical link is handled today by sensors, control devices, signal buses, wireless signals and electrical actuators. Functional safety used to be ensured through mechanical design and dimensioning.

But what about today?

Ralf Hickl, Ileana Keges, Martin Motz,

Product Sales Manager Microcontroller, Product Sales Manager Microcontroller, Product Sales Manager Microcontroller, Rutronik Elektronische Bauelemente GmbH

To protect human lives and their health, program-based electronics must be able to demonstrably and reliably detect errors in real time and, in the event of a fault, establish a safe state within a prescribed time.

This is required by the standards based on IEC 61508. Typical safety-related applications include elevators, heating burner con28

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trol mechanisms, airbags, X-by-wire etc.

Depending on the applicable standard, such applications are classified into various risk groups based on the potential damage or injury in the event of an error, known as Safety Integrity Levels (SIL) or Performance Levels, for example.

In order to meet their requirements, all of

the standards require the implementation of a safety function capable of reliably detecting errors and a strategy that restores the system to a safe condition in the event of an error within the prescribed time. A mathematical reliability model must also be created that enables the calculation of the probability of the system failing and the reliabili-

DESIGN

ty of the safety function. Relevant standards, such as IEC 61508 or industry-specific derivatives of it such as ISO 13849, require certain minimum values for the safety function to be deemed reliable. Adherence to these values must also be demonstrated to a certification body such as the TÜV. In the mathematical reliability model, values for the failure rates of the system components (FIT – failure in time) and the test coverage of the self-diagnostics are required for failures to actually be detected in the first place. Empirical data for failure rates is specified, for example, in the standard SN 29500 from Siemens, and is provided by component manufacturers. On this basis, the system's mathematical reliability model provides the data that can be used to document the safety aspects required by the standards for the certification bodies.

Developers face the challenge of acquiring reliable figures for FIT rates and the diagnostics coverage rate. For example, there are plenty of memory tests – but which share of all possible memory faults can they detect?

And how can this be proven? Some microcontroller manufacturers have addressed such needs and offer support: Renesas Safety Ecosystem Renesas has developed a self-testing library certified by TÜV Rheinland in accordance with IEC 61508 for the RX631/N 32-bit microcontroller range. This self-diagnostic function covers random, persistent errors in the CPU core, including floating point units

MCUs

and DSP extension, in user RAM and in flash memory. The diagnostic coverage provided by such functional units is more than 90%.

The tests can be performed cyclically as a block or in time segments during runtime.

SIL2 is achieved with a RX631/N, while a two-chip system is required for SIL3.

Renesas also supplies a safety manual and safety software manual with the library. A free-of-charge evaluation license enables users to see the library for themselves before buying it.

The safety ecosystem for the RX series also includes an IEC 61508-certified compiler from IAR, the EWRXFS. Renesas used this to develop its self-testing library. Drive system specialist Wittenstein also offers a certified real-time operating system for Renesas' RX series microcontrollers in the form of SAFERTOS. The use of such pre-certified software modules provides a good basis for the certification of the end devices and shortens the development time. The safety manual states the FIT rates and breaks them down into the chip's individual functional units, which enables the reliability model to be finetuned. Also, previously approved components reduce the number of issues to be discussed with the certification body. All this contributes towards reducing the time to market-readiness.

Instead of using the CPU method of software self-testing, Renesas' V850E/P and RH850/P series use dual cores that process

the same code in lockstep. The processing results are compared, with differences recognized as errors. The target applications V850/RH850 are in the automotive industry.

Infineon PRO-SILTM: Safety Solutions for Automotive and Industrial Applications Infineon offers an entire product range of microcontrollers, power supply ICs, sensors, three-phase drivers and associated software and documentation (FMEDA safety manual = Failure Mode, Effects and Diagnostics Analysis) under the PRO-SILTM brand. The development organization and processes, both at hardware and software level, are audited on the basis of ISO 26262.

The latest addition to the PRO-SIL™ product family is the AURIX™ range, including safety software and the appropriate TLF35584 power supply. It enables the establishment of a system solution that users can use to simplify the creation and certification of safety-critical applications. The scope within which it can be used ranges from traditional automotive applications to transport systems such as trains, buses or utility vehicles used in agriculture or construction to safetycritical industrial applications.

The AURIX™ range is highly scalable in terms of memory, processing performance and packaging, consumes little power and has an optimized safety concept. In order to detect possible errors early, the CPU cores have a backup core running in the background that concurrently performs the same calculation processes with an offset of two cycles before calculating the results. As a great many safety functions are implemented in hardware, this enabled Infineon to greatly reduce the software load for the user.

A safety certification process is currently being conducted by TÜV SÜD on the basis of ISO 26262. Further certifications are planned, among them more generalized standards such as IEC 61508 as well as specific standards such as ISO 25119 for agricultural vehicles.

STMicroelectronics: Dual-Core Microcontrollers for ASIL D Applications Specially for functional safety applications in automotive electronics, STMicroelectronics has developed and certified the SPC56 L dual-core microcontroller family on the basis of the IEC 61508 and ISO 26262 safety standards. www.epd-ee.eu |

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DESIGN

MCUs

It has two high-performance cores with up to 2 MB flash memory, 192 KB internal RAM, three CAN interfaces and optimized peripheral features for safety and motor control applications. Thanks to the dualcore architecture, fewer components need to be duplicated, which reduces the cost of the systems. The architecture also provides the user with a great deal of flexibility, because they can switch between lockstep and parallel processing mode. The simultaneous processing of identical code in both cores (lockstep) provides maximum safety, while processing using different code (parallel processing) provides the best performance possible.

ment their application in accordance with the IEC 60730 standard. Depending on the safety requirements of the application, there is a whole range of tests available for implementation: CPU register tests, program counter tests, variable memory tests, invariable memory (Flash/EEPROM) tests, interrupt tests and clock tests.

monitoring of the CPUs. Documentation provides the relevant parameters for the reliability model. However, the safety requirements that apply to the system must be specified. It is always advisable to clarify beforehand whether the package from the manufacturer optimally meets your own requirements.

Such pre-certified solution modules from various manufacturers shorten the development and certification phase.

Their purpose is to achieve a certain rate of diagnostic coverage for the microcontroller with the help of software libraries or mutual

A distributor like Rutronik may assist his customers with independent and comprehensive support ďż­

Not only are the functions of the CPU duplicated, but additional redundant systems are provided on the chip, enabling the safety concept of the SPC56 L line to offer more than the usual approaches. In addition to automated hardware diagnostics, there are other safety functions available, among them a CRC unit, memory with ECC, a temperature sensor, a central error detection and control unit, voltage and cycle failure detection. The SPC56 L line therefore meets the requirements of the most sophisticated ASIL level ASIL D – something already certified by an independent certification body.

The 32-bit automotive microcontroller SPC56 L line is part of the SPC56 range, used in automotive drive trains, bodywork, chassis work and safety. All products are based on e200 cores with 32-bit Power Architecture technology, embedded flash and application-optimized peripherals.

Microchip Safety Software Library Microchip offers the Class B Safety Software Library for 8-bit, 16-bit and 32-bit microcontrollers. They include a number of "APIs", whose purpose is to detect malfunctions, increase the safety of the application and thereby help the development to imple30

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Rutronik www.rutronik.com

PRODUCT NEWS

AUTOMATION

Cost-effective safeguarding with Safetinex Type 2 from Contrinex During semi-automated heat staking of assemblies for domestic white goods, manufacturers use light curtains to preserve operator safety without compromising production throughput.

The active optoelectronic protective device (AOPD), mounted directly in front of each bench-mounted heat-press, prevents the press-head from descending if it detects any intrusion in the working area, halting the operating cycle immediately.

• Non-contact operating principles • Excellent safety rating to EN/ISO 13849-1 Cat. 2 PL c and IEC 61508 SIL 1 • AOPD (active optoelectronic protective device) with aluminum housing and M12 cable connector

Customer value • Cost-effective, active safeguarding • Improved workplace ergonomics • Increased productivity arising from unimpeded loading and unloading • Industry-standard interface requires minimal modification to control systems Advantages of Type 2 light curtain YBB-30S/R2-0800-G012 • Permanent autocontrol not usually found on Type 2 safety devices • IP65 and IP67 protection

Tel. +40 256-201346 • office@oboyle.ro • www.oboyle.ro

AUTOMATION

New models available for Pizzato NG Safety Switches NG Series RFID safety switches with guard locking keep on developing: during the SPS IPC Drives Italia 2015 Pizzato Elettrica presented new versions that guarantee a higher versatility and increase the possibilities of application.

The Customer has the opportunity to choose between two different activation modes of the safety outputs: active with guard closed and locked (Mode 1) for machines with inertia, or active with guard closed and unlocked (Mode 2) for machines without inertia.

Some of the new models are provided with EDM (External Device Monitoring): the switch automatically checks the correct functioning of external devices connected to the 32

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safety outputs such as relays or contactors, providing a feedback signal at the EDM input and verifying the coherence between EDM signal and state of the safety outputs.

Pizzato Elettrica also introduces non-reprogrammable versions: suitable for applications where customers require a device preventing the reprogramming of the associated actuator and switch.

The main news of the NG safety switches are:

• Two different activation modes of the safety outputs • EDM function • Non-reprogrammable version • TÜV SÜD approval for applications up to SIL 3, PL e and cat.4

• Tel. +40 256-201346 • office@oboyle.ro • www.oboyle.ro

PRODUCT NEWS

Leuze n n n

Optical sensors Sensors for logistic applications Safety at work

SENSORS

ASM n n n

GMW

Linear Sensors Angle Sensors Tilt Sensors

n n n n

Contrinex n n

Optical Sensors Inductive Sensors

Selec n n n

Digital panel meters Panel indicators Bus bar isolators Current transformers

Industrial connectors

PLCs Temperature Controller Timer

n n n n

Circular connectors M8; M12; M23 Cable and Connectors for Sensors Valve Connectors Distribution Blocks

Special Approvals

Sensor Instruments n n n

Color Sensors True Color Sensors, Spectrometers Gloss Sensors

Kobold n n n

Flowmeters Level Indicators and Switches Pressure Sensors and Switches

n

IP69K Tel. +40256201346 office@oboyle.ro www.oboyle.ro

AUTOMATION

RFID read/write modules with USB Builders of low frequency RFID systems can now enjoy the practical advantages offered by read/write modules with USB

connection, which were previously only available with high frequency systems. Advantages include the possibility of direct

connection to a PC, without the need for an adaptor.

All Contrinex USB read/write modules, whether for low or high frequency, are fully compatible with ConID LF/HF DEMO software. This software is the ideal professional tool for RFID program development, demonstration and training. With its userfriendly screen and intuitive control, it ensures access to individual components and detailed analysis of frames. It is downloadable

free-of-charge. Like the high frequency types, the new low frequency USB read/write modules are available in M18 and M30 sizes, non-embeddable.

All devices have a stainless steel housing with plastic sensing face and status LED.

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PRODUCT NEWS

SENSORS

Leuze packaging sensors Foil, cardboard, glass - coloured, glossy or transparent?

Of course we can detect them!

Regardless of what you package – we are sure to have the right sensor!

There exists a near endless variety of packaging and packaging materials. Whether foil, cardboard, glass, paper or metal, glossy or structured, opaque or transparent, we have proven sensor solutions for nearly every application. We place great value on usability during our product development. This also includes the greatest possible flexibility for adapting the devices to rapidly growing requirements without any additional adjustment work.

When it comes to matters related to packaging, you've come to the right place: ￭ Extensive product portfolio especially for the packaging industry ￭ Decades of application know-how in the entire packaging process for a wide range of industries ￭ Competent specialists are always available to answer your questions Reliably detect even transparent media The detection of transparent media is one of the supreme disciplines in sensor technology. With the 3B, 55 and 18B series, we have a whole range of devices in our product line specifically for this purpose.

Quickly detect self-adhesive labels Regardless of shape, regardless of material, regardless of whether matte or glossy surfaces. With our forked sensors of the 61, 63 and 14 series, we offer a perfect product line for every conceivable application.

PRK 18B Retro-reflective photoelectric sensor

NEW: GSU 14D Ultrasonic forked sensor

NEW: KRT 21 Contrast scanner

• Calibrated aBEAM optics completely replace time-consuming alignment • Integrated threads make mounting particularly simple • Precise repeatability thanks to a jitter time of just 40 μs • Nickel-plated metal housing is extremely robust and is also ideally suited for hygiene applications

• Easy Teach function for very simple set up of the sensors • Large mouth width of 4 mm also enables the detection of booklets or foldouts • ALC (Auto Level Control) automatically readjusts the sensitivity and ensures maximum function reserves

• High-strength plastic housing with metal threaded sockets • Scanning range 9 mm • RGB LED light source • Response time 33 μs • Switching frequency 15 kHz • Changeable optics for adapting to the installation conditions

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Reliably detect arbitrary print marks Arbitrary colors of backgrounds and print marks and, in some cases, very small print marks place special demands on the contrast scanners used, such as KRT 3B, KRT 55 and KRT 21.

PRODUCT NEWS

SENSORS

49c series from Leuze High performance means functional reliability Even in times of constant increases in efficiency, the old rule "the more the better" holds true. Especially when it comes to, e.g., a reduction in system failures with increasing soiling, large operating ranges or the reliable detection of special materials, more power also always means more performance reserve and, thus, more reliability. For these areas of application in particular, we have a range of solutions on hand that use more power to help provide more success.

One sensor for 20V to 250V – The new 49c series from Leuze Great emphasis was placed on flexibility and reliability during the development of the SR 49C. An innovative housing design with terminal compartment at the front as well as a number of technical details make mounting, alignment and operation simple and stand for our claim of easyhandling for all devices.

Does your sensor need to function reliably to -40°C? The new plastic housing and the optional optics heating also facilitate use in extreme temperatures, e.g., outdoors.

Does your sensor need to be easy to wire from the front?

With the innovative terminal compartment on the front of the sensor, mounting is no problem, even in constricted spaces or in corners.

Does your sensor need to detect reliably even in the event of soiling?

Automatic sensitivity adjustment (ALC) automatically readjusts the sensor and prompts for cleaning before the system fails.

Do you want to use your sensors flexibly, even over long cable lengths?

The sensor operates in a voltage range from 20V to 250V with range-independent performance adaptation and can, thus, even be used over long distances to the PLC.

PRK 49C Retro-reflective photoelectric sensor

IS 212 Inductive switch

SR 49C Photoelectric sensor

The new AC/DC 49C series with a voltage range from 20V to 250V for distances of up to 24m and front terminal compartment for lower space requirements.

Cylindrical AC/DC sensor with an operating range of 10mm for the reliable detection of metal objects that cannot, or can only with difficulty, be detected using optical means.

Transmitter/receiver device models with an operating range of up to 120m for special areas of application.

ELECTRONICS

Pole coil winding goods for BLDC motor from HAHN The BLDC motor (brushless DC motor) is constructed as a three-phase synchronous machine whose efficiency exceeds 85%. It is characterized by its long life and smooth running.

Applications of BLDC are e.g. drives for fans and household appliances and compressors, model airplanes, electric actuator in the form of servo motors to drive systems for machine tools. In addition, the BLDC motor meets the ErP guidelines. It is used for establishing requirements for the eco-design of energy related products (ERP). This is what brings the efficiency of energy of motors, with regard to the environment and soaring energy

costs, more and more into focus. The energy efficiency of engines can be improved by: • The use of dynamo sheet with improved magnetic properties • Improving the cooling in the engine • Reduction of production tolerances • Reduction of losses in the pole windings by • Optimization of winding structure / winding execution With regard to the last point, the winding task, HAHN can rely on over 45 years of experience in production of coiled products.

From the beginning, HAHN relies on high product quality, innovation and progressive,

solid expansion of production.

HAHN is distributing more than 100,000 pieces per day worldwide.

Due to our supportive development activity, we have experience in the coil construction, which is of significant importance for new developments. Together with our customers we bring this experience into their new projects in the field of coil design for BLDC motors.

• Tel. +40 256-201346 • office@oboyle.ro • www.oboyle.ro www.epd-ee.eu |

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PRODUCT NEWS

AUTOMATION

Hydraulic Force Transducers from TECSIS Leakproofness Guaranteed for Five Years Hydraulic force measurement is an easy possibility to measure and display forces in a variety of applications.

The force measurement utilises the hydraulic principle: The force applied to a piston

generates a hydraulic pressure, which is displayed with a manometer. tecsis offers a vari-

ety of hydraulic force transducers with nominal forces range from 100 N up to 3000 kN, which enable easy force measurement even under rough environmental conditions.

Applications for the hydraulic force transducers can be found in apparatus engineering, mining, test and measurement equipment and special mechanical engineering.

For their hydraulic force transducers tecsis now prolonged its leakproofness guarantee to five years. In the unlikely event of a leakage the transducers will be repaired free of charge.

The company demonstrates how much it trusts in the quality of its own products.

• Tel. +40 256-201346 • office@oboyle.ro • www.oboyle.ro

AUTOMATION

Tecsis pressure switches S2400, S2410, S2420, with Display and Analog Output The pressure switches SC400 / SC410 / SC420 with display provide continuous pressure monitoring and configuration of the set points without pressurising.

It is easy to configure the switching point and reset point without pressurising or to change the type of contact (NO / NC), damping, delay and n - / p switching. In addition, autho-

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rised personnel can quickly and easily access the user menu to alter the switching points. The analogue signal of S2410 and S2420 can be scaled from 20 % ... 100 % of the range. Switching currents from a few μA up to 500 mA can be switched by the output transistors.

By use of long - term tested ceramic or thin film sensors, this pressure switch features a high repeatability and durability, even in the case of a large number of pressure cycles. The turnable display and the turnable process connection (optional) allows the usage of this pressure switch even under difficult installation conditions.

The high - quality stainless steel

| www.epd-ee.eu

housing qualifies the SC400 / SC410 / SC420 also for the usage under adverse conditions.

For the higher pressure ranges all wetted parts are made of stainless steel, therefore working with almost every media. The Tecsis SC400 / SC410 / SC420 are multifunctional applicable for measurement tasks within hydraulic and pneumatic applications.

Features • Sensing element ceramic or thin - film • Repeatability 0.2 % • Switching points, reset points and switching function (NO / NC) and switching output (pnp / npn) configurable

• Configurable analogue output • Integrated password protection • Adjustable attenuation of the output signal and delay of the switching outputs • Min - / Max - memory Adjustment range: • 1 ... 700 bar

• Tel. +40 256-201346 • office@oboyle.ro • www.oboyle.ro

PRODUCT NEWS

SENSORS

Semiconductor sensors from Panasonic can handle pressures from very low to very high Panasonic Automotive & Industrial Systems has introduced a broad range of highprecision, miniature semiconductor pressure sensors that can handle pressure. They are available with built-in amplification and temperature compensation cicuitry (PS-A units).

beds as well as in other pneumatically operated pressure devices.

And the low-pressure types can be used for water level detection in household washing machiens and dishwashers, air pressure control in clean rooms and medical respiratory pressure measuring instruments.”

Precision sensors without amplifier and open wheatstone measurement bridge are also available and in ultra-miniaturised sizes (PS). There are also versions with chamfered pins for improved ease of DIP pin insertion into PCBs.

The PS and PF sensors come in two versions. The standard type with a glass base is for pressures from 4.9 to 980.7kPa and the economy type without a glass base for 40kPa. The PS models have a footprint of 7.2 by 7.2mm.

The PS-A units come in three types. The standard type with a glass base can handle pressures from ±100kPa to -1000kPa with a total accuracy of ±1.25%. The economy type without a glass base is for 40kPa pressures and ±4% accuracy and the low-pressure version is for 6kPa and ±2.5% accuracy. Footprint is 7.0 by 7.2mm (10.4 by 10.4mm for the low-pressure type).

“In the PS version, a high degree of precision and linear detector response has been achieved by applying the semiconductor strain gauge system,” said Alexander Hoch. “This makes them high reproducible based on repeated pressure.”

“The PS-A units can be used in pressure switches and pneumatic devices in industrial applications,” said Alexander Hoch, Team Leader Product Marketing Department at Panasonic: “They also have medical uses in bloodpressure monitors, compressed air pressure measurement and air

Taking their place alongside the standard 5kΩ bridge resistance models are PS units with a 3.3kΩ resistance, which is optimally suited to 5V drive circuits.

Applications for the PS units include industrial pressure switches and pneumatic devices and medical blood pressure measurement.

PAISEU http://eu.industrial.panasonic.com

Sensirion’s microthermal mass flow meters for G4 and G6 smart gas meters Sensirion presents two new versions of the SGM70xx mass flow meter modules for G4 and G6 gas meters. These microthermal gas meter modules enable realtime gas flow monitoring and come with the additional advantages of high-level reliability and long-term stability.

Onboard software in the mass flow meters guarantees precise gas quality compensation.

As a result, the Swiss company Sensirion has further consolidated its expertise in the smart energy sector.

Until now, microthermal gas flow modules from Sensirion were available for G1.6 and G2.5 gas meters.

Like the other versions of the SGM70xx series, the latest modules for the G4 and G6 gas meters stand out with high-level reliability, long-term stability and resistance to dust and dirt. Apart

from this, they feature a standard connection and an I2C interface.

The compact design permits easy integration into gas meters.

The mass flow meters are digital, temperature compensated, pressure corrected and completely calibrated for gas and natural gas. Finally, the SGM70xx comes with software and hardware approved by the

GWI (Gas and Heating Institute) to compensate for different types of gas mix. If required, the gas meter module is also supplied with European NMI component certification.

SENSIRION www.sensirion.com

ON Semiconductor’s latest BSI technology delivers best-in-class performance for automotive ADAS and viewing cameras ON Semiconductor is expanding its highly-regarded 1/3-inch 1 megapixel (MP) image sensor portfolio with early sampling of the company’s first backside illuminated (BSI) sensor technology for the automotive imaging market. The innovative new sensor technology delivers 4x better low light signal-tonoise ratio, a 40 percent increase in visible light sensitivity, and greater than 60 percent improvement in near infrared (NIR) performance than the current market leading AR0132AT CMOS image sensor for advanced driver assistance systems (ADAS). The first product to incorporate this new technology will be the AR0136AT 1/3inch optical format CMOS digital image sensor with 1280 × 960

resolution, and 3.75 micron BSI pixels (p). The AR0136AT supports linear and high dynamic range (HDR) modes, in a single chip HDR solution, with a 120

decibel (dB) dynamic range in HDR mode. It has an output pixel rate of 74.25 MP/second (maximum), which results in a frame rate of 45 frames per second (fps) at 960p resolution and 60 fps at 720p resolution.

ON SEMICONDUCTOR www.onsemi.com

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PRODUCT NEWS

ACTIVE COMPONENTS

Digi-Key Partners with ARM University Program to Offer 'Lab-in-a-Box' for Participating Universities Worldwide Global electronic components distributor Digi-Key Electronics, announced their partnership with the ARM University Program (www.arm.com/support/university) to distribute the innovative 'Labin-a-Box' (LiB) to higher educational institutions around the globe. The LiB contains ARM-based technology and high quality, rigorous training materials that support electronics and computer engineering courses. Since its launch in February 2014, ARM LiBs have been successfully deployed in hundreds of universities worldwide, enabling an easy migration path for academics wanting to upgrade their existing curricula to state-of-the-art technologies from the vast ARM eco-system.

New White Paper: How Next-Generation Power Modules Simplify Power Design A new white paper from Maxim Integrated Products, Inc. examines how a new generation of flexible, easyto-use power modules simplifies power design. Ready-made power modules enable system designers to shorten time to market and solve space constraints on their printed circuit board (PCB).

The white paper, “Next Generation Power Modules Further Simplify Power Design,” explains how these highly efficient power modules integrate all the key components needed for a smaller system-inpackage (SiP) power solution. Using Maxim’s new DC-DC power modules, customers can now combine the passive compensation components needed with the voltage regulator for a single, small, power-supply solution in an

IC package.

• Register for the white paper to learn about the benefits of smaller, simpler, and more flexible power modules: http://goo.gl/S9aiy0 • For a list of Maxim’s new power modules, visit: http://goo.gl/AaT93e • For more information, visit: http://goo.gl/XvYUqI All trademarks are the property of their respective owners.

MAXIM INTEGRATED www.maximintegrated.com

XP Power leads the industry with 95% efficient 225 Watt AC-DC supply in a 2” × 4” package The Lab-in-a-Box package includes hardware development boards, professional software licenses from ARM, and complete teaching materials from the ARM University Program ready to be deployed in classes. These include lecture note slides, demonstration codes, lab manuals and projects with solutions in source.

“Digi-Key is an excellent partner for distributing the full bill of materials of our education kits to a larger customer base worldwide," said Khaled Benkrid, Manager, Worldwide University Program, ARM. "This is an important initiative for the ARM University Program as it offers convenient access to the hardware components that go hand in hand with our teaching materials. This is integral to our mission of equipping tomorrow's engineers with the necessary tools to drive the creation of exciting and intelligent products that transform society."

The Program provides a variety of teaching materials, hardware platforms, software development tools, IP, and other resources for many academic courses including efficient embedded systems design and programming, SoC design, operating system design, and digital signal processing . Other Program initiatives include Professor Workshops, online teaching/training videos, design contest sponsorships and research support.

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XP Power today announced the EPL225 series of high efficiency open frame AC-DC power supplies approved for industrial, IT and medical applications. The series comprises seven single-output models that offer a range of standard output voltages from +12 VDC to +48 VDC. A secondary 12 VDC / 0.5 A fan output is provided across the range. Packaged in an extremely compact low profile 2 × 4 inch industry standard ‘1U’ footprint (50.8 × 101.6 × 32.3 mm) the series has a convection cooled output power rating of 150 Watts which is believed to be “best in the industry” for a power supply of this footprint. Output power of up to 225 Watts is available with only 10 CFM of forced airflow.

The EPL225 series offers a minimum average efficiency of 93% and a maximum efficiency of 95% resulting in less heat to dissipate and a cooler running unit, the later contributing to a more reliable longer-life power supply. The series complies with the universal safety standard EN 60950-1 for IT equipment in addition to the medical safety standards ANSI/AAME/ 60601-1 and

IEC/EN60601-1 3rd edition. With low conducted and radiated noise the units meet the standards EN55011 & EN55022 for Class B conducted and

Class A radiated EMI specifications.

The EPL225 suits use in a broad range of operating environments with an extended temperature range from -20 to +70°C and no derating until +50 °C. XP POWER www.xppower.com

PRODUCT NEWS

ACTIVE COMPONENTS

Rochester Electronics adds End-Of-Life Support for Freescale MC68040 MPUs Extension-of-Life® Inventory and Continuing Production for MC680x0 Family Derivatives including 68020, 68030, 68040 and the 68060. Plus ability to support 68882 floating point co-processor and 68360 companion chip.

Rochester Electronics has been licensed by Freescale to provide a continuing manufacturing solution for the Freescale MC68040 32bit microprocessor product family. Freescale announced the discontinuation of the 68040 devices and will be shipping the last products they will produce until November 2015. The agreement between Freescale and Rochester provides customers of the popular legacy MPUs with access to a secure and reliable source of parts for continued product supply.

Rochester Electronics is fully stocked with original Freescale packaged parts and silicon die from which it will manufacture a variety of device options. The company’s experience as the world’s largest continuing manufacturer and long-term aftermarket support solution for end-of-life, obsolete and discontinued semiconductors places it in the ideal position to guarantee supply of these parts. Freescale has also provided access to full design and test IP, making it possible for Rochester to continue manufacturing products even if all existing wafer stocks are exhausted.

In addition to the 68040 family, Rochester legacy support includes 68020, 68030, 68060 and the 68882 floating point coprocessor. Freescale will also be supporting Rochester on the supply of the MC68360 QUICC communications processor, which went EOL at the end of April.

The MC680x0 family has been widely adopted in sectors including military, aerospace, transportation, medical, industrial and communications, all of which are characterized by long installed product lifetimes and the need for extended availability of component parts. Rigorous qualification and standards approval processes can make redesign of systems in these areas either difficult or prohibitively expensive.

Discussing the cooperation with Freescale, Chris Gerrish, President, Rochester Electronics said: “The MC680x0 family of products has been and will continue to be critical to many systems with long product life cycles. Rochester’s capability to continue production of a Freescale licensed and authorized solution will save customers immeasurable redesign costs, time and effort. Our inhouse design, assembly and test operations allow for smooth continuous indefinite production and supply”.

ROCHESTER ELECTRONICS

www.rocelec.com

Renesas Electronics ADAS Starter Kit Accelerates Vision-Based ADAS Application Development Renesas Electronics introduced the smallest R-Car-based development kit to date – the ADAS Starter Kit – based on Renesas’ highend R-Car H2 System on Chip (SoC) and developed to help simplify and speed up the development of advanced driver assistance systems (ADAS) applications. Complementing Renesas’ current R-Car V2H-based ADAS development boards, the new ADAS Starter Kit will enable users and partner companies to experience the enhanced computer vision performance of Renesas SoCs and accelerate the development of dedicated hardware and software solutions for future ADAS applications.

The ADAS Starter Kit provides cutting-edge computer vision performance with OpenCV and high-performance graphics power based on OpenGLES, allowing customers and partners to develop their ADAS applications on a robust and high-performance platform. The new kit is powered by Linux, based on the Yocto distribution that is also used for other R-Car evaluation boards.

The new starter kit is the smallest Renesas R-Car development kit to date, measuring only 10x10cm, and features pre-implemented interfaces and peripherals, which eliminates the need for any additional hardware. The core board comes with 2 GB of DDR3 RAM, 64 MB of QSPI flash and a Micro SD card slot. This small form factor board also includes Ethernet, an HDMI output and a connector for a camera module. With the integrated extension connector, it is designed for easy customization. Users can easily design addon boards that enable new use cases with little effort. The extension connector supports interfaces like PCI Express (PCIe), further display outputs, and four channels for cameras as needed for surround view applications.

About Renesas R-Car H2 SoC The new ADAS Starter Kit features Renesas’ successful R-Car H2 SoC, which is capable of delivering more than 25,000 DMIPS and provides state-of-the-art 3D graphics capabilities and powerful vision processing cores. The R-Car H2 is powered by the ARM® Cortex™A-15 quad-core configuration running an additional ARM® Cortex™A-7 quad-core. It also features the Imagination Technologies PowerVR Series6 G6400 Graphics Processing Unit (GPU). This GPU supports open technologies, such as OpenGL ES 2.0 and the OpenGL ES 3.0 standards. Renesas' IMP-X4 core provides real-time image processing that enables system manufacturers to support computing intensive vision operations. OpenCV support for IMP-X4 will also be offered. The R-Car H2 also supports up to four independent input camera channels, allowing easy implementations of 360° camera views and object recognition – to cite just one example of the possible driver assistance functions. With these features, the R-Car H2 offers the highest level of integration of advanced safety concepts and enables developers to implement high performance ADAS features.

RENESAS ELECTRONICS EUROPE www.renesas.eu www.epd-ee.eu |

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PRODUCT NEWS

ACTIVE COMPONENTS

Murata shrinks 1 W DC/DC converter footprint by 34% Murata announced the MTC1 series of 1 Watt regulated single output DC/DC converters manufactured by Murata Power Solutions. These miniature isolated devices are available with nominal input voltages of 12 or 24 VDC and accommodate a 2:1 input range around the selected nominal. Having such a wide input range allows for use in designs with different nominal input voltages or in situations where wide voltage deviations might occur.

The range comprises six single output models providing 3.3, 5 or 12 VDC for both the 12 and 24 VDC nominal inputs. No additional regulation components are required since the MTC1 output is fully regulated to within ± 0.5% of stated output.

A voltage trim pin allows adjustment of the output voltage by ± 10% to suit any special voltage requirements.

A remote on/off pin provides the ability to disable the output for application power saving.

Input to output isolation conforms to the international safety insulation standard UL60950 (Pending). With its certification to the medical safety standard ANSI/AAMI ES60601-1 for 2 MOOPs the converter is suitable for use in a wide range of medical and healthcare applications.

Occupying 34% less PCB area that competing parts the MTC1 can operate up to 105 degrees C with derating.

Ann-Marie Bayliss, product marketing manager of Murata Power Solutions comments, “The MTC1 with its 34% smaller footprint, UL60950 reinforced insulation and 3rd edition medical safety standard compliance offers enhanced product features in a miniature package.”

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Huawei Boosts Smartphone 4G Reliability and Performance with Lattice Semiconductor Tunable Antenna Solution Lattice Semiconductor Corporation announced its new iCE40 LM FPGA is integrated in the new Huawei P8 flagship smartphone to enable optimal 4G reception. Huawei will continue to use Lattice’s low latency, tunable antenna controller in other devices using its Kirin 930 chipset.

The Signal+ technology in Huawei’s P8 uses the iCE40 LM FPGA to automatically optimize 4G reception for multiple RF conditions. The resulting antenna solution is 80 times faster than other options, providing reception quality that is 40 percent better than Huawei’s competitors in the poorly covered or congested RF environments frequently found in both high-density cities and rural areas with limited reception.

Huawei put considerable effort into designing the P8’s attractive one-piece aluminum body, and the Lattice tun-

able antenna controller helps it achieve optimal RF performance and overcome the inherent RF quality issues of metal casings. The iCE40 LM

device performs as the bridge between the Kirin 930 application processor and tuner integrated circuit to minimize latency during an antenna switch, also saving system power.

LATTICE SEMICONDUCTOR www.latticesemi.com

Industry’s Lowest Power 3.3V PCIe Clock Generators from IDT Now Shipping from Mouser Mouser Electronics, Inc. is now shipping the 9FGL PCI Express (PCIe) Clock Generators from Integrated Device Technology (IDT). The 9FGL family of clock generators are members of IDT's 3.3V low-power PCIe series and support both Common Clock (CC) with or without spread spectrum and Separate Reference noSpread (SRnS) PCIe clocking architectures. Operating at 120mW and 130mW power consumption respectively, the 9FGL06 and 9FGL08 generators are the lowest power 3.3V PCIe clock generators available, eliminating thermal concerns in high-performance consumer devices.

The IDT 9FGL PCIe Clock Generators, available from Mouser Electronics, are low-power clock generators that generate low-power HCSL differential clock outputs in either 6-output (9FGL06) or 8-output (9FGL08) forms. All 9FGL clock generators feature support for two different spread spectrum levels plus an off function (0% spread). Direct connections to transmission lines and small 40-pin, 5mm × 5mm (9DFGL06)

or 48-pin, 6mm × 6mm (9FGL08) VFQFPN packages reduce required board space and BOM costs. The 9FGL0641 and 9FGL0651 devices contain default configuration, and the 9FGL06P1 and 9FGL08P1 devices can be programmed with a user-defined power up default SMBus configuration.

These SMBus-selectable features allow optimization options including control input polarity, control input pull up/downs, slew rate for each output, differential output amplitude, 33 , 85 , or 100 ohm output impedance for each output, and spread spectrum amount.

MOUSER ELECTRONICS www.mouser.com

PRODUCT NEWS

ACTIVE COMPONENTS

Mouser Now Shipping STMicroelectronics STEVAL-ISA162V1 Evaluation Board

Melexis Launches QVGA ToF Imaging Evaluation Kit

Mouser Electronics, Inc. is now stocking the STEVAL-ISA162V1 Evaluation Board from STMicroelectronics. This new evaluation board implements an isolated flyback (12V/0.84A) 10W widerange mains developed for general-purpose applications. The core of the application is the VIPer25HD, an off-line, high-voltage converter from the ST’s VIPerPlus family.

Melexis, a global microelectronics engineering company, has strengthened the support offered for its ground-breaking time-offlight (ToF) sensing technology. The EVK75023 evaluation kit accompanies its MLX75023 QVGA (320x240pixels) resolution ToF sensor with high dynamic range DepthSenseTM pixels. This new hardware platform enables implementation of more advanced human machine interfaces (HMIs).

Co-developed in association with Melexis technology partner BlueTechnix, the EVK75023 is a compact (130mm x 105mm x 60mm) board for assessment of ToF sensing capabilities under even the most challenging of application conditions, where the detrimental influence of ambient light variations must be addressed. Thanks to the constituent MLX75023 imaging device, it can deal with up to 120klux of background light.

The ST STEVAL-ISA162V1 Evaluation Board, available from Mouser Electronics, includes an onboard VIPer25HD IC with a custom-designed, 800V rugged power MOSFET, current-mode PWM logic, and a zero current detection (ZCD) block for quasiresonant operation. The power MOSFET also integrates a highvoltage startup generator, allowing the IC to connect directly with input mains without requiring a resistor to reduce the voltage.

The VIPer25HD IC operates in quasi-resonant mode with valley switching, enabling low electromagnetic interference (EMI) emission and safe behavior in case of short circuit. The IC features high-level protection including dual-level overcurrent protection, overvoltage and overload protections, hysteretic thermal protection, soft-start, and safe auto-restart after any fault-condition removal.

The STEVAL-ISA162V1 Evaluation Board can help reduce BOM costs and time-to-market when creating solutions such as power adapters for mobile devices, industrial power, and switchedmode power supplies (SMPS) for household appliances.

With its broad product line and unsurpassed customer service, Mouser caters to design engineers and buyers by delivering What’s Next in advanced technologies. Mouser offers customers 21 global support locations and stocks the world’s widest selection of the latest semiconductors and electronic components for the newest design projects. Mouser Electronics’ website is updated daily and searches more than 10 million products to locate over 4 million orderable part numbers available for easy online purchase.

Mouser.com also houses an industry-first interactive catalog, data sheets, supplier-specific reference designs, application notes, technical design information, and engineering tools.

MOUSER ELECTRONICS

www.mouser.com

The EVK75023 has a high bandwidth Gigabit Ethernet interface, through which real-time 3D images are output at frame rates of up to 60fps. These can be used to recognize complex gestures. Via a C-based API or via the Matlab SDK, users can easily develop their own communication interface.

The platform consists four main elements: • A pair of illuminating units - each with a set of 6 LEDs capable of producing a peak optical output of 10W. • A sensor board - incorporating the MLX75023 sensor, a standard M12 lens mount plus objective with a field of view up to 60°, a quad-channel data converter and programmable logic (through which both the sensor and the LEDs are controlled).

• An ARM-based processing board - featuring an i.MX6x Freescale microprocessor, which is responsible for compiling the acquired ToF data then subsequently communicating this to a laptop, via the Gigabit Ethernet connection, for analysis.

• An interface board - on to which all of these different subsystems are placed.

MELEXIS

www.melexis.com/EVK75023 www.epd-ee.eu |

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PRODUCT NEWS

Lighting Solutions / Display

MTCS-C3 Colorimeter: Test system for LED quality control, color measurement and more The new MTCS-C3 product family enables users to implement their own True Color Colorimeter into lighting, backlight, LED tests, color selection or other applications. The MTCS-C3 is ideal to measure color coordinates (XYZ), CCT or brightness levels.

CIE1931 XYZ Colorimeter board for color testing applications The sensor system is based on the JENCOLOR速 standard components MTCSiCF (True Color sensor) and MCDC04 (Signal converter). The sensor is based on the CIE1931 XYZ color standard, while the signal converter allows an output at 16/20 bit at a dynamic range of 1-to-1,000,000. The Evaluation Kit is prepared for specific customer calibrations.

The JENCOLOR速 True Color sensors and signal ICs are an ideal solution for stabilization of LED light in regards of aging, binning and temperature shifts. Additionally used in industrial color measurement tasks, medial applications and for metrology solutions.

racy - even dimmable high brightness power LEDs at high temperatures (>100属C) and brightness levels can be measured close to

the target. The colorimeter has a micro USB interface and can be directly controlled via Windows software.

Set DK MTCS-C3 test software Sample Image of the Set DK MTCS-C3 test software.

True Color measurement made simple The sensor system is based on the JENCOLOR速 standard components MTCSiCF (True Color sensor) and MCDC04 (Signal converter). Therefore displays can be measured at very low brightness levels and at high accuThe software includes ADC parameters such as gain, integration time, offset correction, and divider options. The values can be individually calibrated to the application and have several output options (color spaces, export functions, etc.) The MTCS-C3 is an ideal solution for LED tests in manufacturing or incoming goods inspection and is a costefficient solution to be utilized at multiple measurement points. A simple user calibration can be performed to the existing LED selection and as soon as color or brightness deviations occur, actions can be taken.

OEM Sensor Baord MTCS-C3 The OEM Sensor Baord MTCS-C3 with USB interface for color measurements based on CIE1931 can be used as stand-alone USB color sensor. Customers can simply place it into their own environment and casing to implement the system as customer-specific colorimeter. The system is prepared for customer calibration and can be delivered directly with specific presets from MAZeT. 42

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Even special features like flicker detection for displays are implemented. For customerapplications, an adaptation of the software is offered or they can use the DLL libraries to develop and integrate their own software solution. The MTCS-C3 is available in 4 versions. As OEM-Board with and without metal casing or as Development Kit including software with or without metal casing.

Only one software license is required to use it for multiple sensors.

MAZeT www.mazet.de

PRODUCT NEWS Rutronik presents Duris S 10 for Solid State Lighting from Osram Duris S 10 is the latest addition to the Chip Array SMD family (CAS) from Osram Opto Semiconductors. This new LED is characterized by high efficiency, high light output and uniform color appearance. It is available at distributor Rutronik as of now.

The new LED’s efficient SMD technology makes assembly simple, leading to significant cost savings in system and optic design. The Duris S 10 is available in two output classes with typ. 1050lm or 1400lm at 3000K. Both have a CRI of 80 and a CCT of 2700K up to 6500K. The forward voltage is 28V or 37V respectively. Both Duris S 10 CAS LEDs are binned according to the familiar MacAdams ellipses, resulting in a more uniform color appearance.

The LED’s light-emitting surface of only 7.7mm in diameter forms the basis for compact optics and extremely narrow beam angles of 120°. Thanks to this small size, the design of the optics is also simpler, making it easier to integrate standard accessories such as lenses and reflectors. The lumen packages are specifically for standard applications such as MR16 retrofits, and enable lamp and luminaire designs to be created on the basis of a single Duris S 10. Therefore, the LED is ideal for use in spotlights, downlights, and directional and omnidirectional retrofits. In view of the surface-mounted design of the LED, a pc board has to be incorporated in the luminaire.

RUTRONIK www.rutronik.com

Lighting Solutions / Display Zytronic’s Projected Capacitive Technology enables @TABLETM from Videofonika Leading developer and manufacturer of advanced projected capacitive touch screen solutions, Zytronic, has supported Videofonika in the creation of their latest touchscreen solution, the @TABLE™. Working with Polish distribution partner, Elatec GmbH, this new interactive multimedia touch table delivers a sleek, contemporary and lightweight device which is ideally suited for innovative showrooms, modern museums and applications in the retail and entertainment industries.

Zytronic’s Projected Capacitive Technology (PCT™) was selected

by Videofonika after a careful study of other competing touch screen technologies. Key to this decision was the responsiveness of Zytronic’s multi-touch sensor and controller and the robust and water resistant nature of the touchscreen.

The @TABLE uses a 42” multi-touch sensor which is fitted with antiglare glass and a printed black border with special icons for rotation and NFC sensors. The custom glass includes sealed joints within the metal chassis which makes the table waterproof. This feature adds to the ruggedness of the device, allowing it to be safely installed in high footfall public spaces, such as restaurants, hotel lobbies or even shopping malls.

ICOP Technology introduces 933 MHz Panel PCs ICOP Technology introduces with the industrial-grade PPC series a new 933 MHz Panel PC family developed to be deployed as lean, low-power HMIs (Human Machine Interfaces). The compact and fully x86 compatible, rugged Panel PC series in metal housing follows the trend towards client/server architectures with central processing clouds and slim, distributed control terminals as well as industrial-grade thin client installations. Application areas are to be found where lowpower designs need industrial robustness and versatile industrial-grade connectivity options at an attractive price point. Target markets are, for example, retail, industrial automation, digital signage and facility management applications, where more complex x86 processors would create greater overhead and costs.

The new fanless Panel PC series with 9 or 15 inch touch screens, metal housing and front IP65 protection is equipped with energysaving low power DM&P Vortex86 processors and is available in various industrial-grade I/O configurations including support of various serial interfaces. Internet of Things (IoT) connectivity is provided by either one or two Ethernet ports or optional Wi-Fi. The Panel PCs support extended operating temperature ranges from 0°C to 50°C or optional -20°C to 60°C. ICOP TECHNOLOGY www.icoptech.eu

Videofonika provide a selection of software application templates which enable @TABLE to be applied to different settings and environments such as trade shows, digital signage, e-banking, and as a help aid for medical applications. A dedicated browser interface enables multiple users to browse the Internet simultaneously on the same touch table.

Sales and marketing manager at Videofonika, Jakub Boni commented on working with Zytronic’s touchscreen technology for @TABLE: “We examined a number of different touchscreen solutions before going with Zytronic. What attracted us was the reliable multitouch performance of their PCT technology and the customised antiglare glass which ideally suited our requirements for the @TABLE”.

ZYTRONIC

www.zytronic.co.uk www.epd-ee.eu |

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INDUSTRY PRODUCT NEWS

The Sirius Act Discover what you can do with Siemens SIRIUS ACT, the newest generation of pushbuttons and signalling devices.

This device offers you unique features for your machines, like: elegantly designed, indicator lights for Push Buttons and switches with a perfect embodiment of intelligence, style and physical toughness.

Push Buttons

• • • • •

Switches

Push Buttons Twin Push Buttons Mushroom Push Buttons Sensor Switches Emergency Stops

• • • • • •

Modern design

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Selector Switches Coordinate Switches Toggle Switches Potentiometer Key-Operated Switches ID Key Operated Switches

Indicators

• •

Easy to use

Elegant product design and high quality material – as a distinguishing system design feature.

•

From configuration to installation: SIRIUS ACT takes the concept of simplicity to the next level.

Indicator lights (Single/Duo LED) Acoustic signaling devices

Extremely rugged

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Reliable. Especially when things get rough. SIRIUS ACT devices ensure reliability for critical operations.

Flexible Communication

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Communication solutions for the field and the control panel.

Source:http://w3.siemens.com/mcms/industrial-controls/en/commanding-devices-signaling/sirius-act/pages/default.aspx

The new Push Buttons, switches and indicator lights have been tested to ensure reliability for your critical operations. The Sirius ACT were constructed with genuine metal and high-grade plastics and were engineered with smart functions and communication capabilities.

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July, 2015

| www.epd-ee.eu

INDUSTRY PRODUCT NEWS

SIRIUS ACT - the latest generation of pushbuttons and signalling devices Sirius ACT is a union of modern design, strength, easy installation and malleable communication.

Features for Sirius ACT: - Design - four design lines with variants tastes and budgets

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• plastic • plastic with metal front ring • metal, shiny • metal, matte, flat Installation - standardized and self-explanatory one-man installation

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Ruggedness - high-level safety even under extreme conditions • highest degree of protection • reliable installation • design stability

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Communication - direct connection to AS-Interface, IO-Link or shortly PROFINET

Several example of Sirius ACT that you can buy from ro.rsdelivers.com 22 MM PUSH BUTTONS - PLASTIC WITH METAL RING RS Stock No. 874-2099 874-1709 874-1702 874-2080 874-2096 874-2106

Mfr. Part No. 3SU1130-0AB20-1BA0 3SU1130-0AB50-1BA0 3SU1130-0AB60-1BA0 3SU1130-0AB10-1CA0 3SU1130-0AB30-1BA0 3SU1130-0AB40-1BA0

Push Button Colour Red Blue White Black Yellow Green

Specifications Body Material Contact Configuration Cutout Diameter IP Rating Maximum AC Voltage Maximum Current Maximum DC Voltage Maximum Operating Temperature Minimum Operating Temperature Mounting Type Push Button Actuation Push Button Diameter Push Button Material Push Button Shape Push Button Style Terminal Type www.epd-ee.eu |

Plastic NO 22mm IP20, IP66, IP67, IP69 500V 10A 500V +70°C -25°C Panel Momentary 29.45mm Plastic Round Flat Screw July, 2015

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INDUSTRY PRODUCT NEWS

22 MM PUSH BUTTONS - PLASTIC RS Stock No. 874-2024 874-1932 874-2020 874-2033

Mfr. Part No. 3SU1100-0AB20-1CA0 3SU1100-0AB50-1BA0 3SU1100-0AB10-1BA0 3SU1100-0AB40-1BA0

Push Button Colour Red Blue Black Green

Specifications Body Material Contact Configuration Cutout Diameter IP Rating Maximum AC Voltage Maximum Current Maximum DC Voltage Maximum Operating Temperature Minimum Operating Temperature Mounting Type Push Button Actuation Push Button Diameter Push Button Material Push Button Shape Push Button Style Terminal Type

Plastic NO 22mm IP20, IP66, IP67, IP69 500V 10A 500V +70°C -25°C Panel Momentary 29.45mm Plastic Round Flat Screw

Specifications Body Material Contact Configuration Cutout Diameter IP Rating Maximum AC Voltage Maximum Current Maximum DC Voltage Maximum Operating Temperature Minimum Operating Temperature Mounting Type Push Button Actuation Push Button Diameter Push Button Material Push Button Shape Push Button Style Terminal Type

Metal NO 22mm IP20, IP66, IP67, IP69 500V 10A 500V +70°C -25°C Panel Momentary 29.45mm Plastic Round Flat Screw

Specifications Body/Fixing Collar Included Cutout Diameter IP Rating Push Button Actuation Push Button Diameter Push Button Material Push Button Shape Push Button Style

Yes 30mm IP66, IP67, IP69K Momentary 38mm Plastic Round Flat

22 MM PUSH BUTTONS – METAL RS Stock No. Mfr. Part No. 874-2125 3SU1150-0AB20-1CA0 874-2121 3SU1150-0AB10-1BA0 874-2131 3SU1150-0AB40-1BA0

Push Button Colour Red Black Green

30 MM PUSHBUTTON HEADS RS Stock No. 874-1667 874-2018 874-1655 874-1664 874-1661 874-2014

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Mfr. Part No. 3SU1060-0JB20-0AA0 3SU1060-0JB50-0AA0 3SU1060-0JA60-0AA0 3SU1060-0JB10-0AA0 3SU1060-0JB30-0AA0 3SU1060-0JA40-0AA0

EP&Dee |

July, 2015

Push Button Colour Red Blue White Black Yellow Green

| www.epd-ee.eu

How can you install?

The unit installation can be done without effort, with only one hand, saving your time.

Visible installation indicators and markups on components reduce the risk of incorrect installation. In the image bellow you can observe how simple and efficient the installation of Sirius Act can be.

Author: Mihaela S창rbu Aurocon Compec

For more information about the products please access ro.rsdelivers.com or contact us by email: compec@compec.ro phone: +40 (0) 213 046 233 / fax: +40 (0) 213 046 234. www.epd-ee.eu |

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