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Market Segmentation in the System in Package (SiP) Technology report
from System in Package (SiP) Technology Market – Industry Trends and Forecast to 2030
by kristen bell
Based on packaging technology, the system in package (SiP) technology market is segmented into 2-D IC packaging, 2.5-D IC packaging and 3-D IC packaging.
On the basis of packaging type, the system in package (SiP) technology market is segmented into flat packages, pin grid arrays, surface mount, small outline packages and others.
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On the basis of interconnection technology, the system in package (SiP) technology market is segmented into flip-chip Sip, wire-bond SiP, fan-out SiP and embedded SiP.
The application segment of the system in package (SiP) technology market is segmented into consumer electronics, automotive, telecommunication, industrial system, aerospace and defense and others. Others have further been segmented into traction and medical.
