Micro Clamp/Wire Clamp/Micro Gripper for Lead Bonding Based on Piezo Ceramics

MicroClamp/WireClamp/MicroGripperforLeadBondingBasedonPiezoCeramics

MicroClamp/WireClamp/MicroGripperforLead

BondingBasedonPiezoCeramics

Leadbondingisamicroelectronicpackagingtechniqueusedtoconnecttinyelectronic components(suchastransistors,capacitors,resistors,etc)toacircuitboardThetechnologyisto usewiretoattachpinsofelectroniccomponentstometalpadsonthecircuitboard.This techniqueiscommonlyusedtomakeintegratedcircuitsandothermicroelectronicdevicesThe metalwiresusedinleadbondingareusuallyverythin,abouttensofmicrons.

ByEncikTekateki-Ownwork,CCBY-SA4.0

Amicroclamp/wireclampfitisrequiredduringleadbonding,anditsroleinleadbondingisto holdandclamptheleadtoensurethattheleaddoesnotmoveortwistduringbondingItis importanttomaintainthepositionandorientationoftheleads,whichensuresthecorrect connectionandperformanceoftheelectroniccomponentsMicroclamps/wireclampsareusually operatedinanautomaticmannerandareplacedatoneorbothendsoftheleadduringthe bondingprocesstoensurethattheleadispositionedandorientedcorrectly

Themetalwireinleadbondingisverythin,thedisplacementoftheclampingactionofthemicro clamp/wireclamp/microclampisrequiredtobeintheorderofmicrons,whichcannotonly ensuretheclampingofthemetalwire,butalsoensurethatthemetalwireisnotdamaged,so thecontroloftheclampingactionisrelativelyhigh.

Basedontheabovereasons,CoreMorrowdesignedamicrogripper-electricclamp/wireclamp basedonpiezoceramicdriveandcombinedwithflexiblemachinery,itisakindofmicro mechanicaldeviceusespiezoceramicsasadrivingelement,controlthedeformationofpiezo ceramicsbychangingthevoltage,soastocontroltheclampingforceofthegripper

CoreMorrowpiezomicrogripperhastheadvantagesofnogap,nofriction,compactstructure, simpleinstallation,nolubricatingoil,etcItisdrivenbypiezoceramics,soithastheadvantages offastresponse,highprecisionandgoodstability.Itcanbeusedinmicroandnanoprocessing, micromanipulation,microassemblyandothermicromanufacturingfields,clampsmallpartsor

devices,toachievesmallsizeprecisionoperation,andhasbeenwidelyusedinthefieldofmicro manufacturing

CoreMorrowprovidecustomerswithavarietyoftypesandparametersofmicro-pressurewire clamp/clampThefollowingareseveralstandardmodels,customercanselectaccordingtothe sizeoftherequiredclampingdisplacement,whethertobeequippedwithclosed-loopsensorand otherrequirements.Inaddition,themicrogrippercanalsobecustomizedaccordingtothe equipmentstructure

1XD002.90KWireClamps/PiezoClamps

MicroClamp/WireClamp/MicroGripperforLeadBondingBasedonPiezoCeramics

Model XD00290K Unit Activeaxes X Travelrange(0~120V) ±40 μm Travelrange(0~150V) ±50 μm Push/pullforcecapacity 10/1 N Unloadedsteptime 07 ms Elcapacitance 018 μF Material Steel Mass 10 g Power-onjawstatus Open

MicroClamp/WireClamp/MicroGripperforLeadBondingBasedonPiezoCeramics

2XD002.150KWireClamps/PiezoClamps

Thismicroclamphasaclosedloopsensor.

3XD002.200SWireClamps/PiezoClamps

Model XD002150K Unit Activeaxes X Travelrange(0~120V) ±60 μm Travelrange(0~150V) ±75 μm Elcapacitance 017 μF Material Steel Mass 87 g Power-onjawstatus Open

MicroClamp/WireClamp/MicroGripperforLeadBondingBasedonPiezoCeramics

Thefollowingarelarge-travelpiezoclampswithrangesupto500μmor1mm.

Ifyouareinterestedinpiezomicroclampsorhaveanyquestionsaboutit,pleasecall CoreMorrowon0451-86268790,17051647888(WechatID)!

Piezoclamp/Piezopliers1 Parameter Travelrange 500μm@150V Elcapacitance 18μF UNloadedresonantfrequency 180Hz Material Titaniumalloy Piezoclamp/Piezopliers2 Parameter Travelrange 1000μm@150V Elcapacitance 36μF UNloadedresonantfrequency 110Hz Material Titaniumalloy Piezoclamp/Piezopliers3 Parameter Travelrange 1000μm@150V Elcapacitance 36μF UNloadedresonantfrequency 90Hz Repeatability 05%FS Displacementsensor Yes Material Titaniumalloy

Model XD002200S Unit Activeaxes X（Closedloop） Travelrange(0~120V) ±80 μm Travelrange(0~150V) ±100 μm Push/pullforcecapacity 4 N Elcapacitance 72 μF Material Steel Mass 305 g Power-onjawstatus close

Turn static files into dynamic content formats.

Create a flipbook