Micro Clamp/Wire Clamp/Micro Gripper for Lead Bonding Based on Piezo Ceramics
Micro Clamp/Wire Clamp/Micro Gripper for Lead Bonding Based on Piezo Ceramics Lead bonding is a microelectronic packaging technique used to connect tiny electronic components (such as transistors, capacitors, resistors, etc.) to a circuit board. The technology is to use wire to attach pins of electronic components to metal pads on the circuit board. This technique is commonly used to make integrated circuits and other microelectronic devices. The metal wires used in lead bonding are usually very thin, about tens of microns.
By Encik Tekateki - Own work, CC BY-SA 4.0 A microclamp/wire clamp fit is required during lead bonding, and its role in lead bonding is to hold and clamp the lead to ensure that the lead does not move or twist during bonding. It is important to maintain the position and orientation of the leads, which ensures the correct connection and performance of the electronic components. Microclamps/wire clamps are usually operated in an automatic manner and are placed at one or both ends of the lead during the bonding process to ensure that the lead is positioned and oriented correctly. The metal wire in lead bonding is very thin, the displacement of the clamping action of the micro clamp/wire clamp/micro clamp is required to be in the order of microns, which can not only ensure the clamping of the metal wire, but also ensure that the metal wire is not damaged, so the control of the clamping action is relatively high. Based on the above reasons, CoreMorrow designed a micro gripper - electric clamp/wire clamp based on piezo ceramic drive and combined with flexible machinery, it is a kind of micro mechanical device uses piezo ceramics as a driving element, control the deformation of piezo ceramics by changing the voltage, so as to control the clamping force of the gripper. CoreMorrow piezo micro gripper has the advantages of no gap, no friction, compact structure, simple installation, no lubricating oil, etc. It is driven by piezo ceramics, so it has the advantages of fast response, high precision and good stability. It can be used in micro and nano processing, micro manipulation, micro assembly and other micro manufacturing fields, clamp small parts or