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Intel Selects Bechtel for Phase I of New Albany Facilities
Intel photo
Bechtel will design and build Phase 1 of the Intel Ohio project, a total of 2.5 million sq. ft. of facility, including 600,000 sq. ft. of cleanrooms.
Bechtel on Nov. 28 announced it was selected by Intel to build the company’s new semiconductor manufacturing facilities in New Albany, Licking County, Ohio. The fabrication facilities will further revitalize chipmaking in the United States and help restore dependability and resilience to the global semiconductor supply chain. Bringing this capability to Ohio is a historic
win for the region and for America, Bechtel said. Intel’s investment will strengthen future economic development in the region and transform it into the “Silicon Heartland” as an entire supply chain is developed to deliver these facilities, including engineers, construction leadership and craft professionals. Bechtel will partner with the North
America's building trades unions and suppliers to create new construction jobs, and work with local education organizations to implement training programs. “Bechtel is proud to work with Intel and the people of Ohio to reclaim U.S. semiconductor manufacturing,” said Catherine Hunt Ryan, president of Bechtel’s manufacturing and technology business. “A project of this
complexity and magnitude — with an outsized impact on the community and economy — is the type of work Bechtel is uniquely positioned to deliver. We are honored to be chosen by Intel as its partner and we are ready to build its most advanced semiconductor facilities in the world.” see BECHTEL page 6