Design for Industry Semiconductor
to facilitate contact- ee separation. The die li ed in this way is picked up by the gripper tip without contact and moved to the next process step at high speed, where it can be placed easily and precisely by switching off the vacuum. DW
tips for the different sizes, which can be easily exchanged using a collet chuck. With ultrasound and vacuum at the same time, the die can be gripped om above and held and swiveled without contact. Due to the self-centering effect at the gripper tip, the die can be gripped and placed down precisely even at rapid accelerations of over 2g. In order to achieve an optimal centering effect, the gripper tip must be adapted exactly to the format of the die, therefore three different gripper tips are necessary for this application. The gripper can be connected to any robot or axis system by an adaptable flange. Gripper and housing are made of anodized aluminum, the tip of the gripper is made of titanium. In the application described here, the dies to be separated are pushed upwards by pins under the wafer to reduce the adhesive force on the adhesive film and
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