Bisinfotech Magazine November 2019 by Bis Infotech

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EDITOR MANAS NANDI manas@bisinfotech.com

Artificial Intelligence and IoT are Driving Most of the Trends

CONSULTANT EDITOR NILOY BANERJEE niloy@bisinfotech.com SUB EDITOR NITISHA DUBEY nitisha@bisinfotech.com MARKETING MANAGER ARNAB SABHAPANDIT arnab@bisinfotech.com DESIGN HEAD SANDEEP KUMAR WEB DEVELOPMENT MANAGER JITENDER KUMAR WEB PRODUCTION BALVINDER SINGH SUBSCRIPTIONS PRIYANKA BHANDARI priyanka@bisinfotech.com MANAGER FINANCE KULDEEP GUSAIN accounts@bisinfotech.com Bisinfotech is printed, published, edited and owned

by Manas Nandi and published from 303, 2nd floor, Neelkanth Palace, Plot No- 190, Sant Nagar,East of Kailash, New Delhi- 110065 (INDIA), Printed at Swastika Creation 19 DSIDC Shed, Scheme No. 3, Okhla Industrial Area, Phase-II, New Delhi- 110020 Editor, Publisher, Printer and Owner make every effort to ensure high quality and accuracy of the content published. However he cannot accept any responsibility for any effects from errors or omissions. The views expressed in this publication are not necessarily those of the Editor and publisher. The information in the content and advertisement published in the magazine are just for reference of the readers. However, readers are cautioned to make inquiries and take their decision on purchase or investment after consulting experts on the subject. BisInfotech holds no responsibility for any decision taken by readers on the basis of the information provided herein. Any unauthorised reproduction of Bisinfotech magazine content is strictly forbidden. Subject to Delhi Jurisdiction.

BISINFOTECH|NOVEMBER 2019|VOL 1|ISSUE 11

INDUSTRY UPDATES 06 Infineon expands its CoolGaN portfolio 07 Analog Devices Acquires Test Motors 08 Microchip Offers Production Ready Open Source Tools 09 STMicroelectronics Expands Its Software Support

COMPANY TOUR 10 ST at electronica India 2019 Flaunts The Dual-Core and Power-Pack STM32H7 MCU ELECTRIC VEHICLES 12 Semiconductors for compact and cost-efficient on-board chargers

WHITE PAPER 16 The Wearable for Machine Health: Condition-Based Monitoring

TECH COLUMN 26 5G Demands Comprehensive Cloud Data Management

DATA PROTECTION 34 For Better Protected Data, A dd a Dose of Healthy Skepticism

TELECOM UPDATES 36 Telecom Minister inaugurated the India Mobile Congress 2019

T&M 38 Antenna Company unveils Industry’s First DRA 39 Anritsu’s Signal Quality Analyzer gets approval

INDUSTRY KART 42 element14 introduces its private label collection 44 New Yorker Electronics Expands its Portfolio

BIG PICTURE 20 Dr. R A Gotur Director | Indian Operations HONGFA GROUP – INDIA 22 Padmanabha Shaktivelu General Manager Electrolube India 30 Madhukar Tripathi Head- MARCOM & OPTICAL PRODUCTS | Anritsu India

LEDs 51 Littelfuse Expands HighTemperature TRIAC Thyristor Series

SECURITY UPDATES 54 Fortinet Announces Acquisition of enSilo

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INDUSTRY UPDATES

Infineon expands its CoolGaN portfolio Infineon Technologies broadens its CoolGaN series with two devices. The CoolGaN 400 V device (IGT40R070D1 E8220) is tailored for premium HiFi audio systems where end users demand every detail of their high resolution sound tracks. These have been conventionally addressed by bulky linear or tube amplifiers. With the CoolGaN 400 V switch as class D output stage, audio designers are able to deliver excellent listening experience to their prospective audio fans. The CoolGaN 600 V industrial-grade device (IGLD60R190D1) enables performance and cost optimization for low- and mid-power applications, such as in the area of low-power SMPS and telecom rectifiers. Every product within the Infineon CoolGaN family meets JEDEC standards.

The CoolGaN 400 V switch enables smoother switching and more linear class D output stage by offering low/ linear C; zero Q, and normally-off switch. Ideal class D audio amplifiers offer zero percent distortion and 100 percent efficiency. What impairs the linearity and power loss is highly dependent on switching characteristics of the switching device. Infineon’s CoolGaN breaks through the technology barrier by introducing zero

reverse recovery charge in the body diode and very small, linear input and output capacitances. The resulting benefit to the end users is more natural and wider soundstage audio experience. To further simplify the design, Infineon pairs the CoolGaN 400 V device in an HSOF-8-3 (TO-leadless) package with a popular class D controller (IRS20957STRPBF) in an evaluation board. Infineon’s CoolGaN 600 V portfolio is now also extended with a new 190 mΩ, industrial-grade HEMT. This product was developed to fit any consumer and industrial application on an optimized cost with the aim to lower the technology entry barrier. Easy design-in is supported with a standardized DFN 8x8 packaging and the matching driver ICs from the GaN EiceDRIVER series.

New Consortium for Autonomous Vehicles

Artesyn Selects for Industrial Applications

Leading companies from the automotive and computing industries has recently announced a collaborative effort toward making fully self-driving vehicles a reality. The new Autonomous Vehicle Computing Consortium (AVCC), officially launched at Arm TechCon in San Jose, brings together industry leaders from automotive, automotive supply, semiconductor and computing to serve as the leading organization for autonomous computing expertise. Together with the consortium’s growing membership, the initial AVCC members Arm, Bosch, Continental, DENSO, General Motors, NVIDIA, NXP Semiconductors and Toyota will collaborate to help solve some of the most significant challenges to deploy self-driving vehicles at scale. The first step toward achieving this vision and the common objective of AVCC is to develop a set of recommendations of a system architecture and a computing platform that reconciles the performance requirements of autonomous systems with the vehicle-specific requirements and limitations in terms of size, temperature range, power consumption and safety. Working groups will share ideas and study common technological challenges, facilitating cross-industry collaboration to help the automotive industry work together by defining, educating and publishing for the benefit of all.“The future of mobility and the safe, scalable deployment of advanced driver assistance systems to fully autonomous vehicles for mass production require unprecedented industry collaboration,” said Dipti Vachani, Senior Vice President and General Manager, Automotive and IoT Line of Business, Arm.

LEDs are replacing other lighting technologies in almost all applications from automotive to street lighting, horticultural to retail, and residential to industrial. A maker of innovative LED lights for industrial applications has selected Artesyn’s LCC600 series fanless and IP65-rated AC-DC power supply for its new ruggedized high power luminaire, which uses a patented cooling method to optimise efficiency of the light fixture. Starting with a power supply that already meets the EN61347-2-13 lighting industry standard and ENEC high quality European mark made it much easier for the customer to secure safety approval for their lighting fixture. Artesyn’s ability to rapidly modify the standard product to suit the customers exact needs, including constant current mode and a small output voltage adjustment, combined with outstanding technical support made this bright idea an easy decision for this customer.

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INDUSTRY UPDATES

ACEINNA Signs Agreement with ZAT Group

ACEINNA has recently announced that ZAT Automobiltechnik GmbH has signed an agreement to market ACEINNA’s industry leading lines of inertial and current sensing solutions to OEMs and manufacturers throughout Germany, France and Spain. As a highly focused and professional sales organization, ZAT will serve as an extension of ACEINNA’s existing direct sales force and will primarily be responsible for marketing ACEINNA’s OpenIMU, RTK and INS products and technologies at automotive manufacturers like Daimler, BMW, VW Group, Ford and Opel and their Tier suppliers as well as European ADAS developers and manufacturers. ACEINNA is innovating and shaping the GPS, GNSS and RTK markets with our unique open source IMU strategy,” says Michael Murray, Executive Vice President. “This agreement with ZAT will greatly expand our coverage in EU and our focus on Automotive.” “ACEINNA is one of the world’s most innovative developers of IMU technologies that enable the industry development of ADAS and autonomous vehicle’s guidance & navigation solutions,” said Stefan Braitsch, General Manager of ZAT.

Alps Alpine Collaborates with Immersion Corporation Alps Alpine Co., Ltd has entered a joint collaboration agreement with Immersion Corporation. Alps Alpine entered into a license agreement relating to touch feedback technology for automotive input devices with Immersion in 2000 and has since developed, manufactured and marketed a variety of products. Under the new joint collaboration agreement on product creation relating to HAPTIC technology, the two companies will work together to innovate products delivering enhanced operability and diversity by fusing Alps Alpine’s humanmachine interface (HMI) technology in areas including touch input, illumination, graphics and sound with Immersion’s advanced software and control algorithms and other expertise. Through a closer relationship with Immersion, Alps Alpine seeks crucial progress on improving the user experience of next-generation automobiles and new types of services characterized by the CASE domains – connected cars, autonomous driving, sharing and services, and electric vehicles – and Mobility-as-a-Service (MaaS). The move will also spur further expansion of a product lineup born from synergies generated by business integration.

Analog Devices Acquires Test Motors Analog Devices has recently announced the acquisition of Test Motors. Based in Barcelona, Spain, Test Motors offers products and services that detect faults in electric motors before they cause damage to production cycles and advises on how and when to repair them. The acquisition expands ADI’s portfolio of condition-based monitoring solutions capable of identifying equipment faults before downtime and catastrophic failure occur. This acquisition builds on Analog Devices’ 2018 addition of OtoSense, a startup that developed “sensing interpretation” software able to learn and recognize sounds or vibration and identify potential problems in a factory machine or a car’s engine before they become severe. OtoSense’s artificial intelligence (AI) platform is dedicated to sensing interpretation and enabling the monitoring of any asset, wherever located. Analog Devices plans to combine software from OtoSense with Test Motors’ monitoring capabilities to create solutions that offer an advanced, wholistic snapshot of machine

health by capturing a wider breadth of potential faults. “Machine maintenance relies heavily on experienced technicians and engineers able to detect and diagnose issues that can lead to unplanned downtime,” said Kevin Carlin, Vice President Automation and Energy Group, Analog Devices. He also said, “There are not enough trained professionals, however, to keep up with the demand as the number of machines to maintain rapidly grows. ADI’s condition-based monitoring applications, driven by the acquisitions of Test Motors and OtoSense, will tackle this expert resource challenge by providing customers with a system able to perform complete and early detection of anomalies to avoid unexpected and costly machine downtime.” The Test Motors team will join ADI’s Automation and Energy Group and operate as a key technology group. Financial terms of the acquisition were not disclosed. “We are excited to become part of Analog Devices and work with its team

of industrial technology experts,” said Emili Valero, Test Motors’ former CEO. “The combining of our technology and expertise will enable us to develop the next generation of condition-based monitoring solutions designed to greatly extend manufacturing equipment life for electrical and non-electrical rotating machines and deliver significant cost savings that benefit both businesses and consumers.” ADI’s Condition-based Monitoring Solutions Condition-based monitoring is not about any single technology but instead a system-level solution that requires a combination of technologies and solution considerations. Analog Devices’ technology portfolio enables these solutions with breakthroughs in MEMS (microelectromechanical systems) sensors, flexible signal conditioning and data conversion technologies, processing and communications solutions with the power portfolio to deliver optimized wireless and wired condition-based monitoring solutions.

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INDUSTRY UPDATES

Microchip Offers Production Ready Open Source Tools Microchip Technology is the first who offered production-ready open source tools for managing its Adaptec Smart Storage HBA, SmartHBA and SmartRAID offerings in OpenStack data centers. By investing in and offering readily deployable open source tools and plugins, Microchip removes complexity for customers that are connecting storage resources to its Adaptec lineup of storage controller solutions in heterogeneous data centers powered by OpenStack. The prequalified and tested Adaptec Smart Storage tools are scalable and customizable, simplifying management of large networks of cloud servers within enterprise-class infrastructures. The Adaptec Smart Storage OpenStack tools include three components: 1) a plug-in for Metal as a Service (MaaS), a bare-metal deployment tool from cloud industry leader and Ubuntu creator Canonical Ltd.; 2) a scripted service formula, or “charm”, created with Canonical’s Juju modelling tool that allows users to remotely deploy Adaptec ARCCONF in any type of cloud

environment so the adapters and attached devices can be configured and managed remotely using the Juju dashboard; and 3) a plug-in for the OpenStack Horizon Graphical User Interface (GUI) that allows users to discover, configure and conveniently manage both Adaptec Smart Storage standard adapters and custom embedded solutions. “Microchip is excited to deliver new open source tools that ease the integration of our Adaptec Smart Storage solutions used in OpenStack software-defined infrastructure,” said Andrew Dieckmann, associate vice president of marketing in the Data Center Solutions (DCS) business unit at Microchip Technology. “This unique offering will improve our customers’

ability to rapidly and efficiently deploy new storage assets within OpenStack’s market-leading open source cloud server management framework.” “The $6.1 billion market for OpenStack continues to post double-digit growth rates globally, across public and private clouds in nearly every conceivable use case, including containers, VMs and bare metal,” said Danny Carreno, senior manager of ecosystem development and operations at the OpenStack Foundation. “The open infrastructure community driving this growth is itself growing, with companies like Microchip integrating projects like the OpenStack Horizon Dashboard to support Microchip’s Adaptec lineup of storage controller solutions.

Toradex Announces General Availability for its Apalis SoM

Jon Imperato New VP of Worldwide Sales & Marketing

Toradex has recently announced general availability for its Apalis System on Module (SoM) based on the NXP® i.MX 8QuadMax applications processor. The SoM has been available as part of Toradex’s ‘early access’ program to its key partners and customers for several months and has a minimum product availability until 2030. The SoM is pin-compatible with the Apalis family, including i.MX 6 and NVIDIA-based SoMs. This allows Apalis-based products to be easily scaled. All Toradex software and support resources are available, including a high-quality Yocto Project-based Linux BSP and the new upcoming easy-to-use Industrial Linux Platform Torizon. Operating Systems provided by partners include Android from Kynetics, QNX, and Greenhills INTEGRITY. The NXP i.MX 8QM SoC is the highest performance variation of the i.MX 8 family, featuring 6x Armv8-A 64-bit processor cores – 2x Arm Cortex-A72 & 4x Cortex-A53 – as well as 2x additional Cortex-M4F microcontrollers. The integrated HIFI4 DSP, a high-performance dual GPU, 28 nm FD-SOI technology for decrease in soft error rates, and extra safety features are other highlights.

Maxim Integrated has recently announced that it has promoted Jon Imperato to Maxim’s Vice President of worldwide sales and marketing. In this role, he will be responsible for the Maxim Integrated’s customer-facing organizations, which include Sales, Customer Operations, Field Applications Engineering, Distribution and Marketing. Most recently, Imperato was the head of North America Sales at Maxim. “Jon has an excellent history of sales execution, as well as a proven ability to run a large, successful organization and contribute to top-line growth,” said Tunç Doluca, President and Chief Executive Officer at Maxim Integrated. “This, coupled with his deep knowledge of Maxim products, markets and customers, makes him an ideal fit for this leadership role.” Imperato has over 20 years of sales experience in the semiconductor industry. His career at Maxim Integrated spans roles including sales director for Maxim’s large customers and head of North America Sales where he led sales for both direct and distribution channel customers. Imperato earned his bachelor’s degree in Business Administration from Texas Christian University.

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INDUSTRY UPDATES

Flex GBS India Top-20 Most IEAE Will Be Held at Pragati Admired Shared Services Org Maidan, New Delhi Flex has recently announced that its Global Business Services (GBS) division in India has been named one of the Top-20 Most Admired Shared Services Organizations in 2019 by SSON Analytics. Flex GBS India is staffed by more than 5,000 employees and provides centralized services in the areas of Finance, Information Technology, Engineering and Quality, Human Resources, Program Management Global Procurement and Supply Chain to deliver operational excellence to Flex’ global sites. “This recognition is a reflection of GBS India’s continued passion to operational excellence and commitment to be an employer of choice, while providing services to all our global Flex sites,” said Ashutosh Arora, vice president & managing director, Flex GBS, India. “Our constant endeavour is to identify opportunities to enhance our services to enable us to add more value and positively contribute to Flex’s success.” SSON Analytics is the global data analytics centre of the Shared Services & Outsourcing Network (SSON), the world’s largest and most established community of shared services and outsourcing professionals.

India International Electronics & Smart Appliances Expo (IEAE) is getting co-organized by Ikonic Exhibition & Conferences Pvt. Ltd. The IEAE will be organized alongside Chaoyu Exposition from China who is also the organisers of IEAE Series of Exhibitions in Indonesia and is Powered By the most reputed mediah from India - The Economic Times. Scheduled from 12 – 14 December, 2019 at Pragati Maidan, New Delhi, the event is an initiative supported by leading industry association National Small Industries Corporation (NSIC), Govt. of India, All India Electronics Association (AIEA), CMAI Association of India, Federation of All India IT Association, PHD Chambers of Commerce & Industry (PHDCCI) from India & China Electronics Chambers of Commerce (CECC), Guangdong Electronics Chambers of Commerce (GECC), Dongguan Electronics Chambers of Commerce (DECC) from China. This 2nd edition of India’s premier B2B event will see 200+ participating brands showcase 500+ products in varied range from consumer electronics & smart home appliances like mobile phones, tablets, laptops, television, refrigerator, fans, air conditioners, air & water purifiers, gadgets, CCTV camera’s, microwave, mixers, electric kettle, home theatre’s & audio, home lighting, smart home automation and more.

STMicroelectronics Expands Its Software Support STMicroelectronics is enhancing software support for smartphone app developers to unleash the full potential from the new Core NFC Framework of the newly released iOS 13 operating system. STMicroelectronics has a rich portfolio of chips for use in mobile devices, payment terminals and automotive, and NFC tags, including the ST25T series for type-5- tags in widespread use today and the ST25DV series for type-5 long-range (ISO/IEC 15693) dynamic tags. The Core NFC Framework in iOS 13 enables reading and writing interactions with diverse types of NFC tags, including ISO/IEC 15693type-5 tags. The newly supported commands include the full standard command set as well as the extended set specified in ISO/ IEC 15693, together with the support of custom commands, to permit interaction with embedded electronics through dynamic tags that can store changeable information such as fitness-tracking data. The move enables powerful and innovative contactless possibilities

extending well beyond payments and ticketing to include smart retail, cycle or scooter hire, smart parking, healthcare, coupons, loyalty schemes, easy device pairing, gaming, and many more, including industrial and automotive use cases. In addition to standardized capabilities, ST’s tags provide enhanced features such as custom instructions and TruST25 digital signature for additional protection. Developers can leverage a comprehensive ecosystem that includes the ST25 SDK software development kit, ST25DV-DISCOVERY evaluation kit, XNUCLEO-NFC04A1 STM32 Nucleo Expansion board, ST25 (Mobile) NFC tap application, and soon-to-be-updated ST25 NFC tap iOS application for development on iOS 13 devices. “The mobile world has so far only scratched the surface of the convenience and efficiency NFC can bring to many daily interactions. With support for the full range of NFC tag functionalities about to arrive on iOS devices, many new and imaginative apps can and will emerge,”

said Benoit Rodrigues, Memory Division General Manager, STMicroelectronics. “With our strong portfolio of NFC tag ICs and a full suite of tools to support development of tags and unleash the full capabilities of the new Core NFC Framework, we’re positioned to have a central role in changing the way people interact with the world through their mobiles.” As a long-time advocate of type-5 ISO/IEC 15693 dynamic tags and a board member of the NFC Forum and ISO standards organizations developing contactless specifications, ST has expertise across the full range of NFC technologies and applications and had already contributed to development programs for the launch of iOS 13. Moreover, to help developers begin creating new apps for iOS 13 devices quickly, ST has made source code available for the ST25 NFC tap application and published a guide with tips and tricks for unleashing the potential of NFC on iOS 13.

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COMPANY TOUR

ST at electronica India 2019 Flaunts The Dual-Core and Power-Pack STM32H7 MCU In a maiden showcase of AI/ML future with integrated IoT chips, STMicroelectronics during the recent 2019 editions of electronica India unveiled its Dual-core STM32H7 MCUs. Combining dual-core punch with power-saving features and enhanced cyber protection, the new devices leverage a 480MHz version of the Cortex-M7, which is till now the highest performing member of Arm’s Cortex-M family, and add a 240MHz Cortex-M4 core. STMicroelectronics at Booth EB21, Hall 10 showcased its latest cutting-edge technologies for automotive, industrial and IoT applications. Visitors crowding at ST’s booth got the chance to have a glimpse of ST’s products and solutions for Electric Vehicle charging, Battery Management Systems, and Smart Agriculture. ST Booth included 40+ cutting-edge live products & technologies on display includes: • Smart driving applications • Smart industry solutions • IOT • End-user products and solutions with ST-embedded technology Among the all, the STMicrolectronics’ Dual-core STM32H7 MCUs was the centerstage. What’s unique about ST’s new Dual-core STM32H7 MCUs:

• World Most Powerful MCU & New dual-core product lines expanding the STM32 portfolio • Developers can easily upgrade existing applications through flexible use of the two cores. They can add a sophisticated user interface to an application such as a motor drive formerly hosted on a single-core Cortex-M4 MCU by migrating legacy code to the STM32H7 Cortex-M4 with the new GUI running on the Cortex-M7. • A n o t h e r e x a m p l e i s t o b o o s t application performance by offloading intensive workloads such as neural networks, checksums, DSP filtering, or audio codecs. • The dual-core architecture also helps

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Vinay Thapliyal, Technical Marketing Manager- MCD, India said, “STM32H7 is the industry’s highest-performance Arm Cortex-M general purpose MCU combing dual-core with power-saving features and enhanced cyber protection. And, we will continue to introduce most innovative portfolios catering to different customer needs in the MCU ecosystem”. Other key attractions from the booth included:

simplify code development and accelerate time to market in projects where user-interface code may be developed separately from real-time control or communication features. • STM32H7 MCUs come with pre-installed keys and native secure services including Secure Firmware Install (SFI). SFI lets customers order standard products anywhere in the world and have the encrypted firmware delivered to an external programming company without exposing unencrypted code. • Compared to Flashless processors, STM32H7 MCUs deliver high performance with the extra advantage of up to 2MByte Flash and 1Mbyte SRAM on-chip to better handle space constraints and simplify the design of smart objects in industrial, consumer, and medical applications with realtime performance or AI-processing requirements. Moreover, the Cortex-M7 level 1 cache and parallel and serial memory interfaces offer unlimited and fast access to external memory. • Additional advanced features include Error Code Correction (ECC) for all Flash and RAM memory to increase safety, multiple advanced 16-bit analog-to-digital converters (ADCs), external ambient-temperature range up to 125°C allowing use in severe environments, an Ethernet controller and multiple FD-CAN controllers giving communication-gateway capabilities, and ST’s latest high-resolution timer for generating precision waveforms.

• An Automotive section of the stand ST highlighted EV charging system portfolio, including solutions for Battery Management Systems, Onboard Battery Chargers (OBC), and a complete range of power and control devices for electric vehicles; NFC readers for Automotive applications; and technology to address the India Automotive Industry Standard 140 Intelligent Transportation System requirements. ST will also showcase reference designs targeting e-bike and e-rickshaw motor drives designed specifically for the Indian market and a fast charger module. • In the Industrial section, visitors had a glimpse of ST’s solutions for Mesh over BLE on real lighting devices; ISO15693 NFC forum type 5 certified dynamic tags with Pulse Width Modulation (PWM) outputs; ST’s latest digital configurable ASIC that can drive three channels as interleaved PFC for industrial applications. In addition, ST will feature a Wireless Industrial Node and Smart Agriculture Qi-Charger solution integrated with NFC, STSAFE protection, and PoE-based Lighting. • The IOT /AI display highlighted ST’s wide portfolio of STM32 microcontrollers, with an emphasis on ultra-low-power-budget applications, a multiprotocol ultra-low-power 2.4GHz radio transceiver, and the new Sensortile.box platform for plug-andplay IoT sensing. The stand will also feature several Artificial Intelligence IoT reference designs.

Semiconductors for compact and cost-efficient on-board chargers MARTIN GLEICH

Senior Manager Marketing and Business Development Powertrain in the Automotive Division Infineon Technologies

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ELECTRIC VEHICLES

Fig. 1: There are three basic charging scenarios.

capacities of new electric vehicles are between 40kWh and 80kWh, allowing ranges up to 400km. Plug-in hybrid vehicles integrate smaller battery packs that are around 10kWh since the pure electrical range usually does not exceed 50km. In the case of the electric vehicles, the charging of this battery by an external source is a basic requirement; with the plug-in hybrid, charging by an external source is in addition to the charging by energy generation of the internal combustion engine. Regarding the charging infrastructure, three basic types of charging can be distinguished: charging at the regular location ("main harbor charging"), charging at the destination ("destination charging") and charging to extend the range (â&#x20AC;&#x153;range extension chargingâ&#x20AC;?). [Fig. 1]

Charging scenarios and charging power

On-board chargers (OBC) are required in any fully electric or plug-in hybrid vehicle. This article explains what factors are important in the development of an OBC and how these can be achieved with suitable semiconductor components. Battery electric and plug-in hybrid vehicles will shape the streetscape much more strongly in the next few years than they do today. Since these vehicles have no, or very low, local CO2 emissions according to WLTP, manufacturers are increasingly relying on the sales of these vehicles in order to achieve the CO2 emission targets in the EU. Both types of vehicles use lithium-ion battery packs with nominal voltages typically in the range of 350V - 360V. Today the battery

Main Harbor Charging refers to charging at locations where the vehicle is usually kept, typically at home and at work. It is where the OBC comes into play. Since the vehicle is typically at the charging point for several hours, the charging time plays a minor role in the overall charging ecosystem. This is reflected in the installed charging power, which seldom exceeds 2,3kW (230V, 1-phase, 10A) or 3,6kW (230V, 1-phase, 16A) today. However, these power levels are only sufficient to charge either plug-in hybrid vehicles or electric vehicles with batteries less than 40kWh. To charge batteries with capacities greater than 40kWh overnight, or during working hours, the charger will require an output power of 11kWh, or more, which necessitates 3-phase power inputs. Destination Charging occurs at locations such as supermarkets, shopping centers, movie theaters, etc. It lasts for shorter periods of time than Main Harbor Charging, and it is used to partially recharge the battery. In order to sufficiently charge the battery in this limited time higher charging power is required. Today the typical charging station at such locations has an output power of 22 to 50kW, and the AC to DC power conversion is integrated into the charging station, especially at the higher powers. Range Extension Charging is comparable to refueling the classic automobile. In the shortest possible time the battery is charged for longer distances. Today, charging power in the range of 50kW to 120kW is installed.Over the next few years up to 350kW are planned to charge even larger

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ELECTRIC VEHICLES

batteries,for example 80kWh in less than 20 minutes. For this type of charging only DC charging columns with integrated voltage conversion are used. Since the OBC combines the conversion from AC to DC voltage and the control of the battery charging it needs to ensure compatibility with single and three-phase power networks in addition to the various required communication protocols. At the same time, active power factor, isolation and EMC requirements need to be met in the input side, as well as supplying the proper charging current and voltage on the output side. More and more is being discussed about electric vehicles being used as energy storage for the domestic solar installation, in order to capture excess power generated during periods of strong sunlight and supply this power to the home later. This requires bi-directionality in the OBC: in addition to the charging function for the battery in the vehicle, the OBC must also provide its energy in the other direction to the outside. However, such systems are rarely used today.

dissipation, maximum achievable switching frequency, and robustness. This in turn directly affects power density, cost, and efficiency. For example, reducingpower dissipationreduces the size and cost of the cooling system and the OBC as a whole, and also increases efficiency. Higher switching frequencies allow the use of smaller passive components. Each of the circuit topologies mentioned above require different types of semiconductors. For example, due to the high switching frequency of an LLC converter (up to 500 kHz) MOSFETs are the best choice. A totem pole PFC operating in continuous conduction mode requires fast switching IGBTs due to hard switching of the devices. Silicon carbide (SiC) MOSFETs and diodes can, in principle, facilitate higher efficiency. Infineon Technologies offers the full range of power semiconductors specifically designed for in-car on-board charging systems.

Automotive CoolMOSTM CFDA and Automotive Driver IC AUIRS2191S

Optimize power density and costs

Fig. 2: An onboard charging system consists of two subsystems: the active power factor correction stage (PFC) and the DC-DC voltage converter (DC-DC)

What parameters are to be considered when developing an OBC? Space plays a big role - especially in plug-in hybrids. Therefore, the power density of the OBC should be as high as possible. At the same time, it is important to keep the costs as low as possible. This is especially true because the OBC is not a differentiator for the vehicle manufacturer. Cost pressure often means that vehicle manufacturers are not willing to pay more for higher efficiency. An onboard charging system consists of two subsystems: the active power factor correction stage (PFC) and the DC-DC voltage converter (DC-DC) [Fig. 2]. The PFC stage secures an active power factor of >0.9 on the line side, implements the rectification of the AC line voltage to an intermediate DC circuit voltage and communicates with the charging station. The DC-DC converter controls the battery charging current and separates the mains from the battery side by galvanic isolation. In principle, various topologies are available for each section. However, these are usually limited to a few in the automotive sector in order to meet the above-mentioned requirements: • For PFC: Boost converter, Totem Pole • For DC-DC: LLC, ZVS Phase Shift

In addition to the choice of topology, the focus in system design is also on the power semiconductors. In addition to the passive power components, these have a major influence on power

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Bild 3: Infineon‘s Automotive CoolMOS™ CFDA technology enables a robust design

Resonant DC-DC topologies such as LLC or ZVS Phase Shift are operated with switching frequencies up to 500kHz and thus require the fastest possible commutation between high and low-side switches. Typically, these topologies use soft switching of the MOSFETs (i.e. either in zero-voltage or zero-current switching mode). However, under certain circumstances, a hard commutation of the MOSFETs may occur. Often, the reverse recovery of the MOSFET body diode is not taken into consideration, and this can lead to the desired switching frequency or load current not being achieved. However, if a hard commutation occurs in the field, the fast removal of the reverse recovery charge could destroy the MOSFET in extreme cases. So-called "fast body diodes" help here. Infineon's CoolMOSTM CFDA technology significantly simplifies the design by providing a fast body diode with a recovery delay 40% below average. Fig. 3 shows the resulting turn-off behavior close to the ideal switch: no overvoltage peaks occur, and oscillations remain negligible. Thus, efficient resonant topologies with high switching frequencies can be realized reliably over

ELECTRIC VEHICLES

the lifetime without having to invest in additional filter circuits. In addition, the good controllability of the CoolMOSTM CFDA with different gate resistance values simplifies circuit design and reduces the burden of evaluation testing. In order to minimize the total bill-of-material costs of the driver circuits, it makes sense to use integrated driver ICs. The AUIRS2191S is the perfect complement to the CoolMOSTM CFDA based products in resonant topologies. With the two channels for a high-side switch and a low-side switch, the driver stage for a half bridge can be realized in a space-saving manner. A typical propagation delay of 90ns and driver current of ± 3.5A are sufficient to drive power semiconductors up to 3kW up to 200kHz without additional components.

Automotive TRENCHSTOPTM 5 Fast Switching IGBTs and Automotive Gate-Driver IC AUIRS2191S

Totem Pole based PFC stages are often used to enable bidirectional charging or increase efficiency with acceptable overhead. As mentioned above, operation in the CCM necessitates the use of fast switching IGBTs. Infineon's TRENCHSTOPTM 5 technology products are ideally suited for this, as they each have the lowest switching and forward losses in their class, allowing for the highest possible efficiency. The switching frequency also plays a further role in component selection: Totem pole stages are usually operated at 70kHz, TRENCHSTOPTM 5 supports frequencies up to 120kHz and thus ensures reliable operation over life. In order to keep the circuit complexity low, the AUIRS2191S can be used again as a driver stage.

Automotive CoolSiCTM MOSFET and Automotive Driver IC AUIRS1170S

Efficiency improvement plays a major role today, if it increases the power density and thus space can be reduced, assuming the increased costs are acceptable. In the future, it is quite possible that new energy usage criteria for electric vehicles will also include the energy usage of the OBC itself. In China and Japan, discussions are currently taking place on this topic – in order to be able to present a more correct overall consumption of electrical energy per electric vehicle. This would mean that efficiency becomes more important in OBC than it is today, even justifying additional costs. Silicon carbide, compared to silicon as a semiconductor base material, offers the advantage of producing active power devices with lower switching and forward losses and thus enabling higher efficiency. Taking as an example a Totem Pole PFC stage, today with the use of the latest fast switching TRENCHSTOPTM 5 IGBTs with integrated Rapid-Diode over 97% efficiency can be achieved. By replacing the rapid diodes with the current generation CoolSiCTM diodes from Infineon, this can be increased to values above 98%. Even higher values can be achieved with a completely SiC-based implementation, using CoolSiCTM MOSFETs instead of the TRENCHSTOPTM 5 IGBTs, but the cost-benefit ratio is significantly less favorable. Fig. 4 shows the efficiency improvement over a power range up to 3,3kW, CoolSiC MOSFET 650V scaled from 1200V. Another possibility for improving the efficiency is provided by the step from passive to active rectification on the

Bild 4: In a Totem Pole PFC efficiency can be increased by another 0.7 percent byusing anautomotive CoolSiC™ diode

secondary side of the DC-DC converter. At the same time, bidirectional operation is made possible. In contrast to passive rectification with diodes,the associated heat sink is usually not required. This benefits the space and reduces costs in production. Infineon's AUIRS1170S is the only driver component in automotive electronics that was specifically developed for synchronous rectification. The drain to source voltage measurement on the power semiconductor switch integrated intodriver eliminates the otherwise necessary activation by a microcontroller. Measurement results with the CoolMOSTM CFDA technology show an improvement of 0.5% compared to passive rectification.

AURIX™ Microcontroller

Electric and plug-in hybrid vehicles are connected to the outside world via a communication interface in the OBC;via Ethernet, CAN (FD) or Power-line, the OBC communicates with a charging station or wallbox, for example, to request information about the installed power supply or to communicate the battery charge status. Like any other communications interface, these interfaces of an OBC can also be usedinappropriately. Since the OBC is integrated into the E / E architecture of the vehicle via the CAN (FD) bus, improper intrusions can have serious consequences. Therefore, the OBC must be protected by appropriate encryption algorithms and secure user authentication. Here, the widely used AURIXTM microcontroller series from Infineon with the integrated "Hardware Security Module" (HSM) offers the perfect solution;not only is the implementation of a security system possible that is deemed fully compliantto the EVITA standard, but also safe communication with AutosarSecOC can be implemented. Integration of the high-voltage low-voltage DC-DC converter in the OBC seems technically and commercially feasible and could be used more frequently in the future. In addition to higher demands on computing power, functional safety would also be more important here. Together with the TLF35584 power supply IC, the products in the AURIXTM family enable system solutions that not only deliver the required performance, but also conform to ISO26262 to ASIL-D standards. n

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The Wearable for Machine Health:

Condition-Based Monitoring STUART SERVIS

Senior Applications Engineer | Analog Devices

Condition-based monitoring (CbM) is the Industry 4.0 equivalent of wearable fitness devices. With the explosion of connectivity comes the opportunity to observe the physical world like never before and to see physical processes in action, in real time, in fine detail. In industrial systems, one of the processes important for us to understand is the process of the aging of equipment and machines. This is important in diverse markets from oil and gas, wind power generation, and industrial process control, where capital equipment costs are high, and downtime is costly. Unplanned downtime can cost thousands of dollars per hour. One study in 2017 found that companies reported

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an average cost of $2 million due to downtime alone, and unplanned downtime is significantly more costly than planned maintenance because a machine must be offline while itâ&#x20AC;&#x2122;s diagnosed, parts are ordered, and repairs are made. The continued operation of machines within specification, and the expected remaining lifetime of machines, is impacted by variables such as the time in operation, varying loads and operating environments, and damaging events. Conditionbased monitoring seeks to quantify these impacts, provide alerts when immediate attention is required, and accurately predict when intervention will be required. Every machine is different, and every machine will age in

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a different way, although the aging process is usually slow and imperceptible. Unless we actively look for indications of subtle changes over time, aging may go unnoticed for some time. Then suddenly there’s a failure, possibly catastrophic, that means that the machine is offline and in need of repair. End users are demanding earlier notice of impending failure to plan for downtime well in advance. They are also looking for indicators of more subtle changes in the machines that may affect the quality of their end product, such as paper and sheet metal.

condition monitoring analytics, this is achieved by looking for the minutest changes in the system, whether it be system temperature, vibration, or acoustic signature. To sense these small changes requires sensors and data acquisition systems that can see the small changes clearly at the lowest detection levels, even amongst high levels of vibration or temperature. This requires signal chains with extremely high dynamic range, meaning systems with extremely low noise performance while still being able to deal with large variations in signal level. For example, to detect the onset of wear-out in a reciprocating pump may require the detection of a change in less than 1/10th of a mm of the end stroke position of the piston, where the piston is moving up to 300 mm overall. To ensure that we can see this change, the system noise must be below this by at least a factor of 10. This pushes the detection level to 1:300,000, or 109 dB, and requires 18-bit or more accurate data acquisition systems. Another consideration is the need to push out of the bandwidth of interest. Motor axles and many gear systems have characteristic vibrations at relatively low frequencies, with frequencies at close to the rotation speed of the axle or low multiples of this. However, there are other components in the systems that have higher frequency features. To detect shifts in the wear of components that have higher frequency characteristics, such as ball and oil bearings, the sensing must be able to achieve high resolution and high dynamic range at frequencies beyond 10 kHz and up to 80 kHz.

Figure 1. Manual inspection of equipment using piezo sensors and a handheld logger.

The combined need for earlier and earlier indication of machine wear-out and information about machine output quality drives the need for more sensitive and more ubiquitous sensing. Measurement types are also broadening, with sensing modalities such as temperature and vibration being supplemented with acoustic, motor current, and voltage measurements. These measurement systems are being combined to give a more holistic view of the state of equipment. This leads to increasing numbers of measurement channels per machine. The individual measurements often need to be well synchronized to show relationships, such as between x-, y-, and z-axis measurements of vibration. This need for synchronization further increases the complexity of systems. The increasing spread of measurement nodes and modalities means that manual inspection and measurement routines, based on manual resources, are no longer able to keep up. Systems must be deployable across the factory floor or remote site, with connectivity using existing wired infrastructure or wirelessly using robust and secure wireless systems. Bulky and expensive sensors and aggregator units must be smaller, cheaper, and more power efficient to fit in these environments. There are new, precise solutions at the component and subsystem level with higher levels of integration to allow system builders to make this increased sensing future a reality now.

Data Acquisition

To achieve the earliest possible indication of machine wearout, you almost need to see into the future. In the realm of

Figure 2. Typical vibration frequency signature.

The sensing system specifications must include high dynamic range (DR), as well as extremely low total harmonic distortion (THD) in order to resolve these frequency domain features in the system vibration profile. In these systems, the latest precision wide bandwidth sigma-delta (Σ-Δ) converters are used to perform the analog-to-digital conversion step. There are extremely accurate analog-to-digital converters that meet the key requirements for these systems. Converters in this category are specified with superior dynamic range and THD (typically +108 dB DR and −120 dB THD), which is achieved across a bandwidth of dc to at least 80 kHz, combined with

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ease-of-use features such as analog input precharge buffers, integrated digital filters, and cross-device synchronization for multichannel phase matching, make these key components in the building of the highest performance CbM data acquisition systems. Power scaling features allow the same physical hardware to be tuned to meet specific power ceilings, where dynamic range or bandwidth can be traded-off against total power. And providing accuracy at dc as well as wider bandwidth allows the input channels to address the needs of temperature, strain, and other dc or low bandwidth sensing in the same platform, which simplifies the overall condition monitoring system architecture and complexity—a single platform for all CbM sensor types.

Simultaneous Sampling

In CbM systems, simultaneous sampling is used to ensure the phase relationships between sets of time domain data is preserved. For example, where two orthogonally arranged vibration sensors are used, this allows the direction and amplitude of the vibration phasors to be detected. Ideally the phase delays through each sensor input path should be well matched and track over temperature. For CbM systems that require even more flexibility in their design for wider range in their sampling rate, bandwidth, or power scaling needs, SAR ADC products are also appropriate. These devices also offer high dynamic range and THD, and at throughputs up to 2 MSPS, and also incorporate ease of use features that reduce signal chain power consumption, reduce signal chain complexity, and enable higher channel density. Converters with higher input impedance modes broaden the range of low power precision amplifiers that can drive these ADCs directly, while still achieving optimum performance. To allow system builders to achieve the highest possible channel densities in more compact or distributed acquisition nodes, and to achieve faster time to market, signal chain μModule® products with higher levels of integration than ever before are being developed. These μModule devices combine key components commonly used in data acquisition signal chain designs within a compact, integrated circuit (IC)-like form factor. The μModule approach transfers the design burden of analog and mixedsignal component selection, optimization, and layout from designer to device, which shortens the overall design time and system troubleshooting, as well as ultimately improves

Figure 3. 3D render of μModule assembly.

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time to market. Housed in tiny packages, μModule devices are well suited to distributed low channel count, compact CbM systems or for higher channel count rack-based systems.

Sensors

Providing high dynamic range, wider bandwidths, greater power efficiency, and higher channel densities in the data acquisition part of the signal chain alone only addresses part of the system design challenge for CbM systems. Traditional integrated electronics piezoelectric (IEPE) vibration sensors are large, bulky, and expensive, and are usually run off relatively much higher voltage rails than the data acquisition system. Common piezoelectric sensors use a −24 V single supply, consuming upward of 2 mA, and are housed in heavy metal cases. Because the sensor supplies are usually provided by the data acquisition module, increasing the channel density in the box becomes a power density problem and a component density problem. Adding to this the need for wireless batterypowered acquisition nodes, the traditional piezo vibration sensor no longer meets the demands of these signal chains. MEMS vibration and inertial sensors are now meeting the requirements of these systems. The latest wide bandwidth MEMS devices have noise and bandwidth performance that is ideal for CbM applications, and they achieve this performance in tiny standard surface-mount packages with power levels that are 20 times lower than comparable IEPE sensors. The small size and power profile of these MEMS sensors allow very small multiaxis, battery-powered systems to be developed for permanent and constant condition monitoring.

Power and Connectivity

Sensing the temperature, vibration, or noise of the machine and converting this to digital information is a key part of the monitoring task, but these details do not provide the complete picture. To build condition monitoring systems requires paying close attention to all of the analog, digital, and mixedsignal components in the design. To achieve low noise in the data acquisition chain requires not only low noise sensors and analog-to-digital conversion components, but also low noise power design. And achieving low power in the system also requires power components that efficiently take power from the battery or field wiring without adding to the complexity of the design. Connectivity needs will depend on the specific application environment. Many industrial facilities already have extensive wiring in place for process control or existing environmental sensing, such as temperature. However, much of this existing infrastructure may not be able to deal with the large amounts of raw data, or the data rates, required for extensive conditionbased monitoring. One approach is to enhance the capabilities of existing wiring by adding more data in ways that it does not affect the existing functions. For example, HART® technology is used to add diagnostic information in digital form on top of the ubiquitous 4 mA to 20 mA analog interface. Similarly, Industrial Ethernet adds determinism and real-time control where existing Ethernet cabling exists, which allows for known latency in control applications as well as higher bandwidth where vibration or FFT data is required, as well as allowing

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multiple nodes on each link. Another approach is to transfer the information wirelessly. In industrial environments, robust and secure wireless networking is required. The latest intelligent mesh radio products are wireless chips, and precertified PCB modules, which enable low power communication and >99.999% data reliability even in harsh, dynamically changing RF environments. For condition-based monitoring, this means that fault or transient events are guaranteed to be communicated to the host and can be acted on in the shortest possible time.

Figure 4. Block diagram showing sub-blocks of a typical precision data acquisition signal chain.

The Future of CbM

Condition-based monitoring is an absolute need for large capital cost equipment such as for energy and oil and gas, where unplanned downtime has a direct impact on production costs. It is also becoming more and more important on the factory floor where it can be used as both a proactive approach to machine maintenance, but also a way to ensure machines are producing product in a consistent way in normal operation. As the value of these monitoring capabilities becomes more apparent, this technology will start to be applied across more and more of the machines that we use every day—no longer the preserve of wind turbines or paper mills, we will see CbM in trains, planes, and automobiles, and eventually in washing machines and even smaller appliances. Manufacturers of system components will integrate the sensor, or even the whole channel, into the component. Motors will come with vibration and current sensing included, and the same may become true for bearings and gearboxes. There will be self-contained sensor nodes that will report to your mobile device—deploy one on your garage door so it can warn you before your car gets stuck inside! To meet the growing need for sensing in these many different scenarios, equipment makers will need to take a platform approach, where a smaller set of platforms can serve a more varied set of needs. Measurement channels will need to handle different sensor types so that rack-based equipment can be retasked for different combinations of sensors. In smaller equipment, the systems will need to be adaptable to different power profiles so that the same monitoring node can be used in a washing machine or a battery-powered tool.

Conclusion

Condition-based monitoring seeks to quantify the state of health of machines by sensing various measurable parameters within the machines. Increasing the accuracy and sensitivity

of these measurements, as well as reducing the size, weight, and power of the monitoring equipment, allow the factory manager to deploy this sensing across the factory floor. The factory now has a health monitor—a fitness tracker—that gives new levels of insight into the factory operations. Factory managers can be advised of minute changes in machine operation to make early and informed decisions with this information. Scheduling maintenance in advance, and only planning it for those machines that really need it, can significantly reduce maintenance costs. After-hours call-out and on-call technician costs can be reduced to zero.Capital equipment costs can be reduced due to the more controlled nature of the factory. Earlier detection and replacement of worn components protects the overall health of the machines. Closer monitoring reduces the occurrence of catastrophic failures. Equipment lifespans can be extended as the machines are carefully managed to end of life. The cost of production of the factory end product can be reduced. With insight into machine health comes the possibility of maintaining control of the tolerances on the machines. End product output quality is more consistent from lot to lot. The occurrence of machine out-of-bound, or sudden stoppage, is reduced. Therefore, product rework and wastage are reduced.

How Analog Devices Helps Solve This Problem

Analog Devices, Inc. (ADI) understands the sensing and measurement needs of end customers who want to maximize the efficiency and lifetime of their installed equipment, or who provide these measurement and analytics solutions to their end users. The sensing and measurement tasks required by CbM can be solved with the combined technology offering available from ADI, at the component level, as most customers are familiar with, but also now at higher levels of integration with signal chain μModule devices and power μModule products, which allow faster time to prototype or design a viable product for our customers’ products. ADI can provide the full signal chain, from low power MEMS sensors, high performance and power efficient data converters, to wireless connectivity and power management solutions. ADI technology continues to offer the best performance options for central rack-based systems, as well as addressing the needs of distributed monitoring nodes. The analog world is where data is born, and Analog Devices has always been at the forefront of making sense of that world to convert it into real information that is meaningful and useful. For more information on condition-based monitoring solutions from Analog Devices, please visit analog.com/cbm.

About the Author

Stuart Servis is a product applications engineer at Analog Devices, where he works in the precision signal chains team, within the Instrumentation and Precision Technology Group. His area of expertise is precision data acquisition signal chains based on sigma-delta and SAR ADCs. He received his B.Sc. in applied physics and electronics from National University of Ireland, Galway. He can be reached at stuart.servis@ analog.com.

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THE GENERAL-PURPOSE RELAY MARKET IS AN EVERGREEN MARKET Currently HONGFA are developing product portfolio for Electric and hybrid vehicles. 48V relay for Hybrid car: we are now cooperating with FEW GLOBAL AUTO MNCs to develop this type of relay, this relay will be widely used in Hybrid car unveils Dr. R A Gotur, Director | Indian Operations | HONGFA GROUP – INDIA while talking to Niloy Banerjee from BISinfotech. Unravelling HONGFA’s ahead plans, strategies and models to encompass across the Indian market, the veteran also enunciated on the forthcoming design trends, technology impact and trends for the relays market. Below, are more exciting insights! Read below the edited nub.

Dr. R A Gotur Director | Indian Operations | HONGFA GROUP – INDIA

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Bringing along a mammoth experience in the relays New technologies in the existing applications require segment, which trends and technologies majorly have greater current capability, higher operating frequency you seen impacting the Relays market? and higher coil sensitivity to meet the demands for lower power In EMR Technology there is no much change trend/Technology consumption. How is Hongfa dealing with it? for GP relays. In Auto relays segment slowly New design technology advancements the plug in relays will vanish & PCB relays along with material advancements have will be consumed more & more. Also the allowed Hongfa to develop size reduced Magnet relays are used for Intelligent products at higher performance. The meters & Building automation will be the introduction of Micro ISO and MicroHigh future relay trend. Current plug-in relay products allow customers to decrease system size by What is the annual production using these products in higher current capacity of Hongfa currently and applications traditionally being controlled what has made it a major manufacturer by larger Mini size package relays and even exporter across the globe? Automotive technology and integrated Hongfa production CAPACITY is around 2 systems continue to developrapidly with BN Relays. Hongfa exports to more than electric and electronic systems in today’s 100 countries. vehicles playingan increasingly important role for traffic safety and traveling comfort. How is electromechanical-relay What challenges does Electric and (EMR) technology tackling the current hybrid vehicles and emerging 48-volt design challenges? systems bring? The EMR technology in relays in reducing Currently HONGFA are developing the size of the relays ( Minature relays – product portfolio for Electric and hybrid Small size ) and also in SMT relays ( Surface vehicles. 48V relay for Hybrid car: we are Mount Technology ). These changes are now cooperating with FEW GLOBAL AUTO promonent in 2019-20. Relays which have MNCs to develop this type of relay, this low contact resistance and low voltage relay will be widely used in Hybrid car. This drop across contacts and this enhances long time relaibility and also the life. Also the permanent will make the working efficiency of the car higher and lower magnet relays & contactors are becoming popular due to consumption of oil. High current PCB relay to replace Plug in relays: now days Europe, USA and China have already theirlower power consumptions.

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Hongfa production CAPACITY is around 2 BN Relays. Hongfa exports to more than 100 countries.

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started to switch from PLUG in relays to PCB relays. Hongfa is the first company in China to start the development of High current PCB relay.

wide range of products by sharing our knowledge and time. At Hongfa, we strongly believe in nurturing the future pillars of industry and in sharing our knowledge with the community. Also we actively share our technological know-how by How to keep the cost down and maintain a high security participating in exhibitions and through Magazines. of supply? Are there new market strategies for Indian market and To keep cost down& maintain adoption high level of security of how do you reckon to encompass across this indigenous supply in this sector are stringent quality norms fully automized market? plant which yields zero defect helps: HONGFA have aggressive plans for future growth in India. We identified few areas where Hongfa will focus for future • Reducing operational cost, growth. Power Electronics, Consumer Electronics, Automotive, • Improve product quality Light, Smart meter segment & Add manpower in due course • Enhance quality work for employees. in India going to be our focus areas of our future growth. • Increase product output rates Hongfa aligned our strategies and resources in these areas • Boost manufacture flexibility to reach target are our plans for future growth. • Reduce labour turnover • Reduce wastage & increase yield. Hongfa in 2020, what is your expectation from the entire How do you witness the current relays market? relays market. Key drivers, challenges and Hongfa’s The general-purpose relay market is an evergreen market, market traction? the current slowdown in the Auto Sector has impacted the HONGFA has aggressively performed since its establishment. Hongfa relay market business, witnessing a slowdown. We have wide range of relay series segments and we are able to deliver high quality products and competitive prices with What has been the strength of Hongfa and how do you JIT (Just in time ) terms. Hongfa expecting more & more share strategize to harness it further in this competitive market? from India in 2020 relay market. Within a span of short time, Already all most all the customers are well aware of Hongfa we are able to enter with major companies in all segments. product wide range & quality. Besides advertising to create Hongfa commitment to quality and value pricing has helped brand awareness, we also build credibility for our brand and us immensely.

Q Q

UNVEIL

IN THIS SPACE! www.bisinfotech.com

Reach Us : advt@bisinfotech.com T : +91- 11- 46504585

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LED MARKET IN INDIA IS A PARTICULARLY SUCCESSFUL AREA FOR US What are the key elements of success for a company who set up their Indian operation more than half a decade ago? Electrolube has gone from strength to strength in the electronics industry in the last 7 years. Elaborating on the enormous growth of Electrolube India, Padmanabha Shaktivelu, General Manager of Electrolube India, speaks to Niloy Banerjee from BISinfotech about their strategies, focus and trends in this exclusive interview below.

Padmanabha Shaktivelu General Manager | Electrolube India

Given the gamut of Electrolube’s portfolio, what are your key offerings that have seen major traction in the Indian market? We certainly have an extensive portfolio of electro-chemicals across our 6 core product groups, which consist of thermal management solutions, encapsulation resins, conformal coatings, service/ maintenance aids, cleaning solutions and contact lubricants. However, our key offerings would undoubtedly be our thermal management materials, encapsulation resins and conformal coatings, due tothe huge demand from LED manufacturers in India. The LED industry in India is extremely buoyant and demand for our products is booming. It has played a key part in the dynamic growth of Electrolube. EV/Automotive, industrial, consumer and mobile electronics are also thriving industries for Electrolube. We are seeing overwhelming demand for our EV/automotive products in Europe, where we are literally under the bonnet of all major car manufacturers, and the market in India is following suit. We are already working on some interesting EV projects in India and this is an area where we foresee tremendous growth. As a company, we thrive on challenges and providing solutions, which we are

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capable of providing across every area of the design and production processes. This, in turn, also saves our customers a lot of time in sourcing different suppliers. Some customer application issues may be resolved with an off-the-shelf product, and other applications may require a more bespoke solution. Our driving force is to resolve the issue by any means necessary, and with our vast product range, R&D resource and global network, we are really gaining a huge share of the Indian market.

We have been established in India for 7 years now and have made a significant investment in a state-of-theart manufacturing facility in Bangalore, located near the major electronics manufacturing hubs of Southern India. Having a local presence has put us in a very strong position to collaborate with customers and provide electronics protection solutions to customers quickly and cost effectively.

Our R&D team is highly experienced, innovative and resourceful. We have Electrolube India has just actually specifically developed new resin celebrated the fourth anniversary of and thermal management products its’ manufacturing site in Bangalore to meet the demands of the Indian and this has coincided with the brand’s market, using locally sourced materials success at the popular annual Electronics so that we can offer products at highly Maker ceremony. Electrolube has been competitive prices. Our new products awarded a Best of Industry Manufacturing for LED manufacturers also have the Award for Conformal Coatings for the endorsement of Electrolube’s UK R&D fifth year in succession. Electrolube was team and have proven to be so effective also awarded the accolade of Best that they have been adopted into many Electronics Manufacturer for their overall additional territories. You simply cannot beat local knowledge, and this is an contribution to the industry. area we have developed intensively in How has Electrolube been positioning India with tremendous response from itself to foster its R&D strength in India? customers. Electrolube has positioned itself globally Electrolube’s growth in India has as a complete solutions provider in all been phenomenal, what have been areas of electro-chemical manufacturing.

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the main factors behind this success? The key element of our success is our ability to work closely with our customers and put them first. We're not just about volume; we are fully committed to research and development, remaining true to the company’s heritage of making products that really add value for the customer. Innovation, collaboration and finding a complete solution are absolutely central to everything we do. With collaboration, we come to understand our customer’s issues better and we can then find the best way to solve these problems. We have been serving the electronics industry for nearly 80 years and have acquired significant expertise, knowledge and contacts, that all of our customers can really benefit from. Electrolube India’s growth has been exceptional, accelerated by the clear local supply benefits and straightforward import process on material, which prevents delays for customers. Having a local presence in Bangalore has also enabled us to be very versatile and responsive to issues that customers need solutions for, even within a short time frame. We have been approached by new customers who arehaving problems with their existing non-Electrolube products, and we have delivered a fully effective solution within as little as 24 hours! A short timescale such as this could pose a complete nightmare for many companies, but our tight network of manufacturing and global supply gives us a really competitive edge with these types of projects. We can manufacture the products in Bangalore, or have a local distributor pick up the initial order to deliver a fast turnaround. Developing bespoke products for the local market using locally sourced materials has also given us a huge competitive advantage. These products truly meet the specific requirements of Indian manufacturers at competitive prices.

What is Electrolube’s major focus for the Indian Market? This is an interesting question as we have customers in almost every area of electronics manufacturing! We have never really had to change our focus as the broad opportunities and TAM (Total Addressable Market) have been

continuously increasing due to the wide range of core products we offer. If we look at our performance in the LED and EV markets, however, these are areas where Electrolube is really thriving and we anticipate that there is going to be further exponential growth here for our products, particularly as we have been developing resins and thermal management materials specifically for LED and EV manufacturers.The LED market in India is a particularly successful area for us. We are bringing new resin and thermal management solutions to the market that increase performance and device lifetime, as environmentally friendly as possible and at low-cost, thanks to local sourcing of materials. We are also growing rapidly across EV/ automotive, consumer, industrial and mobile electronics. Our automotive/EV conformal coatings have received BMW approvals, and we will be focusing on this area even more intently next year.

new solutions also carry a full seal of approval from the UK parent company for quality and innovation, compliant with internationally recognised standards. Some examples of our most recent innovations include 3 new epoxy resins, 3 speciality silicone resins and a highly thermally conductive PU resin. The new resins are more application specific for LED Lighting, Automotive Headlamps and even ECU/EFI (EFI-Electronic Fuel Injectors). The first of the new encapsulation resins includes the black, two-part epoxy resin ER6001, which is ideally suited to a wide variety of applications within the electronics and automotive industries as well as for industrial controls. ER6001 has good chemical resistance, a wide operating temperature range, performing exceptionally at high temperatures. One of ER6001’s major applications in particular is for ferrite core transformed bonding and encapsulation. The ER6002 is also a two-part, thermally Kindly underline the recent launches conductive epoxy encapsulation of Electrolube during ep India for resin that is ideal for LED drivers, SPDs Indian manufacturers? (Surge Protection Devices) and for We have introduced a vast amount automotive applications, such as ignition of new products to the Indian market, control unit potting. Developed as a leveraging both group technical support strong competitor to existing locally and key local knowledge. Our R&D manufactured, low-cost epoxy potting team at Electrolube India identified resins, ER6002 is a beige coloured, low local customers’ requirements and viscosity (10,000cps) resin with good developed numerous, cost-effective flowability and an exceptionally high new resins and thermal management thermal conductivity of 1W/mK. Mixed products with higher specifications than in a ratio of 9:1, the cured resin achieves existing products on the market. The a Shore D hardness of 50.

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The new, repairable ER6007 epoxy potting and encapsulating resin is a two-part system, designed for the protection of electronic devices and is ideal for LED drivers, SMPS and Solar Charge Controller encapsulation. With a simple 1:1 mix ratio for ease of processing, the ER6007 has excellent high temperature properties, suitable for use in applications where the operating temperature will be up to 180°C, as well as good flow characteristics to allow the potting of difficult and complex geometries. New silicone resins include the SC4010 flexible resin system. SC4010 is a low viscosity, fast curing, two-part silicone potting and encapsulating resin, which has been primarily developed for the protection of LED drivers but its properties make it suitable for a wide range of applications, such as LED Luminaire side encapsulation and also ECU encapsulation, with its fast RT cure. What are the current challenges SC4010 has excellent high temperature you face as a company in this fast properties, ideal for use in applications where the operating temperature may paced industry? rise to 200°C while its flexibility allows for Perhaps the biggest challenges for us have come from the very wide and varied temperature cycling. mix of projects that we are approached SC4003FD is a flexible, fast RT curing to find solutions for. Every customer has t h i x o t r o p i c s i l i c o n e p o t t i n g a n d different project requirements, sometimes encapsulating resin, which has been these requirements are absolutely unique specially designed for the Indian market. and require us to research and develop SC4003FD is suitable for a wide range of a bespoke solution, often within a very electronic applications, especially LED short timescale. However, this is an drivers. With a wide operating temperature area where Electrolube thrives. Being a range (-60°C to +200°C) and good high chemical solutions provider with a vast temperature performance, SC4003FD portfolio, we are in a very strong position provides excellent moisture resistance to provide a full service to our customers throughout the entire production process. and good flow characteristics.

SC4004 is a low cost, two-part, thermally conductive, addition cure silicone resin. The advantage of an addition cure silicone is that reaction by-products are not released so the product can safely cure in a closed environment. Low viscosity (12,000cps) SC4004 is mixed in a ratio of 1:1 and attains a Shore A hardness of 70 when fully cured. The thermal performance is excellent for a silicone in this products’ price range; in addition, the product features a wide operating temperature range (with excellent stability at high temperatures), good tolerance of thermal shock cycling and a high thermal conductivity of 1.1W/m K.

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In the automotive industry, balancing the requirements of environmental suitability, manufacturing acceptability and end-product reliability continues to be the main challenge for electronics protection consumables but we have introduced new conformal coatings to help customers address all of these issues simultaneously. With regard to challenges faced by LED manufacturers, heat dissipation is always an issue, however, LED applications are becoming increasingly more diverse; design requirements and location or the function of the product are all challenges

that face LED designers. Electrolube provides thermal management and encapsulation solutions that not only increase performance but also ensures reliability throughout the lifetime of the device. We also provide products that can be incorporated into the design of the product for cosmetic reasons as well as helping to provide key functional improvements such as increased efficiency and reduced energy consumption.

Electronic chemicals market is projected to reach about $ 29.96 billion by 2024, what will be the key trends and drivers behind this gushing growth? Electro-chemicals are widely regarded as key enablers for other sectors from electronics and automotive to food production and mobile devices. With such a vast presence, the electro-chemicals market is set for vigorous growth both in terms of revenue and applications over the forthcoming years. The key drivers behind this exponential growth, from our point of view, will certainly arise from the EV/Automotive industry, which utilizes a broad range of our specialty chemical products in the form of conformal coatings, resins, thermal management materials and contact lubricants. The expanding automotive industry coupled with the growing demand for electric

vehicles will also bring a huge set of and guidance on material choices to opportunities for the market space, and designers and manufacturers across a as automotive electronics assemblies wide range of industries, applications and become smaller, more complex and environments, and the future is looking are required to perform in harsher, more extremely positive. crowded conditions, manufacturers in this Lately, Electrolube concluded its buoyant sector are increasingly turning to maiden Technology Day in India, Electrolube for reliable circuit protection what did you take back from this onesolutions and applications support. The global LED industry will also be a of-a-kind event? key factor in driving growth. The industry is booming worldwide as individuals, It was extraordinary, to be honest. It companies and governments switch was the first time that we have hosted to these more efficient, eco-friendly a Technology Day in India and the lighting solutions. Electrolube has response truly exceeded all of our been at the forefront of this boom expectations, attracting in excess of 100 from the outset, supplying specialist senior decision makers from leading Indian solutions to the world’s best known LED electronics manufacturing companies. manufacturers. Electrolube materials The Technology Day was a great platform work to protect components, dissipate to engage with local manufacturers, to heat and prolong the life of LED units listen to their application requirements and their associated components such and enabled manufacturers to discover as drivers. There is enormous scope in the effective new ways of improving reliability LED market as the applications for LEDs and performance through electronics become increasingly more diverse and protection solutions from Electrolube’s not just restricted to automotive, street core product groups. Since hosting the lighting and residential lighting but also event, many of the delegates have architectural smart lighting, human centric been in touch with Electrolube India’s lighting, horticultural, agricultural and team for technical support and site visits. fishing lighting.Electrolube has become a It was extremely successful and we will well-respected global supplier of electro- be looking to do more Technology Days chemicals, providing technical support in the future.

What is your outlook for the electronics industry in India? India is set to become one of the world’s prime electronics manufacturing regions. Both export and local markets are booming and demand for specialised services and products in the LED, EV, mobile technology and consumer/industrial electronics sectors, such as those provided by Electrolube, are growing rapidly. Demand for our products is so strong that Electrolube’s growth in turnover is set to propel up to a staggering 91% this year, following a 40% increase across 2017-2018. Our local manufacturing operation continues to thrive in this market and our award-winning products are in widespread use among the major Indian OEMs. We are responsive to the Indian Government’s aims to promote a strong home-based manufacturing sector that is able to satisfy local supply chains and provide reliable and timely delivery. Consequently, we will continue to grow and support the local markets we serve and increase customer assurance in our capacity to be an innovative, consistent and reliable supplier of electro-chemicals.

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TECH COLUMN

5G Demands Comprehensive Cloud Data Management AMAN BRAR

VP - Global Alliances, Openwave Mobility,an Enea company

A number of operators have started implementing 5G networks. They are however increasingly realizing that the data management needs of 5G are drastically different than those of earlier network generations. 5G demands that operators move from bare metal to cloud-based stateless applications, where more efficient managing and processing of data is needed to manage and process larger data volumes, also ensuring that authorized applications have rapid access without downtime. The solution is Cloud Data Management (CDM) in which each 5G Network Function (NF) is treated as a service. CDM provides a data layer that stores information that NF’s need, including fast-changing session/state data, subscriptions, policy and configuration data. CDM replicates data as required, easing the creation of 5G slices and stateless core services, while also delivering data at the edge for performance-sensitive, ultra-reliable low latency applications. The data replication is also key to providing six-nines of service availability on virtual infrastructure that typically provides threenines of availability at infrastructure level. IT provides a glimpse of CDM’s 5G benefits A recent survey of 116 business and technical managers responsible for modernizing data environments, illustrates the importance of CDM to the IT networks: • A wide range of business functions are supported by CDM the most important of which include analytics (64%), data warehousing (52%) and reporting (47%) • T he top CDM benefits are seen as scalability for data storage and integration workloads (51%), automatic and elastic resource management (44%) and affordably enabling advanced analytics at scale (35%)

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• More than 85 percent of respondents say implementing CDM is either extremely important (39%) or moderately important (47%) to the success of their data strategy • The “must have” features of CDM include core data management functions for data integration (70%), data prep (57%) and data quality (55%) W hile t he rep o rt is fo c u sed o n I T infrastructure, it mirrors the benefits CDM can deliver for 5G core networks and provides a critical advantage for operators. CDM provides the key infrastructure components needed to enable new 5G core Service Based Architecture (SBA). The 5G core difference The 5G core is composed into servicebased architecture (SBA) elements. They are designed to separate the control plane (CP) and user plane (UP) and relies on an external Data Layer to make the control plane and user plane stateless. The 5G core is made up of virtualized, software-based NFs (or services), creating a new architecture that gives operators

the flexibility to meet diverse network requirements for 5G use cases. Because 5G core architecture is cloud native, it’s important for a 5G CDM offering to integrate cloud-ready capabilities for the 5G mobile core. These include: • U n i f i e d D a t a M a n a g e m e n t (UDM): Supports the generation of authentication and key agreement (AKA) credentials; user identification handling; access authorization; subscription management • U ser Data Repository (UDR): Stores information about subscribers, application-specific data and policy data • Authentication Server Function (ASF or AUSF): Implements the extensible authentication protocol (EAP) authentication server and stores keys • Policy Control Function (PCF): Provides policy rules for control plane functions, including network slicing, roaming and mobility management. It accesses subscription information for policy decisions taken by the UDR and supports the new 5G quality of service (QoS) and charging functions Other 5G network functions like NRF, NEF, CHF, AMF and SMF benefit from the UDSF portion of CDM which enables these stateless network functions to store the fast changing session data. Openwave Mobility, an Enea company, is in a unique position to provide operators with a single CDM solution that provides all of these features. In March, Openwave’s parent company, Enea AB, acquired a business unit from Atos Convergence Creators, enabling us to add cloud-ready features to our 5G core CDM solution – Stratum. These features include policy management, authentication and subscriber data management.

EXHIBITION SALES MR. RAVI KUMAR E: ravi@itenmedia.in M : +91 9711433860

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Artificial Intelligence and IoT are Driving Most of the Trends

Randall Restle, Vice President of Applications Engineering, Digi-Key Electronics underlines the key technology trends for Microcontrollers (MCUs) in 2020. Here is what the veteran articulated.

Trends and Analysis of MCUs in 2020?

Once upon a time, semiconductor companies designed their own CPUs but that is not much the case today. Today, a CPU core is as much a “peripheral” as its peripherals! They are simply IP blocks. Ignoring the personal computer market of CPUs and, instead focusing on the broader embedded market, there are four popular CPU licensed cores: ARM, RISC-V, MIPS, & Xtensa. ARM is the leader, but the open source RISC-V core is coming on fast. Microchip’s PIC32 is based on MIPS and Chinese semiconductor Espressif Systems uses Xtensa. Xtensa was designed by Tensilica, now part of

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Cadence Design Systems. Digi-Key stocks over 27,000 microcontrollers from over 25 different manufacturers and that number continues to grow. Another trend that is growing quickly is

System in Package (SiP). The advantage of a SiP is that it can house multiple die of different technologies into a package that is practically the same size of a large integrated circuit. These devices are generally able to run complete operating systems, like Linux, with very few external devices and most of these devices are passives. I only know of 32bit processors within these SiPs so they are indeed powerful little devices. One such SiP manufacturer is Octavo. I saw a demo of one of their devices powered from a USB connection without having a circuit board at all and talking to the host PC via a terminal window connected

MCU TREND

high level synthesis (HLS) compilers to map C and C++ code descriptions into hardware. One has to wonder whether the trend is for programmable logic and MCUs to become one market.

The 32-bit microcontroller Market in 2020?

Whereas the largest demand remains 8-bit microcontrollers, much to many people’s surprise, it seems few are interested in the 16-bitters. Instead, the 32-bitters are taking hold and why not – 32-bit devices cost as little as $0.24 for one. So, while 8-bit devices remain the largest market by units and by customer count, the 32-bit devices are in second place. The 16-bit market remains the prowess of digital signal processors whose realworld problems do not typically require more than 96dB (16 bits x 6dB per bit) dynamic range.

Impact of Automotive Segment in 2020?

to a Linux command line coming from the SiP – no external devices! The best part is that this entire board’s worth of parts – those encompassed in the SiP – costs less than $45 for one. Of course, these devices are available from stock from Digi-Key.

Key Tech Trends in This Domain to Drive MCUs in 2020?

Artificial Intelligence and IoT are driving most of the trends. These technologies are ubiquitous to many applications. Some companies claim you need both technologies in the same chip solution. This opens opportunities for programmable logic companies as the processing requirement for neural networks are well-implemented in programmable hardware fabric. Interestingly, it is increasingly popular that programmable logic generally sports one or more CPUs. Take a course on programmable logic these days and you will learn how to configure its CPU core more than you will learn about hardware description languages. Another trend is to make software designers into programmable logic algorithm developers and use

Digi-Key is a broad-based distributor and does not focus on one market over another. Instead, we strive to be the first to stock and distribute new devices and we’re committed to offering the broadest selection of in-stock electronic components, as well as providing the best service possible to our customers, aiding engineers through the entire design process. Many customers tell us that they only design-in a new product if Digi-Key stocks it. This is because they know the product is real if Digi-Key stocks it. That said, Digi-Key stocks products in all device variations which include meeting automotive specifications.

Your Expertise and Focus in 2020?

While other distributors are cutting back inventory, Digi-Key continues to partner and support the global engineering

community with the most contemporary technology from current and new vendors. It aspires to be a one-stop shop to customers. Given its ship-from-stock, overnight shipping, customers value getting one box with all the parts to a project. Customers can provide reference numbers that are marked on the packages that Digi-Key sends so that customers can easily match their parts received to their Bill of Materials (BoMs). Aside from parts, Digi-Key is expanding its services offering and many of these are free of charge to the customer. For example, scores of Design Services Providers are listed to give customers the name of design firms capable of augmenting in-house designers or outsourcing entire designs to turnkey design services providers. Another free offering is DK IoT Studio. This is a cloud-based design tool that enables customers to configure the single board computers and sensors that it buys from Digi-Key into operable IoT systems. Upon completing one’s design with DK IoT Studio, one can see and control IoT endpoints with a smartphone from anywhere in the world. Of course, those endpoints require connectivity to the internet so another item that Digi-Key sells are data-plans for IoT endpoints to talk over most any cellular region in the world.Digi-Key has been on a digital path for 23 years, and the digital acceleration is only quickening. We’re improving our web experience with customized search and personalized content. The DK IoT Studio is expanding with new products and analytics offerings. Our Scheme-It tool is focused on stellar customer experience with a custom symbol generator and ability to export to KiCad. We’re fully committed to visual product search and our digital voice assistant, and we’re taking our B2B/API connectivity to the next level.

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BIG PICTURE

COST OF DEVELOPING T&M FOR NEW TECHNOLOGIES IS ALWAYS HIGH The Indian telecom sector is the new ravishing field gearing the Indian T&M market. During an Interview, Madhukar Tripathi, Head- MARCOM & OPTICAL PRODUCTS at Anritsu India Pvt. Ltd, emphasizes that the cost of developing a new T&M for new technologiesfeatures is always high. Due to increase labour cost, hardware, component cost equipment manufacturing cost is always high. Testing of any particular telecom technology either in lab or field needs a very skilled man power and T&M having good GUI to make testing east and cost effective. More about the trend and outlook of Test and Measurement for telecom sector in 2020 in this interview. Edited Nub.

Madhukar Tripathi Head- MARCOM & OPTICAL PRODUCTS | Anritsu India

Trends Which Will Shape The Telecom Sector in 2020? Telecom sector is under transformation from 4G to 5G mainly in India. Entire telecom ecosystem is looking towards new technology (5G) adaption in Indian market while 4G / LTE –Advanced still have long way to go.Due to various reasons we see 2020 will see demand of more 5G R&D test and measuring instruments along with 3G, 4G field maintenance instruments. Government push for Make in India will create production T&M demand. Telecom and Automotive have joined hands for autonomous cars/connected cars and automotive sector is also creating demand for telecom T&M. Deployment of high capacity transmission system using Optical Fiber cables by many ISP, telecom operators, is creating demand for OFC Operational and Maintenance T&M Instruments.

Opportunities and Challenges For T&M industry in the telecom sector in 2020? India is the world's second-largest telecommunications market, with around 1,183.53 million telephone subscriber bases at the end of May 2019. The telecom market can be split into three segments – wireless, wireline and internet services. India is also the second largest country in terms of internet subscribers. Government decision of 100% FDI in telecom sector is one of big opportunity for many investors to look India as emerging market. National Digital Communications Policy 2108 widely known as NDCP 2018 is opening many opportunities for T&M sector. Fierce price competition and teleco’s lower CAPEX plan is major challenge for T&M community. Indian buyers always look for lower /lowest prices irrespective of features/ advantages

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offers by T&M companies. Entry of many new players in less than 6GHz domain is other challenges for global T&M companies.

What will be the key drivers for the T&M industry in the telecom industry? In current scenario there are various verticals contributing to telecom T&M industry such as 5G R&D, Make InIndia, Digital India, Smart Cities Broadband for all push from Government of India. Most of global telecom company having R&D, production set up in India are working towards 5G R&D and field trials and creating demand for telecom T&M instruments. Defence, Aviation & utilities(Power generation distribution companies) sector is also under upgradation and adding demand of telecom T&M.

Impact of Software-defined approach towards instrumentation? Software Defined Radio (SDR) offers the ability to receive and transmit various modulation methods using a common set of hardware in communication system along with ability to alter functionality by downloading and running new software as per requirement- application. Software Defined Radio (SDR) offers flexibility to users and help in achieving low CPAEX. This means low investment for future proof testing requirements/ technologies.

Testing costs are said to remain almost as high as equipment manufacturing costs, how will it impact the T&M vendors? The cost of developing a new T&M for new technologiesfeatures is always high. Due to increase labour cost, hardware,

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component cost equipment manufacturing cost is always high. Testing of any particular telecom technology either in lab or field needs a very skilled man power and T&M having good GUI to make testing east and cost effective.

Your key offering in this domain. Anritsu offers telecom Test and Measurement instruments to many sectors such as Cellular Communication or Aviation communication or Defence communication or communication used in mission critical applications. Anritsu T&M are used in R&D, product operation and maintenance of telecom network. Anritsu is a pioneer in the implementation of next-generation wireless technologies while continuing to support existing standards. We offer solutions for the full range of 2G, 2.5G, 3G, 4G, and 5G telecommunications as well as current and next-generation 3GPP, 3GPP2, and IEEE standards including 1xEV, GSM/GPRS, W-CDMA, HSDPA, 802.11, and 802.16. Our portfolio encompasses instrumentation ready to test both early next-generation specifications and legacy technologies. From the chipset to the installed product, our wireless test equipment covers the entire life cycle of wireless infrastructure and user equipment. Anritsu is the industry standard for RF and Microwave Test and Measurement equipment for both field and lab environments, with instruments operating at all frequencies up to 110 GHz and beyond. Our handheld Site Master Cable and Antenna Analyzer, for example, enables field technicians to troubleshoot microwave cables and communication systems and detect problems before they become costly, time-consuming system failures. Other products are suitable for R&D and manufacturing applications, providing extremely accurate measurements of power, network analysis, signal analysis and frequency. Transport datacom applications require extremely high reliability as well as frequent monitoring and testing at each stage of the R&D, manufacturing, deployment and maintenance lifecycle. Anritsu provides a range of measurement instruments for Bit Error Rate (BER), Frame and Protocol testing, for networks using such technologies as IP, Ethernet, MPLS, SONET, SDH, DWDM, ATM, ISDN, SS7, VoIP, PDH, DSn as well as future systems up to 43.5 Gbps. Our products are used both by designers and manufacturers of transport and datacom systems and by end user companies monitoring their own systems. Anritsu offers a complete range of test and measurement equipment for the optical communications industry including R&D, production, installation, monitoring, and manufacturing. Anritsu is a recognized leader in high-speed optical technology offerings and field test solutions including evaluating a wide range of optical devices and fiber systems like DWDM. Critical measurements such as OTDR, Chromatic Dispersion, Polarization Mode Dispersion, Loss Test Set, and Optical Return Loss can be made quickly and accurately to maximize network performance and accelerate the deployment of new services.

Our latest offering for telecom sector are: Field Master Proâ&#x201E;˘

MS2090A Anritsuâ&#x20AC;&#x2122;s Field Master Pro MS2090A real time spectrum analyzer delivers performance never previously available in a compact, handheld instrument. With continuous frequency coverage from 9 kHz to 54 GHz, the Field Master Pro MS2090A is specifically designed to meet the test challenges of a full range of other wireless technologies in use today, including: 5G, wireless backhaul, aerospace/defense, satellite systems, and radar. Radio Communication Test Station MT8000A

All-in-One Support for RF Measurements and Protocol Tests in Sub-6 GHz and Millimeter Wave Bands Radio Communication Test Station MT8000A is a new platform for developing 5G communications terminals, chipsets and devices. With support for both signaling and RF tests, this all-inone platform can be configured easily for various tests, including

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RF, protocol, and use-case tests matching the module construction. Anritsu—the leader in 4G testing—is also now taking the lead in 5G.With a 5G base station emulation function, a single MT8000A test platform supports both the sub-6 GHz, including band n41, and the millimeter wave bands used by 5G. Combining it with the OTA Chamber enables both millimeter wave band RF measurements and beamforming tests using call connections specified by 3GPP. More o ve r, i t su pp or t s not only 5 G S A (Standalone) but also NSA (non-Standalone) mode with the customer's existing LTE measurement assets. Signal Quality Analyzer-R MP1900A Anritsu’s Signal Quality Analyzer-R MP1900A series is a high-performance BERT with 8 slots for modules, such as a 32 Gbit/s Multi-channel PPG/ED, 32G/64G PAM4 PPG, 32G PAM4 ED and Jitter/Noise Generator, to expand measurement applications supporting signal integrity analyses of ever-faster devices. In addition to Physical layer measurement functions for broadband network interfaces, the all-in-one MP1900A supports PCI Express bus,

etc., interface measurements. [Target Applications] 100 GbE/200 GbE/400 GbE, CEI-25G/28G/56G/112G, InfiniBand EDR/HDR, Fibre Channel, PCI Express Gen 1 to 5, Thunderbolt 3, USB3.1 Gen1/2, Optical modules, SERDES, AOC, High-speed Interconnects

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For Better Protected Data, Add a Dose of Healthy Skepticism LAURENCE PITT

Director of Security Strategy, Juniper Networks

Data protection is the ultimate cybersecurity endgame. For this reason, it is near the top of the agenda in any security team meeting.They know theyneed to do all they can to ensure data stays inside the organisation and, therefore,will layer software and hardware solutions to make that happen. After all, their adversaries (threat actors) will do anything to gain access to that data for resale,including damage it, lock it up and demand ransom payments for access. This battle began because of the importance that data has in a modern digital business; it is the flow of data that makes a business unique.No two are the same and it is critical for data to be well-protected. Ascrucial as it is to have technology in place for protecting data, it isjust as important to ensure that usershave security

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awareness too, since many breaches begin with an innocent double-click to open a file or email. Data used to be simple; only stored online to make it easier for us to keep up in the digital age. Examples include one’s name, email address or password, whichcould be combined with the name of a pet or parent so that itcould be easily reset whenever it was forgotten. None of it seemed important, and certainly not perceived toaffect anyone’s life, if mislaid. Fast forward 10 years and all of this has changed. Today, the information that we put online is not only critical, but because of the way that it can be shared across social media and analysed for targeted advertising,it is also possible to be used to build a detailed and accurate profile of who you are and what you do every

day. Put simply, online data is now a representation of your ‘digital-self’. If anyone gains unlawful access to this information, they are able to make online purchases, take out loans or perhaps cause mischief like stop mobile phone contracts or cancel airline tickets.

Corporate Data Loss Can lead to Closure

The same goes for business data, except that the data inside a business has corporate ownership and, therefore, loss of that data could affect thousands of people –or even forcethe business to close altogether. Malware attacks are a digital reality for today’s organisations.But with a plan in place to help protect against these types of attacks, risks can be mitigatedquickly and within compliance,

DATA PROTECTION

ultimatelystrengthening brand equity in the event of a breach. Some useful guidelines for this plan are: • Invest in an internal cyber-awareness program. These training resources help users understand the importance of the data they work with and the different methods that may be used by an adversary to gain access. Phishing (or spear-phishing) is still the most common attack vector but users also need to learn about malvertising, which can be used to deliver ransomware, watering hole attacks and targeted social engineering. Understanding these different methods will help users better protect themselves and others – inside or outside of the workplace – who may be at risk. • U nderstand the data held by your organisation. Too often, the immediate reaction following an attack or new compliance requirementis to implement blanket levels of security. This is not the

answer. Different data has different business value, access needs and lifecycles. Blanket security means that a PDF on the website becomes as hard to modify as it would be to update a person’s medical records. This becomes too costly and complex to manage, impedes legitimate data use/flows and, over time, dataprotection will fail as users work to circumvent controls in the name of ‘efficiency’. U nderstanding your data – where it is held, what it is, the lifecycle, who (internal and external) needs legitimate access and any compliance requirements – are all key to successful dataprotection. The project will more likely succeed because data is safe without impacting useraccess; but should the worst happen,your business is also in the best position to mitigate and move forward. • Invest only in suitable security products. Given the evolution of dataprotection and cybersecurity, every business will have covered the basics offirewall, intruder prevention, anti-virus, software web and email gateways.Eventually, there’s a breach and another solution is purchased to prevent the breach from happening again. This knee-jerk response is common, and from as far back as 2016, it was reported that the average enterprise has around 75 different products in use.

You May Already Own The Best Security Solution

In the same way that users are a great first line of defence when armed with good cyber-awareness, the best security solution may be one that you already have. The real challenge is how to extract relevant information and alerts from itexactly when they are needed. CISOs and IT teams need to think about how they can deploy a layer of security to the business that does not replace what you already use but instead enhances it. Nowadays, despite what some in the industry might tell you, the answer to the problem can never be ‘rip and replace’.Rather, value comes from the ability to leverage existing solutions and skills, in order to provide the fastest, most accurate threat mitigation possible. From there, organisations are welladvised to think about how their network

infrastructure understands its own data patterns – knowing what ‘normal’ looks like makes it easier to detect anomalous behaviours and unknowns before they wreak havoc on the network. Automated, intelligent security solutions can then make decisions on whether incoming data traffic is ‘good’, ‘bad’ or ‘unknown’. Suspicious data should be automatically subjected to advanced analysis – including sandboxing – to identify andprovide data that allows the security team to make an informed final decision on whether it should be allowed or rejected. Despite the protection in place, sometimes threats enter the network or are introduced accidentally by a user. In this case,advanced threat preventionsolutionsare useful, providing a consolidated view not only across all security solutions, but also the east-west spread of a threat inside the network. From there, engineersshould be equipped to deploy required changes or updates to neutralise a threat quickly and easily. The importance of protecting dataand understanding howdifferent types of information can be used for anything from marketing to malware cannot be overstated, as it highlightsthe need to ensure the strongest possible protection and governance for business data. It is all too easy to adopt the wrong approach when protecting data, and finding the right balance that ensures a smooth flow of data within your business is key. The next step is to educate employees (on an ongoing basis) and so reduce the risk of downloading files from untrusted sources or clicking malicious links – but that is a topic for an article on its own. Data protection is a constant requirement for the modern digital business – the issue won’t ‘go away’ and there is no single answer. Be sceptical of any expert that tells you – or sells you – otherwise. The key components to a viable strategy must be a robust understanding of your company’s unique data and flow patterns, fit-for-purpose detection, analysis and mitigation tools that leverageintelligence and automation in tandem with your network team and relentless employee education.

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TELECOM UPDATES

Telecom Minister Inaugurated the India Mobile Congress 2019 The India Mobile Congress 2019 was inaugurated by Ravi Shankar Prasad. Launched for the first time in 2017, the Digital Technology Forum did carved out a niche for itself by relentlessly delivering on its commitment towards building upon innovative ideas, forging lasting industry relationships, showcasing ace mobile technology and product trends, providing sectoral insights, industrial solutions, case studies and workshops that are immensely beneficial to the entire tech-telecom ecosystem at large. During the inauguration Ravi Shankar Prasad, stated that, “It gives us an immense pleasure to introduce the third edition of India Mobile Congress. Despite being the very economic backbone of the country and the

harbinger of unmatched technological advancements, game-changing innovations and ensuring overall steady economic health, there has never been a platform that rightfully positions India’s telecom story to the rest of the world.” He also said, “India Mobile Congress is designed to address this very need. This Forum will delve into subjects that are contemporary, relevant and futuristic and will not only contribute in shaping policy decisions of the future but would also act as a facilitator in further amplifying and bolstering Prime Minister’s vision of Make in India and Startup India.” “IMC 2019, not only attract cross border investors, it also witnessed the launch of several innovative products, encourage emerging startups, and promote futuristic

technologies It is rightfully a veritable platform designed to help the country accomplish the Prime Minister’s vision of making India a truly digitally empowered economy,” he concluded. The session stressed on how the country is poised to become a 5 trillion economy by 2024. Telecom sector has a critical role to play in this growth. It is one of the prime support services needed for the growth of every other sector. Though the telecom sector is in acute financial distress, Startups are hopeful of a positive future. The fact that many Startups participated at IMC to showcase their innovation in the telecom and other allied space and their open resolve to collaborate with corporates across the globe, corroborates this fact.

Industry landscape is Ripe for Infracos to Test New BM

The ongoing transformation in the telecom industry has opened-up a revenue potential for infrastructure providers, to the tune of INR 215 billion-INR310 billion in 2023 – EY The telecom industry is undergoing a major transformation, which is set to alter the supporting infrastructure sector. The telco market has shrunk to a limited 3+1 operator format. Hot on the heels, EY released its report on the future of telecom infrastructure sector in India – ‘Next-gen infraco: Unlocking new business opportunities’. In this report, EY draws out the future business landscape for the Indian telecom infrastructure industry and conducted an in-depth study on the new opportunities which have already started to gain ground. Prashant Singhal, Emerging Markets TMT Leader, EY, said, “Towercos today are well placed to tap in on new opportunities that represent a revenue potential of INR 215 billion-INR 310 billion in 2023. With the high momentum from towercos, and government’s push on infrastructure growth, the future is promising for the telecom infrastructure sector.” Bharat Bhargava, Telecommunications

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Advisory Leader - Performance Improvement, EY said “Next generation technologies such as 5G and IoT require formidable network performance, which has triggered the need for a diverse infrastructure mix. Infrastructure providers are in strong position to tap on the new opportunities such as fibre, small cells, Wi-Fi and smart cities. Infracos have the potential to tap 35%-40% of the overall addressable market of these new revenue segments.” The telco industry is characterized by high data demand which is expected to witness a 5x increase during 2018-24. This data growth has given rise to the demand for new infrastructure and services. With this seismic shift in the industry, plenty of opportunities are arising for tower companies to shift their attention

from a macro tower focused business, towards new business models hinged on fiber, small cells, data centers, Wi-Fi and smart cities and beyond. Globally, tower companies are already reaping the results of these new areas of investment and the business case has proved to be successful for multiple global infrastructure companies (infracos). Towercos today are well positioned to expand their infrastructure portfolio, by tapping into adjacencies and cater to the changing needs of the telecom sector. Fibre presents significant potential as the overall fiber deployment in the country is expected to increase at a CAGR of 13.6%, from 1.5 million cable kilometers in 2018, to 2.8 million cable kilometers in 2023. Wireless, FTTx and common infrastructure would be the major contributors to fiber demand. The fiber growth is expected to see a fillip 2020 onward, with expected launch of 5G in 2023.Small cells are another booming segment and towercos are well placed to tap it. From 2023 onwards, the rollout 5G services is expected to commence which would contribute to large number of small cell deployments to support increasing bandwidth requirement for new use cases.

T&M

Antenna Company unveils Industry’s First DRA Antenna Company has recently announced that it will be showcasing the industry’s first 5G dielectric resonator phased antenna array designed specifically for 5G mm-wave applications. Antenna Company will be sharing details of the phased array design to customers attending MWC19 Los Angeles on October 22-24, 2019. The 64-antenna DRA combines patented Antenna Company’s SuperShape™ and DRA technology to achieve wide-band operation over the 24-30 GHz frequency bands. The mm-wave DRA array demonstrates reduced scanning losses, lower sidelobe levels and greater maximum scan angle compared to a conventional patch array using the same configuration and inter-element separation. The improvements in scanning performance enable better coverage over the usable frequency band.

The Antenna Company design achieves over 40 dBm of peak EIRP, which is ideal for use in customer-premise-equipment (CPE) products. The design is scalable to support 37-40 GHz frequency bands for global band support across the mm-wave spectrum.

“Antenna Company is excited to announce this breakthrough in mmwave antenna performance”, said company CEO, David Favreau. “With the roll-out of 5G services worldwide, antenna performance is mission-critical for achieving reliable coverage,”, commented Joe Madden, Chief Analyst at Mobile Experts. According to Madden, “the market for CPE products which can benefit from Antenna Company’s solution is growing rapidly and is expected to reach 8M-units by 2023.” The production version of the design, featuring 64 dual-polarization antenna elements, 5G NR radio transceiver, RF front-end, and support for beam-steering and beam-forming is planned to be released in 2H-2020. Visit Antenna Company at MWC19 in Los Angeles on October 22-24, 2019 at South Hall Stand, MR1477.

Agilent New Portfolio of Smart- DXOMARK New Scoring for Connected GC Instruments Mobile Audio Experience

Agilent Technologies has recently introduced a micro gas chromatograph that is small, fast, smart, and easy to use. The new Agilent 990 Micro GC system is designed to monitor the safe distribution, calorific valuation, and odorant level in natural gas. Compact and rugged, it delivers laboratory-quality data whenever and wherever it is needed. The 990 Micro GC combines Agilent’s proven microfabrication and smart-connected digital technologies in an all-new modular platform. The system’s plug-and-play architecture and smartconnected user assist functions make the 990 Micro GC easier to install, use, and troubleshoot, reducing the cost of ownership and improving productivity. “Developing better tools to assure the continued safe distribution and use of natural gas, represents yet another demonstration of Agilent’s commitment to partnering with our customers and the market,” stated Eric Denoyer, Ph.D., director of Marketing, GC, and Workflow Automation Solutions at Agilent. “This not only improves scientific and business outcomes for our customers but also helps improve the quality of life in the communities we serve.” With double the battery life of previous models, the transportable system provides over eight hours of remote operation for many applications. An optional mobile browser interface allows remote connectivity with mobile devices such as laptops or tablets, and allows hands-free, unattended operation in places that are more difficult, or potentially less safe, for humans to access.

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DXOMARK has recently launched a brand-new benchmark for mobile audio quality. DXOMARK Audio will assess the capabilities of a mobile’s speaker and microphone. Evaluating audio quality, the next logical step after image quality in informing mobile users Sound is an essential part of the mobile experience. Whether listening to music, watching videos, recording concerts, recording family events, or gaming, audio quality is more important than ever before. After establishing itself as the best-known reference for image quality, DXOMARK decided to take up audio testing as the next logical step in its mission to help consumers make informed choices. DXOMARK Audio, first ever audio benchmark that tests and scores consumer experiences with mobile speakers and microphones The audio benchmark will evaluate the playback quality of speakers as well as the recording quality of microphones embedded in mobiles. Testing each device involves assessing over 100 audio combinations for several days in their dedicated labs. Driven by user experience, the DXOMARK audio test protocol is based on a set of use cases and associated reference audio samples representing a broad range of voices, ambiences, music, and everyday audio environments designed to be comprehensive, robust, and repeatable as a basis for assessment.

T&M

Anritsu’s Signal Quality Analyzer gets approval A nri t su C o rpo rat ion ha s r e c e nt ly announced that its Signal Quality Analyzer-R Series MP1900A has been approved by PCI-SIG®*1 as a compliance test measuring instrument for PCI Express 4.0® (PCIe Gen4). The MP1900A is already approved as an R&D test instrument supporting Gen3 compliance tests and is now approved for the Gen4 test standards. Background To speed-up serial-bus interfaces of communications equipment and highend computers, the PCIe standard is transitioning from Gen3 (8GT/s) to Gen4 (16GT/s). PCIe Gen4 was adopted as a communications standard in August 2017 and has been discussed and examined for compliance testing since then. As part of this process, the MP1900A was approved as a compliance test measuring instrument for PCIe Gen4

based on the results of testing at the May 2019 PCI-SIG Compliance Workshop, and the MP1900A has been in use for certifying PCIe products since August 2019.

solution is ideal for automating Tx/Rx LEQ tests*2 required for compliance testing. Moreover, built-in analysis functions with excellent reproducibility support analysis of signal quality issues caused by high-speed transmission path losses. All Gen1 to Gen4 tests are supported by a single MP1900A, which also supports the new Gen5 standard. Furthermore, 32-Gbaud PAM4 signals required by the future Gen6 standard are also supported. As a result, the MP1900A helps cut PCIe design, inspection, and certification work burdens, while also improving quality.

MP1900A Test Solution Outline The PCI-SIG-approved MP1900A is a high-performance, multichannel, bit error tester with world-beating output waveform quality, high input sensitivity, and a built-in jitter and noise source. With these high-performance hardware features, the MP1900A PCIe Gen4 test

*1 PCI-SIG The PCI-SIG business organization handles and manages PCI industry open standards. It decides reference I/O (Input/Output) specifications for the PCI market meeting members’ needs. With nearly 800 current members, PCISIG is the market leader.

Flex Boston Innovation Center Keysight, Integrated Device focusing on medical devices Technologies Alliance Staying relevant in the medical device industry requires operating “with real-time information, comprehensive capabilities, and a global physical infrastructure to deliver speed, scope, and scale to keep pace in this rapidly changing market.” This model is at the heart of the Flex Platform, created by Flex as it transformed itself from a traditional electronics manufacturing Services Company into what it refers to as a “sketch-to-scale” provider. While in Boston for AdvaMed’s Medtech Conference, I toured the company’s Boston Innovation Center. The center is “a concepting, design, and production facility.” It is designed to support all sizes of companies from startups to large multinationals. Its services include everything from sourcing disruptive technologies to accelerating product development. “We bring insights to customers — what will technology look like in the future,” says Ben Cooper, the center’s General Manager. “We have the ability to look across industries, and then help companies connect in a way that’s meaningful.” The Boston center is the company’s newest center. It provides a collaborative approach to design and engineering as well as development of early stage product concepts for new market applications. Technology experts ensure that vision is realized. The facility has 17,000 sq ft of engineering and prototyping space to support product and system design, prototyping, assembly, and testing.

Keysight Technologies has recently announced an extended collaboration with Integrated Device Technologies, Inc. (IDT). “Our close collaboration with Keysight enables us to validate that our 5G beamformers and other components deliver the high performance and low-power consumption essential for 5G network infrastructure equipment,” said Naveen Yanduru, Vice President and General Manager of IDT’s RF product division. Network equipment manufacturers (NEMs) use beamforming technology in 5G NR base stations to improve reliability and efficiency in the mmWave frequency spectrum. Beamforming uses multiple antennas (a phased array) to transmit the same signal, thereby increasing the signal strength to and from a chosen direction to extend cellular coverage, delivering higher data rates and an improved radio environment. As the bandwidth of integrated circuits using 5G technology increases, it is important to characterize their performance over wider frequency ranges. This is why IDT uses Keysight’s high performance family of vector network analyzers (VNAs) to validate the performance of its beamformer ICs. Keysight solutions enable IDT, and other leading designers of ICs, to measure key parameters such as scattering (S) parameters, 1dB compression point (P1dB), third-order intermodulation products (IM3), and error vector magnitude (EVM).

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T&M

NetAlly launches a powerful network testing solution

NI Releases Sub THz Testbed for 6G Research

NetAlly has recently announced the release of EtherScope nXG Portable Network Expert. NetAlly’s EtherScope nXG enables network engineers and technicians to quickly discover, test, verify and troubleshoot enterprise access networks. As the first handheld tool to offer a single user interface (UI) that fully integrates both wired and wireless network test data, the EtherScope nXG dramatically increases network visibility, accelerates and simplifies testing, and simplifies team collaboration. This is the first portable tool with the right combination of capabilities to “break the Layer 2 ceiling” – allowing users to easily identify wireless clients not just by MAC address, but by IP, name and type, delivering visibility most Wi-Fi tools cannot provide. “As today’s networks continue to grow in complexity, network teams often struggle to keep pace. They need better solutions that help streamline their network testing and troubleshooting process,” said Mike Parrottino, CEO, NetAlly. “To help address these challenges, we designed EtherScope nXG to be the most comprehensive and powerful portable network tester available.” EtherScope nXG’s all new UI combines wired and wireless data analysis and purpose-built hardware to support a broad range of technologies like line-rate 10G (over copper and fiber), NBASE-T, Wi-Fi 5/Wi-Fi 6, and high-power PoE (Power over Ethernet).

NI has recently announced a real-time sub THz software-defined radio (SDR) for 6G research built on NI’s mmWave Transceiver System (MTS) and Virginia Diodes’ (VDI) radio heads. “Researchers need access to sub THz testbeds to prototype multiple wireless use cases. These testbeds must be highly flexible but also offer cutting edge performance in order to explore the boundaries of wireless performance at these very high frequencies,” said James Kimery, Director of wireless research, NI. “NI’s MTS when combined with the VDI radio heads create an excellent platform for exploring sub THz and THz spectrum and associated applications to spur innovation on the way toward 6G.” Using VDI radio heads, the frequency range of the MTS can extend into the sub THz range. Because this testbed is built using SDRs and FPGAs, the software can be upgraded and customized to meet a wide range of research needs and applications. Users can leverage existing software reference designs for channel sounding or wireless communications protocols to create a real-time testbed for 6G research. The development cycle of a typical wireless standard is approximately 10 years. As the commercial rollout of 5G begins in 2019, wireless communications researchers are already investigating the technology and ideas that will serve as the foundation of 6G. The use of sub THz and THz frequencies has numerous applications for communications and is likely to be a major area of 6G research in the foreseeable future.

For autonomous vehicles, NI tests the computing platform

NI has recently announced a solution to test the computing platform for autonomous vehicles (AVs). NI’s solution for testing the complex computing platform consists of modular hardware with a configurable set of I/O that includes power measurements, thermal performance, automotive networks, sensor interfaces and PCB electrical measurements. AVs are among the most complex systems being tested today. At the heart of the AV is a powerful computing platform that analyzes the environment around the vehicle and determines the appropriate action to help ensure the safety of the car and its surroundings. As automotive companies design and build their own AV supercomputers that combine automotive-specific networks and sensors with consumer electronic components for this computing platform,

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a critical balance must be struck between high computing power and adequate efficiency. Validating this balance in the computing hardware requires a flexible test platform that can continually be adapted through software. By working with lead customers, NI has proven that it can meet the challenges of today and tomorrow with a single platform for testing automotive networks, digital protocols, sensor interfaces and power consumption capabilities. This test platform, scalable to production, is ideal to test the custom

supercomputers that will enable the deployment of AVs. “With over 40 years working with teams automating V&V test systems, NI is a trusted advisor for helping test engineering groups maximize test effectiveness, enabling them to release quality products efficiently and confidently,” said Chad Chesney, General Manager and Vice President, Transportation, NI. The inherent flexibility in the modular design of NI’s solution means that automotive test teams can add measurement capabilities to the test system without buying a new system or starting from scratch. The footprint of the PXI-based system is also much smaller than that of a system composed of benchtop instruments. The holistic platform approach simplifies system complexity and reduces the burden on test teams to integrate disparate pieces of test equipment.

T&M

Siemens announces solutions to help industries Siemens Digital Industries Software announces new Simcenter system simulation solutions, designed to help industries meet the need for more accurate and competitive system modeling. Simcenter system simulation model authoring tools bring together Simcenter Amesim software, a simulation platform for mechatronic systems, and Simcenter Flomaster software, a vertical solution for thermo-fluid systems of any size and complexity. This unique joint solution can further improve userfriendliness and openness, with application capabilities to foster collaboration and enable users to continually innovate to meet the demands of growing engineering complexity. With applications for the automotive, aerospace, marine and energy and utilities industries, enhanced mechatronic and thermo-fluid system modeling capabilities can help manage complexity and improve model process efficiency. Additional enhancements regarding electrification can help assess both the electromechanical performance and thermal behavior on driving cycles more accurately. Simcenter system simulation solutions 2019.2 offer an improved user experience, allowing for

more scalability and reduced turnaround time on modeling, as well as increased openness and interoperability.

Tektronix Announces the Availability of Two SMU

VIAVI signs an agreement with Tait Communications

Tektronix has recently announced the availability of two new source measure unit (SMU) modules for the Keithley 4200A-SCS Parameter Analyzer that can perform low-current measurements even in the presence of high load capacitance due to long cables and complex test setups. Among the notable test applications facing this challenge are LCD display manufacturing and nano FET device testing on a chuck.The new 4201-SMU and 4211-SMU are designed specifically for test setups with long cables, switch matrices, gate contacts to the chuck, and other fixturing. Such test setups, which are required in a number of low current measurement applications, can increase the capacitance seen at the output of the SMU, even though the device under test itself has very low capacitance. When the test connection capacitance is too high, the resulting low current measurements can become unstable. To address these challenges, the new modules can source voltage and measure current with longer cables or more connection capacitance than possible using traditional SMUs. This saves researchers and manufacturing test engineers the time and cost that would otherwise be spent troubleshooting and reconfiguring test setups. “High load capacitance resulting from elaborate test setups is a growing problem as current levels are reduced to save energy, as is the case with testing the large LCD panels that ultimately end up in smartphones or tablet computers,” said Peter Griffiths, General Manager Systems & Software, Keithley division of Tektronix. “Our new modules excel at making stable low-current measurements and will immediately benefit many of our existing and future customers.”

VIAVI Solutions has recently announced an agreement with Tait Communications. The agreement between VIAVI and Tait is to provide automated test capabilities for Tait P25 and DMR Series radios on the VIAVI 3920B Radio Test Platform, formerly an Aeroflex offering. These options give end-users automated testing for Tait TP/ TM 9100, TP/TM 9300, and TP/TM 9400 radio families. “We are pleased to support Tait P25 and DMR Series mobile and portable radios on the 3920B,” said Edward Latimer, Product Line Manager of Radio Test Sets for VIAVI Solutions. “Tait’s dealers and end users are now able to conduct fast and accurate automated testing which conforms to Tait’s specifications.” “We work closely with our partners to strengthen our portfolio of solutions and meet our clients’ evolving needs,” said Ellery Hurn, Partner Manager, Strategic Partnering at Tait Communications. “We are pleased to work closely with VIAVI to provide additional value to our clients and further strengthen our Tait Tough reputation for endurance and resilience.” The automated radio test applications use the precision instrumentation of the 3920B to quickly perform automated tests to specifications defined by the manufacturer. Testing can be performed in less time, minimizing service and support costs for end users and dealers. VIAVI offers a broad selection of integrated, portable testing equipment and solutions for critical communication radio users across a variety of industries, including public safety, homeland security, military and paramilitary, private security, utilities, railroads, public transportation, and hospitals.

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INDUSTRY KART

element14 introduces its private label collection element14 has launched a new collection of affordable components, tools and test equipment under its new brand, Multicomp Pro. This collection brings the very best products from Multicomp, Duratool, Tenma, ProPower, Pro-Elec and Pro-Signal under one brand, making it easier for design engineers, technicians and production facilities to identify high value alternatives, whilst assuring production-grade quality they can rely on. Customers purchasing from the Multicomp Pro brand can benefit from reduced upfront costs and productlifetime savings. Products from element14’s new Multicomp Pro brand are ideal for equipping design and development labs, service facilities and educational establishments where budgets might be restricted. Original Equipment Manufacturers (OEMs) and Contract Electronics Manufacturers (CEMs) can also benefit from lower cost, production grade components.

Chris Haworth, Managing Director of CPC and Global Head of Private Label at element14 said: “Our new Multicomp Pro brand focusses on the very best private label products, carefully selected from leading global brands, giving customers access to quality products with incredible value, and average savings of 30% compared to branded alternatives. 97 percent of our customers say that they

would recommend the products to a colleague, making Multicomp Pro the engineer’s choice” The Multicomp Pro range will stock more than 60,000 quality components, tools and equipment, exclusively available and ready to ship globally from element14. The Multicomp Pro product range is available from Farnell in EMEA, Newark in North America and element14 in APAC.

Mouser Electronics Stocks Full Analog Front End with Qorvo Active-Semi Portfolio Integrated ADC

Electronics has recently announced that it is stocking the Active-Semi line of products. The programmable power management solutions provide customers with compelling simplicity, efficiency and design flexibility, resulting in smaller footprints, lower bill of material costs, and reduced time to market.Qorvo, a leading provider of innovative RF solutions that connect the world, recently acquired Active-Semi as part of Qorvo’s Infrastructure and Defense Products (IDP) group. With the addition of Active-Semi products, Qorvo gains a portfolio of analog and mixed signal systems-on-chips (SoCs) used in charging, powering and embedded digital control systems for end applications, such as industrial, commercial and consumer equipment. Qorvo’s power management products include power application microcontrollers, DC/ DC, AC/DC, PMU and LED drivers that significantly reduce solution size and cost while improving system-level reliability. Power efficiency is increasingly a core requirement in electronic applications in IDP’s existing markets, including 5G base stations, active phased arrays for defense, automotive, and IoT. Active-Semi’s programmable mixed signal power solutions deliver simplicity, efficiency and flexibility, resulting in lower bill of material (BOM) costs, smaller footprints, and faster time to market.

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Analog Devices recently introduced the AD4110-1 Analog Front End with integrated 24-bit ADC for industrial process control systems. AD4110-1 is a universal input AFE with an integrated ADC that allows customers to design a “platform” input module that they can configure for multiple functions. This saves significant R&D cost, reduces time to market and requires less design resources. The high voltage inputs of the AD4110-1 are fully software configurable for current or voltage signals, allowing direct interface to all standard industrial analog signal sources. One reference design replaces many, reducing module size and decreasing cost of ownership. Software-configurable I/O is a key factor in the implementation of Industry 4.0. The AD4110-1 is available today in 40-lead LFCSP packages. Key features include: Integrated, fully differential programmable gain amplifier (PGA) that offers 16 gain settings from 0.2 to 24 Provides internal, front-end diagnostic functions to indicate overvoltage, undervoltage, open wire, overcurrent, and overtemperature conditions. The high voltage input is thermally protected, overcurrent limited, and overvoltage protected.

INDUSTRY KART

Digi-Key to Sponsor Seven Microchip MASTERs Events

Arrow Electronics Discussed 2019 Financial Results

Digi-Key Electronics has announced it will sponsor seven upcoming Microchip MASTERS events in November and December Digi-key tied up as the Gold Sponsor for all three China events, the Silver Sponsor for the India event, the Platinum Sponsor for the Korea event, and the Silver Sponsor for the two Taiwan events. “We are thrilled to support the work of the Microchip MASTERs premiere technical training events,” said David Stein, vice president, global supplier management for Digi-Key. “The MASTERs events continue to arm system design engineers of every level with the information and hands-on training they need to scale the learning curve and get their products to market faster. The mission of the Microchip MASTERs could not align more with the values and mission of Digi-Key, and we’re proud to be a part of these events.” The Microchip MASTERs conferences are held annually for embedded control engineers around the globe. The training sessions and classes cover a broad range of topics and are taught by Microchip’s own application and design engineers. “Attendees have consistently conveyed Microchip MASTERs is the premier technical training event in the industry,” said Ken Pye, Microchip’s vice president of worldwide applications.

Arrow Electronics has recently held a conference call to discuss thirdquarter 2019 financial results. The live conference call was accessible by telephone at 1-877-791-0231 (toll-free) or 1-647-689-6624 for participants outside the United States and Canada. The conference ID is 2985782. The conference call will also be available via webcast. Audio replay of the call will be available through Nov. 14, 2019. The replay numbers are 1-800-585-8367 for the United States and Canada and 1-416-621-4642 for callers from other countries. The conference ID is 2985782. Arrow Electronics guides innovation forward for over 200,000 leading technology manufacturers and service providers. With 2018 sales of $30 billion, Arrow develops technology solutions that improve business and daily life.

Avnet and Infineon Decide to Support Startups and Incubators Avnet has recently signed a Memorandum of Understanding (MOU) with Infineon Technologies Asia Pacific to jointly support startups and incubators from technology-related sectors in Southeast Asia. Startups and incubators will now be able to access Avnet and Infineon’s expertise, ecosystem, and technological facilities to accelerate the process of bringing their products to market. The cooperation will give startups access to laboratory facilities, technical support, and guidance in areas of solution design, testing and certification based on Infineon’s products and manufacturing services. To further develop the innovation ecosystem, Avnet and Infineon will also collaborate with incubators to jointly organize workshops, seminars, and events for stakeholders to discuss current and emerging technology trends. Tan Aik Hoon, Regional President, South Asia, Korea and Avnet United said, “Avnet has been at the forefront of enabling innovation in the region. Our partnership with Infineon will allow us to further enhance our innovation-enabling capabilities for startups at every stage of the product lifecycle so they can get to market faster. We see great potential in Southeast Asia as a region for the development of innovative technologies with its thriving and vibrant entrepreneurial ecosystem.” Lim King Soon, Vice President, Distribution Management,

Infineon Technologies Asia Pacific Pte Ltd said, “We welcome Avnet in bringing onboard their expertise including IoT, design and supply chain that greatly complements Infineon’s extensive portfolio of sensors, microcontrollers, actuators and embedded security to develop the next generation of intelligent applications and IoT solutions linking the real and the digital world.”

INDUSTRY KART

New Yorker Electronics Expands its Portfolio New Yorker Electronics has added the new Amphenol RF 12G MCX Connectors to its lineup of 12G Optimized Amphenol RF Connectors. Designed specifically for 4K/Ultra-HD broadcast applications, they are used largely in 4K/8K Video Cameras, Mobile Broadcasting, Digital Signage and other state-of-theart video applications. These new PCB Connectors and Cable Connectors boast standard 12Gbps performance per SMPTE. Amphenol RF’s line of high-frequency 75-Ohm Micro Coaxial connectors support data transfer rates of up to 12Gbps. This enables the transmission of high-resolution, uncompressed video signals. This new RF connector provides 4K and Ultra-HD quality signals in a micro-miniature package size and is ideal for broadcast modules and video routers. This expanded product line features mount configurations designed with the reliable push-on coupling mechanism. The MCX connectors join New Yorker Electronics’ already robust portfolio of BNC and HD-BNC products that are also optimized to support data transfer rates up to 12Gbps. The addition of 75 ohm 12G MCX connectors brings versatility to the current line, allowing customers to terminate to the board in designs where the BNC or HD-BNC is not able to be mounted directly. Utilizing the MCX connector allows the 12G signal to be carried from the panel to the PCB using a single transmission line without compromising the quality of the video. The 12GSDI MCX interconnect solutions are available as PCB connectors with edge-mount, straight or right-angle configurations, or as cable connectors for industry standard Belden 4855R cable. Ideal applications for these MCX connectors

include 4K/8K video cameras, mobile broadcast, digital signage, remote viewing and video encoders and routers. Features and Benefits: · 12Gbps performance per SMPTE standard · One channel for 4K or Ultra-HD quality · Variety of PCB and cable products · Familiar push-on coupling mechanism

RS Components DC Power Supplies with Reinforced Isolation

RS Components has introduced the new TRI Series of high-voltage regulated DC/DC converters from power supply specialist TRACO Power. Aimed primarily at electronic engineers designing IT equipment for industrial, instrumentation and transportation applications, TRI Series power converters combine a sophisticated reinforced isolation system, able to withstand high test voltages, with high common-mode transient immunity. The TRI Series offers five power options: 3.5W, 6W, 10W, 15W and 20W. The first three options, housed in compact 1.25 x 0.80 x 0.40-inch DIP-24 packages, provide 7071VDC regulated I/O isolation and 9000VDC peak isolation of up to one second duration. The 15W and 20W models, with a 2.00 x 1.00-inch footprint, feature 5940VDC I/O isolation and 8000VDC peak isolation up to one second. All models have a 1000VAC RMS

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working voltage and common-mode transient immunity (dv/dt) of 15kV/µs. Other TRI Series characteristics include low no-load power consumption ranging from 96–192mW for 3.5W models to 240– 480mW for 20W versions; high efficiencies of up to 90%; and overload, overvoltage and short circuit protection. Mean time between failure is over one million hours. TRI Series DC/DC converters offer 12V (9–18V), 24V (18–36V) and 48V (36–75V)

input voltage options with a wide 2:1 input range, and precisely regulated output voltages of 5.1V, 12V or 15V single mode or ±12V or ±15V dual mode. A 4.5–9V input range option is available for 3.5W models. An internal filter enables all TRI power supplies to comply with EN 55032 class A EMC emission requirements for multimedia equipment used in non-residential environments — including professional IT, broadcast, audio-visual and lighting control products — without any external components. All models are safety qualified to IEC/EN/UL 62368-1 with IECEE CB Report, operating safely over a wide temperature range from –40°C to +85°C. All TRI Series DC/DC converters are supported by a three-year warranty provided by TRACO Power. They are stocking now at RS in the EMEA and Asia Pacific regions.

INDUSTRY LAUNCH

Analog Devices AD4110-1 Analog Front End Analog Devices has recently introduced the AD4110-1 Analog Front End with integrated 24-bit ADC for industrial process control systems. AD4110-1 is a universal input AFE with an integrated ADC that allows customers to design a "platform" input module that they can configure for multiple functions. This saves significant R&D cost, reduces time to market and requires less design resources. Features: • Integrated, fully differential programmable gain amplifier (PGA) that offers 16 gain settings from 0.2 to 24 • The high voltage input is thermally protected, overcurrent limited, and overvoltage protected.

Availability: The AD4110-1 is available in 40-lead LFCSP packages.

Arm IP Brings Smart, Immersive Experience Arm launches two new mainstream ML processors, as well as our latest Mali graphics and display processors. Together, this IP represents Arm’s ability to scale, bringing premium experiences to everyday and ultra-efficient consumer devices. Features: • Ethos-N57 and Ethos-N37 NPUs • Mali-G57 • Mali-D37

Applications: Mainstream Electronics Market

Availability: Available Now

BalluffNew Intelligent Displacement Sensor With their BMP series Balluff has added a new intelligent displacement sensor.This sensor provides not only the absolute position signal for the stroke travel of a piston via IO-Link but also information about the sensor status and the current ambient conditions. Features: • It monitors for example the sensor temperature, • Number of starts and issues warnings when a configurable limit value is violated. • Both since the last service and the last start-up.

Applications: Assembly, handling and factory automation.

Availability: Available Now

CypressUSB-C Controller-ACG1F Cypress Semiconductor announces latest USB-C controller, ACG1F. ACG1F is a cost-effective single-port USB-C controller used for systems which need to convert legacy USB Type-A ports to USB Type-C ports.

Features: • VBUS load switch for power and fault protection. • 32-bit Arm Cortex-M0 processor with 16-KB flash for USB-C programmability. • Latest USB Type-C Connector System Software Interface (UCSI) driver implementations and extensions from Microsoft.

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Applications: Mainstream and entrylevel notebooks and desktop PCs

INDUSTRY LAUNCH

Electrocube’s Capacitor Provides Long Life Electrocube has announced the release of the new Electrocube 958A Series of High Current DC Link Metallized Polypropylene Film Capacitors.

Features: • Extended electrode construction • Tolerances available to ±5%, ±10% • Polymer case & dry construction

Applications: • EV Power Conversion • Aircraft Power Systems • Battery Chargers • High Pulse Applications

Availability: Available Now

Electrolube New Range of Thermal Gap Fillers Electrolube introduced a versatile new range of gap-filling products with excellent thermal performance. Electrolube’s GF400 is a two part, liquid silicone-based gap filler, which can either be cured at room temperature or accelerated with heat.

Features: • Alternatively, the gap filler can be cured at 25°C for 12 hours or 90 minutes at 60°C. • G F400 is soft and compliant, making it ideal for low stress applications

Applications: Printed circuit board assembly and housing electronic components discretely to automotive electronics, including HEV and NEV batteries, power electronics, LEDs and fiber optic telecoms equipment.

Infineon’sNew Form of Interaction Chip Infineon Technologies has developed a 60 GHz radar chip, which enables a new form of interaction between users and their devices. Infineon, while using an integrated antenna system, it sensesthe presence and movement of people and objects with high precision or measures distances and speeds. Features: • This chip is the base for Google’s Soli technology and has now been integrated for the first time into a smartphone, so that it can also be controlled by gestures. • Infineon’s radar technology has its roots in the automotive sector. • Radar sensors have been effectively measuring distances, speeds and movements while driving for decades.

Dual channel PPTC Protects Telecom Equipment Littelfuse has recently announced a new series of 250V Telecom PPTCs designed to help make telecom and network equipment more reliable. TheLittelfuse’s TSM250-130 series protects against power cross and induced power surges as defined in ITU, Telcordia GR1089 and IEC 62368-1.

Features: • T wo 250V PPTCs in single housing reduces PCB area by 50%. • Resistance matched PPTCs offer Tip and Ring resistance balance.

Applications: • Customer Premise Equipment (CPE) • Central Office (CO) equipment • Subscriber Line Interface Cards (SLIC) • VoIP port on set top boxes

Availability: The TSM250-130 Series PPTCs are available in tape and reel format in quantities of 3,000.

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INDUSTRY LAUNCH

Maxim MAX17853 for Mid-to-Large Cell Count Configurations Designers can now achieve ASIL-D compliance for automotive applications using just a single chip for a safer, more cost-effectivebattery management system with the MAX17853 battery monitor IC from Maxim Integrated Products.MAX17853’sunique flexible architecture called Flexpack allows customers to rapidlymake changes to their module configurations to quickly respond to market demands. Key Advantages: Safety: The MAX17853 is the only mid- to large-size cellbattery management solution that enables ASIL-D compliance fortemperature, cell voltage and communication. Ease of Design: Flexpack architectureallows customers to make changes to their module configurations without spinning and qualifying additional boards.

Availability: Targeting mid-to-large cell count configurations for automotive applications

Microchip Simplifies Hardware-Based IoT Security Microchip has introduced the industry’s first pre-provisioned solution that provides secure key storage for low, mid and high-volume device deployments using the ATECC608A secure element. Microchip’s Trust Platform for its CryptoAuthentication familyenables companies of all sizes to easily implement secure authentication. Features: • Device credentials are pre-programmed, shipped and locked inside the ATECC608A for automated cloud or LoRaWANauthentication onboarding. • As the first solution to provide ready-to-go secure authentication for the mass market, the first tier – Trust&GO – provideszero-touch pre-provisionedsecure elementswith a Minimum Orderable Quantity (MOQ) as low as 10 units.

Availability: Available Now

ROHM Presents New 4-Pin Package SiC MOSFETs ROHM has recently launchedsix new trench gate structure SiC MOSFETs (650V/1200V).The SCT3xxx xR series utilizes a 4-pin package (TO-247-4L) that maximizes switching performance, making it possible to reduce switching loss by up to 35% over conventional 3-pin package types (TO-247N) for lower power consumption in a variety of applications.The SCT3xxx xR series consists of SiC MOSFETs utilizing a trench gate structure. Features: • 4-Pin package (TO-247-4L) reduces switching loss by up to 35% • With conventional 3-pin packages (TO-247N), the effective gate voltage at the chip reduces due to the voltage dropped across the parasitic inductance of the source terminal.

Applications: UPS Systems, Solar Power Inverters, Power Storage Systems, EV Charging Stations, Power Supply for Server Farms and Base Stations and more

Socionext New Next-Gen Radar Sensors Socionext unveiled a new series of radio-wave ranging sensors for smart home and other IoT devices.

Features: • Detect location and movement of persons with high sensitivity. • T hey are highly useful in developing new services and functions based on information about “human behavior”, while also addressing privacy concerns.

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Applications: Home appliances, mobile devices and industrial equipment.

Availability: Available now in samples, with volume production scheduled for the first quarter of 2020.

INDUSTRY LAUNCH

Southco Extends its Line of Captive Hardware Southco has extended its successful line of captive hardware with a new version that features lever-actuated operation for faster and easier latching and unlatching of electronic components. Features: • Improved grip for simplified hand operation and saves time when installing or removing components in tight spaces.

Applications: Electronic Components

Availability: Available Now

ST Present STM32H7 MCUs The new STM32H7 microcontrollers (MCU) from STMicroelectronics are the industry’s highestperforming Arm Cortex-M general-purpose MCUs.The new STM32H7 combines dual-core punch with power-saving features and enhanced cyber protection.

Features: • T he new devices leverage a 480MHz version of the CortexM7and add a 240MHz Cortex-M4 core.

Applications: Simplify the design of smart objects in industrial, consumer, and medical applications

Availability: STM32H7 dual-core microcontrollers are entering production and samples are available now. A broad selection of packages is offered, including WLCSP.

TDK New ESD and EMI Combined Protection TDK Corporation has expanded its lineup of chip varistors with the new AVRF101U6R8KT242 for audio equipment, which offers both ESD and EMI protection.

Features: • Combined ESD and EMI protection • E xcellent ESD protection capability to IEC61000-4-2, level 4 • High permissible circuit voltage of 28 V DC

Applications: ESD and EMI protection of audio equipment such as smartphones, speakers and other wireless devices that operate in the 2.4-GHz band using wireless LAN and Bluetooth

Availability: Available Now

Vicor DCM2322 Family of Isolated DC-DC Converters Vicor DCM2322 Family matches the need of new modern rail infrastructure.Power density, efficiency and ease of use are critical considerations when designing isolated, regulated DCDC converter systems for modern rail applications. The newVicor DCM2322 Family provides power system engineers a smaller footprint option with input voltage ranges that meet multiple EN50155 standards. Features: • Engineers wide input voltage ranges of 43 – 154V and two more narrow input voltage ranges of 14 – 72V and 9 – 50V • Power levels ranging from 35 to 120W and efficiencies up to 90.5%.

Applications: Modern rail infrastructure

Availability: Available Now Package Size: 0.97 x 0.90 x 0.30in (22 x 23 x 7mm)

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Enhanced Protection for LEDs in Challenging Environments Over the past 10 years the use of LEDs for home and commercial lighting has increased exponentially, with a wide range of applications and specialist features that incandescent and fluorescent lighting systems simply cannot meet. The improvements in the efficiency of the LED over the past few years has also lead to a considerable improvement in the lifespan of the component, which is now substantially greater than both the traditional incandescent and fluorescent lighting technologies. This has meant that for a number of applications, LED lighting is now regarded as very low or even maintenance free, and is widely used for road, traffic and vehicle lighting. The potential energy savings that can be obtained from the use of LEDs has indisputably driven the global acceptance of this comparatively new technology. However, the low energy consumption is only one of advantages available from the use of LEDs. As a result of their physical characteristics â&#x20AC;&#x201C; i.e. small size and relatively low weight, they have exploded the boundaries of possibility for both lighting and lighting effects. This has effectively changed our concept of the LED as a simple white indoor bulb replacement to a multi-coloured, aesthetically pleasing lighting product with options for some

really challenging environments. The increasing variety and complexity of applications is creating new challenges in terms of protective materials and users require the highest level of performance available. In short, protective materials must ensure that the LED can perform in all environments, whether this be an internal application in Europe, outdoor street lighting in India or underwater lighting in Australia. LEDs are sensitive electronic components and often require additional protection against mechanical damage, moisture and other environmental factors. The use of an encapsulation resin to protect LEDs has become increasingly common over the past few years. The selection of the resin is dependent upon a number of different factors; the viscosity of the mixed system, useable life and gel time for the liquid properties, as well as the hardness, density, colour and operating

temperature of the cured resin. When directly protecting the LED, there are a number of essential factors; key amongst these is the clarity of the material applied to ensure the maximum utilisation of light output from the LED. In addition, any potential changes that can occur over the lifetime of the LED must also be considered. Electrolube have developed a number of polyurethane encapsulation resins that cover a range of different property requirements that have been optimised for the LED encapsulation market. Two component (2K) resin systems are designed to offer the ease of handling and flow to allow the liquid resin to flow into the housing and around the LEDs, yet will react to form a crosslinked polymer that is tough and protects against the environment. Polyurethane resins are available in a range of different size packs, which are designed to allow both manual and machine mixing and dispensing. For low volume or prototype work, often manual application is the best option. While for series production, machine application is by far the preferred method as it allows for the production of a consistently mixed resin, which is independent of the machine operator and the unit into which the resin is being applied.

Human Centric Lighting Market to Cross $6bn by 2025

According to Global Market Insight, Human Centric Lighting Market is forecast to register its name in the billion-dollar fraternity down the line of six years. The report says that it will be exceed a revenue of USD 6 billion by 2024 with a projected CAGR of 25% over 2019-2025. The increasing adoption of smart lighting technology in commercial & residential applications to gain energy efficiency benefits is driving the industry growth globally. The circadian rhythm-based lights aid in reducing visual & non-visual harms to humans and offer improved productivity in industrial & enterprise applications. The color, brightness, and temperaturevarying features offered through tunable

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fixtures in these systems support human psychology and sleep-wake cycles, resulting in health improvement of elderly care residents and patients. Additionally, the growing focus on the adoption of controllable, bodycentric, and low power consuming lights due to government initiatives and consumer awareness is creating

several opportunities for the human centric lighting market growth. Lighting fixtures and software are gaining high demand in the human centric lighting market globally due to the installation of fully transitional and controllable systems in new commercial, industrial, and healthcare facilities. The software used in these systems allows users to control and change the light settings, color, and brightness levels depending on the requirements. The service segment including professional, managed, and consulting services is witnessing high popularity due to increased awareness of application industries and initiatives for adopting body dynamic light solutions.

Littelfuse Expands High-Temperature TRIAC Thyristor Series Littelfuse has announced an additional five series of high-temperature Alternistor TRIAC switching thyristors. The thyristors are designed for use as semiconductor switches in appliances and equipment powered by line AC voltages up to 250VRMS. Available in five compact, surfacemount and through-hole packages, these components expand the Littelfuse TRIAC product line by making high 150°C maximum junction temperature devices available in 600V to 800V with ratings of 12A, 16A, 25A, 30A and 40A. This combination of high temperature capabilities, space-saving packaging and choice of current ratings makes them well-suited for Internet of Things (IoT) smart home applications that require compact design but don’t involve continuous high currents. Potential applications including: • Kitchen and Home Appliances • Tankless Water Heaters • Electric Tools • Lighting Dimmers

The high-temperature Alternistor TRIACs include these key benefits: Easier thermal management, especially in application with limited or no heat sinking. Mechanically and thermally robust clip-attach packages offer higher field reliability. Enables designers to use smaller board sizes in low power applications. Ensures higher surge capability to withstand short-duration overload conditions. “The combination of the robust clip-attach assembly design and the maximum operating junction

temperature ensures the high surge capability needed to withstand shortduration overload conditions,” “This important extension to our TRIAC product portfolio opens the door for product designers to include 250V AC applications with current ratings up to 40A,” said Koichiro Yoshimoto, Business Development Manager, Semiconductor Business Unit at Littelfuse. “By offering more current rating choices in a variety of surface-mount packages utilizing our clip-attach assembly, design engineers now have the freedom to minimize board sizes for low power applications, while also ensuring excellent field reliability and longer product life.” Availability High-temperature TRIACs are available in these popular packages: TO-220AB, TO-220 Isolated, TO-263 (D2-PAK), TO-218 Isolated (TOP3 Ins) and TO-218X Isolated with loop leads unique to Littelfuse.

Signify Announces its Agreement with Eaton Signify has recently entered into a definitive agreement with Eaton to acquire Cooper Lighting Solutions for USD 1.4 billion (approx. EUR 1,270 million) in cash. “Today’s announcement confirms the strategic importance of the North American market for Signify. This acquisition will substantially strengthen our position in this attractive market,” said Eric Rondolat, CEO of Signify. “We look forward to welcoming the team from Cooper Lighting. They have built a high-performance company based on professionalism, truly innovative offers and a long and strong relationship with their customers. We share a genuine passion and single focus for Lighting and a successful track record in innovation. We will join forces to further develop connected lighting and provide our customers with the highest level of service while optimizing operational efficiencies.” A strategic transaction to strengthen Signify’s position in the North American professional lighting market This acquisition is fully in line with Signify’s

strategy to expand in attractive markets, enhancing Signify’s position in the North American market and improving the business mix. Signify and Cooper Lighting will maintain separate front offices: sales forces, agent networks, product and brand portfolios, marketing and product development teams. Both businesses will be able to strengthen their respective product portfolios, benefitting from an increased power of innovation as well as more competitive and cost-efficient offerings. Substantial cost synergy potential of more than USD 60 million per year The transaction is expected to generate substantial cost synergies of more than USD 60 million per year, largely to be achieved in the first three years. These tangible and well-identified cost synergies will stem from savings in the bill of materials as well as from supply chain and sourcing optimization. Compelling financial metrics Signify will acquire Cooper Lighting Solutions for a cash consideration of

USD 1.4 billion (approx. EUR 1,270 million) on a cash and debt-free basis. The enterprise value of the transaction net of the present value of tax benefits will be USD 1,313 million (approx. EUR 1,191 million), representing a multiple of 7.0x the expected 2018 EBITDA excluding synergies, and 5.3x including run-rate synergies. Transaction impact on Signify Upon closing of the acquisition, Signify will generate over 50% of its sales in the Professional segment, increasing the revenue base for its growing profit engines from EUR 4.9 billion to EUR 6.4 billion. The proportion of sales generated in the Americas increases from 28% to 40%. Financing Structure The acquisition is fully financed with debt, with committed bridge financing arranged. Signify intends to replace the bridge loan and the existing term loan debt obtained at IPO with a new financing structure before or shortly after the closing of this transaction.

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SECURITY REPORT

37pc Companies in India Experience Downtime of over 9 Hrs Organizations in India are facing longer downtimes and higher financial costs from cybersecurity breaches, compared to the global average, according to Cisco’s 2019 Asia Pacific CISO Benchmark Study, released today. According to the study, 37 percent of companies in India experienced a downtime of over 9 hours after their most severe breach in the past year, compared to just 30 percent globally. Longer downtimes often result in higher financial costs. With the number of cyber threats increasing rapidly, the real challenge lies in what comes after the alert is received. How many of the alerts are investigated, and how many of those found to be genuine are eventually remediated. According to the study, 46 percent of respondents reported receiving more than 5,000 threat alerts a day; however, 43 percent of them go unattended, compared to 39 percent in 2018. Of

the threats that were investigated and found to be genuine, only 41 percent were remediated (down from 52 percent in 2018). Cyber-attacks are evolving rapidly. Hackers are no longer just targeting IT infrastructure but have started to attack operational technology infrastructure, intensifying the challenge for companies. In India, 25 percent of respondents have already experienced an attack on their operational infrastructure (versus 21 percent globally), and 34 percent expect this trend to increase in the next year. The study also highlights that the use of multiple vendors is adding to the complexity for security professionals. According to the survey, 29 percent of companies in India are using more than 10 vendors, compared to 33 percent globally, and 4 percent are using more than 50 vendors, compared to 3 percent globally. When asked how challenging it is to manage a multi-vendor environment,

89 percent said it was somewhat or very challenging to orchestrate multiple vendor alerts. This is in line with the global trend, with 79 percent of respondents across the world highlighting this as an issue. The study, based on close to 2,000 security professionals from across the APAC region, highlights that security practitioners in the Asia Pacific are being kept busier than their global counterparts. Vishak Raman, Director, Security Business, Cisco India & SAARC, “Organizations in India have made significant improvements to their cybersecurity postures, in the last year. They have increased their security budgets, focused on training their workforce, and have started integrating their security infrastructure. However, high workloads and alert fatigue continue to be a big challenge. Hence, enterprises in India are looking at increasing the level of automation in their security strategy as well as opting for an integrated end-toend solution to secure their infrastructure.”

Automotive Cybersecurity Points of Exposure

IntSights, the threat intelligence company focused on enabling enterprises to Defend Forward has recently announced the firm’s new report. The IntSights’ report name was Under the Hood: Cybercriminals Exploit Automotive Industry’s Software Features. The report identifies the inherent cybersecurity risk and vulnerabilities manufacturers face as the industry matures through a radical transformation towards connectivity. Car manufacturers offer more software features to consumers than ever before, and increasingly popular autonomous vehicles that require integrated software introduce security vulnerabilities. Widespread cloud connectivity and wireless technologies enhance vehicle functionality, safety, and reliability but expose cars to hacking exploits. In addition, the pressure to deliver products as fast as possible puts a big strain on the security capabilities of cars, manufacturing facilities, and automotive data. “The automotive industry faces some

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unique challenges. Aside from the need to protect their IT and OT from attacks seen in other industries, they also have to identify issues and protect the vehicles themselves. With more onboard computers, more connectivity and more personal devices connecting - the attack surface is constantly growing and the attackers have taken notice,” said Etay

Maor, Chief Security Officer, IntSights. He also said, “A lack of adequate security controls and knowledge of threat vectors enables attackers to take advantage of easily acquired tools on the dark web to reap financial gain. Automakers need to have a constant pulse on dark web chatter, points of known exposure, and data for sale to mitigate risk.”

SECURITY REPORT

NTT Reveals ‘Risk: Value 2019 report’ NTT’s report identified good and bad practice for organizations researched as part of its Risk:Value 2019 report, scored across 17 key criteria. This NTT report revealed that under-30s score 2.3 in terms of cybersecurity best practice, compared to 2.9 for 30-45-yearolds and 3.0 for 46-60-year-olds. The data suggests that a person born in the digital age wouldn’t necessarily follow cybersecurity best practice. In fact, employees who have spent longer in the workplace gaining knowledge and skills and acquired ‘digital DNA’ during that time, sometimes have an advantage over younger workers. Under-30s, who are born into the digital age, on the other hand, are more laid back about cybersecurity responsibilities. They adopt different working practices and expect to be productive, flexible and agile at work using their own tools and devices. However, half of respondents think that responsibility for cybersecurity rests solely with the IT department. This is 6% higher than respondents in the older age categories. Top generational differences in attitudes to cybersecurity: Under-30s are more likely to consider paying a ransom demand to a hacker (39%) than over-30s (30%). This may be due to an impatience to get systems back up and running, or a greater knowledge of bitcoin and other cryptocurrencies. Growing up in a technology skills crisis, 46% of under-30s are worried their company doesn’t have the right cybersecurity skills and resources in-house. This is 4% higher than for over-30s. The desire for flexibility and agility could be affecting attitudes to incident response. Under-30s estimate that a company could recover from a cybersecurity breach in just 62 days – six days less than the time estimated by older age groups (68 days). Younger workers are more accepting of personal devices at work and consider them less of a security risk (71%) than older workers (79%). However, they’re more concerned about the Internet of Things (IoT) as a potential risk (61% compared to 59%). 81% believe cybersecurity should be

an item on the boardroom agenda, compared to 85% of over-30s. Key regional differences Under-30s in Brazil and France emerge as cybersecurity leaders in their countries; the result of the French government’s cybersecurity agency’s specific focus four years ago to raise awareness of cybersecurity issues among children and students. In Brazil, digital infrastructure was rolled out later than in North America, Europe and Asia Pacific, meaning that middle-aged employees have had less exposure to digital. In the Nordics, USA, Hong Kong and the UK – all digitally advanced countries – older employees have plenty of ‘digital DNA’, but these countries must ensure that under30s continue to learn and embrace cybersecurity skills and behaviours. Adam Joinson, Professor of Information Systems, University of Bath, an expert on the intersection between technology and behaviour, comments: “There is no ‘one size fits all’ approach to cybersecurity. The insights from the NTT study demonstrate that treating all employees as posing the same risk, or having the same skills, is problematic for organizations. We do need to be careful not to assume that the under-30s simply don’t care so much about cybersecurity. While this may be true in some cases, in others it is more likely that existing security policies and practices don’t meet their expectations about ‘stuff just working’. “If we want to harness the fantastic creativity and energy of younger workers, we need to think about security as something that enables their work, not something that blocks them from achieving their tasks. This is likely to mean security practitioners having to

fundamentally rethink the way security policies operate, and finding ways to improve the fit between security and the tasks employees are required to undertake as part of their core work.” Matt Gyde, CEO, Security, NTT Ltd., added, “NTT’s research has uncovered contrasting attitudes and behaviours on cybersecurity from different generations. It’s clear from the research that the workforce has a very different approach and attitude to cybersecurity, depending on age. Businesses must transform their approach to security if they are to engage all generations. Most important is ensuring that employees understand that security is everyone’s business, and isn’t simply a role for IT, as has been the case in the past. Different generations use technology in very different ways and business leaders need to recognise that strong cybersecurity practices for all generations within the business is an enabler and not a barrier. Security leaders should make themselves more approachable and talk the language of business, not IT. Education is also fundamental to change in cybersecurity behaviour, so make the learning process interesting and relevant to all generations in the workforce.” Cybersecurity best practice in a multigenerational workforce: Security culture must include all generations and be supported by a diverse range of employee champions, which includes age. Build a panel of younger employees and listen to their views on cybersecurity. Younger employees can be at their best and most motivated in an agile, productive, flexible workplace environment, where they are most likely to buy into the desired culture and behaviours. Security should be designed to enable the business. Make cybersecurity everyone’s business. Security leaders should be approachable to employees, through one-to-one interaction and more formal company events. Where skills shortages are most acute, support learning programmes, mentoring and consider external support.

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SECURITY UPDATES

Fortinet Announces Acquisition of enSilo Fortinet has recently completed the acquisition of enSilo, a privately-held advanced endpoint security company headquartered in San Francisco, California. The acquisition further enhances the Fortinet Security Fabric and strengthens Fortinet’s powerful endpoint and network security solutions by providing customers with advanced endpoint security that offers: Automated real-time protection against advanced threats and incident response services provided by a team of cyberthreat experts. Patented code-tracing technologies that thwart attacks and prevent exfiltration and ransomware, to help ensure PCI, HIPAA, and GDPR compliance. Lightweight agent with protection parity across multiple operating systems including Linux, Windows, and macOS. Unique coordinated security for the Internet of Things (IoT), through integrated access control and endpoint security functionality. Flexible on-premise and cloud deployment

with multi-tenancy and the ability to scale to hundreds of thousands of endpoints. The combination of Fortinet and enSilo will be a powerful offering for enterprises and service providers of all sizes. Fortinet intends to offer customers additional security effectiveness through the integration of enSilo’s endpoint detection and response (EDR) technology with Fortinet’s FortiSIEM solution. FortiInsight UEBA (user entity behavior analytics) features, and FortiNAC solution. Enterprises will gain superior endpoint visibility and tightly coordinated, dynamic control of network, user, and host activity within their environment. Likewise, MSSPs will be able to extract the full value of this combination and deliver a comprehensive and efficient managed detection and response (MDR) service. Furthermore, enSilo, a Fortinet Security Fabric-ready partner prior to the acquisition, already complements FortiGate Next-generation Firewalls, FortiSandbox, FortiSIEM and the FortiClient Fabric Agent, providing an additional detection and enforcement layer that

helps organizations further reduce the time to detect, investigate, and remediate malicious attacks. “Together, enSilo and Fortinet share the commitment to solve customers’ most difficult challenges and to protect the endpoint and their corresponding operations and data. Now, enSilo brings its patented approach for advanced endpoint protection and response to Fortinet and its broad security portfolio.” Roy Katmor, Chief Executive Officer and Founder, enSilo. “According to ESG research, 76% of organizations find threat detection and response more difficult today than two years ago. Vendors like Fortinet are tackling this problem by constructing an integrated security platform across endpoints, network and cloud infrastructure. The move to natively add enSilo’s automated EDR capabilities to the Fortinet platform should improve and accelerate alert correlation, leading to faster threat detection and incident response.” - Dave Gruber, Senior Analyst, Enterprise Strategy Group (ESG)

Industry’s First Silicon-Based Security for IoT Edge Devices

Micron Technology has recently introduced the industry’s first siliconbased security-as-a-service platform for protecting internet of things (IoT) edge devices. The new Micron Authenta Key Management Service (KMS) platform enables a cloud-first deployment model for a broad set of industrial and automotive applications. It allows installed Authenta-enabled devices to be switched on through a cloud-based service, mitigating some of the biggest challenges and complexities related to securing devices in an “everything connected” environment. The number of connected IoT devices deployed across markets such as automotive, enterprise, industrial control and connected home is expected to grow from 23 billion in 2019 to 30 billion by 2020. Securing these diverse devices remains

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a concern for system OEMs who want a simple solution that is cost-effective and independent of their choice of systemon-a-chip (SoC) hardware. Authenta KMS, along with its hardware root of trust embedded in NAND and NOR flash devices, equips OEMs to safeguard device functionality at the silicon level. Current methods adopted by the industry for protecting connected devices have their limitations and typically center on one of three common practices: adding secure elements, which is costly and difficult to scale; leveraging secure key injection

in the SoC, which creates a fragmented architecture; or simply doing nothing, which puts devices below market and compliance standards. “Securing a diverse set of IoT edge devices through the complete product lifecycle — from the supply chain to in-field management — requires a novel, simple, scalable and cost-effective approach,” said Amit Gattani, senior director of embedded segment marketing for Micron’s Embedded Business Unit. “Authenta KMS provides a trusted and unique silicon-tocloud service for all “connected things” using Authenta-enabled flash devices.” Micron’s Authenta KMS complements existing efforts to protect IoT networks through secure element functions in Authenta-enabled standard flash devices. Authenta KMS security-as-aservice platform allows installed secure flash devices to be activated and managed at the edge through a cloud-based service.

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NETWORKING UPDATES

New Age of SD-WAN Software-defined anything has a tendency to bring technology cycles back to life… remember SDN? Software-defined WAN is not just a service, but a new way of doing business. SD-WAN transformation is required – for service providers as a new way to operate on-demand and achieve true “Telco Cloud” enabled networks – for enterprises as a new way to manage their WANs with flexibility without compromising on performance and high-availability. Why now? MPLS circuits deployed in traditional WANs remain expensive, growing number of branches, home offices and wireless devices, slow response time for changes and value-add services, more applications (including mission-critical) are moving to the cloud and sensitive data dispersed across geographies, operators, enterprise domains. Introducing a comprehensive suite of SDWAN test solutions that allows you validate the increasingly complex, virtualized, and automated SD-WAN environment. Whether you are a SD-WAN vendor, service provider or an enterprise, Spirent ensures SDWAN to meet your expectations of cost savings in network operation, faster deployment

and increased performance. Built upon Spirent’s expertise for network validation and emerging MEF standards, service providers can now be confident that their SD-WAN implementations offer baseline SD-WAN capabilities; and SD-WAN vendors can continue focus on high-valueadded and differentiated features. Spirent’s TestCenter, Virtual and Cloud solutions help generate network and application traffic; emulate workloads and impairment conditions, and more. However, at its basic, the testing objective for SD-WAN functionality (depending on type of device under test) includes: Application traffic steering Dynamic path selection High availability with device and link failure L2-4 stateless traffic steering Load balancing Local Internet breakout Multi-tenancy QoS prioritization SD-WAN controller redundancy Service chaining VPN encryption Zero-touch provisioning Spirent is here to assure the promise of SD-

MALATHI MALLA

Director, Product Marketing Virtualization and Cloud solutions WAN starting from design, development to deployment phases. More blog series on how to unlock SD-WAN’s potential to become an autonomous, self-managing domain. Malathi Malla Malathi Malla leads Cloud, Data Center and Virtualization segment for Spirent. Responsible for the Product Marketing, Technical Marketing, and Product Management, she drives go-to-market strategy across Cloud and IP solutions. She has over 14 years of hi-tech experience at both Silicon Valley start-ups and large companies including Citrix, IBM, Sterling Commerce (software division of AT&T). Malathi also represents Spirent as Marketing prime through various open source communities like Open Networking Foundation and OpenDayLight.

Atos Completes the Acquisition of IDnomic

Atos has recently completed the acquisition of IDnomic, European leader in digital identity management infrastructure. With this acquisition, Atos reinforces its global leadership in cybersecurity and expands its offering in the field of digital identity management and PKI (Public Key Infrastructure) solutions. IDnomic’s expertise in PKI technology is applied to many everyday uses to protect the digital identities of people, machines and connected objects. Its SaaS (Software as a Service) trust solutions complement Atos’ cybersecurity product offerings – in particular identity and access management, data protection, management of security certificates and IoT security solutions. According to Pierre Barnabé, Senior Executive Vice-President, Head of Big Data & Cybersecurity at Atos: “We are

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delighted to welcome IDnomic to the Atos family. IDnomic’s expertise strengthens our ability to support our customer’s end-to-end in their cybersecurity needs. This acquisition allows us to consolidate our global leadership and address new security challenges related to hybrid cloud, certificate management automation, and the Internet of Things.” “Joining Atos is a great source of pride. This will enable us to support, together, the development of the multiple uses of digital identity as well as to enrich our offers to meet the many needs of our customers, who are increasingly demanding in terms of cybersecurity” said Coralie Héritier, CEO of IDnomic. “Atos’ acquisition of IDnomic is a ‘winwin’ scenario. IDnomic gains global reach and scale while retaining a European core. For

Atos, its digital identity proposition is enriched. Trust is built-in through IDnomic’s PKI presence, and capability added via an automated certificate lifecycle management offering deliverable through a scalable, as-a-service model” says Ralf Helkenberg, Research Manager of European Privacy & Data Security at IDC. With 5,000 cybersecurity experts and 14 Security Operations Centers (SOCs) worldwide, Atos was recently ranked 3rd in the world and 1st in Europe for security service management by Gartner1. IDnomic’s teams, which include more than 100 digital identity specialists, are joining Atos’ community of cybersecurity experts. In 2018, IDnomic generated €17 million in revenue. The current management will support IDnomic in this new phase within the group.

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EP CHINA SHANGHAI NOVEMBER 05-07, 2019 SHANGHAI

INTERNATIONAL TRADE FAIR FOR ELECTRONIC COMPONENTS, SYSTEMS AND APPLICATIONS

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SEMICON EUROPA MUNICH NOVEMBER 12-15, 2019 MUNICH

INTERNATIONAL TRADE FAIR FOR SEMICONDUCTOR TECHNOLOGY

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PRODUCTRONICA MUNICH NOVEMBER 12-15, 2019 MUNICH

INTERANTIONAL TRADE FAIR FOR INNOVATIVE ELECTRONICS PRODUCTION

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INDIA CONSUMER ELECTRONICS AND HOME APPLIANCES EXHIBITION NOVEMBER 14-16, 2019, MUMBAI

ELECTRONICS AND HOME APPLIANCES

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LED EXPO DELHI 2019 NOVEMBER 14-16, 2019 DELHI

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MODELL + TECHNIK STUTTGART NOVEMBER 21-24, 2019 STUTTGART

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POWER & ELECTRONICS

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AUTOMECHANIKA SHANGHAI DECEMBER 03-06, 2019 SHANGHAI

TRADE FAIR FOR AUTOMOTIVE PARTS, ACCESSORIES, EQUIPMENT, AND SERVICES

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SOUTHERN CHINA SMART MANUFACTURING FAIR 2019 DECEMBER 04-06, 2019, SZCEC, CHINA

ROBOTICS & SMART VISION, INTELLIGENT MONITORING & DETECTION, IOT & CLOUD COMPUTING

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THE RISE OF SMART MANUFACTURING & SMART INFRASTRUCTURE

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COSMO ELECTRICAL AND POWER EXHIBITION NOVEMBER 22-24, 2019, PUNE

IIOT INDIA 2019 DECEMBER 05-06, 2019, DELHI

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