www.globalsmtindia.in
South East Asia
Covering India, Thailand, Malaysia, Singapore, The Philippines and Hong Kong
Nanotechnology is now starting to find applications in electronics Head-in-pillow: Identifying and highlighting suspect solder joints BGA assembly reliability—PWB quality is the key
Volume 1 Number 2 Summer 2010
Erik Miller Interview Inside NEW PRODUCTS INDUSTRY NEWS INTERNATIONAL DIARY
Contents
South East Asia
Volume 1, No. 2 Spring 2010
Global SMT & Packaging is published monthly by Trafalgar Publications Limited. The journal is FREE to qualified professionals and is available by subscription at a cost of $380.00 for the current volume (twelve issues). Periodicals postage paid at Rahway NJ. Postmaster send address corrections to: Global SMT & Packaging, c/o Mercury International Limited, 365 Blair Road, Avenel, NJ 07001. No part of this publication may be reproduced, stored in a retrieval system, transmitted in any form or by any means; electronic, mechanical, photocopying, recording or otherwise without the prior written consent of the publisher. No responsibility is accepted for the accuracy of information contained in the text, illustrations or advertisements. The opinions expressed in the articles are not necessarily those of the editors or the publisher. ISSN No. 1474-0893 © Trafalgar Publications Ltd Designed and Published by Trafalgar Publications Ltd, Bournemouth, United Kingdom Printed by Progress Printing, Lynchburg, VA, USA.
Contents
2
A manufacturing renaissance for India’s electronic industry? Debasish P. Choudhury
6
Technology Focus
8
Nanotechnology is now starting to find applications in electronics Alan Rae, TPF Enterprises LLC
12 Head-in-pillow: Identifying and highlighting suspect solder joints Dr. Evstatin Krastev and Dr. David Bernard, Nordson Dage 22 BGA assembly reliability—PWB quality is the key Tom Clifford, TJB Associates
12
Special Features
30 Interview—Erik Miller, Kyzen Corporation 36 Interview—Norbert Bargmann, Messe München 38 Show review: Maiden ELECTRONICS INDIA 2010
28
regular columns
4
The growing reliability gap and some thoughts on how to bridge it Joe Fjelstad
16 Tsunami growth waves followed by modest swell Walt Custer and Jon Custer-Topai 32 ‘Pad cratering’ & ‘trace buckling’—new failure modes created by Pb-free soldering Werner Engelmaier Other Regular Features
6 34 36 40
Industry News New Products Association News International Diary
Flexible circuits created using carbon nanotubes. (Source: University of Illinois at Urbana-Champaign)
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Global SMT & Packaging Southeast Asia – Summer 2010 – 1
Editorial
Debasish P. Choudhury
Editorial Offices Europe Global SMT & Packaging Trafalgar Publications Ltd 8 Talbot Hill Road Bournemouth Dorset BH9 2JT United Kingdom Tel: +44 (1202) 388997 E-mail: news@globalsmt.net Website: www.globalsmt.net United States Global SMT & Packaging PO Box 7579 Naples, FL 34102 USA Tel: (866) 948-5554 Fax: (239) 236-4682 E-mail: news@globalsmt.net China Global SMT & Packaging Electronics Second Research Institute No.159, Hepin South Road Taiyuan City, PO Box 115, Shanxi, Province 030024, China Tel: +86 (351) 652 3813 Fax: +86 (351) 652 0409 Editor-in-Chief Trevor Galbraith Tel: +44 (0)20 8123 6704 (Europe) Tel: +1 (239) 784-7208 (US) E-mail: editor@globalsmt.net Managing Editor Heather Lackey Tel: +1 (866) 948-7778 E-mail: hglackey@globalsmt.net Editor Debasish P. Choudhury Tel: +91 120 6453260 dchoudhury@globalsmtindia.in
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Editor
A manufacturing renaissance for India’s electronic industry? At the outset, let me thank the whole electronic industry for the warm response, and for your invaluable support to our Southeast Asia edition launch. Also, I am happy to tell you that, according to a recent independent survey by Media Business magazine, Global SMT & Packaging is the leading SMT magazine in the world. When we think of the world economy, we think of Asia! China and India, the world’s two most populous nations, are driving the world economy by sheer mass consumerism. While China has established its Numero Uno position in the global manufacturing eco-system, India has all the requisite skills to emerge as a global manufacturing hub. According to the United Nations Industrial Development Organisation’s (UNIDO) ‘International Yearbook of Industrial Statistics 2010’, India ranks among the top 10 producers of manufacturing output in 2009. According to the UNIDO estimates, India’s manufacturing value added (MVA) per capita is US$ 283, putting India ahead of Canada, Brazil and Mexico. No doubt, India weathered the storm of global economic slowdown with remarkable élan in 2009. The Index of Industrial Production (IIP) data released by the government of India for March 2010 shows a robust growth of 13.5 percent in the manufacturing sector as compared to March 2009. As per the sectoral data, consumer durables have recorded growth of 32.0% in March 2010 over last year, with the overall growth in consumer goods being 10.6%. The cumulative growth for the period April-March 2009-10 stands at 10.4% over the corresponding period of the previous year. According to a recent industry survey,
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India’s manufacturing sector is expected to expand 11-12 percent in the AprilJune 2010 quarter, lower than 15 percent expected in January-March 2010, due to sharp increases in raw material prices and insufficient power. The sectors which would contribute significantly to the growth are automotive, FMCG, electronics & consumer durables, metal & metal products, forging, textiles, machinery, tyre and ship building. It is true: there is a noticeable growth trend in the electronic manufacturing activity in the country. In Q1 2010, USbased electronic manufacturing services company Sanmina-SCI opened a new manufacturing facility at Oragadam, near Chennai at an investment of US$ 55.6 million. Japanese company Panasonic India plans to invest US$ 100 million in its new plasma TV production facility in 2011. Nokia, which produce a fifth of its global mobile phone production in India, is exploring the possibility of expanding its production facilities in India. The Government of India has identified IT and electronics hardware manufacturing as a key thrust area. The new manufacturing policy document of the government, which envisages the establishment of National Manufacturing and Investment Zone’s (NMIZ) across the country to make India a world class manufacturing hub, is likely to be published by June 2010. So, are we waiting for a manufacturing renaissance? —Debasish P. Choudhury
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Title
The growing reliability gap and some thoughts on how to bridge it
Joe Fjelstad
The growing reliability gap and some thoughts on how to bridge it Those who have taken up the burden of trying to assure product reliability in the realm of electronics are increasingly finding themselves faced with grim reality that the current trajectory of electronics manufacturing, based on legislative mandates such as the EU ban on lead in electronic solder, is taking the industry in the wrong direction relative to reliability. To date, the global electronics industry has spent several tens of billions of dollars to make the conversion to lead free. Unfortunately, it appears that both the consumer and the environment will be
paying an ongoing price for the folly of “feel good” legislation, both in terms of wasted energy and less reliable products. Poor reliability is not cheap, and it never will be. Early product failures result in higher warranty costs to the manufacturer and the potential for product recalls, the cost of which can run into tens of millions of dollars. That number could be multiplied many times over as every manufacturer faces the same risk. While lead-free is an increasingly identified target, it is not the lone culprit. Dr. Craig Hillman of DfR Solutions, Inc.,
Figure 1. The overall reliability of electronic products is predicated on the reliability of the IC itself. For most of the history of electronics, the IC has been the single most reliable element; however as feature sizes shrink, the reliability is also being reduced as the chart indicates creating an ever enlarging gap between customer expectations/ demands and physical reality, especially for higher reliability applications. How that gap might be closed is a subject that must be addressed sooner or later.
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has pointed out that the semiconductor industry’s relentless effort to keep the faith with Moore’s Law is not going to make the job of those tasked with assuring reliability any easier. It is worrisome that little attention seems to be given to the impact of such pursuits on the long-term reliability of semiconductor (i.e., integrated circuit) products. The problem is that each new generation of integrated circuit technology, which must adhere to the laws of physics, is proving less reliable over time than the past. In a presentation at a Coventry, England, SMART Groupsponsored Technology World conference in November 2008, Dr. Hillman presented a graph in his talk, titled “Technology Breakthroughs- Bending the Design Rules,”1 which showed that long term reliability of ICs has been in rapid decline since feature sizes dropped below 250 nm. A modification of that graph is provided in Figure 1. The implications are that the industry is now on the cusp of producing products that might have mean life times of less than five years, when only a few short years ago lifetime expectations ran to several decades, or even as long as a few centuries. In response to the challenges faced by the industry in this regard, one potential solution might be found by turning the clock of technology backwards just a few years to an earlier technology node, while at the same time continuing to press out the edges of 3D technologies, which is and activity presently underway with TSV (through silicon via) and stacked
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The growing reliability gap and some thoughts on how to bridge it
chip solutions. Interestingly, 3D solder technology can easily be technologies have been viewed by some adapted to the concepts described, as a way to extend Moore’s Law (or given the problems of lead-free solder, predictions) by going vertical. The 3D the concepts are perhaps better suited approach has the potential to extend to solderless manufacturing concepts the reach of the spirit of Moore’s Law that sidestep the soldering process3 altogether. without suffering the potential loss In summary, the tailings removed of reliability due to leakage caused by from the intellectual mine in which diffusion of metals through silicon at the electronics industry has been lower nanometer nodes. digging for the last several decades is If one is to entertain the heresy a high value ore, rich in opportunities of going backwards to find the future, and capable of providing significant then one might as well consider and sustainable value to the something else that may be even more electronics industry and its customers, radical, and that is to simplify design both now and in the future but rather than to increase complexity reliability is key. The simplicity of as we are continuing to do. This many past concepts that have been non-standard prescription was being Figure 2. LEGO® blocks can serve as an easily identifiable inspidiscarded should be reevaluated in formulated even before an IBM ration for a fresh way of looking at the intrinsic benefit of employthe presence of new and evolving researcher recently warned during a ing a standard grid for electronic circuit design if the designer will technologies which can extract the paper presentation at the International allow. The solution has benefits that cascade over into all areas of value that has been left behind. Symposium on Physical Design (ISPD) the manufacturing cycle including: design, production and test. of “design rule explosion” beyond the 1. http://www.dfrsolutions. 22-nanometer node2. Another thing there are now emerging developments in is worth noting here, and that is that IC com/press-releases/2008_11_dfr_ component handling technology described designers are presently putting more and technology_world_england.pdf in this column a few months ago that will more function into chips that is much 2. http://www.eetimes.com/showArticle. make possible the assembly of devices as too often untapped by the next level jhtml?articleID=224200982&cid= small as 100 µm on a side. circuit designer. While the most common NL_eet The designer could then lay out his or defense is that they add the extra circuits 3. http://www.semiconductor.net/ her circuit in much less space with fewer “because they can,” this actually creates a article/440040-Reversing_the_ circuit layers, yet with much greater ease as great deal of waste in terms of both money Electronic_Assembly_Process.php routing channels would be predictably and and energy. So this gives rise to a simple easily navigated, in a manner described by question: “What if the product level circuit Professor Len Shaper and his colleagues designer could design using only the exact Verdant Electronics founder and president at the University of Arkansas in their IP circuit blocks he needed and nothing Joseph (Joe) Fjelstad has more than 35 years IMPS design concept. The final product more?” of international experience in electronic might well look something like (or even In actuality, this is not a completely interconnection and packaging technology in very much like) LEGO® blocks, another radical idea; it is the way things used to a variety of capacities from chemist to process concept which has been suggested in this be in earlier days circuit design. The older engineer and from international consultant column more than once in the past, and readers will likely remember Heathkit to CEO. Mr. Fjelstad is also a well known Figure 2 is provided to help the reader with electronics, which provided such simple author writing on the subject of electronic that visualization. building block components that the interconnection technologies. Prior to founding All of the supporting technology hobbyist could use to create their own Verdant, Mr. Fjelstad co-founded SiliconPipe could follow a similar path making equally electronic products and systems. These a leader in the development of high speed simple products that fit the basic pattern early designs were crisp designs, designs interconnection technologies. He was also of a common grid. This would include that were comprised of nothing more formerly with Tessera Technologies, a global connectors, sockets, test systems and the than was needed and in keeping with the leader in chip-scale packaging, where he was like. This provides a path to the future advice of Albert Einstein, who once stated appointed to the first corporate fellowship for that is clear and easily understood, and that “one should make things as simple as his innovations. interestingly, it takes its lessons from the possible and not one bit simpler.” past when most companies designed and Carrying the thought forward a bit manufactured PCBs using a fundamental further, the reader is asked to consider grid pitch 100 mils (0.100" centers) because the possibility that all of the components most components lead pitches were as produced containing those IP blocks were well. It was then and still is, at its core, produced and packaged on a wafer, each both simple and powerful. Moreover it of them having their I/O on a universally could well pave the way to much easier used common I/O pitch. The IP block and improved system design and a less chips produced in such a manner would expensive alternative to system on a chip also be both small and cheap and equally and system in a package. important highly reliable. While granting As a final thought looking forward that there will be concerns about handling with these concepts from the past, while devices that might be vanishingly small,
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Global SMT & Packaging Southeast Asia – Summer 2010 – 5
Title Industry News
Industry News Semiconductor industry set for highest annual growth in 10 years The last time the global semiconductor industry achieved annual revenue growth greater than 30 percent was a decade ago. Ten years after the chip business’s whopping 36.7 percent expansion of 2000, the industry is expected to finally break the 30 percent barrier once again in 2010, with revenue set to rise to $300.3 billion, up 30.6 percent from $229.9 billion in 2009. However, unlike the Internet-crazed spike in 2000, growth in chip sales this year will be driven by real fundamental supply/ factors that slowly have been gaining momentum during the past 12 months, according to iSuppli. “Building on the continuing expansion in sales that followed the downturn in late 2008 and early 2009, the semiconductor industry is set to achieve remarkable revenue growth and record size in 2010,” said Dale Ford, senior vice president, market intelligence services, for iSuppli. “Chip sales growth this year will be fueled by a number of key factors, including continued strong consumer demand for hot electronic products, diligent inventory and capacity management efforts among chip makers and the arrival of innovative technologies at both the component and end-system levels.” This year will mark an all-time annual high for global semiconductor revenue, eclipsing the previous record of $274 billion set in 2007 by about 9 percent. A major factor driving demand in the first quarter and beyond is consumer demand for electronic products, which continues to surpass expectations. Strong sales growth is predicted for 2010 in PCs, mobile handsets, LCD-TVs and other semiconductor-rich electronic systems. This will propel global factory revenue for electronic systems to a record high of $1.55 trillion in 2010, up 10.4 percent from $1.4 trillion in 2008. The previous high for electronic OEM revenue was $1.53 trillion in 2008. www.isuppli.com
started with the signing of an MOU with the Government of Tamil Nadu for the acquisition of the Oragadam Campus in June 2007, in conjunction with the start up of operations at an interim location at the nearby MEPZ Special Economic Zone (SEZ). Today, Sanmina-SCI has moved all manufacturing operations to its new 100 acre Oragadam campus. The company has over 1,500 highly skilled and dedicated employees. www.sanmina-sci.com Aqueous Technologies sells Trident III to Bangalore’s Accurex Solutions Aqueous Technologies Corp., North America’s largest provider of batch defluxing systems, announced that Accurex Solutions Pvt. Ltd. of Bangalore, India has purchased its Trident III automatic defluxing and cleanliness testing system. The sale was made by Aqueous Technologies’ sales manager Kevin Buckner during the recently held IPC APEX Expo in Las Vegas (April 6-8, 2010). The Trident Series represents the next generation of lead-free compatible, fully automatic post-reflow defluxing systems. Accurex provides complete engineering services that ensure that both system hardware and software are capable of performing all testing functions required by customer specifications and test requirements documents. The Trident III will help Accurex evaluate its customers’ test requirements and develop efficient test strategies. www.aqueoustech.com
Nadu, India. Sanmina-SCI’s investments and footprint in Tamil Nadu began in 2003, with the formation of the Chennai IT Center to support Sanmina-SCI’s global IT systems. Manufacturing operations
Sanmina-SCI opens Chennai manufacturing facility EMS company Sanmina-SCI Corporation formally inaugurated its state-of-the-art technology manufacturing campus in the Oragadam Hi-Tech Special Economic Zone (SEZ) near Chennai in the state of Tamil
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IMI expands to Chengdu Philippines-based Integrated MicroElectronics Inc. (IMI), an electronics manufacturing services (EMS) provider and a member of the Ayala group of companies, opened its new factory in Chengdu, Sichuan Province, in southwestern China. A simple inauguration ceremony was held on April 9, 2010 at the factory in Xindu District’s Muwei Industrial Park. Some members of IMI’s board of directors and management committee, led by chairman Jaime Augusto Zobel de Ayala, president Arthur Tan, and board member Gerardo Ablaza Jr., attended the event. The Chengdu factory brings the number of IMI’s manufacturing sites in China to six. The other plants of IMI are located in Shenzhen (in Liantang, Kuichong, Fuyong); Jiaxing; and Chongqing. www.global-imi.com AU Optronics signs MOU with Toshiba Mobile Display to acquire its Singapore subsidiary
AU Optronics Corp. has signed an MOU with Toshiba Mobile Display Co., Ltd. to purchase 100% shares of AFPD Pte., Ltd., a subsidiary of TMD in Singapore and a manufacturer of LCD panels based on low temperature polysilicon (LTPS) technology. Meanwhile, AUO and TMD intend to enter into certain agreements relating to each party’s intellectual property rights. This acquisition, when it becomes effective, will hopefully help AUO to gain business opportunities in high-end notebook and smart phone market. The proposed transaction is subject to the signing of definitive agreements between AUO and TMD, as well as to any necessary approvals. www.auo.com
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Industry News
Flextronics reports profit riding on higher sales Singapore-based EMS provider Flextronics International Ltd. reported its fourthquarter 2009 results riding on higher sales resulting in profit. Net sales for the fourth quarter ended March 31, 2010 were $5.9 billion, compared to net sales for the third quarter ended December 31, 2009 of $ 6.6 billion. Adjusted operating income for the fourth quarter ended March 31, 2010 was $ 170 million with an adjusted operating margin of 2.9 %, compared to adjusted operating income of $ 189 million and an adjusted operating margin of 2.9 % in the prior quarter. Adjusted net income for the fourth quarter ended March 31, 2010 was $ 130 million and adjusted EPS was $ 0.16 compared to $ 138 million and $ 0.17, respectively, for the prior quarter. This marks the 7th consecutive quarter of positive cash flow generation. www.flextronics.com Analog Devices expands its development facility in Bangalore Analog Devices, Inc., opened its new, expanded development facility at the RMZ Infinity Technology Park in Bangalore. Analog Devices recently completed its 15th year of presence in India and its R&D operations have seen tremendous growth. The new facility will allow better collaboration between the company’s DSP, Analog and Software divisions and will help ADI India to further develop its core strengths such as analog IC design, processor IC design, and multimedia embedded software. Located in the same campus as ADI’s existing facility, the new IPDC is equipped to accommodate approximately 400 engineers. www.analog.com EPIC Technologies and SFO Technologies form strategic alliance US-based EPIC Technologies announced that it had formed a strategic alliance with SFO Technologies, a NeST Group Company, India’s largest indigenous electronics design and manufacturing services (EMS) provider, which will allow the companies to leverage complimentary capabilities, provide global manufacturing support for their customers’ requirements in North America, Europe and Asia, and cooperate in joint sales and marketing efforts. “While EPIC’s innovative Lean Sigma focus has allowed us to provide a highly cost competitive and flexible North American manufacturing solution, we recognize that some of our customers are
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looking to source in multiple regions ,” said Bhawnesh Mathur, EPIC’s CEO. “Our alliance with SFO Technologies enables us to offer those customers a comprehensive manufacturing option in Asia that seamlessly integrates with our existing program management resources. Similarly, SFO Technologies will be able to offer its customers an expanded North American solution through EPIC’s facilities.” “We are very excited to work with our partners at EPIC Technologies,” said N. Jehangir, SFO’s managing director. “The combined strength of EPIC’s manufacturing solutions and SFO’s unique model of providing end to end product support solutions covering design, software, value engineering, re-engineering & product development, manufacturing and testing will offer our customers competitive, full-service solutions anywhere in the world. I am really excited about the potential this unique model will offer to our global customers.” www.epictech.com, www.nestgroup.net. Elcoteq and Videocon terminate negotiations In September 2009, Elcoteq announced that it had signed a non-binding Letter of Intent with Videocon Industries Limited (Videocon) regarding a major equity investment which would have made Videocon a major single shareholder in Elcoteq. After mutual re-assessment, the parties decided to terminate the negotiations in March 2010. In January 2010, Elcoteq issued hybrid securities in an amount of EUR 29 million and used the proceeds directly to repay outstanding debenture bonds having an aggregate nominal amount of EUR 105 million. This major transaction improved significantly company’s indebtedness and solidity. If the debenture and hybrid transaction had taken place in 2009, as at December 31, 2009, the company’s gearing would have been 0.7, solvency 24% and net debt EUR 82 million. By improving the equity structure of the company, the transaction altered the original investment structure planned by Videocon, and finally led to the mutual decision of both parties to terminate the negotiations. www.elcoteq.com New order bookings for SMT equipment continue to rise worldwide According to the latest market analyses conducted by Siemens Electronics Assembly GmbH & Co. KG (SEAS),
electronics manufacturers are heavily investing in SMT equipment again. The main growth engines continue to be plants in China and the rest of Asia, but orders from Europe are also on the rise for SIPLACE and other equipment suppliers. The order bookings for SMT equipment prove that the economic recovery is picking up speed. For the period from October through February, global new order bookings more than tripled compared to the same period last year. China played the dominating role, but since the middle of 2009 order bookings from Europe have begun to recover as well (posting a plus of 30 percent from January to February alone). For the first five months of its current fiscal year (October 2009 through February 2010), the SIPLACE team has booked as many orders as during the entire twelve months of 2008/2009. www.siplace.com ESI expands its Singapore-based operations Electro Scientific Industries Inc expanded its Singapore operations and has opened a new Asia manufacturing and service plant in the Kaki Bukit industrial hub. ESI will initially use the facility for manufacturing and service of its micromachining and passive components product lines. The plant will also provide the company with the capability to manufacture and service the company’s other new and existing product lines. ESI’s Singapore plant features 30,000 square feet of space, 19 laser stalls, 16 multi-purpose manufacturing cells, capability for a Class-1000 cleanroom, and a professional office area for all of its Singapore-based employees. www.esi.com Digi-Key Corporation and SANYO Semiconductor Corporation sign global distribution deal Electronic components distributor DigiKey Corporation signed an agreement with SANYO Semiconductor Corporation (USA) for global distribution. DigiKey stocks products from SANYO including discrete semiconductor products, integrated circuits, sensors and transducers. These products are available for purchase on Digi-Key’s global websites and will be featured in future print and online catalogs. SANYO specializes in integrating analog and digital systems, and has made valuable contributions to several successful systems by developing original analog technology including analog IP, power-saving technology and other circuit technologies. www.digikey.com, us.sanyo.com
Global SMT & Packaging Southeast Asia – Summer 2010 – 7
Nanotechnology is now starting to find applications in electronics
Nanotechnology is now starting to find applications in electronics Alan Rae, TPF Enterprises LLC, Wilson, NY, USA Four years ago we outlined some of the areas where nanotechnology might be applied to electronics. We are now seeing real examples of use, particularly in new areas such as photovoltaics, but there are applications in more conventional applications such as solder and surface finishes. Keywords: Nanotechnology, Semiconductors, Clean Tech, Interconnection, NEMS
Introduction The first presentation on nanotechnology at Pan-Pac predicted that nanomaterials would be entering the electronics supply chain and being assembled into products. Today, there are indeed products in use—not as many as anticipated and not necessarily the same products as predicted. We will explore some of these products and the areas in which they are being used. We have seen controversy about nanomaterials in the workspace, we have seen completely new materials families such as graphenes emerge, and we have seen new electronics markets such as solar photovoltaics where nanomaterials play a key role in their success. Other areas have taken longer to develop than expected.
can enhance existing products or replace their structure or function. Nanotechnology in semiconductors beyond the normal feature size shrinkage is raising interest in electronics circles. The novel 3-D structures known as FinFETs are predicted to be used in the next generation of semiconductor devices arriving in 20112012 and nano-wire based structures will be starting to appear in the same time frame. These are highly complex structures made by sophisticated processes. Most nano applications that are reaching the market today are actually much more basic and many are concentrated in the area of improved materials. Small size features—around the wavelength of light—can produce very interesting properties. Below the wavelength of light, nano structures can become invisible to the naked eye; band gaps in semiconductor materials can be modified to alter electrical and optical properties; metals can sinter and coalesce well below their melting temperatures and nanotubes and nano-wires can behave as individual transistors. Structured surfaces
The iNEMI 2009 roadmap The iNEMI roadmap (www.inemi.org ) is a comprehensive document that reviews the key issues affecting the electronics supply chain. Gaps in the technology or infrastructure that can adversely affect NEMI members are identified, and the NEMI Research Committee was formed to prioritize and disposition the tasks and identify companies, universities and government laboratories that can address them for the mutual good. The results are published in the Research Priorities1, downloadable from the iNEMI web site. Almost every roadmap chapter in the 2009 roadmap identifies aspects of Figure 1. Enthone Nanofinish® (with permission). nanotechnology that
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Nanotechnology is now starting to find applications in electronics
Figure 3. Spectral Coverage of Si quantum dots. (University of Buffalo)
Figure 2. Hydrophobic and antibacterial coating of 80 nm Ag in polyurethane. (NanoDynamics)
can be scratch-resistant, ultrahydrophobic or self-cleaning. Nanotechnology has been described as a toolkit for the electronics industry in that it gives us tools that allow us to make nanomaterials with special properties modified by ultra-fine particle size, crystallinity, structure or surfaces. These will become commercially successful when they give a cost and performance advantage over existing products or allow us to create new products. Semiconductors and packaging In 2009 we saw 45 nm node semiconductors deployed and real progress being made towards the next nodes. We haven’t yet come to the “brick wall” predicting the end of Moore’s Law... but it is still on the horizon. Packaging continues to be a concern and we are starting to see a real emphasis on 3D packing to address integrated functionality, speed, form factor, and cost (yes, better-faster-smaller-cheaper still rules, especially for smart phones and netbooks). Nanomaterials use has generally been limited to evolution of filler systems used in packaging materials and underfills. Replacement concepts for silicon
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“We have seen controversy about nanomaterials in the workspace, we have seen completely new materials families such as graphenes emerge, and we have seen new electronics markets such as solar photovoltaics where nanomaterials play a key role in their success.”
semiconductor technology have focused for several years on carbon nanotubes. This technology has been slowed by the difficulties of separating metallic and semiconducting nanotubes produced together in the synthesis process which differ only in the stacking sequence of carbon atoms in the tubes. Better process control and new separation processes have allowed separation to take place but there are still cost and other issues involved. Shepherding individual nanotubes into useful devices has also proved tricky. One approach is to create a random mesh (rather like a non-woven fabric) that is then cut to shape; the other approach, pioneered by the NSF Center for High-Rate NanoManufacturing,2 is to
assemble them into lithographically formed features. We are still some way from widely deployed applications of nanotubes in electronics although structural applications and those based on bulk conductivity are growing.
Interconnection We predicted a widespread use in interconnection, which has proved rather more difficult to achieve in practice. In composites and coatings the law of mixtures is always difficult (conductivity is dominated by the less conductive material especially if conductivity is directional, as with carbon nanotubes) and so concentrations required to reach acceptable conductivity may be higher than is economic. The iNEMI nano solder project showed that nano-sized SAC alloy could sinter at 180˚Cand below but that flux formulation was problematic. Nano-sized metals can catalyze some flux ingredient
Global SMT & Packaging Southeast Asia – Summer 2010 – 9
Nanotechnology is now starting to find applications in electronics
Figure 4. Schematic of a NEMS single molecule detector. Plan view is in the left, side view is on the right.
decomposition as low as 120˚Cand flux residues could really hinder solidification. Work is continuing on solder and solder replacement. Nano Surface finishes have been faster to market. Nano surface finishes have been commercialized by Enthone (Cookson Electronics Inc.) Their novel surface finish, originally developed by Ormecon in Germany, combines a conductive polymer with a nano silver to combine the best features of OSP and silver. This product is potentially a substitute for ENIG as well as other surface finishes due to its superior, aging, oxidation and solderability properties coupled to multiple reflow capability3 Printed electronics as a discrete industry has not developed as fast as the marketing reports suggested—except in the solar area (see below). Nano inks, particularly those based on silver, are compatible with polymer substrates but are in general waiting for the markets to develop. Clean energy Clean tech represents a huge growth opportunity for electronics. For the first time ever, alternative energy sources outstripped nuclear electricity in the USA in the first half of 2009—0.7 quadrillion BTU January-May 2009, according to the Department of Energy’s Monthly Energy Review4. Alternative energy depends heavily on nanomaterials used in electronics structures—in nano silver inks for current collectors for silicon cells, in printable thin film copper indium gallium selenide (CIGS) cell materials themselves as well as the conductors in the newer types of rigid and flexible cells that can lower cell costs below $1 per peak watt. They are an area of increasing focus for EMS companies, with Jabil, Flextronic and Celestica among others very active in the field. Nanomaterials have many potential applications in fuel cells and alternative fuel catalysis but their first widespread application has been in solar photovoltaics. In the “front end” or cell formation process, reactive exothermic nano foils
Figure 5. Schematic of the two possible states of a carbon nanotube based memory cell (NRAM).
formerly produced by RNT Inc. are now supplied by Indium Corporation.5. This novel process uses a local exotherm to provide controlled heating and reliable mounting of sputter targets to backplates. Printable CIGS (copper indium gallium sulpho-selenide) cells are being produced using nano inks by NanoSolar Inc.6. The nano ink is coated onto a metal backplate to allow the formation of these flexible and potentially low-cost cells. At the “back end” of the process, metallization inks based on silver are used on the front surfaces of silicon solar cells. These metallizations together with backside aluminum and silver are co-fired at 800˚Ccausing cracking and distortion of the cells. Nano silvers processing at 200-300˚Care available but have yet to be widely accepted. Displays The use of carbon nanotubes as “self-sharpening” cold cathodes in plasma televisions has been limited by improvements in the competing LCD televisions and concerns over the energy consumption of large plasma TV sets, California has enacted groundbreaking legislation limiting the energy consumption of TV sets7 and other states are likely to follow. Plasma TVs are typically less energy-efficient than LCD TVs, which are becoming more efficient as LCDs replace fluorescent backlights. Indium tin oxide (ITO) is used not only in TV sets but also monitors, phone displays and solar cells and is supply limited. Nano alternatives being given serious consideration include carbon nanotube and graphene containing films. Anti-smear nano coatings are being sold by suppliers including Aculon Inc8. Hydrophobic and oleophobic coatings of this kind will be increasingly used for screens and other surfaces. LEDs are replacing fluorescent tubes in TV and monitor screens to reduce power usage and mercury usage. Eventually they will start to replace fluorescent lighting more generally as costs start to fall. Efficiency and spectral performance can be modified using quantum dots, nano-sized
10 – Global SMT & Packaging Southeast Asia – Summer 2010
particles of silicon that absorb unwanted frequencies and re-emit at desired frequencies. Silicon quantum dots will replace the first generation Cd materials. NEMS NEMS—nano-electro-mechanical systems— are the nano equivalent of the micro systems in MEMS. Two examples below are the NEMS nose and nanotube-based memThe “NEMS Nose” is being developed by groups such as the Roukes Group at CalTech9. Here a nano-sized resonator can be used to detect molecular mass by alterations in the resonant frequency of a vibrating cantilever. Arrays with different surface treatments can be used for selective detection of chemical species and here we have created a NEMS analog of a mass spectrometer. This reduces the detector size from a device the size of a refrigerator to a NEMS device that can fit in a handheld detector. This has obvious applications for emergency services and medical use—and in addition, if the coating on the cantilever contained palladium, an extremely sensitive detector for hydrogen would be created—a sensor that will become vital if the hydrogen-fueled vehicle becomes a reality. Hydrogen has an extremely wide explosive range—from 4% to 75% in air, much wider than gasoline, which has a range from 1% to 7%. Hydrogen leaks in enclosed spaces are bad news! Polymer based NEMS sensors such as those produced by NEMS AB10 promise to be very inexpensive to produce and can be made selective to specific molecules. Nantero’s NRAM11uses bundles of carbon nanotubes in arrays that can be switched to form a n array of 0’s and 1’s depending on whether they have moved position under an applied field. This non-volatile memory promises to be faster and more durable than flash memory and to use a lot less power then SRAM, fast and low power but can not hold a lot of data, or DRAM, slow and high power consumption but high capacity. Interestingly, as 2GB RAM memory is getting to be about the minimum memory requirement for a PC, cooling of memory is now an issue.
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Nanotechnology is now starting to find applications in electronics
Totally new devices for new applications are quite rare and difficult to predict! These are totally new concepts giving us new tools to address opportunities that we don’t know how to address just now. An example from the past was the AFM (atomic force microscope), which allowed us to explore surfaces in previously unknown detail using a totally new principle. “Killer apps” like this may have shortcomings—there are a limited number of AFMs needed in the world and relatively few companies producing the detector heads. NEMS can also enhance existing MEMS applications. These enhanced MEMS devices could detect smaller changes in acceleration, pressure, flow etc. Here the cost-benefit analysis is fairly straightforward if there is a clear market need for this type of measurement. This type of product will often be developed by established MEMS manufacturers New materials reaching commercialization One key new materials system has surfaced in the past 4 years. Graphene, composed of sheets of carbon atoms one atom thick, which seem to have many of the desirable properties of carbon nanotubes without the high cost and potential health and safety concerns. Potential applications include ITO replacement Many nano materials have been developed because of their interesting properties and companies have been founded on products for which there are limited market demand (technology push). This tends to produce leading edge products with very limited immediate commercial potential. Work by iNEMI and others suggests the time for deployment in the electronics industry is typically seven years for a new product that fits with the existing infrastructure and 15 years for a disruptive product. Doubters only need to look at the intensive phase of lead-free solder qualification and implementation (1999 to 2009…and still not complete for complex boards) or the implementation of MEMS devices in accelerometer applications—30 years! The electronics industry is fast moving in term of ultimate product development but very conservative when it comes to accepting new materials, devices and systems. Managing HSE issues There continues to be a lively discussion internationally about whether nanomaterials should be regulated separately from traditional materials There
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are many opinions and the challenge is the diversity of types and diversity of applications— how do you equate nanosized silver, carbon nanotubes and liposomes, or nanomaterials in cosmetics, wind turbine blades, injected for medical image enhancement and automotive clear coat? Some nanomaterials behave differently at below 100 nm—for example Figure 6. TEM of Graphene. (Wikipedia) silver which can be sintered as low as 120˚C, well below economic benefits. its 961˚Cmelting point—and others such as sodium chloride (which you inhale every Acknowledgements time you go to the beach) do not appear to Past colleagues at NanoDynamics Inc; behave differently. current colleagues and associates at At the moment products are registered Graphene Devices Ltd, University of under EPA’s TSCA and, if appropriate, Buffalo, Purdue University, Global Solar FIFRA programs. Only two materials have Technology, Cookson Electronics, iNEMI, been singled out for special attention, ISO and the Inventures Group. carbon nanotubes because of their unique structure and properties, and silver because References of the large number of antibacterial 1. “Research Priorities”, iNEMI Inc., products being launched—not all of them http://thor.inemi.org/webdownload/ properly registered—including computer RI/2009_Research_Priorities.pdf keyboards and mice. 2. Center for High-Rate ISO TC 229 “Nanotechnologies” is at NanoManufacturing http://www. the forefront of the harmonization task. northeastern.edu/chn/ As with any new technology there is a 3. Enthone Ormestar Ultra™ http:// “land grab” by national and international www.enthone.com/pwb/index.aspx standards and other organizations; ISO 4. US Department of Energy Monthly is looking to harmonize nomenclature, Report http://www.eia.doe.gov/mer/ metrology, health and safety guidelines 5. “Indium Corporation Acquires Assets and communication (data sheets, MSDS, of Reactive Technologies” http://www. labeling etc) to bring some order to the indium.com/news/nanotechnologies/ process. 6. NanoSolar Inc. http://www.nanosolar. It is highly likely that all nanomaterials com/technology presented to the electronics board fab and 7. CA TV restrictions http://www.wired. assembly industries will be in some way com/gadgetlab/2009/03/california-tv/ encapsulated as inks, as pastes, in resins 8. Aculon Inc. display coatings http:// or as coatings compatible with existing www.aculon.com/displays.html processes and probably will not be subject 9. Roukes Group CalTech http://nano. to specific regulations. caltech.edu/ 10. NEMS AB http://www.nems.se/ Conclusions 11. Nantero NRAM http://www.nantero. Nanomaterials are starting to be more com/mission.html widely used in electronics but it takes a significant time for these applications to take hold and for significant business to result. Most applications will be evolutionary rather than revolutionary but will still yield significant performance and
Global SMT & Packaging Southeast Asia – Summer 2010 – 11
Head-in-pillow: Identifying and highlighting suspect solder joints
Head-in-pillow: Identifying and highlighting suspect solder joints Dr. Evstatin Krastev and Dr. David Bernard, Nordson Dage, Fremont, CA, USA
Head-in-pillow (HIP) or head-on-pillow (HOP) is the phenomena that can occur when incomplete wetting of a solder joint occurs after solder paste coalesces around, or near to, a ball grid array (BGA) solder ball after reflow but does not inter-mix, resulting in an open joint. These defects are difficult to detect with inline automatic x-ray inspection (AXI) systems or lower performance 2D x-ray systems. However, head-in-pillow defects can be more easily indentified using modern high-performance digital 2D x-ray systems equipped with 70 degree oblique angle viewing. Enhancing this capability is an automated HIP inspection routine that identifies and highlights suspect BGA solder joints without requiring an operator to manually inspect numerous locations within each BGA. Keywords: Ball Grid Array, Head In Pillow, Head On Pillow, Solder Joint Integrity, X-Ray Inspection, Oblique Angle View, Artificial Intelligence
Figure 1. Head-in-pillow defects imaged with 2D x-ray inspection.
Introduction Head-in-pillow (HIP) defects, also known as head-on-pillow (HOP), can occur after reflow soldering when the solder paste wets the printed circuit board pad while not fully wetting a BGA ball. While the resulting solder joint may initially exhibit electrical conductivity, it may lack sufficient mechanical integrity. Often these HIP defects are not detected during in-circuit or functional testing but arise as an intermittent field failure when the solder joint is placed under physical or thermal stress throughout its product life cycle. Head-in-pillow defects have become more predominant with the advent of lead-free solder paste due to greater board warpage and resulting solder ball lifting caused by higher reflow temperatures. Studies have
12 – Global SMT & Packaging Southeast Asia – Summer 2010
shown that because board and component warpage are inconsistent and cannot be predicted, attention should be focused on reflow process parameters and material issues1. Process variables impacting upon HIP defects include the BGA solder ball alloys used, the type of reflow profile applied, the peak reflow temperature used as well as the solder paste chemistry. In some cases destructive cross sectioning with scanning electron microscope (SEM) examination may be required to confirm this type of deficiency after a circuit board has been returned as a field failure, having previously passing outgoing in-circuit or functional test. Identifying HIP defects Even though HIP defects can be difficult
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Head-in-pillow: Identifying and highlighting suspect solder joints
Figures 2a and 2b. 2D x-ray image and enhanced 2D image of head-in-pillow defects.
to detect when using in-line automatic x-ray inspection (AXI) systems or 2D x-ray systems with lower performance characteristics, they can be readily identified with state-of-the-art 2D x-ray inspection systems without the need to destroy the printed circuit board as is the case with micro-sectioning (Figure 1)2. Figure 1 clearly illustrates why these defects are referred to as head in pillow, or better, head on pillow. The defective BGA solder ball appears to be laying on the reflowed solder paste instead of forming a single interconnection after reflow. Often considered an open joint, HIP defects frequently occur with BGA devices but can also be found in other area array devices such as flip chips and advanced three-dimensional semiconductor packages, including package on package (PoP), package in package (PiP) and system in package (SiP)3. Even with these complex semiconductor packages, HIP defects can be easily identified with off-axis x-ray inspection system without destroying the semiconductor device or damaging the substrate or printed circuit board. X-ray inspection techniques Oblique angle viewing, or tilt angle capability, is of critical importance in identifying HIP defects (Figures 2a and 2b). It is recommended best practice to use tilt, or oblique angles, of between 55 to 70 degrees with the ability to rotate 360 degrees around the point of inspection by moving the x-ray detector. This allows the ability to examine all around the BGA solder joints and does not suffer from occlusion of view by other solder balls or www.globalsmtindia.in
other aspects of the printed circuit board. Emphasis should be placed on the proper use of tilt and rotation angles together with x-ray parameters including kilo volts (kV) and power (W) which are important when trying to detect defect features of only a few microns in size such as cracks within solder balls of area array devices including BGA or flip-chip devices. One of the best ways board level assemblers can control costs is by maximizing production yields so there are fewer first-pass failures, as well as minimizing subsequent rework and repair. Assemblers should concentrate on setting up the right inspection and test regime that will eliminate difficult and reoccurring problems. One way to do this is to implement a highly capable x-ray inspection system with userfriendly features and sub-micron feature recognition. The payback on such a piece of inspection equipment can be substantial considering the full range of faults it can detect in addition to HIP defects, thereby providing a significant advantage in improving process control, maximizing manufacturing yields and reducing operating costs. Automated inspection HIP routine The traditional method for detecting HIP defects before they leave a factory has been for an operator to manually inspect each solder ball within a soldered BGA using a modern 2D x-ray inspection system equipped with oblique angle viewing and sub-micron feature recognition capability. While this method has proven to be highly reliable in detecting HIP
defects, it is time consuming and labor intensive. All technological advances that help board level assemblers improve yield enhancement in a cost-effective manner are extremely helpful in general, and especially so in the current economic situation. Working with leading industry authorities, an automated HIP inspection routine has been developed that can identify and highlight suspect HIP defects without requiring an operator to manually inspect each individual solder joint location within a BGA. As an optional extension module to standard automated analysis software, this automated inspection routine automatically analyses BGA solder joints for HIP failures. The system scans an entire BGA and a sophisticated artificial intelligence algorithm analyses all solder balls indicating those BGA solder joints that it considers to be HIP defects. These are then displayed via a color-coded overlay to the operator together with an HIP confidence value for each BGA joint (Figure 3). Further investigation can then be simply carried out by the operator to confirm the joint status, including the use of oblique angle views at high magnification. This additional information is then fed back into the HIP algorithm to improve the automated analysis function. This automated inspection routine identifies the presence and locations of HIP failures within BGA devices with a statistical variance, even if the solder joints are fully or partially obscured by the presence of other components on the opposite side of a board. As with most
Global SMT & Packaging Southeast Asia – Summer 2010 – 13
Head-in-pillow: Identifying and highlighting suspect solder joints
Figure 3. Color-coded overlay displaying HIP confidence values for each BGA ball.
automation routines the auto HIP software does have certain limitations, however its performance improves with continued use due to the incorporated learning feature. Conclusions Occurrence of head-in-pillow defects remains an industry wide concern despite improvements in solder paste flux chemistry and enhanced wetting characteristics of BGA ball solder alloys. Indications are that HIP defects will persist for the foreseeable future due to higher lead-free reflow temperatures. While manual inspection with a 2D x-ray inspection system continues to prove an effective method in detecting HIP defects, implementing an automated HIP inspection software routine is a further step in providing additional confidence
in solder joint integrity and helping to prevent HIP defect escapes.
Dr. David Bernard is product manager x-ray systems at Nordson Dage and may be contacted at david.bernard@nordsondage.com.
References 1. Seelig, K., “HIP Defects in BGAs,” Circuits Assembly magazine, December 2008 2. Krastev, E., “Modern 2D X-Ray Tackles BGA Defects,” SMT magazine, July 2008 3. Krastev, E., “Investigating Defects in 3D Packages,” Advanced Packaging magazine, June 2009
Dr. Evstatin Krastev is national applications manager for semiconductor packaging and printed circuit board inspection at Nordson Dage and may be contacted at evstatin. krastev@nordsondage.com.
14 – Global SMT & Packaging Southeast Asia – Summer 2010
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Eliminating false calls with 3D AOI technology
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Global SMT & Packaging Southeast Asia – Summer 2010 – 15
Combating Tsunami growth counterfeit wavescomponents—industry followed by modest swell initiatives for a global problem
Walt Custer and Jon Custer-Topai
Tsunami growth waves followed by modest swell Globally the current electronics industry business cycle is approaching its peak growth rate (Chart 1). Certainly our industry is far from “recovered,” but relative to 1Q’09’s recession-driven chasm, 2010 growth is now near its high point. Electronic equipment sales increased over 20% worldwide in 1Q’10 vs. 1Q’09 (Chart 2). In this same first quarter world semiconductor shipments rose over 50% and printed circuit boards grew 36%. Whopping first quarter growth rates! SE Asia (Chart 3) is driving the current electronics end market recovery. The USA (Chart 4) is up slightly while Europe (Chart 5) and Japan (Chart 6) still have a way to go. Regional semiconductor (Chart 7) and printed circuit board (Chart 8) shipments tell a similar story—SE Asia is driving the recovery. A strong rebound in personal computer purchases by both businesses and consumers (Chart 9) is just one reason for continued optimism. Per 20100411
Chart 10 electronic equipment growth looks solid in all regions through at least 2012. Key challenges will be material and labor cost increases, material and component shortages and proper inventory management. 2010 should be an interesting year! This current “growth” wave is impressive. End markets Computers: • Global PC shipments are projected to total 366.1 million units in 2010.— Gartner • Global PC market is expected to grow 12.6% y/y to 333.2 units in 2010.— IDC • HPC (high performance computing) server market declined 11.6% to $8.6 billion in 2009. It is projected to return to growth in 2010.—IDC Storage: • Global external disk storage revenue fell 0.7% y/y to $5.29 billion in 4Q’09.—IDC • Hard disk drive shipments increased
World Electronic Equipment, PCB & Semiconductor Shipments
20100418
30
PCB
1.5
"0" Growth
SIA
Global Equipment Revenues Quarterly Growth
Converted @ Constant 2008 Exchange Rates
3/12 rate of change
8% q/q to 49.9 million in 4Q09.— iSuppli Consumer: • Consumer electronics market is expected to grow from $375 billion in 2009 to $406 Billion in 2010.—IMS Research • Worldwide TV market will reach 228 million units in 2010.—DisplaySearch • LCD TV shipment will increase 32% y/y to 180 M. Units in 2010.— DisplaySearch • Worldwide set-top box shipments will grow 11.5% y/y to 147.8 million in 2010.—iSuppli • Video game hardware sales fell 20% to $426.4 million in February.—NPD Group • Worldwide e-book reader forecast expects shipments to grow from 700k in 2008 to 28 million by 2013.— Digitimes Research Peripherals: • EMEA-market for printer, copier & multifunctional product shipments fell 17.8% to 39.6 million units in 2009.—
% Growth (quarter vs same quarter in prior year) Estimated from Jan & Feb 2010 growth + Taiwan/China 3/10
El Equip 20
1.3 10
1.1 0.9
0
0.7
-10
0.5 3 6 9 12 3 6 9 12 3 6 9 12 3 6 9 12 3 6 9 12 3 6 9 12 3 6 9 12 3 6 9 12 3 6 9 12 3 6 9 12 3 02 03 04 05 06 07 08 09 10 00 01 CALENDAR YEAR Source: Custer Consulting Group
Chart 1.
16 – Global SMT & Packaging Southeast Asia – Summer 2010
-20
1 2 3 4 1 2 3 4 1 2 3 4 1 2 3 4 1 2 3 4 1 2 3 4 1 2 3 4 1 2 3 4 1 2 3 4 1 01 02 03 04 05 06 07 08 09 10
Custer Consulting Group: World Electronic Equipment Model
Chart 2.
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Tsunami growth waves followed by modest swell
Gartner
• Worldwide LCD monitor shipments
grew 3.8% y/y to 176.5 million units in 2009.—iSuppli • Worldwide hardcopy peripheral shipments grew 3.6% y/y to 34 million units in 4Q’09.—IDC Mobile: • Femtocell base station shipments should grow from 571,000 units in 2009 to 1.9 million in 2010.—iSuppli • Worldwide touchscreen mobile device market to increase 96.8% y/y to 362.7 million units in 2010.—Gartner World’s industrial/medical electronics market revenues are expected to grow by 11% y/y to $560 billion in 2010.—Semicast China: • Mobile phone usage grew to over 756 million users in January 2010.—MIIT • Handset production reached 619 million units in 2009, increasing 10.7% from a year earlier.—Sina.com • New-vehicle sales increased 46.3%
to 1.21 million units in February.— China Association of Automobile Manufacturers • New-car sales are expected to reach 15mn units in 2010.— China Association of Automobile Manufacturers • 25-26 million LCD TVs sold in 2009. • TV shipments should rise 11% to 41.3 million units in 2010.—iSuppli EMS, ODM & related assembly activities BESTProto received ISO 9001:2008 certification. Cal-Comp Electronics: • Acquired a 53.08% equity interest in Avaplas from Arrk Corporation. • Will establish a set-top-box manufacturing plant in Europe. Celestica closed its Mt. Juliet, Tennessee, facility. CirTran sold its electronics contract manufacturing business to Katana
20100411
Taiwan/China Electronic Equipment Producers Composite of 101 Manufacturers NT$ (billions)
600
2009/2008 up 3%
500
Electronics. CommsAudit added a MYDATA MY100LX pick-and-place machine and took board manufacturing in-house. Commercial Vehicle Group (CVG) closed and consolidated one of its two production facilities in Liberec, Czech Republic. Compal expects personnel costs in China to increase 8-10% this year due to labor shortages. Creation Technologies named Andy Hyatt as new executive VP—business development. Congratulations Andy! C-Tech Electronics added a Speedprint stencil printer and Vantage ERF series reflow oven. Dell delayed its Winston-Salem assembly plant closing for third time. Efore appointed Vesa Vähämöttönen president and CEO. Elcoteq: • appointed Jari Hakkarainen director, group legal affairs.
20100331
US Electronic Equipment Orders & Shipments Communications, Computer, Military, Instruments
34
$B (Monthly Orders - Seasonally Adjusted)
32 30
400
28
Shipments Orders
26
300
24 22
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100 0
18 16 1 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 04 05 06 07 08 09 10 02 03
14 1 4 7101 4 7101 4 7101 4 7101 4 7101 4 7101 4 7101 4 7101 4 7101 4 7101 4 7101 4 7101 00 01 02 03 04 05 06 07 08 09 10 98 99
CALENDAR YEAR
CALENDAR YEAR
Taiwan listed companies, often with significant manufacturing in China
http://www.census.gov/indicator/www/m3/
Chart 3.
Chart 4.
20100418
European Computer, Electronic & Optical products Production Index (2005=100), Seasonally Adjusted 130
20100321
2000
Japan Electronic Equipment Production 2000 to Present Yen billion Elec Application Equip Electronic Business Machines Computers & Related Equipment Communications Equipment Electronic Measuring Instrumentation Consumer Electronic Equipment
-30% -1%
120
1500 +3%
-7%
+2%
-3%
+1% -32%
110
+3%
1000 100
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80 1 4 7101 4 7101 4 7101 4 7101 4 7101 4 7101 4 7101 4 7101 4 7101 4 7101 4 7101 4 7101 00 01 02 03 04 05 06 07 08 09 10 98 99 CALENDAR YEAR
0 1 3 5 7 9 11 1 3 5 7 9 11 1 3 5 7 9 11 1 3 5 7 9 11 1 3 5 7 9 11 1 3 5 7 9 11 1 3 5 7 9 11 1 3 5 7 9 11 1 3 5 7 9 11 1 3 5 7 9 11 1 01 02 03 04 05 06 07 08 09 10 00
JEITA www.jeita.or.jp/
CALENDAR YEAR
Eurostat, C26 category, EU 27 countries
Chart 5.
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Chart 6.
Global SMT & Packaging Southeast Asia – Summer 2010 – 17
Tsunami growth waves followed by modest swell
• opened a 4200 sq. m. plant in Tallinn,
Estonia. • restructured Finish operations. • started manufacturing Philips’ SSL products in Dongguan, China. • received a global manufacturing services contract from Philips Lighting. EPIQ CZ received ISO 14001:2004 certification in Tremosna, Czech Republic. Flextronics: • dedicated one million SF to clean tech at its facility in Malaysia. It expects to reach 1 GW solar module capacity in two years. • began producing solar cells for Q-Cells in Malaysia. • received a mobile phone manufacturing contract from Puma. • expects over 10% business growth in southern China. • began high-volume production of SolarEdge’s distributed photovoltaic power harvesting and monitoring systems. • integrated SloMedical into its medical disposables business unit in Slovakia. • began manufacturing RIM’s Blackberry handsets in Brazil. • chip spending will increase 8.8% y/y to $7 billion in 2010.—iSuppli • became microinverter EMS provider for Enphase Energy. Foxconn/ Hon Hai: • purchased a 90.1% stake in Sony’s LCD TV factory in Slovakia. • received an order for two million notebooks from Sony. • allocated NT$10 billion to build a solar cell and module plant in Miaoli County. • is investing billions to develop a hi-tech complex in central Vietnam. • is adding a shipping hub at Kaohsiung Harbor. • was the top 2009 patent recipient in 20100404
Taiwan.
• joined the global LED commission. • Its chip spending will increase 18.7% y/y to $22.6 billion in 2010.—iSuppli Hana Microelectronics is spending $30 million to expand its Lamphun, Thailand, assembly plant. Herley subsidiary, CTI received a $5 million IMA contract for a U.S. Navy electronic attack aircraft. Incap closed and moved it Vuokatti, Finland, production to Estonia. Inventec is building a new notebook PC production base in Chongqing, China. Jabil Circuit: • leased new site in Szombathely, West Hungary, due to higher order volume. • Maquiladora, Mexico, production was temporarily halted by bomb threat. • received printer assembly contract from Zebra Technologies in China. • began producing LCD TVs at its new production unit in Tver, Russia. Jaltek achieved BS EN 9100 and ISO 13485 defense and medical accreditations. JVC Kenwood ended TV production in Mexico. Kenmec spun-off its EMS business. Kinpo-Compal shifted its production deployment focus to Brazil and Poland. Kitron closed its development department in Karlskoga, Sweden. KOR Electronics received $44.4 million in U.S. military supply contracts for digital RF jammers and electronic warfare systems. Lightspeed Manufacturing moved to new 60,000 SF manufacturing facility in Haverhill, MA. Neways reduced its number of suppliers by 12% to 750 in 2009. NBS deployed a RFID intelligent feeder system at its Santa Clara, California, manufacturing facility.
Total Semiconductor Shipments to an Area
20100411
World PCB Monthly Shipments
Monthly Shipments - Reporting Firms
14
$B - 3-Month average Japan N America Europe Asia Pac
12 10
Converted @ Constant 2008 Exchange Rates 3500
SE Asia
Note closed its manufacturing facility in Skänninge-Nyköping (Sweden). Pantech named David Ronis chief marketing officer. Parsec installed new SMT line in Centurion, South Africa. Plexus: • plans to occupy its $20 million global headquarters in Neenah, Wisconsin, in summer 2010. • selected TRC Global Solutions for domestic and international relocation services. Quanta Computer is investing $40 million to set up notebook PC and peripheral subsidiaries Tech-Front Computer in Chongqing, China and Tech-Full Computer in Changshu, China. RUAG received a 5.5 million Swiss franc production order for RBE2 radar subassembly for France’s Rafale fighter jet from Thales. Sanmina-SCI: • entered a optical polymer modulator manufacturing partnership with GigOptix. • Gunzenhausen, Germany facility received AQAP and NADCAP certifications. • opened its Chennai, India unit and plans to raise its headcount from 1,500 to 10,000 in five years. Smiths Interconnect acquired Interconnect Devices for $185 million. Sparton received a $14.5 million U.S. Navy ADAR Sonobuoy manufacturing subcontract. Sypris received a $6 million of F-16 Digital Flight control computer follow-on orders from Honeywell International, Defense and Space Electronic Systems. Topco Technologies spun-off its electronics manufacturing business group into a 100%-owned subsidiary.
N America
Europe
Japan
SE Asia
3000 2500 2000
8
1500
6
1000
4
500
2
0
0 1591591591591591591591591591591591591591591591 95 96 97 98 99 00 01 02 03 04 05 06 07 08 09 10 SIA website: www.sia-online.org/
Chart 7.
18 – Global SMT & Packaging Southeast Asia – Summer 2010
1 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 01 02 03 04 05 06 07 08 09 10 99 00
Source: Custer Consulting Group
CALENDAR YEAR
Chart 8.
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Tsunami growth waves followed by modest swell
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Global SMT & Packaging Southeast Asia – Summer 2010 – 19
Recovery: Getting back to 2008 levels 20100416
Personal Computer Market Growth World & USA 40
20100405
Electronic Equipment Production Growth
Current $ Growth Rates Converted @ Constant Exchange Rates
% Unit Growth World
USA
World
2008 0.5
2009 -9.9
2010 8.3
2011 9.5
2012 6.9
USA
-0.6
-5.4
6.8
6.4
4.8
W Europe
-3.3
-18.0
1.5
3.8
4.2
-11.6
-24.1
3.2
5.4
4.8
-1.2
-8.3
9.1
10.2
9.0
4.1
-5.2
14.8
15.4
9.1
30 20 10
Japan
0
Four Tigers
-10 -20
1234123412341234123412341234123412341234123412341 98 99 00 01 02 03 04 05 06 07 08 09 10
IDC 1/2010
Henderson Ventures 4/2010 www.hendersonventures.com
Chart 9.
TPV obtained LCD TV orders from Sharp through Mitsui. TT electronics’ Rogerstone (South Wales) facility became UK’s first manufacturing site to achieve the IRIS Revision 02- Rail Industry Standard. Victron: • named Jim Williams VP of North America sales. • received device manufacturing license renewal from CAFDB. Wintech added a MYDATA MY100 DX14 and a Pillarhouse selective solder machine in Estonia. Materials & process equipment Ampoc Fareast entered the HDI board production equipment market. APS Novastar commercialized ESS selective soldering machines. Atotech opened a new European TechCenter in Jablonec nad Nisou, Czech Republic. Cadence Design Systems acquired Taray. Camtek entered a distribution agreement with Canon for FALCON and Gannet systems in Japan. Christopher Associates and Japan Unix introduced a fluxless ultrasonic soldering robot. Cookson appointed Jeff Harris nonexecutive director and chairman designate. DEK: • received Intel’s Supplier Continuous Quality Improvement award. • appointed Laser Stencil Technology Ltd, as its new stencil licensee for South Africa region. DKN Research developed cut & paste printed resistors and capacitors for flexible film substrates. DuPont Circuit & Packaging Materials: • opened a new technical lab in Shanghai, China.
China
Chart 10.
• introduced new screen printed ink materials for printed circuit boards. Elite Material, Iteq, Taiwan Union Technology and Uniplus Electronics are expanding CCL capacity on strong demand from smartphones and LCD panels. ESI expanded its Singaporean operations and opened a new Asian manufacturing and service plant in Kaki Bukit industrial hub in Singapore. Essemtec introduced its new PanteraXV SMD placement machine for small production. Henkel: • received “World’s Most Ethical Company” ranking by US Ethisphere Institute. • plans to close its U.S. adhesives production plant by the end of 2011. Honeywell named Dr. Krishna Mikkilineni and Bask Iyer to its executive management team. Huntsman appointed Dr. Patrick Harker as its new independent director to its board of directors. Indium: • named Jacques Matteau global sales manager (NanoBond and NanoFoil). • had 20 employees complete IPC-A610D certification program.
• • Isola: • appointed David Luttrull to director of development.
• received U.S. Patent No. 7,687,556 for flame retardant compositions. Intrinsiq Materials developed a 12 wt% copper ink formulation designed for photonic curing at room temperature in air. JPSA completed the first phase of its 20,000 SF facility expansion. Kester received ISO 9001:2008
20 – Global SMT & Packaging Southeast Asia – Summer 2010
certification. KMG Chemicals acquired General Chemical’s electronic chemicals business for $25.7 million in cash plus approximately $850,000 of liabilities. Laminating Company of America added an Excellon Concept 129 drilling machine. Lincoln International: • opened office in Amsterdam. • named Eric Wijs managing director for Benelux Countries. LPKF appointed Elis Hirvonen its LDS product manager. Luther & Maelzer GmbH, in cooperation with Everett Charles Technologies, appointed Peter Brandt as European sales manager. Marantz appointed Jeremy Saise product manager, solder paste inspection. Mentor Graphics acquired Valor Computerized Systems for $50 million. Microtek Laboratories signed a preferred partner agreement with UL for PCB test and certification services. Nippon Steel Materials acquired subsidiaries Micron and Nittetsu Composite. Nordson: • ASYMTEK received Intel’s Preferred Quality Supplier award. • DAGE appointed Hal Hendrickson sales director, global accounts for its x-ray product line and promoted Keith Bryant to global sales director, x-ray products. • YESTECH launched new website to promote its new branding and expanded inspection capabilities. Orbotech and Mentor Partner formed Frontline PCB Solutions JV. Ovation launched its Grid-Lok Gold fully automatic tooling solution for board and substrate support. Paragon is spending NT$208 million
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Recovery: Getting back to 2008 levels
(US$6.54 million) to expand capacity. Park Electrochemical: named David Dahlquist VP and CFO. appointed Steven Jolly VP of facilities engineering, Robert Nurmi director of marketing for industrial PTFE materials and Gregory Strand VP of aerospace structures marketing and engineering. Rehm Thermal Systems introduced its enhanced reflow cooling technology for its Vision Series convection reflow ovens. Rogers: • acquired SK Utis Co., Ltd. • technical paper was voted Best in “Board and System Design” category at Designcon 2010. Rohwedder AG filed for insolvency proceedings at the German district court in Konstanz. Schmoll Maschinen added OptiFlex to its product line. Seica SpA introduced its “Flying IC Thermal Detection Units” on its line of Aerial flying probers. STI Electronics received a contract from IPC to update existing IPC-A-610 and J-STD-001 training and certification programs from the D to the soon-to-bereleased E revision of the standards. SunRay Scientific introduced NANOGLOW conductive silver inks for roll-to-roll printing of electronics.
Techcon Systems appointed Karl Fischbeck its eastern territory sales manager. Tokyo Ohka terminated its printed circuit board dry film photoresist business due to low market prices. Tongtai plans to increase PCB drilling machine shipments by 40% y/y to 300 units in 2010. Uyemura named Shunsaku Hoshi to its US Tech Center’s R&D and technical support team. Ventec: • established Ventec Europe South SA in Switzerland. • Europe Limited received ISO9001:2008. Components & related • Worldwide semiconductor revenues fell 10.5% y/y to $228.4 billion in 2009.—Gartner • IC market is expected to grow 27% in 2010 to $253 billion and another 15% in 2011 to $290 billion.—IC Insights • Global semiconductor materials market value fell 19% to $34.6 billion in 2009.—SEMI • Worldwide semiconductor manufacturing equipment sales declined 46% to $15.92 billion in 2009.—SEMI • Semiconductor capital equipment
•
• •
•
spending will grow 76.1% to $29.4 billion in 2010.—Gartner South-east Asian semiconductor capital equipment market is expected to grow 65% to $2.31 billion in 2010, after 46% fall in ’09.—SEMI Microcontroller market value will exceed $12 billion in 2010.—Databeans Global LED market is facing a supply shortage in 2010; total consumption reached 63 billion units in 2009, up from 57 billion in 2008.—iSuppli Optoelectronics sales are expected to increase 27% to $23.3 billion in 2010, sensor/actuator revenues to grow 33% to $6.8 billion, and discretes will expand 29% to $19.7 billion.—IC Insights
Walt Custer is an independent consultant who monitors and offers a daily news service and market reports on the PCB and assembly automation and semiconductor industries. He can be contacted at walt@custerconsulting.com or visit www.custerconsulting.com. Jon Custer-Topai is vice president of Custer Consulting Group and responsible for the corporation’s market research and news analysis activities. Jon is a member of the IPC and active in the Technology Marketing Research Council. He can be contacted at jon@custerconsulting.com.
European Electronics Assembly Reliability Summit September 21-23, 2010 | Tallin, Estonia www.europeanelectronicsummit.com The European Union continues to impose legislation on the electronics manufacturing community. REACH, RoHS and WEEE all have significant impact on the manufacturability of our board assemblies and finished goods. The Second European Electronics Assembly Reliability Summit brings together experts and provides a unique opportunity to examine, learn and debate these business-critical issues through industry discussion, technical collaboration and information sharing. The event will include a technical conference, tabletop exhiibition and networking opportunities. Join us this September. Visit the website to learn more.
This conference is being held at a critical time for the electronics industry. Increasing legislation and lack of reliability in electronics assemblies and interconnections is providing many challenges for, designers, specifiers and manufacturers of printed assemblies. The rise in counterfeit components is only adding to these challenges.
September 21-23, 2010 | Tallin, Estonia | www.europeanelectronicsummit.com www.globalsmtindia.in
Global SMT & Packaging Southeast Asia – Summer 2010 – 21
BGA assembly reliability—PWB quality is the key
BGA assembly reliability— PWB quality is the key Tom Clifford, TJB Associates The quality of the circuit board‘s pad is a critical factor in the reliability of the solder joint attaching the BGA. The solder-joints are hidden, and therefore the resultant BGA solder-joint quality cannot be easily visually verified, in contrast to conventional SMT constructions. This paper provides a gallery of photographs illustrating many types of defects, suggestions for acceptance thresholds, and a review of the consequences of defective BGA pads. Further, this paper discusses quality control protocols, sampling considerations, supplier interactions and inspection methods, all targeted to improve the durability and reliability of high-value electronics assemblies utilizing BGA-type connections. Keywords: BGA, Ball Grid Array, Pads, Defects
Introduction BGAs are rapidly becoming the dominant SMT high-performance package. BGA solder joints are critical to reliability and durability, but those solder-joints are essentially uninspectable because the solder balls/ joints are obscured under the package, This situation is similarly encountered with other hidden-joint constructions, including land grid arrays and QFNs. Defects of the pad can render the solder non-wettable, induce stress-risers and reduce the effective fillet area, etc., all jeopardizing performance and long-term reliability. The importance of inspection, outgoing from the fab as well as incoming by the user, is critical. These defects cannot typically be ruled out simply because a carefully selected sample or batch was selected for, and passed, some high-visibility “qualification” test protocol. These defects arise randomly, in different locations on a board, from board to board, and from lot to lot. Vigilance is necessary. Inspection protocols, at the fab and the user must accommodate appropriate sampling, performed by calibrated eyes, reinforced by real-time communication feedback. Further, the methods of inspection are critical. Magnification level, lighting, focus, clarity and image enhancement/capture are all pivotal parameters and must be defined and shared between supplier and user.
Even more important, the accept/reject threshold for each attribute must be clearly understood throughout the supply chain. The consequence, in terms of final product quality, of each level of each defect is often shrouded in crude “cause” data: e.g. “failure attributed to defective solderjoint”. This “defective solder joint” really failed because the plating popped loose from the PWB substrate, or the solder fillet was resting on a big caramelized resin goober, or a fiber acting as a stress-riser, etc. The user must determine the real root cause, and if it involves the PWB, he must share that with the fab/supplier. This paper does not dwell on the fab’s processes and likely causes of the pad defects. That is typically unknown by the user—irrelevant at that point—and is well known to and under the control of the fab. Note that technology evolves. New geometry, new solder alloys and new board platings and finishes will arise, as will defects that are not exactly those shown below. Nevertheless, the guidance contained herein should be mostly transferable. More importantly: the pace of shrinking geometries is inescapable. Fine pitch BGAs, flip-chips and waferlevel packaging for high-value assemblies will demand more fine-scale finesse in detection, discrimination and control. The paper provides the scope, then the
Figure 2. Fibers trapped under mask. Figure 1. Plating “splash”?
Figure 3. Edge flaking.
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BGA assembly reliability—PWB quality is the key
gallery of images with discussions, then QC reasonings and protocols with referee considerations. Scope This paper is primarily a photo-gallery of BGA pad defects, plus interpretations, consequences, and inspection advice. The acronym BGA (ball grid array) is used here to include the basic collapsing-ball plastic BGA as well as non-collapsing ball ceramic BGAs and column grid array constructions. Examples are shown from several board finishes, at pitches down to 0.4 mm (0.016”), but the criticality of a proper receiving pad, plus the reasonings and protocols are applicable to finer pitches, to other hidden-fillet constructions, to HDI bump pads and flip-chip substrates and to
other (increasingly ”green”) platings and finishes. Note also that the defects shown will also occur on pads for other SMT joints, with similar consequences. Those might be more inspectable, but many of these defects will result in compromised joints, even if visually apparently OK. These BGA pad images are offered in this paper because at this writing no industry standard is available to provide appropriate guidance. Defects Plating: surface condition or plating appearance The physical aspects of the pad, besides the size, are obviously important attributes. Lumps and dimples, for instance, can themselves compromise the integrity of the joint, and also can reveal internal weak-
Figure 4. Severe edge flaking.
nesses in the integrity of the pad’s plating which can cause further issues later. Figures 3 through 7 illustrate several types of defects, as well as their degrees of severity Figure 3 shows examples of the “awning” effect, where broken-off fragments of metal could get loose and cause electrical mischief. Figure 4 shows extreme edge-flaking. Figure 5 shows a case of a completely missing pad. Sad fact is that the BGA solder ball might stick to its trace long enough to pass a functional test, but would release/fail later in service. Figures 6 through 11 show other types of surface conditions caused during fab. Figure 6 shows “mouse-bites”, on the pad edge. Figure 7 shows dimples plus a double-level pad condition. Figure 8 shows a couple seriously compromised pads.
Figure 6. Pad “mousebites.” Figure 5. Missing pad
Figure 9. Extreme damage.
Figure 7. Double-plate plus dimples. Figure 8. ??????
Figure 12. Probe damage. Figure 10. Domed solder.
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Figure 11. Domed solder.
Global SMT & Packaging Southeast Asia – Summer 2010 – 23
BGA assembly reliability—PWB quality is the key
Figure 13. Linear gouge. Figure 14. Severe damage. Figure 15. Scuffed surface.
Figure 17. Solder bump. Figure 16. Minor plating lumps.
Figure 9 some sort of systematic massive damage or condition, eliminating the top of the pad. These conditions, at certain levels of severity, will compromise physical and electrical integrity, short or long term. External damage A damaged pad is clearly a concern. The impact depends on many factors, of course. Some damage (a scuffed HASL surface. for instance) might look dramatic but will reflow nicely with no ill effect). A scuffed silver plating can expose a troublesome base metal, subject to long-term failure. Images, interpretations, and communications are crucial. Figures 12 through 15 show examples of these situations. Figure 12 shows what looks like damage from a clumsy test-probe. Figure 13 shows some sort of deep linear gouge, and Figure 14 show damage that similarly exposes underlayers of base metal. Figure 15 shows a scuffed-surface situation, which might be rejectable. The point of this exhibit is the different appearance of the attribute depending on the lighting. A dramatically different image (in this example, plus a range of others not shown) is seen depending on side-lighting, intensity,
Figure 18. Metal peak?s
diffusion, polarization, etc. Are those light-on-dark, or dark-on-light? Are these black-on-copper, or white-on-gold? Acceptreject decisions might have been crafted naively to specify one or the other. The human eye/brain system can resolve the situation rationally, but AOI systems, or rigid defect-text language could be seriously misleading. Careful consideration of lighting subtleties is crucial for surface and color characterization, permanent-records and decision-making. Metallic contamination Usually the type of contamination can be identified visually, and the distinction between “metallic” and “non-metallic” can serve a useful purpose. Figures 1 and 16 through 18 show what looks to be metallic contamination, from process or tramp sources. These defects can be troublesome in two ways. They can upset the stencil-printing process by holding the stencil up off the board surface, which can impact solder volumes and registration. They can act as stand-offs at/during BGA placement, preventing or proper solder-fillet formation. More directly, in the extreme, they will compromise the mechanical strength and durability of the solder-joint. Figure 1 shows a large splash of a metal
24 – Global SMT & Packaging Southeast Asia – Summer 2010
or some material on the pad surface, leaving a probably non-wettable condition and likely compromised joint quality. Figure 16 shows a fairly common lump condition, which at this level is probably not rejectable. Figure 17, a tramp solder blob would probably negatively affect stenciling, but might reflow later with no appreciable ill effect. Figure 18 shows a hard metal point with probable impact on stenciling and solder-joint integrity. Non-metallic contamination This broad category can typically be sub-classified in terminology into specific defect types by appearance; and oftimes by supposed source or cause. However, these, and the other images in this paper, are presented solely as useful exhibits, with no pretense at a suggested terminology standard. In some fortuitous cases, polymeric contaminants will fall off in handling, or will be washed away in a board cleaning process. However, some cling fiercely, and will have their impact later in process or in service. Figures 19, 25 and 27 show some of the worst offenders: the resin (probably adhesive or maskant) will resist any likely bare-board cleaning process and will doubtless resist the flux/solder process, leaving very compromised solder
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Presenting...
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Process challenges and solutions for embedding chip-on-board into mainstream SMT assembly
The 2010 GLOBAL Technology Awards The ONLY global awards program in the industry A GLOBAL Technology Award sends the message that your product or service is an innovation and quality leader in an industry crowded with competing products. Sponsored by Global SMT & Packaging magazine, the GLOBAL Technology Awards are now in their sixth year of recognizing and celebrating innovation in the electronics manufacturing industry. Entries are being accepted now through July 31st. Entries are invited from equipment, materials and EMS companies of all sizes. In addition to the award statue, winners receive publicity in a special awards issue of each of Global SMT & Packaging magazine’s five editions (US, Europe, China, Korea & South East Asia) as well as on the Global SMT & Packaging and GLOBAL Technology Award websites and in the Global SMT & Packaging email newsletters. Winners also receive a small poster for use at trade shows and an image and logo for use in advertising, websites and other promotional materials.
Enter now: http://awards.globalsmt.net
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Global SMT & Packaging Southeast Asia – Summer 2010 – 25
BGA assembly reliability—PWB quality is the key
joints, good enough to squeak past final functional test before being deployed, as guaranteed early-failers, into service. Figures 20 and 22 show particulate FOD that might dislodge in handling, might be displaced by hot flux/solder, and might leave no deleterious reside; but why take a chance? Figure 26 and Figure 2 from the introduction, show unarguably rejectable conditions: solder-joints will form, if BGA placement isn’t disrupted, but will be seriously compromised, long term. Figure 21 shows a condition clearly originating in the plating process, which cannot be a good thing. Figure 23 is the author’s favorite: a QC stamp, doubtless signifying top quality, which is imprinted right on a soldering surface. Possibly the hot flux/ solder will remove it during assembly, but again, why risk it? Defects related to via-in-pad Unlike many of the FOD and point-defect conditions shown earlier, these VIP-related conditions are more systematic, are directly caused by the particular fab process, and will be recognizably similar in all BGA pads in that lot. That said, they will vary in severity, and acceptance thresholds must be established for new process qualification, routine
process control and final QC, Via-in-pad constructions and processes and materials are numerous, and the resulting reliability implications of the extremes examples are mostly uncharacterized. Deep open dimples can gobble solder, deep dimples full of chemical residue can pump unknowable materials into solder joints, bumps can impact stenciling, dimples and undulating pad contours can disrupt CTE-mismatched solder-fatigue shear planes and also trigger stress-riser situations. Thoughtful engineering considerations, backed by solid data, are necessary to establish proper acceptance thresholds, “Teaching” an AOI system to characterize dimples and lumps can be an interesting proposition. Solder mask defects The application of solder mask (design limits, materials, process control. QC, etc) has been a troublesome SMT challenge, particularly in recent times for BGAs. Figures 31 and 32 are clearly the result of an out-of control mask-application process. Figures 33 and 35 shows a very common and relatively minor case of an unintentional “solder-mask-defined” condition, related to bad registration and
Figure 20. ? something.
possibly inappropriate target dimensions and tolerances. Figure 34 shows a similar condition, made worse by a brittle condition, which leads to flakes of soldermaskant becoming FOD. Quality control reasonings and protocols The OEM—the name on the label—is responsible for the quality of the product. He must ensure that all the tiers in the supply-chain ladder do their respective quality assurance jobs: in-process during fab, at final at the fab, and at incoming by the user. A good baseline sampling view is that each fab batch is different, each board within that batch is different, each location and each pad on the board is different. A single sample-point is never enough. In every case, the inspection protocol sampling must be tailored, iteratively, to accommodate the type and distribution of defects likely to arise in the process as well as the actuals being encountered for that particular technology and design. Often the detection of a specific attribute can trigger a deeper sampling, to further characterize the severity and distribution of the attribute. Also, typically most point defects are rare; but rarity is slim comfort.
Figure 21. Goober in plating process.
Figure 19. Resin smears.
Figure 23. QC stamp! Figure 24. Resin droplets. Figure 22. Something else.
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Process challenges and solutions for embedding chip-on-board into mainstream SMT assembly
Event Overview LED Lighting is a key emerging segment in the Indian lighting market, driven by the move towards energy efficient lighting solutions, which have been gaining importance in the recent past. LEDs are poised to replace conventional general lighting service (GLS) lamps and high intensity discharge (HID) lamps in many key applications like street lighting, indoor and outdoor lighting apart from other niche industrial applications. LEDs have also found increasing adoption among automobile manufacturers in the country due to their small form factor and high lumen/watt ratio. However, LED lighting has its share of challenges. LED lighting installations require more complicated designs spanning the optical, thermal and electronics domains. LED lamps continue to be quite expensive compared to conventional lamps thus hindering penetration in the price sensitive Indian market. Further, the advent of cheaper LED lamps from countries such as China and Taiwan, which account for a key portion of the unorganized market in the country, has also hindered the penetration of multinational brands in the Indian market. Frost & Sullivan is confident that LED lighting is expected to grow significantly in the future cannibalizing on traditional lighting technologies but its penetration largely depends on how affordable LED lighting products become for Indian consumers in the future. Keeping in perspective the challenges faced by the LED lighting suppliers and end users, Frost & Sullivan’s Automation & Electronics practice is organizing an exclusive executive congress titled ‘LED Lighting – Towards a Bright Future’ on 16th June 2010, at Hyatt Regency, New Delhi, India. This one day event will bring together LED and other conventional lighting suppliers and leading end users of LED lighting from key industry sectors such as Government (State and Central), NGOs,
industrial and automotive, as well as value chain partners such as building contractors, system integrators, energy consultants and architects, for a specific and definite purpose of brainstorming on the future and strategies for LED Lighting penetration in these key industry sectors.
Key Benefits •
A platform that provides insights and specific tools for actionable strategies for the challenges faced by the LED lighting suppliers
•
Listen to views on the current status and path ahead for LED lighting adoption
•
Ideate and evaluate the requirements from different segment of end users
Whom to Expect Lighting Industry Suppliers: •
Leading LED lighting and Luminaires suppliers
•
Suppliers of other conventional lighting devices and luminaries manufacturers
•
Semiconductor Companies (Suppliers of LED Driver ICs)
End-user segments: - Government (Public Works Department – State and Central) - NGOs - Industrial - Railways - Automotive Value Chain Partners: • •
System Integrators Energy Consultants
• Distributors / Developers • Building Contractors / Architects
To Register and know more about the event contact: Harish Natesan, Automation & Electronics Practice, P: +91 44 4204 4521; M: +91 98406 37751; E: harish.natesan@frost.com Amrita Nandi, Corporate Communications, P: +91 33 4009 9337, M: +91 99034 33364, E: amritan@frost.com
Media Partners:
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Global SMT & Packaging Southeast Asia – Summer 2010 – 27
BGA assembly reliability—PWB quality is the key
One bad pad in a million (1 ppm) on a big, busy two-sided high-value board containing many big BGAs is a good predictor of one field failure in every few hundred boards. Not a good situation. Inspection finesse and training is key. The method depends on many factors, in addition to product volume and the value of the PWB. X-ray can deal with feature sizes and gross edge defects. All else must be dealt with optically, either visual aided by microscopy, or by patternrecognition video systems, “taught” by
visual calibration and establishment of accept-reject thresholds. Specific details and guidance depends on the defects being encountered. The acceptance threshold, (i.e. how severe is too severe?) is not necessarily the same for all similarappearing attributes, nor the same for all product families. Each situation deserves careful consideration. Note also that the appearance of many types of surface defects is profoundly influenced by the lighting: polarization, side-lighting, point vs. ring vs. diffused, focus, intensity, etc.
Simply specifying a “magnification level” is naive and inadequate. These factors, unless acknowledged and controlled, will trigger serious mis-interpretations, in both visual and optical/electronic methodologies. All this must be resolved and communicated effectively between the fab, the user, and any third-party lab or processor. Note that this paper—a gallery of images—does not dwell on the causes and corrections of these defects arising within the fab’s process. Typically the user need not care, and certainly cannot solve the
Figure 26. Trapped fiber. Figure 27. Maskant contamination.
Figure 25. Resin smear.
Figure 29. Via-in-pad.
Figure 30. Via-in-pad.
Figure 28. Via-in-pad.
Figure 33. Maskant defect.
Figure 32. Maskant defect.
Figure 31. Maskant defect.
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BGA assembly reliabilityâ&#x20AC;&#x201D;PWB quality is the key
Figure 34. Unintentional â&#x20AC;&#x153;solder-mask-definedâ&#x20AC;? condition made worse by a brittle condition.
fabâ&#x20AC;&#x2122;s process problems anyway. Also, the naming of defects and attributes is typically local and personal and widely-varied ... sometimes descriptive, sometimes causal. Terminology should be regularized. Misunderstandings can trigger unfortunate consequences. The enclosed images do not pretend to provide authoritative terminology, only to offer opportunities that can be named and catalogued between user, supplier, and any spec-writers. Further, these reasonings are not unique
Figure 35. Unintentional â&#x20AC;&#x153;solder-mask-definedâ&#x20AC;? condition.
followed closely by an appraisal of the statistical or systematic occurrence within the population. Additional sampling might be needed. For new and/or borderline cases, engineering testing might be needed before accept/reject decision thresholds can be established and communicated. Certainly an enterprise solution includes causal and corrective efforts, but these are well-known and beyond the scope of this paper. Additional information and imagery, including more exhibits and original glossy photos, are available from the author, at tom-clifford@sbcglobal.net.
to BGA pads. They apply to all solderable surface features, and to receiving pads at any scale (CSPs, micro-BGAs, flipchip pads, etc). Varied technologies and finishes will engender different defects and decisions, but much of the above material should be transferable. Referee/verification The first task is always to see what youâ&#x20AC;&#x2122;ve got. That means proper imagery and documentation;
Light a fire under your sales in the hottest market in South America GEM Expo Brazil offers you a unique opportunity to display your equipment and/or materials to a highly-focused audience of production engineers, managers and decision makers from contract manufacturers and other EMS companies throughout Brazil, Argentina and Chile. If you are a provider of equipment or materials to the PCB, EMS or Advanced Packaging communities, then this show is an essential forum where you will meet new and existing customers and network with your peers. The majority of electronics products are manufactured in Brazil for the Latin American market. This world-class event will attract exhibitors from Europe, Asia and the Americas to
display the latest equipment and materials that can enhance yield, improve reliability and save cost in todayâ&#x20AC;&#x2122;s manufacturing environment. GEM Expo Brazil is fully supported by Brazilian and South American publications and trade associations. It will also contain an extensive conference and workshop program to meet the huge demand for training and process knowledge in Latin America. Book now to take advantage of our early-bird rates! Raw space from $315 per sq. metre. Shell scheme from $87 per sq. metre.
Learn more exhibiting at or sponsoring GEM Expo Brazil at www.gemexpobrazil.com.
October 5-7, 2010â&#x20AC;&#x201D;EXPO CENTER NORTE, SĂŁo PAULO, BRAZIL Organizer
Sponsors
Venue
Title Interview
Interview—Erik Miller, Kyzen Corporation Based in USA, Kyzen is the world-leading provider of environmentally responsible precision cleaning products for electronics and high-technology manufacturing operations. KYZEN entered the Asian market in 1993. Since then, the company has become firmly established in the market, hiring local engineers and chemists and selling the infamous KYZEN-friendly brand. The company opened a new manufacturing facility in Malaysia late last year, the company’s fourth worldwide. KYZEN is a US company, when did you set foot in Asia? Kyzen has been doing business in Asia since 1993. Our first customer in Asia was nearly 17 years ago. The funny part of that is that when the customer asked if we could supply materials to them we of course said yes. However, this was preinternet, and we had to literally go to the library to find exactly where the customer’s facility was. To our surprise, it was in Asia and not the US. Asia has continued to be very important part of our business ever since. Tell us briefly about your Southeast Asia business. What is currently your most successful product in this market? Southeast Asia is an important part of our business. Not only did our first Asian customer reside in SEA, but our business in SEA continues to solidify. We have a fairly broad product line to support our diverse customer base. There is no single Kyzen product that dominates SEA market, but rather the full range of our broad product line that continues to provide our customers with best cleaning solution. In fact, the single “product” many of our customers rave about is our technical service. You established a new manufacturing facility in Penang, Malaysia, in November 2009. Why did you choose Malaysia, and what was the total investment in this facility? Kyzen chose Penang for several reasons. People are critical to any business. We found that the people in Penang fit our company culture well, and also they have the skills and talents necessary to help our customers prosper. Needless to say, if our customers prosper, Kyzen will prosper. Fur-
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Interview
thermore Penang is a wonderful hub for the business areas within SEA. Finally, the business environment in Malaysia was attractive to Kyzen, and we felt it would be conducive to our success and growth. That has certainly proved to be true already! Now that the Penang manufacturing facility is operational, what are the positive impacts you have seen on your business in the region? When you are the home team and have outstanding products, service and support on a very local level, your customers benefit from shorter supply chains and reduced logistics risk. However, very few of our customers are only local customers; many of them have global operations. While we are local in SEA, we are also local in North America and Europe. This affords our customers local service, support and world class products around the world.
Manufacturer of • Solder Wires • Fluxes Ultra Pure Tin Solder Bar • Solder Wire RMA Resin Flux Core Solder Wire RA Resin Flux Core Solder Wire Water Soluble Flux Core Solder Wire No Clean Flux Core Solder Wire
• Solder Sticks • Solvents • Rosin Fluxes Flux Type R Flux Type RA Flux Type RMA
• Flux Pastes General Purpose Flux Paste Electronic Grade Flux Paste No Clean Flux Paste
PREMIER INDUSTRIES
Being local is a big advantage in doing business around the world. What are the benefits Kyzen’s customers will get from this facility? What is the role of the application laboratory? Our application laboratory plays two roles in our support to our customer. First is that it gives our customers a place to come and run tests to find the best process for their cleaning applications. We have a wide variety of cleaning equipment and the full range of Kyzen cleaning solutions to ensure that the customer finds the best solution. This is added capability to similar laboratories in North America and Europe. Second, the laboratory allows Kyzen to continue to develop new materials to meet the ever-changing technologies introduced daily in our industry. Kyzen’s products have enjoyed tremendous longevity in the industry; however, todays technology may not meet the demands of tomorrow. The applications lab is key in testing and developing for tomorrow. Kyzen Penang is home of the Sean McShefferty Training Center. What do you intend to achieve through this initiative? Kyzen opened the Sean McShefferty Training Center (SMTC) in honor of our dear friend and colleague who died in 2008. This facility is being used by industry partners and associations for meetings and training. Sean was a friend to all, and we can think of no better way to honor him that to open a facility that can be used by all to further our industry and businesses.
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• Lead Free Solders for Health & Safety
Vinod Aneja: 9811016242
78, Phase-II, BADLI INDUSTRIAL ESTATE, Delhi-110042 (India) Tel: +91-11-27855016, 27854247, Fax: +91-11-27854247 email: ansol@vsnl.com
Would you like to name some of your prominent EMS and ODM customers in Southeast Asia? Our customers honor us with their business, and we certainly respect their right to publicize the suppliers they have chosen when it will help them meet their objectives. Kyzen has been fortunate to have successful relationships with some of the largest companies in our industry, both OEMs and EMS firms and that is certainly true in Southeast Asia. Thank you, Erik. —Debasish Choudhury
Global SMT & Packaging Southeast Asia – Summer 2010 – 31
‘Pad cratering’ & ‘trace buckling’—new failure modes created by Pb-free soldering
Werner Engelmaier “The unique confluence of material properties, assembly conditions and survivability requirements have created new failure modes.”
‘Pad cratering’ & ‘trace buckling’—new failure modes created by Pb-free soldering I certainly have been railing against the RoHS ban of Pb in solders ever since I first heard about it. It has solved a nonproblem, but has created a whole raft of new real problems. From an electronics hardware point of view, the main root cause of these new problems is the much higher temperatures required to solder with Pb-free solders. The unique confluence of material properties, assembly conditions and survivability requirements have created new failure modes. The most obvious new failure modes are ‘pad cratering’ (see Figures 1-4) and ‘trace buckling’ (see Figures 5-7). While ‘pad cratering’ is not a totally new failure mode, it is much more prevalent with Pb-free solders than SnPb solders. Most ‘pad cratering’ is observed right after the reflow process, but ‘pad cratering’ has also been observed after drop tests and in field returns of hand-held electronics. ‘Pad cratering’ can occur both
Figure 1. Cross-section of BGA solder ball with ‘pad cratering’ on the PCB side showing a crater-like fracture in the resin matrix underneath the soldering pad1.
on the PCB pads as well as the BGA pads as shown in Figure 2. As shown in Figures 3 and 4, in many cases the connection between the soldering pad and the attached trace is broken leading to intermittent functional failures in most cases. Figures 5 through 7 show instances of trace lifting and buckling. The root cause in all these failures is the much higher thermal expansion mismatch on cooling from reflow soldering when SAC solders are used, than previously experienced with SnPb solders. These higher thermal expansion mismatches come from a number of negative factors coming into play: (1) SAC solders are significantly stiffer (~40% higher modulus of elasticity) than SnPb; (2) SAC solders are significantly stronger (greater yield strength); (3) SAC solders creep much slower (therefore provide no ‘give’); (4) SAC solders have a
Figure 2. Cross-section of BGA solder ball with ‘pad cratering’ on the BGA side. Note: Crack initiation in solder joint near interface at a stress concentration caused by a solder-mask-defined (SMD) solder ball geometry. [Source: Ray Prasad, SMTSolver, USA]
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Solidus of 217˚C instead 183˚C, thereby almost doubling the ΔT to the PCB glass transition temperature, Tg (see Figure 8); (5) SAC solders, because (1-3) become a mechanically significant member with a large CTE on top of the copper traces; (6) the PCB base materials, in order to be RoHS-capable, are typically phenolic-, not dicy- cured and contain fillers—this can reduce the cohesive strength of the resin matrix (e.g., pad cratering); (7) the higher soldering temperatures tend to reduce the peel strength of the copper traces on the laminate; (8) in many cases, the cooling rates from reflow have remained the same as with SnPb [Hewlett-Packard has mandated that cooling rates need to be reduced to 1.5˚C/sec or lower] setting up significant thermal gradients, thermal expansion [of course with cooling, this should read ‘contraction’] mismatches, and much higher stress levels than were
Figure 3. Cross-section of BGA solder balls with ‘pad cratering’ on the BGA as well as PCB side. Note: Fractured pad-to trace connection on BGA side. [Source: Cheryl Tulkoff, National Instruments, USA]
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‘Pad cratering’ & ‘trace buckling’—new failure modes created by Pb-free soldering
Figure 5. Photograph of trace buckling on a PCB surface due to differential thermal expansion/ contraction of PCB, copper foil, SAC305 solder and RF shield. Figure 4. Cross-section of BGA solder ball with ‘pad cratering’ on the PCB side with fractured pad-totrace connection. Note: Trace lifted with pad. Also, note ‘stress-concentration geometry’ on BGA side due to solder mask ‘defining’ the solder joint geometry.
possible with SnPb; (9) most reflow ovens are not designed for achieving cooling rates of 1.5˚C/sec or less; for anything but 10-zone ovens, additional cooling zones need to be added [at 1.5˚C/sec you need a cooling section of about 100 cm, at 1.0˚C/ sec that becomes 150 cm]; and (10) and there are likely to be other factors as well. One important parameter is the cohesive strength of the PCB base material resin. This is not specified in IPC-41011; however, a new test method, IPC-9708, “Test Methods for Characterization of PCB Pad Cratering,” is getting close to final draft status. References: 1. Engelmaier, W., “Recommendations for PCB FAB Notes and Specifications in Printed Circuit Board Drawings for SnPb and Lead-Free Soldering Assemblies, the Qualification of PCB Shops and Activities to Assure Continued Quality, v.09,” White Paper/Multi-Client Study, Engelmaier
Associates, L.C., December 2009. 2. Engelmaier, W., “Pb-Free Soldering Processes—Survival, Quality, Reliability,” Tutorial Handbook, Engelmaier Associates, L.C., March 2010.
of electronic packaging and interconnection technology. He is the chairman of the IPC Main Committee on Product Reliability. The TGM-Exner Medal was bestowed on him in 2009 in Vienna, Austria, he was elected into the IPC Hall of Fame 2003, and was awarded the IPC President’s Award in 1996 and the IEPS Electronic Packaging Achievement Award in 1987. He also was named a Bell Telephone Laboratories Distinguished Member of Technical Staff in 1986 and an IMAPS Fellow in 1996. More information is available at www.engelmaier. com, and he can be reached at engelmaier@ aol.com.
Werner Engelmaier will be giving some of his reliability workshops at the Reliability Conference in Frankfurt, Germany, May 20-21, 2010; im FED-Kurs in Stuttgart, Deutschland, 26.Mai 2010; at SMT/ HYBRID/PACKAGING 1010 in Nürnberg, Germany, June 8, 2010; and at the Universität Wien at the end of June. He will be available for in-house workshops and consulting in both English and German in the May through June timeframe; for details of the workshops go to www.engelmaier.com; for more information about the workshops and consulting contact engelmaier@aol.com. Werner Engelmaier has over 44 years experience in electronic packaging and interconnection technology and has published over 200 papers, columns, book chapters and White Papers. Known as ‘Mr. Reliability’ in the industry, he is the president of Engelmaier Associates, L.C., a firm providing consulting services on reliability, manufacturing and processing aspects
Figure 8. Graph of soldering temperatures, solder alloy Solidus temperatures and PCB glass transition temperature2.
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Global SMT & Packaging Southeast Asia – Summer 2010 – 33
New Products Milestones 2010
New products Milara integrates 3-D inspection head on inline printer Milara Incorporated has integrated the CyberOptics 3-D post-print inspection head on its TouchPrint Digital TD2929 inline printer to enable 100-percent 3-D solder paste inspection within a solder paste printer without slowing the cycle time of the print process. Coupling CyberOptics’ proven measurement accuracy and speed with Milara’s high speed, precision print process will ensure consistent, reliable prints. CyberOptics’ patented, on-the-fly 3-D inspection head is manufactured as an integrated assembly with no moving parts, thus requiring no calibration in the field. Milara’s TD2929 is a fully automatic inline printer that offers new SimuTech™ Technology: the system incorporates a dual overhead camera gantry system with twin conveyors which allows for concurrent processing capability (print & inspect, bottom side clean & inspect, inspect & inspect, print & dot dispense, inspect & dot dispense). www.milarasmt.com
Techcon Systems introduces the Techkit Mixer Techcon Systems’ Techkit Mixer provides automatic mixing of two-component materials filled in a cartridge kit for a quick and simple setup process. The Techkit Mixer is equipped with an automatic fluid level sensing device and user-friendly electronic control system. The automatic injection feature provides even distribution of hardener into resin during the mixing cycle to ensure uniform mixed result. The Techkit Mixer accommodates all standard size cartridge kits ranging from 2.5 oz (74ml) to 20 oz. (591ml) and is immediately usable anywhere in the world with its accompanying tools, accessories and universal power supply. www.techconsystems.com
thereby provides precise cooling gradients that are critical to reduce thermal stress and resulting board twist and warp. www.rehm-group.com smtsolderpaste.com offering free shipping to online solder paste customers
Enhanced reflow cooling technology introduced by Rehm Thermal Systems
Rehm Thermal Systems has introduced new cooling zone designs for their Vision Series convection reflow ovens. The new technology is particularly effective for the homogenous cooling of large thermal mass PCBs. Depending upon the length of the system, the cooling area in the VisionXP is laid out in two, three or four stages. The fans in the individual zones, which are available with separate speed/volume control, can cool even lead free processed PCBAs to below 50˚ C. The system also
Manncorp is now offering free shipping on all pastes purchased online at www. smtsolderpaste.com. The solder paste line includes no-clean lead-free, water soluble lead-free, and Pb no-clean and water soluble. For quantity purchases, the price including shipping per 500-gram jar of lead-free types can be as low as $51, while Pb pastes run as low as $38 per jar. Free shipping is applicable to USA destinations only. With distribution centers on both coasts, smtsolderpaste.com can quickly supply paste to end users throughout America. www.smtsolderpaste.com Labeler integrated in SMD placer SMD assembly systems from Essemtec can now mark the printed circuit board with an identification label while placing components. The integrated labeler delivers on demand a label with bar code, matrix code, date or serial numbers. Consistent
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quality assurance and traceability in electronics manufacturing requires first of all the correct identification of a PCB. ID marking is best done where the product is made: during the SMD assembly process. Essemtec’s integrated label feeder can feed labels with any code: bar codes, matrix codes, date or serial numbers are possible. Therefore, its integration of into an existing production line is very simple and quick. www.essemtec.com Innovative process gas cleaning system for reflow systems
SEHO Systems GmbH redesigned the process gas cleaning system for its reflow ovens to further reduce maintenance costs
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New Products
in electronics production. The SEHO MaxiReflow is equipped with the latest cyclone technology. The system extracts the contaminated process gas from all heated zones, leads it through a cyclone and then directs the cleaned gas back to the heating area. The temperature inside the cyclone is controlled to allow optimum condensation. SEHO’s new and innovative process gas cleaning system not only saves time and money in electronics production, but it also helps to protect the environment. www.seho.de Fully automatic heavy wire bonder increases productivity by 30% Hesse & Knipps recently launched its newest Bondjet models, the Bondjet BJ935 and the Bondjet BJ939 fully automatic heavy wire bonders for processing aluminum wire, copper and HCR™ (high current ribbon). The new Bondjet models set new benchmarks for process speed, precision and low maintenance requirements, resulting in significantly increased productivity. The Bondjet 935 and 939 are the only heavy wire bonders available today with non destructive pull test and PiQC™ Process Integrated Quality Control—a unique transducer integrated sensor for 100% quality monitoring in real-time. These features and more work together to improve productivity over previous heavy wire bonder models by up to 30%. www.hesse-knipps.com First pH-neutral defluxing cleaning agent ZESTRON introduced their latest innovative defluxing agent, VIGON® N 501, at NEPCON Shanghai 2010. VIGON® N 501 is the first pH-neutral defluxing cleaning agent worldwide. Due to its neutral pH-value, the cleaning agent demonstrates the highest level of compatibility on sensitive materials of SMT production, such as aluminum, copper, brass, nickel, plastics or labels. The water-based MPC®-cleaner was specifically developed for spray-in-air processes. Being used at short contact
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times and with concentrations as low as 10-15%, VIGON® N 501 shows very good cleaning results, even under low standoff components. www.zestron.com SIPLACE OIB: Efficient software integration across the entire SMT process chain
With the new version of its SIPLACE OIB (Operations Information Broker), Siemens Electronics Assembly System (SEAS) now offers an optimized multivendor integration platform for electronics production. With SIPLACE OIB, applications from different vendors can exchange data with each other in order to completely and transparently map the SMT process chains in heterogeneous IT infrastructures. SIPLACE OIB can link previously isolated applications both horizontally across different machines and lines as well as vertically from the machine controller to MES and ERP systems. As an especially attractive feature, SIPLACE OIB maintains this integration even after updates, version changes or the replacement of individual software components. This makes it easier to link previously separate software modules, minimizes the risk of production failures after software updates, and reduces administrative requirements to a fraction of what they were before. By integrating their processes and software with SIPLACE OIB, electronics manufacturers can significantly improve the transparency, speed, flexibility and productivity of their SMT activities. www.siplace.com Bliss industries introduces multipurpose Cantilever Cart Bliss Industries Inc., provider of material handling carts and racks for PCB assembly, introduced its new multipurpose Cantilever Cart, available in both standard and custom versions. The cart offers the engineer complete flexibility, light weight, and a small footprint. A whole host of accessories can be simply clipped onto the cart, making it an
extremely adaptable and user-friendly solution. The cart can be adapted for many uses, including kanban, staging, test equipment, transport, and more. www.blissindustries.com FCT Assembly introduces NL930PT pin probable solder paste FCT Assembly introduces its NL930PT no-clean, lead-free, halide-free pin probable solder paste. The product is unique in that it is a clear residue paste that can print down to low surface area ratios consistently. Combined with SN100C, this solder paste produces the most cosmetically appealing solder joint available on the market. It also has excellent pin probability, good print release down to .55 SAR when used with the Slic Stencil and excellent wetting on all surface finishes. All this is accomplished without using any halides. www.fctassembly.com Glenbrook Technologies introduces The Dual-Vu system Glenbrook Technologies introduces The Dual-Vu system providing simultaneous and corresponding magnified real-time x-ray and optical imaging of electronic and medical components. This unique patented development provides a quality control and component authentication capability never before realized. The Dual-Vu system employs Glenbrook’s patented ‘Magnification Fluoroscopy” x-ray camera technology, unsurpassed in providing x-ray image detail at low radiation levels, insuring operator safety. www.GlenbrookTech.com Lee Ritchey’s high speed design handbook now available for free download BR Publishing announced the immediate availability of “Right the First Time: A Practical Handbook on High Speed PCB and System Design” by Lee Ritchey, president of Speeding Edge. Ritchey, one of the world’s foremost authorities on highspeed design, first published the hard copy of “Right the First Time” in 2003. Today, Ritchey, BR Publishing and their sponsors are making this updated, how-to guide available to all PCB and system designers at no cost. www.thehighspeeddesignbook.com
Global SMT & Packaging Southeast Asia – Summer 2010 – 35
Title Interview
Interview—Norbert Bargmann, Messe München The ‘two-in-one hub’ of the Indian electronics industry—Messe München’s electronica India and productronica India—returns to the Bangalore International Exhibition Center September 7th-9th. We recently had an opportunity to speak with Messe München’s deputy CEO, Norbert Bargmann, about the event. electronica India and productronica India has emerged as the largest electronic trade show in India in a short span of 2 years. Did you expect such a quick turnaround for a new trade show? When we founded our Indian subsidiary MMI India in 2007 and decided to organize electronica India and productronica India as the sole organizer, we were very confident the show would be a success. This was based on a couple of facts, among them the strong electronics industry in India, the demand of this industry to have a platform to do business with companies from all over the world, a great number of European and American enterprises who wanted to enter the Indian market, and last but not least our expertise in organizing trade shows in India.
concept of our collaboration in 2010. There is lot of buzz in the market about MMI India’s plan to hold an electronic show in New Delhi in 2011. Has the plan been crystallized? When do you want to hold it? Yes, we are planning to organize an electronics show in Delhi in 2011.Many of our exhibitors are interested in addressing the north Indian market via a show of its own and we see a lot of potential. We are in touch with the necessary stakeholders to discuss details.
What necessitated the leadership change at the helm of MMI India late last year? What have you done to cope with this sudden change? In December 2009 we carried out an internal audit which to our regret resulted in the dismissal of the managing director of MMI India. Mr. Thomas Loeffler had taken over responsibility as CEO of bc India and deputy general manager of MMI India earlier in 2009, and we are glad he could immediately take over responsibility as acting CEO of MMI India.
India. We are sure that we will outreach the figures of 2009 in September 2010. All preparations are according to plan, and we already have many bookings from key accounts such as NM Tronics/Fuji, Infineon, Juki, Sony and RS Components. We also widened the exhibition range of electronica India and productronica India and have added three technology fields that stand for growth and sustainability: photovoltaics production, LEDs and laser technology in electronics production.
You had an impressive show in the midst of a demand slowdown in the electronic industry last year. What are you doing to strengthen the show in 2010? In 2009, which was indeed a very difficult year, over 825 exhibitors and represented companies from 25 countries took part in our show. Even in this year of slowdown we made no compromises on the accomplishment and promotion of our show, because we pursue a long-term strategy in
MMI India and Indian Printed Circuit Association (IPCA) worked closely during the last two shows to bring a size number of PCB industry players in the show. What’s the status about this partnership in 2010? The cooperation we have had with IPCA during the last two years has been very successful. Both parties would like to continue this cooperation and we are currently in the process of developing the detailed
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In conclusion, what is in store for Indian electronic eco-system at electronica India and productronica India 2010? Sustainability and renewable energies are one of the hot topics at the show. To give exhibitors the chance to present their products and solutions in this field we will set up a new exhibition segment, the “PV and Solartech Area.” The product range will cover every aspect of this technology in PV production and the new area will for example present solar glass and encapsulation, equipment for wafer-based photovoltaics, cell production, equipment for crystalline photovoltaics, or equipment for manufacturing photovoltaic modules. Another new feature at the show is the topic of LED. This will draw new exhibitors and naturally new groups of visitors. We also start to integrate a pavilion on laser and laser systems for electronics production. Messe Muenchen has a high level of expertise in this field and will bring this to the Indian market. Every two years we organize the world leading trade show for lasers and photonics, the LASER World of PHOTONICS in Munich. The next event will be held from 23 to 26 May 2011.
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Case Study: Reliability and versatility bring success in motor drive manufacturing
Interview Association & institutes news
Association & institutes news CEAMA reports 30% Q-o-Q growth in Q1 2010 Consumer Electronics and Appliances Manufacturers Association (CEAMA) announced that the industry had a robust growth across its varied product categories for Q1 2010 (Jan-March 2010). Overall the industry has grown 30% over Q1 2009 (Jan-March 2009). This quarter also saw phenomenal sales especially in the display category, which includes conventional flat panel displays (PDPs, LCDs and flat screen TVs). FPD registered a growth of 70%, AC sales increased by 50%. The industry also witnessed a 40% healthy growth in home appliances business. “The Consumer sentiment has been very positive and upbeat with higher disposable income and a strong economy. The durable industry has seen a robust 30% growth approximately,” said Pradeep Kumar, spokesperson CEAMA. He added that due to increase in commodity prices like steel, copper etc. and also increase in VAT by a few states, appliances and ACs in particular saw a price rise. This didn’t become a deterrent, though, and almost all categories saw a handsome growth. New ISA chairman, vice chairman Dr. Biswadip (Bobby) Mitra, president & managing director, Texas Instruments India, is the new chairman, and Dr. Pradip K Dutta, corporate VP & managing director, Synopsis India, has been elected as the vice chairman of India Semiconductor Association (ISA) for the year 2010-11. Ms. Poornima Shenoy is the president of ISA. Widely acknowledged for his leadership in the industry, Dr. Mitra takes charge at a time when ISA is poised to play a key role in driving rapid growth of the Indian electronics industry. “Electronics System Design and Manufacturing (ESDM) is a huge opportunity for India,” Dr. Mitra said. “It also has the potential to change our country. Through strong acceleration by the ISA member community, we aim to fast-forward the growth across multiple verticals, driven by the electronics system design and manufacturing companies. We will also intensify our focus on green energy leadership and inclusive growth.” The members of the Executive Council of ISA for 2010-11 are:
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• Dr. Biswadip (Bobby) Mitra, President & Managing Director, Texas Instruments India (ISA Chairman) • Dr. Pradip K Dutta, Corporate VP & Managing Director, Synopsis India (ISA Vice Chairman) • Rajesh Mishra, VP, SEMI & Peripherals Practice, Wipro Technologies (ISA Treasurer) • B V Naidu, Adviser, ISA and Chairman, Sagitaur Ventures • Poornima Shenoy, President, ISA • Dr. Satyanarayan Gupta, CEO, Concept2Silicon Systems • Ganesh Guruswamy, VP & Country Manager, Freescale Semiconductor • Dr. Praveen Vishakantaiah, President, Intel India • Raghu Panicker, Sales Director, Mentor Graphics India • Vivek Sharma, EMR VP & Director, India Design Center, ST Microelectronics • Sanjay Nayak, CEO, Tejas Networks MAIT welcomes draft e-waste (Management and Handling Rules), 2010 MAIT, the apex body representing the interest of IT hardware industry in India, congratulated the Union Minister of State for Environment & Forests, Jairam Ramesh on making the draft ‘e-waste (Management and Handling) Rules, 2010.’ Putting the draft rules in the public domain is a part of the Government process of rule making. These shall remain in the public domain (http://moef.nic.in/index.php) for receiving comments from the public and stakeholders for a period of two months. Welcoming the rules, MAIT Executive Director, Vinnie Mehta said, “The recently announced new set of rules for environmentally sound management of e-waste is the need of the hour. E-waste is one of the world’s fastest growing waste streams and with increased consumption of IT and electronics products, India will soon be faced with the challenges of managing the same. Currently, an estimated three lakh eighty thousand metric tonnes of e-waste is generated annually in India. To address the issue of e-waste in India, MAIT along with GTZ, Greenpeace and Toxicslink had recommended to the Government a set of draft rules in August 2009. ”
ELCINA’s Strategic Electronics Summit for Defence & Aerospace in Bangalore ELCINA is organising a Strategic Electronics Summit on 2nd July 2010 in Bangalore to promote electronics manufacturing and business development in the Defence & Aerospace sector. This is part of the business development strategy for the electronic industry, evolved under the guidance of the ELCINA executive committee to enhance value addition and promote local manufacturing in the electronics sector. There have been significant policy changes in the defence electronics and new opportunities are seen in the aerospace sector, where Indian companies can play a major role locally and also become global players. The event will focus on these opportunities, products and technology which is in demand and local as well as global companies are being invited to participate to find business opportunities, propose joint ventures and possibly share technology to take advantage of the booming Indian market. IT hardware market record robust sales in Q3 MAIT announced the findings of its Quarterly Industry Performance Review for the quarter October-December (OND) of fiscal 2009-10. The total PC sales between October and December 2009, with desktop computers, notebooks and netbooks together, were 2 million (20 lakh) units, registering a growth of 42 per cent over the same period last Fiscal. The sales of desktops stood at 1.35 million (13.5 lakh) units, while netbooks and notebooks taken together recorded a consumption of 0.66 million (6.6 lakh) units growing 27 per cent and 90 per cent respectively, on a year-onyear basis. “The impact of the global economic recession is now well behind us, and the IT hardware industry in India is once again on a growth path. All segments of the IT hardware industry—computers, peripherals and networking products—recorded impressive growth in the Q3/2009-10 over the same period last year. he industry is hopeful that the sales would further improve in the fourth (January-March) quarter.”
Global SMT & Packaging Southeast Asia – Summer 2010 – 37
Maiden ELECTRONICS NEXT INDIA 2010—A progressive trade show
Show Review:
Maiden ELECTRONICS NEXT INDIA 2010— A progressive trade show After months of anticipation, ELECTRONICS NEXT INDIA opened its doors in New Delhi on 24th February 2010. Since the announcement of this show in mid 2009, many argued that it was a suitable business platform for the Indian electronic market, as Reed Exhibitions had adopted a wait and watch policy due to the slow-down in global electronics industry last year and postponed the 16th edition of Componex Nepcon India in 2010. The maiden edition of ELECTRONICS NEXT INDIA held in New Delhi from 24-26 February at Pragati Maidan. The show was inaugurated by Lt. General AKS Chandele, director general, Corps of Electronics and Mechanical Engineers. ELECTRONICS NEXT INDIA 2010 had a special emphasis on defence electronics with an aim to increase investment in the domestic defence equipment manufacturing industry. Most industry leaders agreed that it comprised all the elements of a progressive trade show environment. During the Inaugural session, the first issue of Global SMT & Packaging— South East Asia edition, the exclusive media sponsor of the show, was also launched by Lt. Gen. Chandele. Supported by the Electronic Industries Association of India (ELCINA), Indian Printed Circuit Association (IPCA), MAIT, TEMA, CEAMA among others, ELECTRONICS NEXT INDIA 2010 was an event covering the entire gamut of the electronic manufacturing industry in India
and catering to all industry verticals like consumer electronics, aerospace, defence electronics etc. The show had a good mix of global and Indian players showcasing their latest product and technology offerings and innovations at the show. The exhibition also had an exclusive Country Pavilion from Taiwan. The expo also had a significant participation from China,
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Singapore and Hong Kong along with companies from countries like USA, UK, Japan, Belgium, Israel, Korea and Germany as well. NMtronics, Bergen Systems, AmericanTec, INEtest, Maxim SMT, Prosem, Essemtec, EMS Technology, Omron, DVS, Sumitron and SLN Technologies, among others, were some of the national and international companies that showcased their latest in SMT solutions during the show. Since the global market recovery was underway, a big chunk of Western SMT companies and their Indian representatives were missing from the show this year. Hopefully, we will see a larger number of them flocking into the show next year. For the first time, the global EMS giant Elcoteq SE showcased its electronics manufacturing services at a trade show in India. ELECTRONICS NEXT INDIA also featured a conference in association with ELCINA: “Vision for the future—Opportunity for India in Global Electronics Industry,” which was inaugurated by R.Chandrashekhar IAS, secretary, Department of Information Technology, Government of India. The conference saw experts like Vipin Tyagi, director, Centre for Development of Telematics; Vinnie Mehta, executive director, Manufacturers Association of Information Technology (MAIT); Col. K.V.Kuber, senior vice president, Religare Aerospace & Defence Advisory Services and Mohit Pundit,
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Maiden ELECTRONICS NEXT INDIA 2010—A progressive trade show
business head, L.G. Electronics sharing their perspectives on the future of the Indian EMS industry. There was an exclusive seminar—“Green Electronics, Managing the Environment”— focusing on the need for adopting environment friendly manufacturing and supply chain management. “During the economic slowdown, manufacturers must now understand trends, latest innovations and cost-effective technical solutions,” said T. Vasu, vice president, ELCINA & Director, Tandon Group. “They also must explore technologies suitable for future applications and be aware of the pressing issues that numerous enterprises now are focusing on. Knowledge of these important subjects will not only help companies to survive this difficult period, they also will provide direction for continuous growth after the economic recovery.” “I am glad that our efforts were widely recognized and supported by the industry which drives our efforts now and will continue to do so in the future,” said Rajeev Chawla, senior vice president, Images Exhibitions, the organizer of Electronics
Next India 2010. “Under the guidance of a very able advisory board, and continuous feedback from the industry & the support of all major trade bodies, this edition featured many firsts for the electronics industry and we hope to see all our exhibitors and many more in the next edition of Electronics Next India.” The 2010 edition of Electronics Next India received an encouraging response from both the exhibitors and visitors, thus prompting the organizers to begin the groundwork for next year’s edition, scheduled to be held from January 7th-10th, 2011, again at Pragati Maidan, New Delhi.
ELECTRONICS NEXT INDIA 2011 When the market was down and economy was recovering, IMAGES Exhibitions braved the odds and gave the electronics industry its only show. ELECTRONICS NEXT INDIA, an annual international exhibition catering to the needs of the electronics market in India, is much more than a trade fair. It is the information exchange hub for India’s electronics industry. Conferences, forums and discussions with leading representatives from major companies provide valuable information, insights and knowledge—benefits that can only be had at the ELECTRONICS NEXT INDIA. The International conference at ELECTRONICS NEXT INDIA 2011, taking place January 7th-10th at Pragati Maidan in New Delhi, will see the industry leaders and experts from key segments
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sharing their vision for the future of the industry under the show’s theme of “technology and man, hand in hand” as 11—Underfill reservoir the event celebrates technological advances and the human forces behind them. ELECTRONICS NEXT INDIA 2011 aims to be a show that showcases the latest breakthroughs in electrical and electronics, unveil the future technology products, congregate the global electronics industry under one roof and converge ideas into one vision for the industry to grow. The event covers components and production technologies and equipment, including SMT equipment and materials, printed circuit boards, component manufacturing technology, test and measurement, R&D services, embedded systems, logistics and more. Visitors to the event come from all segments of industry:
IT, communication technology, medical technology, electronics and electrical engineering, automotive electronics, aerospace technology, quality control, consumer electronics and more. The 2010 event welcomed more than 6,000 visitors. The conference featured 20 speakers. 116 companies exhibited on the show floor. Keeping pace with the reality, where Man makes machines & Machine is a half-man, it’s best to know the human side of electronics....the minds behind the technology and the techniques behind the trade. It’s important to meet, talk ideas, present innovations & think...what next? What’s next is ELECTRONICS NEXT INDIA 2011.
Global SMT & Packaging Southeast Asia – Summer 2010 – 39
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electronicAsia October 13-16, 2010 Hong Kong electronicasia.hktdc.com
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Primary Business Type Electronics Mfg—OEM Electronics Mfg—Contractor Electronics Mfg—Design Electronics Mfg—Supplier Microelectronics Manufacturer Microelectronics Services Microelectronics supplier PCB Manufacturer PCB Services PCB Supplier Other
Trafalgar Publications,8 Talbot Hill Rd, Bournemouth, Dorset BH9 2HJ, UK • F: +1 239-236-4682 • subscriptions@globalsmt.net
Quality that you Can Trust on High Accuracy
High Reliability
High Durability
JUKI has built its global image with a combination of top quality, high reliability machines, world - class services & support that result in the lowest production cost for the customers. With advance technologies & a high commitment to our customers, JUKI is poised for continued growth in 21st century.
FX-3
High Speed & Hydric Feeder
JX-100
Flexible Compact Mounter
KE-2070
High Speed Flexible Chip Shooter
JX-100 LED
Compact Led Assembly System
KE-2080
High Speed Flexible Mounter
FX-2
High Speed Modular Mounter
Over 22,000 Mounters Sold World Wide JUKI INDIA PVT. LTD Bangalore : 9945210117 â&#x20AC;˘ New Delhi : 9971396921, 9910448300 â&#x20AC;˘ Mumbai : 9323931932, 9323619519 E-mail.: smt@jukiindia.com