COTS Journal

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December 2016, Volume 18 – Number 12 • cotsjournalonline.com

The Journal of Military Electronics & Computing JOURNAL

g n i s s e c o r P d n a s r o s n Se s e c n a v d A V A U l l a m S Drive FEATURED ARM TECHCON 2016 UPDATE / REVIEW EXCLUSIVE Q&A: PRE-INTEGRATED SYSTEMS SATISFY READINESS DEMANDS DATA SHEET: XMC and PrXMC BOARDS

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The Journal of Military Electronics & Computing JOURNAL

CONTENTS

COTS (kots), n. 1. Commercial off-the-shelf. Terminology popularized in 1994 within U.S. DoD by SECDEF Wm. Perry’s “Perry Memo” that changed military industry purchasing and design guidelines, making Mil-Specs acceptable only by waiver. COTS is generally defined for technology, goods and services as: a) using commercial business practices and specifications, b) not developed under government funding, c) offered for sale to the general market, d) still must meet the program ORD. 2. Commercial business practices include the accepted practice of customer-paid minor modification to standard COTS products to meet the customer’s unique requirements. —Ant. When applied to the procurement of electronics for he U.S. Military, COTS is a procurement philosophy and does not imply commercial, office environment or any other durability grade. E.g., rad-hard components designed and offered for sale to the general market are COTS if they were developed by the company and not under government funding.

December 2016 Volume 18 Number 12

FEATURED p.10 Small UAVs Bulk up Sensor and Processing Capabilities SPECIAL FEATURE Embedded Solutions for Small UAVs 10

Small UAVs Bulk up Sensor and Processing Capabilities

ARM TechCon 2016 Highlights ARM’s Growing Momentum

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The Inside Track

32

COTS Products

44

Annual Article Index

50

Marching to the Numbers

Coming in January See Page 42

Pre-Integrated Systems Evolve to Satisfy New Expectations Steve Gudknecht, Elma Electronic

DATA SHEET XMC and PrXMC Boards Roundup 26 27

Put the Devil First

John Koon

SYSTEM DEVELOPMENT Pre-Integrated System Innovations 22

6 Editorial

Jeff Child

TECH RECON Update/Review from ARM TechCon 2016 16

DEPARTMENTS

High-Speed Throughput and Processing Drive XMC and PrXMC Trends

On The Cover: In June NAVAIR awarded Insitu the Low Rate Initial Production (LRIP) Lot V contract for RQ-21A Blackjack UAV. The craft embeds electrooptic and mid-wave infrared sensors with a laser rangefinder and infrared marker. Shown here U.S. Marines launch a RQ-21A for Assault Support Tactics 2 at Canon Air Defense Complex (P111), Yuma, AZ. (US Marine Corps photo).

Jeff Child

XMC and PrXMC Boards Roundup

Digital subscriptions available: cotsjournalonline.com

COTS Journal | December 2016

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JOURNAL

The Journal of Military Electronics & Computing

Editorial

EDITOR-IN-CHIEF Jeff Child, jeffc@rtcgroup.com EXECUTIVE EDITOR Johnny Keggler, johnnyk@rtcgroup.com SENIOR EDITOR John Koon, johnk@rtcgroup.com

WESTERN REGIONAL SALES MANAGER John Reardon, johnr@rtcgroup.com (949) 226-2000 EASTERN REGIONAL SALES MANAGER Ruby Brower, rubyb@rtcgroup.com (949) 226-2004

Finance

COTS Journal HOME OFFICE The RTC Group 905 Calle Amanecer, Suite 150 San Clemente, CA 92673 Phone: (949) 226-2000 Fax: (949) 226-2050 www.rtcgroup.com

MANAGING EDITOR James Pirie, jamesp@rtcgroup.com

CONTROLLER Cindy Muir, cindym@rtcgroup.com (949) 226-2000

EDITORIAL OFFICE Jeff Child, Editor-in-Chief Phone: (603) 429-8301

Art/Production

Publisher

PUBLISHED BY THE RTC GROUP Copyright 2016, The RTC Group. Printed in the United States. All rights reserved. All related graphics are trademarks of The RTC Group. All other brand and product names are the property of their holders.

ART DIRECTOR Jim Bell, jimb@rtcgroup.com GRAPHIC DESIGNER Hugo Ricardo, hugor@rtcgroup.com

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EDITORIAL Jeff Child, Editor-in-Chief

Put the Devil First

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fter a turbulent path through Congress, the National Defense Authorization Act for Fiscal Year 2017 (NDAA) finally passed the Congress with veto-proof majorities in both houses. But the fight to reform defense acquisition is ongoing, with most stakeholders acknowledging that the taxpayers need to get more for their dollar when it comes to defense spending. The issues are the same as ever: unexpected rises in program costs, slipping of schedules and technology not meeting maturity levels. There’s never any lack of new theories or initiatives aimed at improving things, but for me it’s the ones that take an engineering perspective that catch my eye. Because you all as COTS Journal readers are engineers or technical decision makers of some kind, the expression “the devil’s in the details” is something you well understand. In recent GAO report looked at how detailed systems engineering done prior to product development are a good indicator positioning a program for success. In the report GAO’s analysis of nine case studies identified the factors that frame the challenge posed by a given weapon system’s requirements. The nine programs were the KC-46A Tanker Modernization Program, Global Positioning System III Satellites, Small Diameter Bomb Increment I, Integrated Air and Missile Defense, Paladin Integrated Management, F-35 Lightning II Program, Joint Light Tactical Vehicle, CH-53K Heavy Lift Replacement Helicopter and the P-8A Poseidon Multi-mission Maritime Aircraft Increment I. The analysis showed that programs with even modest requirements and early detailed systems engineering had better outcomes. For example, the Small Diameter Bomb Increment I program, which delivered within cost and schedule estimates, had an incremental approach, mature technologies, a derivative design, and detailed systems engineering before development began. Programs that began with more challenging requirements and insufficient systems engineering reported worse outcomes. The F -35 Lightning II for example—which has encountered significant cost and schedule problems—began development with a single- step approach, a highly complex design, immature technologies, and little systems engineering. The GAO’s analysis of the nine selected programs supported identified four key factors that shine a light on both challenges posed by a system’s top-level capability requirements and the related risk. Although those four factors were not the only ones they considered, the GAO found they were prominent and observable early in their case study programs. Those four factors are Acquisition approach: This indicates whether a program intends to take an incremental, evolutionary approach or a single-step approach to meet all capability requirements. An incremental approach

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COTS Journal | December 2016

reduces risk by developing and delivering a product in a series of enhanced interim capabilities until final capability is reached. In contrast, a single-step approach increases risk by attempting to deliver the final capability all at once without any interim capabilities. Technology status: This is the extent to which the critical technologies for a proposed system are mature at the start of product development. Technologies are ready for inclusion in a product development program when they have been demonstrated in a realistic, operational environment (Technology Readiness Level (TRL) 7), proving that they can work as intended. Demonstrating technologies in an operational environment provides a higher level of technology understanding and reduces risk prior to starting product development. Design maturity: This factor is the extent to which a proposed system’s design is either derived from an existing commercial or DoD system—whether operational or prototype—or is new and unprecedented. Designs derived from existing systems, whether commercial or DoD, by nature have more knowledge available when product development begins, thus reducing risk. In contrast, unprecedented designs are by nature more complex and inherently higher risk. System interdependency: This indicates the extent to which a system relies on another system or group of systems being developed and managed separately to provide its required capabilities. DoD acquisition guidance says that—although DoD programs should not be acquired in isolation—a program office developing a more independent system generally has more control over requirements, schedule, funding, and interfaces, among other factors. In contrast, a program office developing a system that is more dependent on other systems— like a system of systems —generally has less control, thus making its requirements more challenging to achieve and increasing risk. There’s no doubt that the products and technologies developed by our military embedded computing industry offer solutions that feed squarely into the challenges described above. The demand for higher technology readiness has helped fuel demand for prepackaged and prequalified subsystems as primes find themselves without the time or the DoD funding to develop a prototype subsystem themselves. As TRL becomes a more significant part of military requirements, suppliers in our industry are crafting solutions with that specifically in mind. One final thought: My sincere thank you to all you in our industry for your support of COTS Journal in 2016. Here’s wishing you all Happy Holidays and a healthy, prosperous New Year in 2017. And most importantly, please join me and RTC Group in thanking all of our nation’s servicemen and women who serve in harm’s way. Especially at this time of year, they are in our thoughts and in our hearts always.



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INSIDE TRACK Intelsat General Tapped for Satellite Services Supporting WIN-T Testing Intelsat General, a subsidiary of Intelsat, has announced a new contract to provide satellite connectivity to RiteNet Corp. to support testing by the U.S. Army at Ft. Bliss in El, Paso, TX, and at the nearby White Sands Missile Range in New Mexico. The Army conducts a range of testing using the Warfighter Information Network (WIN-T) at these two facilities, including two Network Integration Evaluation (NIE) events each year to evaluate new technologies (Figure 1). Using Ku-band capacity on an Intelsat satellite, RiteNet will provide both ongoing and surge capacity for the network. RiteNet provides informa-

tion technology and telecommunications services to a number of government and commercial customers. According to Intelsat General, its services will support the Army as it tests new equipment and technologies that will one day provide American warfighters around the globe with advanced capabilities. This Comsatcom Transponded Capacity (CTC) task order is awarded by the U.S. Defense Information Systems Agency-Defense Information Technology Contracting Organization (DISA-DITCO) for one year, with options to renew it annually for an additional four years.

Figure 1 This Stryker vehicle’s WIN-T gear extends radio networks and provides tactical edge network comms during Network Integration Evaluation 16.1. Intelsat General McLean, VA (703) 270-4200 www.intelsatgeneral.com

IEE Contracted for F-15C/D Passive Attack Display (PAD) Upgrade

Abaco Systems Acquires 4DSP and Technobox MMS Product Line

IEE is under contract with Boeing Defense, Space & Security to design and develop an upgrade to the F-15 Passive Attack Display (PAD) for compatibility with the Advance Display Core Processor (ADCP) II. The PAD uses an ARINC 818 fiber optic interface to receive video from, and exchange messages with the ADCP II. The ADCP II facilitates the centralization of a number of critical display functions, such as the consolidation of multi-window configurations into one complete screen image for distribution to display units. This addresses the need for the ever-increasing amount of information available to operators to improve situational awareness. The F15-PAD upgrade features twelve programmable discreet interfaces, each of which can be

Abaco Systems has announced that it has acquired 4DSP and the MMS product line from Technobox. Founded in 2004, 4DSP designs and manufactures high speed digital signal processing and data acquisition solutions based on FPGA technology. The company provides solutions for applications such as image processing, software defined radio, radar, sonar, airborne surveillance and medical imaging. 4DSP’s engineering services include the development of custom hardware, FPGA firmware and software, as well as turn-key solutions. Pierrick Vulliez, CEO of 4DSP, and his team will join Abaco with immediate effect. Abaco collaborated closely with the Technobox team—notably on the VPX carrier—prior to the

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Figure 2 The F15-PAD upgrade features 12 programmable discreet interfaces, each of which can be provisioned by the ADCP II to 3 different types of inputs and outputs. provisioned by the ADCP II to three different types of inputs and outputs (Figure 2). These discreets can be used for other aircraft functions, giving the PAD a built-in service life extension. In addition to the ARINC 818 interface, and programmable discreets, the upgraded PAD

COTS Journal | December 2016

features an enhanced Built in Test (BIT). IEE Van Nuys, CA (818) 787-0311 www.ieeinc.com


The

INSIDE TRACK acquisition of the MMS product line. At the heart of the MMS range is the ECM (Electrical Conversion Module) Carrier, which is a PMC form factor board. An onboard FPGA lets you interface up to four MMS modules placed on the carrier to the host board. Those modules support a range of I/O functionality including DAC, ADC, RS485, RS422, RS-232, LVDS and DIO. Each module measures only 1 ¼ inches square. Abaco Systems Huntsville, AL (866) 652-2226 www.abaco.com

GD Bath Iron Works Gets $59 Million Contract for DDG-51 Yard Services The U.S. Navy has awarded General Dynamics Bath Iron Works $59 million contract for the continuation of Arleigh Burke-class (DDG 51) Lead Yard Services and Flight III Upgrade design efforts. This contract extends the services for engineering, technical support, special studies and Flight III design work for Arleigh Burke-class ships through December 2017. The Flight

III upgrades include a more powerful missile defense radar, increased shipboard power production and hull enhancements. Since 1987, Bath Iron Works has provided design and technical assistance for design upgrades and major changes for DDG 51-class destroyers. The Arleigh Burke-class destroyer is a multi-mission combatant that offers defense against a wide range of threats, including ballistic missiles (Figure 3). The ships combine the AEGIS combat system, the Vertical Launching System, an advanced ASW system, two embarked SH-60 helicopters, advanced anti-aircraft missiles and Tomahawk anti-ship and landattack missiles. General Dynamics Bath Iron Works Bath, ME (207)443-3311 www.gdbiw.com

Curtiss-Wright to Buy Data Acq Vendor Teletronics Technology Corp. (TTC) Curtiss-Wright’s Defense Solutions has announced today that

it expects to its position in and commitment to the US and global data acquisition and flight test instrumentation (FTI) markets following Curtiss-Wright’s announced intention to acquire Teletronics Technology Corporation (TTC). The acquisition is expected to close in early 2017 and remains subject to regulatory approval and other closing conditions. TTC is a leading designer and manufacturer of high-technology data acquisition and comprehensive FTI systems for critical aerospace and defense applications. TTC has broad exposure on more than 140 programs, including high-performance military aircraft such as the F-35 and F-18, major defense flight test centers, spacecraft, missile programs, and commercial and business jets. Key products include data acquisition units, recorders, network products, RF networks, airborne transmitters and receivers, and telemetry expansion cards. TTC is headquartered in Newtown, PA. and has approximately 225 employees. The acquired business will operate within Curtiss-Wright’s Defense segment. Curtiss-Wright Defense Solutions Ashburn, VA. (703) 779-7800. www.cwcdefense.com

Mercury Systems’ Vince Vitto Receives Eugene G. Fubini Award

Figure 3 Since 1987, Bath Iron Works has provided design and technical assistance for design upgrades and major changes for DDG 51-class destroyers.

Mercury Systems has announced that its Independent Chairman of the Board Vince Vitto was recently awarded the 2016 Eugene G. Fubini Award for outstanding contributions to the Department of Defense (DoD) and the Defense Science Board (Figure 4). The award was signed by Secretary of Defense Ash Carter and presented in a ceremony recently

Figure 4 Vince Vitto awarded the 2016 Eugene G. Fubini Award for outstanding contributions to the Department of Defense (DoD) and the Defense Science Board. held at the Pentagon in Washington, D.C. According to the DoD, the award recognizes “professional excellence and superior performance in providing exemplary scientific and technical contributions across the broad spectrum of the DoD mission to meet the needs of the warfighting community, improve the acquisition system and strengthen the commercial and defense industrial base.” Mr. Vitto has served for many years on the Defense Science Board, an organization established in 1956 to promote the latest in applied sciences and technology in support of the DoD. His contributions include papers that are presented to key personnel within the Pentagon up to and including the Secretary of Defense. The Eugene G. Fubini Award was established in 1996 by then-Secretary of Defense William J. Perry. Dr. Perry helped launch COTS Journal in 1998. Mercury Systems Chelmsford, MA (978) 967-1401 www.mrcy.com

COTS Journal | December 2016

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SPECIAL FEATURE Embedded Solutions for Small UAVs

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COTS Journal | December 2016


SPECIAL FEATURE

Small UAVs Bulk up Sensor and Processing Capabilities Leveraging advances in integrated electronics and computing, Small UAVs, along with their payloads and control gear, are gaining improved warfighting capabilities. Jeff Child, Editor-in-Chief

T

he flight control, mission control and communications gear aboard Small UAVs—face some of the most rigorous size, weight and power restrictions. Selecting the right embedded electronics and embedded computers in those systems becomes a make or break decision. Here the popular term “SWaP” (size, weight and power) take on a whole different level of urgency. This category of UAVs roughly defined as “smaller-than Predator-sized” encompasses a variety of platforms. The main DoD-funded among those include the RQ-7 Shadow, RQ-11 Raven, RQ-20 Puma and RQ-21 Blackjack Unmanned Aircraft Systems as programs of record. These aircraft provide organic Reconnaissance, Surveillance, Target Acquisition (RSTA) capabilities and are embedded in maneuver formations capable of providing crucial information to the ground commander. With hundreds of thousands of flight hours accrued, many of these UAVs have been mission-critical workhorses in combat operations in Iraq and Afghanistan. Meanwhile new small UAV platforms and upgraded versions of existing platforms are in the process of testing and development. Most of the early designs of Small UAVs and their payloads didn’t much embrace the idea of open architecture and standard form factor boards. In some cases form factors like PC/104, COM Express and others were used in the development phase, but those often didn’t make it to the deployment phase of the UAV. But over time that’s changed as Small UAV system

COTS Journal | December 2016

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SPECIAL FEATURE

Figure 1 In April the Shadow Tactical UAV surpassed one million total flight hours—the only unmanned aircraft system to reach that milestone. 85 percent of those hours were combat missions.

developers strive to add more mission autonomy and more powerful sensors. Meanwhile off-the-shelf compact box-level subsystems typically designed for a special payload function are also gaining mindshare. These box level solutions make sense as Small UAV system developers try to combine multiple functions into a single payload.

Upgrades budgeted for Small UAVs For the proposed DoD fiscal 2017 budget not much is expect to change in whatever final Defense budget the Congress approves. In the Small UAV category the FY 2017 budget request calls for funding upgrades to system hardware and payloads for the RQ-7 Shadow. It also procures upgrades and provides training and contractor logistics support for the RQ-11 Raven. Procurement is also provided for RQ-20 Puma systems for the USMC and SOCOM. A total of 8 systems (base and OCO) of the RQ-21 Blackjack will be procured along with contractor logistics support for that aircraft. For its part, the Shadow Tactical Unmanned Aircraft System, made by Textron Systems Unmanned Systems, achieved a key milestone this year surpassing one million total flight hours—the only unmanned aircraft system of its size to accomplish that so far (Figure 1). According to Textron, more than 85 percent of these one million flight hours occurred during combat operations. 12

COTS Journal | December 2016

In April the U.S. Army awarded Textron a $116.5 million contract to an additional 24 RQ-7B V2 Shadow Tactical Unmanned Aircraft System (TUAS) upgrades. Deliveries of the 24 systems are expected to begin in 2018. The contract furthers the U.S. Army’s Shadow V2 block upgrade program, under which Textron Systems acts as lead system integrator, and aircraft and ground control station original equipment manufacturer. The Shadow V2 is an all-digital, modern system, optimized for new multi-mission, single-sortie profiles and manned-unmanned teaming. The Shadow V2 also includes a high-bandwidth, encrypted data link that enables the aircraft to carry payloads ranging from high-definition video to secure control for prosecution missions. The Army is currently teaming the Shadow V2 system with its Apache helicopter fleet for scouting missions within its combat aviation brigades.

Small UAV vs Vehicle Target Further enhancing technology aboard the Shadow UAV, this summer Textron Systems and Thales announced the successful testing of the Fury lightweight precision guided glide weapon from the Shadow UAV against static vehicle targets. The Fury was tested from a Textron Systems’ Shadow TUAS at the U.S. Army’s Yuma Proving Ground in Arizona on April 29. During the

testing, the Fury was released from 8,000 feet altitude, conducted a GPS guided flyout maneuver and transitioned to the SemiActive Laser (SAL) guided terminal engagement, directly striking a static vehicle target. Textron Systems and Thales began development of the Fury weapon system in 2014. And in October Textron rolled out a new member of its of Ground Control Station (GCS) products, the Synturian. The Synturian family of products includes two main product lines: Synturian Control and Synturian Remote. Synturian Control is a multi-platform, multi-vehicle, multi-domain control system that enhances collaboration and dissemination of information. Synturian Remote includes mobile, network-strengthened tools that enhance situational awareness through timely information and collaboration. Both Synturian Control and Synturian Remote package these capabilities into small, lightweight hardware form factors that are scalable based on customer needs. Textron Systems is actively integrating the Synturian family of products with its own unmanned aircraft systems, including the Shadow Tactical UAV and the Aerosonde™ Small UAV.

Wide Area UAV ISR Another tried and true Small UAV platform is the ScanEagle made by Insitu,

Figure 2 The ScanEagle UAV’s ViDAR performs maritime search tasks to determine the presence of and locate an object. ViDAR is similar to RADAR, but uses vision rather than radio waves.


SPECIAL FEATURE

Figure 3 The Mantis i45 EO/IR gimbal payload on the Puma AE UAV lets users target more accurately and with greater detail while operating farther away from the target.

Command (NAVAIR) awarded the STUAS Engineering Manufacturing Development contract to Insitu in 2010 to begin the development of RQ-21A Blackjack, a variant of the company’s Integrator unmanned system. The program achieved Milestone C in 2013, delivered the first LRIP system in 2014, and achieved initial operational capability in January. In June NAVAIR awarded Insitu the Low Rate Initial Production (LRIP) Lot V contract for RQ-21A Blackjack. The $71 million follow-on contract award includes six LRIP systems with options for two additional LRIP systems. The contract also includes an option year for nine Full Rate Production (FRP) systems.

Payloads for Puma UAV a Boeing subsidiary. In May the company announced a collaboration with Hood Technologies and Sentient to incorporate the ViDAR (Visual Detection and Ranging) payload into its fleet of unmanned systems, beginning with the ScanEagle UAV. ViDAR is a wide area autonomous detection system for electro-optic imagery in the maritime domain (Figure 2). In addition to cueing ScanEagle’s primary camera turret, the payload gives operators who typically must rely on larger, more expensive aircraft to detect objects in the ocean a smaller, more cost-effective solution. The software that runs the ViDAR payload was developed in Australia by Sentient Vision Systems, and was built into a ScanEagle payload by Hood Technologies of Hood River, OR. ViDAR fits a modular slice on ScanEagle that comprises a large backplane digital video camera that continuously scans the ocean in a 180-degree arc in front of the air vehicle. Sentient’s ViDAR software then autonomously detects any object on the surface of the ocean, providing the ground control station with an image and location coordinate of each object detected in real time. The primary sensor can then be cross-cued to the object by simply clicking on the image. A newer kid on the Small UAV block is the RQ-21A Blackjack, also built by Insitu. RQ-21A has significantly larger payload mass, volume and power than other small UAS currently being used in theater. The system includes electro-optic and mid-wave infrared sensors with a laser rangefinder and infrared marker. Naval Air Systems

The Puma UAV made by AeroVironment got its share of payload upgrades this year. In May the company unveiled its new Mantis i45 electro-optical/infrared (EO/IR) gimbal payload designed for the Puma AE (All Environment) UAV. According to AeroVironment, Size, weight and power (SWaP) also were critical design considerations. A payload shell similar to that of the standard Puma AE payload houses the Mantis i45 and installs in an identical manner onto the Puma AE platform. The Mantis i45 empowers operators to identify targets more accurately and with greater detail while operating even farther away from the target (Figure 3). The higher resolution imagery also aids in target analysis, positive identification and better enables operators to identify threats to friendly forces. With an advanced suite of sensors, including ultra-high-resolution EO and IR imagers, key features of the Mantis i45 include: dual-color cameras (wide and narrow views); improved IR imagery; new low-light camera; high-power illuminator; 50-times zoom in EO; optional on-board storage of high definition video and high-resolution stills; and a dedicated on-board image processor. The AeroVironment Mantis i45 also lends itself to a level of customization never before seen in a gimbal this size while still being compatible with portable Puma AE systems.

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Tested Aboard Destroyer In other Puma news, this summer the U.S. Navy tested and deployed the RQ-20B Puma UAV aboard a Flight I Guided Missile

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SPECIAL FEATURE

Destroyer (DDG Class). Some of these exercises included the use of AeroVironment’s fully autonomous system to recover the aircraft aboard a ship. Following completion of a Puma AE intelligence, surveillance and reconnaissance mission, the AeroVironment Precision Recovery System provides for the autonomous on-board recovery of the aircraft, without interrupting the ship’s operations. Because the Puma AE is also designed to land and float in water, operators can choose to recover it from the ocean, should mission requirements dictate. The Precision Recovery System occupies a small footprint and can be managed and operated by members of a ship’s crew, as opposed to requiring external contractors. It is transported in tactical packaging that can be hand-carried aboard and readily transferred from one ship to another. The DoD recently established the designation RQ-20B for the block 2 Puma AE small UAS. The block 2 Puma AE system includes a more powerful and lighter propulsion system, lighter and

stronger airframe, long endurance battery, precision inertial navigation system and an improved user interface. AeroVironment Monrovia, CA (626) 357-9983 www.avinc.com Textron Systems Hunt Valley, MD (410) 666-1400 www.textronsystems.com Insitu Bingen, WA (509) 493-8600 www.insitu.com

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TECH RECON Update/Review from ARM TechCon 2016

ARM TechCon 2016 Highlights ARM’s Growing Momentum This year’s ARM TechCon shinned a light on just how popular the ARM architecture in the general market. Now its sphere of influence is flowing rapidly into the defense market. John Koon, Senior Editor

I

n this era where keeping SWaP (size, weight and power) low is a key design requirement for military platforms, ARM-based computing embedded solutions are rapidly gaining mindshare. The annual ARM TechCon in late October was where all the key chip, board and software vendors delivering those ARM-based building blocks gathered to showcase their latest technologies. COTS Journal’s staff was there and this article examines the key ARM technologies topics and product ewe saw at ARM TechCon 2016, while also looking at the ARM’s adoption in general in our military embedded computing industry. One important shift in the ARM world occurred this summer when Softbank announced the acquisition of ARM for $32 billion at a 43 percent premium and the deal was closed within 7 weeks. As a result of the acquisition Simon Segars, CEO of UKbased ARM Holding, has a new boss, Mr. Masayoshi Son, chairman of Softbank, a Tokyo based telecom conglomerate. ARM, an IP company enjoying a healthy growth of 20 percent year after year, enables silicon partners to produce products to power supercomputers as well as small sensors used in the Internet-of-Things connections around the world (Figure 1).

ARM Gaining Military Mindshare The U’S Army is applying the latest em16

COTS Journal | December 2016

Figure 1 Masayoshi Son, CEO of Softbank (which now owns ARM Holdings), projected that the IoT connected sensors would reach one trillion accumulatively by 2018. bedded computing technologies, similar to those shown at ARM TechCon, to advance the development of its vehicles to save lives and reduce costs. At the 2016 North American International Auto Show, the U.S. Army Tank Automotive Research, Development and Engineering Center (TARDEC) displayed driverless army vehicles capable of machine driving. The capabilities include a convoy of autonomous vehicles following one human driver or a driverless vehicle

navigating by itself. According to Dr. David Gorsich, chief scientist of TARDEC, a lot of technologies are packed inside the vehicle such as computer, sensors, LIDAR to sense the environment and even thermally in the dark using IR. The use of autonomous driverless vehicles can save lives by going through areas with high improvised explosive devices (IEDs) (Figure 2). TARDEC started testing its radio technology on a convoy of tractor-trailers along interstate 69


TECH RECON

Figure 2 The U.S. Army Tank Automotive Research, Development and Engineering Center (TARDEC) is testing driverless army vehicles that will save lives.

in the St. Clair and Lapeer counties of Michigan to prepare for future driverless and connected vehicle development. Information Technology is critical to the success of defense. More than 20 years ago, the department of defense (DoD) funded the development of the ARPANET, the beginning of internet. Today, the cloud and IoT is center of attention of the industrial world. According to report published by the CSIS Strategic Technologies Program the deployment of IoT-related technologies by the military has primarily focused on applications for Command, Control, Communications, Computers, Intelligence, Surveillance and Reconnaissance (C4ISR) and fire-control systems and is limited and poorly integrated. It is expected to get better over time. Wind River, a division of Intel, in its white paper, suggested the collaboration of DoD and technology companies to develop a military IoT platform in which network security is matter of life and death.

based SBCs and computer on modules (COM) solutions. Among these as Congatec, Extreme Engineering and Diamond Systems. Congatec provides the Qseven compatible Conga-UMX6 (NXP i.MX6 Dual ARM Cortex A9) and Conga-QMX6 (NXP i.MX6 ARM Cortex A9 processors) while Extreme Engineering offers ARM-based XMC/PrPMC mezzanine module, 3U OpenVPX SBC, 6U VME and 6U VPX SBC. Diamond for its part teamed up with Toradex to create a platform allowing ARM-based plug-in modules to be added. As technologies like security, IoT, driverless vehicles continue to expand, the defense market will want to leverage those in their system designs..

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ARM SBCs and COM Solutions As ARM-based computing becomes increasingly attractive to the defense market, more and more hardware manufacturers seek to provide more ruggedized ARMCOTS Journal | December 2016

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TECH RECON

SIDEBAR

ARM-Based Solutions Showcased at ARM TechCon 2016 Exhibitors at ARM TechCon showcased a wide mix of technologies and products. Here’s some the most interesting ones from the show. Innovative Tactile Feedback Technology At the ARM TechCon, Ultrahaptics demonstrated a unique technology which uses sound waves to provide touchless tactile feedback. Users can feel the shape of an object without touching it. For example, in mid-air, the user can press a button on an elevator or turn the knob on a stove. Potential applications include automotive infotainment gesture control, 3D holographic displays for computing, control of domestic appliances like induction hobs, industrial and medical systems and gaming/ AR/VR. The company also started a partnership with the Shinoda & Makino lab in Japan to further explore new applications of the technology. Based on the academic research at the University of Bristol, UK in 2013, led by Tom Carter, now Ultrahaptic’s CTO and founder, and colleagues, the touchless haptic feedback project has become an innovative commercial product. It uses acoustic radiation force to generate a sensation to be felt by the surface of the skin of a human palm giving the sensation of virtually touching an object (Figure A). According to Ultrahaptics, studies have shown that the reflection coefficient of airborne ultrasonic waves from the human body is very high, 99.9 percent of the pressure waves generated are reflected away from the soft tissue with only 0.1 percent of the energy being absorbed. Ultrahaptics points out that the technology is very safe because the amount of energy being absorbed is very small. An array of ultrasonic speakers or transducers along with the proprietary signal processing algorithms, multiple ultrasonic energy force points are generated to hit the surface of skin with the 100-300 Hz carrier frequency. The modulated frequency can be managed by the API to create different sensations to simulate various objects.

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COTS Journal | December 2016

Figure A Touchless tactile feedback uses acoustic radiation force to generate a sensation to be felt by the surface of the skin of a palm giving the sensation of virtually touching an object. To help developers to come up with their own custom device, Ultrahaptics provides an evaluation kit (UHEV1) which includes everything needed except the PC; transducer array and logic processor board with firmware, third-party camera sensor for hand position/gesture recognition, an Ultrahaptics software (SDK) license, a host processor running Ultrahaptics and camera sensor API (Application Programming Interface). The square transducer board provided consists of 16x16 (256 transducers). The number of transducers required to be active at any time is determined by the 3D interaction zone above the array and the strength of the haptic sensation desired. The transducers have a 60-degree beam angle which provides a range of 15 to 80 cm. Ultrahaptics’ ultimate business model is to license software and would assist OEM customers in the development of system hardware. An OEM customer would be able to deliver a complete solution, say, a touchless sound system to automakers installed in a car. Consumers would be able

to select a CD track and control the sound volume without looking at the dash board. The tactile feedback gives the sensation of touching and turning of the knob. This technology has broad applications and has potential in the defense market. Ultrahaptics Bristol, UK +44 117 325 9002 www.ultrahaptics.com


TECH RECON

SIDEBAR

ARM-Based Solutions Showcased at ARM TechCon 2016 System-on-Modules Support Robots and Drones Thundersoft has developed products to meet demands in many market segments including smartphone, tablet, IoT, automotive and enterprise (Figure B). Thundersoft’s product lines support Android, Linux and Windows. Based on the Qualcomm snapdragon chip, Thundersoft has developed a line of system on module (SOM) for drones, smart camera, robots and VR. These developments based on common technologies and algorithm from Thundersoft including vision, image processing and control capability. Robots with artificial intelligence technologies are used in various segments including consumer, entertainment and industrial. Recently this author saw one such robot at the San Jose airport for travelers to interact with to find restaurants and other travel related information. It would even sing. This is an area with great potential. To address needs in Robotics, Thundersoft, provides two versions of system-onmodules (SOM). One is the high-end aim

at industrial service sector and the other is middle to low-end for house hold and commercial use. The high-end SOM is a versatile, small board (50x40x6 mm) based on the Qualcomm Snapdragon QCT APQ8096/Kryo 2.15 GHz/Andero 530 chipset. It has two 32 LPDDR4 3 Gbytes/1600 MHz memory with 32 Gbytes of storage. Its network functions include Qualcomm QCA61741a 02.11 ac/a/b/g/n MIMO and BT4.0. Multiple high-speed ports are available including HDMI and misc. signal. Also included are the camera and display ports. The lowend, SOM is a small board (40x40x10 mm) based on the Qualcomm Snapdragon QCT APQ8016, 1.2 GHz quad core A53 design. Memory and storage are smaller; 1G/2G and 32 G. I/O includes MIPI (display), CSI (camera), I2S, I2C, UART, SPI, AD, GPIO and USB 2.0. For drone applications, Thundersoft provides a system-on-module (SOM) solution based on the Qualcomm Snapdragon 801 chipset (APQ8074) quad core processor. The SOM for drone measures 33 x 50

mm and weighs less than 15g. The chipset integrates flight control, camera and data translation functions in one unit. The GPU is 578 MHz maximum with 2G DDR and 16/32 gigabyte EMMC. It has built-in Wi-Fi of 802.11 b/g/n at 2.4G/5GHz. Multiple interfaces are available including 4 lane MIPI for camera, UART for IMU SPI, GPS, Ultrasonic, ESC and remote control, USB 3.0 and SD Card. Video works 4K at30 fps and MPEG-5 AVC/H264. Supported operating systems include Linux and ADSP (RTOS). Thundersoft America Milpitas CA (408) 472-9861 www.thundersoft.com

Figure B Based on the Qualcomm snapdragon chip, Thundersoft has developed a line of system on module (SOM) for drones, smart cameras, robots and VR.

COTS Journal | December 2016

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TECH RECON

SIDEBAR

ARM-Based Solutions Showcased at ARM TechCon 2016 COM Solution with ARM Plug-in Choices At ARM TechCon Diamond Systems announced a new ARM-based versatile Eagle and Eaglet SBC product lines with addon modules from Toradex (Figure C). The computer-on-module (COM) Eagle/Eaglet family is a scalable platform in which users can customize a solution based on space, performance, I/O and power requirements. There are two different modules in the family; the full-size, full-featured Eagle and the smaller-size Eaglet. Customers may purchase a fully configured off-the-shelf solution with pre-select ARM module and heat sink installed or the baseboard and ARM module separately for configuration flexibility. Development Kits, including the fully configured SBC, pre-configured Linux OS on a microSD card, and a full cable kit, are available. The Eagle and Eaglet measure 4- x 5.75-inchs and 4-x 4-inches accordingly. The Eagle has 8 serial and 16 digital I/O verses Eaglet’s 2 and 8 lines. Compared with the Eaglet’s fixed power input of +5 VDC, the Eagle can accept 9-36 VDC. The Eaglet supports 1 Gbit Ethernet, half of what the Eagle has. The CSI camera serial interface is also available on the Eagle. Both versions support 1 micro SD, 1 mSATA socket, HD audio and operate from -40 to +85 degrees C (depending on installed COM). The modules come with a low-cost I/O expansion and the PCIe MiniCard and daughterboard sockets. To add ARM and NVIDIA computing power to the Eagle/Eaglet platform, Diamond partnered with Switzerland-based Toradex to provide 3 different plug-in modules (Apalis TK1, T30 and iMX). Toradex manufacturers the Apalis family of computer on modules (COM) based on the ARM Cortex and the NVIDIA Tegra or NXP/ Freescale iMX multicore processors and all three modules support Windows Embedded Compact, Embedded Linux, Android, Floating Point Unit and NEON. The prebuilt Windows Embedded Compact 7 and 20

COTS Journal | December 2016

Figure C The computer-on-module (COM) Eagle/Eaglet family is a scalable platform that supports three different plug-ins from Toradex.

2013 images are bundled with the hardware modules. The Linux BSP for Apalis use the Open Embedded Build Framework and include driver support as part of the solutions. The board support package (BSP) and work space can be downloaded for free. The L1 instruction and data cache are 32 Kbytes per core and the L2 cache is 2Mbytes for TK1 and 1 Mbyte for T30 and iMX. RAM capacity ranges from 512 MB DDR3 to 2GB DDR3L (64 bit) with flash memory from 4 to 16 Gbytes (8 bit) depends on the module. Multiple I/O including USB, I2C, SPI, UART and more. The hardware modules measure 82x45x6 mm with power dissipation ranges from 3 to 15W and come with a support commitment until year 2025. Diamond Systems Sunnyvale, CA (650) 810-2500 www.diamondsystems.com

Secure Software Tools Support Connected Vehicle Tech The two hot topics form the commercial market—connected cars and security—have huge relevance in the military realm. As cars are getting more and more connected, they have also provided in-

creased opportunities for hackers to gain access to cars. It has been demonstrated that it would only take minutes to remotely unlock the door or gain access of the control of a car. A partnership formed between the National Highway Traffic Safety Administration (NHTSA) United States Department of Transportation (DOT) to investigate vehicle-to-vehicle (V2V) communication. Cars equipped with V2V technology will be able to communicate with cars nearby to alert drivers of dangerous condition ahead to avoid crashes. For example, a driver will be warned that another car at the intersection is approaching quickly so the driver can slow down to avoid a possible head-on collision. V2V makes use of a protocol called Dedicated Short-range communication (DSRC), a two-way, wireless communication with a range of 300 meters depends of the surrounding environment. It operates at the 75MHz band of the 5.9 GHz spectrum allocated by the FCC. There are challenges about V2V such as secure connections and public key management to ensure false signals or hackers are filtered out. What to do about it? Addressing that issue Green Hills Software has proposed multiple solutions to address the security and safety problems. Green Hills provides a platform-independent, real-time operating systems (RTOS) INTEGRITY-178b, which was the first RTOS certified by the National Information Assurance Partnership (NIAP). It is a partnership between the National Institute of Standards and Technology (NIST) and the National Security Agency (NSA) responsible for U.S. implementation of the Common Criteria, including management of the NIAP Common Criteria Evaluation and Validation Scheme (CCEVS) validation body. Recently, ARM launched the 32-bit Cortex-M23 and Cortex-M33 cores based on the new ARM v8-M architecture which incorporates the ARM TrustZone technology traditionally for the low power Cortex M0 and Cortex-M3. At ARM TechCon,


TECH RECON

SIDEBAR

ARM-Based Solutions Showcased at ARM TechCon 2016 Green Hills announced the support of the Cortex-M23 and Cortex-M33 with its real-time operating system (RTOS), development tools, and defense-in-depth security services. These security services include embedded cryptographic toolkits, authenticated boot, key insight and TrustZone consultation. Meanwhile Green Hills announced the support of the new ARM v8-M architecture with its C/C++ compilers which have been listed by the EEMBC Benchmark Compilers. EEMBC is an industry alliance provides benchmarks to help developers to select processors based on their performance. These above services enable developers in the automotive industry and other segments including financial systems, microprocessor manufacturing, industrial automation and military communication to develop robust products needing better security and safety. Additional certification includes ISO 26262, IEC 61508, EN 50128, DO-178B and EAL 6+. Green Hills Software Santa Barbara, CA (805) 965-6044 www.ghs.com

COTS Journal | December 2016

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SYSTEM DEVELOPMENT Pre-Integrated System Innovations

Pre-Integrated Systems Evolve to Satisfy New Expectations Increasing demands for more “finished” systems are driving technology supplies to craft embedded computing solutions that are pre-integrated to greater degrees. Steve Gudknecht, Product Manager, Elma Electronic

T

he age of the pre-integrated embedded system has arrived. Whether those systems are general computing systems, network communications centric, surveillance (C4ISR) or data storage centric, end users and defense primes are increasingly looking to lower tier suppliers to provide complete sub-systems with a high TRL (Technology Readiness Level). With this emerging shift in the landscape comes a learning curve for suppliers, especially as they strive to meet defense industry expectations for fast delivery and near deployment-ready operation. Demand for off-the-shelf systems to put on the table or in the field for testing before program commitment is increasing. Risk reduction and accelerated time to deployment are key drivers of this trend. The dilemma faced by system suppliers is how to be ready with the right product, at the right time, in a market that lacks widely accepted industry standards, which would describe the baseline requirements of form, fit, function and connectivity at the box system level.

lowed end users to define, and suppliers to build, systems conforming to the directives in the standard, thus eliminating the question of physical size. Connectivity to the outside world in 19 inch chassis is often in the form of discrete single purpose cables with predefined connectors. Mounting for 19 inch and ATR chassis is also well defined by standards. The movement towards SFF systems is driven by two factors: Higher levels of chip

integration that allow increased functionality in ever smaller packages; and the need to pack more overall functionality into high performance, smaller and lighter defense assets. For many applications, however, miniaturization has reduced, or even eliminated, the need for these larger chassis. The new wave of pre-integrated systems involves small form factor (SFF) CPU boards such as COM Express, PCI/104 and sometimes 3U slot cards, where the external dimensions and connec-

Leaving the 19” Comfort Zone For years, embedded system suppliers have been developing 3U and 6U slot card based systems housed either in 19 inch wide chassis defined in height in “U” increments of 1.75 inches or in any one of the myriad of ATR box sizes. These standardized sizes al22

COTS Journal | December 2016

Figure 1 Pre-integrated small form factor systems are critical for use across a range of demanding defense applications.


A54_COTSJ_2_25x9_875_Layout 1 10/24/16 4:45 PM

SYSTEM DEVELOPMENT

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Modularity in baseline system elements enables configuration flexibility and shorter lead times.

tivity requirements of such systems are determined more by the specifics of the application and, unlike 19 inch and ATR chassis, not much at all by an open industry standard. ATR and 19 inch systems have mainly been developed as projects targeting specific requirements and then sold into a program as a defined system. In this case, system development is often a joint effort between supplier and customer. The integration of these puzzle pieces is at the heart of slot card based systems. Buying expectations are now shifting from an engagement that starts out more like a project and, over time, ends in the final solution to one where the solution is expected to be on the shelf and ready to go. Demand for off-the-shelf, pre-integrated SFF systems with a high TRL did not really exist in defense applications until recently, but it’s here so stay. So the question becomes how to satisfy that demand. Intelligent system design practices in the form of modular and scalable system design can help bridge that gap between the needs of the supplier and the expectations of the customer (Figure 1).

Modularity and Extensibility A building block approach to systems design can help reduce this gap in expectations, and applies to both the mechanical and electrical designs. Scalability in just about every design aspect is key to shortening lead time and delivering a system within the time required. Regarding mechanics, chassis designs that can grow and shrink for a tailored fit to meet a specific space requirement can

streamline the design effort. Despite the wide selection of pre-defined systems now being introduced by suppliers, customer engagements often begin with interest in a particular system only to be followed up with, “That’s exactly what I need, however…”. It’s that “however” moment that enables design innovations. When the system size does not meet the need, an extruded box design will step up to the challenge. Sturdy, lightweight extruded aluminum side panels can be cut to length and offer infinite variation in the height, width and depth of a chassis. Extrusion profile options, with or without cooling fins, allow fast adaptation to meet thermal needs. Depending on the magnitude of the change, incremental thermal analysis may be required to fine-tune the new size. Integrated system suppliers who have long histories of proven chassis design capability can quickly support this end-to-end set of tasks.

Flexible I/O and Connectivity Critical to any application are the external connectivity requirements that drive the I/O connector type and arrangement. A wide range of shapes and sizes of MIL-STD-38999, Mighty Mouse, M12 or discrete connector styles is generally needed. While most defense systems require MIL-STD 38999 connectors, hundreds of variations exist, even within that subset and the I/O location can be specific – whether front or rear placement, for example. Signal breakout requirements also cause variations in connector sizes, just as pin

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COTS Journal | December 2016

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counts drive the size of each connector. Suppliers can maintain a library of common panel designs for a given set of I/O exiting the box. These I/O panel designs can be quickly substituted, mixed and matched to meet the specific requirement. Even in situations where no existing design is suitable, a custom solution is easily fabricated from stock (Figure 2).

Assembling the Puzzle Pieces Central to most pre-integrated SFF mission computers is the CPU module, which is typically either a COM Express (type 10 or type 6) or PCI/104 board. Both form factors and their respective derivatives are COTSbased and defined by the PICMG standards organization. Both have established track records of performance and are supported by a worldwide ecosystem of suppliers with rugged versions available. COM Express CPU modules require a carrier board for I/O breakout, which are typically supplied by the end user or integrator. In contrast, PCI/104 CPU modules are used in

a stackable architecture intended for direct connection to additional modules and are designed with a wide array of I/O breakout options. Modularity in the I/O set is achieved using existing COTS form factor boards. XMC and PMC mezzanine modules are long established in the 3U and 6U Eurocard world and enable a modular, scalable, easily replaceable and low cost way to upgrade system I/O, while preserving the investment in the more expensive host card – typically an SBC. Both mezzanines types are increasingly being used in SFF systems used in SWaP avionics and ground mobile applications. Additionally, and newer to the scene, miniPCIe and mSATA modules offer credit card-sized I/O options for converting typical I/O signal types into PCIe, thus making use of the growing number of PCIe ports available on the CPU. These modules enable add-on support for Ethernet, audio, video, CANbus, WiFi, digital and analog, SATA, and USB plus a variety of mobile service standards such as LTE (4G) and derivatives or even additional on-board

storage. This combination forms a powerful basis for quick adaptation of a baseline system to meet the needs of a wide array of applications (Figure 3).

The Critical Carrier Card CPU choices, plus an extensive set of I/O options, provide the ingredients for a wide range of pre-integrated systems. However, the glue that brings these discrete pieces together in a system is the all-important carrier card. COM Express carrier cards typically provide the connectors and headers necessary to support the I/O native to the CPU. In many cases, they are barely larger than the CPU module itself. As this standard finds its way into the defense market, suppliers have developed carrier cards featuring mezzanine sites designed to support multiple XMC/PMCs, as well as multiple miniPCIe and mSATA modules in addition to the CPU module site. Reliable carrier design is critical, especially where high speed and densely packed

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SYSTEM DEVELOPMENT

supply options enable multiple choices in power levels as well as power filtering and conditioning. Many defense applications require MIL-STD 1275 and 704 capable power supplies, so this is a valuable option in terms of modularization.

Re-configuration an Added Bonus Figure 3 The NetSys-5303 features both mechanical and functional modular concepts for scalability. signals are common. PCIe Gen 3 signals at 8 Gbps require skilled board designers and the latest signal integrity analysis tools to ensure every piece of data makes its way through intact. Taking it one step further, carrier designs can support both COM Express and PCI/104 cards to leverage the best options available, irrespective of the board form factor. Last but not least, modularity in power

It’s clear that pre-integrated systems, based on modular designs, can resolve many pre-sale demands, but an additional benefit addresses post-sale issues that can arise. Pre-integrated systems are modular and configurable, by definition, and that inherently enables efficient re-configuration after the system is deployed. This becomes useful when mission evolution requires a CPU upgrade or a new I/O recipe and as COTS modules reach end of life. Programs can then preserve the lion’s share of their equipment investment by replacing only the effected obsolete compute and I/O modules, while leaving the remaining system intact, inclusive of the carrier card, connectors, balance of the I/O cards, power supplies and chassis mechanics.

Modularity and scalability in both the electrical and mechanical designs of pre-integrated systems enable baseline designs to be quickly adapted to meet specific compute level, I/O and mechanical requirements for the end application. This approach reduces time to deployment in critical defense programs and enables efficient system upgrades post-deployment. With proper attention to system design and a seasoned team with an eye towards emerging defense requirements, experienced embedded system suppliers can address the growing demand for pre-integrated systems which are delivered against ever shortening lead time expectations. This capability allows primes and end users to realize cost savings as they concentrate their efforts towards higher level system integration. Elma Electronic Fremont, CA. (510) 656-3400 www.elma.com

COTS Technology with a Custom Twist. Many companies choose to focus on what they offer to the customer by way of solutions and skills. System providers and niche market OEMs often sub-contract their computer hardware design. If your application has unusual requirements, Sundance has the skills and resources to specify, design, manufacture and test a custom solution for you. Our design engineers will help you to develop a specification that meets your requirements, whilst making every effort to ensure that your product conforms to appropriate industry standards. By doing so, your product will be re-useable in future system-building applications. As a result, you will enjoy the benefits of both compatibility and an optimised solution, along with a fast, cost-effective route to market. For more information on any of these products, or assistance please contact us and we will help you the best we can.

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COTS Journal | December 2016

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DATA SHEET XMC and PrXMC Boards Roundup

High-Speed Throughput, Processing Drive XMC and PrXMC Trends Today’s XMCs and Processor-based PrXMCs offer fabric-based interconnects suited for high-speed processing as well as numerous types multi-function I/O solutions.

Jeff Child, Editor-in-Chief

X

MCs and Processor XMCs (PrXMCs) are now firmly entrenched as the natural heirs to the venerated PCI-based PMC and Processor PMC (PrPMC). XMCs enable system developers to mix and match the functions they need and by doing so create a semi-custom solution using offthe-shelf products. Meanwhile, processorbased mezzanines like PrXMCs advance the idea of separating computing functions from I/O, and application-specific functions have become a core theme in military applications. That concept is very attractive for applications with long design cycles like the military. The VITA 42 XMC set of standards provides backward compatibility with legacy PMC modules while allowing PCI bus products to integrate switched fabric architectures. The standards build on the existing PMC standards by adding switched fabric interconnects to the existing PCI bus interface. XMC has a conduction-cooled option that piggybacks off the VITA 20 ConductionCooled PMC standard. The VITA 42.0 base specification does not dictate signal types, data rates, protocols, voltage levels or grouping for these signals. Instead, it leaves that up to the several subspecifications that are part of the VITA 42 family. This allows XMCs to evolve as new interconnect technologies and protocols emerge. To support gigabit serial interfaces, 26

COTS Journal | December 2016

Figure 1 An E-2D Hawkeye 125 launches from the flight deck of the aircraft carrier USS Theodore Roosevelt (CVN 71).

notice that both P15 and P16 connectors define 10 full-duplex differential pair lines. As the product listings on the follow several pages show, advanced processing chips like GPUs, FPGAs and even Intel Xeon processors are now common on XMC and PrXMC offerings. FPGAs have become a particular fixture in mezzanine card designs. The latest crop of XMC boards sports powerful FPGAs like the Xilinx Artix -7 and Kintex UltraScale. These FPGAs offer a collection of resources ideally suited for DSP and peripheral I/O functions. FPGAs may be configured to implement numerous electri-

cal interface standards as well as a variety of protocol engines. Thanks to the magic of today’s level of semiconductor integration, multifunction board products have emerged enabling military system designers to blend a variety of I/O functions onto a single XMC card. The challenge has been to choose I/O technologies that are suited for use together. Reconfigurable FPGAs can be used to enable an I/O board to replace several legacy products, while adapting to future standards and protocols as well. This helps to mitigate product obsolescence, both at the board level and at the deployed system level. In applications that depended heavily on signal acquisition, raw resolution and bandwidth are only effective if the analog front end and the acquisition subsystem maintain good signal integrity as the signal is moved into the digital domain for processing. Here, XMC mezzanines help that issue as the analog components can be physically on a separate card from the digital processing components on the carrier card. An example of a system making use of XMC-based solutions is the E-2D Advanced Hawkeye (Figure 1). Using XMC technology, the data recording and playback systems for the E-2D could scale up to dozens of modular, heterogeneous input/output channels and FPGA-based protocol engines.


DATA SHEET

XMC and PrXMC Boards Roundup

Graphics XMC Sports AMD / CoreAVI E8860 Embedded GPU

XMC Modules Feature Xilinx Artix -7 FPGA with 200l Logic Cells

High-Performance Video and Graphics Empower Rugged GPU PMC Board

Abaco Systems’ XMCGA8 is the 8th generation of graphics mezzanine card designed for demanding rugged 2D and 3D applications. It supports the 8-lane PCI Express implementation, providing the maximum available communication bandwidth to an SBC. The GPU is capable of PCI Express Gen 2 speeds, and will automatically adapt to the speed of the host board. The PCI Express link will also automatically adapt to the active number of lanes available.

Acromag’s XMC-7A200 modules feature a high-performance user-configurable Xilinx Artix-7 FPGA enhanced with 200k logic cells, high-speed memory and a highthroughput serial bus interface. The result is a powerful and flexible I/O processor module that is capable of executing custom instruction sets and algorithms. Typical uses include hardware simulation, communications, in-circuit diagnostics, military servers, signal intelligence, and image processing.

The M598 is Aitech’s the latest video and graphics PMC in its extensive line of AMD-driven solutions, designed to simultaneously drive several independent video streams (link is external) in a wide variety of outputs. The PMC uses the AMD Radeon E8860 (Andelaar) GPU, providing six independent graphics heads. In addition to the independent video stream capture, the M598 provides advanced video overlay functionality.

• AMD / CoreAVI Radeon E8860 Embedded GPU.

• Reconfigurable Xilinx Artix-7 FPGA with 200k logic cells.

• 2 Gbytes of GDDR5 SDRAM.

• 128M x 64-bit DDR3 SDRAM; 32M x 16-bit parallel flash memory for MicroBlaze FPGA program code storage.

• x8 PCI Express (Gen 2 capable). .• Four independent output channels (two dual heads). • DVI 1.0 digital video output. • Single link to 1920x1200 at 60 Hz; 2x analog VGA output; VESA resolutions to 1920x1200 at 60 Hz. • Air- and conduction-cooled variants. Abaco Systems Huntsville, AL (866) 652-2226 www.abaco.com

• 4-lane high-speed serial interface on rear P15 connector for PCIe Gen 1/2 (standard), Serial RapidI/O, 10Gb Ethernet, Xilinx Aurora. • 60 SelectI/O or 30 LVDS pairs plus 2 global clock pairs direct to FPGA via rear P4 port. • 34 SelectI/O or 17 LVDS pairs plus 2 global clock pairs direct to FPGA via rear P16 port.

• Single Width PMC with PCI-X 64-bit at 133 MHz Host Interface. • AMD Radeon E8860 GPU; 6 independent graphics heads; 2 Gbytes of GDDR5. • Analog video inputs; analog and digital video outputs. • Full video switching capabilities. • Video capture and overlay; Video resize and customized formats. • Full 2D/3D processing capabilities. • Supports DirectX 11.1, Shader 5.0, OpenGL 4.2 and OpenCL 1.1. Aitech Defense Systems Chatsworth, CA (888) 248-3248 www.rugged.com

Acromag Wixom, MI. (248) 295-0310 www.acromag.com

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COTS Journal | December 2016

27


DATA SHEET

XMC and PrXMC Boards Roundup

XMC Serves Up UltraScale FPGA and 8 Gbytes DRAM

Processor XMC Sports 6th Gen Core Processor and 64 GB SSD

QorIQ T2080 -based PrXMC is SafetyCertifiable

Alpha Data’s ADM-XRC-KU1 is a high performance reconfigurable XMC (compliant to VITA Standard 42.0 and 42.3) based on the Xilinx UltraScale range of platform FPGAs. It features 8 Gbytes of DDR4 memory in four independent banks. Enhanced system monitoring enables the board to be managed by PCI Express or via USB.

Concurrent Technologies’ XP B5x/msd is a processor XMC module based on a low power variant of the 6th generation Intel Core family previously known as Skylake-H. The board initially features the 2-core Intel Core i3-6102E processor with 8 Gbytes of DDR4 ECC DRAM. Main connectivity to the baseboard is provided by a single x8 or dual x4 PCI Express (PCIe) lane configuration for high bandwidth connectivity. A range of standard I/O interfaces including Ethernet, USB, SATA, RS232, digital I/O and DisplayPort are included to satisfy a variety of configurations.

Creative Electronic Systems’ MFCC8558 is a Design Assurance Level (DAL) C certifiable XMC 2.0 SBC engineered for the most stringent aerospace and defense applications. It is specifically designed to meet the DO-178C/DO-254 certification process of your system. The card can be delivered with all documentation, certification evidences and supporting artifacts required to prove compliance with assurance qualifications of the avionic industry.

• PCI Express Gen2 x4 host interface. • Xilinx Kintex UltraScale (KU060, KU115} (A1517). • 8 Gbytes of SDRAM in 4 independent banks. • 2x QSPI serial NOR flash; Configuration flash provides an initialization design for automatic loading into the target FPGA.

• 6th generation Intel Core processor suitable for long life cycle deployments.

• Drivers for Microsoft Windows, Linux and VxWorks.

• Wide range of I/O interfaces available on XMC connectors.

• SDK provides the example C and HDL source code, giving software engineers and FPGA designers a head start in creating applications.

• Extended temperature and rugged versions available.

Alpha Data Denver, CO (303) 954-8768 www.alpha-data.com

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COTS Journal | December 2016

• Built in 64 Gbyte Solid State Drive for reliable storage.

• Support for Linux, Windows and VxWorks. Concurrent Technologies Woburn, MA (781) 933-5900 www.gocct.com

• Design Assurance Level C (DO-178C/ DO-254). • Conduction-cooled XMC 2.0 form factor. •NXP QorIQ T2080 processor. • Low power: 15W typical. • Four PCIe Gen2 interfaces on XMC (Full Mesh Support); One DAL-C Fast Ethernet interface. • Safety optimized board management controller. • Backward compatible with MFCC-8557. Creative Electronic Systems Geneva, Switzerland. +41 (0)22 884 51 00. www.ces-swap.com


DATA SHEET

XMC AND PRXMC BOARDS ROUNDUP Links to the full data sheets for each of these products are posted on the online version of this section.

PrXMC Board Serves Up Skylake Xeon E3-1505L Processor

Rugged XMC Network Access Controller Meets FibreChannel Needs

XMC Does 3G-SDI Video Capture and Advanced Graphics

Curtiss-Wright’s XMC-121 incorporates Intel’s latest 6th Gen Xeon technology using the Skylake Mobile Xeon E3-1505L processor. The processor provides quadcore, dual threading performance operating at 2.0 GHz with turbo operation to 2.8 GHz. With an integrated 8 Mbytes L2 Intel Smart Cache and featuring Intel Virtualization and vPro Technologies, the E3-1505L processor provides 64-bit high performance processing while consuming under 25 watts of power.

The FC-75500 FibreACCESS XMC board series from Data Device Corp. is based on its third generation of two-channel Fibre Channel Network Access Controller (NAC) PMC boards. These ruggedized boards provide 1 and 2 Gbit Fibre Channel interfaces for TCP/IP, UDP/IP, ASM, SCSI Initiator and FC-AE-1553 (High-Speed 1760) upper layer protocols, and are supplied with VxWorks and Linux software drivers.

The Condor 4107xX for EIZO Rugged Solutions ( formerly Tech Source) is a conduction-cooled XMC graphics card with OpenCL support. Based on the AMD E8860 GPU, the low-power, SWaP-optimized Condor 4107xX XMC graphics/video card provides 3G-SDI video capture capability with dual 3G-SDI video inputs and outputs on the rear XMC I/O connector.

• | Intel Skylake Mobile Xeon E3-1505L processor.

• Dual-channel operation. • x4 PCI Express interface. • Conduction or air-cooled PCI mezzanine board providing extended temperature operation.

• AMD Radeon E8860 GPU. • XMC form factor, 8 Lane PCI Express interface. • 2 Gbytes of GDDR5 memory.

• ASM, TCP/IP, SCSI initiator, raw mode, and FC-AE-1553 protocols.

• Video outputs: two 3G-SDI (1080p60) One DisplayPort++ (converted to DVI or VGA with adapters) One VGA/RGB Sync-on-green/STANAG 3350.

• Quad Gigabit Ethernet ports, serial RS232/422, USB, SATA, and DIO interfaces; DVI/DisplayPort.

• Memory-To-Memory latency under 10 μS

• Video inputs : two 3G-SDI, HD-SDI, SD-SDI.

• Dual SPI and I2C signals for local expansion.

• 1 Gbit/s or Gbit/s operation. • Class 2 and Class 3 service including Broadcast And Multicast.

• Resolution: 1080p60 (3G-SDI), 1920x1200 at 60 (DisplayPort, RGB).

• Quad-core , dual thread at 2.0 GHz. • Up to 32 Gbytes of DDR4 with ECC. • Up to 32 Gbytes of SATA NAND flash.

• Low power with configurable power settings. Curtiss-Wright Defense Solutions Ashburn, VA (703) 779-7800 www.cwcdefense.com

• VxWorks and Linux software drivers. Data Device Corp. Bohemia, NY (631) 567-5600 www.ddc-web.com

• OpenCL 1.2, DirectCompute 11 640 Shaders, 608/38 GFLOPs single/double precision peak. EIZO Rugged Solutions Altamonte Springs, FL (407) 262-7100 www.eizorugged.com

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COTS Journal | November 2016

29


DATA SHEET

XMC and PrXMC Boards Roundup

XMC Storage Card Boasts QuadChannel SATA III 6 Gbps Controller

QorIQ ARM Processor-Based XMC/ PrPMC is Conduction-Cooled

XMC Module Marries UltraScale FPGA and Dual 5.1 GSPS DACs

The DX2-COUGAR from EKF Elektronik is a XMC style mezzanine card, equipped with a four-channel PCI Express to SATA 6Gbps controller, and one or two on-board 1.8inch Micro SATA solid state drives (SSD) as an option. The Marvell SATA 3.0 controller allows RAID or non-RAID operation, and incorporates speed negotiation to backward support 3 Gbps and 1.5 Gbps.

Extreme Engineering’s XPedite6401 is an XMC/PrPMC mezzanine module that supports an NXP QorIQ LS1043A processor with four 64-bit ARM Cortex-A53 cores operating at up to 1.6 GHz. The LS10xxA processor family delivers excellent networking performance and flexible I/O options in a single SoC design, making it the logical choice for Small Form Factor networking and rugged embedded computing applications.

Innovative Integration’s XU-TX is an XMC module which features two ACcoupled single-ended 16-bit DAC outputs with programmable DC bias. The DAC devices employed support synchronization, interpolation, and their unique output circuits allow improved frequency synthesis in the 2nd and 3rd Nyquist zones. The maximum sample rate of the DAC IC is 10.2 GSPS.

• XMC single-width mezzanine card. • Marvell PCI Express 2.0 to SATA III host controller; Four SATA 6G bps interface ports. • Hardware RAID 0/1/10; On-the-fly AES encryption 128/256-bit. • Two front bezel eSATA connectors for attachment of external devices; RAID option for dual external drives. • On-board 1.8-inch Micro SATA SSDs. • Operating temperature: 0 to 70 degrees C. • Shock 15g 0.33ms, 6g 6ms; Vibration 1g 5-2,000 Hz. EKF Elektronik Hamm, Germany +49 (0)2381/6890-0 www.ekf.de

• NXP QorIQ LS1043A processor with four 64-bit ARM A53 cores at up to 1.6 GHz • Conduction cooling. • Up to 8 Gbytes of DDR4-1600 ECC SDRAM. •U p to 256 Mbytes of NOR flash; Up to 16 Gbytes of NAND flash. • x1 PCI Express Gen2 interface to P15. • Four 10/100/1000BASE-T Ethernet ports; Two 10GBASE-KR; Two 1000BASE-X ports. • Two RS-232/422/485; Two USB; One USB 3.0; One SATA 6 Gbit/s port (optional). Extreme Engineering Solutions Middleton, WI (608) 833-1155 www.xes-inc.com

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COTS Journal | December 2016

• Two 16-bit, greater than 5.1 GSPS DAC channels. • Over 2 GHz analog bandwidth (1X), • Enhanced 2nd and 3rd Nyquist modes. • Up to 7,800 Mbyte/s streaming via PCIe or Aurora. • Internal or external clocking; Fixed latency, multi-board synchronization. • Xilinx Kintex UltraScale FPGA XCKU060/085. • 4 Gbytes of DDR4 DRAM in 2 banks each with 64 bit interface. • 4 Mbytes of QDR SRAM in 1 bank with 32 bit interface. Innovative Integration Simi Valley, CA (805) 578-4260 www.innovative-dsp.com


DATA SHEET

XMC AND PRXMC BOARDS ROUNDUP Links to the full data sheets for each of these products are posted on the online version of this section.

XMC I/O Module Features In-Mission Dynamic FPGA Reconfiguration

L-Band RF Tuner XMC Delivers Improved Bandwidth and Precision

16 Channel XMC Does Thermocouple, RTD and Strain-Measurement Duties

Mercury Systems’ Ensemble IOM-300 series are rugged, programmable I/O XMC modules and the industry’s first fiber-optic modules which are supported by two FPGA devices. The primary Altera industrial-grade Stratix-V FPGA is a formidable, customizable processing resource for low-latency signal processing and is supported by a second configuration-FPGA that enables in-mission, real-time image refreshes.

Pentek’s Onyx Model 71791 XMC module. is an L-Band RF tuner with two 500 MHz A/ Ds based on the high density Xilinx Virtex-7 FPGA. The board is designed for connection directly to SATCOM or communications system L-band signals. A front panel SSMC connector accepts L-Band signals between 925 MHz and 2175 MHz, typically from an L-Band antenna or an LNB (low noise block).

The TXMC590 from TEWS Technologies is a standard XMC compatible module offering 16 channels capable of measuring thermocouples, resistive sensors like RTD and thermistors, and strain gauges. Each channel consists of a differential analog input and a differential sensor excitation output. The setup of the analog in-/ outputs, the signal conditioning and the translation into data values is handled by a microcontroller with an integrated ADC and current source.

• Main FPGA processor: Altera Stratix V 5SGXA5 or 5SGXA7. • Configuration FPGA: (PCIe Gen 2.1 interface). • 5 Gbytes DDR3 SDRAM; 128 Mbytes of flash memory. • Gen 2 x8 or Gen 3 x8 PCI Express ports to host processor. • Up to 12 pairs of fiber optic links at 10 Gbits/s each, full-duplex 850 nm multimode fiber (~range 150m). • XMC P16 ports: 8 SERDES at up to 10 Gbit/s; 12+19 LVDS pairs (various speeds, 19 LVDS pairs separable to single ended). Mercury Systems Chelmsford, MA. (866) 627-6951. www.mrcy.com.

• Accepts RF Signals from 925 MHz to 2175 MHz. • Programmable LNA handles L-Band input signal levels from -50 dBm to +10 dBm. • Programmable analog downconverter provides IF or I+Q baseband signals at frequencies up to 123 MHz. • Two 500 MHz 12-bit A/Ds digitize IF or I+Q signals synchronously; optional: 400 MHz 14-bit A/Ds. • Two FPGA-based multiband digital downconverters. • Xilinx Virtex-7 VX330T or VX690T FPGAs. Pentek Upper Saddle River, NJ (201) 818-5900 www.pentek.com

• XMC Interface conforming to ANSI/ VITA 42.0-2008 (R2014). • Standard single-width (149mm x 74mm). • 16 analog thermo-/strain measurement channels. • 16x Sensor excitation onboard. • Onboard cold junction compensation for thermocouples. • 16 pre-defined parameter sets for standard sensors; 16 user-definable parameter sets for specific sensors storable in flash memory. • Operating temperature: -40 to +85 degrees C. TEWS Technologies Reno, NV. (775) 850-5380 www.tews.com

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COTS Journal | December 2016

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COTS

FIND the products featured in this section and more at

PRODUCTS

intelligentsystemssource.com

3U VPX Switch Provides 10 Gbit Ethernet and PCI Express Gen3 Extreme Engineering Solutions (X-ES) has made available its newest 10 Gbit Ethernet switch module from the XChange3021. This 3U VPX switch provides both 10 Gbit Ethernet and PCI Express Gen3 (backwards compatible with Gen2 and Gen1) functionality, which allows the XChange3021 to serve as the heart of inter-board communications inside a high-end OpenVPX system. The XChange3021 was designed to provide the Ethernet switching capability needed for the next generation of 3U VPX systems, such as within X-ES’ own 3U VPX rugged, embedded systems. This 3U VPX switch module features a managed 10 Gbit Broadcom BCM56450 Ethernet switch, including 102.5 Gb/s of non- blocking switching, an on-chip ARM A9-based CPU, an integrated hierarchical traffic manager to reduce overall board complexity and power, and a feature-rich packet processing engine, all within a single 40 nm device. The XChange3021 is unique in that it also includes a PCI Express switch that increases throughput by supporting PCI Express Gen3 technology. The integration of a PCI Express

High Reliability Power Supplies Offer DC outputs from 1,000-4,000 W Behlman Electronics has completed its six month introduction of the DCR2U Critical Mission COTS Power Supply Series. The DCR2U Series is designed specifically for those who must have reliable DC power whenever and wherever it is needed for airborne, shipboard, ground, mobile and industrial applications. Behlman created the DCR2U Series of COTS Power Supplies to accept inputs of either 200 to 375 VDC; or 115/200 VAC, 3-phase at 57 to 440 Hz (IAW MIL-STD-704 and DO-160). Custom inputs are also available upon request. Output power of 1,000/2,000/3,000/4,000 Watts are available, with voltages from 3.3 VDC to 48 VDC, along with protective circuits, controls, and indicators, and wide-ranging operating and storage temperatures. The DCR2U is designed to meet MIL-STD810F for Shock and Vibration, and MIL-STD-461E for EMI/EMC (RE102 inside external enclosure). The power supplies are designed to be mounted in 19-inch racks, and need only 2U (3.50 inch) space. Weight is approximately 30 pounds. Behlman Electronics Hauppauge, NY (631) 435-0410 www.behlman.com

switch allows the XChange3021 to support X-ES’ latest 3U VPX modules, such as the XPedite767x family of single board computers, and consequently provides our customers with a higher bandwidth for both the data plane and control plane. With one 10-port, 10 Gigabit Ethernet switch, up to eight 10BASE-KR or 1000BASE-BX/KX Ethernet ports, and up to three 10/100/1000BASE-T Ethernet ports connected to the XMC site, the XChange3021 is capable of switching some of the largest 3U VPX backplanes. Extreme Engineering Solutions Middleton, WI (608) 833-1155 www.xes-inc.com

Pair of Safety Certifiable 3U VPX Graphics Modules Target Avionics Curtiss-Wright’s Defense Solutions has expanded its portfolio of DO-254/DO178C safety certifiable COTS products with the introduction of two new rugged 3U VPX high performance graphics processor modules. Based on AMD’s Radeon E8860, both of these multihead graphics cards support the long lifecycle availability required for defense and aerospace programs. Designed for use in safety certifiable applications, these modules were developed to meet DO-254 DAL C and DO-178C DAL A certification. The VPX3-719 is ideal for applications that require video capture and HD-SDI video interfaces. It supports extremely low latency video capture, graphics generation and overlay, and display output conversion. The card’s Radeon GPU is supported with up to six independent and simultaneous graphics outputs selectable from 4x DVI, 2x HD-SDI, and 2x analog RGBHV or STANAG interfaces. The VPX3-717 provides system designers with a higher level of architecture flexibility. Unlike the VPX3-719, it provides an on-module XMC mezzanine expansion site, which can be configured with a wide variety of XMC card types. The card can also be configured with a processor XMC SBC enabling single-slot solutions. I/O support includes six independent DVI outputs, two of which can also be configured to support a dual-link DVI port for higher resolutions. Curtiss-Wright Defense Solutions, Ashburn, VA (703) 779-7800. www.cwcdefense.com.

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COTS Journal | December 2016


COTS PRODUCTS

NXP i.MX 6 Processor Powers Projective Capacitive Touch Panel PC American Portwell Technology has announced its COMBO Series Panel PCs, a compact and projective capacitive touch panel PC with wide temperature and voltage support. The system is towered by NXP i.MX 6 series application processors family, a scalable multi-core platform that includes single-, dual- and quad-core processors based on the ARM Cortex-A9 architecture. As well as being equipped with a projective capacitive touch screen and a resolution of 7-inch 800 x 480 or 10-inch 1280 x 800 industrial display in stylish 16:9 aspect ratio, the COMBO Series features an IP65 rated front panel, and is housed in a plastic bezel, making it slim, lightweight but still rugged for harsh environments. American Portwell Technology Fremont, CA (510) 403-3399 www.portwell.com

449 pin BGA Socket Boasts Robust Electrical Performance Ironwood Electronics has introduced a BGA socket addressing high performance requirements for testing BGA devices: the SBT-BGA-7035. The self inductance of the contactor is 0.88 nH, insertion loss less than 1 dB at 15.7 GHz and capacitance 0.097pF. The current capacity of each contactor is 4 amps at 30C temperature rise. Socket temperature range is -55 to +180 degrees C. Socket also features a floating guide for precise ball to pin alignment. The specific configuration of the package to be tested in the SBT-BGA-7035 is BGA, 17x17mm, 0.65mm pitch, 449 position, 25x25 ball array. Pricing for the SBT-BGA-7035 is $770 at quantity 1. Ironwood Electronics Eagan, MN (800) 404-0204 www.ironwoodelectronics.com

VME SBC Sports an 8-Core Xeon D-15xx Processor Interface Concept has announced its new Intel Xeon processor D-15xx-based VME board. With as many as 8 processor cores, combined with 2 banks of 8 Gbyte DDR4, 4 Gbit Ethernet ports and 4 SATA interfaces among others, the IC-INT-VMEb is capable of meeting compute-intensive needs, in industrial and harsh environments (available in standard and rugged variants). This VME processing board integrates a Kintex-7 FPGA, that is dedicated to customers’ application requirements, and comes with an optional HDMI/DVI video link. To end with, the IC-INT-VMEb supports IC’s FPGA-based VME bridge, preventing obsolescence risks. Interface Concept Quimper, France +33 (0)2 98 57 30 30 www.interfaceconcept.com

Intelligent Power Modules Provide High-Reliability and High Temp Support BETA Transformer Technology (a subsidiary of Data Device Corp.) and CISSOID have partnered to develop compact and highly reliable Intelligent Power Modules (IPM). These modules are optimized for power converters and motor control within extreme environments. BETA developed high density transformer assemblies that combine multiple transformers into a single compact, rugged solution, with an extended temperature range of -55 to +225 degrees C. These compact transformer assemblies are ideal for board designs with limited space that are subjected to extreme thermal conditions. The transformers are optimized to provide the enhanced isolation, and extremely low parasitic capacitances associated with the fast switching SiC MOSFET transistors utilized. Data Device Corp. Bohemia, NY (631) 567-5600 www.ddc-web.com

COTS Journal | December 2016

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COTS PRODUCTS

Portable RF/IF Signal Recorder is Rugged and Light-Weight Pentek has announced a new member of its Talon RF/IF signal recording and playback systems. The Model RTR 2727A rugged portable recorder targets applications needing to record and reproduce high-bandwidth signals. A complete PC workstation, the RTR 2727A provides high data capacity and aggregate recording rates of up to 4.0 Gbytes/s in a four-channel system. The RTR 2727A offers up to sixteen hot-swap solid state drives (SSDs) with a combined capacity to 30.7 Terabytes sustain hours of continuous recording. The system features recording and playback of RF/IF signal frequencies up to 700 MHz with signal bandwidths up to 200 MHz. Available data converters include 500 MHz 12-bit A/Ds or 400 MHz 14-bit A/Ds and 800 MHz 16-bit D/As. At the heart of the RTR 2727A are Pentek Cobalt Series Virtex-6 software radio boards featuring A/D and D/A converters, DDCs (digital downconverters), DUCs (digital upconverters), and complementary FPGA IP cores. Optional GPS time and position stamping allows the user to record this critical signal information. The hot-swappable SSD array is available in configurations from 1.9 to 30.7 Terabytes and supports RAID levels 0, 1, 5, or 6. Available I/O includes VGA video, six USB 2.0 ports, two USB 3.0 ports and dual Gigabit Ethernet connections. All Talon RTR Portable Recorders are built on a Windows 7 Professional workstation with an Intel Core i7 processor and provide both a GUI (graphical user interface) and API (Application Programmer’s Interface) to control the system. The Talon RTR 2727A starts at $55,995. Pentek, Upper Saddle River, NJ (201) 818-5900. www.pentek.com

Star Communications, Inc.

signal processing receivers computing accelerators x 6.6” >65 Teraop/s 4.4 Small. Powerful. Affordable. Easy-to-use.

4.4 x 6.6 x 0.8 inches >65 Teraops/sec scalable 1-4 FPGAs installs in any PC or server made in the U.S.A.

www.starcommva.com 34

COTS Journal | December 2016

FPGA PCI Express Card Boasts 27 Gbit/s Full Duplex Aggregate I/O Sundance has launched its high-performance accelerator card based on the Xilinx XCVU190-2FLGC2104E FPGA. As an option the board can be fitted with lower cost FPGAs in the family, namely XCVU095, XCVU125, and XCVU160. This board is designed for superior data throughput leveraging various industry-standard interfaces, including 8 lanes of PCIe Gen 3, PCIe104 expansion connectors, and CFP4 optical networking. A processing engine with such power must have a matching data throughput for utilizing the entire horsepower. The processing and IO performance of the board is further enhanced with the option of using 2 Gbytes of Micron’s Hybrid Memory Cube (HMC), 8 Gbytes of DDR4 and 18 Mbytes of QDR2+ memory. An HDMI connector and codec allows applications to display images directly with the use of suitable IP cores. The board features additional I/O expansion options using the latest high-speed board-to-board connectors from Samtec. The HPC FMC interface supports 10 GTH transceivers and 72 I/Os. Multiple Samtec Z-Ray interposers provide access to HMC modules and additional 16 GTY transceivers. Each Samtec FireFly Micro Flyover System interface provides copper or optical silicon-to-silicon connectivity via 4 GTY transceivers. Price starts at $19,000 each for volumes under 10. Sundance DSP Reno, NV (775) 827-3103 www.sundancedsp.com


COTS PRODUCTS

800W 3U VPX Conduction Cooled Power Supply is VITA 62 Compliant Dawn VME Products has announced the PSC-6238, a VITA 62 compliant up to 800 Watt 3U OpenVPX Power Supply for conduction cooled systems. The PSC-6238 is designed to operate in a military environment over a wide range of temperatures at high power levels, is extended shock and vibration compliant per MIL-STD-810F and features an onboard real-time clock with switchable Battleshort and NED (Nuclear Event Detect) functions. Dawn’s PSC-6238 is a wedge lock conduction cooled module on a 1 inch pitch with an operating temperature of -40 to +85 degrees C at the wedge lock edge. The up to 800 Watt power output true 6-channel supply provides full Open VPX support and is current/load share compatible with up to 4 PSC-6238 units. The PSC-6238 front I/O panel includes a 3-color LED status indicator, VBAT battery access and a USB port for status display, access menu control and firmware upgrade. Dawn’s embedded RuSH Rugged System Health Monitor technology provides for intelligent monitoring and control of critical system performance parameters including voltage, current, temperature and control of power sequencing and shutdown of all voltage rails. Custom RuSH firmware enables additional features such as monitoring humidity, shock/ vibration events or customer specified monitoring windows, power sequencing, alerts, alarms, status and control, event logging, and so on. The RuSH monitor is interfaced into the OpenVPX (I2C) management plane, providing an I2C communication link with system cards. Priced at $4,975 for quantity 1. Dawn VME Products San Jose, CA (510) 657-4444 www.dawnvme.com

9-Port Gbit Ethernet Switch Rides CompactPCI Serial EKF has introduced the SL2BRASS, a 9-port Gbit Ethernet switch built on a peripheral slot card for CompactPCI Serial systems. The switch provides latest features such as 802.1 Audio Video Bridging (AVB/TSN) and QoS support. While four GbE ports are wired to associated M12 X-coded front panel receptacles, another four GbE ports are available for backplane communication via the CompactPCI Serial connector P6. Multiple SL2-BRASS boards on a suitable CompactPCI Serial backplane can be cascaded to a switch fabric with a scalable number of GbE ports, with or without a CPU card on the backplane system slot. EKF Elektronik Hamm, Germany +49 (0)2381/6890-0 www.ekf.de

SMARC 2.0 COM Board Family Uses a Variety of Intel Processors Kontron has announced its new SMARC 2.0 Computer-onModules based on the latest generation Intel Atom, Pentium and Celeron processors. The scalable SMARC-sXAL module covers the entire range of Intel's latest IoT-ready embedded processors. This includes the Intel Atom processor E3900 series, as well as Intel Pentium processor N4200 and Intel Celeron processor N3350. The SMARC-sXAL module is available in both dual-core and quad-core configurations. The SMARC-sXAL module versions range from a cost optimized dual-core Intel Celeron (2x 1.1/2.4 GHz with 6W TDP) iteration optimized for energy-sensitive applications to genuine quad-core Intel Atom (4x 1.6/2.0 GHz with 12W TDP) and Intel Pentium (4x 1.1/2.5 GHz with 6W TDP) versions for high-end applications. Kontron Poway, CA (888) 294-4558 www.kontron.com

COTS Journal | December 2016

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COTS PRODUCTS

Highly Integrated Motor Controller is Rad-Tolerant for Space Microsemi announced it is sampling the LX7720 radiation-tolerant motor controller, the newest member of its Space System Manager (SSM) product family. As the industry's first highly integrated radiation-tolerant motor control integrated circuit (IC), the LX7720 significantly reduces weight and board space relative to conventional discrete motor control circuits. The LX7720 has already been adopted by customers to enable various motor control applications in space robotics and human-rated space programs. Key features of the LX7720 include: Four half-bridge N-channel MOSFET drivers; Four floating differential current sensors; Pulse modulated resolver transformer driver; Three differential resolver sense inputs; Six bi-level logic inputs; Fault detection; Radiation-tolerant: 100 krad total ionization dose (TID), 50 krad enhanced low dose radiation sensitivity (ELDRS) and single event immune; Power drivers via external field-effect transistors (FETs); Loop control electronics for voltage or current control; Position read-back (resolver, potentiometer, limit switches, etc.); Highest integration solution; and a development board available to work with company's RTG4 FPGA Development Kit/ Microsemi's LX7720 radiation-tolerant motor controller is available for sampling now. Microsemi Aliso Viejo CA (949) 380-6100 www.microsemi.com

COTS

PRODUCT GALLERY Product Title: VPX6600 Single Board Computer • 6th Generation Intel Xeon: - Quad Core Xeon E3-1505M V5 (47W) • Up to -40 to 85°C extended operating range • Programmable CPU power for heat sensitive applications • Intel C230 series CM236 PCH chipset • Up to 32GB of high-speed DDR4 memory with SODIMM lock-down mechanism (permits user removal or upgrades) • Front panel I/O includes (air-cooled version): - dual USB 3.0 ports - mini-display port • Special I/O on P2 • Power-on self-test (POST) code LCD display

Acromag

Phone: (877) 295-7084 Email: solutions@acromag.com Web: www.acromag.com

3U OpenVPX ARM Cortex A9 SBC - 68ARM1 The 3U VPX ARM Cortex A9-based, Single Board Computer (SBC) can be configured with up to three intelligent function modules. Ideally suited for rugged defense, industrial, and commercial applications, the 68ARM1 delivers off-the-shelf solutions that accelerate deployment of SWaP-optimized systems.

• OpenVPX Profile: SLT3-PAY-4U2T-14.2.x • Data plane: 4 x1 PCIe • Control plane: 2x 10/100/1000Base-T, or 2x 1000Base–KX • ARM Cortex™-A9 Dual Core 800MHz Processor • 40+ modules to choose from • Wind River® VxWorks® and Xilinx® PetaLinux OS support • Continuous Background Built-in-Test (BIT) • COSATM Architecture Product link: www.naii.com/3U-OpenVPX-ARM-Cortex-A9-SBC/P307

North Atlantic Industries, Inc. Phone: (631) 567-1100 Web: www.naii.com

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COTS Journal | December 2016



COTS PRODUCTS

EPIC Form Factor Rugged SBC Serves Up Intel Atom E3800 CPU WinSystems has unveiled a series of shock- and vibration-tested single board computers featuring the Intel Atom E3800-Series CPU ( formerly known as Bay Trail-I). The EPX-C414 products support up to 8 Gbytes of RAM and legacy PC/104-Plus expansion while facilitating upgrades to newer technology. They are outfitted with eight onboard USB 2.0 ports, dual Gigabit Ethernet controllers, four serial COM ports and 48 GPIO, providing broad capability and impressive performance in a small package. The EPX-C414 series features the Intel Atom E3800 family of processors in an industry-standard EPIC form factor. The SBC EPX-C414 underpins quad-core, dual-core or single-core processors and up to 8 Gbytes of DDR3L SDRAM. The Intel Generation 7-based graphics engine supports up to two simultaneously active displays with interfaces available for analog VGA, Mini DisplayPort and LVDS connections For networking and communications, the EPX-C414 includes two Intel i210 Ethernet controllers with 10/100/1000 Mb/s multispeed operation. It provides eight USB 2.0 channels and four serial ports to support RS-232/422/485 interface levels. The series also features two MiniPCIe and PC/104-Plus connectors, enabling further I/O expansion. Both of the MiniPCIe connectors accommodate fulllength cards with screw-down mounting for improved shock and vibration durability. One MiniPCIe connector also supports bootable mSATA solid-state disks. The PC/104-Plus connector provides access to a full ecosystem of legacy off-the-shelf and custom-design I/O expansion modules, including data acquisition modules. Linux, Windows and other x86 operating systems can be booted from the CFast, mSATA, SATA or USB interfaces, offering flexibility in data storage. WinSystems, Arlington, TX (817) 274-7553. www.winsystems.com

Directional Patch Antennas Serve Body Worn Tactical Needs

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In house Assay Lab utilizing: l Fire Assay l Atomic Absorption l X-Ray Spectroscopy l Wet Chemistry

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COTS Journal | December 2016

RFMW has announced design and sales support for body worn antennas from Southwest Antennas. Model 1065031 is a right-hand, circularly polarized (RHCP) antenna while model 1065-032 offers left-hand polarization (LHCP). Developed to offer high performance, rugged antenna options, the antenna radome housing is resistant to damage from drops, being stepped or jumped on, and other potential abuse. Both 1065-031 and 1065-032 antennas are designed for use with handheld or body worn MIMO / MANET radio systems operating from 1350 to 1390MHz. Circular polarization offers performance enhancements in multi-antenna radio configurations, crowded RF / non line-of-sight scenarios, and improved performance in adverse weather conditions. RFMW San Jose, CA (408) 414-1450 www.rfmw.com


COTS PRODUCTS

Fanless Embedded Computers Support Three Independent HD Displays ADLINK Technology has announced its MXC-6400 Series of high-performance expandable fanless embedded computers, featuring 6th generation Intel Core i7-6820EQ/i5-6440EQ/ i3-6100E processors and the QM170 chipset. Along with leading performance, high storage density from 4x 2.5-inch SATA drives, and rugged fanless construction withstanding operating shock up to 50G and vibration to 5Grms, the MXC-6400 Series meets the needs of rugged applications. Up to three independent displays are supported, accelerated HW media codecs enable Ultra HD 4K, dualchannel DDR4 2133MHz SO-DIMM sockets accommodate up to 32 Gbytes of memory, and PCI and 2 PCIe Gen3 x8 (or 1 PCIe Gen3 x16) slots fully optimize expansion. The MXC-6400 Series is equipped with 4x 2.5-inch SATA III installation capability with RAID 0/1/5/10 support, via two hotswappable 2.5-inch SATA III trays and two internal 2.5-inch SATA III ports, and one CFast socket. Storage maintenance burdens are relieved, and massive, flexible storage capacity combines with built-in data security to better empower intelligent transportation systems and niche industrial automation (IA) markets. The MXC-6400 Series simplifies ownership tasks such as installation and maintenance with a front-mounted I/O array providing support for up to three independent displays via two DisplayPort and one DVI-I ports enabling up to 4K UHD resolution, two software-programmable RS-232/422/485 + two RS-232 ports, three GbE ports If you are ready for a more robust handle/panel solution, with teaming function, six USB 3.0 come to Pixus! Our OpenVPX handles feature a metal ports, and 16CH DI and 16CH DO. Fanless rugged construction withstands engagement claw and rugged design that ensures the up to 50G shock and 5Grms vibration highest reliability. Ask about our new rugged horizontal and operating temperatures of -20 to 70 extruded rails with thicker material for OpenVPX and high degrees C (with industrial SSD or CFast). insertion force systems today!

Are Your OpenVPX Handles Breaking?

Superior Rugged Metal Claw

ADLINK Technology San Jose, CA (408) 360-0200 www.adlinktech.com

sales@pixustechnologies.com pixustechnologies.com

COTS Journal | December 2016

39


COTS PRODUCTS

Test Platform Features PXI Express Marries and RF Test Capabilities Marvin Test Solutions has expanded the capabilities of its TS‐900 PXI semiconductor test platform with the addition of the TS‐960e system which offers PXI Express (PXIe) performance and expanded test capabilities for RF devices and SoC applications. The TS‐960e accommodates PXIe and PXI modules ‐ providing high‐ performance digital, mixed‐signal, and RF test capabilities in a compact, single chassis footprint. The TS‐960e platform combines 256, 125 MHz digital I/O channels with per‐pin‐PMU with multiple RF and analog test instruments in a single, 21‐slot PXIe chassis. Available as a bench top or with an integrated manipulator, the TS‐960e platform takes full advantage of the PXIe architecture to achieve a full‐featured test solution for digital, mixed–signal or RF test applications. The GX5296 delivers high‐performance digital test capabilities and is ideal for addressing verification, focused production, and failure analysis test needs ‐ or for replacing legacy test systems. The GX5296 builds on the successful GX5295 digital subsystem, offering unrivaled timing, edge‐placement, density, memory, and parametric measurement capabilities. The TS‐960e is available with Keysight Technologies’ comprehensive portfolio of PXIe RF instrumentation which can address a wide range of RF applications including WLAN, Bluetooth, Cellular, EW, and F transceivers. Available instrumentation options include Keysight Technologies’ vector transceiver, vector signal analyzers and generators, and vector network analyzer PXIe modules; offering wafer and packaged RF test capabilities from 9 KHz to 27 GHz. All of these modules as well Keysight’s VSA measurement application software are fully integrated with the TS‐960e’s system software, ATEasy. Marvin Test Solutions Irvine, CA (949) 263-2222 www.marvintest.com

SSD Family Offers eUSB 10-Pin Form Factor, 256 GB Capacities Virtium has introduced its TuffDrive eUSB 3.0 embedded storage modules. They are among the industry’s first eUSB 3.0 10-pin storage solutions for industrial and embedded applications, feature speeds of up to 4.8 Gbps—ten times the throughput of USB 2.0—and capacities from 2- to 256-Gbytes, while drawing less than 1W. At those capacities the storage modules are ideal for booting operating systems, logging video and data, and hosting storage-hungry applications. Furthermore, by drawing such little power, they can operate in the absence of cooling fans—or even airflow. The SSDs feature, industry-proven industrial connectors and mounting that assure durability in environments known for shock and vibration. The devices are available in Virtium’s CE (MLC), XE (iMLC) and PE (SLC) classes. SMART support provides the ability to monitor drives’ health using standard SMART commands. The also support Virtium’s vtView SSD Software, enabling drive analysis for optimal configuration. Optional security features include AES encryption and write protection, ensuring data is protected and secure from falling into the wrong hands. The units support industrial operating temperatures -40 to 85 degrees C. Prices for Virtium’s eUSB 3.0 TuffDrive embedded storage modules start at under $20 each. Virtium Rancho Santa Margarita, CA (949) 888.2444 www.virtium.com

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COTS Journal | December 2016


COTS PRODUCTS

6000W Power Converters Offer Protection Circuitry and High Efficiency

High Temperature Dual Op Amps Target Harsh Environments Designs

Schaefer has introduced the C/ B5600 Series of 6,000 Watt DC/ DC converter, AC/DC power supply and battery charging products. The C/B5600 Series offers a substantial lineup with over 150 standard models, with requests for modifications also available. Five standard DC input voltage options span a range from 80-800 VDC. AC input models offer 1-Phase or 3-Phase as well as battery charging models. Single output voltages encompass a range from 5-400 VDC. The C/B5600 Series DC/DC and AC/DC models have remote sense capability and features comprehensive protection circuitry and efficiencies are up to 95 percent. The units are packaged in a space saving 6U or 9U rack module or a wall mount module.

Datel introduced the AM-606HT series, a line of harsh environment amplifiers that are developed and manufactured using processes that originate with Datel's MILPRF-38534 standards and controls. These standards have been extended and increased to meet the demanding -55 to +200 degrees C operating temperature ranges. The AM-606HT has a gain bandwidth of 28MHz, a slew rate of 250V/µs and can settle to 0.01 percent in less than 180ns while delivering excellent dynamic performance for harsh environment systems. The DC performance of the AM-606HT includes less than 1.5mV of offset, a voltage noise density below 8nV/√Hz and a total supply current under 10mA.

Schaefer Hopkinton, MA (508) 436-6400 www.schaeferpower.com

Datel Mansfield, MA (508) 964-5397 www.datel.com

LCR Embedded System’s complete line of integrated rugged industrial and military systems, from off-the-shelf to fully customized, are ideal for all aspects of mission-critical computing. To learn more about what we can do for you and your application, contact us today. Our integrated systems feature VME, VPX, ATCA and CompactPCI architectures For chassis, backplanes and integrated systems, LCR Electronics is now LCR Embedded Systems.

(800) 747-5972 e-mail sales@lcrembedded.com www.lcrembeddedsystems.com

COTS Journal | December 2016

41


COTS

ADVERTISERS INDEX GET CONNECTED WITH INTELLIGENT SYSTEMS SOURCE AND PURCHASABLE SOLUTIONS NOW Intelligent Systems Source is a new resource that gives you the power to compare, review and even purchase embedded computing products intelligently. To help you research SBCs, SOMs, COMs, Systems, or I/O boards, the Intelligent Systems Source website provides products, articles, and whitepapers from industry leading manufacturers---and it's even connected to the top 5 distributors. Go to Intelligent Systems Source now so you can start to locate, compare, and purchase the correct product for your needs.

Index

intelligentsystemssource.com

Company Page# Website

Company Page# Website

Acromag...............................................2............................ www.acromag.com

Pentek.................................................51.............................. www.pentek.com

AIM......................................................14........................ www.aim-online.com

Phoenix International..........................24........................... www.phenxint.com

Elma Electronics.................................17................................. www.elma.com

Pico Electronics, Inc............................23................. www.picoelectronics.com

GAIA Converter Inc...............................5................... www.gaia-converter.com

Pixus Technologies..............................39.............www.pixustechnologies.com

HVF Precious Metals...............................38............... www.hvfpreciousmetals.com

Star Communications Inc....................34......................www.starcommva.com

Innovative Integration............................21.....................www.innovative-dsp.com

Sundance............................................25..........................www.sundance.com

Intelligent Systems Source....................37...... www.intelligentsystemssource.com

SynQor..................................................5................................www.synqor.com

LCR Embedded Systems Inc................41........ www.lcrembeddedsystems.com

Systel USA...........................................15.......................... www.systelusa.com

Mercury Systems, Inc. ........................52................................. www.mrcy.com

TE Connectivity...................................14......................................www.te.com

NovaSom Industries............................13........... www.novasomindustries.com

TQ-Systems.........................................43...............www.embeddedmodule.net

One Stop Systems, Inc. ......................4, 7....................... onestopsystems.com

COTS Gallery Ad..................................36.........................................................

COTS Journal (ISSN#1526-4653) is published monthly at 905 Calle Amanecer, Suite 150, San Clemente, CA 92673. Periodicals Class postage paid at San Clemente and additional mailing offices. POSTMASTER: Send address changes to COTS Journal, 905 Calle Amanecer, Ste. 150, San Clemente, CA 92673.

COMING NEXT MONTH Special Feature: Five Leading Processor Architectures for Military Systems

Military systems have an almost unquenchable thirst for greater integration, more autonomous operation, faster connectivity and increased computing muscle. Today’s highly integrated processors are critical enablers to achieve the compute-density needed in today’s advances military programs. This section picks out the five most popular chip architectures and explores their strengths along with their ecosystems of embedded form factors boards that embed these devices.

Tech Recon: Jeff’s Picks: Jeff Child’s Top Rugged Laptops and Tablets

In 2017 we continue our popular Tech Recon feature “Jeff’s Pick”. The section directly leverages Jeff’s decades of experience covering the embedded computing and defense market. He will choose the top products in a different category each month and share his insights on why they’re significant in terms of design innovation, market relevance and technology leadership. January’s section looks at rugged laptops and tablets designed for military users.

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COTS Journal | December 2016

System Development: Rackmount Solutions for the Navy / WEST 2017 Special Coverage

If your goal is packing in as much compute density into a system as possible, it’s hard to beat a rackmount blade-computer architecture. Naval platforms need such technology to increase their levels of automation aboard ships. This section explores that ways military programs are exploiting these technologies along with a look at what vendors are planning to showcase at AFCEA’s WEST 2017 show.

Data Sheet: Rugged Ethernet Switch Boards Roundup

Ethernet is becoming entrenched as favorite interconnect fabric in compute-intensive applications like sonar, radar or any application that networks sensor arrays together. This section updates readers on the product and technology trends driving board-level Ethernet switch products, and will include a product album of representative Ethernet switch board products in form factors such as VPX, VME, cPCI, MicroTCA and more.


Experience Real Design Freedom

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For more information call 508 209 0294 www.embeddedmodules.net


ANNUAL ARTICLE INDEX December 2015

January 2016

Data Sheet: XMC and FMC Boards Roundup January 2016, Volume 18 – Number 1 • cotsjournalonline.com

The Journal of Military Electronics & Computing JOURNAL

Airborne Platforms Embrace Open Architecture Standards

Airborne Platforms Embrace Open Architecture Standards

7

NEW! JEFF'S PICKS! JEFF'S TOP RACKMOUNT COMPUTER SYSTEMS

TECHNOLOGY

TRENDS FOR

DEFENSE

TOP

JOURNAL

The Journal of Military Electronics & Computing

HYBRID SMALL FORM FACTOR APPROACH ENABLES FLEXIBLE DESIGNS DATA SHEET: RUGGED ETHERNET SWITCH BOARDS

7 Top Technology Trends for Defense

COM Express and PC/104 Contend for Low SWaP Mindshare Hi-Def Video Management Solutions Climb in Sophistication An RTC Group Publication

December 2015 Volume 17 Number 12

cotsjournalonline.com

An RTC Group Publication

Editorial

Editorial

Special Feature

Special Feature

Tech Recon

I mmersive Training a Major Theme at I/ITSEC 2015.......................... 16 Michael Blades, Frost & Sullivan

Parallel Paths................................................................................................. 6 Open Architectures for Airborne Platforms Open Standards Ease Development of Airborne Platforms................ 10 Jeff Child Signal Chain: Video Distribution Technology Advances Video Management Technologies Deliver HD Solutions for Warfighters.......................................................................... 16 Jeff Child

System Development

COM Express vs. PC/104 Form Factors COM Express and PC/104 Vie for Small Form Factor Dominance........................................................................... 20 Jeff Child

Data Sheet

XMC and FMC Boards XMCs and FMCs Help Shake Up the Definition of “System”............. 24 Jeff Child XMC and FMC Boards Roundup............................................................ 26

Technology Transition Gap......................................................................... 6 Target Report: Top Seven Technology Trends for Defense Seven Technology Trends Driving Military Design Choices............... 10 Jeff Child

Embedded Network Security Shifts from Software to Hardware....... 18 Ryan Kenny, Altera, now part of Intel

Jeff’s Picks

Jeff Child’s Top Rackmount Technologies 2U Rackmount System Integrates Functionality of Four or More Servers............................................................................ 22 Jeff Child

System Development

OpenVPX Versus Hybrid Small Form Factor Strategies Hybrid Open Standard Approach Provides Alternative to VPX......... 26 Mike Southworth, Curtiss Wright Defense Solutions

Data Sheet

Rugged Ethernet Switch Boards Roundup Board-Level Ethernet Switches Connect with Military Needs............ 30 Jeff Child Rugged Ethernet Switch Boards Roundup............................................. 31

44

COTS Journal | December 2016


ANNUAL ARTICLE INDEX February 2016

March 2016

February 2016, Volume 18 – Number 2 • cotsjournalonline.com

March 2016, Volume 18 – Number 3 • cotsjournalonline.com

The Journal of Military Electronics & Computing

The Journal of Military Electronics & Computing

JOURNAL

JOURNAL

Military Batteries and Power Supplies Defy Density Limits

Military Batteries and Power Supplies Defy Density Limits

VME and CompactPCI Propel Tech Upgrades

VME and CompactPCI Propel Tech Upgrades JEFF'S PICKS! EXCLUSIVE: Q&A ON SECURITY WITH MICROSEMI EXECS 17TH ANNUAL OBSOLESCENCE SERVICES DIRECTORY DATA SHEET: FPGA PROCESSING BOARDS

NEW! JEFF'S PICKS! JEFF'S TOP VIDEO CAPTURE SYSTEMS CLOUD COMPUTING TECHNOLOGIES MUSTER FOR DEFENSE DUTIES DATA SHEET: CompactPCI AND CompactPCI SERIAL BOARDS An RTC Group Publication

An RTC Group Publication

Editorial

Editorial

Special Feature

Special Feature

Small Batteries Enable Space-Constrained Military Devices............... 16 Sol Jacobs, Tadiran Batteries

Power Supply Loading Requirements Involve Tricky Hurdles............ 16 Stephan Westdal, Rantec Power Systems

Jeff’s Picks

Jeff’s Picks

System Development

System Development

DoD 2017 Budget Proposal is Here........................................................... 6 Power Supplies and Military Batteries Target System Needs Mil Batteries and Power Supplies Expand Options and Capabilities........................................................................... 10 Jeff Child

Jeff Child’s Top Video Capture Solutions System Marries HD Video Capture and Recording with Metadata Support........................................................... 20 Jeff Child Rugged Cloud Computing for the Military Rugged Cloud Computing Adapts to Unique Defense Needs............. 26 Jeff Child

Data Sheet

CompactPCI and CompactPCI Serial Board Roundup CompactPCI Continues to Hold Its Own as Military Solution.......... 28 Jeff Child CompactPCI and CompactPCI Serial Board Roundup....................... 29

Space Battles.................................................................................................. 6 Tech Upgrades with VME, CompactPCI and More VME and CompactPCI Deal Winning Hands for Upgrade Programs............................................................................... 10 Jeff Child

Jeff Child’s Top Anti-tamper Tactics for Electronics Experts Discuss Today’s Challenges in Security and Anti-Tamper........................................................................ 20 Jeff Child Annual Obsolescence Services Directory Engineering and Government Groups Ease the Sting of DMSMS Issues.............................................................. 24 Jeff Child

Data Sheet

FPGA Processing boards Roundup FPGA Boards Leverage Advances in FPGA Speeds and Densities..................................................................... 28 Jeff Child FPGA Processing boards Roundup......................................................... 29

COTS Journal | December 2016

45


ANNUAL ARTICLE INDEX April 2016

May 2016

April 2016, Volume 18 – Number 4 • cotsjournalonline.com

JOURNAL

May 2016, Volume 18 – Number 5 • cotsjournalonline.com

The Journal of Military Electronics & Computing

The Journal of Military Electronics & Computing JOURNAL

Rugged Systems Evolve to Meet UAV SWaP Needs

Rugged Systems Evolve to Meet UAV SWaP Needs

Box-Level Solutions Enable Vehicle Networking

Box-Level Solutions Enable Vehicle Networking

JEFF'S PICKS: TOP FPGA-BASED DIGITAL CONVERSION SOLUTIONS DOD BUDGET REPORT: MAJOR WEAPONS PROGRAMS

JEFF'S PICKS! TOP RUGGED DISPLAYS TACTICAL RADIOS LEVERAGE SYNTHETIC INSTRUMENTATION

DATA SHEET: VME SBCs FOR TECH REFRESH

DATA SHEET: SMALL FORM FACTOR BOARDS An RTC Group Publication

An RTC Group Publication

Editorial

Editorial

Special Feature

Special Feature

VPX Provides a Balance of Attributes That Keeps UAVs on Mission............................................................................ 14 Matthew R. McAlonis, TE Connectivity

Technology Shifts Drive Vehicle Mounted Computing Choices......... 16 John McKown, Octagon Systems

All Eyes on the F-35..................................................................................... 6 Rugged Box Systems Target UAV Payload Needs UAV Designs Up Their Reliance on Box-Level Systems...................... 10 Jeff Child

UAV Data Imaging Solutions Push Limits of Embedded Technologies........................................................................... 18 David Lippincott, Chassis Plans

Jeff’s Picks

Jeff Child’s Top FPGA-Based Digital Conversion Solutions XMC Board Uses FPGA and ADCs for Comprehensive GSM Monitoring........................................................... 22 Jeff Child

System Development

DoD Budget Report: Major Weapons Programs Major Programs Budget Modernizes Across Land, Sea and Air........ 26 Jeff Child

Data Sheet

VME SBCs for Tech Refresh Roundup VME SBCs Refresh Legacy Systems with New Tech............................ 30 Jeff Child VME SBCs for Tech Refresh Roundup................................................... 31

46

COTS Journal | December 2016

Ship Shaping the Future.............................................................................. 6 Military Vehicles Embrace Mobile Networking Rugged Box Systems Enable Vehicle Mobile Networking.................... 10 Jeff Child

Jeff’s Picks

Jeff Child’s Top Rugged Display Solutions Display System Blends Zero Client Virtualization and Power-over-Ethernet.......................................................................... 20 Jeff Child

System Development

Test and Instrumentation for Defense Synthetic Instrumentation Aids Tactical Radio Testing – Part I......... 24 Ian Williams, Michael S. Caulfield, Steve Fairbanks, Astronics Test Systems

Data Sheet

Small Form Factor Boards Roundup Mini-ITX and Others Lead Small-Sized Board Advances................... 28 Jeff Child Small Form Factor Boards Roundup....................................................... 29


ANNUAL ARTICLE INDEX June 2016

July 2016

June 2016, Volume 18 – Number 6 • cotsjournalonline.com

July 2016, Volume 18 – Number 7 • cotsjournalonline.com

The Journal of Military Electronics & Computing

The Journal of Military Electronics & Computing

JOURNAL

JOURNAL

1553 & Ethernet Team to Meet Avionics Needs

1553 & Ethernet Team to Meet Avionics Needs

JEFF'S PICKS: JEFF'S TOP POWER CONVERSION SOLUTIONS OPEN STANDARDS STREAMLINE AIRBORNE DESIGNS DATA SHEET: PC/104 and PC/104 FAMILY BOARDS

HPEC Systems Propel Ahead of Ordinary Embedded Solutions

HPEC Systems Propel Ahead of Ordinary Embedded Solutions

JEFF'S PICKS! JEFF'S TOP SPACE-QUALIFIED ELECTRONICS MISRA C COMPLIANCE AIDS SECURITY/ SAFETY SOFTWARE DATA SHEET: OPENVPX SBCs

An RTC Group Publication

An RTC Group Publication

Editorial

Editorial

Special Feature

Special Feature

Internet of Military Things......................................................................... 6 Connecting the Dots with 1553, Ethernet and More Divergent Advantages of 1553 and Etherent form Fruitful Marriage.............................................................................. 10 Jeff Child Synthetic Instrumentation Aids Tactical Radio Testing – Part II....... 16 Ian Williams, Michael S. Caulfield, Steve Fairbanks, Astronics Test Systems

Jeff’s Picks

Jeff Child’s Top Power Conversion Solutions Digitally Controlled Power Factor Correction Solution Meets Radar Needs..................................................................... 20 Jeff Child

System Development

Open Standards for Airborne Systems Airborne Platforms Embrace Open Standards...................................... 24 Jeff Child

Data Sheet

PC/104 and PC/104 Family Boards Roundup PC/104 Keeps Space-Constrained Systems on Course......................... 28 Jeff Child PC/104 and PC/104 Family Boards Roundup....................................... 29

Look to the East............................................................................................ 6 HPEC Systems Leverage Data Center Computing System and Software Technologies Lead HPEC Charge...................... 10 Jeff Child Applying HPEC and Deep Learning Tech to Defense Systems........... 16 Mark Littlefield, Dr. Mohamed Bergach, Kontron

Jeff’s Picks

Jeff Child’s Top MIcroTCA and ATCA Products AMC Module Does 56 GSPS A/D Conversion and FPGA-Based Signal Analysis............................................................ 20 Jeff Child

System Development

Safety Critical and Mission-Critical Software Security/Safety Analysis Tools Smooth Path to MISRA-C Compliance.......................................................................... 24 Jay Thomas, Chris Tapp, LDRA

Data Sheet

OpenVPX SBCs Roundup OpenVPX Community Churns Out Standards and Solutions............ 30 Jeff Child OpenVPX SBC’s Roundup........................................................................ 31

COTS Journal | December 2016

47


ANNUAL ARTICLE INDEX August 2016

September 2016

August 2016, Volume 18 – Number 8 • cotsjournalonline.com

September 2016, Volume 18 – Number 9 • cotsjournalonline.com

The Journal of Military Electronics & Computing

The Journal of Military Electronics & Computing

JOURNAL

JOURNAL

Bonds Between Develop and Deploy Phases Get Stronger JEFF'S PICKS: JEFF'S TOP SPACE-QUALIFIED ELECTRONICS PCI EXPRESS PAVES NEW PATH FOR SOLID STATE DRIVES DATA SHEET: COM EXPRESS BOARDS

Bonds Between Develop and Deploy Phases Get Stronger

Military Systems Embrace Advanced Cooling Options

Military Systems Embrace Advanced Cooling Options

FEATURED: INTEL DEVELOPER FORUM (IDF) UPDATE/REVIEW SHIPBOARD SYSTEMS EYE NEW CONNECTIVITY SCHEMES DATA SHEET: RACKMOUNT SYSTEMS An RTC Group Publication

An RTC Group Publication

Editorial

Editorial

Special Feature

Special Feature

Jeff’s Picks

Optimizing Thermal Controls in Pre-Validated Systems..................... 16 Simon Parrett, Kontron

Talking Space................................................................................................ 6 Linking Development - to Deployed - Systems Barriers Fall Between Development and Deployed Systems............... 10 Jeff Child Jeff Child’s Top Space-Qualified Electronic Solutions 3.3V Rad Tolerant MIL-STD-1553 Terminals are Fully Integrated.................................................................................... 16 Jeff Child Space Poses Unique Challenges for Commercial Components.......... 20 Doug Patterson, Aitech Defense Systems

System Development

Rugged Storage: From RAID to SSD High Capacity Storage Systems Look to PCI Express........................... 24 Steve Gudknecht, Elma Electronic

Data Sheet

COM Express Boards Roundup COM Express a Win for Compact and Mobile Applications.............. 28 Jeff Child COM Express Boards Roundup............................................................... 29

To Tame the Drone Frontier....................................................................... 6 Cooling Options for Rugged Box Systems Solutions and Standards Advance for Box-Level Cooling................... 10 Jeff Child

Tech Recon

Update/Review from Intel Developer Forum 2016 Post-PC Tech Rules at Intel Developer Forum 2016............................. 20 John Koon

System Development

Open Standards for Navy Modernization Cable Technology Advances Meet Shipboard Network Needs............ 24 Robert Moore, TE Connectivity 3G-SDI’s Many Advantages Serve Defense Video/Display Needs...... 30 John Payne and Chris Fadeley, EIZO Rugged Solutions

Data Sheet

Rackmount Systems Roundup Rackmount Systems Move Toward Converged Solutions.................... 34 Jeff Child Rackmount Systems Roundup................................................................. 35

48

COTS Journal | December 2016


ANNUAL ARTICLE INDEX October 2016

November 2016

October 2016, Volume 18 – Number 10 • cotsjournalonline.com

November 2016, Volume 18 – Number 11 • cotsjournalonline.com

The Journal of Military Electronics & Computing JOURNAL

The Journal of Military Electronics & Computing

Military Comms Wrestles with Scalability Challenges

Military Comms Wrestles with Scalability Challenges

JOURNAL

SFF Solutions Reach New Compute-Density Levels

SFF Solutions Reach New Compute-Density Levels

THREE STEP APPROACH TO AVIONICS SYSTEM DEVELOPMENT EXCLUSIVE Q&A: WHEN RF AND DIGITAL-WORLDS COLLIDE DATA SHEET: HI REL POWER SUPPLIES

JEFF'S PICKS JEFF'S TOP VIDEO DISPLAY SYSTEMS EXCLUSIVE Q&A: IoT AND MILITARY DIGITAL TRANSFORMATION DATA SHEET: RUGGED BOX SYSTEMS An RTC Group Publication

An RTC Group Publication

Editorial

Editorial

Special Feature

Special Feature

AUSA and a Multi-domain Future............................................................ 6 Scaling Up Military Comms and Networking Systems Network and Comms Advances Serve a Connected Military............. 10 Jeff Child

Spectrum Access Reimagined.................................................................... 6 Advances in Small Form Factor Box Systems SFF Boxes Beef Up Their Processing and Functionality...................... 10 Jeff Child

Internet Transport Protocols Contend for Military Interconnect Role........................................................................ 16 Shepard Siegel, Atomic Rules

Tradeoffs Drive Distributed vs. Consolidated Architecture Choice................................................................................... 16 Mike Southworth, Curtiss-Wright Defense Solutions

10/40 Gbit Ethernet Switching Poses Unique Board Design Hurdles............................................................................... 20 Thierry Wastiaux, Interface Concept

Leveraging MIL-STD-810 Takes More Than Meets the Eye............... 20 David Lippincott, Chassis Plans

Tech Recon

Jeff Child’s Top Video Display Systems Display Console System Meets Shipboard/Shore Needs...................... 16 Jeff Child

Avionics System Development Strategies Three Stage Process Speeds Path to Avionics System Deployment................................................................................... 24 Wayne McGee, CES--North America

System Development

Integrating RF Electronics and Computing EXCLUSIVE: Expert Weighs in on RF/Digital Integration Challenges............................................................................... 28 Ken Karnofsky, Mathworks

Data Sheet

High Rel Power Supplies Roundup High Reliability Power Supplies Boast Rich Power Supplies Bulk up for High Reliability Work............................... 30 Jeff Child

Tech Recon

System Development

Leveraging IoT Strategies for Defense Needs EXCLUSIVE: Expert Shares Insights on Digital Transformation in the IoT Age........................................................... 28 Nick Michaelides, Cisco Systems

Data Sheet

Rugged Box Systems Roundup Box-Level Rugged Systems Feed Tech Readiness Needs...................... 32 Jeff Child Rugged Box Systems Roundup................................................................. 34

High Rel Power Supplies Roundup.......................................................... 31

COTS Journal | December 2016

49


COTS Journal’s

MARCHING TO THE NUMBERS

15,000 TONS

Tonnage displacement of the two first ships of the U.S. Navy’s new Zumwalt-class of surface combatants. BAE Systems has received an indefinite delivery / indefinite quantity contract from the Navy for post-construction work aboard the guided missile destroyers USS Zumwalt (DDG 1000) and USS Michael Monsoor (DDG 1001). The ships are 610 feet long and are comprised of steel hulls and composite structure deckhouses. The Zumwalt was commissioned in Baltimore last month and now is enroute to its homeport in San Diego. The Michael Monsoor is currently under construction in Bath, Maine.

1,910 The number units covered by Rockwell Collins’ recently won follow-on service and support contract for its Common Avionics Architecture System (CAAS) on the U.S. Army’s CH-47F helicopter fleet. The contract covers up to that many units by 2021. Originally fielded on the CH-47F aircraft in 2007, Rockwell Collins’ CAAS integrates multiple communications, navigation and mission subsystems through its flexible Flight2 system. The CAAS solution uses common, reusable processing elements in each piece of hardware and incorporates an open systems architecture based on commercial standards.

103 MILLION

$

Approximate maximum value over five years of an Indefinite Delivery/Indefinite Quantity (“ID/IQ”) contract awarded to Elbit Systems of America for the production of 60mm, 81mm, and 120mm Mortar Weapon Systems, which include the following items: M224 60mm Legacy Mortar Weapon System; M252 81mm Legacy Mortar Weapon System; M224A1 60mm Lightweight (LW) Mortar Weapon System; the M252A1 81mm LW Mortar Weapon System; the M121 120mm Carrier Mounted Mortar Weapon System, and the M120A1 120mm Towed Mortar Weapon System which includes the M326 120mm Mortar Stowage Kit. 50

COTS Journal | December 2016

200

Number of successful roll-in test arrestments that General Atomics Electromagnetic Systems’ (GA-EMS) Advanced Arresting Gear (AAG) completed successfully since March. The company announced successfully completing its first flyin aircraft recovery of an F/A-18E Super Hornet on October 13, 2016 at the Runway Arrested Landing Site (RALS) at Joint base McGuire-DixLakehurst in New Jersey. AAG is a turbo-electric system designed for controlled and reliable deceleration of aircraft recovery operations on carriers. AAG is installed on-board Pre-Commissioning Unit Gerald R. Ford CVN 78.

144

The number of four-seat diesel MRZR vehicles ordered by the United States Marine Corps from Polaris Defense as part of the utility task vehicle (UTV) program, which will provide MRZR-D4s to each of the Marine Corps’ active-component infantry regiments. The contract also includes spare parts blocks in support of the vehicles. The UTV program is designed to provide company-level operations with logistics support, filling a critical capability gap at the tactical level. The MRZR-D4 delivers a proven solution that is cost-effective, reliable, easily maintained, and certified for internal transport in MV-22 and CH-53 aircraft.


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