PC/104 and Small Form Factors Spring 2015 Resource Guide

BIG on Performance Small on Size

PC/104 and Small Form Factors Editorial/Production Staff John McHale, Group Editorial Director jmchale@opensystemsmedia.com Lisa Daigle, Assistant Managing Editor ldaigle@opensystemsmedia.com

Steph Sweet, Creative Director ssweet@opensystemsmedia.com

Sales Group

Small form factor SBCs with conduction cooling and data acquisition for rugged environments

ARIES E3800 / Bay Trail CPU

1.91GHz quad core & 1.46GHz dual core processors 2 or 4 GB memory down 2 Gigabit Ethernet !! NEW 3 USB 2.0 & 1 USB 3.0 4 RS-232/422/485 Industry leading data acquisition: 16 16-bit A/D 4 16-bit D/A 22 digital I/O PCIe Minicard and SATA DOM PC/104 & PC/104-Plus expansion -40°C to +85°C 4.0" x 4.5" PC/104-compatible form factor

♦ ♦ ♦ ♦ ♦ ♦

♦ ♦ ♦ ♦

ATLAS N2800 CPU

1.86GHz quad core processor 2 or 4GB memory down 1 Gigabit Ethernet 4 USB 2.0 6 RS-232/422/485 PCIe MiniCard socket PCI-104 & PCIe/104 expansion -40°C to +75°C 4.5" x 3.8" PCIe/104 form factor

♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦

VEGA Core i7 COM Express

COM-based SBC for long lifecycle Quad/Dual core COM Express CPU: 2.1GHz Intel Core i7-3612QE 1.7GHz Intel Core i7-3517UE 2 Gigabit Ethernet 4 USB 2.0 4 RS-232/422/485 Industry leading data acquisition: 16 16-bit A/D, 8 16-bit D/A 30 digital I/O PCIe Minicard and EMX expansion 7 to 36V DC/DC power supply -40°C to +85°C emxbus.org 4.9" x 3.7" EMX form factor

♦ ♦

♦ ♦ ♦ ♦

♦ ♦ ♦ ♦

The Perfect Fit for Imperfect Environments

800-36-PC104 (800-367-2104) • sales@diamondsystems.com diamondsystems.com

2 y

Tom Varcie, Sales Manager tvarcie@opensystemsmedia.com (586) 415-6500 Rebecca Barker Strategic Account Manager rbarker@opensystemsmedia.com (281) 724-8021 Eric Henry, Strategic Account Manager ehenry@opensystemsmedia.com (541) 760-5361 Kathleen Wackowski, Strategic Account Manager kwackowski@opensystemsmedia.com (978) 888-7367 Asia-Pacific Sales Elvi Lee, Account Manager elvi@aceforum.com.tw

Regional Sales Managers Barbara Quinlan, Southwest bquinlan@opensystemsmedia.com (480) 236-8818 Denis Seger, Southern California dseger@opensystemsmedia.com (760) 518-5222 Sydele Starr, Northern California sstarr@opensystemsmedia.com (775) 299-4148 Europe Sales James Rhoades-Brown james.rhoadesbrown@husonmedia.com

Reprints and PDFs republish@opensystemsmedia.com

OpenSystems Media Editorial/Creative Staff John McHale Group Editorial Director Military Embedded Systems PC/104 and Small Form Factors PICMG Systems & Technology VITA Technologies Lisa Daigle Assistant Managing Editor Military Embedded Systems PC/104 and Small Form Factors Jerry Gipper, Editorial Director VITA Technologies jgipper@opensystemsmedia.com Curt Schwaderer, Editorial Director Embedded Computing Design cschwaderer@opensystemsmedia.com Joe Pavlat, Editorial Director PICMG Systems & Technology jpavlat@opensystemsmedia.com Jennifer Hesse, Managing Editor VITA Technologies Sally Cole, Senior Editor Military Embedded Systems Joy Gilmore, E-cast Manager jgilmore@opensystemsmedia.com

Corporate Patrick Hopper, Publisher phopper@opensystemsmedia.com Rosemary Kristoff, President rkristoff@opensystemsmedia.com John McHale, Executive Vice President jmchale@opensystemsmedia.com Rich Nass, Executive Vice President rnass@opensystemsmedia.com Wayne Kristoff, CTO

Subscriptions

Rich Nass Embedded Computing Brand Director Embedded Computing Design rnass@opensystemsmedia.com Monique DeVoe Managing Editor Embedded Computing Design mdevoe@opensystemsmedia.com Brandon Lewis Assistant Managing Editor PICMG Systems & Technology Embedded Computing Design Industrial Embedded Systems blewis@opensystemsmedia.com Mariana Iriarte, Assistant Editor Military Embedded Systems miriarte@opensystemsmedia.com Rory Dear, Technical Contributor Embedded Computing Design rdear@opensystemsmedia.com Konrad Witte, Senior Web Developer Steph Sweet, Creative Director David Diomede, Creative Services Director Joann Toth, Senior Designer

www.opensystemsmedia.com Emily Verhoeks, Financial Assistant Headquarters – ARIZONA: 16626 E. Avenue of the Fountains, Ste. 201 Fountain Hills, AZ 85268 Tel: (480) 967-5581 MICHIGAN: 30233 Jefferson St. Clair Shores, MI 48082 Tel: (586) 415-6500

www.opensystemsmedia.com/subscriptions

subscriptions@opensystemsmedia.com

Spring 2015 | PC/104 and Small Form Factors Resource Guide

www.smallformfactors.com

www.smallformfactors.com

small MATTERS By Jeff Milde

PC/104 Consortium introduces OneBank option for the PCI/104-Express & PCIe/104 specification The PC/104 Consortium has announced the latest revision of the PCI/104-Express & PCIe/104 Specification, Revision 3.0, that provides an additional option called “OneBank.” The PCIe/104 OneBank utilizes a smaller, lower-cost bus connector which is compatible to the full-size PCIe/104 connector currently in use today. It allows designers to stack boards using a complimentary format that frees up PCB real estate for additional components as well as potential cost savings. The history of the stackable PC/104 architecture is tightly coupled to the concept of building on the foundation of the PC market, as defined by the major processor and peripheral chip manufacturers. This began with the ISA bus (PC/104), then the ISA and PCI buses together (PC/104-Plus), then the PCI bus only (PCI/104), and then the PCI and PCI Express buses together (PCI/104-Express). For additional room on a module, the PCIe/104 format removes the PCI bus. This roadmap allows maximum use and leveraging of the resources and economies of scale of the PC community in both hardware and software development. It also allows maximum backward compatibility with minimal stacking overhead, if any, and allows future bus advancements as technologies develop and mature. The origin of the OneBank option to the stackable PCIe/104 bus comes from the desire to minimize the resources needed for a given application. The standard PCIe/104 bus allows for maximum bus feature flexibility. It consists of a three-bank connector with 152 pins and is available as either Type 1 or Type 2. Both Type 1 and Type 2 have a common feature set and pin assignments, which include four x1 PCI Express links, two USB 2.0, ATX power and control signals: +5V standby, power supply on, power good, power: +3.3V, +5V, +12V, and SMBus. Type 1 has the common feature set plus one x16 PCI Express Link that can be configured as two x8 Links or two x4 PCI Express Links, dependent on the host. Type 2 has the common feature set plus two x4 PCI Express Links, two USB 3.0, two SATA, LPC bus, and RTC battery. With speed capability up to PCIe Gen 3, developers are given plenty of bandwidth for the future. The OneBank connector concept consists of removing two of the three “banks” of the standard PCIe/104 connector, resulting in a 52-pin connector as opposed to the full-size 156-pin connector. The OneBank connector is positioned so that it will plug into Bank 1 of the standard PCIe/104 connector. Thus, the www.smallformfactors.com

“The OneBank connector concept consists of removing two of the three ‘banks’ of the standard PCI/e connector, resulting in a 52-pin connector as opposed to the full-size 156-pin connector.” signals of the OneBank include the same four x1 PCI Express links, two USB 2.0, ATX power and control signals: +5V standby, power supply on, power good, power: +3.3V, +5V (reduced current) as found on the first bank of the standard PCIe/104 bus, making them plug-in compatible. This setup preserves the stackability and compatibility of PCI/104-Express and PCIe/104 modules along with the new OneBank modules. By removing two of the banks, 0.513 square inches of printed circuit board real estate on each side is freed up. With speed scales up to PCIe Gen 3 on the PCIe/104 bus, developers are given plenty of bandwidth for the future even with just four x1 PCIe links. As with all of the stackable buses adopted by the PC/104 Consortium, the PCIe/104 OneBank connector can be immediately incorporated across the Consortium’s 104, EPIC, and EBX form factors. It can also be utilized on other form factors not housed by the Consortium to provide convenient, cost effective mezzanine I/O expansion. For more information about the PCI/104 Express & PCIe/104 specification, the newest OneBank option, and how it is incorporated onto the 104, EPIC, and EBX form factors (and to download a free copy of the specification), go to www.pc/104.org. The stable, long-term supply of PC/104 is valued by thousands of OEMs in application areas such as industrial control and instrumentation, military and aerospace, and medical. The compatibility of OneBank with existing PCIe/104 products helps to preserve customers’ investments in product designs while opening additional opportunities for cost savings, high levels of integration, and system expandability. Jeff Milde is the Executive Director of the PC/104 Consortium. www.pc104.org • info@pc104.org PC/104 and Small Form Factors Resource Guide | Spring 2015

y 3

w w w. s m a l l f o r m f a c t o r s .c o m w w w. p c10 4 o n l i n e.c o m

ON THE COVER: The 432nd Maintenance Group ensures that airmen, remotely piloted aircraft like the MQ-1 Predator and MQ-9 Reaper, ground-control stations, Predator Primary Satellite Links, and a globally integrated communications network are fully capable of supporting air crew training, combat operations, operational test and evaluation, and natural-disaster support. (U.S. Air Force photo/Senior Master Sgt. C.R.)

Volume 19 • Number 1

Columns

Features

12

SBCs:

PC/104 for Unmanned Systems

Small Matters

8

Small form factor and ultra-small form factor mission computer/network solutions meet expanding UAV requirements

PC/104 Consortium introduces OneBank option for the PCI/104-Express & PCIe/104 specification By Jeff Milde, Executive Director of the PC/104 Consortium

SFF-SIG

SoCs power legacy I/O

PC/104 Consortium

Rugged packaging and the PC/104 architecture

Rugged Packaging

12

Rugged development requires integration of design and test from start to finish

SoCs

16

16

Flexible military radios balance SWaP, cost specs

6

By Dr. Paul Haris, PC/104 Consortium Chairman and President

Resource Guide PROFILE INDEX

By Jeff Munch, ADLINK Technology, Inc.

PROCESSOR ARCHITECTURE:

5

By Alexander Lochinger, SFF-SIG President

By Mike Southworth, Curtiss-Wright Defense Solutions

COMs and SOMs:

3

20

COMs and SOMs

20

Hardware and Peripherals

22

SBCs and Boards

27

Systems

33

Events Embedded TechCon June 8-10 • San Francisco, CA www.embeddedtechcon.com

By Paul Dillien, Lime Microsystems

Advertiser Index

9

ACCES I/O Products, Inc. – USB embedded I/O solutions. Rugged, industrial strength USB.

19

Computex – Taipei – Trade Show

2

Diamond Systems Corporation – BIG on performance, small on size.

13

Elma Electronic – Reduce, save, improve. Elma’s rugged platforms do all that--and more.

Published by: 2015 OpenSystems Media® © 2015 PC/104 and Small Form Factors All registered brands and trademarks used in PC/104 and Small Form Factors are property of their respective owners. ISSN: Print 1096-9764, ISSN Online 1550-0373

4 y

Spring 2015 | PC/104 and Small Form Factors Resource Guide

7

Excalibur Systems, Inc. – mil-1553.com/1553couplers.com

11

UBM Electronics – ESC Embedded Systems Conference 2015 – Boston

36

WinSystems, Inc. – Accelerate your product development cycle.

PC/104 and Small Form Factors www.linkedin.com/groups?gid=1854269 @sff_mag www.smallformfactors.com

Small Form Factor

www.sff-sig.org

SIG

By Alexander Lochinger, SFF-SIG President

SoCs power legacy I/O One of the largest input/output (I/O) board ecosystems in the small form factor (SFF) marketplace uses a boardstacking architecture. Unlike I/O cards that are plugged independently into different slots of a motherboard, stackable I/O boards are mounted one on top of another like a stack of pancakes, except that the middle boards cannot be removed without first unplugging all the boards below or above them. In terms of production quantities, the majority of such stackable I/O modules still use parallel PCI or ISA bus interfaces and are designed into rugged and demanding applications that don’t need to migrate quickly to new architectures. Besides, the I/O chips and components themselves are rarely affected by obsolescence. Most of the processors and chip sets that used to directly drive those parallel PCI and ISA buses were on an obsolescence cycle of every five years. In this new era of powerful all-in-one systems-on-chip (SoCs), however, the good news is that processor chip life cycles have stretched out to seven years for Intel and 10 years for AMD. The “other” news is that the PCI and ISA buses are not available in those SoCs. Their primary markets – such as high-volume tablet and modular PC markets and in-vehicle “infotainment” – simply don’t need the legacy buses and I/O. Long live legacy Hope arrives in several forms. Still available at the entry level is a low-cost, legacyfriendly SoC from DM&P Electronics called the Vortex86DX. The processor performance is modest, as the whole point is to meet the legacy application software and I/O where they are. SFF processor modules are available from multiple suppliers with stacking PCI and ISA buses. Legacy I/O also includes universal asynchronous receiver/transmitter (UART) serial www.smallformfactors.com

ports, which are still essential in many embedded systems, and are included in the Vortex86 SoC. Also legacy-friendly and still available is the AMD Geode LX800 processor. The built-in PCI interface only needs the external ISA bridge chip to produce both of the stacking legacy buses. Like the Vortex86 based boards, the Geode-based boards are available from many suppliers. Boosting performance Some embedded applications, however, need to move up substantially in processor or graphics performance or both, while keeping the legacy buses and I/O. While the new Intel Atom E38xx, Intel Celeron J1900/N2930, and AMD GX-2xx & GX-4xx SoCs fit the performance bill, the processor module designs need to add back in the serial ports and bus bridges that were eliminated from the SoCs. Plenty of PCI and LPC bus chips are available for the task. Some legacy features like I/O space, memory hole, and interrupt requests are limited, so be sure to dig into these details before porting over legacy code. If there are no legacy code “gotchas,” the huge jump in performance to quadcore 1.2 GHz with great graphics, or to 2.0 GHz with good graphics, can provide a needed facelift for old systems. Part of this stems from the ability to run modern GUIs and OSs that require substantial compute and memory resources, from the various embedded Windows platforms to Linux and Android. Certain legacy applications may benefit from 64-bit register size for data handling or overall physical memory address space. Upgrade the CPU, but don’t forget power Now that several vendors are featuring the latest Atom processor family on their

Figure 1 | WinSystems’ PCMPS394-500 complements the latest SoC-based processor modules.

boards with stacking PCI and ISA expansion and serial ports, the old stacks can be upgraded. Simply unplug the obsolete processor module and replace it with one of these new ones. The good news doesn’t end there: The low-power, high-performance SoCs deserve the latest switching power-supply technologies to finally replace some of the ancient designs that have been on the market for decades. (See example in Figure 1.) Efficient power-supply design for embedded is a topic for another column, though. Here we are in 2015, still talking about the usefulness of stackable processor boards with ISA bus expansion. The bottom line is the staying power of the installed base of I/O cards, more than that of the CPU cards. The biggest surprise of all is the continued availability and even brand-new introductions of x86 SoCs on SFF boards that bring out PCI and ISA interfaces. While these boards provide the legacy signaling that the I/O cards need, don’t forget to update the power supply card while you’re at it. Small Form Factor Special Interest Group 408-480-7900 • info@sff-sig.org

PC/104 and Small Form Factors Resource Guide | Spring 2015

y 5

www.pc104.org

PC/104

Consortium

By Dr. Paul Haris, PC/104 Consortium Chairman and President

Rugged packaging and the PC/104 architecture The concept of “ruggedized systems” is all in the eye of the beholder: Ruggedizing can take many forms and mean many different things, depending on the application and the operating environment. In one application, rugged might mean splashproof, while in another application, rugged could mean waterproof to 100 meters. Some people may think that zero degrees Celsius is a hostile environment, where others may think that zero is normal and -40 is hostile. When it comes to shock and vibration, one designer or user may feel that a piece of equipment on a truck is in a hostile environment, where others may feel like the truck-mounted equipment is riding on pillows. Their definition of “hostile” may include how to withstand being mounted on a turret or how to handle rocket-engine heat and vibration. No matter the application or the definition, finding a packaging solution for computers and control systems can be a daunting task, as other factors such as cost, availability, sole source versus open source, and packaging longevity also must be considered. Additionally, how rugged a system will be depends not just on the mechanical package surrounding the electronics, but also on how the electronics are mounted to the enclosure, how the electronics are connected between each other, how the electronics themselves are designed and manufactured, and the choice of the components used to make up the electronics themselves. Because of all these factors, rugged system design requires a team effort of engineering, manufacturing, and ­economic expertise. How does one find the best solution to meet all requirements without getting bogged down in the details of the nitty-gritty electrical and mechanical design work and optimizing time to market? The process begins with selecting a computer board standard and architecture that has built into its very nature the aspects one is looking for in the deployed end product. For more than twenty years, the PC/104 architecture has shined in this area and continues to provide one of the best architectures for short- and long-term applications. An inherent benefit of this architecture has always been its ability to communicate across modules without additional mechanical infrastructure, as one finds with rackmount systems. The secure stacking of

6 y

Spring 2015 | PC/104 and Small Form Factors Resource Guide

“...a PC/104 stack is a self-contained unit that can function with or without an outside enclosure while maintaining its ruggedness and ability to expand its functionality. Add the appropriate enclosure to it and you have a rugged system that has been built rugged inside and out.”

PC/104 modules through interboard bus connectors and standoffs provides an architecture with built-in baseline rugged­ness. To begin with, a PC/104 stack is a self-contained unit that can function with or without an outside enclosure while maintaining its ruggedness and ability to expand its functionality. Add the appropriate enclosure to it and you have a rugged system that has been built rugged inside and out. A look across the many industries, OEMs, and manufacturers will reveal a multitude of packaging configurations tailored for the PC/104 architecture. Some of these configurations are custom, solving a specific task for a specific industry, while others have been configured to maintain the inherent modularity of the PC/104 architecture to allow quick expandability or repairability. Each approach has its benefits and tradeoffs. The bottom line: Many enclosure systems can be tailored to the end user’s particular requirements while being optimized to reduce weight and costs. Today, you will find PC/104 at work in every facet of industry, from benign locations to the most hostile environments. As technology continues to be further integrated and embedded into our everyday personal and business products, the need for rugged packaging systems grows exponentially. The PC/104 architecture is and always has been ready to meet those requirements. For more information visit the PC/104 Consortium website at www.pc104.org. www.smallformfactors.com

SBCs: PC/104 for Unmanned Systems SBCs

PC/104 for Unmanned Systems

Small form factor and ultra-small form factor mission computer/ network solutions meet expanding UAV requirements Mike Southworth

An RQ-4 Global Hawk unmanned aerial vehicle (UAV) sits on the runway before a nighttime mission. Small and ultra-small form factor technologies can be used in this and other UAVs with exacting size and weight limitations. (U.S. Air Force photo/John Schwab.)

As missions expand and the classes of different types of unmanned aerial vehicles (UAVs) become better defined, the commercial off-the-shelf (COTS) community can meet the new requirements with open architecture solutions that reduce design risk, lower costs, and speed time to deployment. UAV system designers can select solutions based on their application requirements, the line-replaceable unit- (LRU) or line-replaceable module (LRM)-based subsystem solution that best meets mission needs, payload capabilities, and the platform’s size, weight, and power (SWaP) limitations. When it comes to UAV processor and networking applications, one size definitely does not fit all. The taxonomy of unmanned platforms continues to expand to meet a wider range of mission types and environments. These different classes of UAVs have varying operational requirements and sensor payload capacities. Moreover, the amount of onboard electronics that each type of UAV needs to interface, and how much sensor data it must process, will vary greatly between the size and the class of the UAV platform.

8 y

Today’s military UAVs include highaltitude/long-endurance (HALE)-type unmanned aerial systems (UASs) such as Northrop Grumman’s RQ-4 Global Hawk and the newer MQ-4C Triton aircraft. These UAVs have a wingspan similar to that of a Boeing 747 and a service altitude of approximately 60,000 feet. In the medium-altitude class of long-endurance (MALE) UAVs are found tactical platforms such as the General Atomics MQ-1 Predator and MQ-9 Reaper. For lower-altitude or shorter-range operations, smaller UAVs such as the Boeing

Spring 2015 | PC/104 and Small Form Factors Resource Guide

Scan Eagle or Textron RQ-7 Shadow – with wingspans of 10 to 14 feet and operating ceilings of 15,000 feet – are the workhorses. Meeting the needs of UAVs with COTS solutions The good news is that SWaP-optimized COTS processing and network solutions designed to meet the needs of each of these three classes of UAV have evolved and matured in parallel. Until recently, these solutions have ranged from upgradeable 3U OpenVPX www.smallformfactors.com

Comparing traditional and ultra small form factor (USFF) systems Traditional small form factor systems

Ultra-small form factor systems

HALE, MALE UAS

Smaller tactical UAS

3U VPX, PCIe104, COMe, XMC

Purpose-built SFF cards

LRM / LRU

LRU

High-performance x86, FPGA, Power, GPGPU

Low-power ARM, x86, FPGA

UAS class compatibility Board architecture Maintenance approach CPU architecture Cooling Typical size Typical weight Power dissipation Connectors Operating temp Ethernet switch ports

Passive / active

Passive

50-300 in²

< 50 in²

1-10 pounds

< 1.0 pound

10-200 W

< 10 W

MIL-DTL-38999

Micro-miniature circular

-40 to +71 degrees C

-40 to +85 degrees C

8 to 26 ports

Up to eight ports

Table 1 | A comparison of typical vs. ultra-small form factor systems.

backplane-based LRM systems at the high end to compact, self-contained LRU systems built with rugged PC/104 or COM Express-based small form factor (SFF) technologies in the midrange. A new class of extremely compact LRUs, ultra-small form factor (USFF) systems, has also recently emerged that delivers unprecedented size and weight reduction without compromising networkmanagement capabilities. These USFF systems are ideal for the smaller, lowaltitude UAVs with the most pressing size and weight limiations.. For system designers – after taking into consideration their platform’s available space and weight limitations – choosing between the various classes of COTS mission computer and networking solutions for UAVs will typically involve tradeoffs in terms of thermal-management requirements and processing performance. For example, 3U OpenVPX chassis systems can support a wide range of cooling options, including natural convection, air-cooled, and liquid cooling methodologies. In comparison, the midrange SFF and USFF approaches, while significantly smaller and lighter, are limited to natural convection cooling. Due to its ability to cool higher temperatures, the 3U OpenVPX solution is also able to support hotter multiprocessor architectures, while SFF and USFF designs find their sweet spots best supported by mobile laptop-type class Intel Core i7 and low-power tabletclass ARM processors. Examples of these 3U OpenVPX systems are the Integrated Mission Management Computer (IMMC) systems deployed on Global Hawk and Triton. (See Table 1.) www.smallformfactors.com

PC/104 and Small Form Factors Resource Guide | Spring 2015

y 9

SBCs: PC/104 for Unmanned Systems The small form factor LRU approach For those UAV applications where available space and weight preclude the use of the larger ATR-style chassis used by 3U OpenVPX systems, system designers have turned to SFF solutions. These rugged and compact “shoebox”-size COTS subsystems – frequently based on standard PCIe104 and COM Express modules – can deliver multicore fourthgeneration Intel Core i7 processing and Cisco IOS network routing in five-pound LRUs that do not require fans or moving parts to handle thermal management. It is also now possible, with the use of software-based routers such as the Cisco Systems 5921 Embedded Services Router (ESR) software, to reduce weight by nearly 40 percent for applications that require both a mission computer and network router because both functions can be integrated into a single LRU without adding any additional weight. The combined router/mission computer approach also significantly reduces costs because the total system is priced lower than separate distributed processor and hardware router LRU system alternatives. The emergence of ultra-small form factor COTS For the most demanding space- and weight-sensitive UAV applications, the new class of USFF subsystems holds great promise. Some of these rugged “pocket-size” solutions take up only 10 cubic inches, weigh half a pound, and consume less than 5 W of power. The first products in this class have been aimed at addressing requirements for Ethernet switching. They are targeted for technology refresh to upgrade older platforms with modern Internet Protocol (IP)-based data networks, or for deployment on smaller UAVs to connect Ethernet-enabled embedded devices such as computers, cameras, sensors, and command-and-control equipment deployed at the network edge. These miniature network-switch systems are less than 10 percent of the size and 25 percent of the weight of the most recent comparable small form factor switch offerings yet are able to deliver fully managed Ethernet switching.

“For the most demanding and weight-sensitive UAV applications, the new class of USFF subsystems holds great promise. Some of these rugged ‘pocket-size’ solutions take up only 10 cubic inches, weigh half a pound, and consume less than 5 W of power.” MIL-DTL-39999-like connectors for Gigabit Ethernet connectivity. For applications requiring 10/100 Ethernet shielded connectivity or when enhanced signal integrity is required, a rectangular connector fitted with Quadrax contacts can now be supported in an USFF LRU. The specialized Quadrax connector delivers superior electromagnetic shielding of Ethernet signals, with 100-ohm differential impedance matching for all Ethernet signals. Integrated electromagnetic (EMI)/power filtering handles power input voltage, spikes, surges, transients, and EMI/EMC compatibility for aircraft installations. An example of the new class of miniature MIL-circular connector enabled USFF ­network switches is the Curtiss-Wright Parvus DuraNET 20-11 8-port GbE Ethernet switch subsystem (a six-port 10/100 Ethernet switch variant with Quadrax contacts is also available). (See Figure 1.) These rugged, miniaturized, carrier-grade Layer 2/ Layer 3 switch solutions have precision time stamping (IEEE-1588v2), advanced Quality of Service, SNMPv3 management, and zeroization capabilities. When fitted with Quadrax contacts, the switch can provide enhanced protection against EMI generated by either the network switch or the other electronics onboard UAV platforms. This level of EMI isolation was recently required for several UAS platform installations where the mission of the UAS facilitates situational awareness for commanders to see, understand, and act decisively in time-critical situations. The network switch had to operate without being affected by or interfering with the platform’s noisy onboard communications equipment, to serve essentially as a flying cellphone tower. Figure 1 | The Parvus DuraNET 20-11 ultra-small form factor GbE switch measures 10 cubic inches.

Packaged in a fully sealed IP67 enclosure, these USFF LRUs have no moving parts, support extended temperature operation (-40 to +85 °C) and are resistant to high shock/vibration, humidity, altitude, and dust/water ingress. Designed for use in airborne platforms and ground vehicles with reduced SWaP requirements, these units support power input voltage, spikes, surges, transients, and EMI/EMC compatibility per MIL-STD-704F, MIL-STD-1275D, MIL-STD-461F, and RTCA/DO-160 for use in civil and military aircraft and ground-vehicle installations.

New connectors boost USFF Helping to make this reduction in SWaP possible is the use of new connector types such as microminiature

10 y

Spring 2015 | PC/104 and Small Form Factors Resource Guide

Mike Southworth is a product manager, Curtiss-Wright Defense Solutions. He can be reached at msouthworth@curtisswright.com. Curtiss-Wright Defense Solutions cwcdefense.com

www.smallformfactors.com

Experience extraordinary training for embedded systems professionals at ESC Conference Series 2015! The Embedded Systems Conference (ESC) is the industry’s largest, most comprehensive technical conference for embedded systems professionals in the U.S. ESC is excited to announce an expanded 2015 USA Conference Series, taking place in Boston (May 6-7), Silicon Valley (July 20-22), and Minneapolis (November 4-5).

ESC’s first stop in 2015 is Boston, MA, known for its good mix of hi-tech, biotech/ life sciences, medical device, and military defense companies. It’s also home to the #1 engineering university in the world - MIT.

Come join us at the Boston Convention Center and check out some of our sponsors for the event: Rohde & Schwarz | Green Hills Software, Inc | AdaCore| Altium, Inc. AMP Display | Azul Systems, Inc. | Convergence Promotions | IAR Systems AB Ironwood Electronics | MathWorks | Rigol Technologies | SmartBear Software Symmetry Electronics | Technologic Systems | Teledyne LeCroy Toradex | Total Phase | Vision Components GmbH | WolfSSL | Lauterbach, Inc. Phoenix Contract Software | Security Innovation | Code e-con Systems India Pvt. Ltd | Express Logic | XJTAG

Register today at www.embeddedconf.com/boston and get 15% off a Conference Pass when using a promo code OSM15Bos, offer expires May 1, 2015.

COMs and SOMs

Rugged Packaging

Rugged development requires integration of design and test from start to finish By Jeff Munch Mobility and environmental extremes are critical considerations for rugged board design in transportation applications. A comprehensive rugged hardware development methodology must integrate testing with design from the very start of the process.

In 1972, Dave Packard of Hewlett-Packard said, “There is only one road to reliability. Build it, test it, and fix the things that go wrong. Repeat the process until the desired reliability is achieved.” Few areas of hardware engineering require more testing than the development of rugged industrial products. In order to develop a truly rugged solution that meets required international standards, government regulations, general environmental specifications, and customer-specific performance requirements, designers must incorporate rugged design methodology into every aspect of the development process. This means following a rigid validation and verification testing process that is as much a part of the development cycle as the product design itself. Rugged vs. ruggedized The term ruggedized often refers to commercial-grade designs that are screened at high temperatures with high yield fallout. However, ruggedization of existing mechanics isn’t enough to meet the requirements of industrial

12 y

applications housed outdoors or in moving vehicles, where exposure to a variety of climates dictates the need to operate in extended temperatures and to power up in any extreme. For truly rugged electronics, boards and systems are best designed for harsh

Spring 2015 | PC/104 and Small Form Factors Resource Guide

environments from the ground up, with special attention and care given to component selection; circuit design; printed circuit board (PCB) thickness, layout, and materials; thermal solutions; enclosure design; and manufacturing process. Just as important to the development www.smallformfactors.com

Conformal coating can also reduce degradation from exposure to outside elements. A variety of conformal coating materials (such as acrylic, polyurethane, epoxy, and silicone) and application methods (such as brushing, spraying, and dipping) are currently used to protect against moisture, dust, chemicals, and temperature extremes that can potentially damage electronics. The correct coating or application method varies depending on established standard operating conditions for an application. With transportation applications, different coatings may be selected based on a primary need for moisture resistance versus abrasion resistance versus temperature stability. With rugged, in-vehicle applications, vibration control is critical for performing functions like capturing video or securing targets. Some rugged boards offer a thicker PCB fabrication to add rigidity so that the board can withstand higher levels of vibration strain. The thicker PCB offers stability to the overall surface area, protecting electronic components from damage due to vibration. The thicker PCB also offers the ability to use more copper between layers for thermal considerations, as heat is a common unwanted byproduct of processing power. Selecting the right form factor for rugged designs Rugged boards come in many form ­factors, so starting with the right one is key in being able to deliver customerspecific requirements. Let’s take a quick look at industry-standard single board computers (SBCs) and computers-onmodule (COMs).

for designs that can handle slightly larger SBC form factors. With just 46 square inches of surface area (8 inches by 5.75 inches), EBX balances size and functionality with a bolt-down SBC format supporting rugged embedded designs with higher-­ performance central processing units (CPUs), such as those using multicore technology for networking, digital signal processing (DSP), and graphics-heavy applications; EBX also sports generous onboard I/O functions to support everything from large data exchange to video. The PC/104 embedded computing format has no backplane, instead allowing modules to stack together like building blocks – more rugged than typical bus connections in PCs (such as PCI or PCI Express slot cards). PC/104 delivers high performance combined with low power, stackable configurations, and adherence to MIL-STD; it also meets key industrial and transportation standards for electromagnetic interface/compatibility (EMI/EMC), e.g. EN50121, EN50155, EN610000-x, etc. The ability to build stacks of PC/104 modules create opportunities for developing a diversity of complex, often mobile, applications that range across

“

Reduce, Save, Improve. Elma’s Rugged Platforms Do All That - And More.

“

cycle is testing of the design in order to validate choices and guarantee required performance levels and solution durability in a variety of simulated environmental conditions. Robust test methods ensure optimal product design phases in order to meet a product’s stringent requirements, such as -40 °C to +85 °C operating temperature range, MIL-STD, shock and vibration, and long-term reliability.

No one in embedded computing offers as many products and services as Elma. Our packaging, thermal and I/O interface expertise, plus years of expert embedded subsystem designs gives our customers a serious advantage. We are an extension of your team -- we fill in where you need us most, and we’re there every step of the way. Find out why Elma is truly Your Solution Partner.

Embedded Board eXpandable (EBX) and PC/104 are good format options MES-JulyAugust_Elma-SFF_Family_Ad.indd 1

www.smallformfactors.com

2/27/2015 2:11:06 PM

PC/104 and Small Form Factors Resource Guide | Spring 2015

y 13

COMs and SOMs: Rugged Packaging industrial, transportation, and defense environments where PC/104’s robust and reliable capabilities are required. (Figure 1.)

development cycle, as well as more progressive applications that require frequent processor upgrades without affecting other application design elements. (Figure 2.)

4-40 nut (4)

Stackable, mix-and-match modularity and the intrinsically rugged design of PC/104 is ideal for many of today’s technology upgrade programs looking for commercial off-the-shelf (COTS) options, especially those that value size, weight, power, and cost (SWaP-C). In addition to ruggedness, users of PC/104 have come to expect long life cycle support. When considering shrinking DoD budgets, the robustness, longevity, and compatibility of the PC/104 ecosystem ensure strong system support and minimized costs. In cases where an application design requires very specific I/O or physical size/shape restrictions, then a COM approach would provide better results. COMs are complete embedded computers built on a single circuit board for use in small or specialized applications requiring low power consumption or small physical size. With the COM approach, all generic PC functions are readily available in an off-the-shelf foundation module, enabling system developers to focus on their core competencies and the unique functions of their systems. A custom designed carrier board complements the COM with additional functionality that is required for specific applications. The carrier board provides all the interface connectors for peripherals, such as storage, Ethernet, keyboard/mouse, and display. This modularity enables the designer to upgrade the COM on the carrier board without changing any other board design features, and also allows more customization of peripherals as dictated by a specific application. The COM Express form factor offers flexibility in the development and advancement of ultra-rugged embedded applications for a wide range of industries. The modular processing block enables the designer to create a price and value advantage without getting locked into a single vendor for board creation. As it is easily swapped from a carrier board and comes in one of the smallest form factors, COM Express is ideal for long-life embedded applications with a critical

14 y

0.6 inch spacer (4)

PC/104 Module

CoreModule PC/104 Module

0.6 inch spacer (4)

ISA Bus Stack - through Expansion Connectors

PC/104 Module

4-40 screw (4)

Figure 1 | The PC/104 embedded computing format has no backplane, instead allowing modules to stack together like building blocks. Many applications in defense and transportation still incorporate legacy devices that require an ISA-BUS interface.

M2.5 Screws (5)

COM Express Module

M2.5 PEM Nuts Spacing 8 mm (5)

Stack Connectors Custom Base board Design

Figure 2 | A design using the COM Express form factor provides off-the-shelf functionality and an easy upgrade path by putting the customization on the baseboard, thereby creating more flexibility with the module without sacrificing performance.

Rugged design validation Guaranteeing the customer experience means not only satisfying regulatory requirements (EMC/safety/environmental testing), but also hewing to availability and durability requirements. Strength and Highly Accelerated Life Test (HALT) are used to simulate product aging to find design limits and maximum operating range by testing for issues such as displacement due to tolerances. This entire process enables hidden product defects to be exposed and addressed early in the development cycle. Rugged designs are subjected to extensive voltage and temperature margin tests during the new-product development process, then are validated using HALT, shock and vibration testing, and voltage margining. The HALT process consists of progressively increased extremes of temperature (both high and low), rapid thermal transition, six-axis vibration and – finally – combined temperature and vibration stress. Failures and the physical damage found at the destruct limits provide data, which is used to improve the ruggedness of the product design. Rugged board products are generally shock and vibration tested to meet the MIL-STD-202G standard. This includes subjecting the product to multiple 50 G shocks and 11.95 Grms of random vibration between 100 Hz and 1,000 Hz along each axis. Additionally, voltage and temperature margin testing is used during the product development process to subject the product to temperatures well outside the intended operating temperature range (-40°C to +85°C for extreme rugged products). The product is simultaneously subjected to minimum and maximum rated voltages (±5 percent). This process verifies products are functional and stable over combined

Spring 2015 | PC/104 and Small Form Factors Resource Guide

www.smallformfactors.com

as rugged products are expected to perform when taken to extremes, a comprehensive rugged hardware-­development process with equal emphasis on design and test processes must mirror those extremes.

Figure 3 | The recent Extreme Rugged COTS computing platform from ADLINK, the HPERC-IBR, is an example of a system that was developed from the ground up as a rugged standards-based solution, with the entire process relying heavily on testing to meet performance expectations.

extremes of both temperature and voltage, and ensures wide design margins resulting in long-term reliability under all specified operating conditions. Fulfilling extreme expectations Industrial computers are used in myriad rugged applications. They are subjected to frequent vibrations aboard vehicles, are found in factories with high temperature and humidity, are deployed in deserts or high mountains with temperature differences of as hot as 90 degrees Celsius, or are designed into guided missiles as flight controllers. To provide customers with highly reliable industrial-grade products that conform to catalog specifications and rugged application environments, solution providers must put as many resources – time, money, and human – into testing as they do into design. Just

Jeff Munch, ADLINK CTO, heads all research and development operations in North America and Asia and is responsible for building ADLINK’s presence throughout the world. Munch has more than 20 years of experience in hardware design, software development, and engineering resource management. Before joining the company, he spent five years at Motorola Computer Group as Director of Engineering. Munch has also chaired several PICMG subcommittees. Readers can reach him at jeff.munch@adlinktech.com. ADLINK Technology (408) 360-0200

E-CASTS IoT panel discussion: Get to market ASAP Presented by Advantech, Atollic, Freescale, Kontron, and Wind River IoT-related products are coming to market at an increasing pace. Companies that do not get their IoT-related offerings to the world in a timely manner are losing revenue. Those companies that do get their products to market are those that take advantage of the tools offered by the suppliers; such tools may include preconfigured operating systems, made-toorder drivers, and development kits. In this panel-discussion webinar, learn to make sense of the tools that are available for IoT development and discover which parts are left to the design engineer to figure out.

GO TO E-CAST: ECAST.OPENSYSTEMSMEDIA.COM/538

www.smallformfactors.com

Need more hardware for continuous integration? Use simulation Presented by Wind River This web seminar is a part of a series focusing on how development teams can adopt continuous and other game-changing practices by using simulation, whereas in the past teams may have been held up by the inflexibility of hardware labs. Development teams that practice continuous integration (CI) can quickly and iteratively develop, test, and integrate as they work. Faster feedback means faster error resolution, which means faster time to market. In this webinar, learn how to use a virtual platform and simulation approach that can yield an effective CI setup that can be used to extend access to test systems and remove hardware-related bottlenecks. GO TO E-CAST: ECAST.OPENSYSTEMSMEDIA.COM/536

PC/104 and Small Form Factors Resource Guide | Spring 2015

y 15

PROCESSOR ARCHITECTURE

SoCs

Flexible military radios balance SWaP, cost specs By Paul Dillien U.S. Marine Corps Capt. Michael Fox, a forward air controller with Fox Company, 2nd Battalion, 8th Marines (2/8), Regimental Combat Team 7, talks over the radio during Operation Nightmare in Nowzad, Afghanistan. (U.S. Marine Corps photo by Kowshon Ye.)

Over the last decade, engineers working to create software-defined radio (SDR) systems have found it challenging to design a very flexible wireless system that meets the military requirements for space, weight, and power (SWaP) at an affordable cost. The SDR sector was given a big boost when the U.S. military Joint Tactical Radio System (JTRS) program was initiated in 1997. The program’s ambitious objective was to allow mobile ad hoc networks to link together disparate wireless systems from the various branches of the military, other NATO armed forces, legacy radios, and some civilian systems. These systems included ground mobile radios (GMR), ground-to-air, and satellite communications. The JTRS specification featured a wide range of what were termed “waveforms”

16 y

that would be modulated onto any RF frequency over a huge range from high frequency (HF) to ultra-high frequency (UHF). The spec’s physical layer included orthogonal frequency division multiplexing (OFDM) and wideband code division multiple access (WCDMA) technologies to enable users to communicate via voice, data, and video simultaneously at all levels of security. The system was designed to support the need for mobile Command, Control, Communications, Computers, Intelligence, Surveillance and Reconnaissance (C4ISR) and to stay connected in the chaotic environment of a battlefield by using a self-healing network. These technologies required complex processing of the baseband signal to realize the various waveforms. In order to achieve both the speed of processing and low power consumption, the design requires some form of hardware acceleration. The two most suitable options would be a hardwired mask programmed gate array or field programmable logic, such as a field programmable gate array (FPGA). The advantages of the “classic” gate array include optimized performance and low power; however,

Spring 2015 | PC/104 and Small Form Factors Resource Guide

www.smallformfactors.com

once the design is committed to silicon it has permanently fixed functionality. Moreover, non-recurring engineering (NRE) costs have escalated dramatically for leading-edge technology, due to the long production timescales typical of defense procurement. The FPGA option provided a flexible logic fabric; because it is reprogrammable, it allowed design iterations to be tested in hardware with no NRE. The RF challenges also proved to be very difficult. The design of an RF chain that could span a wide range of frequencies is far from easy, with different frequencies requiring tunable components and an agile antenna. The bandwidth required for voice is much narrower than that needed for video, which gave added complexity to the design. Fast frequency hopping, spread spectrum, or OFDM further compounded the problems. Unfortunately, the specification proved too complex and difficult for the technology of the day and the JTRS program was finally cancelled in late 2011. The program also suffered from feature creep and bloated requirements during the 15 years of development, which rendered much of the earlier work obsolete. When the cancellation of the program was announced, the Defense Undersecretary was quoted as saying, “Our assessment is that it is unlikely that products resulting from the JTRS GMR development program will affordably meet service requirements, and may not meet some requirements at all. Therefore termination is necessary.” JTRS program elements live on Fast forward to 2014: Many of the require­ments from the JTRS program remain relevant today. The advance of Moore’s Law has been relentless, so that FPGAs fabricated using 20 nm planar technology are currently shipping, with 14 nm Tri-Gate (FinFET) technology just around the corner. This update has dramatically boosted both complexity and performance. For example, the midrange Altera Arria 10 SX family expands to www.smallformfactors.com

“The design of an RF chain that could span a wide range of frequencies is far from easy, with different frequencies requiring tunable components and an agile antenna. The bandwidth required for voice is much narrower than that needed for video, which gave added complexity to the design.”

660k logic elements, alongside well over 40 Mbits of on-chip memory and more than 1k DSP accelerators. The 20 nm SX devices also feature dual high-performance ARM processors. A question: How could a designer use an Arria 10 device to meet the baseband requirements of an SDR? The first decision is to partition the tasks between the s­ oftware running on the ARM processors and the hardware accelerators and interfaces that will be built in the logic fabric. The general rule is that compute-intensive functions, such as Fast Fourier Transform (FFT) encoding and decoding or Forward Error Correction (FEC), are typically more efficient in hardware. The processor is ideal for activities like data moves to memory and protocol checking and manipulating. The equivalent of baseband “waveforms” would be various modulation standards. These could be OFDM, which demands complex FFT computations, or Code Division Multiple Access (CDMA), requiring fast spreading code generation and correlators to despread and recover the received data. The DSP blocks in the Arria device form a key element of the hardware accelerator. Modern modulation systems use data in the form of In-phase (I) and Quadrature (Q) bitstreams; this allows the RF carrier to be modulated with quadrature amplitude modulation (QAM) such as 16 (up to as high as 256 QAM), or the simpler quadrature phase shift keying (QPSK). This highperformance task can be implemented in the DSP and logic fabric to save overall system power. The latest standard is called Multiple-Input Multiple-Output (MIMO), a complex scheme that uses two or more antennas separated by a physical distance. MIMO techniques improve the spectral efficiency and achieve a diversity gain that improves the link reliability. It is expected that MIMO will become an important addition to meet the growing demand for data throughput. A programmable logic solution offers significant additional advantages. The logic function is defined by a configuration file held in nonvolatile external memory and loaded into the device on power-up; the memory also holds the executable code for the ARM cores. This solution allows the functionality to be updated as a midlife software update, as users could, for example, support new waveforms in the logic or add new features to the ARM code. The ARM processors can control the data flow into the FPGA cores, using them as ­specially customized peripherals. As an example, one core may be allocated to controlling the interfaces, such as a display or video screen, while also verifying that the received data packets are valid (see Figure 1 on following page). The second processor can control the hardware accelerators built from the logic and DSP resources. The ARM can select the hardware accelerators that implement the algorithm currently required, for example, to produce QAM16, and to regulate the data transfer to and from the field programmable radio frequency (FPRF) chip. PC/104 and Small Form Factors Resource Guide | Spring 2015

y 17

PROCESSOR ARCHITECTURE: SoCs

The LMS7002M includes an on-chip microcontroller; this setup simplifies the calibration of the chip, which otherwise would involve complex interactions with the baseband logic. It calibrates DC offset, the TX/RX LPF bandwidth tuning, transmit local oscillator leakage feedthrough, IQ gain and phase mismatch in both transmit and receive chains, as well as handling on-chip resistor and capacitor calibration. In most applications the initial calibration is sufficient; however, for military wireless systems operating at extreme temperatures and frequencies, then the microcontroller can be instructed to recalibrate to ensure optimum performance. Power-saving features include the ability to selectively power down any block when not required, with settings and calibration retained if power to the SPI memory is retained (see Figure 2). The FPRF chip is housed in an 11.5 mm x 11.5 mm package.

ARM Code

I&Q Data

RSSI

Dual ARM Cores

Control Data

Video or Message Display

Figure 1 | An FPGA controlling the SDR logic. ANALOG SIGNALS

DSP BYPASS DSP

I DAC

DIGITAL INPUTS

DSP

TX PLL BB GAIN

LP FILTER

MIXER

FILTER BYPASS Q DAC

LP FILTER

BB GAIN

Transceiver 2 Transceiver 1 RF GAIN RF OUTPUT

SPI CONTROL REGISTERS

RF

LNA 1 LNA 2 LNA 3

BB GAIN MIXER BB GAIN RX PLL

LP FILTER

BB GAIN FILTER BYPASS

I ADC

BB GAIN

Q ADC

LP FILTER

ANALOG SIGNALS

DSP DIGITAL OUTPUTS

DSP

DSP BYPASS

Figure 2 | Each FPRF block can be selectively depowered or bypassed.

OpenCL code and rapidly exploit the massively parallel architecture of an FPGA. It enables kernel code to be emulated and debugged, pinpoints performance bottlenecks, and profiles and recompiles to a hardware implementation. The FPRF design tool from Lime Microsystems takes the form of a graphical user interface (GUI); the GUI is available free of charge and allows complete control of the device.

Various tools are available to help designers, either provided by the FPGA vendor or third-party suppliers. For example, Altera is the only FPGA vendor to offer a publicly available, Open Computing Language (OpenCL)conformant software development kit. OpenCL allows programmers to take

18 y

Interfaces

I Q I Q Accelerators

SPI

External Memory

Logic, DSP and Internal Memory

JESD207

Configuration File

FPRF

LimeLightTM I/F

The LMS7002M, the second-generation FPRF device from Lime Microsystems, is a newly announced 65 nm CMOS chip that features a dual-transceiver architecture. The frequency range has been extended, so that it now covers 50 MHz to 3,800 MHz, giving support to the lower frequencies often used in legacy military radios. In addition, the upper limit can be easily extended with the addition of an external PLL and mixer, so that it can cover frequencies used in satellite communications.

FPGA

LimeLightTM I/F

The ARM can control the FPRF device as well with a simple and fast SPI interface using a two-byte instruction to give it complete control of the RF domain. The processor can also process the received signal strength indicator (RSSI) that indicates the activity level at the chosen frequency. The combination of the FPGA and FPRF devices provides a highly flexible, low power, and above all, ­cost-effective solution to the logic and RF domains.

Spring 2015 | PC/104 and Small Form Factors Resource Guide

Paul Dillien has worked with Lime Microsystems covering a range of marketing projects for the past two years. He previously worked in the FPGA industry for 15 years, and is the author of “The FPGA Market” report. Paul has worked in strategic and tactical marketing roles for leading U.S. and U.K. semiconductor companies and specializes in competitive analysis and negotiation. Readers may reach him at paul@high-tech-marketing.co.uk. Lime Microsystems | 630-208-2700 | www.limemicro.com www.smallformfactors.com

See you JUNE

2 - 6, 2015

COMPUTEX TAIPEI, since its founding in 1981, has soared with ICT to become the hub of the industry to shape the future. This mega event is where ideas become products to inspire even greater advances.

Stars of the show Wearable Technology

Smart Handhelds

Cloud Computing / Services

Embedded Technology

The Internet of Things

3D Printing

Smart Home Automation

ICT Security

Pre-register NOW! www.ComputexTaipei.com.tw Tel: +886-2-2725-5200 Ext. 2634 Organizers:

E-mail: computex@taitra.org.tw Fax: +886-2-2725-3501

PC/104 and Small Form Factors Resource Guide

2015 RESOURCE GUIDE INDEX Company Category Page ACCES I/O Products, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Hardware and Peripherals. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22-24 ADL Embedded Solutions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SBCs and Boards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 ADL Embedded Solutions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 ADLINK Technology, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . COMs and SOMs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Alphi Technology Corporation . . . . . . . . . . . . . . . . . . . . . . . . . . . . SBCs and Boards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 Connect Tech Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . COMs and SOMs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Connect Tech Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SBCs and Boards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28-29 EMAC, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . COMs and SOMs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 EMAC, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SBCs and Boards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 Intermas, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Hardware and Peripherals. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 North Atlantic Industries . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 PEAK-System Technik GmbH . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Hardware and Peripherals. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25-26 RTD Embedded Technologies, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . Hardware and Peripherals. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 RTD Embedded Technologies, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . SBCs and Boards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 RTD Embedded Technologies, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . Systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 Sundance Multiprocessor Technology, Ltd. . . . . . . . . . . . . . . . . . . SBCs and Boards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 Themis Computer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 WinSystems, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SBCs and Boards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30-32

PC/104 and Small Form Factors Resource Guide

WinSystems, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

COMs and SOMs

AmITX-HL-G Mini-ITX Industrial Motherboard The AmITX-HL-G delivers a high-performance and space-saving platform for a wide array of embedded computing applications, including multimedia, automation control, and gaming applications. With a compact footprint, this Mini-ITX motherboard supports processing high-speed and high-bandwidth network connectivity with PCI Express-based gigabit LAN and offers diverse I/O, storage, and audio interfaces. ADLINK's AmITX-HL-G is equipped with our SEMA Cloud functionality and is ready-made for Internet of Things (IoT) applications. The AmITX-HL-G is able to connect legacy industrial devices and other IoT systems to the cloud, extract raw data from these devices and determine which data to save locally and which to send to the cloud for additional analysis. http://www.adlinktech.com/PD/web/PD_detail.php?cKind=&pid=1446

FEATURES ĄĄ 4th Generation Intel® Core™ i7/i5/i3 Desktop Processor with Intel

Q87/H81 Chipset

ĄĄ Dual SODIMM DDR3L-1600 memory sockets (up to 16 GB) ĄĄ PCIe x16, PCIe x1 and Mini PCIe expansion slots ĄĄ Three DisplayPort interfaces ĄĄ SEMA Cloud support

smallformfactors.opensystemsmedia.com/p372682

ADLINK

www.adlinktech.com 20 y

Spring 2015 | PC/104 and Small Form Factors Resource Guide

angela.torres@adlinktech.com  408-360-0200 

www.smallformfactors.com

COM Express® + GPU Embedded System The COM Express + GPU Embedded System from Connect Tech combines the latest generation x86 processors with high-end Graphics Processing Units (GPU) all into a ruggedized small form factor embedded system. Choose from 4th Generation Intel® Core™ i7 or i5 (Haswell) x86 processor options and from either the AMD Radeon E6760 GPU, ideal for driving multiple displays, or the NVIDIA GeForce GTX 970M/950M GPU’s for applications that require access to CUDA Cores and the ability to process complex mathematics in

FEATURES ĄĄ Combines High-End GPUs with Latest Generation x86 Processors

in a ruggedized small form factor

ĄĄ GPUs can be targeted for 4 independent display outputs OR for a

headless GPU processing system utilizing CUDA cores

parallel of the on-board x86 CPU.

ĄĄ All thermal extraction points from COM Express and GPU are

brought out to a single unified plane

smallformfactors.opensystemsmedia.com/p372068

Connect Tech Inc.



www.connecttech.com/VXG001

sales@connecttech.com www.connecttech.com

 519-836-1291 | 800-426-8979 twitter.com/connecttechinc



COMs and SoMs

COM Express® Type 6 PMC/XMC Ultra Lite Carrier Connect Tech’s COM Express® Type 6 PMC/XMC Ultra Lite Carrier Board is a compact, feature-rich carrier which offers dual PMC/XMC and Mini-PCIe expansion. This carrier board features USB 3.0 and DisplayPort, and supports the latest high performance processors. The COM Express® Type 6 PMC/ XMC Ultra Lite Carrier Board is ideal

FEATURES

for military and aerospace applications, and accepts a wide input

ĄĄ Dual PMC/XMC & Mini-PCIe Expansion

voltage range from a regulated or un-regulated source of +12V to

ĄĄ COM Express Type 6 compatibility

+48V DC.

ĄĄ Ruggedized, locking pin header connectors ĄĄ Small form factor (170mm x 165mm) ĄĄ Extended Temperature Range, -40° C to +85° C

smallformfactors.opensystemsmedia.com/p372689

Connect Tech Inc.

www.connecttech.com/CCG-PMC-XMC www.smallformfactors.com



sales@connecttech.com www.connecttech.com

 519-836-1291 | 800-426-8979 twitter.com/connecttechinc



PC/104 and Small Form Factors Resource Guide | Spring 2015

y 21

PC/104 and Small Form Factors Resource Guide

COMs and SoMs

PC/104 and Small Form Factors Resource Guide

COMs and SoMs

Low Power Industrial Temperature ARM SoM-A5D36 Designed and manufactured in the USA, the SoM-A5D36 is a System on Module (SoM) based on the Atmel ARM Cortex A5 ATSAMA5D36 processor. This low power, wide temperature ARM 536 MHZ SoM utilizes 4GB of eMMC Flash, 16MB of serial data flash, and up to 512MB of LP DDR2 RAM. Like other modules in EMAC's SoM product line, the SoM-A5D36 is designed to plug into a custom or off-the-shelf carrier board containing all the connectors and any additional I/O components that may be required. This approach allows the customer or EMAC to design a Custom Carrier Board that meets the I/O, dimensional, and connector requirements without having to worry about the processor, memory, and standard I/O functionality. With this System on Module approach, a semi-custom hardware platform can be developed in as little as a month. Please contact EMAC for OEM & Distributor Pricing. Quantity 1 pricing is $150.

FEATURES ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ

Atmel ARM Cortex A5 536Mhz Processor 512 MB of LP DDR2 RAM 4 GB of eMMC Flash, 16MB of Serial Data Flash 10/100/1000 BaseT Ethernet port 22 GPIO (3.3V) Lines 6x serial ports, 2x CAN ports 6x channels of 12 bit A/D (0 to 3.3V) 2x USB 2.0 High Speed Host ports, 1x USB 2.0 Host/Device 4 wire Resistive Touch, 24-bit LCD Controller 1x Synchronous Serial I/O (I2S) Audio Port 4x PWM Channels, 5x Timer/Counters, 3x Clock Outputs Internal Real Time Clock/Calendar, External Address/Data Bus EMAC OE Linux smallformfactors.opensystemsmedia.com/p372683

EMAC, Inc.

info@emacinc.com www.emacinc.com

 618-529-4525



www.emacinc.com/products/system_on_module/SoM-A5D36

Hardware and Peripherals

ETH-DIO-48 Ethernet 48-Channel Industrial Strength Digital I/O Designed for compact control and monitoring applications, this product features 48 or 24 industrial strength TTL digital I/O lines. This Ethernet device is an ideal solution for adding portable, easy-to-install, digital I/O to any Ethernet network, even wirelessly. The ETH-DIO-48 is excellent for use in applications sensing inputs such as switch closures, TTL, LVTTL, CMOS logic, and is ideal for controlling external relays, driving indicator lights, and more. Applications include home, portable, tablet, laboratory, industrial automation, and embedded OEM. Available accessories include a broad range of ribbon cables, screw terminal boards, optically isolated adapters, electromechanical relay boards, and industry standard solid state module racks. Special order items such as conformal coating, custom software, right angle headers, and more, are also available.

FEATURES ĄĄ Ethernet 10/100 RJ45 connector for interfacing to CPU or network ĄĄ 48 or 24 channel high-current TTL digital I/O lines ĄĄ Compatible with industry standard I/O racks such as Grayhill, Opto 22,

Western Reserve Controls, etc.

ĄĄ Eight-bit ports software selectable for inputs or outputs ĄĄ All 48 digital I/O lines buffered with 32 mA source/64mA sink current

capabilities

ĄĄ Jumper selectable I/O pulled up to 5V (via 10KΩ) for contact monitoring, ĄĄ ĄĄ ĄĄ ĄĄ

pulled down to ground or floating Resettable 0.5A fused +5VDC output per I/O connector OEM version (board only), features PC/104 size and mounting compatibility Small, (4"x4"x1.7") rugged, steel industrial enclosure LVTTL (3.3V) and -40°C to +85°C industrial operating temperature available as factory options smallformfactors.opensystemsmedia.com/p372692

ACCES I/O Products, Inc.

www.accesio.com/eth-dio-48 22 y



contactus@accesio.com

 linkedin.com/company/acces-i-o-products-inc.

Spring 2015 | PC/104 and Small Form Factors Resource Guide

 1-858-550-9559 twitter.com/accesio



www.smallformfactors.com

mPCIe-COM Family PCI Express Mini Cards ACCES I/O Products is pleased to announce the release of a new family of mini PCI Express (mPCIe) multi-port serial communication cards. These small, low-priced, PCI Express Mini cards feature a selection of 4 or 2-ports of software selectable RS-232/422/485 asynchronous serial protocols on a port by port basis. These cards have been designed for use in harsh and rugged environments such as military and defense along with applications such as health and medical, point of sale systems, kiosk design, retail, hospitality, automation, gaming and more. The small size (just 50.95mm x30mm) allows for maximum performance in applications where space is a valuable resource. Each RS-232 port is simultaneously capable of supporting data communication rates up to 921.6 kbps. RS-422/485 modes support data communication speeds up to 3 Mbps. The cards provide ±15kV ESD protection on all signal pins to protect against costly damage due to electrostatic discharge. Existing serial peripherals can connect directly to industry standard DB9M connectors on the optional breakout cable accessory kits. The mPCIe-COM cards were designed using type 16C950 UARTs and use 128-byte transmit/receive FIFO buffers to decrease CPU loading and protect against lost data in multitasking systems. New systems can continue to interface with legacy serial peripherals, yet benefit from the use of the high performance PCI Express bus. The cards are fully software compatible with current PCI and PCI Express 16550 type UART applications and allow users to maintain backward compatibility.

FEATURES ĄĄ PCI Express Mini Card form-factor (mPCIe) type F1, with latching I/O connectors ĄĄ 4 or 2-port serial communication cards with optional DB9M connectivity ĄĄ Software selectable RS-232, RS-422, and RS-485 protocols, per port stored in EEPROM ĄĄ High performance 16C950 class UARTs with 128-byte FIFO for each TX and RX ĄĄ Port-by-port field selectable termination for RS-422/485 applications ĄĄ Industrial operating temperature (-40°C to +85°C) and RoHS standard ĄĄ Supports data communication rates up to 3Mbps simultaneously, (RS-232 up to 921.6 kbps) ĄĄ Custom baud rates easily configured ĄĄ ±15kV ESD protection on all signal pins ĄĄ CTS, RTS, 9-bit data mode, and RS-485 full-duplex (4 wire) fully supported ĄĄ RS-232 only and RS-422/485 versions available smallformfactors.opensystemsmedia.com/p372691

ACCES I/O Products, Inc. www.accesio.com



contactus@accesio.com

 1-858-550-9559 twitter.com/accesio

 linkedin.com/company/acces-i-o-products-inc.



Hardware and Peripherals

mPCIe-ICM Family PCI Express Mini Cards The mPCIe-ICM Series isolated serial communication cards measure just 30 x 51 mm and feature a selection of 4 or 2 ports of isolated RS232 serial communications. 1.5kV isolation is provided port-to-computer and 500V isolation port-to-port on ALL signals at the I/O connectors. The mPCIe-ICM cards have been designed for use in harsh and rugged environments such as military and defense along with applications such as health and medical, point of sale systems, kiosk design, retail, hospitality, automation, and gaming. The RS232 ports provided by the card are 100% compatible with every other industry-standard serial COM device, supporting TX, RX, RTS, and CTS. The card provides ±15kV ESD protection on all signal pins to protect against costly damage to sensitive electronic devices due to electrostatic discharge. In addition, they provide Tru-Iso™ port-to-port and port-to-PC isolation. The serial ports on the device are accessed using a low-profile, latching, 5-pin Hirose connector. Optional breakout cables are available, and bring each port connection to a panel-mountable DB9-M with an industry compatible RS232 pin-out. The mPCIe-ICM cards were designed using type 16C950 UARTS and use 128-byte transmit/receive FIFO buffers to decrease CPU loading and protect against lost data in multitasking systems. New systems can continue to interface with legacy serial peripherals, yet benefit from the use of the high performance PCI Express bus. The cards are fully software compatible with current PCI 16550 type UART applications and allow for users to maintain backward compatibility.

FEATURES ĄĄ PCI Express Mini Card (mPCIe) type F1, with latching I/O connectors ĄĄ 4 or 2-port mPCIe RS232 serial communication cards ĄĄ Tru-Iso™ 1500V isolation port-to-computer and 500V isolation

port-to-port on ALL signals

ĄĄ High performance 16C950 class UARTs with 128-byte FIFO for each

TX and RX

ĄĄ Industrial operating temperature (-40°C to +85°C) and RoHS standard ĄĄ Supports data communication speeds up to 1 Mbps simultaneously ĄĄ Custom baud rates easily configured ĄĄ ±15kV ESD protection on all signal pins ĄĄ 9-bit data mode fully supported ĄĄ Supports CTS and RTS handshaking smallformfactors.opensystemsmedia.com/p372557

ACCES I/O Products, Inc. www.accesio.com

www.smallformfactors.com



contactus@accesio.com

 linkedin.com/company/acces-i-o-products-inc.

 1-858-550-9559 twitter.com/accesio



PC/104 and Small Form Factors Resource Guide | Spring 2015

y 23

PC/104 and Small Form Factors Resource Guide

Hardware and Peripherals

PC/104 and Small Form Factors Resource Guide

Hardware and Peripherals

USB-104-HUB – Rugged, Industrial Grade, 4-Port USB Hub This small industrial/military grade hub features extended temperature operation (-40°C to +85°C), high-retention USB connectors, and an industrial steel enclosure for shock and vibration mitigation. The OEM version (board only) is PC/104 sized and can easily be installed in new or existing PC/104-based systems as well. The USB-104-HUB now makes it easy to add additional USB-based I/O to your embedded system or to connect peripherals such as external hard drives, keyboards, GPS, wireless, and more. Real-world markets include Industrial Automation, Embedded OEM, Laboratory, Kiosk, Transportation/Automotive, and Military/Government. This versatile four-port hub can be bus powered or self powered. You may choose from three power input connectors: DC power input jack, screw terminals, or 3.5" drive power connector (Berg). Mounting provisions include DIN rail, 3.5" front panel drive bay mounting, and various panel mounting plates.

FEATURES ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ

Rugged, industrialized, four-port USB hub High-speed USB 2.0 device, USB 3.0, and 1.1 compatible Extended temperature operation (-40°C to +85°C) Data transfer rates up to 480 Mbps Supports bus-powered and self-powered modes Three power input connectors (power jack, screw terminals, or 3.5" drive Berg power connector) LED status indicators for power and overcurrent fault conditions for each downstream port USB/104 form factor for OEM embedded applications OEM version (board only) features PC/104 module size and mounting Includes micro-fit embedded USB header connectors in parallel with all standard USB connectors Industrial grade USB connectors feature high-retention design Small (4" x 4" x 1"), low profile, steel enclosure 3.5" front panel drive bay mounting provision smallformfactors.opensystemsmedia.com/p369571

ACCES I/O Products, Inc.



contactus@accesio.com

 linkedin.com/company/acces-i-o-products-inc.

www.accesio.com

 1-858-550-9559 twitter.com/accesio



Hardware and Peripherals

InterShell Enclosures Intermas develops electronic enclosure systems:

FEATURES

Cabinets, housings, subracks, and an extensive range of accessories for the 19" rack systems and small form factors used in the fields of PCI, VME/VME64x, cPCI, IEEE, and communication applications with stateof-the-art EMI- and RFI-shielded protection.

ĄĄ InterShell is a new aluminum housing enclosure composed of a top

Intermas has an extensive product range of more than 10,000 separate components and more than 30 years’ experience.

ĄĄ Color options are unlimited and customer-specific print is possible.

Go to

and bottom, two front panels, and four screws.

ĄĄ The simple housing design offers an uncomplicated solution for small

form factors for easy and quick assembly.

ĄĄ InterShell is used for the packaging of small electronic units such as

Eurocard formats with 100x160 mm, universal formats, or as mITX formats for example.

ĄĄ Excellent EMC compliancy. ĄĄ InterShell is available in the following standard dimensions (h/w/d)

www.Intermas-US.com

as well as customized formats: • 40x106.6x168.6 mm • 60x150x120 mm • 50x190x190 mm

for our new catalog.

smallformfactors.opensystemsmedia.com/p372684

Intermas US LLC

www.Intermas-US.com 24 y

Spring 2015 | PC/104 and Small Form Factors Resource Guide

intermas@intermas-us.com  800-811-0236 

www.smallformfactors.com

PCAN-PC/104 The PCAN-PC/104 card enables the connection of one or two CAN networks to a PC/104 system. Multiple PCAN-PC/104 cards can easily be operated using interrupt sharing.

FEATURES

The card is available as a single or dual-channel version. The optodecoupled versions also guarantee galvanic isolation of up to 500 Volts between the PC and the CAN sides.

ĄĄ Form factor PC/104 ĄĄ Multiple PC/104 cards can be operated in parallel (interrupt sharing) ĄĄ 14 port and 8 interrupt addresses are available for configuration using

The package is also supplied with the CAN monitor PCAN-View for Windows and the programming interface PCAN-Basic.

ĄĄ Bit rates from 5 kbit/s up to 1 Mbit/s ĄĄ Compliant with CAN specifications 2.0A (11-bit ID) and 2.0B (29-bit ID) ĄĄ Connection to CAN bus through D-Sub slot bracket, 9-pin (in accordance

Optionally available:

• Single-channel or dual-channel version • Galvanic isolation on the CAN connection up to 500 V, separate for each CAN channel

jumpers

ĄĄ ĄĄ ĄĄ ĄĄ

with CiA® 102) NXP SJA1000 CAN controller, 16 MHz clock frequency NXP PCA82C251 CAN transceiver 5-Volt supply to the CAN connection can be connected through a solder jumper, e.g. for external bus converter Extended operating temperature range from -40 to 85 °C (-40 to 185 °F) smallformfactors.opensystemsmedia.com/p341735

PEAK-System Technik GmbH

www.peak-system.com/quick/PC104-1

 info@peak-system.com  +49 (0) 6151-8173-20

Hardware and Peripherals

PCAN-PC/104-Plus The PCAN-PC/104-Plus card enables the connection of one or two CAN networks to a PC/104-Plus system. Up to four cards can be operated, with each piggy-backing off the next. The CAN bus is connected using a 9-pin D-Sub plug on the slot bracket supplied.

FEATURES ĄĄ Use of the 120-pin connection for the PCI bus

The card is available as a single or dual-channel version. The optodecoupled versions also guarantee galvanic isolation of up to 500 Volts between the PC and the CAN sides.

ĄĄ Up to four cards can be used in one system

The package is also supplied with the CAN monitor PCAN-View for Windows and the programming interface PCAN-Basic.

ĄĄ Connection to CAN bus through D-Sub slot bracket, 9-pin (in accordance

Optionally available:

ĄĄ NXP PCA82C251 CAN transceiver

• Single-channel or dual-channel version • Galvanic isolation on the CAN connection up to 500 V, separate for each CAN channel • PC/104-ISA stack-through connector

ĄĄ Bit rates from 5 kbit/s up to 1 Mbit/s ĄĄ Compliant with CAN specifications 2.0A (11-bit ID) and 2.0B (29-bit ID)

with CiA® 102)

ĄĄ NXP SJA1000 CAN controller, 16 MHz clock frequency ĄĄ 5-Volt supply to the CAN connection can be connected through a solder

jumper, e.g. for external bus converter

ĄĄ Extended operating temperature range from -40 to 85 °C (-40 to 185 °F) smallformfactors.opensystemsmedia.com/p345620

PEAK-System Technik GmbH

www.peak-system.com/quick/PC104-2 www.smallformfactors.com

info@peak-system.com  +49 (0) 6151-8173-20 

PC/104 and Small Form Factors Resource Guide | Spring 2015

y 25

PC/104 and Small Form Factors Resource Guide

Hardware and Peripherals

PC/104 and Small Form Factors Resource Guide

Hardware and Peripherals

PCAN-PC/104-Plus Quad The PCAN-PC/104-Plus Quad card enables the connection of four CAN networks to a PC/104-Plus system. Up to four cards can be operated, with each piggy-backing off the next. The CAN bus is connected using a 9-pin D-Sub plug on the slot brackets supplied. There is galvanic isolation of up to 500 Volts between the computer and CAN sides. The package is also supplied with the CAN monitor PCAN-View for Windows and the programming interface PCAN-Basic. Optionally available: • PC/104-ISA stack-through connector

FEATURES ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ

Form factor PC/104 Use of the 120-pin connection for the PCI bus Up to four cards can be used in one system Bit rates from 5 kbit/s up to 1 Mbit/s Compliant with CAN specifications 2.0A (11-bit ID) and 2.0B (29-bit ID) Connection to CAN bus through D-Sub slot brackets, 9-pin (in accordance with CiA® 102) FPGA implementation of the CAN controller (SJA1000 compatible) NXP PCA82C251 CAN transceiver Galvanic isolation on the CAN connection up to 500 V, separate for each CAN channel 5-Volt supply to the CAN connection can be connected through a solder jumper, e.g. for external bus converter Extended operating temperature range from -40 to 85 °C (-40 to 185 °F) smallformfactors.opensystemsmedia.com/p367584

PEAK-System Technik GmbH

www.peak-system.com/quick/PC104-3

 info@peak-system.com  +49 (0) 6151-8173-20

Hardware and Peripherals

CAN Interface for PCI/104-Express The PCAN-PCI/104-Express card enables the connection of one, two, or four CAN busses to a PCI/104-Express system. Up to four cards can be stacked together. The CAN bus is connected using a 9-pin D-Sub plug on the slot brackets supplied. There is galvanic isolation of up to 500 Volts between the computer and CAN sides. The card is available as a single, dual, or four-channel version. The package is also supplied with the CAN monitor PCAN-View for Windows and the programming interface PCAN-Basic. Optionally available: • Single, dual, or four-channel version • PCI-104 stack-through connector

FEATURES ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ

PCI/104-Express card, 1 lane (x1) Form factor PC/104 Up to four cards can be used in one system Bit rates from 5 kbit/s up to 1 Mbit/s Compliant with CAN specifications 2.0A (11-bit ID) and 2.0B (29-bit ID) Connection to CAN bus through D-Sub slot bracket, 9-pin (in accordance with CiA® 102) FPGA implementation of the CAN controller (SJA1000 compatible) NXP PCA82C251 CAN transceiver Galvanic isolation on the CAN connection up to 500 V, separate for each CAN channel Supplied only via the 5 V line 5-Volt supply to the CAN connection can be connected through a solder jumper, e.g. for external bus converter Extended operating temperature range from -40 to 85 °C (-40 to 185 °F) smallformfactors.opensystemsmedia.com/p372678

PEAK-System Technik GmbH

www.peak-system.com/quick/PC104-4 26 y

Spring 2015 | PC/104 and Small Form Factors Resource Guide

info@peak-system.com  +49 (0) 6151-8173-20 

www.smallformfactors.com

100 Watt Isolated ATX Power Supply RTD’s IATX25110HR is a 100 Watt high-power isolated DC/DC converter for PCI/104-Express embedded systems. The supply provides +5V, +5VSTDBY, +3.3V, and +12V to the PCIe and PCI buses. Additionally, +5V, +3.3V, and +12V are provided at auxiliary connectors on the supply. The robust design uses a +5V isolated supply to create +5V and +5VSTBY while the +12V isolated supply cascades to the 3.3V supply. The +5V is designed for 50 Watts, the 3.3V is designed for 10 Watts, the +12V is designed for 50 Watts, and the +5VSTBY is designed for 10 Watts.

FEATURES ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ

PCIe/104 and PCI/104-Express configurations Available in modular, rugged enclosures Input Voltage: 10 to 36 VDC 10 Amps of 5V 4.17 Amps of 12V 3.03 Amps of 3.3V 2.0 Amps of 5VSB Remote ON/OFF control Reverse voltage protection Input over voltage protection Input over current protection ATX functionality Power indicator LEDs Operating Temperature: -40 to +85°C smallformfactors.opensystemsmedia.com/p372679

RTD Embedded Technologies, Inc. www.rtd.com

 sales@rtd.com  814-234-8087

SBCs and Boards

NEW ADLE3800PC – Intel® E3800 Series PCIe/104 SBC The ADLE3800PC is based on Intel’s first System-on-Chip (SoC) E3800 Atom product family which is built using Intel’s 22nm 3D Tri-gate process. It offers vastly superior compute performance and energy efficiency including Intel’s 7th generation graphics engine for stunning graphics performance. Improved power management capabilities result in standby power measured in milliwatts with days of standby time. Potential aPPlications include: • Military & Defense Rugged SFF • Rugged Mobile Computing • Portable Medical Devices • Mobile Autonomous Systems for Civil, Commercial and Defense Applications Including: – – – –

Unmanned Ground Vehicles Robotic Subs Unmanned Avionics Unmanned Buoys and Other Surface Vehicles

FEATURES ĄĄ Intel® E3800 Series SoC Processors, DC/Quad ĄĄ Junction Temperature Rated at -40C to +110C ĄĄ Up to 8 GB DDR3L-1333, 1.35V SoDIMM204 Socket ĄĄ Type 2 Downward-Stacking PCIe/104 V2.01 with 2x Gen2 PCIe

x1 Lanes

ĄĄ 4x USB 2.0, 1x USB 3.0, 2x Serial COM ĄĄ 2x SATA 3 Gb/s, 2x GLAN Ethernet ĄĄ PCI Express Mini Card 1.2 Socket, Compatible with Mini PCIe or

mSATA Modules

smallformfactors.opensystemsmedia.com/p372042

ADL Embedded Solutions Inc. www.adl-usa.com

www.smallformfactors.com

sales@adl-usa.com  858-490-0597 

PC/104 and Small Form Factors Resource Guide | Spring 2015

y 27

PC/104 and Small Form Factors Resource Guide

Hardware and Peripherals

PC/104 and Small Form Factors Resource Guide

SBCs and Boards

PCIe-Mini-1553-2 The MIL-STD-1553 (1553) PCIe-Mini expansion module is a 2 Channel dual redundant 1553 controller module, where each controller can support BC or Multi-RT with Concurrent bus monitor. The controller can support the MIL-STD-1553 A/B and the MIL-STD-1760 traffic. This module can operate in a Mini PCI Express slot. Utilizing the DDC Total-AceXtreme® Engine, this 1553 card is able to perform:

FEATURES

1553 Bus Monitor (MT) • IRIG-106 Chapter 10 Compatibility • Filter Based on RT Address, T/R bit, Sub-Address • Advanced Bit Level Error Detection to Isolate Bus Failures

ĄĄ 1x Mini PCI Express Gen 1.0

1553 Remote Terminal (RT) • Emulate up to 32 RT Addresses Simultaneously • Multiple Buffering Techniques • Programmable Command Illegalization • Programmable Busy by Sub-address

ĄĄ BC or Multi-RT with Concurrent Bus Monitor

1553 Bus Controller (BC) • Streaming and Minor/Major Frame Scheduling of Messages • High and Low Priority Asynchronous Message Insertion • Modify Messages or Data while BC is running

ĄĄ Optional 8 I/O Lines

ĄĄ Dual Independent Dual Redundant MIL-STD-1553 Channel ĄĄ Two independent DDC Total-AceXtreme® Engine ĄĄ Programmable Bus Controller, Remote Terminal or Bus Monitor ĄĄ Supports MIL-STD-1553 A/B and MIL-STD-1760 ĄĄ IRIG-106 Chapter 10 MT Support ĄĄ Optional Digital Irig Input ĄĄ Support for Linux®, Windows®, VxWorks ®drivers smallformfactors.opensystemsmedia.com/p372660  Support@Alphitech.com  480-838-2428

ALPHI Technology Corporation www.Alphitech.com

SBCs and Boards

ArcticEdge/iMX6 Connect Tech’s ArcticEdge/iMX6 is designed to take you beyond the development phase of your project. ArcticEdge’s low-power, high performance design and extended temperature range make it a practical choice for taking your application from development to deployment.

FEATURES

The i.MX6Q 800MHz Cortex-A9 processor gives the reliability needed

ĄĄ HDMI and LVDS Display Outputs

for long life critical applications.

ĄĄ i.MX6 Quad Core 800MHz ARM Cortex-A9 Processor ĄĄ Linux and Android BSP’s Available ĄĄ Extended Temperature Range, -40° C to +85° C

smallformfactors.opensystemsmedia.com/p372502

Connect Tech Inc.

www.connecttech.com/ArcticEdge 28 y



sales@connecttech.com www.connecttech.com

Spring 2015 | PC/104 and Small Form Factors Resource Guide

 519-836-1291 | 800-426-8979 twitter.com/connecttechinc



www.smallformfactors.com

SMARC/SL Connect Tech’s SMARC/SL carrier board is ideal for your low power application. SMARC/SL has the ability to use both +3.3V and +1.8V SMARC Modules, a single Mini-PCIe/mSATA with External SATA switching, Gigabit Ethernet, HDMI Video, and MIPI CSI Camera interface. SMARC/SL supports an extended temperature range of -40° C to +85° C and offers a very small footprint; ideal for mobile or

FEATURES

stationary applications.

ĄĄ Super Small Form Factor ĄĄ Feature Packed (HDMI, SATA, 2-Lane MIPI CSI Camera Interface) ĄĄ External SATA/mSATA Switching Circuitry ĄĄ Single Wide Range Input Voltage +6V to +36V DC

smallformfactors.opensystemsmedia.com/p372503

Connect Tech Inc.

www.connecttech.com/Smarc



sales@connecttech.com www.connecttech.com

 519-836-1291 | 800-426-8979 twitter.com/connecttechinc



SBCs and Boards

Industrial Temperature iPac-9X25 Designed and manufactured in the USA, the iPac-9X25 is a Webenabled microcontroller with the ability to run an embedded server and to display the current monitored or logged data. The Web connection is available via two 10/100-Base-T Ethernet ports or 802.11 wireless Wi-Fi networking when using the proper Linux modules and adapters. This microcontroller has all connectors brought out as headers on the board and has the same footprint of a standard PC/104 module at 3.77" x 3.54". The iPac-9X25 is perfectly suited for Industrial Temperature Embedded Data Acquisition and Control applications. Pricing for Qty 1 is $198.

FEATURES ĄĄ Atmel AT91SAM9x25 400 Mhz Processor ĄĄ 128MB DDR2 RAM, 4GB eMMC, 16MB Serial Data Flash, Micro SD ĄĄ 20 General Purpose Digital I/O lines, 16 SPI I/O Expander Based

Digital I/O, and 8 High Drive Digital Outputs

ĄĄ 2x USB 2.0 (High-Speed) Host Port, 1x USB 2.0 (Full-Speed) Host Port

1x USB 2.0 (High-Speed) Device Port, 1x CAN Bus

ĄĄ 3x RS232, 1x RS232/422/485, 2x 10/100 Ethernet ĄĄ Up to 7 channels of 10 bit A/D, Up to 4 16-bit PWMs ĄĄ Industrial operating range of -40C to +85C smallformfactors.opensystemsmedia.com/p372029

EMAC, Inc.

www.emacinc.com/products/pc_compatible_sbcs/IPAC-9X25 www.smallformfactors.com

info@emacinc.com www.emacinc.com 

 618-529-4525

PC/104 and Small Form Factors Resource Guide | Spring 2015

y 29

PC/104 and Small Form Factors Resource Guide

SBCs and Boards

PC/104 and Small Form Factors Resource Guide

SBCs and Boards

Expandable Intel Core i7 Mission Computer RTD’s robust Intel Core i7 CPU offers high-performance for rugged applications in extended temperature environments. Choose from single-core, dual-core, and quad-core configurations. These fanless systems feature a synchronized power supply, an integrated 2.5-inch SATA carrier, and standard I/O including Gigabit Ethernet, USB, Serial, SVGA, DisplayPort, and programmable digital I/O. The CPU is designed with soldered SDRAM and solid-state flash storage for high shock and vibration situations. The stackable PCIe/104 architecture allows system expandability for additional DAQ, I/O, storage, and network functionality. The Core i7 systems are compatible with RTD’s complete line of data acquisition and peripheral modules. Tailored solutions include conformal coating, watertight enclosures with cylindrical MIL-SPEC connectors, and a variety of custom mounting, LED, and paint options.

FEATURES Modular, scalable Intel Core i7 mission computer Quad-core, dual-core, and single-core configurations 1.5 – 2.1 GHz Processors with up to 3.1 GHz Turbo Boost Dual-Channel DDR3 SDRAM (Surface-Mounted) 32GB surface-mounted industrial-grade SATA flash drive Ideal for extended temperature environments Optional stackable, modular chassis milled from solid T-6061 aluminum with standard PC or cylindrical connectors and user-defined pinouts ĄĄ Optional watertight configurations with EMI suppression and RF isolation ĄĄ Board-level and enclosure customizations available ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ

smallformfactors.opensystemsmedia.com/p372481  sales@rtd.com  814-234-8087

RTD Embedded Technologies, Inc. www.rtd.com

SBCs and Boards

Dual ARM CPU arrives on PC/104 and takes full advantage of the new OneBank family member EMC2-DP The EMC2-DP™ is a PCIe/104 OneBank™ ARM+FPGA board that can be stacked with other boards to provide CPU Host Processing or dedicated I/O functions. The default version of the EMC2-DP is using the Xilinx Zynq Z7015 FPGA with integrated Dual-Core FPGA, but can also be populated with other “System-on-Module” solutions, conforming to the 4x5 formfactor. The EMC2-DP will integrate into Sundance’s “Blades-for-PC/104” of stackable enclosures to build scalable solutions for ANY Embedded Solution.

FEATURES ĄĄ PCIe/104 OneBank™ Carrier Board ĄĄ Dual Core AMR9 and Xilinx Artix-7 FPGA ĄĄ 96mm x 90mm without I/O Expansion board ĄĄ Compatible with stackable PC/104® concept ĄĄ Fully Compatible with VITA57.1 FMC-LPC™ ĄĄ 1x MGT Serial Link to VITA57.1 FMC-LPC™ ĄĄ 68x I/O on the VITA57.1 FMC-LPC™ smallformfactors.opensystemsmedia.com/p372680

Sundance Multiprocessor Technology Ltd www.sundance.com/emc2 30 y

Spring 2015 | PC/104 and Small Form Factors Resource Guide



Flemming.C@Sundance.com

 +44 1494 793167

 uk.linkedin.com/pub/flemming-christensen/0/987/649/en  @OneCrazyDane

www.smallformfactors.com

PPM-C407 – Low Power PC/104 SBC with Long Term Availability The PPM-C407 from WinSystems utilizes the E3800 family of Atom™ processors from Intel® to provide low power and performance in the versatile PC/104 form factor. Designed for harsh environments and reliability, it includes soldered RAM for added shock and vibration resistance with an operating temperature range from -40°C up to +85°C.

FEATURES ĄĄ Multi-Core Intel® Atom™ E3800 Processors ĄĄ Up to 2 GB Soldered Down DDR3 RAM

WinSystems is offering the PPM-C407 in multi-core options depending on the application requirements. The scalable performance allows you to choose between low power single-core and higher performance dual or quad-core solutions.

ĄĄ Two Fully Independent Displays (VGA, DisplayPort & LVDS)

Linux, Windows, and other x86 operating systems can be booted from the CFAST, mSATA, or USB interfaces, providing flexible data storage options.

ĄĄ 24 Bidirectional GPIO with event sense

ĄĄ 1 Gb Ethernet Controller ĄĄ Fanless -40° to +85°C operational temperature ĄĄ 4 Serial Ports and 4 USB 2.0 ports ĄĄ Bus Expansion: MiniPCIe, PC/104 & PC/104-Plus ĄĄ Bootable SATA, CFAST, and mSATA smallformfactors.opensystemsmedia.com/p372685

WinSystems

www.winsystems.com



info@winsystems.com

 817-274-7553

 www.linkedin.com/company/winsystems-inc-  twitter.com/WinSystemsInc SBCs and Boards

PPM-N409 – Dual PC/104-Plus Ethernet with SFP Interface The PPM-N409-2 PC/104-Plus Dual Ethernet module features Small Form Factor Pluggable (SFP) transceivers, controlled by dual Intel® I210 Ethernet Controllers, bringing the latest in technology to your legacy design. Both module housings are compatible with the large variety of SFP transceivers that range from optical single mode, optical dual mode, and GbE twisted pair copper. The small form factor and negligible heat signature of the PPM-N409-2 makes it ideal for installation in confined spaces. Combined with its exceptional range of operational temperatures, low physical profile, and rugged design, the PPM-N409-2 can be deployed in even the most demanding environments. Give your systems the advantage of compact design, low power consumption, and high precision time synchronization of the PPM-N409-2 Ethernet controller from WinSystems. Custom design options are available upon request.

FEATURES ĄĄ Intel® I210 Ethernet Controllers ĄĄ Two Fully Independent Ethernet Connections ĄĄ Small Form Factor Pluggable (SFP) Interface ĄĄ Accepts the Wide Range of SFP Ethernet Modules ĄĄ Fanless -40° to +85°C operational temperature ĄĄ PC/104-Plus Form Factor ĄĄ IEEE 1588 Precision Time Synchronization over Ethernet ĄĄ Robust Communication over Long Distances ĄĄ Supports Linux, Windows, and DOS Operating Systems smallformfactors.opensystemsmedia.com/p372686

WinSystems

www.winsystems.com www.smallformfactors.com



info@winsystems.com

 817-274-7553

 www.linkedin.com/company/winsystems-inc-  twitter.com/WinSystemsInc PC/104 and Small Form Factors Resource Guide | Spring 2015

y 31

PC/104 and Small Form Factors Resource Guide

SBCs and Boards

PC/104 and Small Form Factors Resource Guide

SBCs and Boards

SBC35-C398Q – Industrial ARM® SBC with Real-Time Linux Designed for industrial applications and long-term availability, WinSystems’ SBC35-C398Q SBC features a quad-core ARM® processor with options for expansion and customization. The combination of processing power and industrial I/O provides a flexible solution for a number of applications including security, industrial control, medical, transportation and MIL/COTS. This low-power design operates from -40° to +85°C without a fan or heatsink for improved reliability. Kick-start development with our SD Cards, available preloaded with our newly released real-time Linux distribution or Android™. Our factory engineers offer technical support from pre-sales through production.

FEATURES ĄĄ Freescale® i.MX 6™ Quad-core ARM® Cortex™-A9 Processors ĄĄ Fanless -40° to +85°C operational temperature ĄĄ Powered by PoE or +10-50VDC Input ĄĄ 10/100/1000 Ethernet with IEEE-1588™ ĄĄ USB 2.0 and USB On-The-Go Ports ĄĄ FlexCAN and RS-232/422/485 Serial Ports ĄĄ 24 GPIO tolerant up to 30VDC ĄĄ Mini-PCIe and IO60 (I2C, SPI, TTL, and PWM) expansion smallformfactors.opensystemsmedia.com/p372204

WinSystems

www.winsystems.com



info@winsystems.com

 817-274-7553

 www.linkedin.com/company/winsystems-inc-  twitter.com/WinSystemsInc SBCs and Boards

SBC35-CC405 – Industrial Small Form Factor Computers The SBC35-CC405 series of small form factor computers utilizes the Intel® Atom™ E3800 family of processors in a standard 3.5-inch SBC format. The COM Express based solution includes two Gigabit Ethernet controllers with IEEE 1588 time-stamping, two serial channels, USB 3.0, and +10 to +50V DC input.

FEATURES ĄĄ Multi-Core Intel® Atom™ E3800 Processors

Engineered for rugged applications, the low-profile thermal solution creates a sturdy base that protects the PCB assembly, provides convenient mounting, and enables fanless extended temperature operation.

ĄĄ Up to two independent displays (VGA, LVDS and DisplayPort)

Linux, Windows, and other x86 operating systems can be booted from the CFAST, mSATA, or USB interfaces, providing flexible data storage options. WinSystems provides driver for Linux and Windows 7/8, as well as pre-configured operating systems.

ĄĄ Four USB ports (1xUSB 3.0 and 3xUSB 2.0)

ĄĄ Two Ethernet Controllers with IEEE 1588 time stamping ĄĄ Two RS-232/422/485 Serial ports ĄĄ Bus Expansion (Two MiniPCIe and IO60) ĄĄ Bootable SATA, CFAST, and mSATA ĄĄ Wide range 10 to 50V DC input ĄĄ Fanless -40° to +85°C operational temperature smallformfactors.opensystemsmedia.com/p372206

WinSystems

www.winsystems.com 32 y



info@winsystems.com

 817-274-7553

 www.linkedin.com/company/winsystems-inc-  twitter.com/WinSystemsInc

Spring 2015 | PC/104 and Small Form Factors Resource Guide

www.smallformfactors.com

ADLMES-8200 – High-Ingress Protection (IP) Modular Enclosure Systems The ADLMES-8200 is a highly innovative embedded enclosure design. Its highly configurable modularity makes it possible to expand or reduce a system without replacing the entire enclosure. Side wall modules may be added or removed as system requirements evolve. Three standard profiles provide quick turn inventory availability. A broad portfolio of PC/104 SBC Options Ranging from low-power Intel® Atom™ to high performance 4th Generation Intel Core i7 Processors are available.

FEATURES ĄĄ Modular Sidewall Design Supports Variable PC/104 Stack Heights

(2 - 6 Cards) or Expanded 3.5" SBC Intelligent Systems

ĄĄ High and Low IP (Ingress Protection) Systems Possible via High IP,

Modular Chassis Design Coupled with Full Custom, Quick-Turn I/O Panels

Potential aPPlications include: • • • • • • •

Rugged Industrial Applications Communications Applications Mobile Routers and Other Network Appliances Military and Defense – Rugged SFF Railway Train Control Transportation Imaging Applications

ĄĄ Broad Portfolio of PC/104 SBC Options Ranging from Low Power

Intel® E3800 Atom™ to High Performance 4th Generation Intel Core i7 Processors

ĄĄ Fully Supported by ADL Embedded Solutions’ Team of Solidworks

Engineers for Model and or Design Support

ĄĄ Options for MIL-STD 810, MIL-STD 461, and MIL-STD 704/1275 smallformfactors.opensystemsmedia.com/p372181  sales@adl-usa.com  858-490-0597

ADL Embedded Solutions Inc. www.adl-usa.com

Systems

NIU1A – Embedded I/O System – Nano Interface Unit I/O Interface with optional ARM1 Processor Configure to Customize

FEATURES

The NIU1A is a small, rugged, low-power system. It consists of an integrated power supply, one function slot that can be configured with a field-proven NAI intelligent I/O and communications function module and an optional ARM Cortex-A9 processor. Ideally suited for rugged Mil-Aero applications, the NIU1A delivers off-the-shelf solutions that accelerate deployment of SWaP-optimized systems in air, land and sea applications.

Supports 1 Intelligent I/O function module 2x 10/100/1000 Base-T Ethernet 1.5"H x 1.7"D x 6.8"L @ 16 oz. (454 g) with 3 mounting options 128 MB DDR3 SDRAM Optional ARM Cortex™-A9 Dual Core 800MHz Processor 4 GB SATA II NAND Flash (up to 32 GB option) < 15 W power dissipation Wind River® Linux, VxWorks®, Altera Linux OS Support 1x RS232 Continuous Background BIT Operating temp: -40°C to +71°C conduction cooled Made in the USA Certified Small Business ĄĄ 28 VDC input ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ

Architected for Versatility NAI’s Custom-On-Standard Architecture™ (COSA™) offers a choice of over 40 intelligent I/O and communications options. Pre-existing, fully-tested functions can be selected to quickly and easily meet system requirements. Individually dedicated I/O and communications processors allow mission computers to manage, monitor and control via single or dual Ethernet. All products are designed to operate under extreme temperature, shock, vibration and EMI environments. EMI filters and gaskets meet or exceed MIL-STD-461F and MIL-STD-810G requirements.

smallformfactors.opensystemsmedia.com/p372667

North Atlantic Industries, Inc. www.naii.com

www.smallformfactors.com

www.naii.com  631-567-1100 

PC/104 and Small Form Factors Resource Guide | Spring 2015

y 33

PC/104 and Small Form Factors Resource Guide

Systems

PC/104 and Small Form Factors Resource Guide

Systems

Scalable GigE Switch Family RTD’s scalable Gigabit Ethernet Switch Family maximizes network connectivity and system flexibility to create IoT solutions in rugged -40° to +85°C environments. Our 8-port host module can connect directly to the PCIe/104 bus, or it can be used as a standalone GigE switch. The total number of Ethernet ports can be increased using 8-port expansion modules. Configured with RTD’s 88-watt synchronous power supply, a single system will support up to 56 total ports. In board-level configurations, users can choose from RJ-45 jacks or 10-pin DIL connectors. RTD’s rugged, enclosed packaging can be configured with RJ-45 jacks or 37-pin D-sub receptacles.

FEATURES ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ

Eight 1000/100/10 Mbps Ethernet ports per slice Boards/slices stack together to increase total GigE ports 10-pin DIL, 37-pin D-sub, or RJ-45 connectors BroadCom BCM53115 Unmanaged Gigabit Ethernet Switch Intel WG82574IT PCI Express Ethernet Controller for interface to optional host CPU Jumbo Frame Support (up to 9018 bytes) Auto MDI crossover Onboard LEDs Connectors for external LEDs Passive heat sinks included Available in stackable, rugged enclosures Fanless -40° to +85°C operating temperatures smallformfactors.opensystemsmedia.com/p372480

 sales@rtd.com  814-234-8087

RTD Embedded Technologies, Inc. www.rtd.com

Systems

Themis High-Density Servers Suited for computing environments where server Size, Weight, and Power (SWAP) is important, Themis RES High Density (HD) servers are designed for virtualization, ISR, Big Data Analytics, radar processing, image processing, large Hadoop clusters, and a multitude of applications that require high-compute density and low latency access to large-data storage. RES HD Servers double compute density, enable a 50% savings in rack space, and reduce system weight by nearly 50% with per server weights as low as seven pounds. Available in a 2RU (four bay) or 3RU (six bay) chassis, RES-HD servers provide maximum system configuration flexibility and functionality with processor, storage, high-speed switch, and system management module options. Combining leading-edge components that include Intel® Xeon® E5-2600 v3 Series processors and SuperMicro motherboards, RES servers feature expansion slots, extensive high-speed front or rear I/O, storage, and enhanced reliability options.

FEATURES ĄĄ SWAP-C Ready ĄĄ 2RU or 3RU Chassis Options ĄĄ Intel® Xeon® E5-2660 v3 Series processors, and Supermicro

X9DRT-IBFF motherboards

ĄĄ Supports up to three 56 Gb/sec Infiniband (IB) or 40 Gbm Ethernet ports

to provide industry leading I/O bandwidth

ĄĄ Maximum system configuration and expansion flexibility with processor, ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ

storage, high-speed switch, and system management modules options Enhanced reliability for shock, vibration, and extended temperature 0° C to 55° C operating temperature range 8% to 90% operating humidity (non-condensing) Operating vibration: 4.76 Grms, 5Hz to 2000Hz (SSD) MIL-STD 810F, EN60000, CE Mark

smallformfactors.opensystemsmedia.com/p372688

Themis Computer

www.themis.com/hd 34 y



www.themis.com/headquartersandsales

 linkedin.com/company/17952

Spring 2015 | PC/104 and Small Form Factors Resource Guide

 510-252-0870

 twitter.com/Themis_Computer www.smallformfactors.com

SYS-398Q – Enclosed Industrial ARM with Real-Time Linux WinSystems’ SYS-398Q quad-core industrial computer combines highperformance multimedia graphics with a rich mixture of Industrial I/O. The Freescale® i.MX 6Q™ processor’s integrated power management provides excellent efficiency and allows operation from -40° to +85°C without active cooling. It is designed for demanding graphics applications in security, transportation, medical, and digital signage. The low power, high-performance of ARM® cores coupled with readily available software tools make them an excellent choice for embedded systems. Leveraging Freescale’s proven track record in long term product support with the operating system and application development driven by consumer ARM® devices, the SYS-398Q is ideal for off-the-shelf industrial designs. WinSystems OS starter image now ships with real time patches applied to the Linux kernel for improved determinism in process control applications.

FEATURES ĄĄ Freescale® i.MX 6Q™ Industrial Processor @ 800MHz ĄĄ Fanless -40° to +85°C operational temperature ĄĄ Powered by PoE or +10-50VDC Input ĄĄ High Performance Video and Graphics ĄĄ Gigabit Ethernet (GbE) with IEEE-1588 ĄĄ Six USB 2.0 Ports and One USB On-The-Go Port ĄĄ Two CAN Ports ĄĄ Five (RS-232/422/485) Serial Ports up to 1Mbps ĄĄ 24 Lines GPIO Tolerant up to 30V DC ĄĄ CFAST, SD, and MicroSD Sockets smallformfactors.opensystemsmedia.com/p372687

WinSystems

www.winsystems.com



info@winsystems.com

 817-274-7553

 www.linkedin.com/company/winsystems-inc-  twitter.com/WinSystemsInc Systems

SYS-405 – Rugged Industrial Computers The SYS-405 series of industrial computers utilizes the Intel® Atom™ E3800 family of processors in a tough aluminum enclosure. The solutions includes two Gigabit Ethernet controllers with IEEE 1588 time-stamping, two serial channels (RS-232/485/422), four USB, audio, and +10 to +50V DC input. The rigid enclosure base is engineered for rugged applications and provides the thermal solution for the processor. The 5052 aluminum alloy enclosure protects the PCB assembly and includes access to the CFAST connector. Linux, Windows, and other x86 operating systems can be booted from the CFAST, mSATA, or USB interfaces, providing flexible data storage options. WinSystems provides driver for Linux and Windows 7/8, as well as pre-configured operating systems.

FEATURES ĄĄ Multi-Core Intel® Atom™ E3800 Processors ĄĄ Up to two independent displays (VGA and DisplayPort) ĄĄ Two Ethernet Controllers with IEEE 1588 time stamping ĄĄ Two RS-232/422/485 Serial ports ĄĄ Internal Bus Expansion (Two MiniPCIe and IO60) ĄĄ Four USB ports (1xUSB 3.0 and 3xUSB 2.0) ĄĄ Bootable SATA, CFAST, and mSATA ĄĄ Wide range 10 to 50V DC input ĄĄ Fanless -40° to +85°C operational temperature smallformfactors.opensystemsmedia.com/p372202

WinSystems

www.winsystems.com www.smallformfactors.com



info@winsystems.com

 817-274-7553

 www.linkedin.com/company/winsystems-inc-  twitter.com/WinSystemsInc PC/104 and Small Form Factors Resource Guide | Spring 2015

y 35

PC/104 and Small Form Factors Resource Guide

Systems

Small Form Factor Computers Intel® Atom™ E3800 and i.MX6 CPUs Fanless -40° to +85°C Operation Mini PCIe and IO60 Expansion

PC/104 Single Board Computers Rugged, Stackable Form Factor I/O Modules and Power Supplies

Industrial Computer Systems Off-the-shelf and Custom Solutions Fanless -40° to +85°C Operation

Single Board Computers COM Express Solutions Power Supplies I/O Modules Panel PCs

Accelerate Your Product Development Cycle

Speed up time-to-market with embedded solutions from WinSystems. Our industrial computers include expansion options, so customers can expedite prototyping and integration without the burden of CPU or carrier board design. These proven hardware platforms also provide the building blocks to create customized, application-specific designs. Products are in stock and available for immediate shipment from our Arlington, Texas facility. Let our factory Application Engineers accelerate your capabilities.

715 Stadium Drive I Arlington, Texas 76 011 Phone: 817-274-7553 I Fax: 817-548-1358 info@winsystems.com

Call 817-274-7553 or visit www.winsystems.com. Ask about our product evaluation!