Design and Analysis of Modified Cold Plate for Maximum Heat Transfer Rate by IJSTE

IJSTE - International Journal of Science Technology & Engineering | Volume 4 | Issue 6 | December 2017 ISSN (online): 2349-784X

Design and Analysis of Modified Cold Plate for Maximum Heat Transfer Rate Kale Nikhil Kantaram UG Student Department of Mechanical Engineering JSPM’s RSCOE, Pune, India

Gore Umesh Achyutrao UG Student Department of Mechanical Engineering JSPM’s RSCOE, Pune, India

Khedkar Prashant Ranjit UG Student Department of Mechanical Engineering JSPM’s RSCOE, Pune, India

Shinde Sunil Dattatray UG Student Department of Mechanical Engineering JSPM’s RSCOE, Pune, India

Prof. A R Pawar Assistant Professor Department of Mechanical Engineering JSPM’s RSCOE, Pune, India

Abstract For cooling electronic systems new techniques are invented. Cold plate is liquid cooling system used in electronic components. In present work, the modification is done in design of cold plate to reduce its cost and also to increase the heat dissipation rate. Water at various flow rates is supplied for given power inputs and heat removing capacity of each flow rate at that particular heat load is calculated. It is found that water is best working fluid for all flow rates. Methanol and acetone are best suited for high mass flow rates. The cold plate is used to provide a “cold wall” to which individual electronic components are mounted. The design and performance evaluation of a cold plate follows a prescribed procedure that depends on the heat loading and whether the heat loading is on one or two sides of the cold plate. Due to transmission of applied current and voltage sometimes the temperature of the circuit plate goes increasing. This temperature limits the electronic operation. Thus it is necessary to control such temperature, in order to maintain speed of electronic devices. Keywords: Liquid Cooling, Cold Plates, Temperature, Heat Transfer, Electronic Applications ________________________________________________________________________________________________________ I.

INTRODUCTION

The convective heat exchange takes place by cold plate. The cold plate is simply a plate having grooves at different orientations. The plate is formed by copper and aluminum material and is mounted at surface below the electronic device. The coolant flows from the grooves at specific flow rate. The cooling is done by exchanging heat from lower surface of circuit to the coolant, rising the temperature of coolant. This plate is mounted at the surface below electronic circuit. Usually coolant is water or mixture of water and refrigerant and flows from the grooves at specific flow rate. The cooling is processed by exchanging heat from surface of circuit to the coolant, so that there is increase in the temperature of coolant. The importance of this heat transfer phenomenon is its low cost of implementation and natural occurrence. However, free convective flows are complex to control because they depend on different parameters such as the thermo-physical properties of the fluid and the geometry of the body shape. II. LITERATURE REVIEW A Review on Design and Development of Cold Plate Used In CPU Cooling - Sandashiv Soni S., Koli Tushar, V. H. Patil. Liquid cooling of high-power electronic devices requires unique solutions. Each task has its own target temperatures and design constraints that provide challenges for thermal design. Some of the thermal design issues manufacturing constraints and cost considerations are included. A decision tree of design choices outlined in the process for arriving at an optimum design. A review on Transient Heat Flow Analysis of Cold Plate Used in Electronic Power Cooling Systems - S. K. Bhalerao, Dr .S. I. Kolhe. In this paper author has conducted experimental study on two different models of cold plates having different parameters. The values of outlet temperatures of cooling water are compared with theoretical values and finite element analysis values. The physical attributes appeared are distinctive in every model.

Design and Analysis of Modified Cold Plate for Maximum Heat Transfer Rate (IJSTE/ Volume 4 / Issue 6 / 016)

Performance Improvement on Water-cooled Cold-Plate - Shyan-Fu Chou, Heng-I Lin, & Yi-Ping Wang. Author conducted experimental study and found that we can use the simple flow channel design to increase the contacting time duration of water in the cold-plate and obtains greater heat transfer rate instead of using double spiral channel. By using whirling channels, even at high speeds we can achieve high contact time. As the water flow in the swirling channel cold-plate goes through a narrow gap and into the flow-collecting cavity, spray of water may be formed to cause phase change and then take more heat away. Flow Boiling Heat Transfer in Micro- channel Cold Plate Evaporators for Electronics Cooling - Stefan S. Bertsch, ckhard A. Groll, Suresh V. Garimella. An experimental study was carried out to investigate the heat transfer coefficient during refrigerant flow boiling in cold plate. The heat transfer coefficient peaks at a thermodynamic vapor quality of approximately 20% and decreases significantly with increasing vapor quality. The heat transfer coefficient shows a strong increase with increasing heat flux. Micro-channel Cold Plate Units for Cooling Super Computer - Masahiro Matsuda, Koichi Mashiko, Yuji Saito, Thang Nguyen, and Tien Nguyen The module has a micro-channel fin structure to efficiently transfer heat. Author has developed a new brazing process for mechanical durability under high pressure to respond to the requirement of high mechanical strength of the brazed cold plate. Also author has met customer requirements such as high thermal performance and downsizing for high-density servers of the super computer. Optimization of Liquid Cold Plates Using Computational Fluid Dynamics - P.Sivakumar, P.Srihari and Prof. N.HariBabu. The Analysis has been carried out for the form tube, machined channel and deep drilled cold plates. Heat removal rate is more in deep drilled cold plate. When comparing the weights of three cold plates, deep drilled cold plate have less in weight, than other two cold plates. Author concludes that deep drilled cold plate can be adopted for heavy electronic equipment and naval applications. Evaluation of Liquid Cooling Plate through CFD Analysis - Dupati Ramesh Babu1 and V. Krishna Reddy. In this project design optimization of the cold plates used in defense power electronics was done. Author used two models of cold plate and design optimization of the cold plate was done to achieve the temperature of less than 85 degrees, which is a design constraint. Optimization is done by changing the profile of flow channels, keeping inlet and outlet diameters constant. Liquid Cooled Cold Plates for Industrial High-Power Electronic Devices-Thermal Design and Manufacturing Considerations - Satish G. Kandlikar and Clifford N. Hayner Ii. In this paper author has explained how flow misdistribution has the potential of causing a catastrophic failure of a cold plate few solutions on liquid cooling of high-power electronic devices are presented in this paper. Each experiment in this article has its own target temperatures and design constraints, which provide challenges for the thermal designers. A decision tree of design choices is outlined in the process for arriving at an optimum design. The Design of Cold Plates for the Thermal Management of Electronic Equipment - E. M. Sparrow, John Patrick Abraham. Author has decided to focus on two main topics in this paper. The first is the fluid flow and heat transfer and another is heat transfer enhancement technique. Various experiments were performed to understand the pattern of temperature on the surface of cold plate. They found that a hotspot gets developed having high temperature at heat load sites. They also focused on hat spreading capability of walls of cold plate. Thermal Management of Electric Machines - Yinye Yang, Matthias Preindl, N. Schofield. This paper includes different aspects related to electric machine thermal management. Different approaches of thermal analysis and cooling techniques are included in this paper. This paper is reference guideline for machine designers who are interested in thermal management and thermal researchers who are interested in machine technologies. REFERENCES [1] [2] [3] [4]

Sandashiv Soni S., Koli Tushar, V. H. Patil - A Review on Design and Development of Cold Plate Used In CPU Cooling.ISSN 2250-2459, ISO 9001:2008 certified journal, Volume 7, Issue 7, July 2017. S. K. Bhalerao, Dr .S. I. Kolhe - A review on Transient Heat Flow Analysis of Cold Plate Used in Electronic Power Cooling Systems. ISSN 2347-6435(Online) Volume 5, Issue 12, December 2016 Shyan-Fu Chou, Heng-I Lin, & Yi-Ping Wang. Performance Improvement on Water-cooled Cold-Plate - 4th WSEAS International Conference on Heat and Mass Transfer, Gold Coast, Queensland, Australia, January 17-19, 2007 Stefan S. Bertsch, ckhard A. Groll, Suresh V. Garimella - Flow Boiling Heat Transfer in Micro- channel Cold Plate Evaporators for Electronics Cooling. â&#x20AC;&#x2DC;(2008) International Refrigeration and Air Conditioning Conference. Paper 962â&#x20AC;&#x2122;.

Design and Analysis of Modified Cold Plate for Maximum Heat Transfer Rate (IJSTE/ Volume 4 / Issue 6 / 016) Masahiro Matsuda, Koichi Mashiko, Yuji Saito, Thang Nguyen, and Tien Nguyen - Micro-channel Cold Plate Units for Cooling Super Computer. ‘Fujikura Technical Review, 2015’. [6] P.Sivakumar, P.Srihari and Prof. N.HariBabu - Optimization of Liquid Cold Plates Using Computational Fluid Dynamics.’ (IJETT) – Volume 27 Number 5 - September 2015’ [7] Dupati Ramesh Babu and V. Krishna Reddy - Evaluation of Liquid Cooling Plate through CFD Analysis. ISSN 2319-5991, Vol. 3, No. 4, November 2014 [8] Satish G. Kandlikar and Clifford N. Hayner Ii - Liquid Cooled Cold Plates for Industrial High-Power Electronic Devices-Thermal Design and Manufacturing Considerations ‘Heat Transfer Engineering, 30: 12, 918— 930’ [9] E. M. Sparrow, John Patrick Abraham - The Design of Cold Plates for the Thermal Management of Electronic Equipment.’ DOI: 10.1080/01457630600742308’. [10] Yinye Yang, Matthias Preindl, N. Schofield - Thermal Management of Electric Machines. ‘DOI: 10.1049/iet-est.2015.0050’. [5]