APC - LAYER CONTROL

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APC - LAYER CONTROL ADVANCED PROCESS CONTROL TECHNOLOGY IN EVAPORATION & SPUTTER


APC - LAYER CONTROL Evatec’s know how for its BAK Evaporation & Radiance Sputtering Cluster platforms brings enhanced levels of layer control for processing of compound & power semiconductors, MEMS & optoelectronics. LAYER THICKNESS TERMINATION - Quartz monitoring solutions for single or co-deposition with enhanced sampling for higher accuracy in deposition of metal single layers and stacks - Broadband optical monitoring with direct measurement and control of layer optical properties for high precision dielectric stacks

6 or 12 way quartz heads on the BAK evaporation platform

FILM STOICHIOMETRY - “In situ” plasma emission monitoring (PEM) in sputter processes manages film stoichiometry for dielectrics and TCO deposition processes - Benefit from deposition of fully oxidised films at high rate for maximum throughput

Cathode technology with PEM and closed loop gas control for film stoichiometry management

ELECTRICAL PROPERTY MEASUREMENT - Direct measurement of film electrical properties during the deposition cycle - Layer termination at optimum film performance for highest yield and lowest thin film production costs

“In situ” electrical property measurement on Radiance cluster

Evatec Ltd. Lochrietstrasse 14 CH-8890 Flums Switzerland

Tel: + 41 81 720 1080 Fax: + 41 81 720 1081 info@evatecnet.com www.evatecnet.com

Product descriptions, photos and data are supplied within the brochure for general information only and may be superseded by any data contained within Evatec quotations, manuals or specifications.


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