MICROPROCESADORES Trabajo de Informatica
Intel Dual Core E6800 3.3GHz FSB1066 2MB Box 775 – Procesador
Specifications:
• • • • • • • • •
Type CPU / Microprocessor Family Intel Pentium Dual-Core Model number E6800 Frequency (MHz) 3300 Bus speed (MHz) 1066 Package 775-pin Flip Chip Land Grid Array (FC-LGA8) 1.48" x 1.48" (3.75 cm x 3.75 cm) Socket Socket 775 (LGA775) Architecture / Microarchitecture o Processor core Wolfdale-3M o Manufacturing process 0.045 micron o Data width 64 bit o Number of cores 2 o Floating Point Unit Integrated o Level 1 cache size ? 2 x 32 KB instruction caches o 2 x 32 KB data caches o Level 2 cache size ? shared 2 MB o Features MMX instruction set SSE SSE2 SSE3 Supplemental SSE3 EM64T technology Execute Disable Bit
Virtualization technology o Low power features Halt mode Extended Halt mode Stop Grant mode Extended Stop Grant mode Sleep mode Deep Sleep mode Deeper Sleep mode Enhanced SpeedStep technology
• Electrical/Thermal parameters o Thermal Design Power (W) 65
Intel Core 2 Duo E8400 3.00GHZ FSB1333 6MB Box 775 – Procesador
• • • • • • • • •
Núcleo de Procesador Doble núcleo Velocidad de Reloj 3,0GHz Front Side Bus 1333MHz Memoria Caché 6MB L2 Arquitectura 64 bits Microarquitectura de núcleo Tecnología del Procesador 45nm Refrigeración Ventilador y Disipador Características Físicas Formato 775 pins LGA Socket T Versión BOX, incluye ventilador.
Intel Core i7 870 2.93Ghz Box Socket 1156 - Procesador
• • • • • • • • • •
Frequency (MHz) 2933 Socket: Socket 1156 (LGA1156) Processor core: Lynnfield Manufacturing process: 0.045 micron Data width: 64 bit Number of cores: 4 Level 1 cache size: 4 x 32 KB instruction caches, 4 x 32 KB data caches Level 2 cache size: 4 x 256 KB Level 3 cache size: 8 MB Thermal Design Power (W): 95
Intel Core i5 655K 3.2Ghz Box Socket 1156 - Procesador
Specifications:
• • • • • • • • • • • • • •
Processor Number i5-655K # of Cores 2 # of Threads 4 Clock Speed 3.2 GHz Max Turbo Frequency 3.46 GHz Intel® Smart Cache 4 MB Bus/Core Ratio 24 DMI 2.5 GT/s Instruction Set 64-bit Instruction Set Extensions SSE4.2 Embedded Options Available No Supplemental SKU No Lithography 32 nm Max TDP 73 W
Memory Specifications
• Max Memory Size (dependent on memory type) 16 GB • Memory Types DDR3-1066/1333
• # of Memory Channels 2 • Max Memory Bandwidth 21 GB/s • Physical Address Extensions 36-bit Graphics Specifications
• • • • • •
Integrated Graphics Yes Intel® HD Graphics Yes Graphics Base Frequency 733 MHz Intel® Flexible Display Interface (Intel® FDI) Yes Intel® Clear Video HD Technology Yes Dual Display Capable Yes
Intel Core i7 960 3.20Ghz Box Socket 1366 - Procesador
• • • • • • • • • • • • •
sSpec Number: SLBEU CPU Speed: 3.20 GHz PCG: 08 Bus Speed: 4.8 GT/s Bus/Core Ratio: 24 L3 Cache Size: 8 MB Package Type: LGA1366 Manufacturing Technology: 45 nm Core Stepping: D0 CPUID String: 106A5h Thermal Design Power: 130W Thermal Specification: 67.9°C VID Voltage Range:80V-1.375V
Supported Features: Quad Core
• Enhanced Intel Speedstep® Technology
• • • • •
Hyper-Threading Technology 1 Intel® EM64T 2 Intel® Virtualization Technology Enhanced Halt State (C1E) Execute Disable Bit 3
Intel Core i7 975 Xtreme 3.33Ghz Box 1366 - Procesador
Supported Features:
• • • • • • • •
Quad Core Enhanced Intel Speedstep® Technology Hyper-Threading Technology 1 Intel® EM64T 2 Intel® Virtualization Technology Demand Based Switching Enhanced Halt State (C1E) Execute Disable Bit 3
Processor Specifications:
• • • • • • • • • • •
sSpec Number: SLBEQ CPU Speed: 3.33 GHz PCG:08 Bus Speed: 6.4 GT/s Bus/Core Ratio: 25 L3 Cache Size: 8 MB L3 Cache Speed: 3.33 GHz Package Type: LGA1366 Manufacturing Technology: 45 nm Core Stepping: D0 CPUID String: 106A5
• Thermal Design Power:130W • Thermal Specification: 67.9°C • VID Voltage Range: 80V-1.375V