COT’S PICKS

AirBorn launches its all-new SInergy ® line of interconnects. Sinergy ® offers OEMs a mini-modular hybrid solution in 1-5 configurable bays. With speeds up to 25Gbps per lane or 75Gbps aggregate bidi bandwidth, SInergy meets requirements for XAUI, USB 3.0, PCIe Gen 3/4, SAS-3/4, and Ethernet (10G/25G per lane) applications. Exemplifying milgrade resilience, high-speed, high-density SInergy connectors are tested & qualified based on MIL-DTL-83513 performance requirements.

SInergy’s modularity means OEMs have multiple signal-carrying options in any signal or SMPM RF interface configuration in one to five bays. SInergy’s ruggedness, beginning with the contact system design and extending to the metal shell, means it can handle a very rough ride on Earth or in space.

William Rhea, AirBorn’s Sr. Product Manager, describes SInergy ® as “A high-speed connector family with speeds up to 25Gbps. With its single-piece, four points-of-contact design, SInergy’s extreme durability makes it ideal for demanding mil-aero, space, and industrial environments where complete reliability is essential for success.”

AirBorn airborn.com

Teledyne e2v provides a highlyintegrated radiation-tolerant DDR4 memory solution with a Texas Instruments power supply

To help satellite OEMs streamline their system development work and reduce the time and engineering effort involved, Teledyne e2v and Texas Instruments (TI) collaborated on a new radiation-tolerant DDR4 modular platform. This field-proven hardware consists of a 4GB/8 GB DDR4T0xG72 DDR4 memory from Teledyne e2v and a TI TPS7H3301-SP DDR termination low drop-out (LDO) voltage regulator that provides a stable supply for the DDR4 module.

Optimized for implementations with acute size, weight, and power (SWaP) constraints to factor in, the DDR4/TPS7H3301-SP platform is very compact and convenient. The constituent compo- nents have already gone through comprehensive space characterization and qualification procedures to help designers achieve long-term operation without single event latch-up (SEL) and single event upset (SEU) issues arising.

This platform allows elevated levels of data storage capacity to be achieved inside a small form factor. It requires three times less PCB area versus solutions from the competition, and its volume is smaller by a factor of ten.

Versatility is another plus point, with the DDR4T0xG72/TPS7H3301-SP modular platform applicable across a wide range of space-grade processors (including Teledyne e2v and others), FPGAs/ACAPs (such as AMD/Xilinx, Microchip, NanoXplore, etc.) and custom-built ASICs.

TeledyneTechnology teledyne.com