-
Volume 19, Number 2
SUMMER 2015
A Quarterly Publication of The Microelectronics Packaging & Test Engineering Council
iNEMI / MEPTEC / SMTA / OREGON BIOSCIENCE
Medical Electronics Symposium 2015
2015 September 16 & 17 • Portland, OR page 13
+
The IoT (Internet of Things) Hype? Hysteria? or Hypnosis? page 3
MEPTEC MEMBER COMPANY PROFILE Throughout its history, The Electronics Group of Henkel has consistently led the semiconductor and electronics assembly markets with innovative materials that solve challenges and allow for its customers’ next-generation product developments. page 16 INSIDE THIS ISSUE
15 18 Copper, Copper, Everywhere: The Flip Chip Market Shifts to Cu Pillar.
A look at new tools automating the ball-out studies process and the benefits derived from automation.
22
26
The EoPlex CSI Manufacturing Platform – a unique technology in IC packaging. SPRING 2011 MEPTEC
Opening the Door for Technologies Beyond Moore’s Law Report 3