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Handbook

Hermetic Packages Outlines

HD-00112-11 rev1B 2011-11-04 Š 2011 X-REL Semiconductor

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Hermetic Packages Outlines

Table of Contents 1

CERAMIC SIDE BRAZE DUAL-IN-LINE (DIP) ............................................................................................. 3

2

CERAMIC SMALL OUTLINE IC (SOIC) ..................................................................................................... 5

3

SURFACE MOUNT POWER (SMD) ......................................................................................................... 6

4

TRANSISTOR OUTLINE (TO).................................................................................................................. 7

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Hermetic Packages Outlines 1

CERAMIC SIDE BRAZE DUAL-IN-LINE (DIP)

13.21 [0.520]

0.03 [0.001] 8x 0.03 [0.010]

11.43 [0.450]

4x R 0.76 [0.030] 7.87 7.37 [0.310] [0.290]

6.86 [0.270]

XTRPPPPP YYWWANN

1.27 [0.050]

2.16 [0.085]

3.30 [0.130]

8x 4.00 ±0.50 [0.158 ±0.020] 8x 0.46 [0.018]

6x 2.54 [0.100]

SIDE BRAZE DIP8

Dimensions in mm [inches].

19.00 [0.748] 4x R 0.76 [0.030]

7.87 7.37 [0.310] [0.290]

0.03 [0.001] 14x 0.03 [0.010]

11.43 [0.450]

6.86 [0.270]

XTRPPPPP YYWWANN

3.30 [0.130]

2.16 [0.085]

14x 4.00 ±0.50 [0.158 ±0.020] 14x 0.46 [0.018]

12x 2.54 [0.100]

SIDE BRAZE DIP14

HD-00112-11 rev1B 2011-11-04 © 2011 X-REL Semiconductor

Dimensions in mm [inches].

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Hermetic Packages Outlines

20.32 [0.800] 4x R 0.76 [0.030]

0.03 [0.001] 14x 0.03 [0.010]

11.43 [0.450]

7.87 7.37 [0.310] [0.290]

6.86 [0.270]

XTRPPPPP YYWWANN

1.27 [0.050]

2.16 [0.085]

3.30 [0.130]

16x 4.00 ±0.50 [0.158 ±0.020] 16x 0.46 [0.018]

14x 2.54 [0.100]

SIDE BRAZE DIP16

Dimensions in mm [inches]. 30.48 [1.200] 12.52 [0.493]

4x R 0.51 [0.020]

15.49 14.97 [0.610] [0.590]

0.03 [0.001]

12.52 [0.493]

XTRPPPPP YYWWANN

1.27 [0.050]

3.30 [0.130]

2.16 [0.085]

24x 4.00 ±0.50 [0.158 ±0.020] 22x 2.54 [0.100]

SIDE BRAZE DIP24

HD-00112-11 rev1B 2011-11-04 © 2011 X-REL Semiconductor

24x 0.03 [0.010]

24x 0.46 [0.018]

Dimensions in mm [inches].

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Hermetic Packages Outlines 2

CERAMIC SMALL OUTLINE IC (SOIC)

15.40 [0.606] 9.53 [0.375]

4x R 0.13 [0.005]

7.45 [0.293]

0.03 [0.001]

6.73 [0.265]

XTRPPPPP YYWWANN

24x 0.02 [0.008]

0.30 [0.012]

9.00 [0.354]

10.30 ±0.40 [0.406 ±0.016]

0.64 [0.025]

2.41 [0.095]

SOIC24

HD-00112-11 rev1B 2011-11-04 © 2011 X-REL Semiconductor

22x 1.27 [0.050]

24x 0.42 [0.017]

Dimensions in mm [inches].

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Hermetic Packages Outlines 3

SURFACE MOUNT POWER (SMD)

0.05 [0.002] 7.52 [0.296]

4x R 1.00 [0.039]

10.16 [0.400]

2.93 [0.115]

7.45 [0.293]

6.30 [0.248] XTRPPPPP YYWWANN

3.00 [0.118]

SMD-05 (TO-276AA)

2.50 [0.098]

3.81 [0.150]

Dimensions in mm [inches].

0.05 [0.002] 4x R 1.00 [0.039]

15.88 [0.625]

11.43 [0.450]

3.43 [0.135]

9.53 [0.375]

10.54 [0.415] XTRPPPPP YYWWANN 4.00 [0.158]

5.33 [0.210]

SMD-1 (TO-276AB)

HD-00112-11 rev1B 2011-11-04 © 2011 X-REL Semiconductor

3.55 [0.139]

Dimensions in mm [inches].

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Hermetic Packages Outlines 4

TRANSISTOR OUTLINE (TO)

4.95 [0.195] Ø 3.61 [0.142]

10.54 [0.415]

1.02 [0.040]

0.05 [0.002] 15.51 [0.650]

13.51 [0.532]

10.54 [0.415]

XTRPPPPP YYWWANN 4x R 2.79 [0.055] Max 20.32 [0.800]

2x 2.54 [0.100]

Ø 3x 0.76 [0.030]

TO-257AA 3-lead

3.05 [0.120]

Dimensions in mm [inches].

4.95 [0.195] Ø3.61 [0.142]

15.51 [0.650]

10.54 [0.415]

1.02 [0.040]

Max 20.32 [0.800]

Ø 3x 0.76 [0.030]

0.05 [0.002]

13.51 [0.532]

10.54 [0.415]

XTRPPPPP YYWWANN

2x 2.54 [0.100] 4x R 1.38 [0.055]

TO-257AA 6-lead

HD-00112-11 rev1B 2011-11-04 © 2011 X-REL Semiconductor

3.05 [0.120]

Dimensions in mm [inches].

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Hermetic Packages Outlines

Ø3.68 [0.145]

10.54 [0.415]

1.14 [0.045]

6.06 [0.260]

0.05 [0.002] Max 20.32 [0.800] 20.07 [0.790]

Ø 3x 0.76 [0.030]

17.15 [0.675]

10.54 [0.415]

XTRPPPPP YYWWANN 2x 2.54 [0.100] 4x R 1.52 [0.060]

TO-254AA 8-lead

HD-00112-11 rev1B 2011-11-04 © 2011 X-REL Semiconductor

3.81 [0.150]

Dimensions in mm [inches].

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